JP6696837B2 - Heat dissipation structure for heat generating parts - Google Patents

Description

  BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat dissipation structure for heat generating parts such as electronic parts, and for example, relates to a heat dissipation structure for heat generating parts housed in a housing.

  In order to prevent the temperature rise of the heat-generating components housed in the housing (for example, heat-generating components such as electronic components mounted on the circuit board), the heat of the heat-generating components is transferred to the housing, and the heat transmitted to the housing is transferred. Means for releasing from the housing to the external environment may be employed.

  As a conventional means for transmitting heat from a heat-generating component to the housing and releasing the heat from the housing to the external environment, for example, the heat-generating component is contacted with the heat generated by the heat-generating component and provided with a recess. A heat-receiving component fixed to the substrate, a gel-like or liquid-state heat-conducting material housed in the recess of the heat-receiving part, and a convex portion and a heat-receiving part that come into contact with the heat-conducting material housed in the recess There has been proposed a heat dissipation structure for a heat-generating component, which includes a cover having a bulged portion whose corresponding portion bulges outward (Patent Document 1).

  Further, regarding the gel-like heat conductive material, it has been proposed to fill the space of the housing accommodating the circuit board with a gel material having high heat conductivity in order to ensure stable heat dissipation (Patent Document 2). ).

  On the other hand, in recent years, the heat generation amount of electronic components has been increasing more and more due to the higher functionality of electronic devices. Further, in Patent Document 1, the heat receiving component needs to be formed in a size having a heat capacity capable of quickly receiving the heat generated in the heat generating component and maintaining the heat generating component in a state not overheated. Therefore, in Patent Document 1, when the heat generation amount of the electronic component increases, it is necessary to upsize the heat receiving component, so that the substrate to which the heat receiving component is fixed also becomes large, and thus the structure itself There was a problem that it became large and heavy.

  Further, in Patent Document 1, since it is necessary to form a convex portion and a bulge portion in a portion of the cover corresponding to the heat receiving component, the cover and, by extension, the heat dissipation structure are complicated, and as a result, heat dissipation efficiency is suppressed. However, there is a problem that the work of assembling the heat dissipation structure also becomes complicated. Further, in Patent Document 1, since a precise positional relationship is required between the concave portion of the heat receiving component and the convex portion of the cover, the cover must be changed according to the difference in the position of the heat receiving component on the substrate. However, there is a problem that the number of parts increases.

  Further, as in Patent Document 2, when the space of the housing is filled with a gel material having a high thermal conductivity, the cost becomes high, and the heat is transferred to a region other than a desired portion of the housing. However, there is a problem that the structure becomes heavy.

JP, 2008-98579, A JP, 2005-191130, A

  In view of the above circumstances, the present invention provides a heat dissipation structure for a heat-generating component that can be reduced in size and weight, and further provides a heat-dissipating structure for a heat-generating component that can simplify the heat dissipation structure, has excellent heat dissipation efficiency, and is easy to assemble. To aim.

  Aspects of the present invention include a housing, a substrate housed in the housing, a heat-generating component mounted on the substrate, and a heat-radiating component thermally connected to the heat-generating component, the housing comprising: A heat radiation component housing portion that projects inwardly and houses the heat radiation component is provided, and the heat radiation component is a heat radiation structure of the heat generating component that is attached to the heat radiation component housing portion from the outside of the housing.

  In the above aspect, since the heat dissipation component is attached to the housing, the heat dissipation component is thermally connected to the housing. On the other hand, in the above aspect, the heat dissipation component is not attached to the board on which the heat generating component is mounted. Further, in the above aspect, the heat of the heat-generating component is transferred to the heat-radiating component and released from the heat-radiating component to the external environment, and / or the heat of the heat-generating component is transmitted to the housing via the heat-radiating component, and then from the housing. Released to the external environment.

  In an aspect of the present invention, the housing and / or the heat dissipation component has a taper portion and a pushing portion extending from the taper portion in a region corresponding to a portion where the heat generation component and the heat dissipation component are thermally connected. It is a heat dissipation structure of a heat generating component having.

  An aspect of the present invention is the heat dissipation component heat dissipation structure, wherein the heat dissipation component accommodation portion includes a hole through which the heat dissipation component is inserted.

