JP6669523B2 - Die bonder and method of manufacturing semiconductor device - Google Patents

Description

  The present invention relates to a semiconductor device manufacturing technique, and more particularly to a technique effective when applied to a semiconductor device manufacturing process using a plurality of die bonders.

  As the die bonder used in the manufacturing process of semiconductor products increases the number of pins and pitches due to the higher integration of semiconductor products and the spread of SiP (System in Package), more accurate die (semiconductor chip) positioning accuracy becomes higher. Has been requested.

  On the other hand, in order to cope with the shortening of the product cycle of semiconductor products and the production of small-quantity multi-products, improvement of productivity such as minimizing the production start-up time and maximizing the actual operation rate is also an important issue.

  In general, positioning of a die by a die bonder is performed by irradiating a die or a substrate substrate with light by an illumination system and processing an image captured by a camera. Therefore, the positioning accuracy of the die is greatly affected by the light amount (illumination output) of the illumination system.

  As a background art in this technical field, there is a technique as disclosed in Patent Document 1. Patent Literature 1 discloses that an exposure apparatus capable of obtaining an applied voltage and an oscillating energy amount for each unit pulse number or for each unit time and updating the relational expression between the two by calculation, thereby achieving good energy amount control. Is disclosed.

  Further, Patent Document 2 discloses that “the amount of illumination light for illuminating a semiconductor wafer is reduced in a portion affected by reflected light from a mirror chip from a portion not affected in accordance with the degree of the influence, A semiconductor chip pickup device capable of determining a defective chip even when a defective chip with a good mark attached to a portion affected by light reflected from the mirror chip is disclosed.

  Patent Document 3 discloses “a die bonder including a contrast value optimization device that optimally sets a contrast value in image recognition”.

JP-A-10-125990 JP 2012-174846 A JP 2014-109929 A

  By the way, in a general semiconductor manufacturing line, a plurality of semiconductor manufacturing apparatuses of the same model are installed, conditions are set in advance by one apparatus, recipe data is created based on the conditions, and the recipe data is sent to another apparatus. By transplanting, a method of processing under the same conditions is being performed. This makes it possible to perform processing under the same conditions in a plurality of apparatuses while minimizing the time required for starting up production.

  In a die bonder as well, recipe data such as parameters, coordinates, and illumination output values related to image acquisition used in die positioning and inspection are generated in advance by one device for each product type, and then transplanted to another device and started. Has been taken.

  However, the lighting system mounted on the die bonder often has machine differences between the devices, and if the recipe data is transplanted with the lighting machine differences, the matching score (matching rate) of the positioning decreases and the inspection judgment value decreases. Will be shifted.

  In addition, although the lighting system deteriorates with time, the degree of the deterioration varies between the devices, so that there is a problem that the machine difference between the devices changes with time.

  In order to correct these machine differences, adjustment using an illuminance (light amount) measuring device, a jig, or the like can be considered, but regular maintenance is required, and accurate machine error correction is extremely difficult.

  Patent Document 1 described above adjusts the intensity of the pulse light emitted from the light source based on the output value of the photodetector, but does not disclose the problem caused by the instrumental difference between the light sources as described above. It is also conceivable that the photodetector itself has an instrumental difference.

  Further, Patent Literature 2 suppresses the influence of a mirror chip that reflects light almost completely without forming a circuit pattern. However, like Patent Literature 1, there is no description about a difference between light sources.

  Patent Document 3 described above relates to a contrast value optimizing method at the time of registering a pattern matching model for chip recognition, but similarly does not mention the problem of the difference between light sources.

  SUMMARY OF THE INVENTION It is an object of the present invention to provide a die bonder which can easily correct a machine difference in illumination output and can perform high-accuracy die positioning.

  Another object of the present invention is to provide a method of manufacturing a semiconductor device in which an adjustment time for correcting a machine difference of a die bonder is short and high-precision die bonding is possible.

