JP3181604U - Light emitting diode mounting device - Google Patents

Abstract

A light emitting diode mounting apparatus for securely mounting a light emitting diode to a conductor is provided.
A light emitting diode has two electrode leads that bend outward, and each electrode lead has a tip. A protrusion is formed at the tip of the electrode lead 11 so as to protrude from the bottom surface. The conductor 20 has two electrode substrates 21. A mounting lead frame 22 is formed on the surface of each electrode substrate 21 so as to protrude in correspondence with one of the two electrode leads 11. A mounting hole is formed in each electrode substrate 21 at a position corresponding to one of the protrusions. Further, the tip of each electrode lead 11 is inserted into the corresponding mounting lead frame 22, and each protrusion engages with the corresponding mounting hole. By inserting the light emitting diode 10 into the conductor 20 and engaging the protrusion with the hole, the light emitting diode 10 can be securely and stably attached to the conductor.
[Selection] Figure 1

Description

  The present invention relates to a light-emitting diode mounting device, and particularly to a mounting device that can securely mount a light-emitting diode to a conductor.

  Light emitting diodes (LEDs) are widely used in electronic products such as lighting devices and indicator lamps because they are excellent in low temperature characteristics and power consumption characteristics. The light emitting diode includes a die encapsulated in transparent silicon rubber and an electrode pin extending downward from the die. A conventional light emitting diode is connected to two circuit boards by a spot welding structure.

  Referring to FIG. 11, in order to connect the conventional LED 30 to the two circuit boards 32, the two electrode pins 31 of the light emitting diode 30 are bent at 90 degrees, and the respective tips of the two electrode pins 31 are Each of the positive electrode and the negative electrode formed on the circuit board 32 is soldered by a spot welding process. Therefore, the LED 30 is electrically connected to the power supply device via the circuit board 32.

  However, the solder 33 requires a certain period until it solidifies. Therefore, if the LED 30 is not stably positioned by spot welding within this period, the LED 30 is easily moved (shifted). In order to prevent such movement of the LEDs 30, the LEDs 30 must be connected to the circuit board 32 one by one, and the connection must be made after the solder 33 to the previous LED 30 has solidified. However, this method takes time, and it cannot be said that the movement of the LED 30 does not occur reliably during welding.

Japanese Utility Model Publication No. 6-66045

  In order to solve such a problem, an object of the present invention is to provide a light emitting diode mounting device capable of reducing or preventing the above-described problems.

  In view of the problem in the prior art that the spot welded structure causes movement of the LED 30, the present invention mainly provides an attachment device for reliably attaching the LED to the conductor.

  The LED mounting device according to the present invention includes an LED and a conductor connected to the LED.

  The LED has two electrode leads, and these two electrode leads are formed by bending outward in opposite directions, and each electrode lead has a tip, and a protrusion is formed on the bottom surface of the tip. .

  The conductor includes two electrode substrates. A mounting lead frame is formed in a protruding state on the surface of each electrode substrate, and the mounting lead frame corresponds to one electrode lead of the LED. A mounting hole is formed in each electrode substrate at a position corresponding to the one protrusion. The tip of each electrode lead is inserted into one of the mounting lead frames, each protrusion engages with the corresponding mounting hole, and the tip is mounted to the conductor via the corresponding mounting lead frame. become.

  According to the structure described above, in the present invention, each electrode lead of the LED is inserted into a corresponding mounting lead frame, and at the same time, each projection of the electrode lead engages with a corresponding mounting hole in the conductor, Electrode leads are attached to the conductor by corresponding mounting lead frames. Therefore, the LED can be attached to the conductor in a stable state. The two mounting holes formed in advance in the conductor allow the LED to be accurately placed in the conductor. Furthermore, after connecting the LED to the mounting lead frame formed on the conductor, punching the mounting lead frame along the direction from the mounting lead frame to the electrode lead, thereby further strengthening the LED to the conductor. The LED can be prevented from moving. Thus, the above method can be performed in a shorter time and is simpler than the method by welding.

  Other objects, effects, and novel features of the present invention will become apparent from the following detailed description of the present specification and the accompanying drawings.

