JP2017162845A - Illumination device for imaging in electronic component mounting device and electronic component mounting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an illumination device for imaging in electronic component mounting device capable of making a character, or the like, stamped on the surface of an electronic component by irradiating with illumination light, recognizable, and to provide an electronic component mounting device.SOLUTION: An illumination unit 20 (illumination device for imaging) is provided integrally a mounting head 11, and irradiates an imaging object by a substrate recognition camera 14 (camera) with illumination light. The illumination unit 20 is located between a substrate and the substrate recognition camera 14, while including a lighting board 21 where a light source is placed on the side facing the board, and an illumination control part for controlling the light source, and arranged side-by-side in the Y direction for the mounting head 11. The light source has a central illumination light source 22a(first light source) arranged around an opening 21a through which the imaging optical axis of the substrate recognition camera 14 penetrates, and outside illumination light sources 22b (second light source) arranged on the opposite outsides of the central illumination light source 22a in the X direction. The illumination control part controls the outside illumination light sources 22b to emit light at the time of character recognition.SELECTED DRAWING: Figure 3

Description

  The present invention relates to an imaging illumination device and an electronic component mounting apparatus that are used when imaging a recognition object in an electronic component mounting apparatus that mounts electronic components on a substrate.

  2. Description of the Related Art Conventionally, electronic component mounting apparatuses include a board recognition camera that images a recognition mark provided on the surface of the board for board identification, alignment, and the like, and an illumination device that irradiates the recognition mark with illumination light for imaging. It is provided integrally with the mounting head. In recent years, with the downsizing and high performance of electronic devices, the restriction on the height dimension of the mounting head has increased, and as a result, the substrate recognition camera and the lighting device that are provided integrally with the mounting head have also been configured in consideration thereof. (For example, Patent Document 1).

  The illuminating device disclosed in Patent Document 1 mainly includes an illuminating substrate disposed between a substrate recognition camera and an imaging target substrate. The illumination board is arranged in parallel with the substrate to be imaged, and a plurality of light sources for irradiating illumination light are provided on the surface on the side facing the imaging target board around the opening provided on the illumination board for imaging. Has a configuration.

JP 2008-205226 A

  In recent years, the range of objects required as an imaging object of a board recognition camera has been widened with a request for improvement in functions of an electronic component mounting apparatus. As one of them, there is a letter indicating a component type or the like stamped with a laser or the like on the surface of an electronic component or the like supplied by a component supply device such as a tray or a tape feeder. Such characters have a problem that it is difficult to obtain contrast with the background portion with the conventional illumination for recognizing the recognition mark including Patent Document 1, and it is difficult to recognize the characters with the substrate recognition camera.

  Accordingly, an object of the present invention is to provide an imaging illumination device and an electronic component mounting apparatus in an electronic component mounting apparatus capable of recognizing characters and the like that are engraved by irradiating illumination light on the surface of the electronic component. And

  An illumination device for imaging in an electronic component mounting apparatus according to the present invention is provided integrally with a mounting head for mounting an electronic component on a substrate, and for imaging in the electronic component mounting device that irradiates illumination light onto an imaging target by a camera. A flat illumination board in which a light source part is disposed on a surface facing the board, which is positioned substantially parallel to the surface of the board between the board and the camera. An illumination control unit that controls the light source unit, and the illumination device is arranged in a first direction in a horizontal plane with respect to the mounting head, and the light source unit includes an imaging optical axis of the camera. A first light source disposed around a penetrating opening for imaging, and a first light source disposed on both outer sides in a second direction orthogonal to the first direction of the first light source in the horizontal plane. Two light source units, and the illumination control unit includes: During character recognition, characterized in that to emit the second light source unit.

  The electronic component mounting apparatus of the present invention includes a lighting device for photographing in the electronic component mounting apparatus of the present invention, and the electronic component is mounted on the substrate.

  ADVANTAGE OF THE INVENTION According to this invention, the character etc. which were engraved by irradiating illumination light on the surface of an electronic component can be made recognizable.

