JP6645534B2 - Deposition mask with frame - Google Patents

Description

The present invention relates to a frame with the deposition mask.

  With an increase in the size of a product using an organic EL element or an increase in the size of a substrate, a demand for an increase in the size of an evaporation mask is increasing. And the metal plate used for manufacture of the vapor deposition mask which consists of metal is also increasing in size. However, it is difficult to form slits on a large-sized metal plate with high precision using current metalworking techniques, and it is not possible to cope with high-definition slits. Further, in the case of using a vapor deposition mask made of only metal, the mass increases as the size increases, and the total mass including the frame also increases, which hinders handling.

  Under such circumstances, Patent Literature 1 discloses that a metal mask provided with a slit and a resin mask in which a plurality of rows of openings corresponding to a pattern to be deposited and located on the surface of the metal mask are arranged in rows and columns. There has been proposed a deposition mask formed by such a method. According to the deposition mask proposed in Patent Literature 1, it is said that both high definition and light weight can be satisfied even when the size is increased, and that a high definition deposition pattern can be formed. ing.

Japanese Patent No. 5288072

  An object of the present invention is to further improve a deposition mask in which a metal mask and a resin mask are stacked as described in Patent Document 1 described above, and to improve the yield and the quality in a manufacturing process using the deposition mask. A main object is to provide an evaporation mask, an evaporation mask preparation, and a method for manufacturing an organic semiconductor element using the evaporation mask.

The present invention for solving the above problems is a frame-equipped vapor deposition mask in which a vapor deposition mask is fixed to a frame, wherein the vapor deposition mask fixed to the frame is provided with a resin opening corresponding to a pattern to be vapor-deposited. and on one surface of the resin layer, the metal layer of the metal opening is provided overlapping the resin opening is laminated on a part of the side of the surface in contact with the resin layer of the metal layer, a plurality of alignment marks Is provided, and at least one of the plurality of alignment marks is a deposition mask not in contact with one surface of the resin layer .

Further, the alignment mark may be a through hole penetrating the metal layer .

  Further, according to the present invention for solving the above problems, a metal mask provided with a slit overlapping with the opening is laminated on one surface of a resin mask provided with an opening corresponding to a pattern to be formed by vapor deposition. A vapor deposition mask preparation for obtaining a vapor deposition mask, wherein a metal mask provided with a slit is laminated on one surface of a resin plate not provided with the opening, and the metal mask A plurality of alignment marks are provided on a part of the surface in contact with the resin plate, and at least one of the plurality of alignment marks is not in contact with one surface of the resin plate.

The present invention for solving the above problems is a method of manufacturing an organic semiconductor device, including the step of forming a deposition pattern on the evaporation object using the frame with the deposition mask described above.

  In the step of forming the vapor deposition pattern, the alignment mark provided on the vapor deposition mask of the frame-equipped vapor deposition mask is used to position the vapor deposition mask with the frame and the object to be vapor-deposited, and A semiconductor element may be manufactured.

  ADVANTAGE OF THE INVENTION According to the vapor deposition mask of this invention, even if it enlarges, it can satisfy | fill both high definition and weight reduction, and can improve the yield and quality in the manufacturing process using a vapor deposition mask. According to the vapor deposition mask preparation of the present invention, a vapor deposition mask exhibiting the above effects can be obtained. Further, according to the method for manufacturing an organic semiconductor device of the present invention, an organic semiconductor device having excellent quality can be manufactured with high yield.

(A) is a front view of the vapor deposition mask of one embodiment as viewed from the resin mask side, (b) is a front view of the resin mask of one embodiment as viewed from the metal mask side, and (c) is And (b) is a schematic sectional view taken along the line AA. It is a schematic sectional drawing of the vapor deposition mask of one Embodiment. It is a schematic sectional drawing of the vapor deposition mask of one Embodiment. It is a schematic sectional drawing of the vapor deposition mask of one Embodiment. It is the front view which looked at the vapor deposition mask of one embodiment from the resin mask side. It is the front view which looked at the vapor deposition mask of one embodiment from the resin mask side. It is the front view which looked at the vapor deposition mask of one embodiment from the resin mask side. It is the front view which looked at the vapor deposition mask of one embodiment from the resin mask side. It is a schematic sectional drawing of a comparative vapor deposition mask. FIG. 1A is a schematic cross-sectional view illustrating a state in which an evaporation mask and an object to be deposited according to an embodiment are closely contacted, and FIG. It is an outline sectional view. It is a schematic cross-sectional view showing a state in which the vapor deposition mask and the vapor deposition target of one embodiment are in close contact, It is the front view which looked at the vapor deposition mask of a 1st embodiment from the metal mask side. It is the front view which looked at the vapor deposition mask of a 1st embodiment from the metal mask side. It is the front view which looked at the vapor deposition mask of a 1st embodiment from the metal mask side. It is the front view which looked at the vapor deposition mask of a 1st embodiment from the metal mask side. (A) is a front view of the vapor deposition mask of the second embodiment viewed from the metal mask side, and (b) is a front view viewed from the resin mask side. (A) is a front view of the vapor deposition mask of the second embodiment viewed from the metal mask side, and (b) is a front view viewed from the resin mask side. It is an outline sectional view for explaining the manufacturing method of the vapor deposition mask of one embodiment. It is the front view which looked at the vapor deposition mask with a frame of one embodiment from the resin mask side. It is the front view which looked at the vapor deposition mask with a frame of one embodiment from the resin mask side.

<< evaporation mask >>
Hereinafter, the vapor deposition mask 100 according to one embodiment of the present invention will be specifically described.

  As shown in FIGS. 1A to 1C, the vapor deposition mask 100 according to one embodiment of the present invention has a resin mask 20 provided with an opening 25 corresponding to a pattern to be vapor-deposited. The metal mask 10 provided with the slit 15 overlapping the opening 25 is laminated. FIG. 1A is a front view of the vapor deposition mask of one embodiment viewed from the resin mask 20 side, and FIG. 1B is a front view of the vapor deposition mask of one embodiment viewed from the metal mask 10 side. (C) is an AA schematic sectional view of (b).