In order to solve the above-described problems, the present invention provides an illumination system capable of emitting a light amount proportional to an output value, a camera capable of measuring an input level proportional to the light amount, an output control of the illumination system, and imaging by the camera. And a control unit for performing image processing of the obtained image, wherein the lighting system comprises a complex lighting system having a plurality of channels each capable of independently controlling output, and the control unit includes another die bonder. An image picked up by selecting the same number of regions as the number of the plurality of channels in the reference sample image included in the transplanted recipe data, and simultaneously irradiating light from each of the plurality of channels based on the recipe data. In, a region at the same position as the region selected in the reference sample image is selected, and the selected And each of the brightness range, from the correlation of the received light level of an image captured by the output value and the camera of the illumination system of the respective when irradiated with light by the illumination system independently of said each output of said each lighting system The value is determined.

Also, the present invention provides: (a) a step of selecting the same number of regions as the number of channels of the complex lighting system in a reference sample image included in recipe data transplanted from another die bonder; (b) based on the recipe data (C) selecting an area at the same position as an area selected in the reference sample image in an image captured by simultaneously irradiating light from the composite illumination system and measuring the brightness of each of the selected areas; step lighting of each illumination system system alone is irradiated with light by the illumination system independently of the output value and the each of the lighting system when irradiated with light to measure the received light levels of an image captured, the selection (d) and brightness of each area of the image, the lighting cis when irradiated with light by the illumination system independently of each of said plurality of channels A semiconductor device including an output value of the beam, the step of determining the output value of the illumination system of each of the composite lighting system from the correlation between the received light level of the image captured by irradiating light in the illumination system alone of the respective It is a manufacturing method of.

  The effects obtained by a representative embodiment of the invention disclosed in the present application will be briefly described as follows.

  In a die bonder that positions a die by image recognition, it is possible to easily realize a die bonder that easily corrects machine differences in a device illumination system and has high productivity.

  It is possible to provide a method of manufacturing a semiconductor device capable of performing a highly accurate die bonding with a short adjustment time for correcting a machine difference of a die bonder.

  Problems, configurations, and effects other than those described above will be apparent from the following description of the embodiments.

It is a figure showing the unit composition of the die bonder concerning one embodiment of the present invention. It is a figure showing the optical system composition of the die bonder concerning one embodiment of the present invention. It is a figure showing the control system composition of the die bonder concerning one embodiment of the present invention. It is a figure showing coaxial illumination of a die bonder concerning one embodiment of the present invention. It is a figure showing oblique light ring illumination of a die bonder concerning one embodiment of the present invention. It is a figure showing the dome illumination of the die bonder concerning one embodiment of the present invention. It is a figure showing oblique light bar illumination of a die bonder concerning one embodiment of the present invention. FIG. 3 is a diagram illustrating transmitted illumination of a die bonder according to an embodiment of the present invention. It is a figure showing a die positioning flow by a copying operation of a die bonder concerning one embodiment of the present invention. FIG. 2 is a diagram illustrating a pattern layout of a die according to an embodiment of the present invention. It is a figure showing a die positioning flow by a continuous construction operation of a die bonder concerning one embodiment of the present invention. FIG. 2 is a diagram illustrating a pattern layout of a die according to an embodiment of the present invention. It is a figure showing a die and a dicing groove concerning one embodiment of the present invention. FIG. 4 is a diagram illustrating a pattern layout and foreign matters of a die according to an embodiment of the present invention. It is a figure showing data communication between devices of a die bonder concerning one embodiment of the present invention. It is a figure showing data communication between devices of a die bonder concerning one embodiment of the present invention. It is a figure showing data communication between devices of a die bonder concerning one embodiment of the present invention. It is a figure showing the adjustment method of the lighting mounted in the die bonder. It is a figure showing the adjustment method of the lighting mounted in the die bonder. 5 is a graph showing the relationship between the output level of illumination mounted on a die bonder and the amount of emitted light. It is a figure showing compound lighting of a die bonder concerning one embodiment of the present invention. It is a figure showing compound lighting of a die bonder concerning one embodiment of the present invention. It is a figure showing data communication between devices of a die bonder concerning one embodiment of the present invention. FIG. 2 is a diagram illustrating a pattern layout of a die according to an embodiment of the present invention.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In each drawing and each embodiment, the same or similar components are denoted by the same reference numerals, and detailed description of overlapping portions will be omitted.

