JP2018080344A5 - - Google Patents
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- Publication number
- JP2018080344A5 JP2018080344A5 JP2018009116A JP2018009116A JP2018080344A5 JP 2018080344 A5 JP2018080344 A5 JP 2018080344A5 JP 2018009116 A JP2018009116 A JP 2018009116A JP 2018009116 A JP2018009116 A JP 2018009116A JP 2018080344 A5 JP2018080344 A5 JP 2018080344A5
- Authority
- JP
- Japan
- Prior art keywords
- polyimide precursor
- polyimide
- precursor composition
- mol
- chemical formula
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 229920001721 polyimide Polymers 0.000 claims 22
- 239000004642 Polyimide Substances 0.000 claims 20
- 239000002243 precursor Substances 0.000 claims 15
- 239000000126 substance Substances 0.000 claims 5
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims 4
- 239000000758 substrate Substances 0.000 claims 3
- 125000003118 aryl group Chemical group 0.000 claims 2
- 125000004432 carbon atom Chemical group C* 0.000 claims 2
- 238000010438 heat treatment Methods 0.000 claims 2
- -1 imidazole compound Chemical class 0.000 claims 2
- 150000002460 imidazoles Chemical class 0.000 claims 2
- 238000000034 method Methods 0.000 claims 2
- 238000002834 transmittance Methods 0.000 claims 2
- HYZJCKYKOHLVJF-UHFFFAOYSA-N 1H-benzimidazole Chemical compound C1=CC=C2NC=NC2=C1 HYZJCKYKOHLVJF-UHFFFAOYSA-N 0.000 claims 1
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 claims 1
- 125000000217 alkyl group Chemical group 0.000 claims 1
- 125000005103 alkyl silyl group Chemical group 0.000 claims 1
- 238000009835 boiling Methods 0.000 claims 1
- 229910052731 fluorine Inorganic materials 0.000 claims 1
- 125000001153 fluoro group Chemical group F* 0.000 claims 1
- 229910052739 hydrogen Inorganic materials 0.000 claims 1
- 239000001257 hydrogen Substances 0.000 claims 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- CPFAHOQKQXUICI-UHFFFAOYSA-N Cc(cc1C)ccc1-c1c(C(F)(F)F)cc(C)cc1 Chemical compound Cc(cc1C)ccc1-c1c(C(F)(F)F)cc(C)cc1 CPFAHOQKQXUICI-UHFFFAOYSA-N 0.000 description 1
- GLFKFHJEFMLTOB-UHFFFAOYSA-N Cc1c(C)cc(C(C(F)(F)F)(C(F)(F)F)c2cc(C)c(C)cc2)cc1 Chemical compound Cc1c(C)cc(C(C(F)(F)F)(C(F)(F)F)c2cc(C)c(C)cc2)cc1 GLFKFHJEFMLTOB-UHFFFAOYSA-N 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018009116A JP6638744B2 (ja) | 2018-01-23 | 2018-01-23 | ポリイミド前駆体組成物、ポリイミドの製造方法、ポリイミド、ポリイミドフィルム、及び基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018009116A JP6638744B2 (ja) | 2018-01-23 | 2018-01-23 | ポリイミド前駆体組成物、ポリイミドの製造方法、ポリイミド、ポリイミドフィルム、及び基板 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013245489A Division JP6461470B2 (ja) | 2013-11-27 | 2013-11-27 | ポリイミド前駆体組成物、ポリイミドの製造方法、ポリイミド、ポリイミドフィルム、及び基板 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2018080344A JP2018080344A (ja) | 2018-05-24 |
| JP2018080344A5 true JP2018080344A5 (https=) | 2018-12-06 |
| JP6638744B2 JP6638744B2 (ja) | 2020-01-29 |
Family
ID=62197103
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018009116A Active JP6638744B2 (ja) | 2018-01-23 | 2018-01-23 | ポリイミド前駆体組成物、ポリイミドの製造方法、ポリイミド、ポリイミドフィルム、及び基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6638744B2 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20240167856A (ko) * | 2022-03-28 | 2024-11-28 | 유비이 가부시키가이샤 | 폴리이미드 전구체 조성물, 폴리이미드 필름 및 폴리이미드 필름/기재 적층체 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2683291B2 (ja) * | 1990-02-26 | 1997-11-26 | 日本電信電話株式会社 | 液晶表示素子 |
| JPH05295115A (ja) * | 1992-04-24 | 1993-11-09 | Sumitomo Bakelite Co Ltd | 低熱膨張性ポリイミド樹脂およびその製造方法 |
| JPH10265572A (ja) * | 1996-02-13 | 1998-10-06 | Nitto Denko Corp | 回路基板、回路付きサスペンション基板及びそれらの製造方法 |
| JP2004115813A (ja) * | 1996-03-14 | 2004-04-15 | Toshiba Corp | ポリイミド前駆体組成物、ポリイミド膜の形成方法、電子部品および液晶素子 |
| JPH09302225A (ja) * | 1996-03-14 | 1997-11-25 | Toshiba Corp | ポリイミド前駆体組成物、ポリイミド膜の形成方法、電子部品および液晶素子 |
| JP4130003B2 (ja) * | 1998-03-13 | 2008-08-06 | 宇部興産株式会社 | 芳香族ポリイミドフィルムの製造方法 |
| JP4823953B2 (ja) * | 2007-03-27 | 2011-11-24 | 新日鐵化学株式会社 | フレキシブル積層板の製造方法 |
| JP2009091413A (ja) * | 2007-10-05 | 2009-04-30 | Ist Corp | ポリイミド前駆体組成物、感光性ポリイミド前駆体組成物及びこれを用いた電子部品並びに被膜形成方法 |
| US20110084419A1 (en) * | 2008-06-02 | 2011-04-14 | Ube Industries, Ltd. | Method for producing aromatic polyimide film wherein linear expansion coefficient in transverse direction is lower than linear expansion coefficient in machine direction |
| JP5362385B2 (ja) * | 2009-02-23 | 2013-12-11 | 旭化成イーマテリアルズ株式会社 | ポリアミド酸ワニス組成物及びそれを用いたポリイミド金属積層板 |
| JP5391905B2 (ja) * | 2009-07-31 | 2014-01-15 | 宇部興産株式会社 | ポリイミドフィルムおよびポリイミドフィルムの製造方法 |
| KR101292886B1 (ko) * | 2009-09-29 | 2013-08-02 | 코오롱인더스트리 주식회사 | 내용제성이 개선된 무색투명한 폴리이미드 필름 |
| JP2011209578A (ja) * | 2010-03-30 | 2011-10-20 | Nitto Denko Corp | 管状体およびその製造方法 |
| JP2012146905A (ja) * | 2011-01-14 | 2012-08-02 | Kaneka Corp | 可溶性ポリイミド樹脂フィルムの利用 |
| JP5845911B2 (ja) * | 2012-01-13 | 2016-01-20 | 宇部興産株式会社 | ポリイミド前駆体水溶液組成物、及びポリイミド前駆体水溶液組成物の製造方法 |
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2018
- 2018-01-23 JP JP2018009116A patent/JP6638744B2/ja active Active
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