  As shown in FIG. 1, the vapor deposition mask 100 according to one embodiment of the present invention includes a plurality of alignment marks 40 provided on a part of the surface of the metal mask 10 on the side in contact with the resin mask 20. At least one of the alignment marks 40 is not in contact with one surface of the resin mask 20. In other words, at least one of the plurality of alignment marks 40 provided on a part of the surface of the metal mask 10 in contact with the resin mask 20 is not covered by the resin of the resin mask 20. In the embodiment shown in each figure, a plurality of alignment marks 40 are provided on a part of the surface of the metal mask 10 that is in contact with the resin mask 20, and all of the plurality of alignment marks 40 are formed on one surface of the resin mask 20. It is in a form that does not touch it. The deposition mask of one embodiment of the present invention is not limited to the illustrated form, and a part of the plurality of alignment marks 40 provided on the surface of the metal mask 10 on the side in contact with the resin mask 20 may It may be in contact with one surface of the resin mask 20 (not shown). A preferable vapor deposition mask takes a form in which two or more of a plurality of alignment marks provided on the surface of the metal mask 10 that is in contact with the resin mask 20 are not in contact with one surface of the resin mask 20. Hereinafter, unless otherwise noted, the term “alignment mark 40” means an alignment mark 40 that is not in contact with one surface of the resin mask 20.

  According to the vapor deposition mask 100 of the embodiment of the present invention having the above characteristics, when the alignment mark 40 is read from the alignment mark reading side, the visibility of the alignment mark 40 is not hindered by the resin mask 20, and the alignment The mark 40 can be accurately recognized. Thereby, according to the vapor deposition mask 100 of one embodiment of the present invention, the accuracy of the alignment using the alignment mark 40 can be improved.

  On the other hand, all of the alignment marks 40 provided on a part of the surface of the metal mask 10 that is in contact with the resin mask 20 are in contact with one surface of the resin mask 20, in other words, all the alignment marks 40 are In the comparative thermal transfer sheet 100X (FIG. 9) covered with the resin of the resin mask 20, when the alignment mark 40 is read from the alignment mark reading side, there is an interposition between the alignment mark 40 and the alignment mark reading side. The visibility of the alignment mark 40 is hindered by the presence of the resin mask 20, which makes it difficult to accurately recognize the alignment mark 40.

  The term "alignment mark" as used in the specification of the present application refers to an alignment mask for fixing a vapor deposition mask to a frame, or a vapor deposition mask with a frame when performing vapor deposition using a vapor deposition mask with a frame having the vapor deposition mask fixed to the frame. This is used for aligning the substrate with the object to be deposited.

  FIG. 10A is a schematic cross-sectional view showing a state in which the vapor deposition mask of one embodiment of the present invention and the vapor deposition target are brought into close contact with each other. FIG. FIG. 3 is a schematic cross-sectional view showing a state in which an object to be vapor-deposited is brought into close contact. In the embodiment shown in FIG. 10A, the object to be deposited is in close contact with a deposition mask with a frame in which a deposition mask is fixed to a frame. In the vapor deposition mask according to one embodiment of the present invention, the vapor deposition mask 100 is fixed to the frame with high positional accuracy using the alignment mark 40 having good visibility. In the illustrated form, the description of the frame is omitted.

(Metal mask)
As shown in FIG. 1C, a metal mask 10 is laminated on one surface of the resin mask 20. The metal mask 10 is made of metal, and has a slit 15 extending in a vertical direction or a horizontal direction. The slit 15 is synonymous with the opening. The slit 15 is provided at a position overlapping the resin mask 20. There is no particular limitation on the arrangement example of the slit, as shown in each figure, the slit extending in the vertical direction and the horizontal direction may be arranged in a plurality of rows in the vertical direction and the horizontal direction, the slit extending in the vertical direction, A plurality of rows may be arranged in the horizontal direction, and a plurality of slits extending in the horizontal direction may be arranged in the vertical direction. Further, only one row may be arranged in the vertical direction or the horizontal direction.

  As shown in FIG. 1, a plurality of alignment marks 40 are provided on the surface of the metal mask 10 on the side in contact with the resin mask 20. Are provided at positions not in contact with one surface of the resin mask 20. Hereinafter, an example of the alignment mark and the arrangement of the alignment mark will be described with reference to FIGS. 2 to 4 are schematic cross-sectional views of the vapor deposition mask of one embodiment, and FIGS. 5 to 8 are front views of the vapor deposition mask of one embodiment as viewed from the resin mask side.

  The form of the alignment mark 40 is not particularly limited. For example, as shown in FIG. 1C, a through hole penetrating from the surface of the metal mask 10 in contact with the resin mask to the other surface, or FIG. As shown in FIG. 5, the metal mask 10 may be defined by a concave portion provided on the surface of the metal mask 10 on the side in contact with the resin mask. Above all, the alignment mark 40 defined by the through hole shown in FIG. 1C is preferable in that the alignment mark reading accuracy is high because the contrast is easily obtained in any of the transmitted light and the reflected light. In the embodiments shown in FIGS. 1C and 2, the shape of the through-hole or the concave portion viewed from the resin mask side is the shape of the alignment mark 40. Also, as shown in FIG. 3, a through hole or a concave portion is changed to an alignment mark 40, and a resin layer of a predetermined shape is formed on the surface of the metal mask 10 in contact with the resin mask by using a resin material or the like. The resin layer can be used as the alignment mark 40. In this case, the shape of the resin layer viewed from the resin mask side is the shape of the alignment mark. When the resin layer is used as the alignment mark 40, a colored resin layer may be used in order to further improve the reading accuracy of the alignment mark. Hereinafter, the shape of the alignment mark means the shape of the alignment mark 40 as viewed from the other side of the resin mask. Further, the shape of the exposed region described later means a shape of the exposed region as viewed from the other surface side of the resin mask.

  The shape of the alignment mark 40 is not particularly limited as long as the shape can be recognized by a camera or the like. For example, a circular shape, a rectangular shape, a cross shape, and the like can be given.

  In the vapor deposition mask 100 according to the embodiment of the present invention, a part of the surface of the metal mask 10 is exposed by removing a part of the resin mask 20, and the alignment mark 40 is positioned on the exposed part. I have. Hereinafter, a region where the surface of the metal mask 10 is exposed when viewed from the resin mask side may be referred to as an exposed region (see reference numeral 10 (X) in the drawing).

  In the vapor deposition mask 100 according to one embodiment of the present invention, the alignment mark 40 may be located in a part of the exposed region 10X, or the exposed region 10X of the metal mask 10 may be used as the alignment mark 40 as it is. For example, in the embodiments shown in FIGS. 1 to 3 and FIGS. 5 to 8, the alignment mark 40 is located in a part of the exposed region 10X. In the embodiment shown in FIG. 4, the exposed area itself is used as the alignment mark 40. In the embodiment shown in FIG. 4, since the exposed region 10X itself becomes the alignment mark 40, it is not necessary to provide a through hole, a concave portion, a resin layer, and the like in the metal mask 10 as shown in FIGS.

