JP6672871B2 - Electronic component mounting structure - Google Patents

Description

  The present invention relates to an electronic component mounting structure.

  2. Description of the Related Art An electronic component including a rectangular parallelepiped element, an external electrode, and an insulating layer is known (for example, see Patent Document 1). The element body has a pair of end surfaces facing each other, a pair of first side surfaces facing each other, and a pair of second side surfaces facing each other, and one of the second side surfaces is a mounting surface. The external electrode, a first electrode portion disposed on the end face, a second electrode portion disposed on each of the pair of first side surfaces, and a third electrode portion disposed on each of the pair of second side surfaces, have. The insulating layer covers the first electrode portion and the second electrode portion, and a third electrode portion disposed on one second side surface is exposed from the insulating layer.

JP-A-02-155209

  When an electronic component including an external electrode and an insulating layer covering the external electrode is solder-mounted, molten solder wets between the external electrode and the insulating layer, and the external electrode and the insulating layer A solder fillet may be formed between them. In this case, since the solder fillet is formed between the external electrode and the insulating layer, the size of the solder fillet formed between the electronic component and the substrate is reduced, and the mounting strength of the electronic component may not be secured. .

  SUMMARY OF THE INVENTION It is an object of the present invention to provide an electronic component mounting structure capable of securing mounting strength and realizing high-density mounting.

  The mounting structure of an electronic component according to one embodiment of the present invention is a mounting structure of an electronic component in which the electronic component is mounted on a board by soldering, wherein the electronic component has a pair of end surfaces facing each other and a pair of facing surfaces facing each other. A first side surface, having a pair of second side surfaces facing each other, a rectangular parallelepiped element body having one second side surface as a mounting surface, and an external electrode arranged on the end surface side, An insulating layer covering the external electrode, wherein the solder joins the external electrode and the substrate, and is formed between the external electrode and the insulating layer. Is thicker between the external electrode and the insulating layer than the solder located on the other second side.

  In the electronic component mounting structure according to one embodiment of the present invention, during solder mounting, the molten solder wets up between the external electrode and the insulating layer, and a solder fillet is formed between the external electrode and the insulating layer. You. For this reason, the mounting strength of the electronic component is improved.

  In the electronic component mounting structure according to one embodiment of the present invention, the external electrodes are covered with the insulating layer. Further, the size of the solder fillet formed between the external electrode and the insulating layer is smaller than the size of the solder fillet formed when an electronic component having no insulating layer is mounted by soldering. Therefore, the electronic component according to one embodiment of the present invention can be mounted at a high density with a small space therebetween.

  In the electronic component mounting structure according to one embodiment of the present invention, the thickness of the solder located on one second side surface (mounting surface) side between the external electrode and the insulating layer is set between the external electrode and the insulating layer. In this case, since the thickness of the solder fillet is larger than the thickness of the solder located on the other second side surface, the area of the solder fillet in contact with the substrate increases. Accordingly, even when the solder fillet is formed between the external electrode and the insulating layer, the contact area between the substrate and the solder fillet is ensured, and the mounting strength of the electronic component is improved.

  In the electronic component mounting structure according to one embodiment, the insulating layer may cover the solder located on the other second side surface side. In the electronic component mounting structure according to one embodiment, since the solder located on the other second side surface is covered with the insulating layer, even when the thickness of the solder fillet formed on the substrate side is large, the insulating Nature can be secured.

  In the electronic component mounting structure according to one embodiment, the external electrode is further disposed on each of the pair of first side surfaces, and the insulating layer is disposed on the pair of first side surfaces and the external electrode and the pair of first side surfaces. One side may be further covered. In the electronic component mounting structure according to one embodiment, the molten solder wets up between the external electrode and the insulating layer disposed on the pair of first side surfaces, and is insulated from the external electrode disposed on the pair of first side surfaces. Solder fillets are also formed between the layers. For this reason, the mounting strength of the electronic component is further improved.

  In the electronic component mounting structure according to one embodiment, the external electrode is further disposed on each of the pair of second side surfaces, and the insulating layer includes the external electrode disposed on the other second side surface and the other second side surface. The side surface may be further covered. In the electronic component mounting structure according to one embodiment, the insulating layer is formed on the other second side surface, so that excessive solder is prevented from wetting on the other second side surface, and is insulated from the inside of the insulating layer. The stress acting on the layer is reduced. As a result, it is possible to prevent the strength of the insulating layer from being reduced.