  First, a schematic configuration of the die bonder of the present embodiment will be described with reference to FIGS. FIG. 1 is a front view showing the configuration of the die bonder. FIG. 2 shows a configuration of an optical system of the die bonder, and FIG. 3 shows a configuration of a control system.

  As shown in FIG. 1, the die bonder 1 of the present embodiment includes a frame loader 2, a preform head 3, a wafer holder 4, a bonding head 5, and a camera image display monitor 6 as main components.

  The substrate substrate 15 conveyed from the frame loader 2 to the preform section (preform head 3) is imaged by a camera mounted on the preform section optical system 7, and is positioned based on the image. The adhesive (paste) is applied to the positioned substrate substrate 15 by the paste application unit 8 at the preform head. This adhesive (paste) application step may be a film attaching step or may be omitted depending on the type of the target semiconductor product.

  The substrate substrate 15 is further transported to a bonding section (bonding head 5). Thereafter, an image is taken by a camera mounted on the bonding unit optical system 10, and positioning is performed based on the image. The die picked up by the pickup / bonding unit 11 from the wafer holder unit 4 is bonded to the positioned substrate substrate 15.

  In the wafer section, the wafer 14 is transported while being bonded and fixed on a dicing tape 13 attached to the wafer ring 12, and individual dies in the wafer 14 are positioned by the wafer section optical system 9.

  At the time of applying the adhesive (paste), bonding, and picking up, the substrate substrate 15 and the wafer 14 are imaged by the respective cameras in accordance with each process. Using image processing based on the captured image, detection and inspection of a defective mark are performed in addition to die positioning.

  FIG. 3 shows a simple block diagram of the device control system of the die bonder 1. Image data captured by each of a bonding camera, a preform camera, and a wafer camera is stored in a storage device via an image capturing device (capture board). The storage device includes an auxiliary storage device such as a main storage device RAM (Random Access Memory) and an HDD (Hard Disc Drive).

  The stored image data is subjected to image processing in a control and arithmetic unit CPU (Central Processing Unit) by programmed software, and positioning of a work (substrate substrate or die) is performed.

  Based on the position of the work calculated by the control / arithmetic unit CPU, a drive unit such as an XY table is moved by software through an I / O signal control device including a motor control device, a sensor, and a switch control. The I / O signal control device also controls motors, sensors, lighting devices, and the like.

  With this process, the die on the wafer is positioned, the pickup / bonding unit 11 is operated by the drive unit, and the die is bonded on the substrate substrate 15. The camera used for imaging the workpiece is a grayscale image, a color image, or the like, and quantifies the light intensity.

  The image capturing device and the I / O signal control device are mounted on the input / output device together with the touch panel, the mouse, the monitor, and the like.

  Next, a variation of an illumination system (illumination device) mounted on the die bonder will be described with reference to FIGS. 4A to 4E.

  FIG. 4A shows an example of the coaxial illumination 17. The light radiated from the light source 18 is reflected 90 ° by the half mirror 19 and is indirectly radiated to the work (observation target) 20, and the camera 16 provided coaxially with the direction of light irradiation on the work causes the half mirror 19 to move. An image of the work 20 is taken through. It is suitable for imaging when the work is planar and is specularly reflected.

  FIG. 4B is an example of the oblique ring illumination 21. A ring-shaped illumination system (illumination device) is provided between the camera 16 and the work 20, and the light emitted from the light source 18 is directly applied to the work 20, and the work 20 is imaged from between the rings. Since the work 20 can be irradiated with light from all directions, a uniform captured image without shadow can be obtained.

  FIG. 4C is an example of the dome illumination 22. A dome-type illumination system (illumination device) is provided between the camera 16 and the work 20, and the light emitted from the light source 18 is directly applied to the work 20, and the work 20 is imaged through an opening provided at the top of the dome. The light source has a dome shape and is suitable for imaging when the workpiece is nearly spherical.

  FIG. 4D is an example of oblique light bar illumination 23. Four oblique light bars 23 are provided between the camera 16 and the work 20 so that the work 20 can be irradiated with light from four directions. It is suitable for imaging a work having a matte surface.