  According to an aspect of the present invention, there is provided a heat dissipation structure for a heat generating component, wherein the heat dissipating component is provided with a recess for accommodating the heat generating component.

  An aspect of the present invention is a heat dissipation structure for a heat-generating component, wherein the recessed portion is provided with the tapered portion and the pushing portion.

  An aspect of the present invention is a heat dissipation structure for a heat generating component in which a heat conductive material is disposed between the heat dissipation component and the heat generating component.

  An aspect of the present invention is the heat dissipation structure of the heat generating component, wherein the heat generating component is fixed to the heat dissipation component and / or the housing by a fixing means.

  According to the aspect of the present invention, since the heat dissipation component is attached to the heat dissipation component housing portion of the housing, the heat dissipation structure can be simplified, and thus the heat dissipation structure of the heat dissipation component is excellent in heat dissipation efficiency and easy to assemble. Obtainable. Further, according to the aspect of the present invention, since the heat dissipation component is attached to the housing, heat is smoothly transferred from the heat dissipation component to the housing. Further, according to the aspect of the present invention, since the heat dissipation structure is simplified, the number of parts can be reduced. Further, according to the aspect of the present invention, since the heat dissipation component is attached to the housing, it is not necessary to upsize the board even if the heat generation amount of the heat dissipation component such as an electronic component increases. The heat dissipation structure can be made smaller and lighter.

  According to the aspect of the present invention, the housing and / or the heat dissipation component has a taper portion in a region corresponding to a portion where the heat dissipation component and the heat dissipation component are thermally connected, so that the heat dissipation component mounted on the substrate is secured. It can be smoothly guided to a predetermined position of the housing and / or the heat dissipation component. Further, by having the push-in portion extending from the tapered portion, the thermal connectivity and the fixability between the heat-generating component guided to the predetermined position of the housing and / or the heat-radiating component and the housing and / or the heat-radiating component are improved. As a result, the heat dissipation efficiency is further improved.

  According to the aspect of the present invention, since the heat dissipation component is formed with the recess for accommodating the heat dissipation component, the heat dissipation component can be easily and thermally connected to the heat dissipation component, and the heat generated from the heat dissipation component to the heat dissipation component is reduced. Transmissibility is further improved.

  According to the aspect of the present invention, by disposing the heat conductive material between the heat radiating component and the heat radiating component, the thermal resistance between the heat radiating component and the heat radiating component can be reduced, and the heat radiating component is excellent in heat radiating component. A heat transfer property is obtained.

  According to the aspect of the present invention, the heat generating component is fixed to the heat radiating component and / or the housing by the fixing means, so that the thermal connectivity between the heat generating component and the heat radiating component and / or the housing is further improved. As a result, a further excellent heat dissipation efficiency can be obtained.

It is a side sectional view explaining the heat dissipation structure of the exothermic part concerning the example of the 1st embodiment of the present invention. It is a side sectional view explaining the heat dissipation structure of the exothermic part concerning the example of the 2nd embodiment of the present invention. It is explanatory drawing of the heat dissipation component used for the heat dissipation structure of the heat generating component which concerns on the example of 2nd Embodiment of this invention. It is a side sectional view explaining the heat dissipation structure of the exothermic part concerning the example of the 3rd embodiment of the present invention. It is a perspective view explaining the heat dissipation component concerning other examples of an embodiment used for the heat dissipation structure of the exothermic part of the present invention. (A) Drawing, (b) Drawing, and (c) Drawing are all perspective views explaining a heat dissipation component concerning other examples of an embodiment used for a heat dissipation structure of a heat generating component of the present invention.

  The heat dissipation structure of the heat generating component according to the first embodiment of the present invention will be described below with reference to the drawings. As shown in FIG. 1, a heat dissipation structure 1 of a heat generating component according to the first embodiment (hereinafter, also referred to as “heat dissipation structure 1”) includes a housing 11 and a substrate 14 housed in the housing 11. The heat generating component 15 mounted on the board 14 and the heat radiating component 16 thermally connected to the heat generating component 15 are provided.