  According to the present invention, the mounting strength can be ensured and high-density mounting can be realized.

It is a perspective view showing the multilayer capacitor concerning one embodiment. It is a figure for explaining section composition of a multilayer capacitor concerning this embodiment. It is a figure for explaining section composition of a multilayer capacitor concerning this embodiment. FIG. 2 is a perspective view showing one mounting example of the electronic component according to the embodiment. FIG. 4 is a diagram for explaining a cross-sectional configuration in one mounting example of the electronic component according to the embodiment. FIG. 4 is a diagram for explaining a cross-sectional configuration in one mounting example of the electronic component according to the embodiment. It is a perspective view showing the multilayer capacitor concerning a modification of this embodiment. It is a figure for explaining section composition of a multilayer capacitor concerning a modification of this embodiment. It is a figure for explaining section composition of a multilayer capacitor concerning a modification of this embodiment. FIG. 9 is a diagram for explaining a cross-sectional configuration in one mounting example of an electronic component according to a modified example of the embodiment. FIG. 9 is a diagram for explaining a cross-sectional configuration in one mounting example of an electronic component according to a modified example of the embodiment. It is a top view showing the electronic parts device concerning one embodiment.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the description of the drawings, the same or corresponding elements will be denoted by the same reference symbols, without redundant description.

  The configuration of the multilayer capacitor C1 according to the present embodiment will be described with reference to FIGS. FIG. 1 is a perspective view showing a multilayer capacitor according to the present embodiment. 2 and 3 are views for explaining a cross-sectional configuration of the multilayer capacitor according to the present embodiment. In the present embodiment, a multilayer capacitor C1 will be described as an example of an electronic component.

  As shown in FIG. 1, the multilayer capacitor C1 includes a rectangular parallelepiped element body 2, external electrodes 5 and 7 disposed on the outer surface of the element body 2, and an insulating layer IL. The external electrode 5 and the external electrode 7 are separated. The rectangular parallelepiped shape includes a rectangular parallelepiped shape in which corners and ridges are chamfered, and a rectangular parallelepiped in which the corners and ridges are rounded. The external electrodes 5 and 7 are also terminal electrodes.

  The element body 2 has, as outer surfaces thereof, a pair of end faces 2a and 2b facing each other, a pair of first side faces 2c and 2d facing each other, and a pair of second side faces 2e and 2e facing each other. 2f. In the present embodiment, the direction in which the pair of end surfaces 2a and 2b face each other (first direction D1) is the longitudinal direction of the element body 2, and the direction in which the pair of first side surfaces 2c and 2d face each other (second direction). The direction D2) is the width direction of the element body 2, and the direction in which the pair of second side surfaces 2e and 2f face each other (the third direction D3) is the height direction of the element body 2.

  The pair of first side surfaces 2c, 2d extend in the first direction D1 so as to connect between the pair of end surfaces 2a, 2b. The pair of first side surfaces 2c, 2d also extend in the third direction D3. The pair of second side surfaces 2e, 2f extend in the first direction D1 so as to connect between the pair of end surfaces 2a, 2b. The pair of second side surfaces 2e, 2f also extend in the second direction D2.

The element body 2 is configured by laminating a plurality of dielectric layers in a direction (third direction D3) in which the pair of second side surfaces 2e and 2f face each other. In the element body 2, the stacking direction of the plurality of dielectric layers (hereinafter, simply referred to as “stacking direction”) matches the third direction D3. Each dielectric layer is made of a sintered body of a ceramic green sheet containing, for example, a dielectric material (dielectric ceramic such as BaTiO ₃ , Ba (Ti, Zr) O ₃ or (Ba, Ca) TiO ₃ ). Be composed. In the actual element body 2, the dielectric layers are integrated so that the boundaries between the dielectric layers are not visible. The second direction D2 may be the above-described laminating direction. The element body 2 is made of a ceramic material.

  The multilayer capacitor C1 has a plurality of internal electrodes 11 and a plurality of internal electrodes 13 as shown in FIGS. The internal electrodes 11 and 13 are made of a conductive material (for example, Ni or Cu or the like) usually used as an internal conductor of the multilayer electronic component. The internal electrodes 11 and 13 are configured as a sintered body of a conductive paste containing the conductive material. The internal electrodes 11 and 13 function as internal conductors arranged in the element body 2.

  The internal electrode 11 and the internal electrode 13 are arranged at different positions (layers) in the second direction D2. That is, the internal electrodes 11 and the internal electrodes 13 are alternately arranged in the element body 2 so as to face each other with an interval in the second direction D2.