The top view of the electronic component mounting apparatus of one embodiment of this invention Structure explanatory drawing of the illuminating device for imaging in the electronic component mounting apparatus of one embodiment of this invention Explanatory drawing which looked at the illuminating device for imaging provided in the electronic component mounting apparatus of one embodiment of this invention from the downward direction Explanatory drawing of the function of the plate-shaped member of the illuminating device for imaging in the electronic component mounting apparatus of one embodiment of this invention Explanatory drawing which used the Fresnel lens as a plate-shaped member of the illuminating device for imaging in the electronic component mounting apparatus of one embodiment of the present invention The block diagram which shows the structure of the control system of the electronic component mounting apparatus of one embodiment of this invention

  Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings. The configuration, shape, and the like described below are illustrative examples, and can be appropriately changed according to the specifications of the electronic component mounting apparatus and the illumination unit (illumination apparatus for imaging). Below, the same code | symbol is attached | subjected to the element which respond | corresponds in all the drawings, and the overlapping description is abbreviate | omitted. In FIG. 1 and a part to be described later, as a biaxial direction orthogonal to each other in a horizontal plane, an X direction (horizontal direction in FIG. 1) in the substrate transport direction and a Y direction (vertical direction in FIG. 1) orthogonal to the substrate transport direction. Is shown. In FIG. 2 and a part to be described later, the Z direction is shown as the height direction orthogonal to the horizontal plane. The Z direction is a vertical direction or an orthogonal direction when the electronic component mounting apparatus is installed on a horizontal plane.

  First, the configuration of the electronic component mounting apparatus 1 will be described with reference to FIG. In FIG. 1, a substrate transport mechanism 2 is arranged in the X direction on the upper surface of a base 1a. The board transport mechanism 2 transports the board 3 as a component mounting target, and positions and holds it at a work position by the component mounting mechanism described below. Component supply units 4A and 4B for supplying components to be mounted on the substrate 3 are disposed on both sides of the substrate transport mechanism 2.

  A tray feeder 5 is disposed in the component supply unit 4A. The tray feeder 5 moves the pallet 7 on which trays 6 (two in this case) for storing the electronic components P in a lattice arrangement are mounted to a component supply position for supplying the electronic components P to a component mounting mechanism described below. A plurality of tape feeders 8 are arranged in parallel in the component supply unit 4B. The tape feeder 8 supplies the electronic component P to the component mounting mechanism by pitch-feeding the carrier tape holding the electronic component P.

  A Y-axis beam 9 having a linear drive mechanism is disposed at one end in the X direction on the upper surface of the base 1a. Similarly, two X-axis beams 10 each having a linear drive mechanism are coupled to the Y-axis beam 9 so as to be movable in the Y direction. A mounting head 11 is mounted on each of the two X-axis beams 10 so as to be movable in the X direction. The mounting head 11 is provided with a plurality of suction nozzles 11a (see FIG. 3).

  By driving the Y-axis beam 9 and the X-axis beam 10, the mounting head 11 moves horizontally (X direction and Y direction) between the component supply units 4A and 4B and the substrate 3 held by the substrate transport mechanism 2. The electronic component P supplied by the component supply units 4A and 4B is taken out by the suction nozzle 11a and mounted on the substrate 3. That is, the Y-axis beam 9 and the first X-axis beam 10 constitute a head moving mechanism 12 that moves the mounting head 11 in the X direction and the Y direction. The Y-axis beam 9, the X-axis beam 10, and the mounting head 11 constitute a component mounting mechanism for mounting the electronic component P on the substrate 3 by the suction nozzle 11a.

  A component recognition camera 13 is disposed between the component supply units 4A and 4B and the substrate transport mechanism 2. When the mounting head 11 that has taken out the electronic component P from the component supply units 4A and 4B moves above the component recognition camera 13, the component recognition camera 13 images the electronic component P held by the mounting head 11. Thereby, the identification and position recognition of the electronic component P held by the mounting head 11 are performed.