  According to the embodiment shown in FIGS. 1 to 3, a part of the outer edge of the exposed region 10 </ b> X, for example, the edge portion is used as an auxiliary mark together with the alignment mark 40 located in the exposed region 10 </ b> X, and the alignment of the deposition mask is performed. It can be performed. In this embodiment, the alignment of the evaporation mask can be performed using two types of alignment marks, so that the alignment can be performed with higher accuracy than the evaporation mask of the embodiment shown in FIG.

  There is no limitation on the shape of the exposed region 10X, and examples thereof include a circular shape, a rectangular shape, and a cross shape. When the shape of the exposed region 10X and the shape of the alignment mark 40 located in the exposed region are the same type, for example, when both the shape of the exposed region 10X and the shape of the alignment mark 40 are rectangular, At the time of recognizing the alignment mark 40 located in the exposed region, there is a possibility that the exposed region is erroneously recognized. Therefore, in consideration of this point, it is preferable that the shape of the exposed region 10X is different from the shape of the alignment mark 40. For example, as shown in FIGS. 1 to 3, it is preferable that the shape of the exposed region 10X be rectangular and the shape of the alignment mark 40 be circular.

  The exposure region 10X is also not particularly limited, and can be appropriately set according to the position of the alignment mark 40. 5 to 8 are front views of the vapor deposition mask of one embodiment as viewed from the resin mask side, and are diagrams illustrating an example of the exposed region 10X. In the vapor deposition mask 100 of the form shown in FIG. 5, a part of the surface of the metal mask 10 is exposed on the outer periphery in the lateral direction of the vapor The alignment mark 40 is located. In other words, in the vapor deposition mask of the form shown in FIG. 5, by making the size of the metal mask 10 larger than that of the resin mask 20, a part of the metal mask is projected outward in the horizontal direction of the resin mask. I have. In the vapor deposition mask 100 of the embodiment shown in FIG. 6, the size of the metal mask 10 is made smaller than that of the resin mask 20, and a predetermined through-hole is provided in the resin mask in the vicinity of the outer periphery of the vapor mask. Some are exposed. 6, the alignment mark 40 is located in the exposed region 10X where the surface of the metal mask 10 is exposed. Further, a part of the plurality of alignment marks 40 may be located in a region other than the exposed region 10X. In other words, some of the plurality of alignment marks 40 may be in contact with one surface of the resin mask 20.

  The vapor deposition mask of the form shown in FIGS. 7 and 8 exposes a part of the surface of the metal mask 10 by providing a predetermined through hole or the like in the resin mask 20 in a region other than the outer periphery of the vapor deposition mask 100, The alignment mark 40 is located in the exposed area 10X where the surface of the mask 10 is exposed. The exposed region 10X is not limited to the form shown in each figure, and for example, the forms shown in each figure can be combined. Further, a position other than the illustrated exposed region may be set as the exposed region.

  In the embodiment shown in FIG. 10A, when the resin mask 20 of the evaporation mask 100 and the object to be evaporated are brought into close contact with each other, the alignment mark 40 is provided at a position overlapping with the object to be evaporated. As shown, when the resin mask 20 of the evaporation mask 100 and the object to be evaporated are brought into close contact, the alignment mark 40 may be provided at a position that does not overlap the object to be evaporated. Also in the vapor deposition mask of the form shown in FIG. 11, when the vapor deposition mask is fixed to the frame, that is, the positioning can be accurately performed at the stage before being brought into close contact with the vapor deposition target.

  The material of the metal mask 10 is not particularly limited, and a material conventionally known in the field of a vapor deposition mask can be appropriately selected and used, and examples thereof include metal materials such as stainless steel, iron-nickel alloy, and aluminum alloy. . In particular, an invar material, which is an iron-nickel alloy, can be suitably used because it is less deformed by heat.

  The thickness of the metal mask 10 is also not particularly limited, but is preferably 100 μm or less, more preferably 50 μm or less, and is preferably 35 μm or less, in order to more effectively prevent the generation of shadow. Particularly preferred. If the thickness is less than 5 μm, the risk of breakage and deformation increases, and handling tends to be difficult. Note that the shadow is thinner than the target deposition film thickness because a part of the deposition material emitted from the deposition source collides with the inner wall surface of the slit 15 of the metal mask 10 and does not reach the deposition target. This refers to a phenomenon in which a non-evaporated portion having a film thickness occurs. In particular, as the shape of the opening 25 is reduced, the influence of the shadow increases.

  Further, in the embodiment shown in each figure, the opening shape of the slit 15 has a rectangular shape, but there is no particular limitation on the opening shape, and the opening shape of the slit 15 may be any shape such as a trapezoidal shape or a circular shape. Is also good.

  There is no particular limitation on the cross-sectional shape of the slit 15 formed in the metal mask 10, but it is preferable that the cross-sectional shape be widened toward the evaporation source as shown in FIG. More specifically, an angle formed between a bottom end of the lower end of the slit 15 of the metal mask 10 and a straight line connecting the upper end of the upper end of the slit 15 of the metal mask 10 and the bottom surface of the metal mask 10, in other words, the metal mask In the cross section in the thickness direction of the inner wall surface constituting the slit 15, the angle between the inner wall surface of the slit 15 and the surface of the metal mask 10 on the side in contact with the resin mask 20 (the lower surface of the metal mask in the illustrated embodiment) is , Preferably in the range of 5 ° to 85 °, more preferably in the range of 15 ° to 80 °, and even more preferably in the range of 25 ° to 65 °. In particular, even within this range, the angle is preferably smaller than the vapor deposition angle of the vapor deposition machine used.

  There is no particular limitation on the method of laminating the metal mask 10 on the resin mask. The resin mask 20 and the metal mask 10 may be bonded to each other using various adhesives, or a self-adhesive resin mask may be used. . The sizes of the resin mask 20 and the metal mask 10 may be the same or different. If the size of the resin mask 20 is made smaller than that of the metal mask 10 and the outer peripheral portion of the metal mask 10 is exposed in consideration of the optional fixing to the frame, the metal mask 10 It is preferable because welding to the frame is easy.