  FIG. 4E is an example of the transmitted illumination 24. An illumination system (illumination device) is provided on the opposite side of the camera 16 with the work 20 interposed therebetween, and the light emitted from the light source 18 is applied to the work 20, and the light transmitted through the work 20 is imaged by the camera 16.

  In the die bonder of the present embodiment, an illumination system is constructed by combining a plurality of types of the illumination systems (illumination devices) described above with reference to FIGS. 4A to 4E according to a subject (work).

  The light source color may be white in addition to the single color. Further, it is preferable to use a light source capable of adjusting the output by a linear change. For example, there is a system for adjusting the amount of light with a pulse dimming duty of an LED (Light Emitting Diode).

  Next, a method (algorithm) of performing die positioning based on an image captured by a camera will be described. In the die bonder of the present embodiment, a template correlation is mainly used to perform an operation using a generally known normalized correlation equation, and the result is set as a coincidence rate. The template matching includes a copying operation for reference learning and an operation for continuous construction.

  FIG. 5A shows a copying operation of reference learning. First, the reference sample is transported to the image acquisition unit, and the image of the reference sample is acquired by the camera. A unique portion (a characteristic pattern compared to other patterns as shown in FIG. 5B) is selected from the captured image by an input device (human interface) such as a touch panel or a mouse. Subsequently, the positional relationship (coordinates) between the selected area (work image) and the sample is stored in the storage device. Finally, the image (template) of the selected area is stored in the storage device.

  FIG. 6A shows a continuous construction operation. First, a member (work) for continuous construction is conveyed to an image acquisition unit, and an image of the member for continuous construction is acquired by a camera. Subsequently, the previously acquired template image is compared with the acquired images of the members for continuous construction, and the coordinates of the most similar portion are calculated. Finally, the calculated coordinates and the coordinates measured by the reference sample are compared to calculate the position of the continuous starting member. For example, as shown in FIG. 6B, an offset between a position at the time of registration of the template image and a similar portion of the member for continuous construction is calculated.

  In addition to the template matching described above, there is a method of positioning a die by detecting a dicing groove. As shown in FIG. 7, the die 25 and the surrounding dicing line (dicing groove 26) are imaged by a camera, and the dicing line (dicing groove 26) is detected by binarizing the captured image or using a contour extraction filter. I do. In this method, the contour of the die 25 is determined from the position of the dicing line (dicing groove 26), and the center of the die 25 is obtained.

  The die bonder of this embodiment can also determine the presence or absence of a defective mark on a die and the presence or absence of a foreign substance by using a camera and an illumination system (illumination device). As shown in FIG. 8, by comparing the brightness of the acquired image of the normal product with the brightness of the acquired image when there is a defective mark or foreign matter 27, the presence or absence of a defective mark or foreign matter is detected (determined) from the difference in brightness. It can be performed.

  Next, with reference to FIGS. 9A to 9C, a description will be given of a variation of a method in which conditions are set in advance by one apparatus in a semiconductor manufacturing line, and the created recipe data is transferred to another apparatus.

  The images used for die positioning and defect mark / foreign matter inspection described above, parameters related to images, coordinates, lighting output values, etc. are maintained for each product type as a group of recipe data for starting each product. Is done. The group data is called recipe data. As for the recipe data, data generated by another device can be transplanted and started between devices whose machine differences have been corrected.

  FIG. 9A shows an example in which the recipe data is transferred from the device A to the device B or from the device B to the device A by the external storage medium 28 such as a USB memory or a CD-ROM. As shown in FIG. 9A, by transferring the recipe data between the devices using the external storage medium 28, the transfer of the recipe data becomes possible without providing communication equipment between the devices in the semiconductor manufacturing line.

  FIG. 9B shows a method of connecting the devices by a communication means such as a wired LAN or a wireless LAN and transplanting the recipe data. Although it is necessary to provide communication means between the devices, there are advantages such as automatic transfer of recipe data.

  FIG. 9C shows an example in which the device A and the device B are connected via a personal computer (PC) such as a host computer by a wired LAN or a wireless LAN. Generally, a semiconductor manufacturing line is provided with a process management system for monitoring and controlling semiconductor manufacturing devices in the line, and it is also possible to transfer recipe data via this process management system.

