JP6635934B2 - バックコンタクト型Si薄膜太陽電池 - Google Patents
バックコンタクト型Si薄膜太陽電池 Download PDFInfo
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- JP6635934B2 JP6635934B2 JP2016555492A JP2016555492A JP6635934B2 JP 6635934 B2 JP6635934 B2 JP 6635934B2 JP 2016555492 A JP2016555492 A JP 2016555492A JP 2016555492 A JP2016555492 A JP 2016555492A JP 6635934 B2 JP6635934 B2 JP 6635934B2
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- 239000010409 thin film Substances 0.000 title claims description 26
- 239000010410 layer Substances 0.000 claims description 180
- 239000006096 absorbing agent Substances 0.000 claims description 63
- 238000000034 method Methods 0.000 claims description 19
- 230000004888 barrier function Effects 0.000 claims description 18
- 229910052710 silicon Inorganic materials 0.000 claims description 16
- 238000002425 crystallisation Methods 0.000 claims description 15
- 230000008025 crystallization Effects 0.000 claims description 15
- 239000007791 liquid phase Substances 0.000 claims description 15
- 238000002161 passivation Methods 0.000 claims description 15
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 14
- 229910021419 crystalline silicon Inorganic materials 0.000 claims description 14
- 238000004519 manufacturing process Methods 0.000 claims description 14
- 239000000758 substrate Substances 0.000 claims description 13
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 12
- 229910010413 TiO 2 Inorganic materials 0.000 claims description 12
- 229910045601 alloy Inorganic materials 0.000 claims description 12
- 239000000956 alloy Substances 0.000 claims description 12
- 239000010703 silicon Substances 0.000 claims description 12
- 238000000151 deposition Methods 0.000 claims description 11
- 239000011521 glass Substances 0.000 claims description 11
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 10
- 229910021423 nanocrystalline silicon Inorganic materials 0.000 claims description 10
- 229910052760 oxygen Inorganic materials 0.000 claims description 10
- 239000001301 oxygen Substances 0.000 claims description 10
- 239000011247 coating layer Substances 0.000 claims description 8
- 230000003287 optical effect Effects 0.000 claims description 8
- 229910021421 monocrystalline silicon Inorganic materials 0.000 claims description 7
- 239000011856 silicon-based particle Substances 0.000 claims description 7
- 239000000969 carrier Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 6
- 239000002243 precursor Substances 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 5
- 239000002356 single layer Substances 0.000 claims description 5
- 230000008021 deposition Effects 0.000 claims description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 3
- 229910052698 phosphorus Inorganic materials 0.000 claims description 3
- 239000011574 phosphorus Substances 0.000 claims description 3
- 239000002994 raw material Substances 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 2
- 229910052787 antimony Inorganic materials 0.000 claims description 2
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 claims description 2
- 229910052785 arsenic Inorganic materials 0.000 claims description 2
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 claims description 2
- 229910021426 porous silicon Inorganic materials 0.000 claims 2
- 238000010521 absorption reaction Methods 0.000 claims 1
- 239000013078 crystal Substances 0.000 claims 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 10
- 239000000463 material Substances 0.000 description 8
