JP6628050B2 - Electronic circuit component mounting method - Google Patents

Description

  According to the present invention, at least one feeder main body side feeder which is held by a mounter main body and supplies a first-type electronic circuit component, and is moved by a head moving device to a circuit substrate transport / holding device and a mounter main body side feeder. An electronic circuit component mounter including one or more head-side feeders, which are held together with a mounting device that mounts electronic circuit components by a plurality of component holders on the head main body and that supplies a second-type electronic circuit component, The present invention relates to a method for mounting both a first type electronic circuit component and a second type electronic circuit component on one circuit substrate, and an electronic circuit component mounting system for implementing the method.

Patent Literature 1 below describes an electronic circuit component mounter including a plurality of mounter body-side feeders 26 and a plurality of bulk feeders 18 as a head-side feeder, and an electronic circuit component mounting method using the same. I have.
In addition, in Japanese Patent Application Laid-Open No. H11-216, the electronic circuit component is taken out from a plurality of tape feeders 4a as a mounter body side feeder and mounted on a substrate W by a plurality of mounting heads 16 having a plurality of suction nozzles 16a. It is described that in the electronic circuit component mounter, the transport of the substrate W from the standby position to the mounting operation execution position and the mounting preparation by the mounting head 16 are performed in parallel.
According to the electronic circuit component mounter and the electronic circuit component mounting method described in Patent Document 1, it is necessary to move the mounting device to the mounter body side feeder in order to take out the electronic circuit components from the plurality of bulk feeders 18. Since the mounting operation can be performed efficiently, the mounting operation can be efficiently performed. In the electronic circuit component mounting machine described in Patent Literature 2, the mounting preparation by the mounting head 16 and the loading of the substrate W are performed in parallel. Can be performed efficiently.

JP 2002-280793 A JP 2008-198778 A

  The present invention has been made with an object to further improve the electronic circuit component mounting machine and the electronic circuit component mounting method described in Patent Documents 1 and 2 against the above circumstances.

In order to solve the above-described problems, an electronic circuit component mounting method of the present invention includes:
(a) a mounting machine body, (b) held by the mounting machine body, and a circuit board transport holding device that transports and fixes and holds the circuit board, and (c) held by the mounting machine body, One or more mounter body-side feeders for supplying a first-class electronic circuit component; and (d) a head moving device for the mounter body, the circuit base material transport and holding device and the mounter body-side feeder. (E) one or more head-side feeders which are held by the head body and supply the second type electronic circuit components, and (f) A plurality of component holders held by the head body, the first type electronic circuit components from the mounting machine main body side feeder and the second type electronic circuit components from the head side feeder by the plurality of component holders; Each and receive and hold the circuit substrate An electronic circuit component mounter including a mounting device for mounting on a circuit substrate held by a device, the first type electronic circuit component for one circuit substrate held by the circuit substrate transport / holding device. And an electronic circuit component mounting method for mounting both the second type electronic circuit component, and
According to a first aspect of the present invention, there is provided an electronic circuit component mounting method, wherein the electronic circuit component mounting method includes receiving at least a part of the first type electronic circuit component in parallel with loading of the circuit substrate by the circuit substrate transport / holding device. Characterized in that it includes a first-class component receiving step during loading of the base material.
According to a second aspect, the electronic circuit component mounting method starts receiving the second type electronic circuit component before completion of mounting the first type electronic circuit component held by the plurality of component holders. -It is characterized by including a parallel implementation process of receiving
According to a third aspect of the present invention, the electronic circuit component mounting method is configured such that, when at least one of a component cut-out in the mounting machine main body side feeder and a component receiving error from the mounting machine main body side feeder occurs, at least the second type electronic component mounting method is performed. After the completion of receiving the circuit component, a specific type 1 component receiving step of receiving a specific type 1 component that is a type 1 electronic circuit component in which the component has run out or a component receiving error has occurred is included,
According to a fourth aspect, in the electronic circuit component mounting method, when it is necessary to discard any of the first-type electronic circuit components held by the plurality of component holders, the head main body is moved to the next position. It is characterized in that it includes a first-class component receiving process at the time of disposal, which is discarded on the way to receiving the first-class electronic circuit component,
According to a fifth aspect of the present invention, when the electronic circuit component mounting method needs to dispose of any of the second type electronic circuit components held by the plurality of component holders, the head moving device can be used immediately. A second type component at the time of disposal, in which a movement of the head body to a component disposal position is started and another one of the plurality of component holders receives a second type electronic circuit component in parallel with the movement; The method includes a receiving step.

