JP6687082B2 - Light emitting device and manufacturing method thereof - Google Patents

Description

  The present invention relates to a light emitting device including a light emitting element and a method for manufacturing the same.

Light emitting diodes (LEDs) are used in various applications such as lighting fixtures, personal computer (PC) and TV backlights, and large displays. As for the LED light source, the demand for such various applications is increasing and the demand for improving the light output is also increasing.
For example, Patent Document 1 includes a wiring substrate having a recess, a light emitting element housed in the recess, and a translucent sealing member that seals the light emitting element, and the surface of the translucent sealing member is a rough surface. An improved optical semiconductor device is disclosed. Patent Document 2 includes a base body, a light emitting element mounted on the base body, and a sealing member for sealing the light emitting element, and disposing filler particles on the surface side of the sealing member. A light emitting device provided with unevenness is disclosed.

JP, 2007-324220, A JP 2012-151466 A

  However, since such a method requires changing the material and shape of the constituent members, the shape and material of the applicable light emitting device may be limited.

  It is an object of an embodiment according to the present disclosure to provide a light emitting device that improves light extraction efficiency and a manufacturing method thereof.

  A light emitting device according to an embodiment of the present disclosure includes a base, a light emitting element mounted on the base, and a translucent member that covers the light emitting element, and the translucent member and the base. Has a plurality of protrusions on the upper surface of each, and the translucent member contains particles of a translucent first filler having a refractive index lower than that of the base material of the translucent member. Part of the particles of the filler 1 is exposed from the base material of the translucent member on the upper surface of the translucent member.

  A method for manufacturing a light emitting device according to an embodiment of the present disclosure is a method for manufacturing a light emitting device including a base, a light emitting element mounted on the base, and a translucent member that covers the light emitting element. Then, after the light emitting element is mounted on the base, a step of forming the translucent member covering the light emitting element, and a blasting process on the upper surface of each of the translucent member and the base. In the step of forming the translucent member, the translucent member uses a translucent resin as a base material, and the translucent first member has a refractive index lower than that of the base material. A part of the particles of the first filler is formed on the upper surface of the translucent member by a step of performing the blasting treatment, which is formed by using a resin material containing particles of the filler. Exposed from the base material.

  According to the light emitting device and the manufacturing method thereof according to the embodiment of the present disclosure, it is possible to provide a light emitting device with improved light extraction efficiency.

It is a perspective view which shows the structure of the light-emitting device which concerns on 1st Embodiment. It is a top view which shows the structure of the light-emitting device which concerns on 1st Embodiment. It is sectional drawing which shows the structure of the light-emitting device which concerns on 1st Embodiment, and shows the cross section in the IC-IC line of FIG. 1B. It is sectional drawing which shows some translucent members and a filler in the light-emitting device which concerns on 1st Embodiment. It is sectional drawing which shows some translucent members and a filler in the conventional light-emitting device. FIG. 6 is a cross-sectional view for explaining light reflection on the upper surfaces of the translucent member and the light shielding member in the light emitting device according to the first embodiment. 6 is a flowchart showing a procedure of a method for manufacturing the light emitting device according to the first embodiment. FIG. 5 is a cross-sectional view showing a configuration of a package prepared in a package preparing step of the method for manufacturing the light emitting device according to the first embodiment. FIG. 5 is a cross-sectional view showing a light emitting element mounting step of the method for manufacturing the light emitting device according to the first embodiment. FIG. 6 is a cross-sectional view showing a resin supply step of the method for manufacturing the light emitting device according to the first embodiment. It is sectional drawing which shows the resin hardening process of the manufacturing method of the light-emitting device which concerns on 1st Embodiment. It is sectional drawing which shows the blasting process process of the manufacturing method of the light-emitting device which concerns on 1st Embodiment. It is a top view which shows the 1st example of the direction which blasts an abrasive in the blasting process process of the manufacturing method of the light-emitting device which concerns on 1st Embodiment. It is a top view which shows the 2nd example of the direction which blasts an abrasive in the blasting process process of the manufacturing method of the light-emitting device which concerns on 1st Embodiment. It is a top view which shows the 3rd example of the direction which blasts an abrasive in the blasting process process of the manufacturing method of the light-emitting device which concerns on 1st Embodiment. It is sectional drawing which shows a 1st process in the blasting process process of the manufacturing method of the light-emitting device which concerns on 1st Embodiment. It is sectional drawing which shows the 2nd process in the blasting process process of the manufacturing method of the light-emitting device which concerns on 1st Embodiment. FIG. 3 is a perspective view showing a configuration of an image display device using the light emitting device according to the first embodiment. FIG. 3 is an exploded perspective view showing a configuration of an image display device using the light emitting device according to the first embodiment. It is a perspective view which shows the structure of the light-emitting device which concerns on 2nd Embodiment. It is a top view which shows the structure of the light-emitting device which concerns on 2nd Embodiment. It is sectional drawing which shows the structure of the light-emitting device which concerns on 2nd Embodiment, and shows the cross section in the VIIIC-VIIIC line of FIG. 8B. 9 is a flowchart showing a procedure of a method for manufacturing a light emitting device according to a second embodiment.

  Hereinafter, the light emitting device and the method for manufacturing the same according to the embodiment will be described. Since the drawings referred to in the following description schematically show the present embodiment, scales, intervals, positional relationships, etc. of the respective members are exaggerated, or a part of the members is not shown. There is a case. Further, in the following description, components having the same names and reference numerals indicate the same or similar members in principle, and detailed description thereof will be appropriately omitted.

<First Embodiment>
[Configuration of light emitting device]
The configuration of the light emitting device according to the first embodiment will be described with reference to FIGS. 1A to 1C.
FIG. 1A is a perspective view showing the configuration of the light emitting device according to the first embodiment. FIG. 1B is a plan view showing the configuration of the light emitting device according to the first embodiment. FIG. 1C is a cross-sectional view showing the configuration of the light emitting device according to the first embodiment, and shows a cross section taken along the line IC-IC of FIG. 1B.

  Note that, in FIG. 1C, the portions surrounded by broken lines near the upper surfaces of the light-shielding member and the light-transmitting member are shown in an enlarged manner. Further, in FIG. 1C, the two types of first fillers are indicated by circles and diamonds, and the second filler is indicated by circles. These shapes do not indicate the specific shapes of the corresponding members, but are used for convenience in order to distinguish the type of the filler particles.

The light emitting device 100 according to the first embodiment includes a base, a light emitting element 1 mounted on the base, and a translucent member 5 that covers the light emitting element 1. The translucent member 5 and the base have an uneven shape, that is, a plurality of protrusions on their upper surfaces. The translucent member 5 contains particles of the translucent first filler 52 having a lower refractive index than the base material 51 of the translucent member 5, and some of the particles of the first filler 52 are translucent. It is exposed from the base material 51 of the transparent member 5 on the upper surface of the transparent member 5. The base is equivalent to the package 2.
More specifically, the light emitting device 100 has a substantially square shape in a plan view, and has a package 2 having a recess 2a opening to the upper surface side, a light emitting element 1 mounted in the recess 2a, and arranged in the recess 2a. , And a translucent member 5 that covers the light emitting element 1. Further, the package 2 has a lead electrode 3 and a light shielding member 4, and the light emitting element 1 is electrically connected to the lead electrode 3 arranged on the bottom surface of the recess 2 a using a wire 6.

The light emitting element 1 is mounted in the recess 2 a of the package 2. In the present embodiment, three light emitting elements 11, 12, 13 having different emission colors are mounted in the recess 2a. For example, the emission color of the light emitting element 11 can be blue, the emission color of the light emitting element 12 can be green, and the emission color of the light emitting element 13 can be red.
Note that, hereinafter, each of the three light emitting elements 11, 12, and 13 may be referred to as a “light emitting element 1” unless particularly distinguished.

