JP7078863B2 - Light emitting device and its manufacturing method - Google Patents

Description

The present invention relates to a light emitting device including a light emitting element and a method for manufacturing the same.

Light emitting diodes (LEDs) are used in a variety of applications such as lighting fixtures, personal computers (PCs), television backlights, and large displays. The demand for LED light sources for such various applications is increasing, and the demand for improving the light output is also increasing.
For example, Patent Document 1 includes a wiring substrate having a recess, a light emitting element housed in the recess, and a translucent sealing member for sealing the light emitting element, and the surface of the translucent sealing member is roughened. A computerized optical semiconductor device is disclosed. Patent Document 2 includes a substrate, a light emitting element mounted on the substrate, and a sealing member for sealing the light emitting element, and by arranging particles of the filler on the surface side of the sealing member. A light emitting device provided with unevenness is disclosed.

Japanese Unexamined Patent Publication No. 2007-324220 Japanese Unexamined Patent Publication No. 2012-151466

However, since such a method requires changing the material and shape of the constituent members, the applicable shape and material of the light emitting device may be limited.

It is an object of the present embodiment to provide a light emitting device for reducing a specular reflection component and a method for manufacturing the same.

The light emitting device according to the embodiment of the present disclosure includes a base having a recess having a bottom surface and a side wall, a light emitting element mounted on the bottom surface of the recess of the base , and a translucent member covering the light emitting element. The translucent member contains particles of the first filler, and the first filler is an air permeation method or Fisher-SubSieve-Sizers-No. The particle size defined in the above is 0.5 μm or more and 10 μm or less, and a plurality of first protrusions having an uneven shape due to the particles of the first filler are provided on the upper surface of the translucent member. A part of the particles of the first filler is exposed from the base material of the translucent member on the upper surface of the translucent member, and the base is a light-shielding member for fixing the lead electrode and the lead electrode. The light-shielding member constitutes at least a part of the side wall of the recess of the base, and the light-shielding member is made of a translucent resin as a base material and contains particles of a second filler. A plurality of second protrusions caused by the particles of the second filler are provided on the upper surface of the light-shielding member, which is a resin material and is the upper surface of the side wall of the recess of the base, and the second filler is provided. A part of the particles of the light-shielding member is exposed from the base material of the light-shielding member.

The method for manufacturing a light emitting device according to the embodiment of the present disclosure is mounted on a base having a lead electrode and a light-shielding member for fixing the lead electrode and having a recess having a bottom surface and a side wall, and a bottom surface of the recess of the base . A light emitting element to be placed and a translucent member covering the light emitting element are provided , and the light shielding member constitutes at least a part of a side wall of a recess of the base and is made of a translucent resin. It is a method of manufacturing a light emitting device which is a resin material containing particles of a second filler as a material, and is a translucent member which covers the light emitting element after the light emitting element is placed on the base. In the step of forming the translucent member, the translucent member is a mother. A translucent resin is used as the material, and the resin material containing the particles of the translucent first filler is used, and the particles of the first filler are air-permeable or Fisher-SubSieve-Sizers-. No. The particle size defined in 1 is 0.5 μm or more and 10 μm or less, and the upper surface of the translucent member has an uneven shape due to the particles of the first filler by the step of performing the blasting process. A part of the particles of the first filler is exposed from the base material of the translucent member on the upper surface of the translucent member so as to have a plurality of first protrusions, and the side wall of the recess of the base is provided. A part of the particles of the second filler is provided on the upper surface of the light-shielding member, so that a plurality of second protrusions caused by the particles of the second filler are provided on the upper surface of the light-shielding member. The upper surface of the translucent member exposed from the base material has an arithmetic mean roughness Ra defined by JIS standard B0601: 2013 of 0.095 μm or more and 0.220 μm or less.

According to the light emitting device and the manufacturing method thereof according to the embodiment of the present disclosure, the specular reflection component can be reduced.

It is a perspective view which shows the structure of the light emitting device which concerns on 1st Embodiment. It is a top view which shows the structure of the light emitting device which concerns on 1st Embodiment. It is sectional drawing which shows the structure of the light emitting device which concerns on 1st Embodiment, and shows the sectional drawing in the IC-IC line of FIG. 1B. It is sectional drawing which shows a part of the translucent member and the filler in the light emitting device which concerns on 1st Embodiment. It is sectional drawing which shows a part of a translucent member and a filler in a conventional light emitting device. It is sectional drawing for demonstrating the light reflection on the upper surface of a translucent member and a light-shielding member in the light emitting apparatus which concerns on 1st Embodiment. It is a flowchart which shows the procedure of the manufacturing method of the light emitting device which concerns on 1st Embodiment. It is sectional drawing which shows the structure of the package prepared in the package preparation process of the manufacturing method of the light emitting device which concerns on 1st Embodiment. It is sectional drawing which shows the light emitting element mounting process of the manufacturing method of the light emitting device which concerns on 1st Embodiment. It is sectional drawing which shows the resin supply process of the manufacturing method of the light emitting device which concerns on 1st Embodiment. It is sectional drawing which shows the resin curing process of the manufacturing method of the light emitting device which concerns on 1st Embodiment. It is sectional drawing which shows the blast processing process of the manufacturing method of the light emitting device which concerns on 1st Embodiment. It is a top view which shows the 1st example of the direction which the abrasive is projected in the blast processing process of the manufacturing method of the light emitting device which concerns on 1st Embodiment. It is a top view which shows the 2nd example of the direction which the abrasive is projected in the blast processing process of the manufacturing method of the light emitting device which concerns on 1st Embodiment. It is a top view which shows the 3rd example of the direction which the abrasive is projected in the blast processing process of the manufacturing method of the light emitting device which concerns on 1st Embodiment. It is sectional drawing which shows the 1st step in the blast processing process of the manufacturing method of the light emitting device which concerns on 1st Embodiment. It is sectional drawing which shows the 2nd step in the blast processing process of the manufacturing method of the light emitting device which concerns on 1st Embodiment. It is a perspective view which shows the structure of the image display device which used the light emitting device which concerns on 1st Embodiment. It is an exploded perspective view which shows the structure of the image display device which used the light emitting device which concerns on 1st Embodiment. It is a perspective view which shows the structure of the light emitting device which concerns on 2nd Embodiment. It is a top view which shows the structure of the light emitting device which concerns on 2nd Embodiment. It is sectional drawing which shows the structure of the light emitting device which concerns on 2nd Embodiment, and shows the sectional drawing in the line VIIIC-VIIIC of FIG. 8B. It is a flowchart which shows the procedure of the manufacturing method of the light emitting device which concerns on 2nd Embodiment.

Hereinafter, the light emitting device and the manufacturing method thereof according to the embodiment will be described. Since the drawings referred to in the following description schematically show the present embodiment, the scale, spacing, positional relationship, etc. of each member are exaggerated, or a part of the members is not shown. There may be. Further, in the following description, those having the same name and reference numeral indicate, in principle, the same or the same quality members, and detailed description thereof will be omitted as appropriate.
It is an object of the present embodiment to provide a light emitting device having improved light extraction efficiency and a method for manufacturing the same.
The light emitting device according to the embodiment of the present disclosure includes a base, a light emitting element mounted on the base, and a translucent member covering the light emitting element, and the translucent member and the base. Has a plurality of protrusions on each upper surface thereof, and the translucent member contains particles of a translucent first filler having a refractive index lower than that of the base material of the translucent member. 1 A part of the particles of the filler is exposed from the base material of the translucent member on the upper surface of the translucent member.
The method for manufacturing a light emitting device according to an embodiment of the present disclosure is a method for manufacturing a light emitting device including a base, a light emitting element mounted on the base, and a translucent member covering the light emitting element. After the light emitting element is placed on the base, a step of forming the translucent member covering the light emitting element and a blasting process on the upper surfaces of the translucent member and the base are performed. In the step of forming the translucent member, which includes the step of applying, the translucent member uses a translucent resin as a base material, and has a first translucency having a lower refractive index than the base material. By the step of performing the blasting process, which is formed by using a resin material containing the particles of the filler, a part of the particles of the first filler is formed on the upper surface of the translucent member of the translucent member. Expose from the base material.
According to the light emitting device and the manufacturing method thereof according to the embodiment of the present disclosure, it is possible to provide a light emitting device having improved light extraction efficiency.