  The housing 11 includes a cover portion 12 and a main body portion 13. By attaching the cover portion 12 to the main body portion 13, the housing 11 having an internal space is formed. A board 14 (for example, a circuit board) is housed in the internal space of the housing 11.

  A heat generating component 15 is mounted on the substrate 14. In the heat dissipation structure 1, the heat generating component 15 is mounted on the substrate 14 via the mounting member 17 which is a conductive metal member. The shape of the mounting member 17 is not particularly limited, but in the heat dissipation structure 1, it is a flat plate shape or a linear shape. The mounting means for mounting the heat-generating component 15 on the substrate 14 is not particularly limited, but in the heat dissipation structure 1, the mounting member 17 penetrates the substrate 14 from the heat-generating component 15 side and the fastener 18 on the back side of the substrate 14. The heat-generating component 15 is mounted on the substrate 14 by being fixed to the substrate by.

  The heat generating component 15 is not particularly limited, but examples thereof include electronic components such as a field effect transistor (FET), an insulated gate bipolar transistor (IGBT), and a semiconductor element such as a light emitting diode.

  The shape of the heat radiating component 16 thermally connected to the heat generating component 15 is not particularly limited, and in the heat radiating structure 1, the heat radiating component 16 is a prism or a column whose side surface has a substantially trapezoidal cross section, and the heat generating component 15 The concave portion 20 is formed on the side facing the. Since the heat-generating component 15 is housed in the recess 20, the heat-generating component 15 and the heat-radiating component 16 are thermally connected. The shape of the recess 20 is not particularly limited as long as it can accommodate the heat generating component 15, and may be a shape corresponding to the shape of the heat generating component 15, such as a shape in which the heat generating component 15 fits into the recess 20. A shape that does not correspond to the above shape may be used.

  In the heat dissipation structure 1, the shape of the recess 20 is a shape corresponding to the shape of the heat generating component 15, and there is a space between the inner surface of the recess 20 and the outer surface of the heat generating component 15. Also, a heat conductive material 21 having a high heat conductivity (for example, a heat conductive gel, a heat conductive sheet, etc.) is arranged. Further, in FIG. 1, the space between the inner surface of the recess 20 and the outer surface of the heat-generating component 15 is filled with the heat conductive material 21. In the heat dissipation structure 1, since the heat conductive material 21 is disposed between the heat generating components 15 and 16, the thermal resistance between the heat generating components 15 and 16 is reduced, and Heat is smoothly transferred to the heat dissipation component 16. Further, since the heat conductive material 21 is housed in the space between the inner surface of the recess 20 and the outer surface of the heat-generating component 15, the heat conductive material 21 transfers heat to a region other than a desired portion of the housing 11. It is possible to prevent this from occurring and to reduce the amount of the heat conductive material 21 used.

  In the heat dissipation structure 1, the heat dissipation component 16 is attached to the cover portion 12 of the housing 11. By mounting the heat dissipation component 16 on the cover 12, the heat dissipation component 16 and the housing 11 are thermally connected. By thermally connecting the heat radiating component 16 and the housing 11, the heat transferred from the heat generating component 15 to the heat radiating component 16 is further transferred from the heat radiating component 16 to the housing 11 and released from the housing 11 to the external environment. It Further, as will be described later, in the heat dissipation structure 1, since the top portion 25 of the heat dissipation component 16 is exposed, a part of the heat transferred from the heat dissipation component 15 to the heat dissipation component 16 is directly output from the heat dissipation component 16 to the outside. Released to the environment. In this way, the heat of the heat-generating component 15 is released to the environment outside the housing 11, so that the heat-generating component 15 is prevented from overheating and temperature rise.

  The means for attaching the heat dissipation component 16 to the cover portion 12 is not particularly limited, and in the heat dissipation structure 1, the heat dissipation component 16 is provided in the heat dissipation component housing portion 19 that is a recessed portion that is provided in the cover portion 12 and that is recessed inward. The heat radiating component 16 is attached to the cover 12 by being fitted. Since the heat dissipation component housing portion 19 is recessed in the inner space direction of the housing 11, that is, in the direction of the board 14, the heat dissipation component 16 is placed on the outer surface of the cover part 12. From the above, in the heat dissipation structure 1, the surface of the top portion 25 of the heat dissipation component 16 is exposed to the external environment.