  According to the above method invention, when both the first type electronic circuit component and the second type electronic circuit component are mounted on one circuit substrate, the effect of improving the efficiency of the mounting operation can be obtained.

Aspects of the invention

  In the following, the inventions that can be claimed in the present application (hereinafter, may be referred to as “claimable inventions.” The only claimable inventions are the inventions described in the claims. However, the invention may include a lower concept invention or a higher concept invention, and may also include a different concept invention.) As in the case of the claims, each aspect is divided into sections, each section is numbered, and the number of another section is cited as necessary. This is for the purpose of facilitating the understanding of the claimable invention, and is not intended to limit the combination of the components constituting the claimable invention to those described in the following items. In other words, the claimable invention should be interpreted in consideration of the description accompanying the respective items, the description of the embodiment, the prior art, the common general technical knowledge, and the like. Embodiments in which components are added and embodiments in which components are deleted from the embodiments of the respective sections can be one embodiment of the claimable invention.

(1) (a) a mounting machine main body, (b) a circuit base material conveying and holding device which is held by the mounting machine main body and conveys and fixes and holds a circuit base material, and (c) the mounting machine main body. One or more mounting machine main body side feeders that are held and supply the first type electronic circuit components; and (d) the circuit base material transport holding device and the mounting machine with respect to the mounting machine main body by a head moving device. A head body that can be moved to an arbitrary position within a movement plane straddling the body-side feeder, and (e) one or more head-side feeders that are held by the head body and supply the second-type electronic circuit components; (f) a plurality of component holders held by the head body, the first type electronic circuit component from the mounting machine body side feeder by the plurality of component holders, and the second type from the head side feeder. Receiving each electronic circuit component and transporting the circuit substrate An electronic circuit component mounter including a mounting device for mounting on a circuit substrate held by a holding device, the first type electronic circuit for one circuit substrate held by the circuit substrate transport / holding device; An electronic circuit component mounting method, wherein both a component and the second type electronic circuit component are mounted.
(2) As the electronic circuit component mounter, the mounting device held by the head main body is configured to move the plurality of component holders in addition to the plurality of component holders in a direction intersecting the axis of the component holders. A device having a holder moving device for moving, and a holder moving device for moving the component holders back and forth in a direction parallel to the axis of the component holders was used, and was arbitrarily selected from the plurality of component holders. One component holder selectively receives the first type electronic circuit component from the mounting machine main body side feeder and the second type electronic circuit component from the head side feeder, and causes the circuit substrate transport holding device to The electronic circuit component mounting method according to the above mode (1), wherein the electronic circuit component is mounted on a held circuit substrate.
(3) A first or second type component receiving order determining step of determining a receiving order of the first type electronic circuit component and the second type electronic circuit component by the plurality of component holders, or (1) or The electronic circuit component mounting method according to item (2).
(4) The electronic circuit component mounting method according to the mode (3), wherein the first and second type component receiving order determination steps are performed by a computer.
(5) The step of determining the order of receiving the type 1 and type 2 components is performed based on the information on the types and numbers of the type 1 and type 2 electronic circuit components to be mounted on the circuit board. The electronic circuit component mounting method according to the above mode (3) or (4), which is executed based on the following.
(6) The first type / second type component receiving order determining step includes the step of determining information on mounting positions of the first type electronic circuit component and the second type electronic circuit component on the one circuit board, and The electronic circuit component mounting method according to any one of the above modes (3) to (5), wherein the method is performed based on at least one of information on an arrangement of a mounter body side feeder on the mounter body.
(7) In the first and second type component receiving order determining step, the number of times the head moving device has moved the head body between the circuit base material carrying and holding device and the mounting machine main body side feeder is possible. (3) to (6), wherein the number of movements of the head main body is determined so as to determine the order in which the first type electronic circuit component and the second type electronic circuit component are received. The electronic circuit component mounting method according to any one of the above items.
During the operation of the electronic circuit component mounter for mounting the first and second types of electronic circuit components on the circuit substrate, an operation that takes a particularly long time is performed between the mounter body side feeder and the circuit substrate transport holding device. Movement of the mounting device between the two. Therefore, if the number of movements is minimized, the time required for the mounting operation can be minimized, and the work efficiency can be improved.
(8) The first type / second type component receiving order determining step determines that the receiving of the first type electronic circuit component and the receiving of the second type electronic circuit component are performed collectively. -The electronic circuit component mounting method according to any one of the above modes (3) to (7), including the step of determining the type 2 component intensive receiving order.
