CN101584263B - Lighting device for image capturing in electronic component mounting apparatus - Google Patents
Lighting device for image capturing in electronic component mounting apparatus Download PDFInfo
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- CN101584263B CN101584263B CN2008800023947A CN200880002394A CN101584263B CN 101584263 B CN101584263 B CN 101584263B CN 2008800023947 A CN2008800023947 A CN 2008800023947A CN 200880002394 A CN200880002394 A CN 200880002394A CN 101584263 B CN101584263 B CN 101584263B
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Abstract
To provide a lighting device for image capturing in an electronic component mounting apparatus that has small dimensions in the height direction and a small size in a plan view and thus can meet demands in a reduction in size. In an electronic component mounting apparatus, a surface lighting unit (30) that emits illumination light to a substrate, which is an object whose image is to be captured bya camera (25), includes as a main component a flat lighting substrate (31) that is provided between the camera (25) and the substrate, which is an object whose image is to be captured, so as to be su bstantially parallel to the surface of the substrate. Upper illumination light sources (32a), intermediate illumination light sources (32b), and lower illumination light sources (32c) are arranged around an opening (31a) for image capturing on one surface of the lighting substrate (31) facing the substrate in this order from the inside to the outside, such that they emit illumination light components to the surface of the substrate at different emission angles. In this way, it is possible to reduce the dimensions of the surface lighting unit (30) in the height direction and thus meet demands for a reduction in size.
Description
Technical field
The present invention relates to a kind of lighting device that in electronic component mounting apparatus, is used for image capturing, this lighting device is used to catch will be by the image of the object of identification, and this electronic component mounting apparatus is for example for being placed on electronic component the electronic component placing apparatus on the substrate.
Background technology
In electronic component mounting apparatus for example is used in electronic component placing apparatus in the electronic component hookup wire, in order to discern the position of substrate or detection substrate, use camera to catch the image of object to be identified, this object is for example for being arranged on the identification marking on the substrate surface.During the image capturing process, lighting device emissive lighting light is to the surface of substrate, and camera receives from the light of object reflection to be identified, catches the image of object to be identified thus.
Usually, indirect illumination reflection of light characteristic depends on the surface nature or the state of object to be identified.Therefore, in order to make the reflected light that camera can reception good in the image capturing process, following structure has been proposed, in this structure, the a plurality of light sources that form lighting device are configured in different positions, illumination light is to the emission angle of substrate surface can change according to object to be identified (for example, referring to patent documentation 1).In patent documentation 1 disclosed structure, a plurality of illuminating board are vertically stacked, each illuminating board has as light source and is arranged to annular LED, thereby light source is transmitted into substrate with different emission angle with the illumination light composition along a plurality of directions, and this substrate is that image is with captive object.
JP-A-2003-168899
Summary of the invention
Technical matters
Recently, along with reducing and the raising of performance of electronic equipment size, the size that the substrate of electronic component is installed reduces, and the packing density of electronic component increases.Therefore, the size of the erecting equipment of this type of substrate reduces, and being used in the component size that electronic unit is installed in the electronic component mounting apparatus on the substrate has needed to reduce.For example, during providing the unit to take out electronic component from parts and electronic component being transmitted and be installed to component mounter structure on the substrate, installation head in planimetric map size and the size on short transverse compared with prior art, be subjected to bigger restriction.
Yet, when the lighting device with said structure is used as the lighting device of the electronic component mounting apparatus that has this restriction dimensionally, because the vertically stacked foundation structure of a plurality of illuminating board, the size of lighting device on short transverse is greater than admissible height space in the device design.In addition, because a plurality of LED are arranged to the light-source structure of annular, so the size of lighting device in planimetric map is greater than the space in the admissible planimetric map in the device design.For those reasons, the layout owing to light source is difficult to reduce according to the size of lighting device on short transverse in the electronic component mounting apparatus of prior art, and, because the structure of light source also is difficult to reduce the size of lighting device in planimetric map.As a result, be difficult to lighting device is applied in the undersized electronic element installation device.
Therefore, the purpose of this invention is to provide a kind of lighting device that in electronic component mounting apparatus, is used for image capturing, this electronic component mounting apparatus has small size and have small size in planimetric map on the short transverse, and can satisfy the demand that size reduces.