  Further, on the bottom surface of the heat dissipation component housing portion 19, a hole 24 is formed at a portion corresponding to the recess 20 of the heat dissipation component 16. The heat-generating component 15 is inserted into the recess 20 of the heat-dissipating component 16 through the hole 24 so that it can be accommodated in the recess 20 of the heat-dissipating component 16 placed on the outer surface of the cover 12. ..

  The shape of the heat radiation component housing portion 19 is not particularly limited, but in the heat radiation structure 1, the heat radiation component housing portion 19 has a shape corresponding to the outer shape of the heat radiation component 16. Further, the heat dissipation component 16 is attached to the cover part 12 in a state of being fitted in the heat dissipation component housing portion 19, that is, in a state where the outer surface of the heat dissipation component 16 is in direct contact with the heat dissipation component housing portion 19. Therefore, heat is smoothly transferred from the heat dissipation component 16 to the cover portion 12. In FIG. 1, a flange 22 is provided on the top portion 25 of the heat dissipation component 16. The heat dissipation component 16 is fixed to the outer surface of the cover 12 by using a screw 23 that penetrates the cover 12 from the outer surface of the cover 12 at the flange 22.

  The material of the housing 11 is not particularly limited, and examples thereof include materials having excellent thermal conductivity, for example, metals such as aluminum, copper and stainless steel. The material of the heat dissipation component 16 is not particularly limited, and examples thereof include materials having excellent thermal conductivity, for example, metals such as aluminum, copper and stainless steel. Further, as the gel material 21 having a higher thermal conductivity than air, for example, silicone gel or the like can be cited.

  As described above, in the heat dissipation structure 1, the heat dissipation component 16 is attached to the heat dissipation component housing portion 19 of the cover portion 12 and is not attached to the substrate on which the heat generation component 15 is mounted. That is, since the heat dissipation component 16 can directly transfer the heat received from the heat generating component 15 to the cover portion 12 (housing 11), the heat dissipation structure 1 can be simplified. According to the aspect of the present invention, since the heat dissipation structure 1 is simplified as described above, excellent heat dissipation efficiency can be obtained. Further, according to the aspect of the present invention, since the heat dissipation component 16 is attached to the cover portion 12 (housing 11), heat is smoothly transferred from the heat dissipation component 16 to the cover portion 12 (housing 11). According to the aspect of the present invention, since the heat dissipation structure 1 is simplified as described above, the number of parts can be reduced and the assembling work can be simplified. Further, according to the aspect of the present invention, since the heat dissipation component 16 is attached to the cover portion 12 (housing 11), it is not necessary to upsize the substrate 14 even if the heat generation amount of the heat generating component 15 increases. Therefore, the heat dissipation structure 1 can be reduced in size and weight.

  Next, the heat dissipation structure of the heat generating component according to the second embodiment of the present invention will be described with reference to the drawings. The same components as those of the heat dissipation structure of the heat generating component according to the first embodiment will be described using the same reference numerals.

  As shown in FIG. 2, the heat dissipation structure 2 of the heat generating component according to the second embodiment (hereinafter, also referred to as “heat dissipation structure 2”) is provided in the recess 20 of the heat dissipation component 16 and further with a tapered portion 30. A pushing portion 31 extending from the taper portion 30 is provided. The tapered portion 30 is provided at the opening-side end of the recess 20, and the pushing portion 31 is provided from the center of the recess 20 (that is, between the opening-side end and the closing-side end of the recess 20) to the closing-side end. It is provided.

  As shown in FIG. 3, in the heat dissipation structure 2, the pushing portion 31 is formed by bending both ends of the notch formed on the side wall surface of the through hole 20 ′ that becomes the recess 20 inward. It is provided by The tapered portion 30 extending from the pushing portion 31 is formed by processing the bent portion into a tapered shape. In addition, the recess 20 is formed by closing the end of the through hole 20 ′ of the heat dissipation component 16 where the tapered portion 30 is not formed with the lid 32.