(Resin mask)
As shown in FIG. 1, the resin mask 20 has a plurality of openings 25. The plurality of openings 25 are provided at positions overlapping the slits 15 of the metal mask 10 when the metal mask 10 and the resin mask 20 are stacked.

  As described above, part of the resin mask 20 is removed, thereby exposing a part of the surface of the metal mask 10. Then, at least one of the plurality of alignment marks is located in a region where a part of the surface of the metal mask is exposed.

  As the resin mask 20, a conventionally known resin material can be appropriately selected and used, and the material is not particularly limited. However, a high-definition opening 25 can be formed by laser processing or the like, It is preferable to use a lightweight material having a small dimensional change rate and a low moisture absorption rate. Such materials include polyimide resin, polyamide resin, polyamide imide resin, polyester resin, polyethylene resin, polyvinyl alcohol resin, polypropylene resin, polycarbonate resin, polystyrene resin, polyacrylonitrile resin, ethylene-vinyl acetate copolymer resin, ethylene- Examples thereof include vinyl alcohol copolymer resin, ethylene-methacrylic acid copolymer resin, polyvinyl chloride resin, polyvinylidene chloride resin, cellophane, and ionomer resin. Among the materials exemplified above, a resin material having a coefficient of thermal expansion of 16 ppm / ° C. or less is preferable, a resin material having a moisture absorption of 1.0% or less is preferable, and a resin material satisfying both conditions is particularly preferable. . By using a resin mask using this resin material, the dimensional accuracy of the opening 25 can be improved, and the rate of dimensional change and moisture absorption over time and heat can be reduced.

  There is also no particular limitation on the thickness of the resin mask 20, but when vapor deposition is performed using the vapor deposition mask 100 of one embodiment of the present invention, a vapor deposition portion having a thickness smaller than a target vapor thickness, a so-called vapor deposition portion. In order to prevent shadows from occurring, it is preferable that the resin mask 20 is as thin as possible. However, if the thickness of the resin mask 20 is less than 3 μm, defects such as pinholes are likely to occur, and the risk of deformation and the like increases. On the other hand, if it exceeds 25 μm, shadows may occur. Considering this point, the thickness of the resin mask 20 is preferably 3 μm or more and 25 μm or less. By setting the thickness of the resin mask 20 within this range, the risk of defects such as pinholes and deformation can be reduced, and the generation of shadows can be effectively prevented. In particular, by setting the thickness of the resin mask 20 to 3 μm or more and 10 μm or less, more preferably 4 μm or more and 8 μm or less, it is possible to more effectively prevent the influence of shadow when forming a high-definition pattern exceeding 400 ppi. . The resin mask 20 and the metal mask 10 described later may be directly bonded or may be bonded via an adhesive layer. However, the resin mask 20 and the metal mask 10 may be bonded via an adhesive layer. When 10 is bonded, it is preferable that the total thickness of the resin mask 20 and the pressure-sensitive adhesive layer be within the above-described preferable thickness range.

  In the embodiments shown in the drawings, the opening shape of the opening 25 is rectangular, but the opening shape is not particularly limited, and the opening shape of the opening 25 may be any shape such as a trapezoidal shape or a circular shape. There may be.

  Opposite end faces of the resin mask forming the opening 25 may be substantially parallel to each other. However, as shown in FIG. 1C, the opening 25 has a cross-sectional shape that expands toward the evaporation source. Preferably, it is shaped. Specifically, the angle formed between the lower bottom end of the opening of the resin mask and the straight line connecting the upper bottom end of the opening of the resin mask and the bottom of the vapor deposition mask, in other words, the opening of the resin mask 20. In the cross section in the thickness direction of the inner wall surface constituting the inner wall 25, the angle formed between the inner wall surface of the opening 25 and the surface of the resin mask 20 on the side not in contact with the metal mask 10 (in the illustrated embodiment, the lower surface of the resin mask) It is preferably in the range of 5 ° to 85 °, more preferably in the range of 15 ° to 80 °, and even more preferably in the range of 25 ° to 65 °. In particular, even within this range, the angle is preferably smaller than the vapor deposition angle of the vapor deposition machine used.

  Hereinafter, a description will be given of a first embodiment and a second embodiment as examples of a form of a vapor deposition mask capable of producing a higher definition vapor deposition pattern.

<Evaporation mask of the first embodiment>
As shown in FIG. 12, the vapor deposition mask 100 according to the first embodiment of the present invention is a vapor deposition mask for simultaneously forming a vapor deposition pattern for a plurality of screens. The metal mask 10 provided with the slits 15 is laminated, and the resin mask 20 is provided with an opening 25 necessary for forming a plurality of screens, and each slit 15 is provided at a position where at least one whole screen is overlapped. It is characterized by being provided. Further, in the vapor deposition mask 100 of the first embodiment, a plurality of alignment marks 40 are provided on a part of the surface of the metal mask 10 that is in contact with the resin mask 20, and one of the plurality of alignment marks 40 is formed of resin. It is characterized in that it is not in contact with one surface of the mask 20. Preferably, two or more of the plurality of alignment marks 40 are not in contact with one surface of the resin mask 20. In the embodiments shown in FIGS. 12 to 15, the alignment mark 40 that is not in contact with one surface of the resin mask is located near the outer periphery of the evaporation mask. Alignment mark 40 not in contact with the surface may be located. Further, alignment marks 40 that are not in contact with one surface of the resin mask may be located both in the vicinity of the outer periphery of the vapor deposition mask and in a predetermined area between one screen. In the embodiments shown in FIGS. 12 to 15, the alignment mark 40 is defined by a through hole that penetrates the metal mask 10. May be defined. The same applies to the vapor deposition mask of the second embodiment.

  The vapor deposition mask 100 according to the first embodiment is a vapor deposition mask used to simultaneously form a vapor deposition pattern for a plurality of screens. One vapor deposition mask 100 can form vapor deposition patterns corresponding to a plurality of products at the same time. it can. The “opening” in the vapor deposition mask of the first embodiment means a pattern to be manufactured using the vapor deposition mask 100 of the first embodiment. For example, the vapor deposition mask is used to form an organic layer in an organic EL display. , The shape of the opening 25 is the shape of the organic layer. In addition, “one screen” is composed of an aggregate of openings 25 corresponding to one product. When the one product is an organic EL display, it is necessary to form one organic EL display. The aggregate of the organic layers, that is, the aggregate of the openings 25 to be the organic layer is “one screen”. In the vapor deposition mask 100 of the first embodiment, the “one screen” is arranged on the resin mask 20 for a plurality of screens at a predetermined interval in order to simultaneously form a vapor deposition pattern for a plurality of screens. . That is, the resin mask 20 is provided with the openings 25 necessary for forming a plurality of screens.

