JP6699042B2 - Metal foil with resin for manufacturing printed circuit board, printed circuit board and method for manufacturing the same - Google Patents

Description

  The present invention relates to a resin-coated metal foil for manufacturing a printed circuit board, a printed circuit board, and a method for manufacturing the same.

  A printed circuit board is a circuit pattern that is made of a conductive material such as copper as an insulating material. Recently, with the trend toward smaller and lighter electronic components, higher density fine circuit patterns are required. ing.

JP, 2006-070176, A

  One embodiment of the present invention is a method of manufacturing a printed circuit board, which has excellent adhesion to a metal layer forming a circuit pattern and which coats a metal foil with a resin layer having high heat resistance to facilitate processing of a fine circuit pattern. For metal foil with resin for.

  Another embodiment of the present invention relates to a printed circuit board manufactured using the resin-coated metal foil for manufacturing the printed circuit board, and a manufacturing method thereof.

  In order to solve the above-mentioned problems, one embodiment of the present invention, on the surface of the metal foil, a naphthalene-based epoxy resin, an epoxy resin curing agent, and a polyimide resin or a polyamide-imide resin soluble in a solvent having a boiling point of 150° C. or less. Provided is a metal foil with resin for manufacturing a printed circuit board having a resin layer containing the resin layer.

  Further, another embodiment of the present invention is a step of laminating the resin-coated metal foil, a step of removing the metal foil from the resin-coated metal foil, and a resin layer of the resin-coated metal foil from which the metal foil has been removed. A method of manufacturing a printed circuit board, the method including forming a circuit pattern thereon.

  According to one embodiment of the present invention, by providing a resin layer having excellent adhesiveness to a metal plating layer forming a circuit pattern, it is possible to process a fine circuit pattern while ensuring peel strength and solder heat resistance. Can be easy.

FIG. 3 is a cross-sectional view of a resin-coated metal foil for manufacturing a printed circuit board according to an exemplary embodiment of the present invention.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. However, the embodiments of the present invention can be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below. Further, the embodiments of the present invention are provided to more fully explain the present invention to those having ordinary skill in the art. The shapes and sizes of elements in the drawings may be exaggerated for clearer description.

  FIG. 1 is a cross-sectional view of a resin-coated metal foil for manufacturing a printed circuit board according to an exemplary embodiment of the present invention.

  Referring to FIG. 1, a resin-coated metal foil 100 according to an embodiment of the present invention has a resin layer 20 formed on one surface of the metal foil 10.

  The resin layer 20 contains a naphthalene-based epoxy resin, an epoxy resin curing agent, and a polyimide resin or a polyamide-imide resin that is soluble in a solvent having a boiling point of 150° C. or less.

  The naphthalene-based epoxy resin is preferably a liquid phase naphthalene-based epoxy resin at room temperature, for example, 20±5° C., and the equivalent weight of the naphthalene-based epoxy resin is preferably 160 or less.

  When the equivalent weight of the naphthalene-based epoxy resin exceeds 160, the resin layer 20 is not uniformly formed and the solder heat resistance is deteriorated.

The epoxy resin curing agent is selected from the group consisting of phenol aralkyl type resin, naphthol aralkyl type resin, novolac type phenol resin, nitrogen-containing novolac resin, dicyclopentadiene type phenol resin, biphenyl type phenol resin and triphenyl type phenol resin. Any one or more.

  The content of the epoxy resin curing agent is derived from the reaction equivalent to the resin to be cured, and the amount is not particularly limited, and it is preferable that the content of the naphthalene-based epoxy resin is sufficiently cured.

  The polyimide resin or polyamide-imide resin soluble in a solvent having a boiling point of 150° C. or lower may be produced by reacting a bulky diamine having an aromatic group with an acid anhydride.