  The mounting head 11 is mounted with a substrate recognition camera 14 that is positioned on the lower surface side of the X-axis beam 10 and moves integrally with the mounting head 11. As the mounting head 11 moves, the substrate recognition camera 14 moves above the substrate 3 positioned and held by the substrate transport mechanism 2 and images the recognition marks 3 a (four in this case) provided on the surface of the substrate 3. To do. Thereby, the position recognition of the board | substrate 3 is performed. The board recognition camera 14 moves above the electronic component P supplied to the component supply units 4A and 4B and images the electronic component P. As a result, the position of the electronic component P is recognized, and characters, polarity marks, and the like formed by laser marking on the upper surface of the electronic component P are recognized.

  Next, the configuration of the substrate recognition camera 14 will be described with reference to FIG. FIG. 2A is a schematic view of the substrate recognition camera 14 arranged in the Y direction (first direction in the horizontal plane) with respect to the mounting head 11 when viewed in the Y direction. As shown in FIG. 2A, the substrate recognition camera 14 is configured by combining a light receiving unit 15 including a light receiving element 15a such as a CCD or CMOS sensor, and an optical unit 16 including lenses 16a and 16b and a prism 16c. It has become. The light receiving unit 15 is coupled to the optical unit 16 in a posture in which the imaging optical axis a is horizontal. The imaging light incident vertically upward from below through the lens 16b on the imaging object side enters the light receiving element 15a through the lens 16a after being refracted in the horizontal direction by the prism 16c, and is at a predetermined focal position. An image of the imaging object is formed on the light receiving element 15a.

  Below the optical unit 16, an illumination unit 20 (illumination device for imaging) that irradiates illumination light to the imaging target is disposed. The illumination unit 20 is mainly composed of a flat illumination substrate 21 having a light source unit 22 disposed on the lower surface side. In a state in which the substrate 3 to be imaged is imaged by the substrate recognition camera 14, the illumination unit 20 is in a position facing the substrate 3 to be imaged substantially parallel to each other. Therefore, in this state, the illumination board 21 is positioned substantially parallel to the surface of the board 3 between the board 3 and the board recognition camera 14 (camera), and a light source is placed on the surface (the lower surface side) facing the board 3. The part 22 is arranged.

  FIG. 2B shows the illumination board 21 viewed from below. The illumination board 21 has an imaging opening 21a at a position where the imaging optical axis a of the board recognition camera 14 penetrates. A central illumination light source unit 22a (first light source unit) is disposed around the opening 21a. Outer illumination light source units 22b (second light source units) are arranged on both outer sides in the X direction of the central illumination light source unit 22a. That is, the light source unit 22 includes a central illumination light source unit 22a (first light source unit) disposed around the imaging opening 21a through which the imaging optical axis a of the substrate recognition camera 14 (camera) passes, and central illumination. It has the outer side illumination light source part 22b (2nd light source part) arrange | positioned in the X direction (2nd direction orthogonal to a 1st direction and a horizontal surface) of the light source part 22a.

  The central illumination light source unit 22a has a large difference in reflectance between the imaging target and its background portion, such as the recognition mark 3a provided mainly on the surface of the substrate 3, and is reflected by irradiating illumination light in the vertical direction (Z direction). It is used for imaging an imaging object in which the contrast between the imaging object and the background portion can be easily obtained with light. On the other hand, the outer illumination light source unit 22b has a small difference in reflectance between the imaging target and its background portion, such as characters that are mainly laser-engraved on the surface of the electronic component P, and the contrast in the vertical direction (Z direction) illumination light. Is used for imaging an imaging target that is difficult to remove.

  When the difference in reflectance between the imaging target and the background portion is small, the minute contrast of the reflected light is erased by the vertical component of the incident illumination light (component in the Z direction), and the imaging target and the background portion cannot be distinguished. In such a case, a large contrast capable of distinguishing between the imaging target and the background portion by illuminating the imaging target with illumination light having a horizontal component (XY direction component) as a main component and a small vertical component (Z direction component). Can be obtained. Therefore, it is desirable that the illumination light emitted from the outer illumination light source unit 22b has a large horizontal component and a small vertical component.