Technical scheme
According to an aspect of the present invention, provide a kind of lighting device that is used for image capturing in electronic component mounting apparatus, this lighting device is to substrate emissive lighting light, and the image of this substrate will be caught by camera.This lighting device comprises: flat illuminating board is arranged between substrate and the camera being basically parallel to the surface of substrate, and has and be arranged on its lip-deep light source portion in the face of substrate; Lighting control unit with the described light source portion of control.Light source portion comprises a plurality of independent light sources (a plurality of individuallight sources), described a plurality of independent light source is around being used for the aperture arrangement of image capturing and with the surface emitting illumination light of different emission angle to substrate, and the imaging optical axis of camera is by described opening.Lighting control unit is controlled described a plurality of independent light source individually.
Beneficial effect
According to the present invention, with different emission angle emissive lighting light components to a plurality of independent light source arrangement of substrate surface on flat illuminating board.According to this structure, can reduce lighting device in size on the short transverse and the size in planimetric map.As a result, can satisfy the demand that the lighting device size reduces.
Description of drawings
Fig. 1 is the skeleton view that illustrates according to the electronic component mounting apparatus of the embodiment of the invention.
Fig. 2 is the planimetric map that illustrates according to the electronic component mounting apparatus of the embodiment of the invention.
Fig. 3 is the side view that illustrates according to the installation head of the electronic component mounting apparatus of the embodiment of the invention.
Fig. 4 is the rear view that illustrates according to the installation head of the electronic component mounting apparatus of the embodiment of the invention.
Fig. 5-a is the diagrammatic sketch of structure that is used for the lighting device of image capturing in the electronic component mounting apparatus that is illustrated in according to the embodiment of the invention.
Fig. 5-b is the diagrammatic sketch of structure that is used for the lighting device of image capturing in the electronic component mounting apparatus that is illustrated in according to the embodiment of the invention.
Fig. 6 is the diagrammatic sketch of emission angle that the illumination light of the lighting device emission that is used for image capturing from the electronic component mounting apparatus according to the embodiment of the invention is shown.
Fig. 7 is the block diagram that illustrates according to the structure of the control system of the electronic component mounting apparatus of the embodiment of the invention.
Fig. 8-a is the diagrammatic sketch of component size that is used for the lighting device of image capturing in the electronic component mounting apparatus that illustrates according to the embodiment of the invention.
Fig. 8-b is the diagrammatic sketch of component size that is used for the lighting device of image capturing in the electronic component mounting apparatus that illustrates according to the embodiment of the invention.
Fig. 9-a is the diagrammatic sketch of component size that is used for the lighting device of image capturing in the electronic component mounting apparatus that illustrates according to prior art.
Fig. 9-b is the diagrammatic sketch of component size that is used for the lighting device of image capturing in the electronic component mounting apparatus that illustrates according to prior art.
Embodiment
With reference to appended accompanying drawing exemplary embodiment of the present invention is described below.
At first, describe the structure of electronic component mounting apparatus with reference to Fig. 1,2 and 3, this electronic component mounting apparatus is as being used for that electronic component is installed in the electronic component placing apparatus that the electronic component hookup wire on the substrate uses.In Fig. 1, transport path 2 and be arranged on the pedestal 1 along directions X.Transport the substrate 3 that 2 pairs in path is equipped with electronic component and transmit, and substrate 3 is positioned at is arranged at the installation site of transporting on the path 2.Parts provide unit 4 to be arranged on the both sides of transporting path 2, and a plurality of tape feeders 5 are installed in each parts and provide in the unit 4.
Y-axle travelling table 7 with linear driving mechanism is arranged on the end on directions X of pedestal 1, to be parallel to the Y direction.Y-axle travelling table 7 has the beam 7a as main element (main component), and this beam 7a is elongated in the horizontal direction, and linear track 8 along continuous straight runs are arranged on the beam 7a.Linear block 9 is assembled to linear track 8, make them to slide along the Y direction, and, linear block 9 is connected to the have linear driving mechanism X-axle travelling table 13 of (referring to fixed component shown in Figure 3 11 and movable member 12), and vertically the carriage 10 that couples of the rectangle of She Zhiing places between the two.