  The light emitting elements 11, 12 and 13 are die-bonded on the lead electrode 33 arranged at the center of the bottom surface 2b of the recess 2a. Further, the anode electrode, which is one of the electrodes of the light emitting elements 11, 12, and 13, is electrically connected to the lead electrode 34 using the wire 6. The cathode electrode, which is the other electrode of the light emitting elements 11, 12, and 13, is electrically connected to any of the corresponding lead electrodes 31, 32, and 33 using the wire 6. That is, the three light emitting elements 11, 12, and 13 are configured to be able to independently apply a voltage. Accordingly, it is possible to individually turn on the light emitting elements 11, 12, and 13, or to arbitrarily adjust the brightness levels of the light emitting elements 11, 12, and 13, and to control the emission color and brightness of the light emitting device 100. It can be changed arbitrarily. Therefore, the light emitting device 100 can be used as one pixel of a color image display device.

The light emitting element 1 used here is not particularly limited in shape, size, semiconductor material and the like. The emission color of the light emitting element 1 can be selected to have any wavelength according to the application. The light emitting elements 11 and 12 that emit blue and green light have In _X Al _Y Ga _{1 -XY} N (0 ≦ X ≦ 1, 0 ≦ Y ≦ 1, X + Y ≦ 1) emission wavelengths in the near-ultraviolet to visible light region. It is possible to preferably use a light emitting device made of a nitride semiconductor represented by). Further, as the light emitting element 13 that emits red light, a GaAs, AlInGaP, or AlGaAs-based semiconductor can also be used.
In the present embodiment, the light emitting element 1 may have positive and negative electrodes arranged on the same surface side, or may have positive and negative electrodes arranged on different surface sides. When using the light emitting element 1 in which positive and negative electrodes are arranged on the same surface side, either a face-up mounting type or a face-down mounting type may be used. When mounting a plurality of light emitting elements 1, different mounting types may be mixed.

  The number of the light emitting elements 1 mounted in the recess 2a may be one or more, and the combination of emission colors when mounting a plurality of the light emitting elements 1 and the outer shape of the light emitting element 1 are appropriately changed. be able to.

  The package 2 has a lead electrode 3 and a light shielding member 4, has a substantially square outer shape in a plan view, and is provided with a recess 2a having an opening on the upper surface side. The recess 2 a is a region for mounting the light emitting element 1, and the bottom surface 2 b of the recess 2 a is composed of the lead electrode 3 and the light shielding member 4. The side wall of the recess 2a is formed of the light shielding member 4.

The lead electrode 3 is composed of four lead electrodes 31 to 34, and is a wiring for connecting the three light emitting elements 11 to 13 electrically connected via the wire 6 to an external power source.
Part of each of the lead electrodes 31 to 34 constitutes the bottom surface 2b of the recess 2a, and each extends to the end of the light shielding member 4 in plan view and bends downward at the end, so that the light shielding member 4 is formed. Are arranged so as to extend along the side surfaces of the light shielding member 4 and to be bent inward along the lower surface of the light shielding member 4. In the light emitting device 100, the lower surface side is a mounting surface, and the lead electrodes 31 to 34, which are bent inward on the lower surface side of the light shielding member 4, are joined together by using a conductive joining member such as solder. It is a junction.

Further, the portions of the lead electrodes 31 to 34 exposed on the bottom surface 2b of the recess 2a are the portions electrically connected to the light emitting elements 11 to 13 via the wires 6. The lead electrode 31 is electrically connected to the cathode electrode of the light emitting element 11, the lead electrode 32 is electrically connected to the cathode electrode of the light emitting element 12, and the lead electrode 33 is electrically connected to the cathode electrode of the light emitting element 13. The lead electrode 34 is electrically connected to the respective anode electrodes of the light emitting elements 11 to 13.
Further, the lead electrode 33 is arranged at the center of the bottom surface 2b of the recess 2a, and also serves as a light emitting element disposition region where the light emitting elements 11 to 13 are bonded using a die bond member.

The lead electrode 3 can be formed by punching or bending a flat metal plate by press working. The sheet metal as a raw material is not particularly limited as long as it is used for the lead frame of the package of the light emitting element. The thickness of the sheet metal is appropriately selected according to the shape and size of the package, but for example, a thickness of about 100 to 500 μm is used, and a thickness of 120 to 300 μm is more preferable. Further, as the material of the sheet metal, for example, a Cu-based alloy is used.
In addition, the upper surface of the lead electrode 3, which is the bottom surface 2b of the recess 2a, is plated with Ag, Au, Ni or the like in order to improve the light reflectivity and / or the bondability with the wire 6 or the die bond member. May be.

The light-shielding member 4 is a member that separates and fixes the four lead electrodes 31 to 34 from each other and forms a side wall of the recess 2a. The light-blocking member 4 is made of a material that blocks light without transmitting it, and a light-reflecting material that blocks light by reflecting light or a light-absorbing material that blocks light by absorbing light is used. To be
Specifically, the light-shielding member 4 can be formed by using a resin material having a light-transmitting property as a base material 41 and a resin material containing a second filler 42 for imparting a light-shielding property as a filler. . Further, on the upper surface 4a of the light shielding member 4 which is the upper surface of the side wall of the recess 2a, some of the particles of the second filler 42 are exposed from the base material 41, and the unevenness caused by the particles of the second filler 42 is formed. It has a shape or protrusion.

When a light-reflecting material is used for the light-blocking member 4, the light-blocking member 4 transmits the light emitted from the light emitting element 1, propagating through the light-transmitting member 5, and reaching the light-blocking member 4. Function to return to within 5. Thereby, the light extraction efficiency from the upper surface of the light emitting device 100 can be improved.
When a light absorbing material is used for the light blocking member 4, the light blocking member 4 absorbs light emitted from the light emitting element 1, transmitted through the light transmitting member 5, and incident on the light blocking member 4. . Therefore, light can be emitted only from the upper surface of the light emitting device 100.

  Further, regardless of whether a light-reflecting material or a light-absorbing material is used for the light-shielding member 4, by providing such a light-shielding member 4, the light emission from the light emitting device 100 is transparent. Since it is limited to the upper surface of the member 5, the light emitting device 100 having a high contrast between the light emitting region and the non-light emitting region and having a good so-called “parting-off property” can be provided.

Examples of the resin used as the base material 41 of the light shielding member 4 include thermoplastic resin and thermosetting resin.
In the case of a thermoplastic resin, for example, polyphthalamide resin, liquid crystal polymer, polybutylene terephthalate (PBT), unsaturated polyester and the like can be used.
In the case of a thermosetting resin, for example, epoxy resin, modified epoxy resin, silicone resin, modified silicone resin or the like can be used.

When the light-shielding member 4 has a light-reflecting property, the light-shielding member 4 is formed using a resin material in which particles of a light-reflecting substance are contained in the base material 41 as the second filler 42 to impart light reflectivity. can do. Examples of the light-reflecting substance include TiO ₂ , Al ₂ O ₃ , ZrO ₂ , and MgO.
Further, the inner surface of the recess 2a preferably has a reflectance of 70% or more, more preferably 80% or more in the wavelength range of the light emitted by the light emitting element 1. The content of the second filler 42, which is a light-reflecting substance, in the light-shielding member 4 may be 5% by mass or more and 50% by mass or less, and preferably 10% by mass or more and 30% by mass or less.
The particle size of the second filler 42 is preferably about 0.1 μm or more and 0.5 μm or less. By setting the particle size of the second filler 42 within this range, the light shielding member 4 can obtain good light reflectivity.
Unless otherwise specified, in the present specification, the values of particle diameters of various fillers, abrasives, and the like are determined by air permeation method or Fisher-SubSieve-Sizers-No. (FSSS method).