  In the vapor deposition mask of the first embodiment, a metal mask 10 provided with a plurality of slits 15 is provided on one surface of a resin mask, and each slit is provided at a position overlapping at least one entire screen. Features a point. In other words, between the openings 25 necessary to compose one screen, between the horizontally adjacent openings 25, the length is the same as the length of the slit 15 in the vertical direction, and is the same as the metal mask 10. A metal line portion having a thickness or a metal line portion having the same length as the horizontal length of the slit 15 and having the same thickness as the metal mask 10 does not exist between the vertically adjacent openings 25. It is characterized by the following. Hereinafter, a metal line portion having the same length as the length of the slit 15 in the vertical direction and having the same thickness as the metal mask 10 and the same length as the horizontal length of the slit 15 and the same as the metal mask 10 The metal wire portion having a thickness may be collectively referred to simply as a metal wire portion.

  According to the vapor deposition mask 100 of the first embodiment, when the size of the openings 25 necessary to form one screen or the pitch between the openings 25 forming one screen is reduced, for example, a screen exceeding 400 ppi Even when the size of the openings 25 and the pitch between the openings 25 are extremely small, the interference by the metal wire portion can be prevented, and a high-definition image can be formed. Becomes When one screen is divided by a plurality of slits, in other words, when a metal line portion having the same thickness as the metal mask 10 exists between the openings 25 constituting one screen, As the pitch between the openings 25 constituting one screen becomes narrower, the metal line portion existing between the openings 25 becomes a hindrance when forming a deposition pattern on a deposition target, and a high-definition deposition pattern is formed. It is difficult to form. In other words, when a metal line portion having the same thickness as the metal mask 10 exists between the openings 25 constituting one screen, the metal line portion causes shadows to form a high-definition screen. Becomes difficult.

  Next, an example of the opening 25 constituting one screen will be described with reference to FIGS. In the illustrated embodiment, an area closed by a broken line is one screen. In the illustrated embodiment, for convenience of explanation, a set of a small number of openings 25 is defined as one screen. However, the present invention is not limited to this embodiment. For example, when one opening 25 is defined as one pixel, one screen is used. May have openings 25 of several million pixels.

  In the embodiment shown in FIG. 12, one screen is constituted by an aggregate of openings 25 in which a plurality of openings 25 are provided in the vertical and horizontal directions. In the embodiment shown in FIG. 13, one screen is configured by an aggregate of the openings 25 provided with a plurality of openings 25 in the horizontal direction. Further, in the embodiment shown in FIG. 14, one screen is constituted by an aggregate of the openings 25 provided with a plurality of openings 25 in the vertical direction. 12 to 14, the slit 15 is provided at a position overlapping the entire screen.

  As described above, the slit 15 may be provided at a position overlapping only one screen, and as shown in FIGS. 15A and 15B, provided at a position overlapping two or more entire screens. May be. In FIG. 15A, a slit 15 is provided in the resin mask 10 shown in FIG. 12 at a position overlapping the entire two screens that are continuous in the horizontal direction. In FIG. 15B, a slit 15 is provided at a position overlapping the entire three screens that are continuous in the vertical direction.

Next, the pitch between the openings 25 constituting one screen and the pitch between the screens will be described using the embodiment shown in FIG. 12 as an example. The pitch between the openings 25 constituting one screen and the size of the openings 25 are not particularly limited, and can be appropriately set according to a pattern to be formed by vapor deposition. For example, when forming a high-definition vapor deposition pattern of 400 ppi, the horizontal pitch (P1) and the vertical pitch (P2) of the adjacent openings 25 in the screen 25 constituting one screen are about 60 μm. Becomes The size of the opening becomes 500μm ² ~1000μm ² about. Further, one opening 25 is not limited to correspond to one pixel. For example, depending on a pixel arrangement, a plurality of pixels can be collectively formed as one opening 25.

  The horizontal pitch (P3) and the vertical pitch (P4) between the screens are not particularly limited either. However, as shown in FIG. 12, when one slit 15 is provided at a position overlapping the entire screen, A metal line portion exists between each screen. Therefore, the vertical pitch (P4) and the horizontal pitch (P3) between each screen are smaller than the vertical pitch (P2) and the horizontal pitch (P1) of the opening 25 provided in one screen. In such a case, or when they are substantially the same, the metal line portion existing between the screens is easily broken. Therefore, in consideration of this point, it is preferable that the pitch between the screens (P3, P4) is wider than the pitch (P1, P2) between the openings 25 constituting one screen. An example of the pitch between screens (P3, P4) is about 1 mm to 100 mm. Note that the pitch between screens means the pitch between adjacent openings in one screen and another screen adjacent to the one screen. The same applies to the pitch of the openings 25 and the pitch between the screens in the later-described vapor deposition mask of the second embodiment.

  As shown in FIG. 15, when one slit 15 is provided at a position overlapping two or more screens, a slit is provided between a plurality of screens provided in one slit 15. The metal wire portion forming the inner wall surface does not exist. Therefore, in this case, the pitch between two or more screens provided at a position overlapping one slit 15 may be substantially equal to the pitch between the openings 25 constituting one screen.

  In addition, a groove (not shown) extending in the vertical direction or the horizontal direction of the resin mask 20 may be formed in the resin mask 20. If heat is applied during vapor deposition, the resin mask 20 thermally expands, which may cause a change in the size and position of the opening 25. However, the formation of the groove can absorb the expansion of the resin mask. Thus, it is possible to prevent the resin mask 20 from expanding as a whole in a predetermined direction and changing the size and position of the opening 25 due to the accumulation of thermal expansion occurring in various parts of the resin mask. There is no limitation on the position where the groove is formed, and the groove may be provided between the openings 25 constituting one screen or at a position overlapping with the opening 25, but is preferably provided between the vertical screens. Further, the groove may be provided only on one surface of the resin mask, for example, only on the surface in contact with the metal mask, or may be provided only on the surface not in contact with the metal mask. Alternatively, it may be provided on both surfaces of the resin mask 20.

  A groove extending in the vertical direction may be formed between adjacent screens, or a groove extending in the horizontal direction may be formed between adjacent screens. Furthermore, it is also possible to form a groove in a mode in which these are combined.