  The aromatic diamine that can be used is not particularly limited, but 1,3-bis(4-aminophenoxy)benzene (1,3-Bis(4-aminophenoxy)benzene), 1,3-as an ether type ether Bis(4-aminophenoxy)biphenyl(1,3-Bis(4-aminophenoxy)biphenyl), 2,2′-bis[4-(4-aminophenoxy)phenyl]propane(2,2-Bis[4-( 4-aminophenoxy)phenyl]propane), 2,2-bis[4-(4-aminophenoxy)phenyl]hexafluoropropane(2,2-Bis[4-(4-aminophenoxy)phenyl]hexafluoropropane), bis[4] -(4-Aminophenoxy)phenyl]sulfone (Bis[4-(4-aminophenoxy)phenyl]sulfone), bis[4-(3-aminophenoxy)phenyl]sulfone (Bis[4-(3-aminophenoxy)phenyl) sufone), 4,4'-diamino-2,2'-bis(trifluoromethyl)diphenyl ether (4,4'-Diamino-2,2'-bis(trifluoromethyl)diphenyl ether), 1,4-bis(4) -Aminophenoxy)-2,3,5-trimethylbenzene (1,4-Bis (4-aminophenoxy)-2,3,5-trimethylbenzene), 1,4-bis(4-aminophenoxy)-2,5- Di-t-butylbenzene (1,4-Bis(4-aminophenoxy)-2,5-di-t-butylbenzene), 1,4-bis[4-amino-2-(trifluoromethyl)phenoxy]benzene( 1,4-Bis[4-amino-2-(trifluoromethyl)phenoxy]benzene), 2,2-bis[4-[4-amino-2-(trifluoromethyl)phenyl]hexafluoropropane(2,2- Bis[4-[4-amino-2-(trifluoromethyl)phenyl]hexafluoropropane), 1,3-bis(4-aminophenoxy)propane (1,3-Bis(4-aminophenoxy)propane), 1,4-bis (4-aminophenoxy)butane (1,4-bis(4-aminophen) oxy)butane), 1,5-bis(4-aminophenoxy)pentane (1,5-bis(4-aminophenoxy)pentane), 1,3-bis(4-aminophenoxy)neopentane (1,3-Bis( 4-aminophenoxy)neopentane), 2,5-bis(4-aminophenoxy)-biphenyl (2,5-Bis(4-aminophenoxy)-biphenyl), 1,3-bis(4-aminophenoxy)-5-( 2-Phenylethynyl)benzene (1,3-Bis(4-aminophenoxy)-5-(2-phenylethynyl)benzene), 1,3-bis(3-aminophenoxy)-5-(2-phenylethynyl)benzene( 1,3-Bis(3-aminophenoxy)-5-(2-phenylethylene)benzene, 2,4-diamino-4′-phenylethynyl diphenyl ether (2,4-Diamino-4′-phenyldiphenylether), as a biphenyl type 4,4'-diamino-2,2'-bis(trifluoromethyl)biphenyl (4,4'-Diamino-2,2'-bis(trifluoromethyl)biphenyl), 3,7-diamino-2,8-dimethyl Dibenzothiophene-5,5-dioxide (3,7-Diamino-2,8-dimethyldibenzothiophene-5,5-dioxide), 4,4′-bis(4-aminophenoxy)biphenyl (4,4′-Bis(4 -Aminophenoxy)biphenyl), 4,4'-bis(4-aminobenzamide)-3,3'-dihydroxybiphenyl (4,4'-Bis(4-aminobenzamide)-3,3'-dihydroxybiphenyl), 2,2 -Bis(3-amino-4-hydroxyphenyl)propane (2,2-Bis(3-amino-4-hydrophenyl)propane), 9,9-bis(4-aminophenyl)fluorene (9,9-Bis( 4-aminophenyl)fluorene), 4,4′-diaminodiphenyl ketone (4,4′-diaminodiphenyl ketone), 2,2-bis[4-{4-amino-2-(trifluoromethyl)phenoxy}phenyl]hexa Fluoropropane (2,2 -Bis[4-{4-amino-2-(trifluoromethyl)phenoxy}phenyl]hexafluoropropane), bis{4-(4-aminophenoxy)phenyl}ketone (Bis{4-(4-aminophenoxy)phenyl}ketone), 2,2-bis{4-(4-aminophenoxy)phenyl}hexafluoropropane (2,2-Bis{4-(4-aminophenoxy)phenyl}hexafluoropropane), 2,2-bis{4-(4-amino) Phenoxy)phenyl}propane (2,2-Bis{4-(4-aminophenoxy)phenyl}propane), 4,4′-diaminodiphenyl sulfone (4,4′-Diaminodiphenyl sulfone) as a sulfone system, bis{4-( 4-aminophenoxy)phenyl}sulfone (Bis{4-(4-aminophenoxy)phenyl}sulfone), bis{4-(3-aminophenoxy)phenyl}sulfone (Bis{4-(3-aminophenoxy)phenyl}sulfone) , 3,7-diamino-2,8-dimethylbenzothiophene-5,5-dioxide (3,7-Diamino-2,8-dimethyldibenzothiphene-5,5-dioxide) and the like.

