JP4559275B2 - Electronic component mounting device - Google Patents

Description

  The present invention relates to an electronic component mounting apparatus that irradiates an electronic component sucked and held by a suction nozzle through an illuminating body into which light from a light source is introduced, and images the electronic component with a component recognition camera.

A large number of light-emitting diodes are fixed on a printed circuit board, for example, arranged in a plane, covered with a diffusion plate, and a front light is disposed horizontally, and the electronic components held by the suction nozzle are irradiated from below with a camera. A technique for imaging is disclosed in Patent Document 1, for example.
JP 2002-100955 A

  However, even if the light from the light emitting diode is diffused by the diffusion plate, the reflectance around the light emitting diode in the diffusion plate is large, and it is small at a distant place, so that the light irradiating the electronic component is not uniform, and the electron There is a problem that the reflected light from the parts is not uniform and the image is unclear.

  Therefore, the present invention irradiates the electronic component sucked and held by the suction nozzle through the illuminating body into which light from the light source is introduced, and when the electronic component is imaged by the component recognition camera, the irradiation light to the electronic component is uniform. An object of the present invention is to provide an electronic component mounting apparatus.

For this reason, the first invention is an electronic component mounting apparatus that irradiates an electronic component sucked and held by a suction nozzle through a lighting body introduced from the side with light from a light source and images the electronic component with a component recognition camera. The light is introduced from the side of the illuminating body, and a light reflecting surface is provided so that the reflectance is lowered near the light introduction portion on one side and the reflectance is increased in the distance. It is characterized by comprising a light guide that guides the emitted light from the other side surface and a reflector that is provided outside the light reflecting surface on the one side surface of the light guide .

A second aspect of the invention is an electronic component mounting apparatus that irradiates an electronic component sucked and held by a suction nozzle through a lighting body introduced from the side with light from a light source and images the electronic component with a component recognition camera. The light is introduced from the side of the illuminating body, and a light reflecting surface is provided so as to lower the reflectance near the light introduction portion on one side and to increase the reflectance in the distance. A light guide that guides light from the other side, a reflector provided outside the light reflecting surface on the one side of the light guide, and light provided on the other side of the light guide. It is characterized by comprising optical path changing means for collecting light.

A third aspect of the invention is an electronic component mounting apparatus that irradiates an electronic component sucked and held by a suction nozzle through a lighting body introduced from the side with light from a light source and images the electronic component with a component recognition camera. The light is introduced from the side of the illuminating body, and a light reflecting surface is provided so as to lower the reflectance near the light introduction portion on one side and to increase the reflectance in the distance. a light guide for deriving the light from the other side, a reflecting member provided on the outer side than the light reflecting surface of said one side surface of the light guide, one side on the side surface of the front SL other of the light guide And a light diffuser for diffusing light via the light guide, and an optical path changing means for condensing the light from the diffuser provided on the other side surface of the diffuser.

A fourth invention is an electronic component mounting apparatus that irradiates an electronic component sucked and held by a suction nozzle through a lighting body introduced from the side with light from a light source and images the electronic component with a component recognition camera The illuminator introduces light through a plurality of optical fiber bundles from the side, and a portion close to the light introduction portion on one side surface is roughly attached with a light reflection surface and is introduced with increasing density. A light guide that guides the light from the other side, a reflector provided outside the light reflecting surface of the one side of the light guide, and one side on the other side of the light guide And a light diffuser for diffusing light via the light guide, and an optical path changing means for condensing the light from the diffuser provided on the other side surface of the diffuser.

In the present invention, when light is emitted to an electronic component sucked and held by a suction nozzle by an illuminator and the electronic component is imaged by a component recognition camera, the reflectance is reduced near the light introduction portion on one side surface. At the same time, a light-reflecting body is provided with a light-reflecting surface so as to increase the reflectance in the distance, or the light guide that guides the introduced light from the other side surface, or a portion near the light-introducing portion on one side surface is roughened. And a light guide that guides light introduced from the other side, and a reflector provided outside the light reflection surface on the one side of the light guide. Since the electronic component is irradiated with light by the illuminating body, the irradiation light to the electronic component can be made uniform.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a plan view of an electronic component mounting apparatus 1, and a plurality of component supply units 3 for supplying various electronic components one by one to a component take-out portion (component adsorption position) on a base 2 of the apparatus 1. It is installed side by side. A supply conveyor 4, a positioning unit 5, and a discharge conveyor 6 are provided between the opposing supply unit 3 groups. The supply conveyor 4 conveys the printed circuit board P received from the upstream device to the positioning unit 5, and electronic components are mounted on the substrate P positioned by the positioning mechanism (not shown) in the positioning unit 5. Then, it is conveyed by the discharge conveyor 6, and is conveyed to a downstream apparatus.

