JP6655779B2 - Illumination device for imaging in electronic component mounting apparatus and electronic component mounting apparatus - Google Patents

Description

  The present invention relates to an illumination device for imaging and an electronic component mounting device used for imaging an object to be recognized in an electronic component mounting device for mounting an electronic component on a substrate.

  2. Description of the Related Art Conventionally, an electronic component mounting apparatus includes a board recognition camera that images a recognition mark provided on a board surface for the purpose of identifying and aligning the board, and an illumination device that irradiates the recognition mark with illumination light for imaging. It is provided integrally with the mounting head. In recent years, with the miniaturization and high performance of electronic equipment, the height dimension of the mounting head has become more restrictive, and as a result, the board recognition camera and the lighting device that are provided integrally with the mounting head also take into account that (For example, Patent Document 1).

  The illuminating device disclosed in Patent Literature 1 mainly includes an illuminating substrate disposed between a substrate recognition camera and a substrate to be imaged. The illumination substrate is arranged in parallel with the substrate to be imaged, and a plurality of light sources for irradiating illumination light are provided on a surface of the illumination substrate around the opening provided for imaging and facing the substrate to be imaged. It has a configuration.

JP 2008-205226 A

  2. Description of the Related Art In recent years, with the demand for improved functions of electronic component mounting apparatuses, the range of objects required as image pickup targets of a board recognition camera has been widened. As one of them, there are characters indicating the kind of parts and the like stamped with a laser or the like on the surface of electronic parts or the like supplied by a part supply device such as a tray or a tape feeder. Such characters have a problem that it is difficult to obtain contrast with a background portion by conventional illumination for recognition mark recognition including Patent Document 1, and it is difficult to recognize characters by a board recognition camera.

  Accordingly, an object of the present invention is to provide a lighting device for imaging and an electronic component mounting device in an electronic component mounting device capable of recognizing engraved characters and the like by illuminating the surface of the electronic component with illumination light. And

The illumination device for imaging in the electronic component mounting apparatus of the present invention is provided integrally with a mounting head that mounts the electronic component on the substrate, and is used for imaging in the electronic component mounting device that irradiates illumination light to an object to be imaged by a camera. A lighting device, wherein a flat illumination substrate is located between the substrate and the camera substantially parallel to the surface of the substrate, and a light source unit is disposed on a surface on a side facing the substrate. An illumination control unit that controls the light source unit, wherein the illumination device is arranged side by side in a first direction in a horizontal plane with respect to the mounting head, and the light source unit has an imaging optical axis of the camera. A first light source unit disposed around the penetrating imaging opening, and a second light source unit disposed on both outer sides in a second direction orthogonal to the first direction of the first light source unit in a horizontal plane. and a second light source unit, the first light source unit The second light source unit includes a plurality of first individual light sources, and the second light source unit includes a plurality of second individual light sources. The density at which the second individual light sources are arranged is such that the first individual light sources are It is higher than the density to be arranged, and the illumination control unit causes the second light source unit to emit light at the time of character recognition .
An illumination device for imaging in another electronic component mounting apparatus of the present invention is provided integrally with a mounting head that mounts an electronic component on a substrate, and is used in an electronic component mounting device that irradiates illumination light to an object to be imaged by a camera. An illumination device for imaging, comprising: a plate-shaped illumination device that is positioned substantially parallel to a surface of the substrate between the substrate and the camera, and a light source unit is disposed on a surface facing the substrate. A lighting control unit configured to control the light source unit, wherein the lighting device is arranged side by side in a first direction in a horizontal plane with respect to the mounting head, and the light source unit includes an imaging light of the camera. A first light source unit disposed around an imaging opening through which an axis passes; and a first light source unit disposed on both outer sides in a second direction orthogonal to the first direction in a horizontal plane of the first light source unit. A second light source unit, the second light source Is composed of a plurality of second individual light sources, and the second individual light sources are arranged at both ends in the first direction of the second light source unit to the imaging optical axis side of other portions. The illumination control unit causes the second light source unit to emit light during character recognition .

  An electronic component mounting apparatus according to the present invention includes the illumination device for photographing in the electronic component mounting apparatus according to the present invention, and mounts the electronic component on the substrate.