  Examples of the acid anhydride include pyromellitic dianhydride, 3,3′,4,4′-benzophenone tetracarboxylic acid dianhydride (3,3′,4,4′-benzophenone tetracarboxydyanhydride), and biphenyl. Tetracarboxylic acid dianhydride (3,4,3',4'-diphenylsulfone tetra-carboxylic acid dianhydride (3,4,3'4'-diphenylsulfone tetra-carboxylic dianhydride) 3,3'4,4'-diphenyl ether tetracarboxylic acid dianhydride (3,3',4,4'-diphenyl ether tetracarboxylic acid dianhydride), 2,3,4-tetrahydrofuran tetra-carboxylic acid acetic acid dianhydride ( 2,3,4-Tetrahydrofuran tetra-carboxylic acid acetic acid dianhydride, 1,2,5,6-naphthalene tetracarboxylic acid dianhydride (1,2,5,6-naphthalenetetracarboxylic3,2,6,3,6) ,7-Naphthalenetetracarboxylic dianhydride (2,3,6,7-naphthalenetetracarboxydian hydride), 1,4,5,8-naphthalenetetracarboxylic dianhydride (1,4,5,8-naphthalenetetracarboxylic hydride) ,2,3,5,6-Pyridinetetracarboxylic dianhydride (2,3,5,6-pyridinetetracarboxy dianhydride), m-terphenyl-3,3',4,4'-tetracarboxylic dianhydride (M-terphenyl-3,3′,4,4′-tetracarboxylic dianhydride), p-terphenyl-3,3′,4,4′-tetracarboxylic dianhydride (p-terphenyl-3,3′, 4,4'-tetracarboxy dianhydride), 4,4-oxydiphthalic dianhydride (4,4-oxydiphthalic dianhydride) , 1,1,1,3,3,3-hexafluoro-2,2-bis(2,3 or 3,4-dicarboxyphenoxy)phenylpropane dianhydride (1,1,1,3,3,3 3-hexafluoro-2,2-bis(2,3 or 3,4-dicarboxyphenoxy)phenylpropane dianhydride),2,2,-bis[4-(2,3 or 3,4-dicarboxyphenoxy)phenylpropane dianhydride Substance (2,2-bis[4-(2,3 or 3,4-dicarboxyphenoxy)phenyl]propane dianhydride), 1,1,1,3,3,3-hexafluoro-2,2-bis[4- (2,3 or 3,4-dicarboxyphenoxy)phenyl]propane dianhydride (1,1,1,3,3,3, -hexafluoro-2,2-bis[4-(2,3 or 3, 4-dicarboxyphenoxy)phenyl]propane dianhydride) and the like.

  In the case of a polyimide resin or a polyamide-imide resin which has a boiling point of more than 150° C., a high boiling point solvent having a boiling point of more than 150° C. is used. Adhesion is reduced.

  At this time, examples of the solvent having a boiling point of 150° C. or lower include methyl ethyl ketone and dimethylformamide.

  The content of the polyimide resin or the polyamide-imide resin is preferably 5 to 50 parts by weight when the sum of the weights of the naphthalene-based epoxy resin and the epoxy resin curing agent is 100 parts by weight.

  If the content of the polyimide resin or the polyamide-imide resin is less than 5 parts by weight, the adhesiveness will decrease, and if it exceeds 50 parts by weight, the moldability will decrease and the resin layer will be formed unevenly.

  The resin-coated metal foil 100 is a naphthalene-based epoxy resin, an epoxy resin curing agent, and a resin varnish produced by adding a solvent to a resin composition containing a polyimide resin or a polyamide-imide resin soluble in a solvent having a boiling point of 150° C. or less, It can be manufactured by applying the resin varnish on one surface of the metal foil 10 to form the resin layer 20.

  The method of applying the resin varnish to the metal foil 10 is not particularly limited, and the viscosity of the resin varnish is adjusted with a roll coater, knife coater, doctor blade coater, gravure coater, die coater, multi-die coater, reverse coater, reverse roll coater, or the like. Then, the resin layer 20 can be formed on the surface of the metal foil 10.

  As the metal foil 10, a metal foil 10 made of copper foil, aluminum foil, nickel foil, or an alloy of one or more of these is used.

  The average surface roughness (Ra) of the metal foil 10 is preferably 0.05 μm to 0.2 μm, and the thickness is preferably 0.1 μm to 5 μm.

  The resin layer 20 is formed on the surface of the metal foil 10 with a thickness of 0.5 μm to 10 μm, and the degree of curing of the resin layer 20 is preferably 70% or more.

