JP6638744B2 - ポリイミド前駆体組成物、ポリイミドの製造方法、ポリイミド、ポリイミドフィルム、及び基板 - Google Patents

ポリイミド前駆体組成物、ポリイミドの製造方法、ポリイミド、ポリイミドフィルム、及び基板 Download PDF

Info

Publication number
JP6638744B2
JP6638744B2 JP2018009116A JP2018009116A JP6638744B2 JP 6638744 B2 JP6638744 B2 JP 6638744B2 JP 2018009116 A JP2018009116 A JP 2018009116A JP 2018009116 A JP2018009116 A JP 2018009116A JP 6638744 B2 JP6638744 B2 JP 6638744B2
Authority
JP
Japan
Prior art keywords
polyimide
polyimide precursor
substrate
film
precursor composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2018009116A
Other languages
English (en)
Japanese (ja)
Other versions
JP2018080344A5 (https=
JP2018080344A (ja
Inventor
卓也 岡
卓也 岡
幸徳 小濱
幸徳 小濱
久野　信治
信治 久野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ube Corp
Original Assignee
Ube Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ube Industries Ltd filed Critical Ube Industries Ltd
Priority to JP2018009116A priority Critical patent/JP6638744B2/ja
Publication of JP2018080344A publication Critical patent/JP2018080344A/ja
Publication of JP2018080344A5 publication Critical patent/JP2018080344A5/ja
Application granted granted Critical
Publication of JP6638744B2 publication Critical patent/JP6638744B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Laminated Bodies (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
JP2018009116A 2018-01-23 2018-01-23 ポリイミド前駆体組成物、ポリイミドの製造方法、ポリイミド、ポリイミドフィルム、及び基板 Active JP6638744B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2018009116A JP6638744B2 (ja) 2018-01-23 2018-01-23 ポリイミド前駆体組成物、ポリイミドの製造方法、ポリイミド、ポリイミドフィルム、及び基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018009116A JP6638744B2 (ja) 2018-01-23 2018-01-23 ポリイミド前駆体組成物、ポリイミドの製造方法、ポリイミド、ポリイミドフィルム、及び基板

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2013245489A Division JP6461470B2 (ja) 2013-11-27 2013-11-27 ポリイミド前駆体組成物、ポリイミドの製造方法、ポリイミド、ポリイミドフィルム、及び基板

Publications (3)

Publication Number Publication Date
JP2018080344A JP2018080344A (ja) 2018-05-24
JP2018080344A5 JP2018080344A5 (https=) 2018-12-06
JP6638744B2 true JP6638744B2 (ja) 2020-01-29

Family

ID=62197103

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018009116A Active JP6638744B2 (ja) 2018-01-23 2018-01-23 ポリイミド前駆体組成物、ポリイミドの製造方法、ポリイミド、ポリイミドフィルム、及び基板

Country Status (1)

Country Link
JP (1) JP6638744B2 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20240167856A (ko) * 2022-03-28 2024-11-28 유비이 가부시키가이샤 폴리이미드 전구체 조성물, 폴리이미드 필름 및 폴리이미드 필름/기재 적층체