X-axle travelling table 13 has the beam 13a as main element, and this beam 13a is elongated on directions X, and linear track 14 along continuous straight runs are arranged on the beam 13a.As shown in Figure 3, linear block 15 is assembled to linear track 14, makes them to slide along directions X, and linear track 14 is connected to installation head 17, and vertically the carriage 16 that couples of the rectangle of She Zhiing places between the two.Couple carriage 16 and be couple to the movable member 12 that forms linear driving mechanism, movable member 12 is in the face of fixed component 11 and slip thereon.
Parts device for identifying 6 is arranged on parts and unit 4 is provided and transports between the path 2.When the installation head 17 that provides unit 4 to take out electronic component from parts was mobile above parts device for identifying 6, parts device for identifying 6 was caught image and this electronic component of identification that is maintained at the electronic component in the installation head 17.When electronic component being installed on the substrate 3, between the electronic component installation period based on the installation site of this identification result correcting electronic element.As shown in Figure 2, the substrate identification camera unit 20 that moves with installation head 17 one is attached to the bottom of X-axle travelling table 13.As shown in Figure 3, substrate identification camera unit 20 is attached to and is arranged on the camera installation portion 19 that couples in the carriage 16, and the imaging optical axis a of this substrate identification camera unit 20 faces down.Substrate identification camera unit 20 moves above substrate 3 with installation head 17, to catch the image that is arranged on the identification marking 3a on the substrate 3.
Next, the structure of the camera installation portion 19 that is attached to installation head 17 is described with reference to Fig. 4.Camera installation portion 19 is arranged for substrate identification camera unit 20 is attached to installation head 17.In this embodiment, camera installation portion 19 constructs by following parts are set in coupling carriage 16, and wherein installation head 17 is couple to and couples carriage 16.In addition, camera installation portion 19 can be attached to other element except coupling carriage, as long as they can move with installation head 17 one.For example, substrate identification camera unit 20 can directly be attached to installation head 17.
Fig. 4 shows the rear side (described trailing flank is to X-axle travelling table 13) of installation head 17.Register pin 16b is arranged among the lower surface 16a that couples carriage 16, and this register pin 16b is the reference point of the position of substrate identification camera unit 20 on the Z direction.In addition, two register pin 16d are arranged among the rear surface 16c that couples carriage 16, these two reference point that register pin 16d is the position of substrate identification camera unit 20 on directions X.When substrate identification camera unit 20 is attached to camera installation unit 19, wherein coupling carriage 16 falls between, one side of substrate identification camera unit 20 contacts with register pin 16d, and substrate identification camera unit 20 contacts with register pin 16b in being arranged on lower surface 16a.Under this state, substrate identification camera unit 20 is fastened to the rear surface 16c that couples carriage 16 by bolt 21.In this way, substrate identification camera unit 20 is positioned at the position of regulation in the horizontal direction with on the vertical direction, and imaging optical axis a aims in vertical direction.
Next, the structure of substrate identification camera unit 20 is described with reference to Fig. 5-a and Fig. 5-b.Shown in Fig. 5-a, substrate identification camera unit 20 comprises camera 25, be coupled to the coaxial lighting unit 26 of lower surface of camera 25 and the surface illumination unit (surface lighting unit) 30 that is installed to the lower surface of coaxial lighting unit 26.Camera 25 constructs by light receiving unit 23 is coupled to optical unit 24, is provided with light receiving element 23a in the light receiving unit 23, and optical unit 24 is provided with lens 24a and 24b and prism 24c.Light receiving unit 23 is coupled to optical unit 24 under the state that imaging optical axis a along continuous straight runs is aimed at.Therefore, scioptics 24b is reflected in the horizontal direction by prism 24c to the image light of vertical incidence upward from the downside edge, and scioptics 24a is incident on the light receiving element 23a then, and wherein lens 24b will captive object near image.Then, light focuses on the precalculated position, and the image that image will captive object is formed on the light receiving element 23a.
Catch at the substrate identification camera unit 20 that is provided with surface illumination unit 30 under the state of image of the substrate 3 for the treatment of captive object as image, surface illumination unit 30 is arranged essentially parallel to as image and treats that the substrate 3 of captive object is arranged on the position in the face of substrate 3.Therefore, under this state, the surface that illuminating board 31 is basically parallel to substrate 3 is arranged between substrate 3 and the camera 25, and light source portion 32 is arranged on facing on the lower surface of substrate 3 of illuminating board.In the surface illumination unit 30 according to present embodiment, light source portion 32 comprises separately controllable a plurality of light source.