  Since the tapered portion 30 is formed at the opening-side end of the recess 20, the heat-generating component 15 mounted on the substrate 14 can be smoothly and surely guided to the position of the recess 20, so that the heat-generating component 15 and the heat-radiating component 16 can be connected to each other. Can be connected smoothly, reliably and thermally. Further, since the push-in portion 31 extends from the taper portion 30, the heat-generating component 15 inserted into the recess 20 is pushed toward the inner surface of the recess 20 that faces the taper portion 30 and the push-in portion 31, and the heat-radiating component 16 is released. Close with. Therefore, the thermal connectivity and the fixability between the heat generating component 15 and the heat radiating component 16 are improved, and the heat radiation efficiency is further improved.

  As shown in FIG. 2, in the heat dissipation structure 2, the recess 20 is shaped to fit the heat-generating component 15, and the inner surface of the recess 20 facing the taper portion 30 and the pressing portion 31 and the outer surface of the heat-generating component 15 are opposed to each other. The heat conductive material 21 is not arranged between them, but the heat conductive material 21 is filled between the closed end of the recess 20 and the top of the heat-generating component 15. That is, in the heat dissipation structure 2, the inner surface of the recess 20 facing the tapered portion 30 and the pressing portion 31 and the outer surface of the heat-generating component 15 are in direct contact with each other.

  Further, in the heat dissipation structure 2, as in the heat dissipation structure 1, the heat dissipation component accommodation portion 19 has a shape corresponding to the outer shape of the heat dissipation component 16, and the heat dissipation component 16 is covered with the heat dissipation component accommodation part 19 in a fitted state. It is attached to the part 12. Similar to the heat dissipation structure 1, the heat dissipation component housing portion 19 is provided with a hole 24 for inserting the heat generating component 15 into the recess 20 of the heat dissipation component 16. On the other hand, in the heat dissipation structure 2, no flange is provided on the top of the heat dissipation component 16, and the heat dissipation component 16 is not fixed to the cover 12 by a fixing means such as a screw. As described above, in the heat dissipation structure of the heat generating component of the present invention, the heat dissipation component 16 can be attached to the cover portion 12 (housing 11) without using a fixing means such as a screw depending on the usage situation.

  Next, the heat dissipation structure of the heat generating component according to the third embodiment of the present invention will be described with reference to the drawings. The same components as those of the heat dissipation structure of the heat generating component according to the first and second embodiments will be described using the same reference numerals.

  As shown in FIG. 4, in the heat radiating structure 3 of the heat generating component according to the third embodiment (hereinafter, may be referred to as “heat radiating structure 3”), the heat generating component 15 is fixed by the fixing means 41. It is fixed to the cover member 12 of the housing 11. In the heat dissipation structure 3, a recess 40 is formed between the outer surface of the cover 12 and the heat dissipation component 16, and the heat dissipation component 15 is accommodated in the recess 40. The heat-generating component 15 is in direct contact with the inner surface (inner surface) of the recess 40. That is, the heat generating component 15 is in direct contact with the heat radiating component 16 and the cover 12.

  In the heat dissipation structure 3, the plate-shaped cover portion 12 has a planar vertical portion 42 formed by bending the edge portion thereof toward the substrate 14 housed inside the housing 11. Further, the heat dissipation component 16 is formed with a portion 43 having a substantially L shape in a side view. The recess 40 is formed by the outer surface of the vertical portion 42 of the cover 12 and the portion 43 of the heat dissipation component 16 that is substantially L-shaped in side view. Of the substantially L-shaped portion 43 in side view, the portion forming the closed end of the recess 40 is attached to the base of the flat vertical portion 42, that is, the outer surface of the bent portion of the cover 12. Therefore, also in the heat dissipation structure 3, the heat dissipation component 16 is attached to the outer surface of the cover 12 (housing 11). That is, in the heat dissipation structure 3, the planar vertical part 42 is formed by the edge of the cover part 12 recessing inward, and the planar vertical part 42 is the heat dissipation part of the cover part 12 (housing 11). Functions as a storage unit.

  The main body portion 13 is designed to be larger than the substrate 14, whereas the cover portion 12 having the planar vertical portion 42 is designed to be smaller than the substrate 14, and the planar vertical portion 42 of the cover portion 12 is designed. The heat generating component 15 is sandwiched between the outer surface and the heat radiating component 16. Further, the heat generating component 15 is fixed (screwed in FIG. 4) to the outer surface of the vertical portion 42 of the cover 12 and the heat radiating component 16 by fixing means 41 (screw in FIG. 4). Therefore, in the heat dissipation structure 3, when the substrate 14 is fixed to the heat dissipation structure 3, the heat dissipation component 16 is also fixed to the heat dissipation structure 3.