(9) The first type in which the first and second type component intensive receiving order determination step determines that the reception of the first type electronic circuit component is performed prior to the reception of the second type electronic circuit component. The electronic circuit component mounting method according to (8), including a component receiving precedence determining step.
(10) A first type component receiving step during the loading of the substrate, which performs at least a part of receiving the first type electronic circuit component in parallel with the loading of the circuit substrate by the circuit substrate transport / holding device (1) Item 14. The electronic circuit component mounting method according to any one of Items 9 to 9.
(11) A mounting / receiving parallel execution step of starting reception of the second type electronic circuit component before the completion of mounting of the first type electronic circuit component held by the plurality of component holders is included (1). The electronic circuit component mounting method according to any one of the above items (10) to (10).
(12) When at least one of a component exhaustion in the mounting machine main body side feeder and a component receiving error from the mounting machine main body side feeder occurs, after at least reception of the second type electronic circuit component is completed, the component exhaustion or (1) The electronic circuit component according to any one of (1) to (11), including a specific type 1 component receiving step of receiving a specific type 1 component that is a type 1 electronic circuit component in which a component receiving error has occurred. Implementation method.
In order to receive the specified first-class component, it is necessary to move the head body between the circuit-substrate carrying and holding device and the feeder on the mounting machine body side, but the number of times must be as small as possible. Is desirable. Usually, the number of the specified first-class components is small, and according to the mounting apparatus provided with a plurality of component holders, it is normal that only one movement is required. In particular, when the number of component holders is large, a plurality of empty component holders that do not yet hold components are often left in a state where the reception of the second type components is completed. Upon completion of the receiving, it is also possible to immediately start the receiving of the specified first type component. However, the receiving and mounting of the type 2 components can be performed in parallel, but if the head body is started to be moved toward the feeder of the mounting machine main body, the mounting of the type 2 components can be performed. You will not be able to do it. Even if the head main body is moved toward the mounting machine main body feeder after the completion of the reception of the second type components, and the head main body is started to be moved after the completion of the second type components, there is almost no difference in the work efficiency. Therefore, after the completion of the mounting of the second type components, since all the component holders of the mounting apparatus are in an empty state, even if the number of the specific first type components is large, Even when the number of component holders of the mounting apparatus is relatively small, it is normal that the movement to the mounter main body side feeder for receiving the specified first type component only needs to be performed once. Therefore, it is desirable that the movement of the head body for receiving the specified type 1 component be started after the completion of the mounting of the type 2 component.
(13) When it is necessary to discard any of the first-type electronic circuit components held by the plurality of component holders, the head body is on the way to receiving the next first-type electronic circuit component. The electronic circuit component mounting method according to any one of the above modes (1) to (12), including a step of receiving a first-class component at the time of discarding, which is disposed of in (1).
(14) When it is necessary to discard any of the second-type electronic circuit components held by the plurality of component holders, the head moving device immediately moves the head body to the component discarding position. (1) to (13), including a second type component receiving step at the time of disposal, in which the second type electronic circuit component is received by another one of the plurality of component holders in parallel with the movement. The electronic circuit component mounting method according to any one of the above items.
(21) (a) a mounting machine main body, (b) a circuit base material conveying and holding device that is held by the mounting machine main body, and conveys and fixes and holds a circuit base material; and (c) the mounting machine main body. One or more mounting machine main body side feeders that are held and supply the first type electronic circuit components; and (d) the circuit base material transport holding device and the mounting machine with respect to the mounting machine main body by a head moving device. A head body that can be moved to an arbitrary position within a movement plane straddling the body-side feeder, and (e) one or more head-side feeders that are held by the head body and supply the second-type electronic circuit components; (f) a plurality of component holders held by the head body, the first type electronic circuit component from the mounting machine body side feeder by the plurality of component holders, and the second type from the head side feeder. Receiving the electronic circuit components respectively and the circuit substrate A mounting device mounted on the circuit substrate held by the feeding and holding device; and (g) a control device for controlling the circuit substrate transport / holding device, a mounting machine body side feeder, a head moving device, a head side feeder and a mounting device. An electronic circuit component mounting machine including:
When it is necessary to mount both the first type electronic circuit component and the second type electronic circuit component on one circuit substrate held by the circuit substrate transport and holding device, A component receiving order determining device for determining a receiving order of the type electronic circuit component and the second type electronic circuit component by the plurality of component holders.