  Each internal electrode 11 includes a main electrode portion 11a and a connection portion 11b, as shown in FIG. The connection portion 11b extends from one side (one short side) of the main electrode portion 11a and is exposed on the end face 2a. The internal electrode 11 is exposed on the end face 2a, and is not exposed on the end face 2b, the pair of first side faces 2c, 2d, and the pair of second side faces 2e, 2f. The main electrode portion 11a and the connection portion 11b are formed integrally.

  The main electrode portion 11a has a rectangular shape with the first direction D1 being a long side direction and the second direction D2 being a short side direction. The connection part 11b extends from the end on the end face 2a side of the main electrode part 11a to the end face 2a. The connection portion 11b is connected to the external electrode 5 at an end exposed on the end surface 2a.

  Each internal electrode 13 includes a main electrode portion 13a and a connection portion 13b, as shown in FIG. The main electrode portion 13a faces the main electrode portion 11a via a part (the dielectric layer) of the element body 2 in the third direction D3. The connection portion 13b extends from one side (one short side) of the main electrode portion 13a and is exposed on the end face 2b. The internal electrode 13 is exposed on the end face 2b, and is not exposed on the end face 2a, the pair of first side faces 2c, 2d, and the pair of second side faces 2e, 2f. The main electrode portion 13a and the connection portion 13b are formed integrally.

  The main electrode portion 13a has a rectangular shape with the first direction D1 as a long side direction and the second direction D2 as a short side direction. The connection part 13b extends from the end on the end face 2b side of the main electrode part 13a to the end face 2b. The connection portion 13b is connected to the external electrode 7 at an end exposed on the end surface 2b.

  The external electrode 5 is located at an end of the element body 2 on the end face 2a side when viewed in the first direction D1. The external electrode 5 is disposed on the electrode portion 5a disposed on the end surface 2a, on the electrode portion 5b disposed on the pair of first side surfaces 2c and 2d, and on the pair of second side surfaces 2e and 2f, respectively. And an electrode portion 5c. That is, the external electrodes 5 are formed on five surfaces 2a, 2c, 2d, 2e, and 2f.

  The electrode portions 5a, 5b, 5c adjacent to each other are connected at the ridge of the element body 2 and are electrically connected. The electrode portion 5a and the electrode portion 5b are connected at a ridge portion between the end surface 2a and each of the first side surfaces 2c and 2d. The electrode portion 5a and the electrode portion 5c are connected at a ridge portion between the end face 2a and each of the second side faces 2e and 2f. The electrode portion 5b and the electrode portion 5c are connected at a ridge between the first side surfaces 2c and 2d and the second side surfaces 2e and 2f.

  The electrode portion 5a is arranged so as to cover all the portion exposed on the end face 2a of each connection portion 11b, and the connection portion 11b is directly connected to the external electrode 5. That is, the connection portion 11b connects the main electrode portion 11a and the electrode portion 5a. Thereby, each internal electrode 11 is electrically connected to the external electrode 5.

  The electrode portion 5b is located at a part of the corresponding first side surface 2c, 2d near the end surface 2a. The electrode portion 5c is located at a part of the corresponding second side surface 2e, 2f near the end surface 2a. The length (width) of the electrode portions 5b, 5c in the first direction D1 is smaller than the length (width) of the electrode portions 5a in the second direction D2. Therefore, the area of each of the electrode portions 5b and 5c is smaller than the area of the electrode portion 5a.

  The external electrode 7 is located at an end of the element body 2 on the end face 2b side when viewed in the first direction D1. The external electrode 7 is disposed on the electrode portion 7a disposed on the end surface 2b, the electrode portion 7b disposed on the pair of first side surfaces 2c and 2d, and on the pair of second side surfaces 2e and 2f, respectively. And an electrode portion 7c. That is, the external electrodes 7 are formed on the five surfaces 2b, 2c, 2d, 2e, and 2f.

  The electrode portions 7a, 7b, 7c adjacent to each other are connected to each other at the ridge of the element body 2 and are electrically connected. The electrode portion 7a and the electrode portion 7b are connected at a ridge portion between the end face 2b and each of the first side faces 2c and 2d. The electrode portion 7a and the electrode portion 7c are connected at a ridge portion between the end face 2b and each of the second side faces 2e and 2f. The electrode portion 7b and the electrode portion 7c are connected at a ridge between the first side surfaces 2c and 2d and the second side surfaces 2e and 2f.