  Further, it is preferable that the plurality of protrusions on the upper surface 4a of the light shielding member 4 are formed so that the arithmetic mean roughness Ra defined by JIS standard B0601: 2013 is about 0.090 μm or more and 0.210 μm or less. In particular, by setting the arithmetic average roughness Ra of the upper surface 4a of the light shielding member 4 to be 0.130 μm or more, it is possible to more efficiently scatter the external light.

When the light-shielding member 4 has a light-absorbing property, the base material 41 is made of a resin material having light-absorbing property by containing particles of a light-absorbing substance as the second filler 42. be able to. Examples of the light absorbing material used for the second filler 42 include black pigments, and more specifically, carbon-based pigments such as carbon black and graphite.
The particle size and content of the light-absorbing substance used as the second filler 42 can be the same as those of the above-mentioned reflective substance. For example, when carbon black is added as the second filler 42, it may be about 1% by mass. Furthermore, for example, wollastonite, which is a reinforcing agent, may be added as another filler in an amount of about 25% by mass.

  The light-shielding member 4 is made of a resin material having a light-reflecting property or a light-absorbing property by containing the second filler 42 in the base material 41, and is formed by a transfer molding method using a mold, an injection molding method, It can be formed by a molding method such as a compression molding method or a coating method such as a screen printing method.

The plurality of protrusions on the upper surface 4 a of the light shielding member 4 can be formed by subjecting the upper surface 4 a to a blasting process to expose some of the particles of the second filler 42 from the base material 41. That is, it is preferable that the plurality of protrusions on the upper surface 4 a of the light shielding member 4 be formed due to the particles of the second filler 42.
The plurality of protrusions formed due to the particles of the second filler 42 having the particle diameter within the above-described range satisfactorily reduce the specular reflection light component of the external light reflected by the upper surface 4a of the light shielding member 4. You can When the light emitting device 100 is used as a pixel of an image display device, even if external light is applied to the image display device, the specularly reflected light component of the external light is reduced, so that the pixel does not depend on the viewing direction. It is possible to satisfactorily recognize the brightness and colors of

The translucent member 5 is a sealing member that is provided in the recess 2 a of the package 2 and seals the light emitting element 1.
The translucent member 5 is for adjusting the viscosity of the uncured resin when it is formed by using a translucent resin as the base material 51, and for imparting the light transmissive property to the translucent member 5. The first filler 52 is contained as a filler. Further, the upper surface 5 a of the translucent member 5 has a part of the particles of the first filler 52 exposed from the base material 51, and has an uneven shape, that is, a plurality of protrusions caused by the particles of the first filler 52. is doing.

  The first filler 52 to be contained in the translucent member 5 may be one kind, but may be two kinds of the first fillers 52a and 52b as in the present embodiment, and three or more kinds. May be. Specifically, the first filler 52a and the first filler 52b may be made of different materials, or may be made of the same material but having different particle sizes and shapes. Good.

Further, the translucent member 5 may contain particles of a light absorbing substance such as carbon black as another filler to the extent that the translucency is not impaired. By allowing the translucent member 5 to contain an appropriate amount of particles of the light absorbing substance, it is possible to suppress the emission of specularly reflected light from the light extraction surface on the surface of the lead electrode 3 or the like. Thereby, the light distribution characteristic of the light emitted from the light emitting device 100 can be improved.
Furthermore, the translucent member 5 may contain particles such as a phosphor, a color pigment, and a light diffusing substance having a higher refractive index than the base material 51, if necessary.

As the base material 51 of the translucent member 5, a translucent thermosetting resin can be used, and examples thereof include a silicone resin, an epoxy resin, and a urea resin. Further, as the first filler 52, a translucent material having a lower refractive index than the base material 51 is used. Specific examples of the first filler 52 include SiO ₂ . For example, when an epoxy resin having a refractive index of 1.53 is used as the base material 51, SiO ₂ having a refractive index of 1.46 can be used as the first filler 52.
The particle size of the first filler 52 is preferably 0.5 μm or more and 10 μm or less. By setting the particle size of the first filler 52 in this range, the specularly reflected light component of the external light on the upper surface 5a is efficiently reduced by the plurality of protrusions formed due to the particles of the first filler 52. be able to.
The content of the first filler 52 in the translucent member 5 is preferably about 2% by mass or more and 40% by mass or less.

  It is preferable that the plurality of protrusions on the upper surface 5a of the light-transmissive member 5 are formed so that the arithmetic mean roughness Ra defined by JIS standard B0601: 2013 is about 0.095 μm or more and 0.220 μm or less. More preferably, it is less than 180 μm.

Further, by exposing the first filler 52 having a refractive index lower than that of the base material 51 on the upper surface 5a of the light transmissive member 5 which is the light extraction surface of the light emitting device 100, the light transmissive member 5 and the light are extracted. It is possible to reduce the difference in the refractive index from the air (refractive index 1.0), which is the medium to which the laser beam is applied. Further, by reducing the difference in refractive index at the interface from which light is extracted, the light reflectance at the interface can be reduced. Therefore, the efficiency of extracting light to the outside of the light emitting device 100 can be improved. Here, if the difference in refractive index between the base material 51 and the first filler 52 is 0.03 or more, the light extraction efficiency of the light emitting device 100 can be increased by exposing the first filler 52.
The details of the mechanism of improving the light extraction efficiency of the light emitting device 100 will be described later.

  Further, by providing a plurality of protrusions on the upper surface 4a of the light-shielding member 4 and the upper surface 5a of the translucent member, which are the upper surfaces of the light emitting device 100, when the upper surface comes into contact with another member, a point contact is made. It is possible to prevent tacking (adhesion) of other members described above, and it becomes easy to handle the light emitting device 100 at the time of manufacturing or mounting.

  The wire 6 is a wiring for electrically connecting the lead electrodes 31 to 34 and electronic components such as the light emitting element 1 and the protective element. Examples of the material of the wire 6 include metals such as Au (gold), Ag (silver), Cu (copper), Pt (platinum), and Al (aluminum), and alloys thereof. It is preferable to use Au, which has excellent thermal conductivity. The thickness of the wire 6 is not particularly limited and can be appropriately selected according to the purpose and application.

[Operation of light emitting device]
Next, the operation of the light emitting device 100 will be described with reference to FIGS. 1C and 2A to 2C.
FIG. 2A is a cross-sectional view showing a part of the translucent member and the filler in the light emitting device according to the first embodiment. FIG. 2B is a cross-sectional view showing a part of the translucent member and the filler in the conventional light emitting device. FIG. 2C is a cross-sectional view for explaining light reflection on the upper surfaces of the translucent member and the light shielding member in the light emitting device according to the first embodiment.
The upper surface 5a of the translucent member 5, which is the light extraction surface of the light emitting device 100, is described as being in contact with air.

  By connecting an external power source to the lead electrodes 31 to 34, the light emitting element 1 emits light. The light from the light emitting element 1 propagates through the transparent member 5 and is directly or reflected on the bottom surface or the inner side surface of the recess 2a and is extracted to the outside from the top surface 5a. On the upper surface 5a, part of the light from the light emitting element 1 is extracted to the outside through the interface between the base material 41 and air. Further, in the portion where the particles of the first filler 52 are arranged near the upper surface 5a, the light from the light emitting element 1 is extracted to the outside through the interface between the first filler 52 and the air.

Here, a case where light is extracted to the outside through the first filler 52 will be described.
As shown in FIG. 2A, when the surface of the first filler 52 is exposed from the base material 51, the light L1 propagating upward in the translucent member 5 is generated by the first filler 52 and the air. It is taken out through the interface.
Further, as shown in FIG. 2B, when the surface of the first filler 52 is covered with the base material 51, the light L2 propagating upward in the translucent member 5 is generated by the base material 51 and the air. It is taken out through the interface.