  According to the present invention, it is possible to illuminate the surface of an electronic component with illumination light to make it possible to recognize engraved characters and the like.

1 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention. Structure explanatory drawing of the illumination device for imaging in the electronic component mounting apparatus of one embodiment of the present invention FIG. 1 is an explanatory diagram of a lighting device for imaging provided in an electronic component mounting apparatus according to an embodiment of the present invention as viewed from below. Explanatory drawing of the function of the plate-shaped member of the illumination device for imaging in the electronic component mounting apparatus of one embodiment of the present invention. Explanatory view using a Fresnel lens as a plate-like member of an illumination device for imaging in an electronic component mounting apparatus according to an embodiment of the present invention. 1 is a block diagram illustrating a configuration of a control system of an electronic component mounting apparatus according to an embodiment of the present invention.

  Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings. The configuration, shape, and the like described below are examples for explanation, and can be appropriately changed according to the specifications of the electronic component mounting device and the lighting unit (the lighting device for imaging). In the following, corresponding elements in all the drawings are denoted by the same reference numerals, and redundant description will be omitted. In FIG. 1 and in a part to be described later, an X direction (horizontal direction in FIG. 1) of the substrate transport direction and a Y direction (vertical direction in FIG. 1) orthogonal to the substrate transport direction are defined as two axial directions orthogonal to each other in a horizontal plane. Is shown. In FIG. 2 and a part described later, the Z direction is indicated as a height direction orthogonal to the horizontal plane. The Z direction is a vertical direction or a perpendicular direction when the electronic component mounting apparatus is installed on a horizontal plane.

  First, the configuration of the electronic component mounting apparatus 1 will be described with reference to FIG. In FIG. 1, a substrate transfer mechanism 2 is disposed on the upper surface of a base 1a in the X direction. The board transport mechanism 2 transports the board 3 on which components are to be mounted, and positions and holds the board 3 at a work position by the component mounting mechanism described below. Component supply units 4A and 4B for supplying components mounted on the substrate 3 are provided on both sides of the substrate transport mechanism 2.

  The tray feeder 5 is arranged in the component supply unit 4A. The tray feeder 5 moves the pallet 7 on which the trays 6 (here, two) for storing the electronic components P in a lattice arrangement to a component supply position for supplying the electronic components P to a component mounting mechanism described below. A plurality of tape feeders 8 are arranged in parallel in the component supply unit 4B. The tape feeder 8 feeds the electronic component P to the component mounting mechanism by feeding the carrier tape holding the electronic component P at a pitch.

  A Y-axis beam 9 having a linear drive mechanism is disposed at one end in the X direction on the upper surface of the base 1a. To the Y-axis beam 9, two X-axis beams 10 similarly having a linear drive mechanism are movably coupled in the Y direction. A mounting head 11 is mounted on each of the two X-axis beams 10 so as to be movable in the X direction. The mounting head 11 is provided with a plurality of suction nozzles 11a (see FIG. 3).

  By driving the Y-axis beam 9 and the X-axis beam 10, the mounting head 11 moves horizontally (X direction, Y direction) between the component supply units 4A, 4B and the substrate 3 held by the substrate transport mechanism 2. The electronic component P supplied by the component supply units 4A and 4B is taken out by the suction nozzle 11a and mounted on the board 3. That is, the Y-axis beam 9 and the first X-axis beam 10 constitute a head moving mechanism 12 that moves the mounting head 11 in the X and Y directions. Further, the Y-axis beam 9, the X-axis beam 10, and the mounting head 11 constitute a component mounting mechanism for mounting the electronic component P on the substrate 3 by the suction nozzle 11a.

  A component recognition camera 13 is provided between the component supply units 4A and 4B and the board transport mechanism 2. When the mounting head 11 that has taken out the electronic component P from the component supply units 4A and 4B moves above the component recognition camera 13, the component recognition camera 13 captures an image of the electronic component P held by the mounting head 11. Thereby, identification and position recognition of the electronic component P held by the mounting head 11 are performed.