<First Embodiment>
[Configuration of light emitting device]
The configuration of the light emitting device according to the first embodiment will be described with reference to FIGS. 1A to 1C.
FIG. 1A is a perspective view showing the configuration of the light emitting device according to the first embodiment. FIG. 1B is a plan view showing the configuration of the light emitting device according to the first embodiment. FIG. 1C is a cross-sectional view showing the configuration of the light emitting device according to the first embodiment, and shows a cross-sectional view taken along the line IC-IC of FIG. 1B.

In addition, in FIG. 1C, the portion surrounded by the broken line near the upper surface of the light-shielding member and the translucent member is shown in an enlarged manner. Further, in FIG. 1C, the two types of the first filler are shown in a circle and a diamond shape, and the second filler is shown in a circle. These shapes do not indicate the specific shape of the corresponding member, but are used for convenience in order to distinguish the types of particles of the filler.

The light emitting device 100 according to the first embodiment includes a base, a light emitting element 1 mounted on the base, and a translucent member 5 that covers the light emitting element 1. The translucent member 5 and the base each have an uneven shape, that is, a plurality of protrusions on the upper surface thereof. The translucent member 5 contains particles of the translucent first filler 52 having a refractive index lower than that of the base material 51 of the translucent member 5, and a part of the particles of the first filler 52 is transparent. The upper surface of the light-transmitting member 5 is exposed from the base material 51 of the light-transmitting member 5. The base corresponds to Package 2.
More specifically, the light emitting device 100 has a substantially square shape in a plan view, and is arranged in a package 2 having a recess 2a opening on the upper surface side, a light emitting element 1 mounted in the recess 2a, and a recess 2a. A translucent member 5 that covers the light emitting element 1 is provided. Further, the package 2 has a lead electrode 3 and a light-shielding member 4, and the light emitting element 1 is electrically connected to the lead electrode 3 arranged on the bottom surface of the recess 2a by using a wire 6.

The light emitting element 1 is mounted in the recess 2a of the package 2. In this embodiment, three light emitting elements 11, 12, and 13 having different light emitting colors are mounted in the recess 2a. For example, the light emitting color of the light emitting element 11 can be blue, the light emitting color of the light emitting element 12 can be green, and the light emitting color of the light emitting element 13 can be red.
Hereinafter, when each of the three light emitting elements 11, 12, and 13 is not particularly distinguished, it may be referred to as "light emitting element 1".

The light emitting elements 11, 12, and 13 are die-bonded on the lead electrode 33 arranged at the center of the bottom surface 2b of the recess 2a. Further, the anode electrode, which is one of the light emitting elements 11, 12, and 13, is electrically connected to the lead electrode 34 by using the wire 6. Further, the cathode electrode, which is the other electrode of the light emitting elements 11, 12, 13 is electrically connected to any of the corresponding lead electrodes 31, 32, 33 by using the wire 6. That is, the three light emitting elements 11, 12, and 13 are configured so that voltages can be applied independently of each other. This makes it possible to light the light emitting elements 11, 12 and 13 individually, and to arbitrarily adjust the brightness level of the light emitting elements 11, 12 and 13, so that the light emitting color and brightness of the light emitting device 100 can be adjusted. It can be changed arbitrarily. Therefore, the light emitting device 100 can be used as one pixel of the color image display device.

The light emitting element 1 used here is not particularly limited in shape, size, semiconductor material, and the like. As the emission color of the light emitting element 1, one having an arbitrary wavelength can be selected depending on the intended use. The light emitting elements 11 and 12 that emit blue or green light have an emission wavelength in the visible light region from near-ultraviolet rays, and are In _X Al _Y Ga _1-XY N (0 ≦ X ≦ 1, 0 ≦ Y ≦ 1, X + Y ≦ 1). ) Can be preferably used as a light emitting device made of a nitride semiconductor. Further, as the light emitting element 13 that emits red light, a GaAs, AlInGaP, or AlGaAs semiconductor can also be used.
In the present embodiment, the light emitting element 1 may have positive and negative electrodes arranged on the same surface side, or positive and negative electrodes may be arranged on different surface sides. When the light emitting element 1 in which the positive and negative electrodes are arranged on the same surface side is used, it may be either a face-up mounting type or a face-down mounting type. Further, when a plurality of light emitting elements 1 are mounted, different mounting types may be mixed.

The number of light emitting elements 1 mounted in the recess 2a may be one or more, and the combination of light emitting colors and the outer shape of the light emitting element 1 when a plurality of light emitting elements 1 are mounted may be appropriately changed. be able to.

The package 2 has a lead electrode 3 and a light-shielding member 4, has a substantially square outer shape in a plan view, and is provided with a recess 2a having an opening on the upper surface side. The recess 2a is a region for mounting the light emitting element 1, and the bottom surface 2b of the recess 2a is composed of a lead electrode 3 and a light-shielding member 4. Further, the side wall of the recess 2a is composed of a light-shielding member 4.

The lead electrode 3 is composed of four lead electrodes 31 to 34, and is wiring for connecting the three light emitting elements 11 to 13 electrically connected via the wire 6 to an external power supply.
A part of each of the lead electrodes 31 to 34 constitutes the bottom surface 2b of the recess 2a, and each of the lead electrodes 31 to 34 extends to the end of the light-shielding member 4 in a plan view and bends downward at the end of the light-shielding member 4. It is arranged so as to extend along the side surface of the light-shielding member 4 and further bend inward along the lower surface of the light-shielding member 4. In the light emitting device 100, the lower surface side is the mounting surface, and the portions of the lead electrodes 31 to 34 provided by being bent inward on the lower surface side of the light shielding member 4 are joined by using a conductive joining member such as solder. It is a joint.

Further, the portion of the lead electrodes 31 to 34 exposed on the bottom surface 2b of the recess 2a is a portion electrically connected to the light emitting elements 11 to 13 via the wire 6. The lead electrode 31 is electrically connected to the cathode electrode of the light emitting element 11, the lead electrode 32 is electrically connected to the cathode electrode of the light emitting element 12, and the lead electrode 33 is electrically connected to the cathode electrode of the light emitting element 13. The lead electrode 34 is electrically connected to each anode electrode of the light emitting elements 11 to 13.
Further, the lead electrode 33 is arranged in the central portion of the bottom surface 2b of the recess 2a, and also serves as a light emitting element arrangement region to which the light emitting elements 11 to 13 are joined by using a die bond member.

The lead electrode 3 can be formed by punching or bending a flat plate-shaped sheet metal by pressing. The sheet metal as a raw material is not particularly limited as long as it is used for the lead frame of the package of the light emitting element. The thickness of the sheet metal is appropriately selected according to the shape and size of the package, but for example, a sheet metal having a thickness of about 100 to 500 μm is used, and a thickness of 120 to 300 μm is more preferable. Further, as the material of the sheet metal, for example, a Cu-based alloy is used.
Further, the upper surface of the lead electrode 3 which is the bottom surface 2b of the recess 2a is plated with Ag, Au, Ni, etc. in order to improve the light reflectivity and / or the bondability with the wire 6 and the die bond member. You may.

