KR101157158B1 - Chip Recognition Apparatus for Chip-Mounter - Google Patents

Abstract

The present invention relates to a component recognition device for a component mounter, comprising: a lighting unit having a plurality of lighting units installed on an inner surface to provide flash lighting, and a heat dissipating unit for radiating heat generated from the lighting unit; An image transfer unit configured to transfer an image of the electronic component generated by the illumination of the illumination unit; And a scan camera that detects a positional error of the electronic component based on an image provided from the image transfer unit, with a camera exposure time of 60-5 ms.

According to the present invention, a flying scan does not stop at the top of a part recognition device, and uses a multi-array light source for optimized recognition, recognizes parts from various angles, and specifies a multi-array of high brightness light sources based on the characteristics of each part. Night lighting is possible. In addition, it provides a dark field illumination for lighting of a light source optimized for component recognition and recognition of a mirror part by giving a difference in a specific position of a light source and a light quantity of the light sources arranged according to the characteristics of a component in a lighting system using a multi-array light source. In addition, by adopting a heat dissipation structure to prevent high heat, the deterioration phenomenon of the light source can be reduced, and the heat dissipation fan speed can be easily adjusted according to temperature conditions.

Component room, lighting unit, camera exposure time

Description

Component Recognition Device for Component Mounter {Chip Recognition Apparatus for Chip-Mounter}

The present invention relates to a component mounting apparatus for a component mounter, and more particularly, to a component mounting apparatus for a component mounter for detecting a defect by recognizing a position of the component before mounting the component on a substrate.

In general, a component mounter (chip mounter) is a device for mounting a (electronic) component such as a semiconductor package on a substrate (PCB).

In recent years, substrates have high density, high functionality, and thus individual integrated circuit components have high functionality as well. This increases the output pins mounted on the substrate, and the gap between the output pins becomes narrower.

Therefore, before mounting the component, it is required that the component is accurately mounted on the electronic substrate by being rotated at the correct angle.

In order to accurately mount the component at a predetermined position, it is necessary to accurately check the suction state and the center position of the component before the component supplied from the component supply unit is mounted on the substrate. For this purpose, a component recognition device is used.

For the part recognition devices, the camera uses a line scan camera and an area scan camera for the part recognition, and the illumination system uses a bright field illumination system.

The line system with the line scan camera is fixed in the direction in which the part is scanned, so that the dome lighting and the spatial system of the illumination system are recognized so that the part is recognized while the part is flying as it passes. There is a lot of room for configuration, and a wide variety of lighting, such as back light lighting. That is, it is timed to recognize a component in the constant velocity section of a component moving section.

The area scan camera-applied illumination system is a brightfield illumination system in which the exposure time is increased because the recognition component picks up at a stationary state, and an amount of light that can be operated at an exposure time longer than necessary brightness is used. For this reason, the heat dissipation structure for the deterioration phenomenon is not adopted.

Part mounters can use the shortest distance to mount the parts to increase the productivity. Bars can be optimally mounted using the short path only when scanning in any direction of the part recognition device.

However, the conventional component recognition device has a problem that the scan direction cannot be freely moved from the upper end of the recognition device to the shortest path.

In the related art, the timing operation time of a camera is long, and it is very difficult to image an image to be operated.

In addition, conventionally, the responsiveness is slow or the light emission illuminance is dark, which is not suitable for short imaging.

The present invention has been made to solve the above-mentioned problems, flying scanning without stopping at the top of the component recognition device, using a multi-array light source for optimized recognition recognizes the parts from a variety of angles and high brightness mainly on the characteristics of each part It is an object of the present invention to provide a component recognition device for a component mounter capable of brightfield and darkfield illumination with multiple arrays of light sources.

In addition, another object of the present invention is to realize the lighting and mirror part recognition of the light source optimized for component recognition by giving a difference in the light position of the light source and the specific position of the light source arranged in accordance with the characteristics of the components of the illumination system using a multi-array light source The present invention provides a component recognition device for a component mounter.

In addition, another object of the present invention is to provide a component recognition device for a component mounter by adopting a heat dissipation structure to prevent high heat to reduce the deterioration phenomenon of the light source, and can easily adjust the heat dissipation fan speed according to the temperature conditions. .

It is still another object of the present invention to provide a component recognition device for a component mounter capable of shortening the exposure time of a camera to 40usec to 10usec and implementing a momentary lighting method for each channel to give a sufficient light amount for a short exposure time.

In general, in order to quickly mount a component on a substrate while transferring the component at a high speed, a component recognition device that is not influenced by the transportation trajectory of the component is required. Conventionally, a line scan camera is used to limit mobility. Recognize the component at the top of the lighting system in order to receive the recognition or to acquire a still image using an area camera. However, in this case, it affects the part recognition speed and the X-Y movement trajectory, which affects the mounting speed of the whole machine.

In the present invention, in order to reduce the movement of the camera unit and the lighting unit, that is, the trajectory, the camera freely recognizes the parts regardless of the X-Y direction and does not show the pixel delay of the acquired parts.