  The electrode portion 7a is arranged so as to cover all the portion exposed on the end face 2b of each connection portion 13b, and the connection portion 13b is directly connected to the external electrode 7. That is, the connection portion 13b connects the main electrode portion 13a and the electrode portion 7a. Thereby, each internal electrode 13 is electrically connected to the external electrode 7.

  The electrode portion 7b is located at a part of the corresponding first side surface 2c, 2d near the end surface 2b. The electrode portion 7c is located at a part of the corresponding second side surface 2e, 2f near the end surface 2b. The length (width) of the electrode portions 7b and 7c in the first direction D1 is smaller than the length (width) of the electrode portions 7a in the second direction D2. Therefore, the area of each electrode portion 7b, 7c is smaller than the area of electrode portion 7a.

  The external electrodes 5, 7 have a first electrode layer 21, a second electrode layer 23, and a third electrode layer 25, respectively, as shown in FIGS. That is, the electrode portions 5a, 5b, 5c and the electrode portions 7a, 7b, 7c include the first electrode layer 21, the second electrode layer 23, and the third electrode layer 25, respectively. The third electrode layer 25 forms the outermost layer of the external electrodes 5 and 7.

  The first electrode layer 21 is formed by applying and baking a conductive paste to the surface of the element body 2. The first electrode layer 21 is a sintered metal layer formed by sintering a metal component (metal powder) contained in the conductive paste. That is, the first electrode layer 21 is a sintered metal layer formed on the element body 2. In the present embodiment, the first electrode layer 21 is a sintered metal layer made of Cu. The first electrode layer 21 may be a sintered metal layer made of Ni. Thus, the first electrode layer 21 contains Cu or Ni. As the conductive paste, a mixture of a powder of Cu or Ni mixed with a glass component, an organic binder, and an organic solvent is used.

  The second electrode layer 23 is formed on the first electrode layer 21 by a plating method. In the present embodiment, the second electrode layer 23 is a Ni plating layer formed on the first electrode layer 21 by Ni plating. The second electrode layer 23 may be a Sn plating layer, a Cu plating layer, or an Au plating layer. Thus, the second electrode layer 23 contains Ni, Sn, Cu, or Au.

  The third electrode layer 25 is formed on the second electrode layer 23 by a plating method. In the present embodiment, the third electrode layer 25 is a Sn plating layer formed on the second electrode layer 23 by Sn plating. The third electrode layer 25 may be a Cu plating layer or an Au plating layer. Thus, the third electrode layer 25 contains Sn, Cu, or Au.

  The multilayer capacitor C1 is mounted on another electronic device (for example, a circuit board or an electronic component) by soldering. In the multilayer capacitor C1, one second side surface of the pair of second side surfaces 2e and 2f is a mounting surface facing another electronic device. In the present embodiment, the second side surface 2e is a mounting surface.

  The insulating layer IL is disposed on the element body 2 and on the external electrodes 5 and 7 so as to surround the pair of end faces 2a and 2b and the pair of first side faces 2c and 2d of the element body 2. The insulating layer IL is exposed from the insulating layer portion ILa covering the electrode portions 5a and 7a, the insulating layer portion ILb covering the electrode portions 5b and 7b, and the electrode portions 5b and 7b on the first side surfaces 2c and 2d. And an insulating layer portion ILc covering the exposed region. The insulating layer portion ILa, the insulating layer portion ILb, and the insulating layer portion ILc are integrally formed. The electrode portions 5c and 7c and the exposed regions of the second side surfaces 2e and 2f that are exposed from the electrode portions 5c and 7c are exposed from the insulating layer IL.

  The insulating layer IL is made of a material having electrical insulation (for example, insulating resin or glass). In the present embodiment, the insulating layer IL is made of an insulating resin. The insulating layer IL is formed, for example, by applying and solidifying an insulating resin coating agent. A screen printing method or a spray coating method can be used for applying the insulating resin coating agent.

  As the insulating resin coating agent, a thermosetting insulating resin coating agent can be used. For example, a thermosetting epoxy resin paint using a metal oxide pigment used as a solder resist for a printed circuit board can be used. Silicone resin paint, fluorine resin paint, phenol resin paint, urea resin paint, melamine resin paint, amino resin paint, unsaturated polyester resin paint, diallyl phthalate resin paint using metal oxide pigment Heat resistance of polyurethane resin coating, polyimide resin coating, alkyd resin coating, spirane resin coating, thermosetting acrylic resin coating, thermosetting methacrylic resin coating, or thermosetting copolymer resin coating Resin paints can also be used. A resist material used as a photoresist such as an acrylated epoxy resin type or an acrylated synthetic rubber type also has thermosetting properties and can be used as an insulating resin coating agent.