Generally, when light is incident on an interface having a difference in refractive index, part of the incident light on the interface is reflected according to the difference in refractive index. Assuming that the refractive indices of the two media that sandwich the interface are n ₁ and n ₂ , the reflectance R of light that is perpendicularly incident on the interface can be expressed by equation (1).
R = (n ₁ −n ₂ ) ² / (n ₁ + n ₂ ) ² (1)

Therefore, when the light extraction surface of the light emitting device 100 is in contact with air, the outermost surface of the upper surface 5a of the translucent member 5 that is the light extraction surface has a lower refractive index than that of the resin that is the base material 51, that is, The first filler 52 having a smaller difference in refractive index from air can reduce light reflection at the interface with air. As a result, the light extraction efficiency of the light emitting device 100 can be improved.
When light propagates from a medium having a relatively high refractive index to a medium having a low refractive index, the light is totally reflected at the interface based on Snell's law. By reducing the refractive index difference at the interface between the translucent member 5 and air, the amount of light totally reflected at the interface can be reduced. That is, the efficiency of extracting light to the outside can be increased also in terms of reducing total reflection.

  Further, when the light emitting device 100 is used as a pixel of an image display device, for example, illumination light such as a fluorescent lamp may enter the upper surface of the light emitting device 100 as external light. When the upper surface of the light emitting device 100 is a flat surface, the upper surface becomes a glossy surface, and many components of external light are specularly reflected (specular reflection). As shown in FIG. 2C, when the light L3 as external light is incident on the upper surface 5a of the translucent member 5, most of it is specularly reflected like the light L5. Therefore, when observing from the direction in which the external light is specularly reflected (the traveling direction of the light L5), the surface of the light emitting device 100 appears to shine brightly due to the effect of the specularly reflected light component of the external light, and the light emitting device 100 is originally projected. The contrast of light and darkness of the light is reduced. That is, the visibility of the image displayed by the image display device is deteriorated due to the so-called “shine” on the surface.

  Here, the light L3 can be diffusely reflected like the light L4 by providing the protrusions due to the particle diameter of the first filler 52 on the upper surface 5a. In other words, the specular reflection light component can be reduced. Therefore, even when the light is observed from the direction in which the external light is specularly reflected, it is possible to reduce a decrease in contrast of light and dark of the light emitted from the light emitting device 100.

  As with the upper surface 5a of the translucent member 5, a part of the light L6 that is external light is also specularly reflected by the upper surface 4a of the upper surface 4a of the light shielding member 4 like the light L8. Here, the light L6 can be diffusely reflected like the light L7 by providing the protrusions due to the particle diameter of the second filler 42 on the upper surface 4a. Therefore, even when the light is observed from the direction in which the external light is specularly reflected (the traveling direction of the light L8), it is possible to reduce the decrease in the contrast of the light and dark of the light emitted from the light emitting device 100.

  The surface roughness of the upper surface 5a and the upper surface 4a is preferably in the above range. If the surface is too rough, the upper surface 5a and the upper surface 4a of the light emitting device 100 may appear clouded, and the contrast of light and dark of the light emitting device 100 may be rather deteriorated. By setting the particle diameters of the first filler 52 and the second filler 42 to the ranges described above and providing the protrusions caused by the first filler 52 and the second filler 42 on the upper surface 5a and the upper surface 4a, the surface roughness can be improved. Can be in an appropriate range.

[Method of manufacturing light emitting device]
Next, a method of manufacturing the light emitting device according to the first embodiment will be described with reference to FIGS. 3 to 6B.
FIG. 3 is a flowchart showing the procedure of the method for manufacturing the light emitting device according to the first embodiment. FIG. 4A is a cross-sectional view showing the configuration of the package prepared in the package preparing step of the method for manufacturing the light emitting device according to the first embodiment. FIG. 4B is a sectional view showing a light emitting element mounting step of the method for manufacturing the light emitting device according to the first embodiment. FIG. 4C is a sectional view showing a resin supplying step of the method for manufacturing the light emitting device according to the first embodiment. FIG. 4D is a cross-sectional view showing the resin curing step of the method for manufacturing the light emitting device according to the first embodiment. FIG. 4E is a cross-sectional view showing the blast processing step of the method for manufacturing the light emitting device according to the first embodiment. FIG. 5A is a plan view showing a first example of a direction in which an abrasive is projected in the blast processing step of the method for manufacturing the light emitting device according to the first embodiment. FIG. 5B is a plan view showing a second example of the direction in which the abrasive is projected in the blast processing step of the method for manufacturing the light emitting device according to the first embodiment. FIG. 5C is a plan view showing a third example of the direction in which the abrasive is projected in the blast processing step of the method for manufacturing the light emitting device according to the first embodiment. FIG. 6A is a cross-sectional view showing a first step in the blasting process step of the method for manufacturing the light emitting device according to the first embodiment. FIG. 6B is a cross-sectional view showing a second step in the blasting process step of the method for manufacturing the light-emitting device according to the first embodiment.
4A to 4E, the package 2 shows only the bottom surface 2b of the recess 2a and the upper portion forming the side wall, and the lower portion is omitted.

The method for manufacturing the light emitting device 100 according to the first embodiment includes a step of forming the light transmissive member 5 that covers the light emitting element 1 after the light emitting element 1 is placed on the package 2, and the light transmissive member 5 and the package. And the step of subjecting the upper surface of each of the two to a blasting process. In the step of forming the light-transmissive member 5, the light-transmissive member 5 uses a light-transmissive resin as the base material 51, and includes particles of the light-transmissive first filler 52 having a lower refractive index than the base material 51. It is formed using the contained resin material. Through the step of performing the blasting process, some of the particles of the first filler 52 are exposed from the base material 51 of the transparent member 5 on the upper surface of the transparent member 5.
The method for manufacturing the light emitting device 100 according to the first embodiment includes a package preparation step S11, a light emitting element mounting step S12, a translucent member forming step S13, and a blast processing step S14. The translucent member forming step S13 includes a resin supply step S131 and a resin curing step S132.

The package preparation step S11 is a step of preparing the package 2 in which the lead electrode 3 is disposed on the bottom surface 2b, the light shielding member 4 is surrounded by the side wall, and the recess 2a is opened upward.
Specifically, in this step, first, a sheet metal is punched by press working to form a lead frame having the outer shape of the lead electrode 3. Next, the lead frame is sandwiched by upper and lower molds having a cavity corresponding to the shape of the light shielding member 4. Next, the light-shielding member 4 is obtained by injecting the resin material containing the second filler 42 into the resin to be the base material 41 into the cavity inside the mold and taking out from the mold after the resin material is solidified or cured. It is formed integrally with the lead electrode 3. Next, the package 2 is prepared by bending the lead electrodes 3 protruding from the side surface of the light shielding member 4 along the side surface and the lower surface of the light shielding member 4.
In the package 2 prepared in this step, the second filler 42 disposed near the upper surface 4a of the light shielding member 4 is covered with the base material 41.

  The light emitting element mounting step S12 is a step of mounting the light emitting element 1 in the recess 2a of the package 2. In this step, the light emitting elements 1 (11 to 13) are die-bonded onto the lead electrodes 33, and the wires 6 are used to electrically connect the respective light emitting elements 1 to the corresponding lead electrodes 31 to 34.

  The transparent member forming step S13 is a step of forming the transparent member 5 that covers the light emitting element 1 in the recess 2a after the light emitting element 1 is mounted in the recess 2a. As described above, the translucent member forming step S13 includes the resin supply step S131 and the resin curing step S132.

First, in the resin supply step S131, a resin material containing the first filler 52 (52a, 52b) in an uncured resin serving as the base material 51 is supplied to the recess 2a by a potting method using the dispenser 71, for example. .
Next, in a resin curing step S132, the resin material is cured by heating with a heating device 72 such as a heater or a reflow furnace. Thereby, the translucent member 5 is formed.
In addition, in the translucent member 5 formed in this step, the first filler 52 disposed near the upper surface 5a is covered with the base material 51.