The light-shielding member 4 is a member that fixes the four lead electrodes 31 to 34 apart from each other and constitutes the side wall of the recess 2a. The light-shielding member 4 is made of a material that blocks light without transmitting light, and is used as a light-reflecting material that blocks light by reflecting light or a light-absorbing material that blocks light by absorbing light. Be done.
Specifically, the light-shielding member 4 can be formed by using a resin having a translucent property as a base material 41 and using a resin material containing a second filler 42 for imparting light-shielding property as a filler. .. Further, on the upper surface 4a of the light-shielding member 4, which is the upper surface of the side wall of the recess 2a, a part of the particles of the second filler 42 is exposed from the base material 41, and the unevenness caused by the particles of the second filler 42. It has a shape or protrusion.

When a light-reflecting material is used for the light-shielding member 4, the light-shielding member 4 emits light from the light-emitting element 1, propagates through the light-transmitting member 5, and reaches the light-shielding member 4. It functions to return to within 5. This makes it possible to improve the efficiency of extracting light from the upper surface of the light emitting device 100.
When a light-absorbing material is used for the light-shielding member 4, the light-shielding member 4 emits light from the light-emitting element 1, passes through the light-transmitting member 5, and absorbs light incident on the light-shielding member 4. .. Therefore, the light can be emitted only from the upper surface of the light emitting device 100.

Further, regardless of whether the light-reflecting material or the light-absorbing material is used for the light-shielding member 4, by providing such a light-shielding member 4, the light emitted from the light-emitting device 100 is translucent. Since it is limited to the upper surface of the member 5, the light emitting device 100 having a high contrast between the light emitting region and the non-light emitting region and having good so-called “parting ability” can be obtained.

Examples of the resin used for the base material 41 of the light-shielding member 4 include a thermoplastic resin and a thermosetting resin.
In the case of the thermoplastic resin, for example, polyphthalamide resin, liquid crystal polymer, polybutylene terephthalate (PBT), unsaturated polyester and the like can be used.
In the case of a thermosetting resin, for example, an epoxy resin, a modified epoxy resin, a silicone resin, a modified silicone resin, or the like can be used.

When the light-shielding member 4 has light reflectivity, the light-shielding member 4 is formed by using a resin material in which particles of a light-reflecting substance are contained as a second filler 42 in the base material 41 to impart light reflectivity. can do. Examples of the light-reflecting substance include TiO ₂ , Al ₂ O ₃ , ZrO ₂ , and MgO.
Further, the inner surface of the recess 2a preferably has a reflectance of 70% or more, more preferably 80% or more in the wavelength range of the light emitted by the light emitting element 1. The content of the second filler 42, which is a light-reflecting substance, in the light-shielding member 4 may be 5% by mass or more and 50% by mass or less, and preferably 10% by mass or more and 30% by mass or less.
The particle size of the second filler 42 is preferably about 0.1 μm or more and 0.5 μm or less. By setting the particle size of the second filler 42 in this range, the light-shielding member 4 can obtain good light reflectivity.
Unless otherwise specified, in the present specification, the particle size values of various fillers and abrasives are referred to by the air permeation method or Fisher-SubSieve-Sizers-No. It shall be based on (FSS method).

Further, it is preferable that the plurality of protrusions on the upper surface 4a of the light-shielding member 4 are formed so that the arithmetic average roughness Ra defined by JIS standard B0601: 2013 is about 0.090 μm or more and 0.210 μm or less. In particular, by setting the upper surface 4a of the light-shielding member 4 to have an arithmetic average roughness Ra of 0.130 μm or more, external light can be scattered more efficiently.

When the light-shielding member 4 has a light-absorbing property, it is formed by using a resin material imparted with light-absorbing property by containing particles of a light-absorbing substance as a second filler 42 in the base material 41 described above. be able to. Examples of the light-absorbing substance used in the second filler 42 include black pigments, and more specifically, carbon-based pigments such as carbon black and graphite.
The particle size and content when the light-absorbing substance is used as the second filler 42 can be about the same as when the reflective substance is used. For example, when carbon black is added as the second filler 42, it can be about 1% by mass. Further, for example, a strengthening agent such as wallastnite may be added as another filler in an amount of about 25% by mass.

The light-shielding member 4 is a transfer molding method using a mold, an injection molding method, using a resin material to which light reflection or light absorption is imparted by containing a second filler 42 in the base material 41. It can be formed by a molding method such as a compression molding method, a coating method such as a screen printing method, or the like.

Further, the plurality of protrusions on the upper surface 4a of the light-shielding member 4 can be formed by subjecting the upper surface 4a to a blasting process to expose some of the particles of the second filler 42 from the base material 41. That is, it is preferable that the plurality of protrusions on the upper surface 4a of the light-shielding member 4 are formed due to the particles of the second filler 42.
The specularly reflected light component of the external light reflected by the upper surface 4a of the light-shielding member 4 is satisfactorily reduced by the plurality of protrusions formed due to the particles of the second filler 42 having the particle size in the above range. Can be done. When the light emitting device 100 is used as a pixel of the image display device, even when the image display device is irradiated with external light, the positively reflected light component of the external light is reduced, so that the pixel does not depend on the observation direction. It is possible to recognize the light and darkness and color of the image well.

The translucent member 5 is a sealing member provided in the recess 2a of the package 2 and seals the light emitting element 1.
The translucent member 5 is for adjusting the viscosity of the uncured resin when forming the translucent resin as the base material 51 and for imparting light diffusivity to the translucent member 5. The first filler 52 is contained as a filler of the above. Further, the upper surface 5a of the translucent member 5 has a part of the particles of the first filler 52 exposed from the base material 51, and has an uneven shape, that is, a plurality of protrusions due to the particles of the first filler 52. is doing.

The first filler 52 contained in the translucent member 5 may contain one type, but may contain two types of the first fillers 52a and 52b as in the present embodiment, and may further contain three or more types. You may. Specifically, the first filler 52a and the first filler 52b may be made of different materials, or even if they are the same material but have different particle sizes and shapes. good.

Further, the translucent member 5 may contain particles of a light-absorbing substance such as carbon black as another filler to the extent that the translucency is not impaired. By including an appropriate amount of particles of the light-absorbing substance in the translucent member 5, it is possible to suppress the emission of specularly reflected light from the light extraction surface on the surface of the lead electrode 3 or the like. This makes it possible to improve the light distribution characteristics of the light emitted from the light emitting device 100.
Furthermore, the translucent member 5 may contain particles such as a phosphor, a coloring pigment, and a light diffusing substance having a higher refractive index than the base material 51, if necessary.

As the base material 51 of the translucent member 5, a thermosetting resin having translucency can be used, and examples thereof include silicone resin, epoxy resin, and urea resin. Further, as the first filler 52, a translucent material having a refractive index lower than that of the base material 51 is used. Specific examples of the first filler 52 include SiO ₂ . For example, when an epoxy resin having a refractive index of 1.53 is used as the base material 51, SiO ₂ having a refractive index of 1.46 can be used as the first filler 52.
Further, the particle size of the first filler 52 is preferably about 0.5 μm or more and 10 μm or less. By setting the particle size of the first filler 52 in this range, the specular reflected light component of the external light on the upper surface 5a is efficiently reduced by the plurality of protrusions formed due to the particles of the first filler 52. be able to.
Further, the content of the first filler 52 in the translucent member 5 is preferably about 2% by mass or more and 40% by mass or less.

The plurality of protrusions on the upper surface 5a of the translucent member 5 are preferably formed so as to have an arithmetic mean roughness Ra defined by JIS standard B0601: 2013, which is about 0.095 μm or more and 0.220 μm or less, and is 0. .180 μm or less is more preferable.