When it is necessary to mount both the first type electronic circuit component and the second type electronic circuit component on one circuit substrate, the characteristics of the mounter body side feeder and the head side feeder are taken into consideration. In addition, it is necessary to determine the receiving order by a plurality of component holders so as to improve the efficiency of the mounting work, but if the determining rule for that is stored in the component receiving order determining device, the receiving order is automatically adjusted. As a result, the efficiency of the mounting operation can be easily improved.
(22) The mounting device further comprises:
A holder / head-side feeder relative moving device for relatively moving the plurality of component holders and the head-side feeder in a direction intersecting the axis of the component holders,
A holder moving device for moving each of the plurality of component holders back and forth in a direction parallel to the axis of the component holder, wherein the first type and the first type are selected by one arbitrarily selected from the plurality of component holders. The electronic circuit component mounting system according to item (21), wherein the second type electronic circuit component can be selectively received and mounted on a circuit substrate held by the circuit substrate transport / holding device.
(23) The mounting device is:
A rotating holder rotatably held around a rotation axis by the head main body, wherein each of the plurality of component holders is held at a plurality of holding positions on a circumference around the rotation axis. A rotating holder,
By rotating the rotation holder about the rotation axis, the plurality of component holders are turned around the rotation axis, and any one of the component holders is connected to a component supply unit of the head-side feeder. A holder turning device for selectively moving to a component receiving position respectively opposed to a component supply unit of the mounting machine body side feeder, and the rotating holder and the holder turning device are provided with the holder / head side feeder. The electronic circuit component mounting system according to item (22), which constitutes a relative movement device.
(24) The component receiving order determining device determines a receiving order of the first type electronic circuit component and the second type electronic circuit component by using the head moving device, the circuit base material conveying and holding device of the head main body, and the The electronic circuit component mounting according to any one of the above modes (21) to (23), including a head body movement frequency minimizing unit that determines the number of movements between the mounting machine body side feeder and the number of movements as small as possible. system.
(25) The first and second type component intensive, wherein the component receiving order determination device determines that the reception of the first type electronic circuit component and the reception of the second type electronic circuit component are performed collectively. The electronic circuit component mounting system according to any one of the modes (21) to (24), including a reception determining unit.
(26) The first type component, wherein the first and second type component intensive reception determination unit determines that the reception of the first type electronic circuit component is performed before the reception of the second type electronic circuit component. The electronic circuit component mounting system according to item (25), including a reception precedence determining unit.
(27) The first type component receiving during the loading of the substrate, wherein the control device performs at least a part of the receiving of the first type electronic circuit component in parallel with the loading of the circuit substrate by the circuit substrate transport / holding device. Electronic circuit component mounting system according to any one of paragraphs (21) to (26), including a control unit.
(28) A mounting / reception parallel execution control unit that starts receiving the second type electronic circuit component before the control device completes mounting the first type electronic circuit component held by the plurality of component holders. The electronic circuit component mounting system according to any one of the above modes (21) to (27).
(29) The control device may be configured to, after at least one of a component shortage in the mounting machine main body side feeder and a component receiving error from the mounting machine main body side feeder occur, after completion of receiving the second type electronic circuit component. (21) to (28), which include a specific type 1 component reception execution control unit for receiving a specific type 1 component, which is a type 1 electronic circuit component in which the component has run out or a component receiving error has occurred. The electronic circuit component mounting system according to any one of the above.
(30) When the control device needs to discard any of the first-type electronic circuit components held by the plurality of component holders, the head main body is moved to the next first-type electronic circuit. The electronic circuit component mounting system according to any one of the above modes (21) to (29), including a first-class component-required-time control unit for causing discarding on the way to receiving the component.
(31) When the control device needs to discard any of the second-type electronic circuit components held by the plurality of component holders, the head moving device immediately discards the components in the head body. A second type component required discarding control unit that starts the movement to the position and causes another one of the plurality of component holders to receive the second type electronic circuit component in parallel with the movement (21) (30) The electronic circuit component mounting system according to any of (30) to (30).
(32) The head-side feeder according to any one of (21) to (31), wherein the head-side feeder includes a bulk feeder that accommodates the electronic circuit components in a bulk state in the component accommodating portion, aligns the electronic circuit components in a line, and supplies the electronic circuit components from the component supply portion. The electronic circuit component mounting system according to any one of the above.