The blasting process step S14 is a process of performing a blasting process on the upper surface 5a of the translucent member 5 and the upper surface 4a of the light shielding member 4. By this step, the first filler 52 disposed near the upper surface 5a and the second filler 42 disposed near the upper surface 4a are exposed, and a protrusion due to the first filler 52 is formed on the upper surface 5a. At the same time, a protrusion due to the second filler 42 is formed on the upper surface 4a.
By performing the blasting process so that the first filler 52 and the second filler 42 are exposed, the upper surface 5a and the upper surface 4a are finely roughened, so that the light diffusion properties of the upper surface 5a and the upper surface 4a are improved. It is possible to obtain an antireflection effect on the surface.

  The blast processing is preferably performed by a wet blast method, for example, by spraying a slurry in which pure water contains an abrasive 74 from a nozzle 73 onto a surface to be processed. The wet blast method can reduce the impact of the abrasive 74 on the object to be processed, as compared with the dry blast method. Therefore, the relatively soft resin material can be selectively shaved and removed without significantly damaging the inorganic particles used for the first filler 52 and the second filler 42. Further, according to the wet blast method, the polishing agent 74 having a smaller diameter can be used, which is suitable for fine processing. Therefore, the base material 51 and the base material that cover the surfaces of the first filler 52 and the second filler 42 without forming rough irregularities on the upper surface 5a of the translucent member 5 or the upper surface 4a of the light shielding member 4. 41 can be removed. As a result, the particles of the first filler 52 and the particles of the second filler 42 are exposed on the upper surface 5a and the upper surface 4a, respectively, and the protrusions caused by the particles of the first filler 52 and the particles of the second filler 42 are exposed. Can be formed.

Specifically, when removing the base material 51 covering the upper part of the first filler 52 near the upper surface 5a and the base material 41 covering the upper part of the second filler 42 near the upper surface 4a, the first filler is removed. It is preferable to perform a blasting treatment so that 52 and the second filler 42 are not separated from the base material 51 and the base material 41 as much as possible.
Specifically, it is preferable that the particle size of the abrasive 74 be about 3 μm or more and 14 μm or less. Further, when a slurry in which pure water contains the abrasive 74 is used by the wet blast method, the content of the abrasive 74 in the slurry is preferably about 5% by volume or more and 30% by volume or less.
Further, it is preferable that the abrasive 74 has a higher hardness than the base material 51 and the base material 41 removed by the blasting treatment, and for example, alumina (Al ₂ O ₃ ), silicon carbide (SiC), stainless steel, zirconia ( ZrO ₂ ), glass and the like can be mentioned.

Further, the projection angle 73a of the slurry containing the abrasive 74 is preferably 15 ° or more and 45 ° or less with respect to the upper surface 5a and the upper surface 4a which are the target surfaces of the processing, and it is preferably around 30 °. More preferable.
When the abrasive 74 is projected at a projection angle 73a close to the vertical (90 °) with respect to the surface to be processed, the abrasive 74 sticks into the base material 41 or the base material 51 and remains in the package 2 after the blast processing. It will be easier. Further, when the abrasive 74 is projected at a projection angle 73a that is nearly horizontal, the efficiency with which the abrasive 74 removes the base material 41 and the base material 51 may decrease. Therefore, the base material 51 and the base material 41 can be efficiently removed by setting the projection angle 73a within the above range.

  In the wet blast method, the above-mentioned slurry is jetted together with compressed air from the nozzle 73 of the jet gun toward the target surface of the processing. The optimum value of the pressure of the compressed air (gun pressure of the injection gun) at this time varies depending on the shape of the nozzle 73, the projection angle 73a, the material and shape of the abrasive 74, the particle size, etc., but is, for example, 0.1 MPa to 0 MPa. It can be set to about 0.5 MPa.

Further, when the abrasive 74 is projected from only one direction D1 in a plan view at the above-described projection angle 73a, the base material 51 on one side (left side in FIG. 6A) of the first filler 52 is removed and the base material 51 on the opposite side is removed. The material 51 is likely to remain. Therefore, it is preferable that after the abrasive 74 is projected from the direction D1, the direction of the nozzle 73 is changed and the abrasive 74 is also projected from the opposite direction (the right side in FIG. 6B), the direction D2.
Further, the abrasive 74 may be projected from the directions D3 and D4 orthogonal to the directions D1 and D2 in a plan view. Further, for example, in plan view, the abrasive 74 may be projected from three directions different from each other by 120 °.
When the abrasive 74 is projected from a plurality of directions, the entire surface of the upper surface 5a and the upper surface 4a is processed in one direction, and then the direction of the nozzle 73 is sequentially changed to perform the processing. The direction of the nozzle 73 may be changed relative to the light emitting device 100, and the direction of the light emitting device 100 may be changed while the nozzle 73 is fixed.

Although the upper surface 5a of the light-transmissive member 5 has been described above, the entire upper surface of the light emitting device 100 is uniformly blasted so that the upper surface 4a of the light-shielding member 4 is also covered with the second filler 42. The base material 41 is removed from the surface.
The light emitting device 100 is manufactured by performing each process as described above.

<Application example>
[Structure of image display device]
Next, as an application example of the light emitting device 100 according to the first embodiment, an image display device using the light emitting device 100 will be described with reference to FIGS. 7A and 7B.
FIG. 7A is a perspective view showing a configuration of an image display device using the light emitting device according to the first embodiment. FIG. 7B is an exploded perspective view showing the configuration of the image display device using the light emitting device according to the first embodiment.

  The image display device 200 includes a circuit board 210, a plurality of light emitting devices 100 mounted on an upper surface of the circuit board 210, a protective member 220 that covers electrodes and wiring portions of the light emitting device 100 and the circuit board 210, and a plurality of protection members 220. The frame member 230 provided so as to cover the space between the light emitting devices 100. The image display device 200 uses one light emitting device 100 as one pixel.

  In the image display device 200, nine light emitting devices 100 are mounted on the circuit board 210 in a 3 × 3 matrix, but more light emitting devices 100 may be mounted. Further, for example, the circuit board 210 on which the 3 × 3 light emitting device 100 is mounted is set as one unit, and a plurality of units are arranged and used to configure an image display device having a larger number of pixels. Good.

  The circuit board 210 is a board for mechanically holding and electrically connecting the plurality of light emitting devices 100. The circuit board 210 is formed in a rectangular flat plate shape. Further, the circuit board 210 can be specifically configured by a board made of glass epoxy or the like on which a drive control circuit for driving the light emitting device 100, a communication circuit, and the like are mounted.

  The protection member 220 prevents moisture such as rainwater and humidity in the outside air from entering the inside of the light emitting device 100. The protective member 220 can be made of a waterproof material such as silicone resin, and is formed on the circuit board 210 so as to cover the side surface of the light emitting device 100.

The frame member 230 is a member for protecting the circuit board 210 and the protection member 220 on the circuit board 210. The frame member 230 is formed in a rectangular flat plate shape and has substantially the same area as the circuit board 210. Further, the same number of openings 230 a as the light emitting devices 100 are formed in the frame member 230, the openings 230 a corresponding to the area of each light emitting device 100. The frame member 230 is arranged such that the upper surface of the light emitting device 100 is exposed through the opening 230a, and is joined to the circuit board 210 by a screw member or the like.
The frame member 230 can be formed using metal, resin, ceramics, or the like, but it is preferable that the upper surface is roughened so as to suppress regular reflection of external light.

  As described above, the light emitting device 100 is provided with the plurality of protrusions on the upper surface side, so that the specularly reflected light component of external light is reduced. Therefore, in the image display device 200 using the light emitting device 100 as a pixel, the influence of external light is reduced, and the brightness and color of the pixel can be satisfactorily recognized regardless of the viewing direction.