Further, by exposing the first filler 52 having a lower refractive index than the base material 51 on the upper surface 5a of the translucent member 5 which is the light extraction surface of the light emitting device 100, the translucent member 5 and the light are extracted. The difference in refractive index from the air (refractive index 1.0), which is the medium to be lighted, can be reduced. Further, by reducing the difference in refractive index at the interface from which light is taken out, the light reflectance at the interface can be reduced. Therefore, the efficiency of extracting light to the outside of the light emitting device 100 can be improved. Here, if the difference in refractive index between the base material 51 and the first filler 52 is 0.03 or more, the light extraction efficiency of the light emitting device 100 can be improved by exposing the first filler 52.
The details of the mechanism for improving the light extraction efficiency of the light emitting device 100 will be described later.

Further, by providing a plurality of protrusions on the upper surface 4a of the light-shielding member 4 and the upper surface 5a of the translucent member, which is the upper surface of the light emitting device 100, when the upper surface comes into contact with other members, point contact occurs. It is possible to prevent tacking (adhesion) of other members, which makes it easy to handle the light emitting device 100 at the time of manufacturing or mounting.

The wire 6 is a wiring for electrically connecting electronic components such as a light emitting element 1 and a protective element with lead electrodes 31 to 34. Examples of the material of the wire 6 include metals such as Au (gold), Ag (silver), Cu (copper), Pt (platinum), and Al (aluminum), and alloys thereof. , Au having excellent thermal conductivity and the like is preferably used. The thickness of the wire 6 is not particularly limited and can be appropriately selected depending on the purpose and application.

[Operation of light emitting device]
Next, the operation of the light emitting device 100 will be described with reference to FIGS. 1C and 2A to 2C.
FIG. 2A is a cross-sectional view showing a part of a translucent member and a filler in the light emitting device according to the first embodiment. FIG. 2B is a cross-sectional view showing a part of a translucent member and a filler in a conventional light emitting device. FIG. 2C is a cross-sectional view for explaining light reflection on the upper surface of the translucent member and the light-shielding member in the light emitting device according to the first embodiment.
The upper surface 5a of the translucent member 5, which is the light extraction surface of the light emitting device 100, will be described as being in contact with air.

By connecting an external power source to the lead electrodes 31 to 34, the light emitting element 1 emits light. The light from the light emitting element 1 propagates in the translucent member 5, is reflected directly or on the bottom surface or the inner side surface of the recess 2a, and is taken out from the upper surface 5a. On the upper surface 5a, a part of the light from the light emitting element 1 is taken out to the outside through the interface between the base material 41 and the air. Further, in the portion where the particles of the first filler 52 are arranged in the vicinity of the upper surface 5a, the light from the light emitting element 1 is taken out to the outside through the interface between the first filler 52 and the air.

Here, a case where light is taken out to the outside through the first filler 52 will be described.
As shown in FIG. 2A, when the surface of the first filler 52 is exposed from the base material 51, the light L1 propagating upward in the translucent member 5 is a combination of the first filler 52 and air. It is taken out through the interface.
Further, as shown in FIG. 2B, when the surface of the first filler 52 is covered with the base material 51, the light L2 propagating upward in the translucent member 5 is the base material 51 and air. It is taken out through the interface.

Generally, when light is incident on an interface having a difference in refractive index, a part of the incident light on the interface is reflected according to the difference in refractive index. Assuming that the refractive indexes of the two media sandwiching the interface are n ₁ and n ₂ , the reflectance R of the light incident perpendicularly to the interface can be expressed by the equation (1).
R = (n ₁ -n ₂ ) ² / (n ₁ + n ₂ ) ² ... (1)

Therefore, when the light extraction surface of the light emitting device 100 is in contact with air, the outermost surface of the upper surface 5a of the translucent member 5 which is the light extraction surface has a lower refractive index, that is, than the resin which is the base material 51. It is possible to reduce light reflection at the interface with air by using the first filler 52 having a small difference in refractive index from air. As a result, the light extraction efficiency of the light emitting device 100 can be improved.
When light propagates from a medium having a relatively high refractive index to a medium having a low refractive index, the light is totally reflected at the interface based on Snell's law. By reducing the difference in refractive index at the interface between the translucent member 5 and air, the amount of light totally reflected at the interface can be reduced. That is, the efficiency of light extraction to the outside can be improved from the viewpoint of reducing total reflection.

Further, when the light emitting device 100 is used as a pixel of an image display device, for example, illumination light such as a fluorescent lamp may be incident on the upper surface of the light emitting device 100 as external light. When the upper surface of the light emitting device 100 is a flat surface, the upper surface becomes a glossy surface, and many components of external light are positively reflected (specularly reflected). As shown in FIG. 2C, when the light L3 is incident on the upper surface 5a of the translucent member 5 as external light, most of the light is specularly reflected like the light L5. Therefore, when observing from the direction in which the external light is specularly reflected (the traveling direction of the light L5), the surface of the light emitting device 100 appears to shine brightly due to the influence of the specularly reflected light component of the external light, and the original output of the light emitting device 100 appears. The contrast between the light and dark of the light is reduced. That is, the so-called "shininess" of the surface reduces the visibility of the image displayed by the image display device.

Here, by providing the upper surface 5a with protrusions due to the particle size of the first filler 52, the light L3 can be diffusely reflected like the light L4. In other words, the specularly reflected light component can be reduced. Therefore, even when observing from the direction in which the external light is specularly reflected, it is possible to reduce the decrease in the contrast between the light and dark light emitted from the light emitting device 100.

Similarly to the upper surface 5a of the translucent member 5, part of the light L6, which is external light, is specularly reflected by the upper surface 4a on the upper surface 4a of the light-shielding member 4, like the light L8. Here, by providing the upper surface 4a with protrusions due to the particle size of the second filler 42, the light L6 can be diffusely reflected like the light L7. Therefore, even when observing from the direction in which the external light is specularly reflected (the traveling direction of the light L8), it is possible to reduce the decrease in the contrast between the light and dark light emitted from the light emitting device 100.

The surface roughness of the upper surface 5a and the upper surface 4a is preferably in the above range. If the surface is too rough, the upper surface 5a and the upper surface 4a of the light emitting device 100 appear cloudy, and the contrast between light and dark of the light emitting device 100 may be rather lowered. The particle size of the first filler 52 and the second filler 42 is within the above-mentioned range, and the surface roughness is provided by providing protrusions caused by the first filler 52 and the second filler 42 on the upper surface 5a and the upper surface 4a. Can be an appropriate range.

[Manufacturing method of light emitting device]
Next, a method of manufacturing the light emitting device according to the first embodiment will be described with reference to FIGS. 3 to 6B.
FIG. 3 is a flowchart showing a procedure of a method for manufacturing a light emitting device according to the first embodiment. FIG. 4A is a cross-sectional view showing the configuration of a package prepared in the package preparation step of the method for manufacturing a light emitting device according to the first embodiment. FIG. 4B is a cross-sectional view showing a light emitting element mounting process of the method for manufacturing a light emitting device according to the first embodiment. FIG. 4C is a cross-sectional view showing a resin supply process of the method for manufacturing a light emitting device according to the first embodiment. FIG. 4D is a cross-sectional view showing a resin curing step of the method for manufacturing a light emitting device according to the first embodiment. FIG. 4E is a cross-sectional view showing a blasting process of the method for manufacturing a light emitting device according to the first embodiment. FIG. 5A is a plan view showing a first example of a direction in which an abrasive is projected in the blasting process of the method for manufacturing a light emitting device according to the first embodiment. FIG. 5B is a plan view showing a second example of the direction in which the abrasive is projected in the blasting process of the method for manufacturing the light emitting device according to the first embodiment. FIG. 5C is a plan view showing a third example of the direction in which the abrasive is projected in the blasting process of the method for manufacturing the light emitting device according to the first embodiment. FIG. 6A is a cross-sectional view showing a first step in the blasting process of the method for manufacturing a light emitting device according to the first embodiment. FIG. 6B is a cross-sectional view showing a second step in the blasting process of the method for manufacturing a light emitting device according to the first embodiment.
In FIGS. 4A to 4E, the package 2 shows only the upper portion constituting the bottom surface 2b and the side wall of the recess 2a, and the lower portion is omitted.