  In the heat dissipation structure 3, the tapered portion 30 is provided at the opening side end of the recess 40. In FIG. 3, the tapered portion 30 is provided in a portion of the flat vertical portion 42 of the cover portion 12 corresponding to the opening side end portion of the recess 40. Further, in the heat dissipation structure 3, the recess 40 does not contain a heat conductive material.

  In the heat dissipation structure 3, the heat generating component 15 is fixed by the fixing means 41 in a state of being in direct contact with the heat dissipating component 16 and the cover portion 12 (housing 11), so that the heat generating component 15, the heat dissipating component 16 and the cover portion 12 ( The thermal connectivity with the housing 11) is further improved, and excellent heat dissipation efficiency can be obtained.

  Next, another embodiment of the heat dissipation component used in the heat dissipation structure of the heat generating component of the present invention will be described. Here, with respect to the heat dissipation component used in the heat dissipation structure of the heat generating component according to the second embodiment, another embodiment will be described with reference to the drawings. The same components as those of the heat dissipation component used in the heat dissipation structure of the heat generating component according to the second embodiment (hereinafter, also referred to as “heat dissipation component according to the first embodiment”) are the same. Description will be given using reference numerals.

  First, as another example of the heat dissipation component, a heat dissipation component according to a second embodiment will be described with reference to the drawings.

  In the heat dissipation component 16 according to the first embodiment, both ends of the notch formed in the wall surface of the through hole 20 ′ that becomes the recess 20 are vertically bent inward to form a bent portion, and thus the pushing portion is formed. Although 31 is provided, instead of this, in the heat dissipation component 56 according to the second embodiment, as shown in FIG. 5, without forming a cut in the recess 20, the inner surface (inner surface) of the recess 20 is formed. In addition, the pushing-in portion 51 is provided by attaching one or a plurality of pushing-in members (two in FIG. 5) which are strips.

  In the heat dissipation component 56, the tapered portion 50 extending from the pushing portion 51 is formed by processing the opening side end portion of the pushing member into a tapered shape. In addition, the recess 20 is formed by closing the end of the through hole 20 ′ that becomes the recess 20 of the heat dissipation component 56, where the tapered portion 50 is not formed, with the lid 32.

  The material of the pushing member, which is a strip material, is not particularly limited, and examples thereof include materials having excellent thermal conductivity, for example, metals such as aluminum, copper, and stainless steel.

  Also in the heat dissipation component 56 according to the second embodiment using the pushing member that is a strip, the tapered portion 50 is formed at the opening side end of the recess 20 as in the heat dissipation component 16 according to the first embodiment. By doing so, the heat generating component (not shown in FIG. 5) can be smoothly and reliably guided to the position of the recess 20. Further, since the push-in portion 51 extends from the taper portion 50, the heat-generating component inserted in the recess 20 is pushed inward toward the inner surface of the recess 20 facing the taper portion 50 and the push-in portion 51, and the heat-radiating component 56 is formed. Closely.

  Next, as another embodiment of the heat dissipation component, a heat dissipation component according to a third embodiment will be described with reference to the drawings. The same components as those of the heat dissipation component according to the first and second embodiments will be described using the same reference numerals.

  As shown in FIG. 6A, in the heat dissipation component 66 according to the third embodiment, an opening 62 is further provided on the side wall surface of the recess 20 of the heat dissipation component 16 according to the first embodiment. .. In the heat dissipation component 66, an opening 62 (a plurality of openings 62 in FIG. 6A) is provided on the side wall surface of the recess 20 on which the pushing portion 31 is formed. In FIG. 6A, one opening 62 having a rectangular shape in a side view is provided at each of the cuts of the recesses 20 provided to form the push-in portion 31.