<Second Embodiment>
[Configuration of light emitting device]
Next, the light emitting device according to the second embodiment will be described with reference to FIGS. 8A to 8C.
FIG. 8A is a perspective view showing the configuration of the light emitting device according to the second embodiment. FIG. 8B is a plan view showing the configuration of the light emitting device according to the second embodiment. FIG. 8C is a cross-sectional view showing the configuration of the light emitting device according to the second embodiment, and shows a cross section taken along line VIIIC-VIIIC of FIG. 8B.
In FIG. 8C, the two types of first fillers are indicated by circles and diamonds, the second filler is indicated by circles, and the wavelength conversion substance is indicated by pentagons. These shapes do not indicate the specific shapes of the corresponding members, but are used for convenience in order to distinguish the type of the filler particles.

A light emitting device 100A according to the second embodiment has a rectangular shape in a plan view and has a package 2A having a recess 2Aa that is open to the upper surface side, a light emitting element 1 mounted in the recess 2Aa, and provided in the recess 2Aa. And a translucent member 5A for sealing the light emitting element 1. Further, the package 2A has a lead electrode 3A and a light shielding member 4A, and the light emitting element 1 is electrically connected to the lead electrode 3A provided on the bottom surface of the recess 2Aa using a wire 6. In the light emitting device 100A, the protective element 8 is mounted in the recess 2Aa.
The protective element 8 is, for example, a Zener diode, and is an element that protects the light emitting element 1 from being destroyed by electrostatic discharge.

  The light emitting device 100A according to the second embodiment includes a package 2A having an outer shape different from that of the package 2 of the light emitting device 100 according to the first embodiment. Further, in the light emitting device 100A, the number of the light emitting element 1 mounted is one, the protection element 8 is mounted, and the first filler 52 (52a, 52b) is provided on the translucent member 5A. In addition to the fact that the particles of the wavelength conversion substance 53 are contained, it is different from the light emitting device 100.

The package 2A is composed of a lead electrode 3A and a light-shielding member 4A, has a substantially rectangular outer shape in a plan view, and is provided with a recess 2Aa having an opening on the upper surface side. The recess 2Aa is a region for mounting the light emitting element 1, and the bottom surface 2Ab of the recess 2Aa is composed of the lead electrode 3A and the light shielding member 4A. Further, the side wall of the recess 2Aa is composed of the light shielding member 4A.
The lower surface of the package 2A is a flat surface and is provided so that the lead electrodes 31A and 32A are exposed, and the lower surface is a mounting surface of the light emitting device 100A.

The lead electrode 3A is composed of a flat lead electrode 31A and a lead electrode 32A, and is provided on the bottom of the package 2A so as to be separated from each other. The lead electrodes 31A and 32A are provided with a step at their outer peripheral ends so as to be recessed on the lower surface side, and are configured so as not to be easily peeled off from the light shielding member 4A.
The lead electrodes 31A and 32A have upper surfaces partially forming the bottom surface 2Ab of the recess 2Aa. The light emitting element 1 is die-bonded onto the lead electrode 31A, and the protective element 8 is die-bonded onto the lead electrode 32A. There is. Further, the light emitting element 1 is electrically connected to the lead electrodes 31A and 32A via the wire 6. The protective element 8 is electrically connected to the lead electrode 32A by die-bonding one electrode provided on the lower surface side, and the other electrode provided on the upper surface side is connected to the lead electrode 31A via the wire 6. Is electrically connected to.

  4 A of light-shielding members can be formed using the same material as the light-shielding member 4 in 1st Embodiment, and a part of particle of the 2nd filler 42 is exposed to 4 Aa of upper surfaces.

The translucent member 5A is provided in the recess 2Aa and seals the light emitting element 1 and the protective element 8. The translucent member 5A contains particles of the wavelength conversion substance 53 in addition to the first filler 52 (52a, 52b) in the base material 51. A part of the particles of the first filler 52 is exposed from the base material 51 on the upper surface 5Aa of the translucent member 5A. Further, the wavelength conversion substance 53 is arranged mainly around the light emitting element 1 and in the vicinity of the bottom surface 2Ab of the recess 2Aa, and is arranged so as not to be exposed from the upper surface 5Aa.
The base material 51 and the first filler 52 may be made of the same material as the translucent member 5 in the first embodiment.

The wavelength conversion substance 53 is a phosphor that absorbs a part or all of the light from the light emitting element 1 and emits light of a different wavelength to convert the wavelength.
For example, white light can be generated by combining the light emitting element 1 that emits blue light and the wavelength conversion substance 53 that absorbs blue light and emits yellow light. The wavelength conversion substance 53 is not limited to one type, and a plurality of types having different emission colors may be used.

As the wavelength conversion substance 53, a substance that absorbs light from the light emitting element 1 and converts the wavelength can be used. The wavelength conversion substance 53 preferably has a larger specific gravity than the base material 51 of the uncured light-transmissive member 5A at the time of manufacturing. When the wavelength conversion substance 53 has a larger specific gravity than the uncured base material 51, the particles of the wavelength conversion substance 53 are settled when forming the translucent member 5A at the time of manufacturing, and the light emitting element 1 and the lead electrode 31A. , 32A can be placed near the surface.
By disposing the wavelength conversion substance 53 near the surface of the light emitting element 1 or the lead electrodes 31A and 32A, the efficiency of wavelength conversion can be improved. Further, by disposing the wavelength conversion substance 53 so as not to be exposed from the upper surface 5Aa, deterioration or alteration of the wavelength conversion substance 53 due to contact with the outside air can be suppressed.

Specific examples of the wavelength conversion substance 53 include YAG phosphors represented by Y ₃ Al ₅ O ₁₂ : Ce, yellow phosphors such as silicates, and CASN phosphors represented by CaAlSiN ₃ : Eu. And a red phosphor such as a KSF phosphor represented by K ₂ SiF ₆ : Mn.

[Operation of light emitting device]
In the light emitting device 100A, a part or all of the light from the light emitting element 1 is wavelength-converted by the wavelength conversion substance 53 and is extracted to the outside from the upper surface 5Aa of the translucent member 5A which is a light extraction surface.
In addition, at least a part of the external light with which the upper surface of the light emitting device 100A is irradiated is diffused and reflected by the plurality of protrusions provided on the upper surface 5Aa and the upper surface 4Aa, so that the "shine" on the surface is reduced. The same as in the first embodiment. Further, the light extraction efficiency is improved by exposing a part of the first filler 52 from the upper surface 5Aa of the translucent member 5A, as in the first embodiment.

[Method of manufacturing light emitting device]
Next, a method of manufacturing the light emitting device according to the second embodiment will be described with reference to FIGS. 8A to 8C and FIG. 9.
FIG. 9 is a flowchart showing the procedure of the method for manufacturing the light emitting device according to the second embodiment.

  The method for manufacturing the light emitting device 100A according to the second embodiment includes a package preparation step S21, a light emitting element mounting step S22, a translucent member forming step S23, and a blast processing step S24. Further, the translucent member forming step S23 includes a resin supply step S231, a wavelength conversion substance settling step S232, and a resin curing step S233.

The package preparation step S21 is a step of preparing the package 2A. Although the shape of the package to be prepared is different, the package 2A can be prepared by the same method as the package preparing step S11 in the first embodiment.
In the package 2A prepared in this step, the second filler 42 disposed near the upper surface 4Aa of the light shielding member 4A is covered with the base material 41.

The light emitting element mounting step S22 is a step of mounting the light emitting element 1 in the recess 2Aa of the package 2A. The light emitting element 1 can be performed by the same method as the light emitting element mounting step S12 in the first embodiment.
In this step, the protective element 8 is also mounted in the recess 2Aa.

  The translucent member forming step S23 is a step of forming the translucent member 5A in the recess 2Aa, and as described above, includes the resin supply step S231, the wavelength conversion substance settling step S232, and the resin curing step S233. There is.