  It is preferable to add an organic pigment or an inorganic pigment to these insulating resin coatings to impart coloring or opacity to the insulating layer IL. Examples of the coloring organic pigment include a polycyclic pigment-based phthalocyanine pigment or an anthraquinone-based pigment, and an azo compound diazo pigment. Examples of the inorganic pigment include a metal oxide and carbon black. By using a pigment having a large refractive index as the pigment of the metal oxide described above, an appropriate light scattering property may be given to the insulating layer IL, and substantial opacity may be given.

  As the insulating resin coating agent, a UV-curable insulating resin coating agent may be used instead of the thermosetting insulating resin coating agent. For example, an acrylated epoxy resin-based paint using a metal oxide pigment used as a solder resist for a printed circuit board can be used. Acrylic silicone resin paint, acrylate fluororesin paint, acrylate phenol resin paint, acrylate polyurethane resin paint, acrylate oil paint, acrylate alkyd resin paint, acrylic using metal oxide pigment Polyester-based paints, acrylated polyether-based paints, acrylated spirane resin-based paints, or acrylated copolymer resin-based paints can be used. The paint may be methacrylated. Unsaturated polyester resin paints or polyene-polythiol paints using metal oxide pigments can also be used.

  It is preferable to add an organic pigment or an inorganic pigment to these heat-resistant resin paints appropriately to impart coloring or opacity to the insulating layer IL. Examples of the coloring organic pigment include a polycyclic pigment-based phthalocyanine pigment or an anthraquinone-based pigment, and an azo compound diazo pigment. Examples of the inorganic pigment include a metal oxide and carbon black. By using a pigment having a large refractive index as the pigment of the metal oxide described above, an appropriate light scattering property may be given to the insulating layer IL, and substantial opacity may be given.

  As the insulating resin coating agent, one obtained by introducing a thermosetting insulating resin coating agent into an ultraviolet-curing insulating resin coating agent may be used. Used as heat resistant paint, Lewis acid salt and epoxy resin paint, acid generator and acid-cured amino alkyd resin paint, or various kinds of the above-mentioned thermosetting insulating resin coating materials using metal oxide pigments A resin obtained by introducing a resin into various types of UV-curable insulating resin coating agents can be used. An acrylated epoxy resin-based photoresist or an acrylated synthetic rubber-based photoresist can also be used.

  Subsequently, the mounting structure 100 of the multilayer capacitor C1 will be described. As shown in FIGS. 4 to 6, the multilayer capacitor C1 is solder-mounted on an electronic device (eg, a circuit board or another electronic component) ED. The multilayer capacitor C1 is disposed such that the second side surface 2e faces the electronic device ED as a mounting surface. In the electronic device ED, a pair of land conductors L1 and L2 are arranged at intervals. The external electrode 5 is connected to the land conductor L1. The external electrode 7 is connected to the land conductor L2.

  When the multilayer capacitor C1 is mounted by soldering, the molten solder wets between the external electrodes 5, 7 (electrode portions 5a, 5b, 7a, 7b) and the insulating layer IL (insulating layer portions ILa, ILb). By solidifying the wet solder, a solder fillet SF is formed between the electrode portions 5a, 5b, 7a, 7b and the insulating layer portions ILa, ILb, as shown in FIGS. As a result, the external electrodes 5, 7 and the land conductors L1, L2 are joined by the solder fillet SF.

  As shown in FIG. 5, in the mounting structure 100 of the multilayer capacitor C1, the thickness of the solder fillet SF located on the second side surface 2e side between the electrode portions 5a, 7a of the external electrodes 5, 7 and the insulating layer portion ILa. Is larger than the thickness of the solder fillet SF located on the second side surface 2f side between the electrode portions 5a, 7a of the external electrodes 5, 7 and the insulating layer portion ILa. In the example shown in FIG. 5, the thickness of the solder fillet SF continuously increases from the second side surface 2f side toward the second side surface 2e side when viewed from the second direction D2.