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2683291B2 (ja) * 1990-02-26 1997-11-26 日本電信電話株式会社 液晶表示素子
JPH05295115A (ja) * 1992-04-24 1993-11-09 Sumitomo Bakelite Co Ltd 低熱膨張性ポリイミド樹脂およびその製造方法
JPH10265572A (ja) * 1996-02-13 1998-10-06 Nitto Denko Corp 回路基板、回路付きサスペンション基板及びそれらの製造方法
JP2004115813A (ja) * 1996-03-14 2004-04-15 Toshiba Corp ポリイミド前駆体組成物、ポリイミド膜の形成方法、電子部品および液晶素子
JPH09302225A (ja) * 1996-03-14 1997-11-25 Toshiba Corp ポリイミド前駆体組成物、ポリイミド膜の形成方法、電子部品および液晶素子
JP4130003B2 (ja) * 1998-03-13 2008-08-06 宇部興産株式会社 芳香族ポリイミドフィルムの製造方法
JP4823953B2 (ja) * 2007-03-27 2011-11-24 新日鐵化学株式会社 フレキシブル積層板の製造方法
JP2009091413A (ja) * 2007-10-05 2009-04-30 Ist Corp ポリイミド前駆体組成物、感光性ポリイミド前駆体組成物及びこれを用いた電子部品並びに被膜形成方法
US20110084419A1 (en) * 2008-06-02 2011-04-14 Ube Industries, Ltd. Method for producing aromatic polyimide film wherein linear expansion coefficient in transverse direction is lower than linear expansion coefficient in machine direction
JP5362385B2 (ja) * 2009-02-23 2013-12-11 旭化成イーマテリアルズ株式会社 ポリアミド酸ワニス組成物及びそれを用いたポリイミド金属積層板
JP5391905B2 (ja) * 2009-07-31 2014-01-15 宇部興産株式会社 ポリイミドフィルムおよびポリイミドフィルムの製造方法
KR101292886B1 (ko) * 2009-09-29 2013-08-02 코오롱인더스트리 주식회사 내용제성이 개선된 무색투명한 폴리이미드 필름
JP2011209578A (ja) * 2010-03-30 2011-10-20 Nitto Denko Corp 管状体およびその製造方法
JP2012146905A (ja) * 2011-01-14 2012-08-02 Kaneka Corp 可溶性ポリイミド樹脂フィルムの利用
JP5845911B2 (ja) * 2012-01-13 2016-01-20 宇部興産株式会社 ポリイミド前駆体水溶液組成物、及びポリイミド前駆体水溶液組成物の製造方法

Also Published As

Publication number Publication date
JP2018080344A (ja) 2018-05-24

Similar Documents

Publication Publication Date Title
JP6721070B2 (ja) ポリイミド前駆体組成物、ポリイミドの製造方法、ポリイミド、ポリイミドフィルム、及び基板
JP6669074B2 (ja) ポリイミドフィルム、ポリイミド前駆体、及びポリイミド
JP6531812B2 (ja) ポリイミド前駆体及びポリイミド
JP6516048B2 (ja) ポリイミド前駆体、及びポリイミド
JP6627510B2 (ja) ポリイミド前駆体組成物、ポリイミドの製造方法、ポリイミド、ポリイミドフィルム、及び基板
JP6607193B2 (ja) ポリイミド前駆体、ポリイミド、及びポリイミドフィルム
JP6283954B2 (ja) ポリイミド前駆体、ポリイミド、ワニス、ポリイミドフィルム、及び基板
JP7047852B2 (ja) ポリイミド前駆体、ポリイミド、ポリイミドフィルム、ワニス、及び基板
WO2015053312A1 (ja) ポリイミド前駆体、ポリイミド、ポリイミドフィルム、ワニス、及び基板
JP5842429B2 (ja) ポリイミド前駆体及びポリイミド
WO2014038714A1 (ja) ポリイミド前駆体、ポリイミド、ワニス、ポリイミドフィルム、および基板
JP6461470B2 (ja) ポリイミド前駆体組成物、ポリイミドの製造方法、ポリイミド、ポリイミドフィルム、及び基板
JP7069478B2 (ja) ポリイミド、ポリイミド溶液組成物、ポリイミドフィルム、及び基板
JP6638744B2 (ja) ポリイミド前駆体組成物、ポリイミドの製造方法、ポリイミド、ポリイミドフィルム、及び基板
WO2015080156A1 (ja) ポリイミド前駆体組成物、ポリイミドの製造方法、ポリイミド、ポリイミドフィルム、及び基板

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20180220

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20180220

RD04 Notification of resignation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7424

Effective date: 20180409

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20181025

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20181120

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20181204

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20190201

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20190521

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20190722

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20191126

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20191209

R150 Certificate of patent or registration of utility model

Ref document number: 6638744

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

S533 Written request for registration of change of name

Free format text: JAPANESE INTERMEDIATE CODE: R313533

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250