  If the degree of curing of the resin layer 20 is less than 70%, the resin layer 20 is mixed with the insulating layer when the resin-coated metal foil 100 is press-laminated on the insulating layer forming the circuit pattern, and the resin layer 20 is chemically mixed during the manufacturing of the printed circuit board. Adhesion with the copper plating layer is reduced, and solder heat resistance is also reduced.

  A printed circuit board manufactured using the resin-coated metal foil 100 is provided with a resin layer containing a naphthalene-based epoxy resin, an epoxy resin curing agent, and a polyimide resin or a polyamide-imide resin soluble in a solvent having a boiling point of 150° C. or less. ..

  When a printed circuit board is manufactured using the resin-coated metal foil 100, a fine circuit pattern can be easily processed while ensuring peel strength and solder heat resistance.

  Next, a method for manufacturing a printed circuit board having a fine circuit pattern using the resin-coated metal foil 100 will be described.

  First, the resin-coated metal foil 100 is laminated so that the resin layer 20 of the resin-coated metal foil 100 is in contact with the surface of the insulating layer forming the circuit pattern. After the lamination, the metal foil 10 is removed by etching, and a circuit pattern is formed on the remaining resin layer 20.

  The method for forming the circuit pattern is not particularly limited, but for example, after forming a chemical copper plating layer on the resin layer 20 and forming a patterned plating resist, electrolytic plating is performed to form the circuit pattern, The chemical copper plating layer is etched and removed.

  In this way, when the resin layer 20 is formed on the insulating layer forming the circuit pattern by using the resin-coated metal foil 100 and then the circuit pattern is formed, the peeling strength and the solder heat resistance are ensured while the surface roughness is maintained. It is possible to reduce the thickness to prevent excessive etching and easily form a fine circuit pattern.

  However, the method for manufacturing a printed circuit board using the resin-coated metal foil 100 is not particularly limited, and any manufacturing method known in the art may be used.

  Hereinafter, the present invention will be described in more detail with reference to examples. However, the scope of the present invention is not limited by the following examples and is intended to help understanding of the present invention.

<Example 1>
7.2 parts by weight of naphthalene-based epoxy (SE-80, SHIN-A T&C), 10.2 parts by weight of phenol aralkyl type curing agent (MEHC-7851S, Meiwa Kasei), 7.5 parts by weight of polyamide-imide (boiling point) A varnish composed of 0.6 parts by weight of an imidazole curing accelerator was prepared (dissolved in a solvent of 150° C. or lower) (SORX-S(NKK)).

<Example 2>
5.2 parts by weight of naphthalene epoxy (SE-80, SHIN-AT&C), 2.3 parts by weight of bisphenol A epoxy (YD-128K, Kukdo Chemical), 9.9 parts by weight of phenol aralkyl type curing agent. (MEHC-7851S, Meiwa fkasei), 7.5 parts by weight of polyamide-imide (dissolved in a solvent having a boiling point of 150° C. or lower) (SORX-S(NKK)), 0.6 parts by weight of a varnish consisting of an imidazole curing accelerator. It was made.

<Example 3>
8.7 parts by weight of naphthalene-based epoxy (SE-80, SHIN-A T&C), 8.8 parts by weight of aminotriazine type novolac curing agent (PS6313, GUN EI Chem. Industry Co. Ltd.), 7.5 parts by weight. A varnish consisting of 10 parts by weight of polyamideimide (dissolved in a solvent having a boiling point of 150° C. or lower) (SORX-S(NKK)) and 0.2 parts by weight of an imidazole curing accelerator was prepared.

<Example 4>
7.1 parts by weight of naphthalene-based epoxy (SE-80, SHIN-AT&C), 1.8 parts by weight of bisphenol A-based epoxy (YD-128K, Kukdo Chemical), 8.6 parts by weight of aminotriazine type novolak curing. Agent (PS6313, GUN EI Chem. Industry Co. Ltd.), 7.5 parts by weight of polyamide-imide (dissolved in a solvent having a boiling point of 150°C or lower) (SORX-S (NKK)), 0.2 parts by weight of imidazole curing. A varnish consisting of the accelerator was prepared.

<Example 5>
7.2 parts by weight of naphthalene-based epoxy (SE-80, SHIN-AT&C), 10.2 parts by weight of phenol aralkyl type curing agent (MEHC-7851S, Meiwa Kasei), 12.2 parts by weight of polyamide-imide (boiling point) A varnish composed of 0.6 parts by weight of an imidazole curing accelerator was prepared (dissolved in a solvent of 150° C. or lower) (SORX-S(NKK)).