Fig. 5-b shows the structure of the light source portion 32 on the lower surface that is arranged on illuminating board 31.Three kinds of independent light sources, that is, last lighting source 32a, intermediate illumination light source 32b and following lighting source 32c arrange around opening 31a.These independent light sources constitute by LED.In the present embodiment, the LED of red-emitting is as last lighting source 32a and intermediate illumination light source 32b, and the LED of emission white light is used as lighting source 32c down.Treat captive object and application target according to image, suitably select kind as the LED of these independent light sources.
Shown in Fig. 5-b, last lighting source 32a is arranged near the position of imaging optical axis a, and intermediate illumination light source 32b is arranged to the outside around last lighting source 32a.Following lighting source 32c only be arranged in imaging optical axis a be the center rectangular extent (A represents by dotted line) place, four angles and in the outside of intermediate illumination light source 32b.Preferably, these independent light source arrangement become almost about imaging optical axis a symmetry.
Fig. 6 shows the emission angle of illumination light, and when substrate identification camera unit 20 was caught the image of substrate 3, this illumination light was transmitted into the surface of substrate 3 downwards from the surface illumination unit 30 on the lower surface that is arranged on illuminating board 31.That is, as shown in Figure 6, lighting unit 30 is installed in the substrate identification camera unit 20, and illuminating board 31 is arranged to be basically parallel to substrate 3.Under this state, last illumination light composition 35a, intermediate illumination light component 35b and the following illumination light composition 35c from last lighting source 32a, intermediate illumination light source 32b and following lighting source 32c emission is incident on the surface of substrate 3 with the emission angle of a1, a2 and a3 respectively respectively.In addition, the illumination light of launching from coaxial illumination light source portion 27 reflects from half-reflecting mirror 26a, and the emission angle with 90 degree are incident on the substrate 3 then.
In addition, the reason that these independent light sources are divided into light source, central source and following light source is: three kinds of independent light sources of needs, promptly, be arranged on the short transverse diverse location on light source, central source and following light source, to be different from emission angle a1, a2 and the a3 emissive lighting light of the emission angle in the lighting device (referring to the lighting device 30A shown in Fig. 9-a) according to prior art.Therefore, in the present embodiment, light source only is to have the name identical with light source of the prior art.In addition, in the present embodiment, emission angle a1, a2 and a3 are meant from the average emitted angle of the illumination light of a plurality of LED emissions that form independent light source.
In the layout of independent light source, as mentioned above, following lighting source 32c has the independent light source of the following illumination light composition 35c (emission angle a1) of minimum emission angle as emission, and only being arranged in imaging optical axis a is the place, four angles of the rectangular extent at center.In this arrangement, the point symmetry that is incident on the illumination light on the substrate 3 has a little impaired, but but the non-uniform Distribution of illumination light in allowed band, this is because down lighting source 32c is apart from imaging optical axis a farthest, that is, following lighting source 32c has the longest illumination distances.Adopt this layout to make it possible to reduce significantly the size of surface illumination unit 30 in planimetric map, and satisfy the requirement of compact optical, this will be described below.
Next, with reference to the structure of Fig. 7 description control system.In Fig. 7, control module 40 is the master controllers with CPU, and controls following element.Illumination data storage unit 41 storage is used to open the illumination data of the independent light source of the LED 28 of coaxial illumination light source portion 27 or surface illumination unit 30 with illuminating board 3, promptly, be used to image to treat the data of the independent light source that captive each object is set, or from the data of the illumination light intensity of independent light emitted.The view data that identification unit 42 identifications are obtained by camera 25, and the position of detection identification marking 3a.Driver element 43 drives X-axis linear motor 13M that is arranged in the X-axle travelling table 13 and the Y-axis linear motor 7M that is arranged in the Y-axle travelling table 7.