  The depth and width of the groove are not particularly limited. However, if the depth of the groove is too deep or too wide, the rigidity of the resin mask 20 tends to decrease. It is necessary to set. Also, the cross-sectional shape of the groove is not particularly limited, and may be arbitrarily selected in consideration of a processing method such as a U-shape or a V-shape. The same applies to the vapor deposition mask of the second embodiment.

<Evaporation mask of second embodiment>
Next, the vapor deposition mask of the second embodiment will be described. As shown in FIGS. 16 and 17, the vapor deposition mask of the second embodiment has one slit (one slit) on one surface of a resin mask 20 provided with a plurality of openings 25 corresponding to a pattern to be vapor-deposited. The metal mask 10 provided with the through holes 16) is stacked, and all of the plurality of openings 25 are provided at positions overlapping with one through hole provided in the metal mask 10. I do. Further, as shown in FIGS. 16B and 17B, the vapor deposition mask 100 of the second embodiment has a plurality of alignment marks 40 on a part of the surface of the metal mask 10 on the side in contact with the resin mask 20. Is provided, and one of the plurality of alignment marks 40 is not in contact with one surface of the resin mask 20. Preferably, two or more of the plurality of alignment marks 40 are not in contact with one surface of the resin mask 20. 16 (a) and 17 (a) are front views of the vapor deposition mask of the second embodiment as viewed from the metal mask side, and FIGS. 16 (b) and 17 (b) are viewed from the resin mask side. It is a front view. As shown in the drawing, the metal mask 10 provided with one slit is laminated on the resin mask 20 as shown in the drawing, so that the alignment mark not in contact with one surface of the resin mask is provided. Reference numeral 40 is located near the outer periphery of the metal mask 10.

  The opening 25 referred to in the second embodiment means an opening necessary for forming a deposition pattern on a deposition target, and an opening that is not necessary for forming a deposition pattern on a deposition target is one. It may be provided at a position that does not overlap with the two through holes 16.

  In the vapor deposition mask 100 of the second embodiment, a metal mask 10 having one through hole 16 is provided on a resin mask 20 having a plurality of openings 25, and all of the plurality of openings 25 are It is provided at a position overlapping with the one through hole 16. In the vapor deposition mask 100 according to the second embodiment having this configuration, since there is no metal line between the openings 25 having the same thickness as the thickness of the metal mask or greater than the thickness of the metal mask, As described in the vapor deposition mask of the embodiment, it is possible to form a high-definition vapor deposition pattern according to the size of the opening 25 provided in the resin mask 20 without being affected by the metal line portion.

  Further, according to the vapor deposition mask of the second embodiment, even when the thickness of the metal mask 10 is increased, the metal mask 10 is hardly affected by the shadow. The thickness can be increased until the properties and the handling properties can be sufficiently satisfied, and the durability and the handling properties can be improved while forming a high-definition vapor deposition pattern.

(Resin mask)
The resin mask 20 in the vapor deposition mask of the second embodiment is made of resin and corresponds to a pattern to be vapor-deposited at a position overlapping one through hole 16 as shown in FIGS. 16 (a) and 17 (a). A plurality of openings 25 are provided. The opening 25 corresponds to the pattern to be formed by vapor deposition. When the vapor deposition material emitted from the vapor deposition source passes through the opening 25, a vapor deposition pattern corresponding to the opening 25 is formed on the object to be vapor deposited. You. In the illustrated embodiment, an example in which a plurality of openings are arranged vertically and horizontally is described. However, the openings may be arranged only vertically or horizontally.

  The vapor deposition mask 100 of the second embodiment may be used for forming a vapor deposition pattern corresponding to one screen, or may be used for simultaneously forming vapor deposition patterns corresponding to two or more screens. . "One screen" in the vapor deposition mask of the second embodiment means an aggregate of the openings 25 corresponding to one product, and when the one product is an organic EL display, one organic EL display An aggregate of the organic layers necessary to form the image, that is, an aggregate of the openings 25 to be the organic layer is “one screen”. In this case, it is preferable that the openings 25 be provided at predetermined intervals (see the arrangement of the openings and one screen in FIGS. 12 to 14). In FIGS. 16 and 17, one screen is constituted by 120 openings 25. However, the present invention is not limited to this mode. For example, when one opening 25 is one pixel, several millions One screen can be constituted by the individual openings 25. As an example of the pitch between screens, both the vertical pitch and the horizontal pitch are about 1 mm to 100 mm. Note that the pitch between screens means the pitch between adjacent openings in one screen and another screen adjacent to the one screen.

(Metal mask)
The metal mask 10 in the vapor deposition mask 100 of the second embodiment is made of metal and has one through hole 16. In the present invention, the one through-hole 16 is located at a position overlapping with all the openings 25 when viewed from the front of the metal mask 10, in other words, all the openings 25 arranged on the resin mask 20. It is located where it can be seen. Further, as described above, a plurality of alignment marks 40 are provided on a part of the surface of the metal mask 10 that is in contact with the resin mask 20, and at least one of the plurality of alignment marks 40 is It is located in a place not in contact with one surface of the resin mask 20.

  The metal portion constituting the metal mask 10, that is, the portion other than the through hole 16 may be provided along the outer edge of the vapor deposition mask 100 as shown in FIG. 16, and the size of the metal mask 10 as shown in FIG. The height may be smaller than that of the resin mask 20, and the vicinity of the outer peripheral portion of the resin mask 20 may be exposed. In any case, the size of the through hole 16 is configured to be smaller than the size of the resin mask 20.

  The horizontal width (W1) and the vertical width (W2) of the metal portion forming the wall surface of the through-hole of the metal mask 10 shown in FIG. 16 are not particularly limited, but the widths of W1 and W2 become narrower. The durability and handling properties tend to decrease as the number of cells increases. Therefore, it is preferable that W1 and W2 have a width that can sufficiently satisfy the durability and the handling property. An appropriate width can be appropriately set according to the thickness of the metal mask 10, but an example of a preferable width is about 1 mm to 100 mm for both W1 and W2 as in the metal mask of the first embodiment.

(Method of manufacturing evaporation mask)
Next, an example of a method for manufacturing a deposition mask according to an embodiment of the present invention will be described.