<Example 6>
5.6 parts by weight of naphthalene-based epoxy (SE-80, SHIN-A T&C), 2.4 parts by weight of NBR modified epoxy (Polydis 3615, Schill+Seilacher "Struktol" GmbH), 9.5 parts by weight of phenol aralkyl type curing agent. (MEHC-7851S, Meiwa kasei), 7.5 parts by weight of polyamide-imide (dissolved in a solvent having a boiling point of 150° C. or lower) (SORX(NKK)), and 0.6 parts by weight of an imidazole curing accelerator were prepared as a varnish. ..

<Example 7>
7.3 parts by weight of naphthalene-based epoxy (SE-80, SHIN-A T&C), 1.8 parts by weight of NBR modified epoxy (Polydis 3615, Schill+Seilacher "Struktol" GmbH), 8.3 parts by weight of aminotriazine type novolak curing. Agent (PS6313, GUN EI Chem. Industry Co. Ltd.), 7.5 parts by weight of polyamide-imide (dissolved in a solvent having a boiling point of 150°C or lower) (SORX-S (NKK)), 0.2 parts by weight of imidazole curing. A varnish consisting of the accelerator was prepared.

<Example 8>
7.2 parts by weight of naphthalene-based epoxy (SE-80, SHIN-AT&C), 1.8 parts by weight of cresol novolac type epoxy (YDCN-500-8P, Kukdo Chemical), 8.5 parts by weight of aminotriazine type. Novolak curing agent (PS6313, GUN EI Chem. Industry Co. Ltd.), 7.5 parts by weight of polyamide imide (dissolved in a solvent having a boiling point of 150°C or lower) (SORX (NKK)), 0.2 parts by weight of imidazole curing A varnish consisting of the accelerator was prepared.

<Comparative Example 1>
7.2 parts by weight of naphthalene-based epoxy (SE-80, SHIN-A T&C), 10.2 parts by weight of phenol aralkyl type curing agent (MEHC-7851S, Meiwa Kasei), 7.5 parts by weight of polyamide-imide (boiling point) A varnish consisting of 0.6 parts by weight of an imidazole curing accelerator was prepared (dissolved in a solvent above 150° C.) (SORX-OB(NKK)).

<Comparative example 2>
28 parts by weight of 2,2′-bis[4-(4-aminophenoxy)phenyl]propane, 19 parts by weight of trimellitic dianhydride, and 260 parts by weight of N-methylpyrrolidone (N-methylpyrrolidone). ) And heated at 80° C., toluene (Toluene) was added and the mixture was refluxed for 3 hours to remove generated water. Then, after maintaining at 190° C. for 2 hours, cooling to room temperature, adding 25 parts by weight of 4,4′-diphenylmethane diisocyanate (4,4′-Diphenylmethyl diisocyanate) and heating at 170° C. for 2 hours, After cooling to room temperature, aromatic polyamide imide (PAI) was synthesized. The average molecular weight (Mw) of the synthesized polyamideimide was 120,000.

  Synthesized polyamide imide 7.5 parts by weight, 7.2 parts by weight of naphthalene-based epoxy (SE-80, SHIN-AT&C), 10.2 parts by weight of phenol aralkyl type curing agent (MEHC-7851S, Meiwa kasei), A varnish consisting of 0.6 parts by weight of an imidazole curing accelerator was prepared.

<Coating example 1>
The thickness of the varnishes of Examples 1 to 8 and Comparative Examples 1 and 2 after solvent removal using a die coater on the surface-treated surface of electrolytic copper foil (MT-EX, Mitsui Metal) having a thickness of 20 μm and a width of 600 mm, respectively. Was coated so that the thickness would be 3 μm. The coated copper foil was passed at a speed of 2 m/min through four 2 m long floating type drying ovens set at 80° C., 110° C., 150° C. and 170° C. The degree of cure of the obtained resin-coated copper foil was 90% or more.

<Coating example 2>
The surface treated surface of the electrolytic copper foil (MT-EX, Mitsui Kinzoku) having a thickness of 20 μm and a width of 600 mm was coated with the varnish of Example 1 using a die coater so that the thickness after solvent removal would be 3 μm. .. The coated copper foil was passed at a speed of 2 m/min through four 2 m long floating type drying ovens set at 80° C., 110° C., 150° C. and 170° C. The degree of cure of the obtained resin-coated copper foil was 45%.