  Reference numeral 8 denotes a pair of beams that are long in the X direction. The screw shaft 10 is rotated by driving a Y-axis drive motor 9, and a component take-out part (component suction unit) of the printed circuit board P and the component supply unit 3 is aligned along a pair of left and right guides 11. Position) Move upward in the Y direction individually.

  Each beam 8 is provided with a head mounting body 12 that moves along a guide in the longitudinal direction, that is, the X direction, by an X-axis drive motor (not shown). The mounting body 12 has one or a plurality of suction nozzles. A mounting head 7 having 13 is provided and a substrate recognition camera 14 is provided. The mounting head 7 is equipped with a vertical axis drive motor (not shown) for moving the suction nozzle 13 up and down, and a θ-axis drive motor (not shown) for rotating around the vertical axis. It is installed. Therefore, the suction nozzle 13 of the mounting head 7 can move in the X direction and the Y direction, can rotate about the vertical axis, and can move up and down.

  The board recognition camera 14 is provided corresponding to the mounting head 7 and attached to the board P in order to recognize how much the printed board P positioned by the positioning mechanism is displaced. Image the positioning mark. Reference numeral 18 shown in FIG. 2 denotes a component recognition camera, which images the electronic component D in order to recognize the position of the electronic component D with respect to the suction nozzle 13 with respect to the XY direction and rotation angle. .

  As shown in FIG. 2, a half mirror 21 is disposed above the component recognition camera 18, and a hollow cylindrical illumination unit 22 is disposed above the half mirror 21.

  Then, light from a light source (not shown) controlled by an illumination lighting circuit is guided to the illumination unit 22 through an optical fiber bundle to irradiate the electronic component D sucked and held by the suction nozzle 13. Light from the light source is introduced into the flat illuminating body 26 from the side through the optical fiber bundle 25 and irradiated to the electronic component D sucked and held by the suction nozzle 13 through the half mirror 21, and the component recognition camera. Reference numeral 18 denotes a configuration for imaging.

  A plurality of optical fibers are bundled and arranged at predetermined intervals on the uppermost inner surface and lower irradiation units 22A and 22B of the hollow cylindrical illumination unit 22 for the reflected illumination A and B. An optical fiber bundle 25 for reflected illumination is disposed in the vertical direction in the vicinity of the illumination unit 22.

  Next, the flat illuminating body 26 will be described with reference to FIGS. 3 and 4. FIG. 3 is a cross-sectional view of the illuminating body 26 with the components separated, and the rightmost layer is a reflective sheet 31 having an L-shaped cross section to reflect all light to the left. This layer is a light guide plate 33 having a light reflecting surface for white reflection or a print 32 as an irradiating body so that the right side surface has a different reflectance. An optical fiber bundle attachment body 34 in which a plurality of optical fiber bundles 25 are arranged is attached to the lower surface (bottom surface) of the light guide plate 33, and light from the light source is sent to the illumination body 26 via the optical fiber bundle 25 at the bottom ( It is configured to be introduced from the side portion and reflected to the left by being reflected by the printing 32 or the reflection sheet 31. Thus, since light is introduced into the illuminating body 26 from the bottom (side), the illuminating body 26 can be made thin.

  In this case, as shown in FIG. 4, the portion near the optical fiber bundle attachment 34 of the light guide plate 33 is roughly attached with the print 32, and is closely attached as the distance increases, thereby reducing the reflectance in the vicinity. In the far distance, the reflectance is increased. Accordingly, a portion of the light guide plate 33 close to the optical fiber bundle mounting body 34 has a small amount of bright reflected light and is led to the left. A lot of light will be led to the left.