  In FIG.2 (b), the center illumination light source part 22a (1st light source part) is comprised from several center LED23a (1st separate light source), and the outer side illumination light source part 22b (2nd light source part) of both outer sides ) Is composed of a plurality of outer LEDs 23b (second individual light sources). The average value of the pitch Lxa in the X direction of the central LED 23a of the central illumination light source unit 22a is wider than the average value of the pitch Lxb in the X direction of the outer LED 23b of the outer illumination light source unit 22b. Similarly, the average value of the pitch Lya in the Y direction of the central LED 23a of the central illumination light source unit 22a is wider than the average value of the pitch Lyb in the Y direction of the outer LED 23b of the outer illumination light source unit 22b.

  That is, the density at which the outer LED 23b (second individual light source) of the outer illumination light source unit 22b is arranged is higher than the density at which the central LED 23a (first individual light source) of the center illumination light source unit 22a is arranged. As a result, the outer illumination light source unit 22b irradiates strong illumination light from a narrow area to reduce the vertical component (Z-direction component) of the illumination light with respect to the imaging target and increase the horizontal component (X-direction component). it can. Therefore, it is difficult to obtain a contrast with the background portion. For example, even a character or the like that is laser-engraved on the upper surface of the electronic component P can be recognized by the board recognition camera 14.

  In FIG. 2B, the imaging optical axis a is more at the opposite ends in the Y direction (first direction) of the outer illumination light source unit 22b (second light source unit) on both outer sides indicated by the broken line frame B than the other portions. Outer LEDs 23b (second individual light sources) are arranged to the side. As a result, the outer illumination light source unit 22b can increase the horizontal component (component in the X direction) of the illumination light, and it is easy to recognize an imaging target that is difficult to obtain contrast with the background portion.

  In FIG. 2B, a plate-like plate member 24 that transmits illumination light emitted from the outer illumination light source unit 22 b is disposed below the outer illumination light source unit 22 b so as to be exchangeable by screws 25. Yes. That is, the illumination unit 20 further includes a replaceable plate-like member 24 that transmits illumination light emitted from the outer illumination light source unit 22b between the outer illumination light source unit 22b (second light source unit) and the substrate 3. Have. In the example shown in FIG. 2, the plate-like member 24 is divided into two and has a shape that is only below the outer illumination light source portions 22 b on both outer sides, but the plate-like member 24 is formed on the central illumination light source portion 22 a. The shape which exists also below may be sufficient.

  Next, the positional relationship between the mounting head 11 and the illumination unit 20 will be described with reference to FIG. FIG. 3 is a schematic view of the mounting head 11 moving in the X direction and closest to the Y-axis beam 9 as viewed from below. The illumination unit 20 is disposed below the substrate recognition camera 14 that is disposed side by side with respect to the mounting head 11 in the Y direction. That is, the illumination unit 20 (illumination device for imaging in the electronic component mounting apparatus 1) is arranged side by side in the Y direction (first direction in the horizontal plane) with respect to the mounting head 11 that mounts the electronic component P on the substrate 3. In this case, the illumination light is irradiated to the object to be imaged by the board recognition camera 14 (camera).

  The two outer illumination light source units 22b are arranged on both outer sides in the X direction of the central illumination light source unit 22a arranged around the opening 21a of the illumination substrate 21. In addition, the outer illumination light source unit 22 b is disposed on the inner side of the width in the X direction of the mounting head 11 and does not interfere with the Y-axis beam 9. Further, the outer illumination light source unit 22b is disposed inside the X-axis beam 10, and is mounted so as to protrude outside the X-axis beam 10 as in the case where the outer illumination light source unit 22b is rotated by 90 degrees as shown by a dashed line in FIG. The movement of the head 11 in the Y direction is not hindered. That is, the outer illumination light source unit 22b is disposed at a position that does not hinder the movement of the mounting head 11 that moves in the XY directions.

  Next, the function of the plate-like member 24 will be described with reference to FIG. FIG. 4 shows a state in which the board recognition camera 14 is moved above the electronic component P on the tray 6 supplied by the tray feeder 5 and the illumination light c is irradiated from the outer illumination light source unit 22b of the illumination unit 20. Yes. The plate-like member 24 is made of a material such as acrylic, and refracts the illumination light c emitted from the outer illumination light source unit 22b (second light source unit) at a low angle in the direction of the imaging optical axis a.