Next, the effect of the substrate identification camera unit 20 that is provided with the surface illumination unit 30 with said structure is described with reference to Fig. 8-a, 8-b, 9-a and 9-b.Fig. 8-a, 8-b, 9-a and 9-b illustrate respectively according to the substrate identification camera unit 20 that is provided with surface illumination unit 30 of present embodiment with according to the diagrammatic sketch of the substrate identification camera unit 20A that is provided with lighting unit 30A of prior art.
The surface illumination unit 30 that is installed to substrate identification camera unit 20 by arrange on the monolithic illuminating board 31 shown in Figure 5 on lighting source 32a, intermediate illumination light source 32b and following lighting source 32c form.Therefore, shown in Fig. 8-a, can reduce the thickness T 1 of lighting unit 30 significantly.On the contrary, as in the lighting unit 30A that is installed to the substrate identification camera unit 20A shown in Fig. 9-a according to prior art, when three kinds of independent light sources, for example go up lighting source 36a, intermediate illumination light source 36b and following lighting source 36c, when vertically being arranged to three layers, the thickness T 2 of lighting unit 30A is summations of the thickness of independent light source in these three layers.Therefore, thickness T 2 is than several times greatly of the thickness T shown in Fig. 8-a 1, and this makes and is difficult to reduce the size of lighting device on short transverse.
In addition, in surface illumination unit 30 according to present embodiment, as mentioned above, in the layout of last lighting source 32a, intermediate illumination light source 32b and following lighting source 32c, following lighting source 32c, have the light source of the following illumination light composition 35c (emission angle a1) of minimum emission angle as emission, only being arranged in imaging optical axis a is the place, four angles of the rectangular extent at center.Therefore, shown in Fig. 8-b, following lighting source 32c is arranged in the rectangular extent with length L and width B.That is, the layout scope of following lighting source 32c is identical with the scope that obtains in the outstanding part layout scope of Width that cuts the following lighting source 36c shown in Fig. 9-a.On the contrary, in lighting unit 30A, shown in Fig. 9-b, be difficult to the size of lighting device in planimetric map is reduced to littler than the outer diameter D of the ring that constitutes by following lighting source 36c.As a result, be difficult to reduce the size of lighting device in planimetric map.
As mentioned above, in surface illumination unit 30 according to present embodiment, with different emission angle emissive lighting light components to a plurality of independent light source arrangement of substrate surface on flat illuminating board.In addition, in these independent light sources, only being arranged in the imaging optical axis with the independent light source of the emission angle emissive lighting light of minimum is four angles of the rectangular extent at center.
In this way, can reduce the thickness of surface illumination unit 30 significantly, and prevent that the independent light source that is positioned periphery is projected into the outside.As a result, can reduce the overall dimensions of lighting device in planimetric map.Therefore, reducing and the packing density of electronic component increases and under the current state that reduces in the size of erecting equipment along with the size of the substrate that electronic component is installed, even when installation head the size on the short transverse and size in planimetric map with compare according to the installation head of prior art when being restricted, also guaranteed to be used for the versatility of the lighting device of image capturing.
In the above-described embodiments, be applied to the substrate identification camera unit of electronic component mounting apparatus with the surface illumination unit 30 of the lighting device that acts on image capturing, but the invention is not restricted to this.The present invention can be applied to install the various device in the field of electrical components.For example, the present invention can be applied to the parts device for identifying of electronic component mounting apparatus, the welding inspection device of screen printing apparatus and the image capture apparatus of checking exterior substrate after the parts installation.
Industrial usability
According to the present invention, on short transverse, have small size and have small size owing to be used for the lighting device that is used for image capturing of electronic component mounting apparatus, so it can satisfy the demand that size reduces at planimetric map.In addition, lighting device can be used for installing the various device of field of electrical components, for example the substrate identification camera of electronic component mounting apparatus.
Claims (4)
1. lighting device that in electronic component mounting apparatus, is used for image capturing, this lighting device is to substrate emissive lighting light, and the image of this substrate will be caught by camera, and this lighting device comprises:
Flat illuminating board is arranged between substrate and the camera being basically parallel to the surface of substrate, and has and be arranged on its lip-deep light source portion in the face of substrate; With
Control the lighting control unit of described light source portion,
Wherein, light source portion comprises a plurality of independent light sources, and described a plurality of independent light sources are around being used for the aperture arrangement of image capturing and with the surface emitting illumination light of different emission angle to substrate, and the imaging optical axis of camera is by described opening,
Lighting control unit is controlled described a plurality of independent light source individually, and
Wherein, in independent light source, it is the place, four angles of the rectangular extent at center that the independent light source with minimum emission angle only is arranged in the imaging optical axis.