  The resin supply step S231 can be performed by the same method as the resin supply step S131 in the first embodiment. The resin material supplied into the recess 2Aa is prepared such that the uncured base material 51 contains the first filler 52 and the wavelength conversion substance 53. Further, it is preferable that the wavelength conversion substance 53 and the base material 51 are selected so that the wavelength conversion substance 53 has a larger specific gravity than the uncured base material 51.

  The wavelength conversion substance settling step S232 is a step of, in the resin supply step S231, supplying the uncured resin material into the recess 2Aa and then causing the wavelength conversion material 53 contained in the resin material to settle. Specifically, this is a step in which the wavelength conversion substance 53 having a larger specific gravity than the uncured base material 51 is settled by gravity and left until near the surface of the light emitting element 1 or the lead electrodes 311 and 32A.

  Since the resin curing step S233 can be performed in the same manner as the resin curing step S132 in the first embodiment, the description thereof will be omitted.

The blasting process step S24 can be performed in the same manner as the blasting process step S14 in the first embodiment, and thus the description thereof will be omitted.
When the wavelength conversion substance 53 is not allowed to settle, the resin curing step S233 is performed immediately after the resin supply step S231.
By performing the above steps, the light emitting device 100A can be manufactured.

Next, examples of the present invention will be described.
The light emitting device of the form shown in FIG. 1A and the light emitting device of the form shown in FIG. 8A were manufactured by the above-described manufacturing method. At this time, a plurality of samples were prepared by changing the conditions of the blast processing.

(Shape and Material of Light-Emitting Device: Sample of First Embodiment)
・ Translucent material:
Base material: Epoxy resin (refractive index 1.53)
First filler: silica (SiO ₂ ) (refractive index 1.46, particle size 1.5 μm, content 40% by mass)
・ Light blocking member (light absorbing member):
Base material: polyphthalamide resin Second filler: carbon black (particle size 3 μm, content 1% by mass)
·package:
External dimensions in plan view: One side is 3 mm
Aperture diameter of translucent member: 2.6 mm on a side
-Light emitting element: 1 blue LED, 1 green LED, 1 red LED mounted

(Shape and Material of Light-Emitting Device: Sample of Second Embodiment)
・ Translucent material:
Base material: Silicone resin (refractive index 1.52)
First filling member: silica (SiO ₂ ) (refractive index 1.46, particle size 6 μm, content 15% by mass)
Wavelength conversion material: YAG phosphor / light-shielding member (light-reflecting member):
Base material: epoxy resin Second filler: TiO ₂ (particle size 0.3 μm, content 17% by mass)
·package:
External dimensions in plan view: 3 mm long side, 1.4 mm short side
Opening diameter of translucent member: long side is 2.6 mm, short side is 1.0 mm
・ Light emitting element: 1 blue LED mounted

(Conditions for blast processing: common to the samples of each embodiment)
・ Polishing liquid (slurry):
Solvent: Pure water Abrasive: Alumina (Al ₂ O ₃ ) (particle size 3 μm (D50), content 5% by volume)
・ Projection angle: 30 ° / 90 °
・ Projection direction: 1 direction / 2 directions / 4 directions ・ Gun pressure: 0.2 / 0.3 / 0.4 (MPa)
-Processing speed: 40 mm / sec Under each of the conditions described above, a blasting process was performed on the upper surface of the sample of the light emitting device by applying air pressure and spraying the polishing liquid in a mist form from the nozzle.

(Evaluation)
For each sample prepared by changing the conditions of the blasting treatment, the light output, the light reflection preventing effect of the upper surface, the surface roughness of the upper surface, the filler (the first filler And whether or not the second filler) has fallen off.
It was confirmed that the filler was exposed on the processed surface of the samples that were blasted under any of the conditions.
The higher the gun pressure, the more the filler was exposed, and some samples were found to have the filler falling off the surface. However, under other conditions, the higher the gun pressure, the higher the light output (luminous flux). It was confirmed. The improvement of the light output is 1 to 2.9% in each sample of the first embodiment and 0.3 to 0.9% in each sample of the second embodiment.

When the projection angle was 90 °, that is, when the abrasive was projected perpendicularly to the machined surface, the amount of filler exposed was smaller than when the projection angle was 30 ° when compared at the same gun pressure.
Also, when the projection angle is set to 30 °, when the projection is performed from one direction, the surface of the filler facing the projection direction is exposed, but the surface on the opposite side is a shadow of the filler itself, so it is not so much. It wasn't exposed. By setting the projection direction to two directions, and further to four directions, the exposure amount of the filler increased, and the exposure amount increased compared to when the projection angle was 90 °. It is considered that by making the projection angle smaller than the vertical angle, the abrasive easily peeled off the resin. The light output is similar between the sample when the projection angle is 90 ° and the gun pressure is 0.4 MPa, and the sample when the projection angle is 30 °, the gun pressure is 0.2 MPa, and the projection directions are four directions. It was confirmed that it could be improved.

Further, it was visually confirmed that each sample has an effect of preventing reflection of external light as compared with the sample not subjected to the blasting treatment.
The surface roughness (arithmetic mean roughness Ra) of the upper surface of each sample was about the same as that of the sample not subjected to the blasting treatment. That is, it was confirmed that only the resin coating the surface of the filler was removed by the blasting treatment without damaging the main body of the light-transmissive member, which is a resin member, to form large irregularities.