The method for manufacturing the light emitting device 100 according to the first embodiment includes a step of forming a translucent member 5 that covers the light emitting element 1 after the light emitting element 1 is mounted on the package 2, and the translucent member 5 and the package. 2. The step of applying a blasting process to the upper surface of each of the above 2 is included. In the step of forming the translucent member 5, the translucent member 5 uses a translucent resin as the base material 51, and particles of the translucent first filler 52 having a refractive index lower than that of the base material 51 are used. It is formed using the contained resin material. By the step of performing the blasting process, a part of the particles of the first filler 52 is exposed from the base material 51 of the translucent member 5 on the upper surface of the translucent member 5.
The method for manufacturing the light emitting device 100 according to the first embodiment includes a package preparation step S11, a light emitting element mounting step S12, a translucent member forming step S13, and a blasting process step S14. Further, the translucent member forming step S13 includes a resin supply step S131 and a resin curing step S132.

The package preparation step S11 is a step of preparing the package 2 in which the lead electrode 3 is arranged on the bottom surface 2b and the light-shielding member 4 is surrounded by the side wall and has a recess 2a that opens upward.
Specifically, in this step, first, a lead frame having an outer shape of the lead electrode 3 is formed by punching a hole in the sheet metal by press working. Next, the lead frame is sandwiched between upper and lower molds having a cavity corresponding to the shape of the light-shielding member 4. Next, a resin material containing the second filler 42 in the resin serving as the base material 41 is injected into the cavity in the mold, and the resin material is solidified or cured and then taken out from the mold, whereby the light-shielding member 4 is formed. It is integrally formed with the lead electrode 3. Next, the package 2 is prepared by bending the lead electrode 3 protruding from the side surface of the light-shielding member 4 along the side surface and the lower surface of the light-shielding member 4.
In the package 2 prepared in this step, the second filler 42 arranged in the vicinity of the upper surface 4a of the light-shielding member 4 is covered with the base material 41.

The light emitting element mounting step S12 is a step of mounting the light emitting element 1 in the recess 2a of the package 2. In this step, the light emitting elements 1 (11 to 13) are die-bonded onto the lead electrodes 33, and each light emitting element 1 is electrically connected to the corresponding lead electrodes 31 to 34 by using a wire 6.

The translucent member forming step S13 is a step of forming the translucent member 5 that covers the light emitting element 1 in the recess 2a after mounting the light emitting element 1 in the recess 2a. As described above, the translucent member forming step S13 includes a resin supply step S131 and a resin curing step S132.

First, in the resin supply step S131, a resin material containing the first filler 52 (52a, 52b) in the uncured resin serving as the base material 51 is supplied to the recess 2a by, for example, a potting method using a dispenser 71. ..
Next, in the resin curing step S132, the resin material is cured by heating using a heating device 72 such as a heater or a reflow furnace. As a result, the translucent member 5 is formed.
In the translucent member 5 formed in this step, the first filler 52 arranged in the vicinity of the upper surface 5a is covered with the base material 51.

The blasting process step S14 is a step of applying a blasting process to the upper surface 5a of the translucent member 5 and the upper surface 4a of the light-shielding member 4. By this step, the first filler 52 arranged near the upper surface 5a and the second filler 42 arranged near the upper surface 4a are exposed, and protrusions caused by the first filler 52 are formed on the upper surface 5a. At the same time, protrusions due to the second filler 42 are formed on the upper surface 4a.
By performing the blasting treatment so that the first filler 52 and the second filler 42 are exposed, the upper surface 5a and the upper surface 4a are finely roughened, so that the light diffusivity of the upper surface 5a and the upper surface 4a is improved. The antireflection effect can be obtained in the surface of.

The blasting treatment is preferably performed by a wet blasting method, for example, by projecting a slurry containing an abrasive 74 in pure water from a nozzle 73 onto a surface to be machined. The wet blast method can reduce the impact of the abrasive 74 on the object to be processed as compared with the drive last method. Therefore, the relatively soft resin material can be selectively scraped off without significantly damaging the particles of the inorganic substance used in the first filler 52 and the second filler 42. Further, according to the wet blast method, an abrasive 74 having a smaller diameter can be used, which is suitable for fine processing. Therefore, the base material 51 and the base material that cover the surfaces of the first filler 52 and the second filler 42 without forming rough irregularities on the upper surface 5a of the translucent member 5 and the upper surface 4a of the light-shielding member 4. 41 can be removed. As a result, the particles of the first filler 52 and the particles of the second filler 42 are exposed on the upper surface 5a and the upper surface 4a, respectively, and the protrusions caused by the particles of the first filler 52 and the particles of the second filler 42, respectively. Can be formed.

Specifically, when removing the base material 51 that covers the upper part of the first filler 52 near the upper surface 5a and the base material 41 that covers the upper part of the second filler 42 near the upper surface 4a, the first filler. It is preferable to perform a blasting treatment so that the 52 and the second filler 42 do not peel off from the base material 51 and the base material 41 as much as possible, respectively.
Specifically, the particle size of the abrasive 74 is preferably about 3 μm or more and 14 μm or less. Further, when a slurry in which the polishing agent 74 is contained in pure water is used by the wet blast method, the content of the polishing agent 74 in the slurry is preferably about 5% by volume or more and 30% by volume or less.
Further, the polishing agent 74 preferably has a hardness higher than that of the base material 51 and the base material 41 removed by the blasting treatment, and for example, alumina (Al ₂ O ₃ ), silicon carbide (SiC), stainless steel, and zirconia ( ZrO ₂ ), glass and the like can be mentioned.

Further, the projection angle 73a of the slurry containing the abrasive 74 is preferably 15 ° or more and 45 ° or less with respect to the upper surface 5a and the upper surface 4a which are the target surfaces of the processing treatment, and is preferably in the vicinity of 30 °. More preferred.
When the abrasive 74 is projected at a projection angle 73a close to perpendicular (90 °) to the target surface to be processed, the abrasive 74 pierces the base material 41 and the base material 51 and remains in the package 2 after the blasting process. It will be easier. Further, when the polishing agent 74 is projected at a projection angle 73a close to horizontal, the efficiency of removing the base material 41 and the base material 51 by the polishing agent 74 may decrease. Therefore, by setting the projection angle 73a within the above range, the base material 51 and the base material 41 can be efficiently removed.

Further, in the wet blast method, the above-mentioned slurry is injected together with compressed air from the nozzle 73 of the injection gun toward the target surface of the processing process. The optimum value of the compressed air pressure (gun pressure of the injection gun) at this time varies depending on the shape of the nozzle 73, the projection angle 73a, the material and shape of the polishing agent 74, the particle size, etc., but is, for example, 0.1 MPa to 0. It can be about 5.5 MPa.