  In the heat dissipation component 66 according to the third embodiment, as in the heat dissipation component 16 according to the first embodiment, the tapered portion 30 is formed at the opening-side end of the recess 20, so that the heat generating component (see FIG. 6). In (a), it is possible to smoothly and reliably guide (not shown) to the position of the recess 20. Further, since the push-in portion 31 extends from the taper portion 30, the heat-generating component inserted in the recess 20 is pushed toward the inner surface of the recess 20 facing the taper portion 30 and the push-in portion 31, and the heat-radiating component 66 is formed. Closely.

  Further, since the opening portion 62 is provided on the side wall surface of the recess 20, the flexibility of the side wall surface on which the pushing portion 31 is formed is improved, so that the heat generating component can be smoothly guided to the position of the recess 20, In addition, the heat-generating component can be easily accommodated in the recess 20. Further, since the opening 62 is provided on the side wall surface of the recess 20, the weight of the heat dissipation component 66 can be reduced.

  Next, as another embodiment of the heat dissipation component, a heat dissipation component according to a fourth embodiment will be described with reference to the drawings. The same components as those of the heat dissipation component according to the first to third embodiments will be described using the same reference numerals.

  As shown in FIG. 6B, in the heat dissipation component 76 according to the fourth embodiment, neither the tapered portion nor the pushing portion extending from the tapered portion is provided in the recess 20. Further, an opening 72 (one in FIG. 6B) having a substantially inverted U shape in a side view is provided on the side wall surface of the recess 20. Since the side wall of the recess 20 is provided with the opening 72 having a substantially inverted U-shape in a side view, the side wall is provided with a protrusion 73 having a substantially rectangular shape in a side view.

  Also in the heat dissipation component 76 according to the fourth embodiment example, the recess 20 for accommodating the heat generating component (not shown in FIG. 6B) is provided, and the opening 72 having a substantially inverted U shape in side view is provided. Since the protruding portion 73 having a substantially rectangular shape in a side view is formed on the side wall surface of the recess 20, excellent heat transfer from the heat-generating component to the heat-radiating component 76 can be obtained. Further, since the opening 72 is provided on the side wall surface of the recess 20, the weight of the heat dissipation component 76 can be reduced.

  Next, as another embodiment of the heat dissipation component, a heat dissipation component according to the fifth embodiment will be described with reference to the drawings. The same components as those of the heat dissipation component according to the first to fourth embodiments will be described using the same reference numerals.

  In the concave portion 20 of the heat dissipation component 16 according to the first embodiment, the pushing portion 31 is provided from the central portion of the concave portion 20 to the closing side end portion, but instead of this, as shown in FIG. 6 (c). In the heat dissipation component 86 according to the fifth embodiment, the pushing portion 81 is provided between the opening-side end portion and the closing-side end portion of the recess 20, that is, the central portion of the recess 20, and the closing-side of the recess 20. It is not provided at the end. Further, in the heat dissipation component 86 according to the fifth embodiment, the taper portion 80 is provided at the opening side end of the recess 20 as in the heat dissipation component 16 according to the first embodiment. Further, in the heat dissipation component 86 according to the fifth embodiment, among the side wall surfaces of the recess 20 provided with the tapered portion 80 and the pushing portion 81, the opening portion 82 (one in FIG. 6C) is provided at the closed end portion. ) Is provided. In FIG. 6C, the shape of the opening 82 is a side view rectangular shape.

  In the heat dissipation component 86 according to the fifth embodiment, as in the heat dissipation component 16 according to the first embodiment, the tapered portion 80 is formed at the opening-side end of the recess 20. In c), (not shown) can be smoothly and surely guided to the position of the recess 20. Further, since the push-in portion 81 extends from the taper portion 80, the heat-generating component inserted in the recess 20 is pushed inward toward the inner surface of the recess 20 facing the taper portion 80 and the push-in portion 81, and the heat-radiating component 86 is formed. Closely.

  Further, since the opening portion 82 is provided on the side wall surface of the recess 20, the flexibility of the side wall surface on which the pushing portion 81 is formed is improved, so that the heat-generating component can be smoothly guided to the position of the recess 20. In addition, the heat-generating component can be easily accommodated in the recess 20. Further, since the side wall surface of the recess 20 is provided with the opening 82, the weight of the heat dissipation component 86 can be reduced.

