JP6693602B2 - 押圧検知センサ及び電子機器 - Google Patents
押圧検知センサ及び電子機器 Download PDFInfo
- Publication number
- JP6693602B2 JP6693602B2 JP2019549260A JP2019549260A JP6693602B2 JP 6693602 B2 JP6693602 B2 JP 6693602B2 JP 2019549260 A JP2019549260 A JP 2019549260A JP 2019549260 A JP2019549260 A JP 2019549260A JP 6693602 B2 JP6693602 B2 JP 6693602B2
- Authority
- JP
- Japan
- Prior art keywords
- piezoelectric film
- electrode pair
- detection sensor
- pressure detection
- region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000001514 detection method Methods 0.000 title claims description 95
- 229920000642 polymer Polymers 0.000 claims description 9
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 239000004626 polylactic acid Substances 0.000 description 16
- 229920000747 poly(lactic acid) Polymers 0.000 description 15
- 238000010586 diagram Methods 0.000 description 14
- 230000004048 modification Effects 0.000 description 11
- 238000012986 modification Methods 0.000 description 11
- 239000002033 PVDF binder Substances 0.000 description 3
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 3
- 239000012790 adhesive layer Substances 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000005616 pyroelectricity Effects 0.000 description 2
- 238000004088 simulation Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- GKWLILHTTGWKLQ-UHFFFAOYSA-N 2,3-dihydrothieno[3,4-b][1,4]dioxine Chemical compound O1CCOC2=CSC=C21 GKWLILHTTGWKLQ-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 210000000707 wrist Anatomy 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/16—Measuring force or stress, in general using properties of piezoelectric devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/008—Transmitting or indicating the displacement of flexible diaphragms using piezoelectric devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/08—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of piezoelectric devices, i.e. electric circuits therefor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/30—Piezoelectric or electrostrictive devices with mechanical input and electrical output, e.g. functioning as generators or sensors
- H10N30/302—Sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/30—Piezoelectric or electrostrictive devices with mechanical input and electrical output, e.g. functioning as generators or sensors
- H10N30/308—Membrane type
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/802—Drive or control circuitry or methods for piezoelectric or electrostrictive devices not otherwise provided for
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/85—Piezoelectric or electrostrictive active materials
- H10N30/857—Macromolecular compositions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/88—Mounts; Supports; Enclosures; Casings
Description
11,63…第1電極対
12,64…第2電極対
15…圧電フィルム
65…切り欠き部
66,114…突出部
100,102…電子機器
151…第1主面
152…第2主面
R1…第1領域
R2…第2領域
Claims (7)
- 第1領域及び該第1領域の外側に位置し、かつ該第1領域の外周をとり囲む第2領域を有し、ユーザからの押圧操作により変形する圧電フィルムと、
前記圧電フィルムの前記第1領域における第1主面及び第2主面に形成された第1電極対と、
前記圧電フィルムの前記第2領域における第1主面及び第2主面に形成された第2電極対と、
を備え、
前記圧電フィルムが押圧操作を受け付けたとき、前記第1電極対は、前記第2電極対と異なる極性の電圧を出力し、
前記第1電極対は突出部を備え、該突出部の一端は、前記第2電極対の外周側へ突出している、
押圧検知センサ。 - 前記第1領域は前記第2領域と同一の面積である、
請求項1に記載の押圧検知センサ。 - 前記圧電フィルムは対称な形状である、
請求項1又は2に記載の押圧検知センサ。 - 前記圧電フィルムは円形である、
請求項3に記載の押圧検知センサ。 - 前記圧電フィルムは一軸延伸されたキラル高分子を含み、
前記第1電極対は、前記一軸延伸された方向に対して45度傾いた方向に切り欠き部を備える、
請求項1から4のいずれかに記載の押圧検知センサ。 - 前記圧電フィルムは一軸延伸されたキラル高分子を含み、
前記突出部は、前記一軸延伸された方向に対して−45度傾いた方向に前記第2領域へ突出する、
請求項1から5のいずれかに記載の押圧検知センサ。 - 請求項1から6のいずれかに記載の押圧検知センサを備える、
電子機器。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017203834 | 2017-10-20 | ||
JP2017203834 | 2017-10-20 | ||
PCT/JP2018/038276 WO2019078144A1 (ja) | 2017-10-20 | 2018-10-15 | 押圧検知センサ及び電子機器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2019078144A1 JPWO2019078144A1 (ja) | 2020-02-27 |
JP6693602B2 true JP6693602B2 (ja) | 2020-05-13 |
Family
ID=66174481
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019549260A Active JP6693602B2 (ja) | 2017-10-20 | 2018-10-15 | 押圧検知センサ及び電子機器 |
Country Status (3)
Country | Link |
---|---|
US (1) | US11619555B2 (ja) |
JP (1) | JP6693602B2 (ja) |
WO (1) | WO2019078144A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102019132356A1 (de) * | 2019-11-28 | 2021-06-02 | Tdk Electronics Ag | Zweikanaliger Detektor |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6130268Y2 (ja) * | 1979-02-08 | 1986-09-05 | ||
JPS5994103A (ja) * | 1982-11-19 | 1984-05-30 | Nec Corp | 電気機械変換器の制御装置 |
JP3256346B2 (ja) | 1993-07-29 | 2002-02-12 | 和廣 岡田 | 圧電素子を用いた力・加速度・磁気のセンサ |
JPH09184774A (ja) * | 1995-12-28 | 1997-07-15 | Miyota Kk | 圧電型物理量センサ |
JPH1144586A (ja) * | 1997-07-29 | 1999-02-16 | Miyota Co Ltd | 圧電セラミックスセンサ及びその製造方法 |
WO2010143528A1 (ja) * | 2009-06-11 | 2010-12-16 | 株式会社村田製作所 | タッチパネルおよびタッチ式入力装置 |
US8888255B2 (en) * | 2010-06-29 | 2014-11-18 | Hewlett-Packard Development Company, L.P. | Piezoelectric actuator with coplanar electrodes |
EP2982938B1 (en) * | 2011-04-08 | 2018-08-29 | Murata Manufacturing Co., Ltd. | Operation device including displacement sensor |
JP5686443B2 (ja) * | 2013-01-10 | 2015-03-18 | 日本写真印刷株式会社 | 接着層付きフィルム状感圧センサとこれを用いたタッチパッド、タッチ入力機能付き保護パネル及び電子機器 |
US20150242037A1 (en) * | 2014-01-13 | 2015-08-27 | Apple Inc. | Transparent force sensor with strain relief |
CN106489119B (zh) | 2014-07-02 | 2020-02-18 | 株式会社村田制作所 | 触摸面板 |
JP6123947B2 (ja) | 2014-08-20 | 2017-05-10 | 株式会社村田製作所 | 押圧センサ及び電子機器 |
-
2018
- 2018-10-15 WO PCT/JP2018/038276 patent/WO2019078144A1/ja active Application Filing
- 2018-10-15 JP JP2019549260A patent/JP6693602B2/ja active Active
-
2019
- 2019-10-04 US US16/593,015 patent/US11619555B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
JPWO2019078144A1 (ja) | 2020-02-27 |
WO2019078144A1 (ja) | 2019-04-25 |
US20200041364A1 (en) | 2020-02-06 |
US11619555B2 (en) | 2023-04-04 |
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