  Here, a problem in transplanting recipe data in the conventional die bonder will be described in detail. As described above, a plurality of die bonders are installed in a semiconductor manufacturing line. In many cases, there are machine differences between die bonders. In particular, if there is a difference between the lighting systems (lighting devices), when the recipe data is transplanted between the devices, a decrease in the matching score (matching rate) or a deviation of the inspection determination value occurs.

  It is conceivable to perform the correction using a jig for the machine difference correction of the illumination output. FIGS. 10A and 10B show an example of the output machine difference adjustment between devices using a jig. FIG. 10A shows a method of directly measuring and adjusting the luminous intensity using an illuminance measuring device (light amount measuring device). An illuminance measuring device 29 is installed on the work 20 to measure the amount of irradiation light from the light source 18 and adjust the illumination output. FIG. 10B shows a method of correcting the illumination output using a jig. A reflection jig 30 is set on the work 20, the light emitted from the light source 18 is applied to the reflection jig 30, and the reflected light is imaged by the camera 16 to adjust the illumination output.

  Further, the difference in illumination output varies with time. Light sources, especially LEDs, have the property of deteriorating with time, and even with devices that have been adjusted at the time of shipment, the amount of light changes over time. In order to correct the difference between the illumination outputs, it is necessary to make adjustments by the methods shown in FIGS. 10A and 10B, but in any case, periodic maintenance is required.

  Further, when an illuminance measuring device is used as shown in FIG. 10A, it is necessary to keep the measurement environment such as the positional relationship with the light source and the orientation of the measuring device constant, and it is not easy to maintain the reliability of the measured values. Therefore, it cannot be guaranteed that the image is completely harmonized with the final imaging result.

  Further, when a reflection jig is used as shown in FIG. 10B, there is an advantage that the reflection jig can be reflected in a final imaging result, but it is necessary to manage a change with time of the jig such as a stain on the surface. Although these methods seem to be able to be adjusted at first glance in the entire output area, matching the machine difference having a deviation in the linear graph of the output value (output level) -the amount of emitted light is performed by adjusting the slope as shown in FIG. And the intercept at the same time, which causes a problem such as a decrease in output gradation, and is practically impossible.

  Therefore, the adjustment must be made specifically for a certain portion of the output area. If it produces samples with different reflectivity, it will eventually have to be readjusted. In other words, adjustment according to the type of production product is required each time.

  In addition, in the die bonder, the device lighting system must be equipped with multiple types of lighting systems (channels) for one camera in order to cover the variety of products, process adaptation, and differences in algorithms such as positioning and inspection. Is common. For example, as shown in FIG. 12A, a coaxial illumination 17 and an oblique light illumination 21 are simultaneously mounted.

  Therefore, when correcting the illumination device difference by the method described above, it is necessary to adjust each channel. In addition, since the lighting system is used in combination, it is necessary to hold the output or the reflectance when each light is irradiated alone. In the absence of this, when correcting the illumination output value only with a stored image captured using multiple light sources, it is necessary to sequentially change the combination of the illumination of multiple channels and search for a combination that matches the brightness in a roller manner. There is also a problem that the adjustment time becomes longer in proportion to the integrated value of the number of channels.

  Thus, the die bonder of the present embodiment is configured so that the adjustment of the illumination system (illumination device) can be easily performed in a short time without the need for the adjustment jig as shown in FIGS. 10A and 10B. Hereinafter, a specific description will be given.

  As an example of the illumination system, a combined illumination system of the coaxial illumination 17 and the oblique illumination 21 shown in FIG. 12A will be described. Further, the communication between the device A for creating the recipe data and the device B to which the recipe data is to be transferred is performed via the HOST management system (PC) shown in FIG.

  In the present embodiment, as shown in FIG. 13, a die bonder (device A) for creating recipe data and a die bonder (device B) for transplanting the created recipe data are connected by a HOST management system (PC). The data is transferred from the device A to the device B via the HOST management system (PC). The transferred recipe data includes a template image (reference sample image) used for template matching, coordinate data, illumination output, and the like.