  A board recognition camera 14 is mounted on the mounting head 11 and is located on the lower surface side of the X-axis beam 10 and moves integrally with the mounting head 11. As the mounting head 11 moves, the board recognition camera 14 moves above the board 3 positioned and held by the board transport mechanism 2 to image the recognition marks 3a (four in this case) provided on the surface of the board 3. I do. Thus, the position of the substrate 3 is recognized. The board recognition camera 14 moves above the electronic component P supplied to the component supply units 4A and 4B and captures an image of the electronic component P. Thus, the position of the electronic component P is recognized, and characters, polar marks, and the like formed by laser engraving or the like on the upper surface of the electronic component P are recognized.

  Next, the configuration of the board recognition camera 14 will be described with reference to FIG. FIG. 2A is a schematic view of the board recognition camera 14 arranged side by side in the Y direction (first direction in a horizontal plane) with respect to the mounting head 11 as viewed in the Y direction. As shown in FIG. 2A, the substrate recognition camera 14 has a configuration in which a light receiving unit 15 including a light receiving element 15a such as a CCD or a CMOS sensor is coupled to an optical unit 16 including lenses 16a and 16b and a prism 16c. It has become. The light receiving unit 15 is coupled to the optical unit 16 with the imaging optical axis a in a horizontal position. The imaging light incident vertically and upward from below via the lens 16b on the imaging object side enters the light receiving element 15a via the lens 16a after being refracted in the horizontal direction by the prism 16c, and is at a predetermined focal position. An image of the imaging target is formed on the light receiving element 15a.

  An illumination unit 20 (illumination device for imaging) that irradiates illumination light to an imaging target is provided below the optical unit 16. The illumination unit 20 is mainly composed of a flat illumination substrate 21 having a light source unit 22 disposed on a lower surface side. In a state where the substrate 3 to be imaged is imaged by the substrate recognition camera 14, the illumination unit 20 is located at a position substantially parallel to and opposed to the substrate 3 to be imaged. Therefore, in this state, the illumination board 21 is positioned substantially parallel to the surface of the board 3 between the board 3 and the board recognition camera 14 (camera), and the light source 21 The part 22 is arranged.

  FIG. 2B shows the lighting board 21 viewed from below. The illumination board 21 has an imaging opening 21 a formed at a position where the imaging optical axis a of the board recognition camera 14 penetrates. A central illumination light source 22a (first light source) is arranged around the opening 21a. Outside illumination light sources 22b (second light sources) are disposed on both outer sides in the X direction of the central illumination light source 22a. That is, the light source unit 22 includes a central illumination light source unit 22a (first light source unit) disposed around an imaging opening 21a through which the imaging optical axis a of the board recognition camera 14 (camera) penetrates, An external illumination light source unit 22b (second light source unit) is provided on both outer sides of the light source unit 22a in the X direction (a second direction orthogonal to the first direction in the horizontal plane).

  The central illumination light source section 22a mainly has a large difference in reflectance between the object to be imaged and its background portion, such as a recognition mark 3a provided on the surface of the substrate 3, and has a reflection direction irradiated with illumination light in the vertical direction (Z direction). It is used for imaging an imaging target in which contrast between the imaging target and a background portion can be easily obtained by light. On the other hand, the outer illumination light source section 22b mainly has a small difference in reflectance between an imaging target and its background, such as characters engraved with laser on the surface of the electronic component P, and has contrast in illumination light in the vertical direction (Z direction). Is used for imaging an imaging target that is difficult to take.

  When the difference in reflectance between the imaging target and the background part is small, the minute contrast of the reflected light is canceled out by the vertical component (the component in the Z direction) of the incident illumination light, and the imaging target and the background part cannot be distinguished. In such a case, by illuminating the imaging target with illumination light having a horizontal component (a component in the X and Y directions) as a main component and a small vertical component (a component in the Z direction), a large contrast capable of distinguishing the imaging target from a background portion is provided. Can be obtained. Therefore, it is desirable that the illumination light emitted from the outer illumination light source unit 22b has a large horizontal component and a small vertical component.

  In FIG. 2B, the central illumination light source unit 22a (first light source unit) includes a plurality of central LEDs 23a (first individual light sources), and outer illumination light source units 22b on both outer sides (second light source unit). ) Are composed of a plurality of outer LEDs 23b (second individual light sources). The average value of the pitch Lxa in the X direction of the central LED 23a of the central illumination light source unit 22a is wider than the average value of the pitch Lxb in the X direction of the outer LED 23b of the outer illumination light source unit 22b. Similarly, the average value of the pitch Lya in the Y direction of the center LED 23a of the central illumination light source unit 22a is wider than the average value of the pitch Lyb in the Y direction of the outer LED 23b of the outer illumination light source unit 22b.