In the present invention, in the case of a camera, a short exposure is used by using a synchronization signal, and the time relationship between the exposure and the frame trigger is 60-5 ms, more preferably 40 ms, through numerous experiments. It was confirmed that the optimum at ~ 10㎲. In order to obtain an optimal image, a flash light with fast responsiveness is used.

The lighting system uses the strobe flash type to induce optimal light emission at the moment, and arranges the light source to be optimal for component recognition by arranging it at various angles to maintain optimal uniformity. An optical sensor is provided to correspond to the change in illuminance of the light source to correspond to the change over time. In addition, a high brightness light source is used to optimize the illumination system, and various heat dissipation parts are provided to solve a heat dissipation problem in high brightness light emission.

In order to achieve the above object, the component recognition device for a component mounter of the present invention is provided with a plurality of lighting units installed on the inner surface to provide a flash light, and a lighting unit having a heat dissipation unit for radiating heat generated from the lighting unit. unit; An image transfer unit configured to transfer an image of the electronic component generated by the illumination of the illumination unit; And a scan camera that detects a positional error of the electronic component based on an image provided from the image transfer unit, with a camera exposure time of 60-5 ms.

A light amount correction unit, for example, an optical sensor, is provided under the lighting unit to keep the light amount of the lighting unit constant.

The lighting unit includes side lights installed to support lighting of a lead and a ball of the electronic component, and first inclined lights and second inclined lights installed to support lighting of a central portion of the electronic component.

The heat dissipation unit is a heat dissipation cover located on the front side of the lighting unit; A heat sink located at a rear side of the lighting unit; And a heat dissipation fan installed adjacent to the heat dissipation plate.

Component recognition apparatus for component mounter of the present invention comprises a temperature sensor for measuring the temperature of the lighting unit; And a control unit controlling the lighting unit at a constant temperature according to the temperature sensor. The image transfer unit may be a beam splitter.

The scan camera is an area scan camera, and the camera exposure time of the scan camera is 40-10 ms.

In addition, the component recognition device for a component mounter of the present invention includes a coaxial lighting unit, and a plurality of heat dissipation slots are formed on an outer circumferential surface of the lighting unit.

As described above, according to the present invention, a flying scan is performed without stopping at the top of the component recognition device, and multiple array light sources are recognized at various angles by using a multi-array light source for optimized recognition, and a multi-array array of high brightness light sources based on characteristics of each part. Brightfield, darkfield illumination is possible.

In addition, it is equipped with a dark field illumination system for lighting of the light source optimized for component recognition and recognition of specular parts by giving a difference in the specific position of the light sources and the light quantity of the light sources arranged according to the characteristics of the components among the illumination systems using multiple array light sources. .

In addition, by adopting a heat dissipation structure to prevent high heat, the deterioration phenomenon of the light source can be reduced, and the heat dissipation fan speed can be easily adjusted according to temperature conditions.

In addition, to shorten the exposure time of the camera to 40usec ~ 10usec, and to provide a sufficient amount of light for a short exposure time, it is possible to implement the instant lighting method for each channel.

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

1 is an external perspective view showing a component recognition device for a component mounter according to a preferred embodiment of the present invention, Figure 2 is an internal perspective view of Figure 1, Figure 3 is a perspective view showing the lighting unit of Figure 1, Figure 4 A block diagram illustrating the operation of a component recognition device for a component mounter according to a preferred embodiment of the present invention.

As shown in Figures 1 to 4, the component mounting apparatus for component mounting apparatus 100 of the present invention is a plurality of lighting unit 111 is installed on the inner side to provide a flash light, and the lighting unit 111 Lighting unit 110 having a heat dissipation unit (115) for radiating heat generated from the; An image transmitting unit 120 for transmitting an image of a component generated by the lighting of the lighting unit 110; And a scan camera 130 that detects a positional error of a component based on an image provided from the image transfer unit 120 and sets a camera exposure time to 60-5 ms.

A plurality of heat dissipation slots 110a are formed on the outer circumferential surface of the lighting unit 110.

The lighting unit 111 is a side light (111a) is installed to support the lighting of the lead, the ball of the part, the first inclined light (111b) is installed to support the illumination of the central part side of the part, The second inclined light 111c is provided. The image transmission unit 120 is a beam splitter.

The heat dissipation unit 115 may include a heat dissipation cover 115a positioned at a front side of the lighting unit; A heat sink 115b positioned at a rear side of the lighting unit 111; And a heat dissipation fan 115c installed adjacent to the heat dissipation plate 115b.

A substrate P is installed below the illumination unit 110, and a light quantity correction unit, for example, an optical sensor 140, is provided on the substrate P to maintain a constant amount of light of the illumination unit 110. Is provided. In addition, the substrate P under the lighting unit 110 is provided with a coaxial lighting unit 150, a temperature sensor 160 for measuring the temperature of the lighting unit 110 and the coaxial lighting unit 150, the heat radiation plate ( 161 and the heat radiation fan 162 are further provided.

The component recognition device 100 for a component mounter of the present invention includes a control unit 170 for controlling the lighting unit 110 and the coaxial lighting unit 150 at a constant temperature at all times.

The scan camera 130 is an area scan camera, and the camera exposure time of the area scan camera is preferably 40-10 ms.