  As shown in FIG. 6, in the mounting structure 100 of the multilayer capacitor C1, the thickness of the solder fillet SF located on the second side surface 2e side between the electrode portions 5b, 7b of the external electrodes 5, 7 and the insulating layer portion ILb. Is larger than the thickness of the solder fillet SF located on the second side face 2f side between the electrode portions 5b, 7b of the external electrodes 5, 7 and the insulating layer portion ILb. In the example shown in FIG. 6, the thickness of the solder fillet SF continuously increases from the second side surface 2f side to the second side surface 2e side when viewed from the first direction D1.

  As shown in FIGS. 5 and 6, the positions of the insulating layer portion ILa and the insulating layer portion ILb increase from the second side surface 2f toward the second side surface 2e, that is, toward the electronic device ED. . This increases the amount of solder that enters, so that the thickness of the solder fillet SF increases and the mounting strength can be secured. Furthermore, insulation can be ensured also on the second side surface 2e side where the thickness of the solder fillet SF is large. Further, the insulating layer portion ILa and the insulating layer portion ILb are in contact with the adjacent multilayer capacitor C1 on the second side surface 2f side where the thickness of the solder fillet SF is smaller than the second side surface 2e side. hard. Therefore, in the mounting structure 100 of the multilayer capacitor C1, the multilayer capacitor C1 can be mounted narrowly adjacent and at a high density.

  By the solder fillet SF, not only the electrode portions 5c, 7c arranged on the second side surface 2e, but also the electrode portions 5a, 5b, 7a, 7b are physically connected to the electronic device ED. Therefore, the mounting strength of the multilayer capacitor C1 on the electronic device ED is improved.

  The size of the solder fillet SF formed between the electrode portions 5a, 5b, 7a, 7b and the insulating layer portions ILa, ILb depends on the size of the solder formed when the multilayer capacitor having no insulating layer IL is mounted by soldering. Smaller than fillet size. Therefore, in the mounting structure 100 of the multilayer capacitor C1, the multilayer capacitor C1 can be mounted narrowly adjacent and at a high density.

  In the mounting structure 100 of the multilayer capacitor C1, the thickness of the solder fillet SF located on the second side surface 2e side between the electrode portions 5a, 5b, 7a, 7b of the external electrodes 5, 7 and the insulating layer portions ILa, ILb is: Since the thickness between the electrode portions 5a, 5b, 7a, 7b of the external electrodes 5, 7 and the insulating layer portions ILa, ILb is larger than the thickness of the solder fillet SF located on the second side surface 2f side, the land conductors L1, L2 and The area of the solder fillet SF that comes into contact increases. Thereby, in the mounting structure 100 of the multilayer capacitor C1, the contact area between the land conductors L1 and L2 and the solder fillet SF is secured, so that the mounting strength of the multilayer capacitor C1 is improved.

  When the multilayer capacitor C1 is mounted by soldering, the molten solder wets between the external electrodes 5, 7 and the insulating layer IL. At this time, the insulating layer portions ILa and ILb spread outward due to penetration of the molten solder. Thereby, the insulating layer portions ILa and ILb cover the solder fillet SF according to the shape of the solder fillet SF. Therefore, in the mounting structure 100 of the multilayer capacitor C1, the solder fillet SF located on the second side surface 2e side is also covered with the insulating layer IL (the insulating layer portions ILa and ILb), so that the thickness of the solder fillet SF is large. In this case, insulation can be ensured.

  Since the insulating layer IL contains a resin, the insulating layer IL has elasticity. Therefore, the stress acting on the insulating layer IL from inside the insulating layer IL is absorbed by the elastic deformation of the insulating layer IL. Therefore, it is possible to reliably prevent the strength of the insulating layer IL from decreasing.

  Next, a configuration of the multilayer capacitor C2 according to a modification of the present embodiment will be described with reference to FIGS. FIG. 7 is a perspective view showing a multilayer capacitor according to the present modification. 8 and 9 are views for explaining a cross-sectional configuration of the multilayer capacitor according to the present modification. Also in the present modification, the multilayer capacitor C2 will be described as an example of the electronic component.

  As shown in FIG. 7, the multilayer capacitor C2 includes the element body 2, the external electrodes 5, the external electrodes 7, and the insulating layer IL, similarly to the multilayer capacitor C1. The external electrode 5 has an electrode portion 5a, an electrode portion 5b, and an electrode portion 5c. The external electrode 7 has an electrode portion 7a, an electrode portion 7b, and an electrode portion 7c.