  That is, the density at which the outer LEDs 23b (second individual light sources) of the outer illumination light source unit 22b are arranged is higher than the density at which the center LEDs 23a (first individual light sources) of the central illumination light source unit 22a are arranged. As a result, the outer illumination light source unit 22b emits strong illumination light from a narrow area, and reduces the vertical component (the component in the Z direction) of the illumination light on the imaging target and increases the horizontal component (the component in the X direction). it can. For this reason, even if the contrast with the background portion is hard to be obtained, for example, a character or the like that is laser-engraved on the upper surface of the electronic component P can be recognized by the board recognition camera 14.

  In FIG. 2B, both ends in the Y direction (first direction) of the outer outer illumination light source portions 22b (second light source portions) on both outer sides indicated by a broken line frame B are closer to the imaging optical axis a than the other portions. The outer LED 23b (second individual light source) is arranged up to the side. Accordingly, the outer illumination light source unit 22b can increase the horizontal component (X-direction component) of the illumination light, and can easily recognize an imaging target that has a low contrast with the background portion.

  In FIG. 2B, a plate-like plate member 24 that transmits illumination light emitted from the outer illumination light source unit 22b is disposed below the outer illumination light source unit 22b in a replaceable manner with a screw 25. I have. That is, the illumination unit 20 further includes a replaceable plate-shaped member 24 that transmits illumination light emitted from the outer illumination light source unit 22b between the outer illumination light source unit 22b (second light source unit) and the substrate 3. Have. In the example shown in FIG. 2, the plate-like member 24 is divided into two and has a shape only below the outer illumination light source portions 22 b on both outer sides, but the plate-like member 24 is formed of the central illumination light source portion 22 a. The shape may also exist below.

  Next, the positional relationship between the mounting head 11 and the lighting unit 20 will be described with reference to FIG. FIG. 3 is a schematic view of the mounting head 11 moving in the X direction and closest to the Y-axis beam 9 as viewed from below. The illumination unit 20 is arranged below the board recognition camera 14 arranged in the Y direction with respect to the mounting head 11. That is, the illumination unit 20 (the illumination device for imaging in the electronic component mounting apparatus 1) is arranged side by side in the Y direction (first direction in a horizontal plane) with respect to the mounting head 11 for mounting the electronic component P on the substrate 3. The illumination light is applied to an object to be imaged by the board recognition camera 14 (camera).

  The two outer illumination light sources 22b are arranged on both outer sides in the X direction of the central illumination light source 22a arranged around the opening 21a of the illumination board 21. Further, the outer illumination light source section 22b is arranged inside the width of the mounting head 11 in the X direction, and does not interfere with the Y-axis beam 9. Further, the outer illumination light source unit 22b is disposed inside the X-axis beam 10, and is mounted outside the X-axis beam 10 as in the case where the outer illumination light source unit 22b is rotated by 90 degrees as shown by a dashed line in FIG. The movement of the head 11 in the Y direction is not hindered. That is, the outer illumination light source unit 22b is arranged at a position that does not hinder the movement of the mounting head 11 that moves in the X and Y directions.

  Next, the function of the plate member 24 will be described with reference to FIG. FIG. 4 shows a state in which the board recognition camera 14 moves above the electronic component P on the tray 6 supplied by the tray feeder 5 and the illumination light c is emitted from the outer illumination light source unit 22b of the illumination unit 20. I have. The plate member 24 is formed of a material such as acrylic, and refracts the illumination light c emitted from the outer illumination light source 22b (second light source) at a low angle in the direction of the imaging optical axis a.

  By inserting the plate member 24 between the outer illumination light source 22b and the substrate 3, an effect of effectively moving the outer illumination light source 22b away from the imaging optical axis a occurs. That is, by inserting the plate-shaped member 24, an effect equivalent to moving the position D of the outer LED 23b farthest from the imaging optical axis a to the position D * virtually further outside can be obtained. Thereby, the horizontal component (the component in the X direction) of the illumination light c can be increased without expanding the illumination board 21 in the X direction, and it becomes easy to recognize an imaging target that has a low contrast with the background portion.