[Form 1]
A base, a light emitting element mounted on the base, and a translucent member covering the light emitting element are provided, and the translucent member and the base have a plurality of protrusions on respective upper surfaces. The translucent member contains particles of a translucent first filler having a lower refractive index than the base material of the translucent member, and a part of the particles of the first filler is A light emitting device, which is exposed from a base material of the translucent member on an upper surface of the translucent member.
[Form 2]
The light emitting device according to aspect 1, wherein the base includes a lead electrode and a light blocking member that fixes the lead electrode.
[Form 3]
3. The form 1 or form 2, wherein the base has a concave portion having an opening on an upper surface, the light emitting element is placed in the concave portion, and the protrusion is formed on an upper surface of a side wall surrounding the concave portion. Light emitting device.
[Form 4]
4. The light emitting device according to any one of modes 1 to 3, wherein a difference in refractive index between the first filler and the base material of the translucent member is 0.03 or more.
[Form 5]
The light emitting device according to any one of modes 1 to 4, wherein a resin having a light-transmitting property is used as a base material for the light-transmitting member and the light-shielding member.
[Form 6]
The light emitting device according to any one of modes 1 to 5, wherein the protrusion provided on the upper surface of the translucent member is caused by particles of the first filler.
[Form 7]
The first filler may be an air permeation method or Fisher-SubSieve-Sizers-No. 7. The light-emitting device according to aspect 6, wherein the particle size defined by is 0.5 μm or more and 10 μm or less.
[Form 8]
The light emitting device according to any one of modes 1 to 7, wherein the upper surface of the translucent member has an arithmetic average roughness Ra defined by JIS B0601: 2013 of 0.095 μm or more and 0.220 μm or less. .
[Form 9]
9. The light emitting device according to any one of modes 1 to 8, wherein the first filler is SiO ₂ .
[Form 10]
10. The light emitting device according to any one of modes 1 to 9, wherein a base material of the translucent member is made of a material selected from an epoxy resin and a silicone resin.
[Form 11]
The light shielding member contains particles of a second filler in a base material made of resin, and a part of the particles of the second filler is exposed from the base material of the light shielding member on the upper surface of the light shielding member. 11. The light emitting device according to any one of modes 1 to 10, wherein the protrusion provided on the upper surface of the light shielding member is caused by particles of the second filler.
[Form 12]
The translucent member further contains particles of a wavelength conversion material that converts light from the light emitting element into light of different wavelengths,
12. The light emitting device according to any one of modes 1 to 11, wherein the particles of the wavelength conversion substance are provided so as not to be exposed from the base material of the translucent member.
[Mode 13]
A method of manufacturing a light emitting device comprising a base, a light emitting element mounted on the base, and a translucent member covering the light emitting element, wherein the light emitting element is mounted on the base. After that, the step of forming the translucent member covering the light emitting element, and the step of subjecting the upper surfaces of the translucent member and the base to a blasting process are performed to form the translucent member. In the step of forming, the translucent member is formed by using a translucent resin as a base material and a resin material containing particles of a translucent first filler having a lower refractive index than the base material. A method for manufacturing a light emitting device, wherein a part of the particles of the first filler is exposed from the base material of the transparent member on the upper surface of the transparent member by the step of performing the blasting process.
[Mode 14]
14. The method for manufacturing a light emitting device according to mode 13, wherein the base includes a lead electrode and a light shielding member that fixes the lead electrode.
[Form 15]
15. The method for manufacturing a light emitting device according to mode 13 or mode 14, wherein the base has a recess having an opening on an upper surface, and the light emitting element is mounted in the recess.
[Mode 16]
The particles of the first filler may be air permeation or Fisher-SubSieve-Sizers-No. 16. The method for manufacturing a light-emitting device according to any one of modes 13 to 15, wherein the particle size defined by is 0.5 μm or more and 10 μm or less.
[Form 17]
The method for manufacturing a light-emitting device according to any one of modes 13 to 16, wherein the blasting treatment is a wet blasting treatment in which a slurry containing water and an abrasive is sprayed.
[Form 18]
18. The method for manufacturing a light-emitting device according to mode 17, wherein the blasting treatment projects the slurry at an angle of 15 ° or more and 45 ° or less on the upper surface of the translucent member.
[Form 19]
19. The method for manufacturing a light-emitting device according to mode 18, wherein the blasting treatment sequentially projects the slurry from two or more different directions in a plan view.
[Form 20]
The light-shielding member is formed by using a resin as a base material and a resin material in which particles of the second filler are dispersed in the base material,
20. The light emitting device according to any one of modes 13 to 19, wherein a part of the particles of the second filler is exposed from the base material of the light blocking member on the upper surface of the light blocking member by the blasting treatment. Manufacturing method.
[Form 21]
The translucent member further contains, in addition to the particles of the first filler, particles of a wavelength conversion substance that converts light from the light emitting element into light of different wavelengths in the base material of the translucent member. Formed using resin material,
In the step of forming the translucent member, the uncured resin material containing the particles of the first filler and the particles of the wavelength conversion material is supplied into the recess, and the particles of the wavelength conversion material settle. 21. The method for manufacturing a light emitting device according to any one of modes 13 to 20, wherein the resin material is cured.

  A light emitting device according to an embodiment of the present disclosure is used in a backlight light source of a liquid crystal display, various lighting devices, a large-sized display, various display devices such as advertisements and destination guidance, and further in digital video cameras, facsimiles, copiers, scanners, and the like. It can be used for an image reading device, a projector device, and the like.

1 Light emitting element 11, 12, 13 Light emitting element 2, 2A package (base)
2a, 2Aa Recesses 2b, 2Ab Bottom surface 3,3A Lead electrodes 31, 32, 33, 34 Lead electrodes 31A, 32A Lead electrodes 4, 4A Light-shielding members 4a, 4Aa Upper surface 4b Cutout portion 41 Base material 42 Second filler 5 , 5A Translucent member 5a, 5Aa Upper surface 51 Base material 52, 52a, 52b First filler 53 Wavelength conversion material 6 Wire 71 Dispenser 72 Heating device 73 Nozzle 73a Projection angle 74 Abrasive 100 Light emitting device 200 Image display device 210 Circuit Substrate 220 Protective member 230 Frame member 230a Opening

Claims (11)

A base having a recess having a bottom surface and side walls ,
A light emitting element mounted on the bottom surface of the recess of the base ;
E Bei and a light transmissive member covering the light emitting element,
The translucent member contains particles of a translucent first filler having a refractive index lower than that of the base material of the translucent member,
On the upper surface of the translucent member, a plurality of first protrusions having an uneven shape due to the particles of the first filler are provided, and a part of the particles of the first filler is a part of the translucent member. Exposed from the base material of the transparent member on the upper surface,
The upper surface of the translucent member has an arithmetic average roughness Ra defined by JIS B0601: 2013 of 0.095 μm or more and 0.220 μm or less ,
The base includes a lead electrode and a light-shielding member that fixes the lead electrode,
The light shielding member constitutes at least a part of a side wall of the recess of the base,
The light-shielding member is a resin material containing a resin having a light-transmitting property as a base material and containing particles of a second filler,
A plurality of second protrusions caused by the particles of the second filler are provided on the upper surface of the light shielding member, which is the upper surface of the side wall of the recess of the base, and a part of the particles of the second filler is provided. A light-emitting device in which is exposed from the base material of the light-shielding member . Upper surface of the light-shielding member is a top of the side wall of the base of the recess, JIS Standard B0601: an arithmetic mean roughness Ra defined by 2013, according to claim 1 is at least 0.090 0.210Myuemu less Light emitting device. The first filler may be an air permeation method or Fisher-SubSieve-Sizers-No. 3. The light emitting device according to claim 1 , wherein the particle size defined by is 0.5 μm or more and 10 μm or less. Wherein the first filler, the light emitting device according to any one of claims 1 to 3 is SiO _2. The light emission according to any one of claims 1 to 4 , wherein the base material of the translucent member is made of a material having a higher refractive index than the first filler and selected from an epoxy resin and a silicone resin. apparatus. The light emitting device according to claim 1 , wherein the second filler is any one of TiO ₂ , Al ₂ O ₃ , ZrO ₂ , and MgO. Anteromedial surface of SL recess, the light emitting device according to any one of claims 1 to 6 reflectance is 70% or more in the wavelength range of the light the light emitting element emits. A base having a lead electrode and a light-shielding member for fixing the lead electrode and having a recess having a bottom surface and a sidewall, a light emitting element mounted on the bottom surface of the recess of the base , and a light-transmitting material covering the light emitting element. A light-transmitting member , the light-shielding member constitutes at least a part of a side wall of the concave portion of the base, a resin material having a light-transmitting property is used as a base material, and a resin material containing particles of the second filler. a method of manufacturing a der Ru emitting device,
A step of forming the translucent member covering the light emitting element after the light emitting element is mounted on the base,
A step of performing a blasting process on the respective upper surfaces of the translucent member and the base,
In the step of forming the translucent member, the translucent member uses a translucent resin as a base material and contains particles of a translucent first filler having a lower refractive index than the base material. Formed using resin material,
The particles of the first filler may be air permeation or Fisher-SubSieve-Sizers-No. Has a particle size of 0.5 μm or more and 10 μm or less,
The step of performing the blasting treatment, the upper surface of the translucent member, so as to have a plurality of first projections are uneven due to the particles of the first filler, the particles of the first filler Part of the upper surface of the transparent member is exposed from the base material of the transparent member ,
Part of the particles of the second filler so that a plurality of second protrusions caused by the particles of the second filler are provided on the upper surface of the light-shielding member, which is the upper surface of the side wall of the recess of the base. A method for manufacturing a light emitting device , wherein the light is exposed from the base material of the light shielding member . The method for manufacturing a light-emitting device according to claim 8 , wherein the blasting treatment projects the slurry onto the upper surface of the translucent member at an angle of 15 ° or more and 45 ° or less. The method for manufacturing a light emitting device according to claim 9 , wherein the blasting treatment sequentially projects the slurry from two or more different directions in a plan view. The blasting process is a wet blasting process for projecting a slurry containing water and an abrasive, the particle size of the abrasive, any one of claims 8 to 10 is 3μm or more 14μm or less Item 8. A method for manufacturing a light-emitting device according to item.

Images