  The left layer of the light guide plate 33 is a diffusion sheet 35 for diffusing light through the light guide plate 33, and the next layer is a sawtooth-like left surface, and serves as an optical path changing means for condensing the light from the diffusion sheet 35. The prism sheet 36, the next layer is the same flat plate-like prism sheet 37, the sawtooth of which is formed perpendicular to the prism sheet 36, the next layer is provided if necessary, and a polarizing filter as means for increasing the luminance 38. The prism sheet 36 collimates the light from the diffusion sheet 35, condenses it as much as possible in the range necessary for illumination of the electronic component, re-reflects about 50% of the incident light, recycles it, and recycles usable refracted light. It increases by about 50% and little light is lost due to reflection and refraction.

  The polarizing filter 38 is provided to increase the luminance when the luminance of light introduced into the illuminator 26 is insufficient, and is not necessary when the luminance is sufficient.

  With the above configuration, the automatic operation of the electronic component mounting apparatus will be described. First, the printed circuit board P is transported from the upstream apparatus to the positioning unit 5 via the supply conveyor 4, and is positioned and fixed by a positioning mechanism (not shown). 9 and an X-axis drive motor (not shown) are driven and the mounting head 7 is moved, so that the board recognition camera 14 is moved to a position above the positioning mark attached to the printed board P, and the printed board P is A positioning mark is imaged in order to recognize how much the position is displaced. Then, the image captured by the recognition processing device is subjected to recognition processing, and the recognition processing result is stored in the storage means.

  Next, the mounting head 7 moves according to the mounting data in which the XY coordinate position to be mounted on the printed circuit board, the rotation angle position about the vertical axis, the arrangement number of each component supply unit 3 and the like stored in the storage means are designated. Then, the electronic component to be mounted by the suction nozzle corresponding to the component type of the electronic component is sucked out from the predetermined component supply unit 3.

  More specifically, the suction nozzle 13 of the mounting head 7 moves so as to be positioned above the component supply unit 3 that stores the electronic component to be mounted of the mounting step number 0001, but the Y-axis drive motor 9 is driven in the Y direction. The beam 8 moves along the pair of guides 11, the X-axis drive motor drives in the X direction and the mounting head 7 moves, and the predetermined component supply unit 3 is already driven to take out the component at the component suction position. Since it is in a possible state, the vertical axis drive motor is driven and the suction nozzle 13 is lowered to suck and take out the electronic component D, and then the mounting head 7 is lifted.

  The suction nozzle 13 moves so as to mount the electronic component D at a predetermined position on the printed circuit board P positioned by the positioning unit 5. During the movement of the mounting head 7, the upper position of the component recognition camera 18 is moved. The electronic component D sucked and held by the suction nozzle 13 is imaged by the component recognition camera 18.

  Then, how much the electronic component D is attracted and held with respect to the suction nozzle 13 is recognized by the recognition processing device with respect to the XY direction and the rotation angle, and the recognition processing result of the electronic component and the printed circuit board described above. The Y-axis drive motor 9, the X-axis drive motor, and the θ-axis drive motor are controlled by a control device (not shown) and mounted at a predetermined position on the printed circuit board P. . Thereafter, the electronic components after the mounting step number 0002 are corrected and mounted in the same manner.

  Here, the light from the light source is introduced into the flat illuminating body 26 from the side through the optical fiber bundle 25 and irradiated to the electronic component D sucked and held by the suction nozzle 13 through the half mirror 21. An operation performed by the component recognition camera 18 using reflected illumination will be described.

  First, light from a light source that is turned on via the illumination lighting circuit is introduced from the bottom surface of the light guide plate 33 of the illuminating body 26 via the optical fiber bundle 25. The introduced light is reflected by the reflection printing 32, and the light that has passed through the portion without the printing 32 is reflected by the reflection sheet 31 and again passes through the light guide plate 33 through the portion without the printing 32. Then, it is diffused by the diffusion sheet 35.

  Then, the light passes through the prism sheets 36 and 37 as the optical path changing means, the brightness is increased by the next polarizing filter 38, and the electronic component D sucked and held by the suction nozzle 13 is irradiated through the half mirror 21. The component recognition camera 18 captures a reflection image of the electronic component D sucked by the suction nozzle 13 generated by irradiation through the half mirror 21.

