CN100370889C - Positioning structure of welding-free light-emitting diode - Google Patents
Positioning structure of welding-free light-emitting diode Download PDFInfo
- Publication number
- CN100370889C CN100370889C CNB2004100455380A CN200410045538A CN100370889C CN 100370889 C CN100370889 C CN 100370889C CN B2004100455380 A CNB2004100455380 A CN B2004100455380A CN 200410045538 A CN200410045538 A CN 200410045538A CN 100370889 C CN100370889 C CN 100370889C
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- emitting diode
- light
- circuit board
- pin
- type led
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Abstract
The present invention relates to a welding-free type light emitting tube positioning structure which comprises a circuit board, a metal board set which is inserted and fixed in the circuit board, and a light emitting tube which is inserted in the metal board set, wherein the metal board set is composed of a plurality of metal boards which are respectively inserted in the circuit board, and every two adjacent metal boards have different polarity; protruding combined parts are respectively formed on the every two adjacent metal boards by punching; connected pins of the light emitting tube are inserted and fixed in the combined parts to be combined onto the circuit board without welding in high temperature, so crystal grains of the light emitting tube can be prevented from being damaged and the connected pin can be prevented from being fused broken in high temperature during welding operation.
Description
Technical field
The present invention is a soldering-free type LED location structure, is the fixed structure that belongs to electronic building brick.
Background technology
Because light-emitting diode has the characteristic of low temperature, low power consumption, so widely be applied to lighting, the perhaps display lamp of electronic product, and the pattern of light-emitting diode is to be coated with crystal grain in transparent adhesive body inside, and the pin that extends downwards, be inserted in the perforation of circuit board by pin, in the scolding tin mode pin is fixed on the circuit board again, yet so crystal grain but can take place and burns and cause unserviceable situation in assembling mode.
Another kind of mode in conjunction with light-emitting diode then is that two pins with light-emitting diode are bent into 90 degree, be consolidated in respectively on two metallic plates in the spot welding mode again, see through metallic plate and be inserted on the circuit board, assembling mode so, the high temperature during its spot welding still can undermine crystal grain.
Be the necessity that is improved to be arranged so that, the combination between existing light-emitting diode and the circuit board is real.
Summary of the invention
Because the improper disappearance that causes being easy to generate defective products of combination, main purpose of the present invention is to provide a kind of light-emitting diode not need the light-emitting diodes tube positioning structure that promptly can be incorporated into circuit board through welding in order to improve between existing light-emitting diode and the circuit board.
Based on above-mentioned purpose, major technique of the present invention is to provide a kind of soldering-free type LED location structure, comprising: a circuit board; One light-emitting diode, it has pin, and pin oppositely bends from the stage casing and makes free end form bending segment; One group of metallic plate group, formed by a plurality of disjunct metallic plate, the adjacent metal plate is to be inserted in circuit board respectively and to have opposed polarity, punch forming one can be for the pin bending segment plant of same light-emitting diode, again with the securing joint portion of light-emitting diode respectively to differ from this side of circuit board in two adjacent metallic plates.
By above-mentioned technological means, the present invention can make light-emitting diode directly be inserted in metallic plate under without weld job, and then is incorporated on the circuit board, because it need not pass through high-temperature soldering, so unlikely the burning of crystal grain and pin does not also have the anxiety of fusing.
Description of drawings
Fig. 1 is a perspective exploded view of the present invention.
Fig. 2 is a combination generalized section in plane of the present invention.
Fig. 3 is that second kind of the present invention implements the fixedly schematic side view of light-emitting diode pin of kenel.
Fig. 4 is that second kind of the present invention implements the fixedly schematic side view of light-emitting diode pin of kenel.
In the accompanying drawing:
10-circuit board 20-metallic plate group
21,21 '-metallic plate 210-pin
220-longitudinal side, 22-joint portion plate
The horizontal side plate 23-of 221-joint portion
The 230-teat
30-light-emitting diode 300-adhesive body
The 31-pin
Embodiment
See also shown in Figure 1ly, soldering-free type LED location structure provided by the present invention is to comprise a circuit board 10, a light-emitting diode 30 of pegging graft and being fixed in the metallic plate group 20 of circuit board 10 and being inserted in metallic plate group 20; Wherein, described light-emitting diode 30 is to be existing product, and it has two pin 31, two pins 31 that extended by adhesive body 300 bottoms and outwards oppositely bends 90 degree from the stage casing, makes its free end form bending segment;
And described metallic plate group 20 is made up of several disjunct metallic plates 21, each metallic plate 21 is respectively equipped with the pin 210 of a bending, using plants is welded on the circuit board 10, the polarity difference of adjacent metal plate 21, again on two adjacent metallic plates 21, punch forming one is towards differing from the joint portion 22 that circuit board 10 is given prominence to respectively, in the middle of this preferred embodiment, described joint portion 22 is for L shaped, it connects metallic plate 21 with a longitudinal side plate 220, bend a horizontal side plate 221 again, this horizontal side plate 221 is pin 31 thickness that are slightly larger than light-emitting diode 30 with the spacing on metallic plate 21 surfaces, plants the free end of the horizontal side plate 221 of punching press then shown in Figure 2 for another example for pin 31, make its bending coat the pin 31 of light-emitting diode 30, be about to light-emitting diode 30 and be fixed on the metallic plate 21.