2. according to the lighting device that in electronic component mounting apparatus, is used for image capturing of claim 1,
Wherein, lighting control unit is controlled described a plurality of independent light source based on lighting pattern, described lighting pattern by making up independent light source the state that opens or closes or obtain from the illumination intensity of the light of independent light emitted.
3. according to the lighting device that in electronic component mounting apparatus, is used for image capturing of claim 1,
Wherein, light source is LED separately.
4. according to the lighting device that in electronic component mounting apparatus, is used for image capturing of claim 1,
Wherein, the independent light source with minimum emission angle is the LED of emission white light.
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP040233/2007 | 2007-02-21 | ||
| JP040232/2007 | 2007-02-21 | ||
| JP2007040232A JP2008205226A (en) | 2007-02-21 | 2007-02-21 | Illumination apparatus for imaging in electronic component mounter |
| JP2007040233A JP4661799B2 (en) | 2007-02-21 | 2007-02-21 | Illumination device for imaging in electronic component mounting device |
| PCT/JP2008/000274 WO2008114486A1 (en) | 2007-02-21 | 2008-02-19 | Lighting device for image capturing in electronic component mounting apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101584263A CN101584263A (en) | 2009-11-18 |
| CN101584263B true CN101584263B (en) | 2011-12-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008800023947A Active CN101584263B (en) | 2007-02-21 | 2008-02-19 | Lighting device for image capturing in electronic component mounting apparatus |
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| Country | Link |
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| JP (1) | JP2008205226A (en) |
| CN (1) | CN101584263B (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5338772B2 (en) * | 2010-08-26 | 2013-11-13 | パナソニック株式会社 | Component mounting apparatus, imaging illumination apparatus, and illumination method |
| JP5338773B2 (en) * | 2010-08-26 | 2013-11-13 | パナソニック株式会社 | Component mounting apparatus, imaging illumination apparatus, and illumination method |
| KR101748622B1 (en) | 2012-03-21 | 2017-06-20 | 한화테크윈 주식회사 | Side light apparatus and light apparatus using that of chip mounter |
| WO2015181898A1 (en) * | 2014-05-27 | 2015-12-03 | ヤマハ発動機株式会社 | Component mounting apparatus and tape feeder |
| JP6683500B2 (en) * | 2016-02-24 | 2020-04-22 | 株式会社ディスコ | Inspection equipment and laser processing equipment |
| JP7021347B2 (en) * | 2018-05-31 | 2022-02-16 | ヤマハ発動機株式会社 | Recognition parameter optimization device, component mounting system, recognition parameter optimization method |
| CN114223321B (en) * | 2019-08-05 | 2023-07-11 | 株式会社富士 | Light source device |
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|---|---|---|---|---|
| US6542238B1 (en) * | 1998-02-27 | 2003-04-01 | Matsushita Electric Industrial Co., Ltd. | Electronic component mounting apparatus |
| EP1548396A1 (en) * | 2002-08-08 | 2005-06-29 | Matsushita Electric Industrial Co., Ltd. | Illumination device, recognizing device with the illumination device, and part mounting device |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2634700B2 (en) * | 1991-01-16 | 1997-07-30 | 三菱電機株式会社 | Lighting equipment |
| JP2000022393A (en) * | 1998-06-30 | 2000-01-21 | Yamaha Motor Co Ltd | Illuminator for recognition |
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2007
- 2007-02-21 JP JP2007040232A patent/JP2008205226A/en active Pending
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- 2008-02-19 CN CN2008800023947A patent/CN101584263B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6542238B1 (en) * | 1998-02-27 | 2003-04-01 | Matsushita Electric Industrial Co., Ltd. | Electronic component mounting apparatus |
| EP1548396A1 (en) * | 2002-08-08 | 2005-06-29 | Matsushita Electric Industrial Co., Ltd. | Illumination device, recognizing device with the illumination device, and part mounting device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101584263A (en) | 2009-11-18 |
| JP2008205226A (en) | 2008-09-04 |
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