Further, when the abrasive 74 is projected from only one direction D1 in a plan view at the above-mentioned projection angle 73a, the base material 51 on one side (left side in FIG. 6A) of the first filler 52 is removed, and the mother on the other side is removed. The material 51 is likely to remain. Therefore, it is preferable to project the abrasive 74 from the direction D1 and then change the direction of the nozzle 73 to project the abrasive 74 from the opposite direction (right side in FIG. 6B).
Further, the abrasive 74 may be projected from the directions D3 and D4 orthogonal to the directions D1 and D2 in a plan view. Further, for example, the abrasive 74 may be projected from three directions different from each other by 120 ° in a plan view.
When the abrasive 74 is projected from a plurality of directions, the entire surfaces of the upper surface 5a and the upper surface 4a are treated in one direction, and then the direction of the nozzle 73 is sequentially changed to perform the treatment. Further, the direction of the nozzle 73 may be changed relative to the light emitting device 100, and the direction of the light emitting device 100 may be changed while the nozzle 73 is fixed.

Although the upper surface 5a of the translucent member 5 has been described above, by uniformly blasting the entire upper surface of the light emitting device 100, the upper surface 4a of the light-shielding member 4 can also be subjected to the second filler 42. The base material 41 is removed from the surface.
By performing each step as described above, the light emitting device 100 is manufactured.

<Application example>
[Configuration of image display device]
Next, as an application example of the light emitting device 100 according to the first embodiment, an image display device using the light emitting device 100 will be described with reference to FIGS. 7A and 7B.
FIG. 7A is a perspective view showing the configuration of an image display device using the light emitting device according to the first embodiment. FIG. 7B is an exploded perspective view showing the configuration of an image display device using the light emitting device according to the first embodiment.

The image display device 200 includes a circuit board 210, a plurality of light emitting devices 100 mounted on the upper surface of the circuit board 210, a plurality of protective members 220 for covering the electrodes and wiring portions of the light emitting device 100 and the circuit board 210, and a plurality of light emitting devices 100. It includes a frame member 230 provided so as to cover between the light emitting devices 100. The image display device 200 uses one light emitting device 100 as one pixel.

The image display device 200 has nine light emitting devices 100 mounted on the circuit board 210 in a 3 × 3 matrix, but may be configured so that more light emitting devices 100 are mounted. Further, for example, a circuit board 210 on which a 3 × 3 light emitting device 100 is mounted may be used as one unit, and a plurality of units may be arranged and used to form an image display device having a larger number of pixels. good.

The circuit board 210 is a board for mechanically holding and electrically connecting a plurality of light emitting devices 100. The circuit board 210 is formed in a rectangular flat plate shape. Further, the circuit board 210 can be specifically composed of a board made of glass epoxy or the like on which a drive control circuit for driving the light emitting device 100, a communication circuit, or the like is mounted.

The protective member 220 prevents moisture such as rainwater and moisture in the outside air from entering the inside of the light emitting device 100. The protective member 220 can use a waterproof material such as a silicone resin, and is formed on the circuit board 210 so as to cover the side surface of the light emitting device 100.

The frame member 230 is a member for protecting the circuit board 210 and the protective member 220 on the circuit board 210. The frame member 230 is formed in a rectangular flat plate shape and has substantially the same area as the circuit board 210. Further, the frame member 230 is formed with the same number of openings 230a corresponding to the area of each light emitting device 100 as the light emitting device 100. The frame member 230 is arranged so that the upper surface of the light emitting device 100 is exposed from the opening 230a, and is joined to the circuit board 210 by a screw member or the like.
The frame member 230 can be formed of metal, resin, ceramics, or the like, but it is preferable that the upper surface is roughened so as to suppress specular reflection of external light.

As described above, the light emitting device 100 is provided with a plurality of protrusions on the upper surface side, so that the specularly reflected light component of the external light is reduced. Therefore, the image display device 200 using the light emitting device 100 as a pixel can reduce the influence of external light and can satisfactorily recognize the brightness and color of the pixel regardless of the observation direction.

<Second Embodiment>
[Configuration of light emitting device]
Next, the light emitting device according to the second embodiment will be described with reference to FIGS. 8A to 8C.
FIG. 8A is a perspective view showing the configuration of the light emitting device according to the second embodiment. FIG. 8B is a plan view showing the configuration of the light emitting device according to the second embodiment. FIG. 8C is a cross-sectional view showing the configuration of the light emitting device according to the second embodiment, and shows a cross-sectional view taken along the line VIIIC-VIIIC of FIG. 8B.
In FIG. 8C, the two types of the first filler are shown in a circle and a diamond shape, the second filler is shown in a circle, and the wavelength conversion substance is shown in a pentagonal shape. These shapes do not indicate the specific shape of the corresponding member, but are used for convenience in order to distinguish the types of particles of the filler.

The light emitting device 100A according to the second embodiment is provided in a package 2A having a rectangular shape in a plan view and having a recess 2Aa opening on the upper surface side, a light emitting element 1 mounted in the recess 2Aa, and a recess 2Aa. A translucent member 5A that seals the light emitting element 1 is provided. Further, the package 2A has a lead electrode 3A and a light-shielding member 4A, and the light emitting element 1 is electrically connected to the lead electrode 3A provided on the bottom surface of the recess 2Aa by using a wire 6. Further, in the light emitting device 100A, the protective element 8 is mounted in the recess 2Aa.
The protection element 8 is, for example, a Zener diode, which is an element that protects the light emitting element 1 from destruction due to electrostatic discharge.

The light emitting device 100A according to the second embodiment includes a package 2A having an outer shape different from that of the package 2 of the light emitting device 100 according to the first embodiment. Further, in the light emitting device 100A, one light emitting element 1 is mounted, the protective element 8 is mounted, and the first filler 52 (52a, 52b) is mounted on the translucent member 5A. In addition, the fact that particles of the wavelength conversion substance 53 are contained is different from the light emitting device 100.

The package 2A is composed of a lead electrode 3A and a light-shielding member 4A, has a substantially rectangular outer shape in a plan view, and is provided with a recess 2Aa having an opening on the upper surface side. The recess 2Aa is a region for mounting the light emitting element 1, and the bottom surface 2Ab of the recess 2Aa is composed of a lead electrode 3A and a light-shielding member 4A. Further, the side wall of the recess 2Aa is composed of a light-shielding member 4A.
Further, the lower surface of the package 2A is a flat surface and is provided so that the lead electrodes 31A and 32A are exposed, and the lower surface is a mounting surface of the light emitting device 100A.

The lead electrode 3A is composed of a flat plate-shaped lead electrode 31A and a lead electrode 32A, and is provided at the bottom of the package 2A so as to be separated from each other. The lead electrodes 31A and 32A are provided with a step at the end of the outer periphery so that the lower surface side is recessed, and are configured so as not to be easily peeled off from the light-shielding member 4A.
A part of the upper surface of the lead electrodes 31A and 32A constitutes the bottom surface 2Ab of the recess 2Aa, the light emitting element 1 is die-bonded on the lead electrode 31A, and the protection element 8 is die-bonded on the lead electrode 32A. There is. Further, the light emitting element 1 is electrically connected to the lead electrodes 31A and 32A via the wire 6. The protective element 8 is electrically connected to the lead electrode 32A by die-bonding one of the electrodes provided on the lower surface side, and the other electrode provided on the upper surface side is connected to the lead electrode 31A via the wire 6. Is electrically connected to.

The light-shielding member 4A can be formed by using the same material as the light-shielding member 4 in the first embodiment, and a part of the particles of the second filler 42 is exposed on the upper surface 4Aa.

The translucent member 5A is provided in the recess 2Aa and seals the light emitting element 1 and the protective element 8. The translucent member 5A contains particles of the wavelength conversion substance 53 in addition to the first filler 52 (52a, 52b) in the base material 51. In the translucent member 5A, a part of the particles of the first filler 52 is exposed from the base material 51 on the upper surface 5Aa. Further, the wavelength conversion substance 53 is mainly arranged around the light emitting element 1 and in the vicinity of the bottom surface 2Ab of the recess 2Aa so as not to be exposed from the top surface 5Aa.
As the base material 51 and the first filler 52, the same materials as those of the translucent member 5 in the first embodiment can be used.