The devices A and B in FIG. 13 are equipped with a camera for recognizing a die (semiconductor chip) in a wafer and an illumination system (illumination device). FIG. 12A shows an example. Figure 12 A is a camera 16, coaxial illumination 17, a camera illumination system 31 consisting of oblique ring illumination 21, coaxial illumination 17 and oblique ring illumination 21 each independently two systems of dimming channels (output controller 32, 33) have.

  As shown in FIG. 13, the recipe data created by the device A is sent to the device B via the HOST management system (PC). At this time, the HOST management system (PC) may hold (save) the recipe data for a certain period of time.

  The device B captures the same product by itself based on the illumination output value of the recipe data received from the device A via the HOST management system (PC). At this time, there is a case where the same image as the device A cannot be obtained by the device B due to a difference in illumination output between the device A and the device B. For example, as shown by the shading of the color of the die 25 in FIG. 13, the appearance of the product is different due to the effect of the difference in the illumination output.

  In other words, when pattern matching is performed by the device B using the transplant data, even for similar products, the matching difference, that is, the matching score decreases due to this machine difference, and the durability against unexpected changes in the production process. (Robustness) may be reduced, and a case may occur where image algorithms such as die positioning cannot be processed normally.

  The following processing is performed in the device B to which the recipe data is transplanted in order to solve the problem of the difference between the lighting systems.

  First, in the transplanted template image data (hereinafter, referred to as pattern image A), two points (regions) where the light receiving level has not exceeded the upper limit are selected. The number of points (the number of areas) to be selected requires the same number of points as the number of channels of the lighting system.

  Next, it is confirmed from the transplanted recipe data that the illuminance at the same position in the product image captured by the device B (hereinafter, referred to as an acquired image B) does not exceed the upper limit of the light receiving level. FIG. 14 conceptually shows the selection of a point (region). Two points (regions) of the image data transplanted from the device A are selected, and a point (region) at the same position in the acquired image B is selected.

  Subsequently, the following definitions are made for the selected two points.

  (1) Let P1 and P2 be the respective points.

  (2) Let C1 and C2 be the channels of each lighting system.

(3) Let the brightness at the positions corresponding to P1 and P2 of the pattern image A be GVP1 and GVP2, respectively. (GV: Grayscale Value)
(4) The light receiving level of the image captured when each point is irradiated only with the oblique ring illumination by the device B is set to LC1P1, LC1P2, and the output is set to OC1.

  (5) The light receiving level of the image captured when each point is illuminated only by the coaxial illumination by the device B is set to LC2P1 and LC2P2, and the output is set to OC2.

  (6) The illumination output of the oblique light ring when obtaining an image having the same brightness as that of the device A is XC1, and the coaxial illumination output is XC2.

  Under predetermined conditions described below, XC1 and XC2 satisfy the relations of Expressions (1) and (2).

  Under the same conditions, the values in parentheses in Equations (1) and (2) are constants. Therefore, solving the simultaneous equations composed of the above two equations, that is, XC1 and XC2 from Equations (1) and (2) By obtaining this, it is possible to derive the illumination outputs XC1 and XC2 for obtaining the same image as the device A by the device B.

  In order to obtain XC1 and XC2 by the above-described processing, first, it is premised that the target lighting system is configured by a lighting unit that can emit a light amount proportional to the output numerical value. Mainly, LED pulse dimming system.

  It is also assumed that the camera that captures an image is a camera (camera system) that can measure an input level proportional to the amount of light. For example, it does not have a correction function such as gamma correction.

  FIG. 12B shows a coaxial illumination 17, a pair of oblique light bar illuminations 23 arranged opposite to each other in the substrate transfer direction (X direction) of the die bonder, and an arrangement opposite to each other in a direction orthogonal to the substrate transfer (Y direction). This is an example in which a pair of oblique light bars 23 are simultaneously mounted. The coaxial illumination 17, the oblique light bar illumination 23 in the left-right direction (X direction), and the oblique light bar illumination 23 in the front-rear direction (Y direction) are individually output by three independent dimming channels (output controllers 32, 33, 34). Controlled.