Referring to the operation of the component recognition device for a component mounter according to a preferred embodiment of the present invention configured as described above are as follows.

In order to adsorb / recognize parts not shown, the X-Y stage moves to the parts supply device to adsorb the parts. The adsorbed parts are automatically recognized by the DB information of the drive motor.

When the picked-up component moves toward the center of the lighting unit 110, and the component reaches the center of the lighting unit 110, the scan camera 130 is turned on by an encoder signal of a driving motor (not shown). do.

At this time, the illumination unit 110 performs illumination corresponding to the component by the illumination DB of the component picked up immediately before the scan camera 130 is turned on.

That is, the lighting is composed of 4 CHs as follows.

In lighting, the bright field illumination system plays a major role, and the dark field illumination system is used for mirror part recognition such as shiny parts. It is necessary to utilize a high-brightness illumination system to focus on recognizing the lead side of a part, or to secure sufficient image brightness at a short exposure time when recognizing a part such as a ball or a chip. In this case, the lighting is directly irradiated with sufficient light using the method of bright field illumination system.

The lighting system uses a white light source to cope with various colors. This color correspondence of the illumination system is associated with the characteristics of the camera sensor unit to secure a sufficient amount of light. The white color is a color that can adjust the entire visible light region, which is selected to optically solve the characteristics of various colors of the part.

When the illumination unit 110 is turned on, the image reflected by the beam splitter 120 is received by the scan camera 130 via the lens 131. Based on the image provided from the beam splitter 120, the scan camera 130 captures an image with a camera exposure time of 60 to 5 ms, preferably 40 to 10 ms, thereby recognizing the data (not shown). ) To detect the positional error of the component.

If the illumination is dark due to light source aging, the light sensor (or light amount change detection sensor) 140 detects the light amount and feeds it back. In this case, the controller 170 automatically corrects the amount of light so as to always obtain an image under constant illumination.

If a high temperature occurs in the process of detecting the component positional error, the temperature sensor 160 detects this and transmits this data to the controller 170. The controller 170 rotates the blowing fans 115c and 162 at high speed to increase the heat dissipation performance so as to maintain a uniform temperature at all times.

As described above, in the detailed description of the present invention has been described with respect to preferred embodiments of the present invention, those skilled in the art to which the present invention pertains various modifications can be made without departing from the scope of the present invention Of course.

Therefore, the scope of the present invention should not be limited to the described embodiments, but should be determined not only by the claims below, but also by the equivalents of the claims.

1 is a perspective view showing a component recognition device for a component mounter according to an embodiment of the present invention

2 is an internal perspective view of FIG. 1

3 is a perspective view of the lighting unit of FIG.

Figure 4 is a block diagram illustrating the operation of the component recognition device for component mounter according to the present invention.

* Description of main parts

100: part recognition device

111: lighting department

115: heat dissipation unit

110: lighting unit

120: video delivery unit

130: scan camera

110a: heat dissipation slot

111a: side lighting

111b: first inclined light

111c: second oblique light

115a: heat dissipation cover

115b: heat sink

115c: heat dissipation fan

P: Substrate

140: light sensor

150: coaxial lighting unit

160: temperature sensor

161: heat sink

162: heat dissipation fan

170: control unit

Claims (11)

A lighting unit having a plurality of lighting units installed on an inner side to provide flash lighting; An image transfer unit configured to transfer an image of the electronic component generated by the illumination of the illumination unit; And A scan camera detecting a positional error of the electronic component based on an image provided from the image transfer unit, with a camera exposure time of 60-5 ms; The lighting unit includes a heat dissipation unit including a heat dissipation cover positioned on the front side of the lighting unit, a heat dissipation plate positioned on the rear side of the lighting unit, and a heat dissipation fan installed adjacent to the heat dissipation unit. The method of claim 1, A component recognition device for a component mounter, characterized in that a lower portion of the lighting unit is further provided with coaxial illumination. The method of claim 2, And a light amount correcting unit is provided under the lighting unit to maintain a constant amount of light of the lighting unit. The method of claim 3, The component recognition device for a component mounter, characterized in that the light amount correction unit includes an optical sensor. The method of claim 1, The lighting unit may include side lighting installed to support lighting of a lead and a ball of the electronic component, and first inclined lighting and second inclined lighting installed to support lighting of a central portion of the electronic component. Component recognition device for component mounter characterized in that. delete 3. The method of claim 2, A temperature sensor for measuring the temperature of the illumination unit and the coaxial illumination unit; And And a control unit for controlling the lighting unit and the coaxial lighting unit at a constant temperature according to the temperature sensor. The method of claim 1, The component recognition device for a component mounter, characterized in that the image transmission unit comprises a beam splitter. The method of claim 1, The component recognition device for a component mounter, characterized in that the scan camera is an area scan camera. The method of claim 1, A component mounting apparatus for component mounting apparatus, wherein the camera exposure time of the scan camera is 40-10 ms. The method of claim 1, Component mounting apparatus component recognition device, characterized in that a plurality of heat radiation slots are formed on the outer peripheral surface of the lighting unit.

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