The wavelength conversion substance 53 is a phosphor that absorbs a part or all of the light from the light emitting element 1 and emits light having a different wavelength to convert the wavelength.
For example, white light can be generated by combining a light emitting element 1 that emits blue light and a wavelength conversion substance 53 that absorbs blue light and emits yellow light. The wavelength conversion substance 53 is not limited to one type, and a plurality of types having different emission colors may be used.

As the wavelength conversion substance 53, a substance that absorbs light from the light emitting element 1 and converts the wavelength can be used. The wavelength conversion substance 53 preferably has a higher specific gravity than the base material 51 of the uncured translucent member 5A at the time of manufacture. When the wavelength conversion substance 53 has a higher specific gravity than the uncured base material 51, the particles of the wavelength conversion substance 53 are settled when the translucent member 5A at the time of manufacture is formed, and the light emitting element 1 and the lead electrode 31A are formed. , 32A can be placed near the surface.
By arranging the wavelength conversion substance 53 near the surface of the light emitting element 1 and the lead electrodes 31A and 32A, the efficiency of wavelength conversion can be improved. Further, by arranging the wavelength conversion substance 53 so as not to be exposed from the upper surface 5Aa, it is possible to suppress deterioration and deterioration of the wavelength conversion substance 53 due to contact with the outside air.

Specific examples of the wavelength conversion material 53 include a YAG phosphor represented by Y ₃ Al ₅ O ₁₂ : Ce, a yellow phosphor such as silicate, or a CASN phosphor represented by CaAlSiN ₃ : Eu. And K ₂ SiF ₆ : A red phosphor such as a KSF phosphor represented by Mn.

[Operation of light emitting device]
In the light emitting device 100A, a part or all of the light from the light emitting element 1 is wavelength-converted by the wavelength conversion substance 53, and is taken out from the upper surface 5Aa of the translucent member 5A which is a light taking-out surface.
It should be noted that at least a part of the external light radiated to the upper surface of the light emitting device 100A is diffusely reflected by a plurality of protrusions provided on the upper surface 5Aa and the upper surface 4Aa, so that the "shininess" of the surface is reduced. , The same as the first embodiment. Further, it is the same as the first embodiment that the light extraction efficiency is improved by exposing a part of the first filler 52 from the upper surface 5Aa of the translucent member 5A.

[Manufacturing method of light emitting device]
Next, a method of manufacturing the light emitting device according to the second embodiment will be described with reference to FIGS. 8A to 8C and FIG.
FIG. 9 is a flowchart showing a procedure of a method for manufacturing a light emitting device according to a second embodiment.

The method for manufacturing the light emitting device 100A according to the second embodiment includes a package preparation step S21, a light emitting element mounting step S22, a translucent member forming step S23, and a blasting process step S24. Further, the translucent member forming step S23 includes a resin supply step S231, a wavelength conversion substance settling step S232, and a resin curing step S233.

The package preparation step S21 is a step of preparing the package 2A. Although the shape of the package to be prepared is different, the package 2A can be prepared by the same method as the package preparation step S11 in the first embodiment.
In the package 2A prepared in this step, the second filler 42 arranged in the vicinity of the upper surface 4Aa of the light-shielding member 4A is covered with the base material 41.

The light emitting element mounting step S22 is a step of mounting the light emitting element 1 in the recess 2Aa of the package 2A. The light emitting element 1 can be carried out by the same method as the light emitting element mounting step S12 in the first embodiment.
In this step, the protective element 8 is also mounted in the recess 2Aa.

The translucent member forming step S23 is a step of forming the translucent member 5A in the recess 2Aa, and includes the resin supply step S231, the wavelength conversion material settling step S232, and the resin curing step S233 as described above. There is.

The resin supply step S231 can be performed by the same method as the resin supply step S131 in the first embodiment. The resin material supplied into the recess 2Aa is prepared so that the uncured base material 51 contains the first filler 52 and the wavelength conversion substance 53. Further, it is preferable to select the wavelength conversion material 53 and the base material 51 so that the wavelength conversion material 53 has a larger specific gravity than the uncured base material 51.

The wavelength conversion material settling step S232 is a step in the resin supply step S231 in which the uncured resin material is supplied into the recess 2Aa and then the wavelength conversion material 53 contained in the resin material is settled. Specifically, it is a step of leaving the wavelength converting substance 53, which has a larger specific gravity than the uncured base material 51, until it settles due to gravity and comes close to the surface of the light emitting element 1 and the lead electrodes 311, 32A.

Since the resin curing step S233 can be performed in the same manner as the resin curing step S132 in the first embodiment, the description thereof will be omitted.

Since the blasting process step S24 can be performed in the same manner as the blasting process step S14 in the first embodiment, the description thereof will be omitted.
If the wavelength conversion substance 53 is not settled, the resin curing step S233 is immediately performed after the resin supply step S231.
By performing the above steps, the light emitting device 100A can be manufactured.

Next, examples of the present invention will be described.
The light emitting device of the form shown in FIG. 1A and the light emitting device of the form shown in FIG. 8A were manufactured by the above-mentioned manufacturing methods, respectively. At this time, a plurality of samples were prepared by changing the conditions of the blasting process.

(Shape and material of light emitting device: sample of the first embodiment)
・ Translucent member:
Base material: Epoxy resin (refractive index 1.53)
First filler: silica (SiO ₂ ) (refractive index 1.46, particle size 1.5 μm, content 40% by mass)
-Light-shielding member (light-absorbing member):
Base material: Polyphthalamide resin Second filler: Carbon black (particle size 3 μm, content 1% by mass)
·package:
External dimensions in plan view: 1 side is 3 mm
Opening diameter of translucent member: 2.6 mm on a side
-Light emitting element: One blue LED, one green LED, and one red LED are mounted.

(Shape and material of light emitting device: sample of the second embodiment)
・ Translucent member:
Base material: Silicone resin (refractive index 1.52)
First filling member: silica (SiO ₂ ) (refractive index 1.46, particle size 6 μm, content 15% by mass)
Wavelength conversion substance: YAG-based phosphor / light-shielding member (light-reflecting member):
Base material: Epoxy resin Second filler: TiO ₂ (particle size 0.3 μm, content 17% by mass)
·package:
External dimensions in plan view: 3 mm long side, 1.4 mm short side
Opening diameter of translucent member: 2.6 mm on the long side and 1.0 mm on the short side
・ Light emitting element: One blue LED is mounted

(Conditions for blasting: common to the samples of each embodiment)
・ Abrasive liquid (slurry):
Solvent: Pure water Abrasive: Aluminium (Al ₂ O ₃ ) (particle size 3 μm (D50), content 5% by volume)
・ Projection angle: 30 ° / 90 °
・ Projection direction: 1 direction / 2 directions / 4 directions ・ Gun pressure: 0.2 / 0.3 / 0.4 (MPa)
Processing speed: 40 mm / sec Under each of the above conditions, the upper surface of the sample of the light emitting device was blasted by injecting the polishing liquid into a mist from the nozzle by applying air pressure.

(evaluation)
For each sample prepared under different blasting conditions, the light output, the light reflection prevention effect on the upper surface, the surface roughness of the upper surface, and the filler (first filler) when the sample without blasting is used as a reference. And the presence or absence of the second filler) falling off was confirmed.
It was confirmed that the filler was exposed on the machined surface of the sample that had been blasted under any condition.
The higher the gun pressure, the greater the exposure of the filler, and some samples showed that the filler had fallen off from the surface, but under the same other conditions, the higher the gun pressure, the higher the light output (luminous flux). It was confirmed that. The improvement in light output is 1 to 2.9% for each sample of the first embodiment and 0.3 to 0.9% for each sample of the second embodiment.