It is a perspective view of the attachment device of the light emitting diode concerning the present invention. It is a disassembled perspective view of the attachment apparatus shown in FIG. It is a partial side view in the attachment apparatus shown in FIG. It is another partial side view in the attachment apparatus shown in FIG. It is a top view of the attachment apparatus shown in FIG. It is a bottom view of the attachment apparatus shown in FIG. It is a perspective view which shows 2nd Example of the attachment apparatus of the light emitting diode which concerns on this invention. It is a disassembled perspective view of the attachment apparatus shown in FIG. It is a partial side view in the attachment apparatus shown in FIG. It is another side view of the attachment apparatus shown in FIG. It is a perspective view which shows the spot welding structure of the conventional light emitting diode which concerns on a prior art.

  The present invention provides an attachment device for securely and stably attaching a light emitting diode to a conductor.

  Referring to FIGS. 1 and 2, the light emitting diode mounting apparatus according to the first embodiment of the present invention includes a light emitting diode 10 and a conductor 20.

  The light emitting diode 10 includes two electrode leads 11 that function as a positive electrode and a negative electrode, respectively. The two electrode leads 11 are formed to bend outwardly opposite to each other, and each of the electrode leads 11 has an end. Part. A protrusion 12 is formed downward from the bottom of the end. In this embodiment, the tips of the electrode leads 11 are each formed in a plate shape, and the protrusions 12 are each formed in a hemispherical shape. Each protrusion 12 is formed by punching in the direction from the upper surface to the bottom surface of the end portion. Accordingly, a hemispherical recess 13 is formed on the upper surface of the tip of each electrode lead 11 at a position corresponding to the protrusion 12.

  The conductor 20 includes two electrode substrates 21 that function as a positive electrode and a negative electrode, respectively. A mounting hole 23 is formed in each electrode substrate at a position corresponding to one of the protrusions 12 formed on the light emitting diode 10. A mounting lead frame 22 is formed so as to protrude from the surface of each electrode substrate 21. The attachment lead frame 22 is formed so as to cover the attachment hole 23 formed in the electrode substrate 21, and is provided corresponding to one of the electrode leads 11 described above. Two electrode leads 11 of the light emitting diode 10 are respectively inserted into mounting lead frames 22 formed on the two electrode substrates 21, and two protrusions 12 on the electrode leads 11 are mounted on the electrode substrate 21. The holes 23 are respectively engaged. In the present embodiment, the length of the mounting lead frame 22 matches the width of the plate-like tip of the electrode lead 11 formed on the light emitting diode 10. Further, the mounting hole 23 is a hole having a roundness for fitting and engaging the hemispherical protrusion 12. Further, since the mounting hole 23 and the mounting lead frame 22 are simultaneously formed by punching in the direction from the bottom surface to the top surface of the conductor 20, each mounting hole 23 corresponds to the mounting lead frame corresponding to the mounting hole 23. 22 is matched.

  Referring to FIGS. 3 and 4, the tip of each electrode lead 11 of the light emitting diode 10 is inserted into one of the attachment lead frames 22 of the attachment lead frame 22 of the conductor 20. Since the tip of the electrode lead 11 is formed in a plate shape, the contact area between the electrode lead 11 and the mounting lead frame 22 is increased, and as a result, the light emitting diode 10 is electrically connected to the conductor 20 in an excellent manner. Is done. Referring to FIGS. 5 and 6, each protrusion 12 of the electrode lead 11 is engaged with a mounting hole 23 formed in the electrode substrate 21. Since the shape of the mounting hole 23 is adapted to the shape of the protrusion 12, the protrusion 12 can be reliably engaged with the mounting hole 23, and the electrode lead 11 can be securely held by the mounting lead frame 22, and therefore light emission is possible. The diode 10 can be securely attached to the conductor 20. Furthermore, after attaching the light emitting diode 10 to the attachment lead frame 22 formed on the conductor 20, punching is performed on the attachment lead frame 22 along the direction from the attachment lead frame 22 to the electrode lead 11. The light emitting diode 10 can be fixed in a tightened state by the conductor 20.

  Referring to FIG. 7, the structure of the light emitting diode 10 in the second embodiment has the same configuration as that of the light emitting diode 10 in the first embodiment except for the conductor 20.