  When coating example 2 is performed, the degree of cure is low at 45%, so the resin layer of the resin-coated copper foil is mixed with the PPG resin during press lamination, resulting in low adhesion to chemical copper plating and reduced solder heat resistance. did.

<Experimental example>
Ten resin-coated copper foils obtained by performing the above coating example 1 with the varnishes of Examples 1 to 8 and Comparative Examples 1 and 2 were laminated together with CCL and PPG at 210° C. for 130 minutes under a load of 3 MPa. . After the lamination, the copper foil was etched and plated with chemical copper (1 μm) and electrolytic copper (20 μm). Copper (Cu)-resin layer adhesion of the obtained substrate (90° peel strength between copper (Cu)-resin layer measured by UTM: P/S) and solder heat resistance (in a 300°C solder bath) The time before the occurrence of blisters in the sample was measured and observed for a maximum of 5 minutes: T-300). The results of the test are shown in Table 1.

  Referring to Table 1 above, Examples 1 to 4 showed excellent adhesion and solder heat resistance.

  On the other hand, in Comparative Example 1, since polyamide imide which is soluble in a solvent having a boiling point of higher than 150° C. was used, the coating property was poor, the residual solvent was large, and the adhesion with the chemical copper plating was reduced. Further, in Comparative Example 2, a polyamideimide soluble in a solvent having a boiling point of higher than 150° C. was used, but the epoxy resin and the curing agent were not uniformly mixed and a varnish could not be formed.

  In addition, Example 5 used a polyamide-imide soluble in a solvent having a boiling point of 150° C. or lower, and exhibited excellent adhesion and solder heat resistance. However, the content of polyamide-imide was too high, the viscosity of the varnish increased, the moldability decreased, and the appearance became uneven.

  In Examples 6 to 8, polyamide imide which was soluble in a solvent having a boiling point of 150° C. or lower was used, but the equivalent of the epoxy resin exceeded 200, the resin layer was not uniformly formed, and the solder heat resistance was lowered.

100 metal foil with resin 10 metal foil 20 resin layer

Claims (7)

In a resin-coated metal foil having a resin layer formed on the surface of the metal foil,
The resin layer is
Naphthalene-based epoxy resin,
An epoxy resin curing agent,
A polyimide resin or a polyamide-imide resin soluble in a solvent having a boiling point of 150° C. or lower,
Only including,
The naphthalene-based epoxy resin has an epoxy equivalent of 160 or less,
When the sum of the weight of the naphthalene-based epoxy resin and the epoxy resin curing agent is 100 parts by weight, the amount of the polyimide resin or the polyamide-imide resin is 5 to 50 parts by weight,
The resin layer has a curing degree of 70% or more,
Metal foil with resin for the production of printed circuit boards. The naphthalene-based epoxy resin is liquid at 20±5° C.,
A resin-coated metal foil for manufacturing the printed circuit board according to claim 1. The epoxy resin curing agent is selected from the group consisting of phenol aralkyl type resin, naphthol aralkyl type resin, novolac type phenol resin, nitrogen-containing novolac resin, dicyclopentadiene type phenol resin, biphenyl type phenol resin and triphenyl type phenol resin. It was at Izu Re or one or more,
Resin coated metal foil for the manufacture of printed circuit board according to claim 1 or 2. The resin layer is formed to a thickness of 0.5 μm to 10 μm,
Resin coated metal foil for the manufacture of printed circuit board according to any one of claims 1 to 3. The metal foil has an average surface roughness (Ra) of 0.05 μm to 0.2 μm,
Resin coated metal foil for the manufacture of printed circuit board according to any one of claims 1 to 4. A step of laminating a resin coated metal foil according to Izu Re one of claims 1 to 5 on the insulating layer,
Removing the metal foil of the metal foil with the resin,
Forming a circuit pattern on the resin layer of the resin-coated metal foil from which the metal foil has been removed;
A method for manufacturing a printed circuit board, including: Naphthalene-based epoxy resin,
An epoxy resin curing agent,
A polyimide resin or a polyamide-imide resin soluble in a solvent having a boiling point of 150° C. or lower,
A resin layer containing is formed ,
The naphthalene-based epoxy resin has an epoxy equivalent of 160 or less,
When the sum of the weight of the naphthalene-based epoxy resin and the epoxy resin curing agent is 100 parts by weight, the amount of the polyimide resin or the polyamide-imide resin is 5 to 50 parts by weight,
The resin layer has a curing degree of 70% or more,
Printed circuit board.

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