When the polishing agent was projected at a projection angle of 90 °, that is, perpendicular to the machined surface, the amount of exposed filler was smaller than that at a projection angle of 30 ° when compared at the same gun pressure.
Also, when the projection angle is set to 30 °, when projecting from one direction, the surface of the filler facing the projection direction is exposed, but the surface on the opposite side is behind the filler itself, so it is not so much. It wasn't exposed. By setting the projection directions to two directions and further to four directions, the exposure amount of the filler increased, and the exposure amount increased as compared with the case where the projection angle was 90 °. It is considered that by making the projection angle smaller than the vertical angle, it became easier for the abrasive to peel off the resin. The light output is about the same between the sample when the projection angle is 90 ° and the gun pressure is 0.4 MPa and the sample when the projection angle is 30 ° and the gun pressure is 0.2 MPa and the projection direction is four directions. It was confirmed that it improved to.

In addition, it was visually confirmed that each sample had an antireflection effect on external light as compared with the sample not subjected to the blasting process.
The surface roughness (arithmetic mean roughness Ra) of the upper surface of each sample was substantially the same as that of the sample not subjected to the blasting process. That is, it was confirmed that only the resin covering the surface of the filler was removed by the blasting process without causing damage to the main body of the translucent member, which is a resin member, so as to form large irregularities.

The light emitting device according to the embodiment of the present disclosure includes a backlight source of a liquid crystal display, various lighting fixtures, a large display, various display devices such as advertisements and destination guides, and further, a digital video camera, a facsimile, a copier, a scanner, and the like. It can be used for image readers, projector devices, and the like.

1 Light emitting element 11, 12, 13 Light emitting element 2, 2A Package (base)
2a, 2Aa Recessed 2b, 2Ab Bottom surface 3,3A Lead electrode 31, 32, 33, 34 Lead electrode 31A, 32A Lead electrode 4, 4A Light-shielding member 4a, 4Aa Top surface 4b Notch 41 Base material 42 Second filler 5 , 5A Translucent member 5a, 5Aa Top surface 51 Base material 52, 52a, 52b First filler 53 Wavelength converter 6 Wire 71 Dispenser 72 Heating device 73 Nozzle 73a Projection angle 74 Polishing agent 100 Light emitting device 200 Image display device 210 Circuit Board 220 Protective member 230 Frame member 230a Opening

Claims (14)

A base with a recess with a bottom and side walls,
A light emitting element mounted on the bottom surface of the recess of the base and
A translucent member that covers the light emitting element is provided.
The translucent member contains particles of the first filler, and the translucent member contains particles of the first filler.
The first filler may be an air permeation method or Fisher-SubSieve-Sizers-No. The particle size specified in is 0.5 μm or more and 10 μm or less.
The upper surface of the translucent member has a plurality of first protrusions having an uneven shape due to the particles of the first filler, and a part of the particles of the first filler is the translucent member. The upper surface is exposed from the base material of the translucent member, and is exposed.
The base includes a lead electrode and a light-shielding member for fixing the lead electrode.
The light-shielding member constitutes at least a part of the side wall of the recess of the base.
The light-shielding member is a resin material using a translucent resin as a base material and containing particles of a second filler.
A plurality of second protrusions caused by the particles of the second filler are provided on the upper surface of the light-shielding member, which is the upper surface of the side wall of the recess of the base, and a part of the particles of the second filler. Is exposed from the base material of the light-shielding member.
The second filler is at least one selected from TiO ₂ , Al ₂ O ₃ , ZrO ₂ , MgO, and carbon-based pigments.
The base material of the translucent member is a light emitting device having a higher refractive index than the first filler. The first aspect of claim 1, wherein the upper surface of the light-shielding member, which is the upper surface of the side wall of the recess of the base, has an arithmetic average roughness Ra defined by JIS standard B0601: 2013 and is 0.090 μm or more and 0.210 μm or less. Light emitting device. The light emitting device according to claim 1 or 2, wherein the upper surface of the translucent member has an arithmetic mean roughness Ra defined by JIS standard B0601: 2013 of 0.095 μm or more and 0.220 μm or less. The light emitting device according to any one of claims 1 to 3, wherein the first filler is SiO ₂ . The light emitting according to any one of claims 1 to 4, wherein the base material of the translucent member is made of a material selected from an epoxy resin and a silicone resin, which has a higher refractive index than the first filler. Device. The light emitting device according to claim 1, wherein the second filler is any one of TiO ₂ , Al ₂ O ₃ , ZrO ₂ , MgO, and a black pigment. The light emitting device according to claim 1 or 2, wherein the particle size of the second filler is 0.1 μm or more and 0.5 μm or less. The light emitting device according to any one of claims 1 to 7, wherein the inner surface of the recess has a reflectance of 70% or more in the wavelength range of the light emitted by the light emitting element. The aspect according to any one of claims 1 to 8, wherein the outer surface of the recess of the base does not have a plurality of second protrusions due to the second filler except for the upper surface of the side wall of the recess. Light emitting device. A base having a lead electrode and a light-shielding member for fixing the lead electrode and having a recess having a bottom surface and a side wall, a light emitting element mounted on the bottom surface of the recess of the base, and a translucent light covering the light emitting element. A resin material comprising a sex member, wherein the light-shielding member constitutes at least a part of a side wall of a recess of the base, has a translucent resin as a base material, and contains particles of a second filler. It is a manufacturing method of a light emitting device, which is
A step of forming the translucent member that covers the light emitting element after the light emitting element is placed on the base.
A step of blasting the upper surface of each of the translucent member and the base is included.
In the step of forming the translucent member, the translucent member is formed by using a translucent resin as a base material and using a resin material containing particles of a translucent first filler.
The particles of the first filler are described by an air permeation method or Fisher-SubSieve-Sizers-No. The particle size specified in is 0.5 μm or more and 10 μm or less.
The second filler is at least one selected from TiO ₂ , Al ₂ O ₃ , ZrO ₂ , MgO, and carbon-based pigments.
The base material of the translucent member has a higher refractive index than the first filler, and has a higher refractive index.
By the step of performing the blasting process, the particles of the first filler have a plurality of first protrusions having an uneven shape due to the particles of the first filler on the upper surface of the translucent member. A part of the upper surface of the translucent member is exposed from the base material of the translucent member, and a part thereof is exposed.
A part of the particles of the second filler so that a plurality of second protrusions caused by the particles of the second filler are provided on the upper surface of the light-shielding member which is the upper surface of the side wall of the recess of the base. Is exposed from the base material of the light-shielding member, and the upper surface of the translucent member has an arithmetic mean roughness Ra defined by JIS standard B0601: 2013 of 0.095 μm or more and 0.220 μm or less. A method of manufacturing a light emitting device. By the step of performing the blasting process, the upper surface of the light-shielding member, which is the upper surface of the side wall of the recess of the base, has an arithmetic average roughness Ra defined by JIS standard B0601: 2013, and is 0.090 μm or more. The method for manufacturing a light emitting device according to claim 10, wherein the light emitting device has a length of 210 μm or less. The method for manufacturing a light emitting device according to claim 10 or 11, wherein the blasting process projects the slurry at an angle of 15 ° or more and 45 ° or less with respect to the upper surface of the translucent member. The method for manufacturing a light emitting device according to claim 12 , wherein the blasting process sequentially projects the slurry from two or more different directions in a plan view. The 12th or 13th claim , wherein the blasting treatment is a wet blasting treatment for projecting the slurry containing water and an abrasive, and the particle size of the abrasive is 3 μm or more and 14 μm or less. Manufacturing method of light emitting device.

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