  In this embodiment, each mounting lead frame 22 ′ of the electrode substrate 21 ′ formed on the conductor 20 ′ includes two bent plates 221. The two bent plates 221 are arranged on both sides of the corresponding electrode leads 11 in order to clamp the corresponding electrode leads 11 of the light emitting diode 10 between the bent plates 221. The bent plate 221 is formed on the conductor 20 ′ by punching. Referring to FIG. 8, first, two straight plates 221a are formed on each electrode substrate 21 ′ of the conductor 20 ′. After each electrode lead 11 of the light emitting diode 10 is attached between two corresponding linear plates 221 a, the linear plates 221 a are bent in a direction facing each other, and the electrode leads 11 are clamped by the bent plate 221. Further, referring to FIGS. 9 and 10, in the second embodiment, the conductor 20 ′ further includes a positioning socket 24. The positioning socket 24 has a socket hole 240 inside thereof, and faces the tip of one electrode lead 11 of the light emitting diode 10 so that the tip of the corresponding electrode lead can be inserted into the socket hole 240 of the positioning socket 24. Yes. Referring to FIG. 8, two electrode leads 11 of the light emitting diode 10 are attached between two corresponding linear plates 221a, and before the linear plates 221a are bent, One of the electrode leads 11 is inserted into the socket hole 240 of the positioning socket 24. With this configuration, the light-emitting diode 10 can be prevented from wobbling, and the subsequent bending process of the linear plate 221a can be easily performed.

  As described above, the light emitting diode 10 can be accurately disposed on the conductor 20 by the engagement between the protrusions 12 formed on the two electrode leads 11 and the mounting holes 23 formed on the conductor 20 in advance. The movement (shift) of the light emitting diode 10 can be prevented. Further, the mounting lead frames 22 and 22 ′ are formed by a punching process in the first embodiment, and are formed by two bent plates 221 in the second embodiment. Therefore, the mounting lead frames 22 and 22 ′ are formed. Can hold the electrode lead 11 of the light emitting diode 10 at a predetermined position. Therefore, the light emitting diode 10 can be stably attached to the conductors 20 and 20 ′, and the assembly of the light emitting diode 10 to the conductors 20 and 20 ′ can be performed in a shorter time and more easily.

  In the foregoing description, the many features and advantages of the present invention have been described in conjunction with the details of the structure and features of the present invention, but these are merely exemplary. Changes in detail are possible, and in particular, the shape, size and arrangement of the members are within the scope indicated by the broad and general meaning of the terms used in the appended claims without departing from the spirit of the invention. The change is possible.

Claims (7)

a) A light-emitting diode having two electrode leads formed by bending outward in opposite directions, each electrode lead having a tip having a bottom surface and a protrusion formed on the bottom surface of the tip. Said light emitting diode,
b) a conductor having two electrode substrates respectively connected to the electrode leads of the light emitting diodes, each electrode substrate being formed on the electrode substrate and protruding from the electrode substrate; and A mounting lead frame that clamps one end of the electrode lead of the light emitting diode, and an electrode substrate that engages with the protrusion formed on the corresponding one of the electrode leads of the light emitting diode. A light emitting diode mounting device comprising: the conductor having a mounting hole;
A light emitting diode mounting apparatus, wherein the tip of each electrode lead is inserted into a corresponding one of the mounting lead frames. 2. The light emitting diode mounting device according to claim 1, wherein the mounting lead frame is disposed on a corresponding mounting hole. Each of the mounting lead frames includes two bent plates formed on two sides of the tip of the corresponding electrode lead of the light emitting diode, and clamps the corresponding electrode lead between the two bent plates. The light-emitting diode mounting device according to claim 1. Each of the conductors includes a socket for forming a socket hole therein and facing the tip of one of the electrode leads of the light emitting diode, and the tip of the corresponding electrode lead of the light emitting diode. The light emitting diode mounting device according to claim 3, wherein the light emitting diode can be inserted into the socket hole of the positioning socket. 5. The light emitting diode mounting device according to claim 1, wherein each of the protrusions has a hemispherical shape, and the mounting hole is a rounded hole. 6. The light emitting diode mounting device according to claim 1, wherein a length of the mounting lead frame is made to coincide with a width of the tip of the plate shape of the electrode lead. 6. The light emitting diode mounting device according to claim 1, wherein a concave portion is formed at a position corresponding to the protrusion on an upper surface of the tip of each electrode.

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