In this case, the portion of the light guide plate 33 close to the optical fiber bundle mounting body 34 is roughly attached with the print 32, and is closely attached as the distance increases, so that the reflectance is lowered in the vicinity and the reflectance is increased in the distance. Configure to raise. Accordingly, there is little bright reflected light from the portion of the light guide plate 33 close to the optical fiber bundle mounting body 34, and gradually dark reflected light is led out to the left as the distance increases, and is led out from the illumination body 26. The amount of light is uniform.

  Therefore, when an electronic component is imaged by the component recognition camera 18, since the electronic component D is irradiated through the illumination body 26 into which light from the light source is introduced, the irradiation light to the electronic component D becomes uniform. Thus, a captured image can be obtained.

  The light source, the optical fiber bundle 25, and the light guide plate 33 may be omitted, and light emitting diodes as irradiation bodies arranged in a plurality of vertical and horizontal directions (horizontal directions) at predetermined intervals may be used. Moreover, you may use the some light emitting diode which can select the wavelength of light according to an electronic component instead of the light source and the optical fiber bundle 25. FIG. Furthermore, instead of using the diffusion sheet 35, a light guide plate in which particles for light diffusion are included in advance may be used. As a result, the structure of the illuminating body can be simplified, and impurities such as dust enter between the light guide plate 33 and the diffusion sheet 35, and the light derived from the illuminating body becomes non-uniform or the amount of light decreases. Can be prevented.

  Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the above-described alternatives, modifications, or modifications. It includes modifications.

It is a top view of an electronic component mounting apparatus. It is a conceptual diagram which shows various illuminations. It is sectional drawing which shows the state which isolate | separated each component of the illuminating body. It is a side view of a lighting body.

Explanation of symbols

DESCRIPTION OF SYMBOLS 3 Component supply unit 7 Mounting head 13 Adsorption nozzle 18 Component recognition camera 21 Half mirror 25 Optical fiber bundle 26 Illumination body 31 Reflection sheet 32 Printing 33 Light guide plate 35 Diffusion sheet 36, 37 Prism sheet

Claims (4)

An electronic component mounting apparatus that irradiates an electronic component sucked and held by a suction nozzle through a lighting body introduced from the side with light from a light source, and images the electronic component with a component recognition camera, Light is introduced from the side, and the reflectance is lowered near the light introduction part on one side and the light reflection surface is applied to increase the reflectance far away. An electronic component mounting apparatus comprising: a light guide to be led out; and a reflector provided outside the light reflecting surface on the one side surface of the light guide . An electronic component mounting apparatus that irradiates an electronic component sucked and held by a suction nozzle through a lighting body introduced from the side with light from a light source and images the electronic component with a component recognition camera, wherein the lighting body is Light is introduced from the side, and the reflectance is lowered near the light introduction part on one side and the light reflection surface is applied to increase the reflectance far away. A light guide to be led out, a reflector provided outside the light reflecting surface on the one side surface of the light guide, and an optical path changing unit provided on the other side surface of the light guide to collect light. An electronic component mounting apparatus characterized by comprising: An electronic component mounting apparatus that irradiates an electronic component sucked and held by a suction nozzle through a lighting body introduced from the side with light from a light source and images the electronic component with a component recognition camera, wherein the lighting body is Light is introduced from the side, and the reflectance is lowered near the light introduction part on one side and the light reflection surface is applied to increase the reflectance far away. a light guide body to derive, a reflection member provided outside the said light reflecting surface of said one side surface of the light guide, the light guide one side is provided on a side surface of the front SL other of the light guide An electronic component mounting apparatus comprising: a diffuser that diffuses light passing through a body; and an optical path changing unit that is provided on the other side surface of the diffuser and collects light from the diffuser. An electronic component mounting apparatus that irradiates an electronic component sucked and held by a suction nozzle through a lighting body introduced from the side with light from a light source and images the electronic component with a component recognition camera, wherein the lighting body is Introduces light through a plurality of optical fiber bundles from the side, and a portion near the light introduction portion on one side is roughly attached with a light reflection surface, and is closely attached as the distance increases, and the introduced light is introduced on the other side. A light guide derived from the light guide, a reflector provided outside the light reflecting surface of the one side of the light guide, and one side provided on the other side of the light guide. An electronic component mounting apparatus comprising: a diffuser that diffuses light passing through a body; and an optical path changing unit that is provided on the other side surface of the diffuser and collects light from the diffuser.

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