  At the bond position of the die bonder, it is preferable to dispose the oblique light bar illumination 23 in front, rear, left and right, and dispose the coaxial illumination 17 on the upper part in order to obtain a more accurate captured image. However, the direction (Y direction) orthogonal to the transport direction (X direction) of the die bonder is the moving direction of the bonding head, and it is difficult to arrange the oblique light bar illumination at the same height (Z direction). Therefore, as shown in FIG. 12B, the oblique light bar illumination 23 in the Y direction is arranged so as to be displaced in the vertical direction (Z direction) from the oblique light bar illumination 23 in the X direction. This is to reduce the influence of the operation of the bonding head.

  The oblique light bar illumination 23 arranged in the X direction and the oblique light bar illumination 23 arranged in the Y direction have different distances to the work (die). Therefore, the oblique light bar illumination 23 in the X direction and the oblique light bar illumination 23 in the Y direction are different from each other. It must be controlled by another output controller. Therefore, output control of three channels of the output controller 34 of the oblique light bar illumination 23 in the X direction, the output controller 33 of the oblique light bar illumination 23 in the Y direction, and the output controller 32 of the coaxial illumination 17 is required.

  As shown in FIG. 12B, by mounting a three-channel illumination system, the shading of a workpiece (die) to be imaged is further reduced than in a two-channel combined illumination system, so that a more accurate captured image is obtained. can do.

  Note that the number of control channels is not limited to two or three. For example, even in the arrangement of the illumination system as shown in FIG. 12B, each of the left and right direction (X direction) and the front and rear direction (Y direction) Can be controlled by individual channels. In this case, there are five channels including the control channels of the coaxial illumination 17.

  The type of illumination to be combined is selected, for example, from the variations shown in FIGS. 4A to 4E. An optimal combination of illuminations is selected based on the degree of freedom of illumination arrangement (restriction condition) of the work (die) recognition position.

  In the case of configuring a complex lighting system including three or more channels of lighting systems, the same number of expressions as the number of channels can be obtained as the expression indicating the relationship between the illumination outputs XC1 and XC2. That is, in an illumination system having n channels, n equations, that is, equations (1), (2),..., (N) are obtained.

  Also in this case, by solving a simultaneous equation composed of n equations, that is, by finding XC1, XC2, and XCn from the n equations, the illumination output XC1, XC2 and XCn can be derived.

  As described above, according to the present embodiment, when a recipe data is shared by a plurality of die bonders in a semiconductor manufacturing line, there is a difference in lighting equipment between the die bonder that created the recipe data and the die bonder that transplants the recipe data. Even if there is, the same captured image can be obtained without the need for adjustment work using a jig or the like. As a result, it is possible to prevent a decrease in the matching score for positioning and a shift in the determination value of the inspection system due to the difference in the lighting device, and it is possible to improve the operation rate of the die bonder and the productivity of the semiconductor manufacturing line.

  In the above embodiment, an example in which recipe data is shared between a plurality of different apparatuses has been described. However, the present invention is also applicable to a case where one die bonder determines each illumination value of an illumination system having a plurality of channels. can do. A captured image is acquired by the illumination system of each channel, a selection area is selected for each captured image, and the illumination outputs XC1, XC2,... Of each illumination system are obtained from the simultaneous equations of the above equations (1) and (2). By deriving XCn, it is possible to calculate the number of illumination values (illumination output) of each illumination system.

  Note that the present invention is not limited to the above-described embodiment, and includes various modifications. For example, the above-described embodiments have been described in detail in order to explain the present invention in an easy-to-understand manner, and are not necessarily limited to those having all the configurations described above. Further, a part of the configuration of one embodiment can be replaced with the configuration of another embodiment, and the configuration of one embodiment can be added to the configuration of another embodiment. Also, for a part of the configuration of each embodiment, it is possible to add, delete, or replace another configuration.

  DESCRIPTION OF SYMBOLS 1 ... Die bonder, 2 ... Frame loader, 3 ... Preform head, 4 ... Wafer holder part, 5 ... Bonding head, 6 ... Camera image display monitor, 7 ... Preform part optical system, 8 ... Paste coating unit, 9 ... Wafer part Optical system, 10: bonding unit optical system, 11: pickup / bonding unit, 12: wafer ring, 13: dicing tape, 14: wafer, 15: substrate substrate, 16: camera, 17: coaxial illumination, 18: light source, 19: half mirror, 20: work (observation target), 21: oblique ring illumination, 22: dome illumination, 23: oblique illumination, 24: transmission illumination, 25: die, 26: dicing groove, 27: foreign matter, 28 ... External storage medium, 29 ... Illuminance measuring instrument, 30 ... Reflection jig, 31 ... Camera illumination system, 32,33,34 ... Exit Controller.