  By inserting the plate-like member 24 between the outer illumination light source part 22b and the substrate 3, an effect of effectively moving the outer illumination light source part 22b away from the imaging optical axis a is produced. That is, by inserting the plate-like member 24, it is possible to obtain the same effect as virtually moving the position D of the outer LED 23b farthest from the imaging optical axis a to the outer position D *. Accordingly, the horizontal component (component in the X direction) of the illumination light c can be increased without extending the illumination board 21 in the X direction, and the recognition of the imaging target whose contrast with the background portion is difficult to obtain is facilitated.

  FIG. 5 shows an example in which a Fresnel lens 26 is used as the plate-like member 24 to refract the illumination light c emitted from the outer illumination light source sections 22b on both outer sides in the direction of the imaging optical axis a at a low angle. FIG. 5A shows an EE cross section of FIG. In the case of the same height (Z-direction thickness), the angle at which the Fresnel lens 26 is refracted at a lower angle than the acrylic plate can be increased. That is, the effect of effectively separating the outer illumination light source unit 22b from the imaging optical axis a is greater. By using the Fresnel lens 26, it is possible to realize the illumination unit 20 that is capable of recognizing an imaging object that is low in height and difficult to obtain contrast with the background portion.

  Further, the plate-like member 24 may be used by overlapping a color filter that selectively transmits light having a predetermined wavelength of the illumination light c emitted from the outer illumination light source unit 22b. That is, the plate-like member 24 may selectively transmit light having a predetermined wavelength of the illumination light c emitted from the outer illumination light source unit 22b (second light source unit). Depending on the imaging target, it may be easier to recognize characters or the like that are red light than white light. In such a case, the recognition rate of the imaging target can be improved without replacing the outer LED 23b by overlaying a color filter on the plate-like member 24 or using the plate-like member 24 itself as a color filter. Further, since the plate-like member 24 can be exchanged, the plate-like member 24 can be exchanged according to the imaging target, and the characteristics of the color filter can be changed to improve the recognition rate of the imaging target.

  Next, the configuration of the control system of the electronic component mounting apparatus 1 will be described with reference to FIG. FIG. 6 shows only a control system related to the substrate recognition camera 14 and the illumination unit 20. In FIG. 6, a control unit 30 is an overall control device including a CPU, and controls each unit described below. The illumination data storage unit 31 stores illumination data such as the proper use of the central illumination light source unit 22a and the outer illumination light source unit 22b set in advance for each imaging target. The recognizing unit 32 performs a process of recognizing imaging data acquired by the board recognition camera 14 (camera) to detect the position of the recognition mark 3a, characters on the surface of the electronic component P, and the like.

  The drive unit 33 drives the head moving mechanism 12 to horizontally move the mounting head 11 and the substrate recognition camera 14 (camera) provided integrally with the mounting head 11 and the illumination unit 20. The illumination control unit 34 individually controls the central illumination light source unit 22a and the outer illumination light source unit 22b according to the illumination data stored in the illumination data storage unit 31. In the illumination data, the central illumination light source unit is implemented so that the best illumination state according to the surface property characteristics of the imaging object to be imaged by the board recognition camera 14, the type of recognition of the imaging data, and the purpose of recognition is realized. An illumination pattern that combines on / off of 22a and the outside illumination light source unit 22b and illumination intensity is set.

  The illumination data is set to turn on the outer illumination light source unit 22b when the board recognition camera 14 recognizes a character stamped on the electronic component P. Note that the illumination control unit 34 may be incorporated in the illumination unit 20. That is, the illumination unit 20 (illumination device for imaging) includes an illumination control unit 34 that controls the light source unit 22 (central illumination light source unit 22a, outer illumination light source unit 22b), and the illumination control unit 34 is an electronic component. When a character such as P is recognized, the outer illumination light source unit 22b (second light source unit) is caused to emit light.