And for example shown in Figure 3 is the another kind of kenel of implementing of the present invention, it also is that pre-metallic plate 21 ' last corresponding punch forming prior to the two-phase neighbour has the joint portion 23 towards outer process, the kenel of this joint portion 23 then is to be formed with two teats 230 that are provided with at interval, pin 31 bending segments with ccontaining light-emitting diode 30 between two teats 230, the height of teat 230 and greater than the thickness of pin 31, for in conjunction with the time punch forming once again make the top of two teats 230 bend in opposite directions as shown in Figure 4 and suppress in the end face of pin 31, promptly make light-emitting diode 30 under situation, be fixed on the metallic plate 21 ' of opposed polarity, to form path without welding.
And because design of the present invention makes spot welding or the scolding tin operation of light-emitting diode 30 without high temperature, so the crystal grain of light-emitting diode 30 does not have the situation of burning, its pin 31 does not also have the anxiety of fusing, can guarantee the quality of light-emitting diode 30, has industry applications.
Again, above-mentioned described be to be the example explanation in the middle of graphic with light-emitting diode with two pins, in addition, it is also applicable to the light-emitting diode with four pins, it is that two pins with the homonymy setting are one group, is inserted on the same metallic plate.
Claims (5)
1. a soldering-free type LED location structure is characterized in that, comprising:
One circuit board;
One light-emitting diode, it has pin, and pin oppositely bends from the stage casing and makes free end form bending segment;
One group of metallic plate group, formed by a plurality of disjunct metallic plate, the adjacent metal plate is to be inserted in circuit board respectively and to have opposed polarity, punch forming one can be for the pin bending segment plant of same light-emitting diode, again with the securing joint portion of light-emitting diode respectively to differ from this side of circuit board in two adjacent metallic plates.
2. as 1 described soldering-free type LED location structure of claim the, it is characterized in that wherein, described joint portion is for having the L shaped of longitudinal side plate and horizontal side plate, the bending segment of light-emitting diode promptly is inserted between horizontal side plate and the metallic plate.
3. as 1 described soldering-free type LED location structure of claim the, it is characterized in that wherein, described joint portion is to have two teats that are provided with at interval, the bending segment of light-emitting diode promptly is inserted between two teats, and by the bending compacting of the top of two teats.
4. as 1,2 or 3 described soldering-free type LED location structures of claim the, it is characterized in that wherein, described light-emitting diode has two pins.
5. as 1,2 or 3 described soldering-free type LED location structures of claim the, it is characterized in that wherein, described light-emitting diode has four pins, wherein two branch connecting pin homonymy settings and become a group.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100455380A CN100370889C (en) | 2004-05-28 | 2004-05-28 | Positioning structure of welding-free light-emitting diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100455380A CN100370889C (en) | 2004-05-28 | 2004-05-28 | Positioning structure of welding-free light-emitting diode |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1705426A CN1705426A (en) | 2005-12-07 |
| CN100370889C true CN100370889C (en) | 2008-02-20 |
Family
ID=35577981
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100455380A Expired - Fee Related CN100370889C (en) | 2004-05-28 | 2004-05-28 | Positioning structure of welding-free light-emitting diode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100370889C (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI442001B (en) * | 2011-12-19 | 2014-06-21 | Keeper Trchnology Co Ltd | Light emitting diode fixtures |
| US20130240944A1 (en) * | 2012-03-13 | 2013-09-19 | Keeper Technology Co., Ltd. | Mounting device for a light emitting diode |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000269554A (en) * | 1999-03-15 | 2000-09-29 | Rohm Co Ltd | Light emitting diode lamp |
| US6225139B1 (en) * | 2000-01-24 | 2001-05-01 | Chan Tsung-Wen | Manufacturing method of an led of a type of round concave cup with a flat bottom |
| US6386733B1 (en) * | 1998-11-17 | 2002-05-14 | Ichikoh Industries, Ltd. | Light emitting diode mounting structure |
-
2004
- 2004-05-28 CN CNB2004100455380A patent/CN100370889C/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6386733B1 (en) * | 1998-11-17 | 2002-05-14 | Ichikoh Industries, Ltd. | Light emitting diode mounting structure |
| JP2000269554A (en) * | 1999-03-15 | 2000-09-29 | Rohm Co Ltd | Light emitting diode lamp |
| US6225139B1 (en) * | 2000-01-24 | 2001-05-01 | Chan Tsung-Wen | Manufacturing method of an led of a type of round concave cup with a flat bottom |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1705426A (en) | 2005-12-07 |
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| PB01 | Publication | ||
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| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080220 Termination date: 20130528 |