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 238000007704 wet chemistry method Methods 0.000 description 1
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Description
ND=c0・1/d
によって、選択されたパラメータ範囲において特定可能であり、ここでdは200nm〜40μmにある吸収体層の厚さを表し、かつc0は面積に対するドーピングを意味し、前記c 0 の値は6・1017μm・cm−3〜8・1018μm・cm−3の範囲にある。対応するパラメータ範囲は図1に示されている。
Claims (11)
- 逆型のp型及びn型ドーピングの半導体原料から形成されている、結晶質Si吸収体層及び結晶質Si吸収体層上に配置されるエミッタ層を少なくとも有し、かつ光入射によって吸収体層で作製された過剰なキャリアを集めるための接触系が裏面に配置されているバックコンタクト型Si薄膜太陽電池において、
・ガラス基板上に、50nm〜1μmの範囲にある層厚を有する障壁層が形成されていること、
・障壁層上に、40nm〜250nmの層厚を有する、光学コーティングのための少なくとも1つの層が配置されていること、
・光学特性を改善する少なくとも1つの層上に、結晶質Si吸収体層に隣接する、0.5nm〜20nmの、シリコン及び/又は酸素を含有する薄い層が配置されていること、及び
・結晶質Si吸収体層が、液相結晶化によって製造されたものであり、かつn伝導型であり、厚さ全体にわたって、2・1015cm−3〜5・1018cm−3の均質なドーピングで200nm〜40μmの層厚を有し、かつ三次元的な広がりにおいて少なくとも吸収体層の厚さと同じ大きさである単結晶Si粒子を有すること、及び
・液相結晶化の間に、シリコン及び/又は酸素を含有する層とSi吸収体層の間に、SiO2パッシベーション層が形成されていること、
を特徴とする前記バックコンタクト型Si薄膜太陽電池。 - 請求項1に記載のバックコンタクト型Si薄膜太陽電池において、障壁層が、単一の層として、又は複数の層で、SiOx、SiNx、SiCx、TiO2、AlOx、又はそれらの混合合金から形成されていることを特徴とする前記バックコンタクト型Si薄膜太陽電池。
- 請求項1に記載のバックコンタクト型Si薄膜太陽電池において、光学コーティングのための少なくとも1つの層が、SiNx、SiOx、SiCx、TiO2、AlOx、又はそれらの混合合金から形成されていることを特徴とする前記バックコンタクト型Si薄膜太陽電池。
- 請求項1に記載のバックコンタクト型Si薄膜太陽電池において、n伝導型結晶質Si吸収体層の均質なドーピングが、その厚さ全体にわたって、1.5・1016cm−3〜2・1018cm−3であることを特徴とする前記バックコンタクト型Si薄膜太陽電池。
- 請求項1に記載のバックコンタクト型Si薄膜太陽電池において、n伝導型結晶質Si吸収体層の均質なドーピングが、式 ND=c0・1/dによって特定可能であり、ここで、dは200nm〜40μmにある吸収体層の厚さをマイクロメートルで表し、かつ
c0は面積に対するドーピングを意味し、前記c 0 の値が6・1017μm・cm−3〜8・1018μm・cm−3の範囲にあることを特徴とする前記バックコンタクト型Si薄膜太陽電池。 - 請求項1から5までのいずれか一項に記載のバックコンタクト型Si薄膜太陽電池の製造方法であって、少なくとも以下の方法工程:
・単一の層として、又は複数の層で、50nm〜1μmの範囲にある層厚を有する、SiOx、SiNx、SiCx、TiO2、AlOx、又はそれらの混合合金からの障壁層を、洗浄したガラス基板に施与すること、
・40nm〜250nmの層厚を有する、SiNx、SiOx、SiCx、TiO2、AlOx、又はそれらの混合合金からの、光学コーティングのための少なくとも1つの層を引き続きこの障壁層に堆積させること、
・その後に、前駆体としてシリコン及び/又は酸素を含有する層をまず堆積させ、その上にアモルファス又はナノ結晶質Si層、及びその上に吸収体層のn伝導性のためのドーピング源として、さらなる層を堆積させることで、コーティング層上にSiO2パッシベーション層を作製すること、及び
・引き続き、Si層の液相結晶化を実施し、ここで200nm〜40μmの層厚、及び吸収体層の厚さ全体にわたる2・1015cm−3〜5・1018cm−3の均質なドーピングを有し、垂直方向の広がりが吸収体層の厚さよりも大きい単結晶Si粒子を有するn伝導型結晶質Si吸収体層が、SiO2パッシベーション層に隣接して作製されること、
を有する前記製造方法。 - 請求項1から5までのいずれか一項に記載のバックコンタクト型Si薄膜太陽電池の製造方法であって、少なくとも以下の方法工程:
・単一の層として、又は複数の層で、50nm〜1μmの範囲にある層厚を有する、SiOx、SiNx、SiCx、TiO2、AlOx、又はそれらの混合合金からの障壁層を、洗浄したガラス基板に施与すること、
・40nm〜250nmの層厚を有する、SiNx、SiOx、SiCx、TiO2、AlOx、又はそれらの混合合金からの、光学コーティングのための少なくとも1つの層を引き続きこの障壁層に堆積させること、
・その後に、前駆体としてシリコン及び/又は酸素を含有する層をまず堆積させ、その上に吸収体層のn伝導性のためのドーピング源として、さらなる層を堆積させ、及びその上にアモルファス又はナノ結晶質Si層を堆積させることで、コーティング層上にSiO2パッシベーション層を作製すること、及び
・引き続き、Si層の液相結晶化を実施し、ここで200nm〜40μmの層厚、及び吸収体層の厚さ全体にわたる2・1015cm−3〜5・1018cm−3の均質なドーピングを有し、垂直方向の広がりが吸収体層の厚さよりも大きい単結晶Si粒子を有するn伝導型結晶質Si吸収体層が、SiO2パッシベーション層に隣接して作製されること、
を有する前記製造方法。 - 請求項1から5までのいずれか一項に記載のバックコンタクト型Si薄膜太陽電池の製造方法であって、少なくとも以下の方法工程:
・単一の層として、又は複数の層で、50nm〜1μmの範囲にある層厚を有する、SiOx、SiNx、SiCx、TiO2、AlOx、又はそれらの混合合金からの障壁層を、洗浄したガラス基板に施与すること、
・40nm〜250nmの層厚を有する、SiNx、SiOx、SiCx、TiO2、AlOx、又はそれらの混合合金からの、光学コーティングのための少なくとも1つの層を引き続きこの障壁層に堆積させること、
・その後に、前駆体としてシリコン及び/又は酸素を含有する層をまず堆積させ、その上にアモルファス又はナノ結晶質Si層を堆積させ、このSi層のために、シリコン層の堆積の間にin−situドーピングによってドーピングを作製することで、コーティング層上にSiO2パッシベーション層を作製すること、
・引き続き、Si層の液相結晶化を実施し、ここで200nm〜40μmの層厚、及び吸収体層の厚さ全体にわたる2・1015cm−3〜5・1018cm−3の均質なドーピングを有し、垂直方向の広がりが吸収体層の厚さよりも大きい単結晶Si粒子を有するn伝導型結晶質Si吸収体層が、SiO2パッシベーション層に隣接して作製されること、
を有する前記製造方法。 - 請求項6から8までのいずれか一項に記載のバックコンタクト型Si薄膜太陽電池の製造方法において、前駆体層としてSiNxOy層、SiNx層、又はAl2O3層を使用することを特徴とする前記製造方法。
- 請求項6から8までのいずれか一項に記載のバックコンタクト型Si薄膜太陽電池の製造方法において、ドーピング物質としてリン又はヒ素又はアンチモンを使用することを特徴とする前記製造方法。
- 請求項6から8までのいずれか一項に記載のバックコンタクト型Si薄膜太陽電池の製造方法において、吸収体層の均質なドーピングを、1.5・1016cm−3〜2・1018cm−3で調整することを特徴とする前記製造方法。
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