  As shown in FIG. 18A, the method of manufacturing a deposition mask according to one embodiment includes a method of manufacturing a metal mask 10 having a plurality of alignment marks 40 provided on a surface in contact with a resin plate 30 and having slits 15 provided thereon. And a preparation step of preparing a metal mask 50 with a resin plate laminated on the resin plate 30. As shown in FIG. 18B, a laser is applied to the metal mask 50 with a resin plate from the side of the metal mask 10 through the slit 15. By irradiating the metal mask with resin plate 50 with laser from the resin plate 30 side, as shown in FIG. 18C, the openings 25 corresponding to the pattern to be vapor-deposited on the resin plate 30 are formed. And forming an opening for exposing at least one of the plurality of alignment marks 40 provided on the surface of the metal mask 10 on the side in contact with the resin plate 30.

"Preparation process"
The preparation step is a step of preparing a metal mask with a resin plate obtained by laminating a metal mask provided with a plurality of alignment marks 40 on the surface in contact with the resin plate and provided with the slits 15 with the resin plate. . The material described for the resin mask 20 can be used for the resin plate 30.

  In the above method, the resin plate 30 constituting the metal mask 50 with a resin plate may be not only a plate-shaped resin but also a resin layer or a resin film formed by coating. That is, the resin plate may be prepared in advance, and when the metal mask 50 with the resin plate is formed using the metal plate and the resin plate 30, a conventionally known coating method is applied onto the metal plate. By such means, a resin layer or a resin film finally serving as a resin mask can be formed.

  As a method for forming the metal mask 10 in which the slit 15 is provided and the plurality of alignment marks 40 are provided on the surface in contact with the resin plate 30, a masking member, for example, a resist material is applied to the surface of the metal plate. Then, by exposing and developing a predetermined portion, a resist pattern leaving a position where the slit 15 and the alignment mark 40 are finally formed is formed. As the resist material used as the masking member, a material having good processing properties and desired resolution is preferable. Next, the resist pattern is used as an etching resistant mask to perform an etching process by an etching method. After the etching is completed, the resist pattern is washed and removed. Thereby, the metal mask 10 in which the plurality of alignment marks 40 are provided on the surface in contact with the slit 15 and the resin plate 30 is obtained. The etching for forming the slit 15 and the alignment mark 40 may be performed from one side of the metal plate, or may be performed from both sides. When the slit 15 and the plurality of alignment marks 40 are formed in the metal plate by using a laminate in which the resin plate is provided on the metal plate, a masking member is provided on the surface of the metal plate on the side not in contact with the resin plate. Is applied, and a slit 15 is formed by etching from one side. When the resin plate has etching resistance to the etching material of the metal plate, it is not necessary to mask the surface of the resin plate, but when the resin plate does not have resistance to the etching material of the metal plate. Requires that a masking member be applied to the surface of the resin plate. Further, in the above description, the resist material is mainly described as the masking member. However, instead of coating the resist material, a dry film resist may be laminated and the same patterning may be performed.

  Also, instead of the above method, (i) a resin plate formed by laminating a resin plate 30 and a metal mask 10 (see the metal mask in FIG. 2) having a concave portion formed on the surface in contact with the resin plate. A metal mask 50 may be prepared, and (ii) a metal mask 10 in which a resin layer formed using a resin material or the like is provided on the surface in contact with the resin plate (see the metal mask in FIG. 3). A metal mask 50 with a resin plate formed by laminating the resin plate 30 with the resin plate 30 may be prepared. In the case of using the metal mask with a resin plate of the above (i) and (ii), a metal mask 10 in which a concave portion is formed on a surface in contact with the resin plate or a resin layer is provided in advance is prepared. The prepared metal mask 10 is bonded to a resin plate.

"Opening process"
In the opening forming step, as shown in FIG. 18B, the metal mask with resin plate 50 is irradiated with laser from the metal mask 10 through the slit 15 and is irradiated with laser from the resin mask. In this step, an opening 25 corresponding to a pattern to be formed by vapor deposition is formed in the resin plate 30, and at least one of the plurality of alignment marks 40 provided on the surface of the metal mask on the side in contact with the resin plate 30 is exposed. . Through this step, as shown in FIG. 18C, a slit 15 overlapping the opening 20 is provided on one surface of the resin mask 20 provided with the opening 25 corresponding to the pattern to be formed by vapor deposition. Metal masks 10 are stacked, and a plurality of alignment marks 40 are provided on a part of the surface of the metal mask 10 on the side in contact with the resin mask 20, and at least one of the plurality of alignment marks 40 is An evaporation mask not in contact with one surface is obtained.

  The laser irradiation for forming the opening may be performed after the laser irradiation for exposing the alignment mark 40, or may be performed before the laser irradiation for exposing the alignment mark 40.

  In the above, a laser processing method is used as a means for forming the opening 25 and exposing the alignment mark 40. However, instead of the laser processing method, precision press processing, photolithography, and etching processing are used. By penetrating the plate, the opening 25 corresponding to the pattern to be formed by vapor deposition on the resin plate can be formed, and the alignment mark 40 can be exposed. Note that it is preferable to use a laser processing method for forming the opening 25 from the viewpoint that the high-definition opening 25 can be easily formed.

(Evaporation mask preparation)
Next, a vapor deposition mask preparation according to one embodiment of the present invention will be described. In one embodiment of the present invention, a metal mask provided with a slit that overlaps with an opening is laminated on one surface of a resin mask provided with an opening corresponding to a pattern to be formed by vapor deposition. Is a deposition mask preparation for obtaining a deposition mask that is formed by laminating a metal mask provided with a slit on one surface of a resin plate, and a part of a surface of the metal mask in contact with the resin plate. A plurality of alignment marks are provided, and at least one of the plurality of alignment marks is not in contact with one surface of the resin plate.

  The vapor deposition mask preparation according to one embodiment of the present invention is the same as the vapor deposition mask 100 according to one embodiment of the present invention described above, except that the opening 25 is not provided in the resin plate 30. Description is omitted. As a specific configuration of the deposition mask preparation, the metal mask with a resin plate (see FIG. 18A) described in the preparation step in the above-described method of manufacturing the deposition mask can be exemplified.

  According to the vapor deposition mask preparation of one embodiment of the present invention, by forming an opening in the resin plate of the vapor deposition mask preparation, even if the size is increased, both high definition and light weight are satisfied, and the vapor deposition mask Thus, it is possible to obtain a vapor deposition mask capable of improving the yield and the quality in the manufacturing process using GaN. Specifically, it is possible to obtain a deposition mask capable of accurately recognizing the alignment mark from the alignment mark reading side.