  The insulating layer IL is disposed over the element body 2 and the external electrodes 5 and 7 so as to surround not only the pair of end surfaces 2a and 2b and the pair of first side surfaces 2c and 2d but also the second side surface 2f. . The insulating layer IL includes an insulating layer portion ILa, an insulating layer portion ILb, an insulating layer portion ILc, an insulating layer portion ILd covering the electrode portions 5c and 7c disposed on the second side surface 2f, and a second side surface 2f. An insulating layer portion ILe covers an exposed region exposed from the electrode portions 5c and 7c. The insulating layer portion ILa, the insulating layer portion ILb, the insulating layer portion ILc, the insulating layer portion ILd, and the insulating layer portion ILe are integrally formed. In the present modification, the electrode portions 5c and 7c arranged on the second side surface 2e and the exposed regions of the second side surface 2e that are exposed from the electrode portions 5c and 7c are exposed from the insulating layer IL.

  Subsequently, the mounting structure 110 of the multilayer capacitor C2 will be described. As shown in FIGS. 10 and 11, the multilayer capacitor C2 is mounted on the electronic device ED by soldering. The multilayer capacitor C2 is disposed so that the second side surface 2e faces the electronic device ED as a mounting surface. In the electronic device ED, a pair of land conductors L1 and L2 are arranged at intervals. The external electrode 5 is connected to the land conductor L1. The external electrode 7 is connected to the land conductor L2. The external electrodes 5, 7 and the land conductors L1, L2 are joined by a solder fillet SF.

  In the mounting structure 110 of the multilayer capacitor C2, similar to the mounting structure 100 of the multilayer capacitor C1, the solder fillet SF is formed between the external electrodes 5, 7 and the insulating layer IL. The mounting strength is improved.

  As shown in FIG. 10, in the mounting structure 110 of the multilayer capacitor C2, the thickness of the solder fillet SF located on the second side surface 2e side between the electrode portions 5a, 7a of the external electrodes 5, 7 and the insulating layer portion ILa. Is larger than the thickness of the solder fillet SF located on the second side surface 2f side between the electrode portions 5a, 7a of the external electrodes 5, 7 and the insulating layer portion ILa. In the example illustrated in FIG. 10, the thickness of the solder fillet SF increases continuously from the second side surface 2f side to the second side surface 2e side when viewed from the second direction D2.

  As shown in FIG. 11, in the mounting structure 110 of the multilayer capacitor C2, the thickness of the solder fillet SF located on the second side surface 2e side between the electrode portions 5b, 7b of the external electrodes 5, 7 and the insulating layer portion ILb. Is larger than the thickness of the solder fillet SF located on the second side face 2f side between the electrode portions 5b, 7b of the external electrodes 5, 7 and the insulating layer portion ILb. In the example illustrated in FIG. 11, the thickness of the solder fillet SF continuously increases from the second side surface 2f side toward the second side surface 2e side when viewed from the first direction D1.

  In the mounting structure 110 of the multilayer capacitor C2, the thickness of the solder fillet SF located on the second side surface 2e side between the electrode portions 5a, 5b, 7a, 7b of the external electrodes 5, 7 and the insulating layer portions ILa, ILb is: Since the thickness between the electrode portions 5a, 5b, 7a, 7b of the external electrodes 5, 7 and the insulating layer portions ILa, ILb is larger than the thickness of the solder fillet SF located on the second side surface 2f side, the land conductors L1, L2 and The area of the solder fillet SF that comes into contact increases. Thereby, in the mounting structure 110 of the multilayer capacitor C2, since the contact area between the land conductors L1 and L2 and the solder fillet SF is secured, the mounting strength of the multilayer capacitor C2 is improved.

  As shown in FIGS. 10 and 11, the positions of the insulating layer portion ILa and the insulating layer portion ILb increase from the second side surface 2f toward the second side surface 2e, that is, toward the electronic device ED. . This increases the amount of solder that enters, so that the thickness of the solder fillet SF increases and the mounting strength can be secured. Furthermore, insulation can be ensured also on the second side surface 2e side where the thickness of the solder fillet SF is large. Further, the insulating layer portion ILa and the insulating layer portion ILb are in contact with the adjacent multilayer capacitor C2 on the second side surface 2f side where the thickness of the solder fillet SF is smaller than the second side surface 2e side. hard. Therefore, in the mounting structure 110 of the multilayer capacitor C2, it is possible to mount the multilayer capacitor C2 in a narrowly adjacent and high density.