  FIG. 5 shows an example in which a Fresnel lens 26 that refracts the illumination light c emitted from both outer illumination light source portions 22b at a low angle in the direction of the imaging optical axis a is used as the plate member 24. FIG. 5A shows an EE cross section of FIG. 5B. In the case of the same height (thickness in the Z direction), the angle at which the Fresnel lens 26 refracts at a lower angle than the acrylic plate can be made larger. That is, the effect of effectively moving the outer illumination light source unit 22b away from the imaging optical axis a is greater. By using the Fresnel lens 26, it is possible to realize the illumination unit 20 that is low in height and capable of recognizing an imaging target that is difficult to contrast with the background.

  In addition, the plate-shaped member 24 may be used by overlapping a color filter that selectively transmits light having a predetermined wavelength of the illumination light c emitted from the outer illumination light source unit 22b. That is, the plate-shaped member 24 may selectively transmit light having a predetermined wavelength of the illumination light c emitted from the outer illumination light source unit 22b (second light source unit). Depending on the imaging target, red light may be easier to recognize a character or the like to be imaged than white light. In such a case, the color filter is overlapped on the plate member 24, or the plate member 24 itself is used as a color filter, so that the recognition rate of the imaging target can be improved without replacing the outer LED 23b. Further, since the plate-like member 24 is replaceable, the plate-like member 24 can be replaced according to the imaging target, and the characteristics of the color filters can be changed to improve the recognition rate of the imaging target.

  Next, a configuration of a control system of the electronic component mounting apparatus 1 will be described with reference to FIG. FIG. 6 illustrates only a control system related to the board recognition camera 14 and the lighting unit 20. In FIG. 6, a control unit 30 is an overall control device including a CPU, and controls each unit described below. The illumination data storage unit 31 stores illumination data such as proper use of the central illumination light source unit 22a and the outer illumination light source unit 22b set in advance for each imaging target. The recognizing unit 32 performs a process of recognizing image data acquired by the board recognizing camera 14 (camera) to detect a position of the recognition mark 3a, a character on the surface of the electronic component P, and the like.

  The drive unit 33 drives the head moving mechanism 12 to horizontally move the mounting head 11 and the board recognition camera 14 (camera) provided integrally with the mounting head 11 and the illumination unit 20. The illumination control unit 34 individually controls the central illumination light source unit 22a and the outer illumination light source unit 22b according to the illumination data stored in the illumination data storage unit 31. The illumination data includes a central illumination light source unit such that the surface properties of the object to be imaged by the board recognition camera 14, the type of image data recognition, and the best illumination state according to the purpose of recognition are realized. An illumination pattern is set by combining on / off of the outer illumination light source unit 22b and the illumination intensity.

  The illumination data is set to turn on the outer illumination light source unit 22b when the board recognition camera 14 recognizes a character engraved on the electronic component P. Note that the lighting control unit 34 may be built in the lighting unit 20. That is, the illumination unit 20 (the illumination device for imaging) includes the illumination control unit 34 that controls the light source unit 22 (the central illumination light source unit 22a and the outer illumination light source unit 22b). The outer illumination light source unit 22b (second light source unit) emits light when character recognition such as P is performed.

  As described above, the illumination unit 20 (illumination device for imaging in the electronic component mounting apparatus 1) of the present embodiment is provided integrally with the mounting head 11, and is provided for an object to be imaged by the board recognition camera 14 (camera). Irradiation light c. The illumination unit 20 is a flat plate-shaped light source unit 22 that is positioned substantially parallel to the surface of the substrate 3 between the substrate 3 and the substrate recognition camera 14 and has a light source unit 22 disposed on a surface facing the substrate 3. An illumination board 21 and an illumination control unit 34 for controlling the light source unit 22 are provided.