(Manufacturing method of organic semiconductor element)
Next, a method for manufacturing an organic semiconductor device according to one embodiment of the present invention will be described. The method for manufacturing an organic semiconductor device according to one embodiment of the present invention includes a step of forming a vapor deposition pattern by a vapor deposition method using a vapor deposition mask with a frame, and the following vapor deposition mask with a frame in the process of manufacturing the organic semiconductor device. Is characterized in that is used.

  In one embodiment, the method for manufacturing an organic semiconductor device having a step of forming a vapor deposition pattern by a vapor deposition method using a frame-equipped vapor deposition mask includes an electrode forming step of forming an electrode on a substrate, an organic layer forming step, and a counter electrode forming step. And an encapsulation layer forming step, and in each optional step, an evaporation pattern is formed on the substrate by an evaporation method using an evaporation mask with a frame. For example, when the vapor deposition method using a vapor deposition mask with a frame is respectively applied to the R, G, and B light emitting layer forming process of the organic EL device, a vapor deposition pattern of each color light emitting layer is formed on the substrate. The method for manufacturing an organic semiconductor device according to an embodiment of the present invention is not limited to these steps, and can be applied to any step in the manufacture of a conventionally known organic semiconductor element using a vapor deposition method.

  In the method for manufacturing an organic semiconductor device according to one embodiment of the present invention, in the step of forming the vapor deposition pattern, the vapor deposition mask fixed to a frame is the vapor deposition mask according to one embodiment of the present invention described above. It is characterized by.

  As the vapor deposition mask that forms the vapor deposition mask with a frame, the vapor deposition mask 100 according to one embodiment of the present invention described above can be used as it is, and a detailed description thereof will be omitted. According to the method of manufacturing an organic semiconductor device using the above-described vapor deposition mask with a frame in which the vapor deposition mask of one embodiment of the present invention is fixed to a frame, the alignment mark is accurately recognized from the alignment mark reading side. Since the alignment marks can be used, the alignment between the deposition mask with the frame and the deposition target can be accurately performed, and an organic semiconductor element having a high-definition pattern can be manufactured. Examples of the organic semiconductor device manufactured by the manufacturing method of the present invention include an organic layer and a light emitting layer of an organic EL device, a cathode electrode, and the like. In particular, the method for manufacturing an organic semiconductor device according to one embodiment of the present invention can be suitably used for manufacturing R, G, and B light emitting layers of an organic EL device that requires high definition pattern accuracy.

  The evaporation mask with a frame used for manufacturing an organic semiconductor element may be any as long as it satisfies the condition that the evaporation mask of the embodiment of the present invention described above is fixed to the frame. There is no particular limitation. The frame is not particularly limited, as long as it is a member that can support the evaporation mask. For example, a metal frame, a ceramic frame, or the like can be used. Among them, the metal frame is preferable because the welding of the deposition mask to the metal mask is easy and the influence of deformation or the like is small. Hereinafter, an example in which a metal frame is used as the frame will be mainly described. For example, as shown in FIG. 19, a metal frame-equipped vapor deposition mask 200 in which one vapor deposition mask 100 is fixed may be used for the metal frame 60, and as shown in FIG. A vapor deposition mask 200 with a metal frame in which vapor deposition masks (four vapor deposition masks in the illustrated form) are arranged and fixed in the vertical or horizontal direction (in the illustrated form, fixed in the horizontal direction). 19 and 20 are front views of the vapor deposition mask 200 with a metal frame according to one embodiment as viewed from the resin mask 20 side, and the alignment marks are omitted.

  The metal frame 60 is a substantially rectangular frame member, and has an opening for exposing the opening 25 provided in the resin mask 20 of the finally fixed evaporation mask 100 to the evaporation source side. The material of the metal frame is not particularly limited, but a metal material having high rigidity, for example, SUS or Invar material is suitable.

  The thickness of the metal frame is not particularly limited, but is preferably about 10 mm to 30 mm from the viewpoint of rigidity and the like. The width between the inner peripheral end surface of the opening of the metal frame and the outer peripheral end surface of the metal frame is not particularly limited as long as the metal frame and the metal mask of the evaporation mask can be fixed. A width of about 50 mm can be exemplified.

  Further, a reinforcing frame 65 or the like may be present in the opening of the metal frame as long as the opening 25 of the resin mask 20 constituting the vapor deposition mask 100 is not hindered. In other words, the opening of the metal frame 60 may be divided by a reinforcing frame or the like. In the embodiment shown in FIG. 19, a plurality of reinforcing frames 65 extending in the horizontal direction are arranged in the vertical direction. However, instead of this reinforcing frame 65, or a plurality of reinforcing frames extending in the vertical direction are arranged in a plurality of rows in the horizontal direction. It may be. In the embodiment shown in FIG. 20, a plurality of reinforcing frames 65 extending in the vertical direction are arranged in the horizontal direction. However, instead of the reinforcing frame 65 or together with the reinforcing frame 65, the reinforcing frames extending in the horizontal direction are arranged in the vertical direction. A plurality may be arranged. By using the metal frame 60 on which the reinforcing frame 65 is disposed, when the vapor deposition mask 100 according to one embodiment of the present invention is fixed to the metal frame 60 in a longitudinal direction and a horizontal direction, the reinforcing frame and the The deposition mask can be fixed to the metal frame 60 even at the position where the deposition mask overlaps.

  The method for fixing the metal frame 60 and the vapor deposition mask 100 according to one embodiment of the present invention is not particularly limited, and can be fixed using spot welding, an adhesive, a screw, or the like, which is fixed by a laser beam or the like.

Reference numeral 200: a vapor deposition mask with a metal frame 100: a vapor deposition mask 10, a metal mask 15, a slit 16, a through hole 20, a resin mask 25, an opening 30, a resin plate 40, an alignment mark 50, a metal mask with a resin plate 60, a metal frame

Claims (2)

An evaporation mask with a frame in which an evaporation mask is fixed to a frame,
A vapor deposition mask fixed to the frame, a metal layer provided with a metal opening overlapping with the resin opening is laminated on one surface of a resin layer provided with a resin opening corresponding to a pattern to be vapor-deposited. A plurality of alignment marks are provided on a part of the surface of the metal layer that is in contact with the resin layer, and at least one of the plurality of alignment marks is not in contact with one surface of the resin layer. An evaporation mask with a frame, which is an evaporation mask.   The deposition mask with a frame according to claim 1, wherein the alignment mark is a through hole penetrating the metal layer.

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