Claims (12)

An illumination system that can emit light in proportion to the output value,
A camera that can measure the input level proportional to the amount of light,
A control unit that performs output control of the illumination system and image processing of an image captured by the camera, and a die bonder,
The lighting system comprises a complex lighting system having a plurality of channels each capable of independently controlling output,
The control unit selects the same number of regions as the plurality of channels in the reference sample image included in the recipe data transplanted from another die bonder,
In the image captured by irradiating light simultaneously from the illumination system of each of the plurality of channels based on the recipe data , select an area at the same position as the area selected in the reference sample image,
From the correlation between the brightness of each of the selected areas of the image and the output value of each of the illumination systems and the light reception level of the image captured by the camera when irradiating light with each of the illumination systems alone, A die bonder for determining an output value of each lighting system. The die bonder according to claim 1, wherein
The lighting system is a combined lighting system having two channels;
A die bonder, wherein the lighting system of each of the two channels is a different type of lighting system. The die bonder according to claim 1, wherein
The lighting system is a complex lighting system having three channels;
A die bonder, wherein the lighting system of each of the three channels includes at least two different types of lighting systems. The die bonder according to any one of claims 1 to 3,
The composite bond system is a die bonder, which is a combination of any of coaxial illumination, oblique ring illumination, dome illumination, oblique bar illumination, and transmission illumination. The die bonder according to any one of claims 1 to 4, wherein
A die bonder, wherein the position of the die is determined by irradiating light from the illumination system with the determined output value of the illumination system and imaging the die with the camera. The die bonder according to any one of claims 1 to 4, wherein
A die bonder that irradiates light from the illumination system based on the determined output value of the illumination system and captures an image of the die with the camera, thereby detecting a pattern of the die or detecting a foreign substance. A semiconductor device manufacturing method including the following steps;
(A) selecting the same number of regions as the number of channels of the combined lighting system in a reference sample image included in recipe data transplanted from another die bonder;
(B) selecting an area at the same position as the area selected in the reference sample image in an image captured by simultaneously irradiating light from the complex lighting system based on the recipe data, and adjusting the brightness of each of the selected areas; Measuring,
(C) measuring an output value of the illumination system when the illumination system alone irradiates light and a light reception level of an image captured by irradiating light with the illumination system alone;
(D) the brightness of each of the selected areas of the image, the output value of the lighting system when each of the complex lighting systems is illuminated alone, and the light of the lighting system alone. Determining an output value of each illumination system of the complex illumination system from a correlation with a light reception level of an image captured by irradiation. A method for manufacturing a semiconductor device according to claim 7, wherein
The lighting system is a combined lighting system having two channels;
The method of manufacturing a semiconductor device, wherein the lighting systems of the two channels are different types of lighting systems. A method for manufacturing a semiconductor device according to claim 7, wherein
The lighting system is a complex lighting system having three channels;
The method of manufacturing a semiconductor device, wherein the lighting system of each of the three channels includes at least two different types of lighting systems. The method for manufacturing a semiconductor device according to claim 8, wherein:
The method of manufacturing a semiconductor device, wherein the combined illumination system is a combination of any of coaxial illumination, oblique ring illumination, dome illumination, oblique bar illumination, and transmission illumination. The method for manufacturing a semiconductor device according to claim 7, wherein:
A method of manufacturing a semiconductor device, comprising: irradiating light from the lighting system according to the determined output value of the lighting system, and imaging the die with a camera, thereby positioning the die. The method for manufacturing a semiconductor device according to claim 7, wherein:
A method of manufacturing a semiconductor device, comprising: irradiating light from the illumination system based on the determined output value of the illumination system and capturing an image of the die with a camera to detect a pattern of the die or a foreign substance.

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