  The illumination units 20 are arranged side by side in the Y direction (first direction in a horizontal plane) with respect to the mounting head 11. The light source unit 22 includes a central illumination light source unit 22a (first light source unit) arranged around an imaging opening 21a through which the imaging optical axis a of the board recognition camera 14 passes, and an X of the central illumination light source unit 22a. An outer illumination light source unit 22b (second light source unit) disposed on both outer sides in the direction (a second direction orthogonal to the first direction in the horizontal plane). The illumination control unit 34 causes the outer illumination light source unit 22b to emit light during character recognition. This makes it possible to illuminate the surface of the electronic component P with the illumination light c so that the engraved characters and the like can be recognized.

  The lighting device for imaging and the electronic component mounting device in the electronic component mounting device of the present invention have an effect that it is possible to irradiate illumination light on the surface of the electronic component and make it possible to recognize engraved characters and the like, This is useful in the field of component mounting where electronic components are mounted on a substrate.

DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 3 Substrate 11 Mounting head 14 Substrate recognition camera (camera)
20 Lighting unit (lighting device for imaging)
21 Lighting Board 21a Opening 22 Light Source 22a Central Light Source (First Light Source)
22b Outside illumination light source unit (second light source unit)
23a Central LED (first individual light source)
23b Outer LED (second individual light source)
24 plate member a imaging optical axis c illumination light P electronic component

Claims (8)

A lighting device for imaging in an electronic component mounting device that is provided integrally with a mounting head that mounts electronic components on a substrate and irradiates illumination light to a target to be imaged by a camera,
A plate-shaped illumination substrate, which is located substantially parallel to the surface of the substrate between the substrate and the camera and has a light source unit disposed on a surface facing the substrate, and controls the light source unit; Lighting control unit,
The lighting device is arranged side by side in a first direction in a horizontal plane with respect to the mounting head,
The light source unit is disposed at a periphery of an imaging opening through which an imaging optical axis of the camera passes, and is orthogonal to a first direction of the first light source unit in a horizontal plane. A second light source unit disposed on both outer sides in the second direction,
The first light source unit includes a plurality of first individual light sources,
The second light source unit includes a plurality of second individual light sources,
The density at which the second individual light sources are arranged is higher than the density at which the first individual light sources are arranged,
The illumination control unit causes the second light source unit to emit light at the time of character recognition, wherein the illumination unit for imaging in an electronic component mounting apparatus. A lighting device for imaging in an electronic component mounting device that is provided integrally with a mounting head that mounts electronic components on a substrate and irradiates illumination light to a target to be imaged by a camera,
A plate-shaped illumination substrate, which is located substantially parallel to the surface of the substrate between the substrate and the camera and has a light source unit disposed on a surface facing the substrate, and controls the light source unit; Lighting control unit,
The lighting device is arranged side by side in a first direction in a horizontal plane with respect to the mounting head,
The light source unit is disposed at a periphery of an imaging opening through which an imaging optical axis of the camera passes, and is orthogonal to a first direction of the first light source unit in a horizontal plane. A second light source unit disposed on both outer sides in the second direction,
The second light source unit includes a plurality of second individual light sources,
At both ends of the second light source unit in the first direction, the second individual light sources are arranged to the imaging optical axis side from other portions,
The illumination control unit causes the second light source unit to emit light at the time of character recognition, wherein the illumination unit for imaging in an electronic component mounting apparatus. The first light source unit includes a plurality of first individual light sources,
The illumination device for imaging in an electronic component mounting apparatus according to claim 2, wherein the density at which the second individual light sources are arranged is higher than the density at which the first individual light sources are arranged.   4. The device according to claim 1, further comprising a plate-shaped member between the second light source unit and the substrate, the plate member transmitting the illumination light emitted from the second light source unit. An illumination device for imaging in an electronic component mounting apparatus according to (1).   The imaging device according to claim 4, wherein the plate-like member refracts illumination light emitted from the second light source unit at a low angle in a direction of the imaging optical axis. Lighting equipment.   6. The imaging device according to claim 4, wherein the plate-shaped member selectively transmits light having a predetermined wavelength of illumination light emitted from the second light source unit. 7. Lighting equipment.   The illumination device for imaging in an electronic component mounting device according to any one of claims 4 to 6, wherein the plate member is replaceable.   An electronic component mounting apparatus comprising the illumination device for imaging in the electronic component mounting apparatus according to claim 1, wherein the electronic component is mounted on the substrate.

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