  In the mounting structure 110 of the multilayer capacitor C2, since the second side surface 2f of the element body 2 in the multilayer capacitor C2 is covered with the insulating layer portion ILe, the molten solder is further suppressed from wetting to the second side surface 2f. it can.

  Next, the configuration of the electronic component device ECD according to the present embodiment will be described with reference to FIG. FIG. 12 is a plan view showing the electronic component device according to the present embodiment.

  As shown in FIG. 12, the electronic component device ECD includes a plurality of multilayer capacitors C1 and an electronic device ED.

  The plurality of multilayer capacitors C1 are solder-mounted in a matrix on the electronic device ED. In the multilayer capacitors C1 adjacent in the row direction, the end faces 2a and 2b face each other. In the multilayer capacitors C1 adjacent in the column direction, the first side surfaces 2c and 2d face each other. The interval P1 in the row direction between the multilayer capacitors C1 is smaller than the interval P2 in the column direction between the multilayer capacitors C1.

  In each multilayer capacitor C1, the strength of the insulating layer IL, particularly, the strength of the insulating layer portion ILa is prevented from being reduced. Therefore, in the electronic component device ECD, narrower adjacent high-density mounting can be realized in the row direction as compared with the column direction.

  Although the embodiments of the present invention have been described above, the present invention is not necessarily limited to the above-described embodiments, and various changes can be made without departing from the gist of the present invention.

  The electronic component device ECD may include a plurality of multilayer capacitors C2 instead of the plurality of multilayer capacitors C1. The electronic component device ECD may include a plurality of multilayer capacitors C1 and multilayer capacitors C2.

  In the present embodiment, an example has been described in which the external electrodes 5, 7 of the multilayer capacitors C1, C2 include the electrode portions 5a, 5b, 5c, 7a, 7b, 7c. What is necessary is just to provide 5a, 7a.

  In the present embodiment, an example in which the electronic components are the multilayer capacitors C1 and C2 has been described, but the present invention is not limited to this. The present invention can also be applied to electronic components other than multilayer capacitors (for example, multilayer inductors, multilayer varistors, multilayer piezoelectric actuators, multilayer thermistors, multilayer composite components, etc.).

  2. Element body, 2a, 2b ... end face, 2c, 2d ... first side face, 2e, 2f ... second side face, 5, 7 ... external electrode, 100, 110 ... electronic component mounting structure, C1, C2 ... multilayer capacitor , ED: electronic equipment (substrate), IL: insulating layer, SF: solder fillet (solder).

Claims (3)

An electronic component mounting structure in which an electronic component on which an insulating layer is formed is mounted on a board by soldering,
The electronic component is
A rectangular parallelepiped element having a pair of end surfaces facing each other, a pair of first side surfaces facing each other, and a pair of second side surfaces facing each other, and one of the second side surfaces is a mounting surface. Body and
The end surface, the pair of first side surfaces, and a pair of external electrodes disposed on each of the pair of second side surfaces ,
It said pair of end faces and the pair of first sides arranged the external electrode, and, and a said insulating layer covers only the pair of first side surface,
The solder joins the external electrode and the substrate, and is formed between the external electrode and the insulating layer disposed on each of the pair of end surfaces and the pair of first side surfaces ,
The thickness of the solder located on the one second side surface between the external electrode and the insulating layer is the thickness of the solder located on the other second side surface between the external electrode and the insulating layer. Mounting structure for electronic components that is larger than the thickness of   The electronic component mounting structure according to claim 1, wherein the insulating layer covers the solder located on the other second side surface. An electronic component mounting method for mounting an electronic component on a board by soldering,
A rectangular parallelepiped element having a pair of end surfaces facing each other, a pair of first side surfaces facing each other, and a pair of second side surfaces facing each other, and one of the second side surfaces is a mounting surface. A body, the end faces, the pair of first side faces, and a pair of external electrodes disposed on the pair of second side faces, respectively, and the external electrodes disposed on the pair of end faces and the pair of first side faces; , And an insulating layer covering only the pair of first side surfaces, and preparing the electronic component comprising:
Disposing the electronic component on the substrate such that the mounting surface of the electronic component faces the substrate, the external electrode and the insulating layer disposed on each of the pair of end surfaces and the pair of first side surfaces; To form a solder between, and join the external electrode and the substrate,
The thickness of the solder located on the one second side surface between the external electrode and the insulating layer, the solder located on the other second side surface between the external electrode and the insulating layer A mounting method for electronic components that is larger than the thickness of the electronic component.

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