  Next, another embodiment of the present invention will be described. In the heat dissipation structure for the heat-generating component according to the first and second embodiments, the heat-dissipating component is formed with a recess and the heat-generating component is housed in the recess. Instead, however, the surface of the heat-dissipating component not provided with the recess. The heat generating component and the heat radiating component may be thermally connected by bringing the heat generating component into contact with the heat generating component.

  Further, in the heat dissipation structure for the heat-generating component according to the first embodiment, the space between the inner surface of the recess and the outer surface of the heat-generating component is filled with a heat conductive material having a higher thermal conductivity than air. Alternatively, the heat-conductive material may not be filled, and in this case, for example, as a shape in which the recess is fitted to the heat-generating component so that a gap is not formed between the inner surface of the recess and the outer surface of the heat-generating component. Good. Further, in the heat dissipation structure of the heat generating component according to the second embodiment, the heat conductive material is not disposed between the inner surface of the recess facing the tapered portion and the pushing portion and the outer surface of the heat generating component. If necessary, a heat conductive material may be arranged, and the heat conductive material was arranged between the closed side end of the recess and the top of the heat generating component, but instead of this, It is not necessary to arrange the heat conductive material.

  In the heat dissipating structure for heat generating components according to the first and second embodiments, the heat generating component is not fixed to the heat dissipating component and / or the housing by the fixing means such as screws, but if necessary, screws such as screws are used. The fixing means may be used to fix the heat dissipation component and / or the housing.

  Further, in the heat dissipation structure for the heat-generating component according to the third embodiment, the taper portion is provided on the planar vertical portion of the cover portion, but instead of or together with this, the recess of A tapered portion may be provided at a portion corresponding to the opening-side end portion.

  In the heat dissipation structure of the heat generating component of the present invention, since the heat dissipation component is attached to the housing, the heat dissipation structure can be simplified, and the substrate and hence the heat dissipation structure can be miniaturized, so that the heat generating component mounted on the substrate is cooled. It is widely applicable in the field, and has high utility value in the field of cooling electronic components having a high heating value, such as field effect transistors, insulated gate bipolar transistors, and light emitting diodes.

1, 2, 3, 4 Heat dissipation structure 11 for heat generating components Housing 14 Substrate 15 Heat generating components 16, 56, 66, 76, 86 Heat dissipation component 19 Heat dissipation component housing 20, 40 Recess 21 Heat conductive material 30, 50, 80 Taper Sections 31, 51, 81 Pushing section 41 Fixing means

Claims (7)

A housing; a substrate housed in the housing; a heat-generating component mounted on the substrate; and a heat-radiating component thermally connected to the heat-generating component,
The housing is provided with a heat dissipation component housing portion that is recessed inward and accommodates the heat dissipation component,
The heat dissipation component is attached to the heat dissipation component housing from the outside of the housing ,
The heat dissipating component housing portion is a heat dissipating structure for a heat generating component, which includes a hole for inserting the heat generating component. A housing; a substrate housed in the housing; a heat-generating component mounted on the substrate; and a heat-radiating component thermally connected to the heat-generating component,
The housing is provided with a heat dissipation component housing portion that is recessed inward and accommodates the heat dissipation component,
The heat dissipation component is attached to the heat dissipation component housing from the outside of the housing,
The housing and / or the heat-radiating element is a region where the heat radiation member and the heat generating component corresponds to the site that was thermally connected to, possess a pushing portion extending from the tapered portion and the tapered portion,
The heat dissipating component housing portion is a heat dissipating structure for a heat generating component, which includes a hole for inserting the heat generating component. The heat dissipation structure for the heat generating component according to claim 1 , wherein the heat dissipation component is provided with a recess for accommodating the heat generating component. The heat dissipation structure for the heat generating component according to claim 2 , wherein the heat dissipation component is provided with a recess for accommodating the heat generating component.   The heat dissipation structure of the heat-generating component according to claim 4, wherein the tapered portion and the pushing portion are provided in the recess.   The heat dissipation structure for a heat generating component according to claim 1, wherein a heat conductive material is disposed between the heat radiating component and the heat generating component.   The heat dissipation structure for a heat generating component according to any one of claims 1 to 6, wherein the heat generating component is fixed to the heat radiating component and / or the housing by fixing means.

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