  As described above, the illumination unit 20 (illumination device for imaging in the electronic component mounting apparatus 1) of the present embodiment is provided integrally with the mounting head 11 and is to be imaged by the board recognition camera 14 (camera). The illumination light c is irradiated. The illumination unit 20 is positioned between the substrate 3 and the substrate recognition camera 14 so as to be substantially parallel to the surface of the substrate 3, and has a flat plate shape in which the light source unit 22 is disposed on the surface facing the substrate 3. An illumination board 21 and an illumination control unit 34 that controls the light source unit 22 are provided.

  The illumination unit 20 is arranged side by side in the Y direction (first direction in the horizontal plane) with respect to the mounting head 11. The light source unit 22 includes a central illumination light source unit 22a (first light source unit) disposed around the imaging opening 21a through which the imaging optical axis a of the substrate recognition camera 14 passes, and X of the central illumination light source unit 22a. It has the outer side illumination light source part 22b (2nd light source part) arrange | positioned on the both outer sides of a direction (2nd direction orthogonal to a 1st direction and a horizontal surface). The illumination control unit 34 causes the outer illumination light source unit 22b to emit light during character recognition. As a result, it is possible to recognize characters and the like that are engraved by irradiating the surface of the electronic component P with the illumination light c.

  The illumination device for imaging and the electronic component mounting device in the electronic component mounting apparatus of the present invention have the effect that the surface of the electronic component can be recognized by irradiating the illumination light with characters etc. This is useful in the field of component mounting for mounting electronic components on a substrate.

DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 3 Board | substrate 11 Mounting head 14 Board | substrate recognition camera (camera)
20 Illumination unit (illumination device for imaging)
21 Illumination board 21a Opening 22 Light source 22a Central illumination light source (first light source)
22b Outside illumination light source unit (second light source unit)
23a Center LED (first individual light source)
23b Outside LED (second individual light source)
24 Plate-shaped member a Imaging optical axis c Illumination light P Electronic component

Claims (8)

An illumination device for imaging in an electronic component mounting apparatus that is provided integrally with a mounting head for mounting an electronic component on a substrate and irradiates illumination light onto an imaging target by a camera,
A flat plate-shaped illumination board that is positioned substantially parallel to the surface of the board between the board and the camera and has a light source part disposed on a surface facing the board, and controls the light source part A lighting control unit,
The lighting device is arranged side by side in a first direction in a horizontal plane with respect to the mounting head,
The light source unit is orthogonal to the first light source unit disposed around an imaging opening through which the imaging optical axis of the camera passes, and the first direction of the first light source unit in a horizontal plane. A second light source unit disposed on both outer sides in the second direction,
The illumination control unit causes the second light source unit to emit light at the time of character recognition, and the illumination device for imaging in the electronic component mounting apparatus. The first light source unit includes a plurality of first individual light sources,
The second light source unit includes a plurality of second individual light sources,
The illumination device for imaging in the electronic component mounting apparatus according to claim 1, wherein a density at which the second individual light sources are arranged is higher than a density at which the first individual light sources are arranged. The second light source unit includes a plurality of second individual light sources,
3. The second individual light source is disposed at both ends of the second light source unit in the first direction to the imaging optical axis side with respect to other parts. 4. An illumination device for imaging in the electronic component mounting apparatus according to 1.   The plate-shaped member which permeate | transmits the illumination light irradiated from the said 2nd light source part between the said 2nd light source part and the said board | substrate is further provided, The any one of Claim 1 to 3 characterized by the above-mentioned. Illuminating device for imaging in the electronic component mounting apparatus.   The said plate-shaped member refracts the illumination light irradiated from the said 2nd light source part at a low angle in the direction of the said imaging optical axis, The imaging component in the electronic component mounting apparatus of Claim 4 characterized by the above-mentioned. Lighting equipment.   The imaging in the electronic component mounting apparatus according to claim 4, wherein the plate-like member selectively transmits light having a predetermined wavelength of illumination light emitted from the second light source unit. Lighting equipment.   The illumination device for imaging in the electronic component mounting apparatus according to claim 4, wherein the plate member is replaceable.   8. An electronic component mounting apparatus comprising the imaging illumination device in the electronic component mounting apparatus according to claim 1, wherein the electronic component is mounted on the substrate.

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