FIG. 1 is a perspective view showing an electronic circuit component mounting system according to an embodiment of the present invention. It is a perspective view which shows two mounting modules which are a part of the said electronic circuit component mounting system, removing the ceiling panel of one cover. FIG. 3 is a perspective view showing a mounting head and a head moving device of the mounting device of the mounting module. It is a perspective view which shows the said mounting head, (a) is a figure which shows the mounting head provided with one nozzle holder, (b) is a figure which shows the mounting head provided with 12 nozzle holders. It is a perspective view which shows the mounting head provided with 12 said nozzle holders with the cover removed. FIG. 3 is a perspective view showing a nozzle holder, a suction nozzle, an elevating device, a valve switching device, and the like of a mounting head having twelve nozzle holders. FIG. 11 is a perspective view showing a nozzle holder, a suction nozzle, another elevating device, another valve switching device, and the like of a mounting head having 12 nozzle holders. It is a perspective view showing the mounting head provided with 12 above-mentioned nozzle holders from the side where the bulk feeder was provided. It is a figure which illustrates roughly the stop position of the suction nozzle by rotation of a rotation holding body in the mounting head provided with 12 said nozzle holders. FIG. 2 is a block diagram schematically illustrating a control unit of the electronic circuit component mounting system illustrated in FIG. 1. FIG. 4 is a plan view schematically showing a relative positional relationship between an electronic circuit to be assembled in one of the mounting modules and a tape feeder. 2 is a flowchart showing a component receiving order determination routine executed in the integrated control device of the electronic circuit component mounting system shown in FIG. 1. 5 is a flowchart illustrating a main part of a component mounting routine executed in each of the mounting modules. It is a flowchart which shows a part of said component mounting routine.

Hereinafter, an embodiment of the claimable invention will be described based on the drawings. However, the structures of the electronic circuit component mounting system and the mounting module are the same as those described in detail in the specification of Japanese Patent Application No. 2011-206452, for example, and thus will be briefly described.
As shown in FIG. 1, a mounting module 10 as an example of an electronic circuit component mounter includes a plurality of units arranged to form a component mounting line 12. Each of the mounting modules 10 includes an operation device 14, a display device (display) 16, and an individual control device. The individual control device is further collectively controlled by a general control device 22. The general control device 22 also includes an operation device 24 and a display device (display) 26. The component mounting line 12 and the overall control device 22 constitute an electronic circuit component mounting system.

  FIG. 2 shows one structural unit of the component mounting line 12. One structural unit is one in which two mounting modules 10 are supported by a common support 28, and the mounting modules 10 are close to each other in the width direction. However, it is supported movably in the front-rear direction by the support base 28, and by being pulled out one by one, an operator can access the inside of each mounting module 10. Each mounting module 10 includes two front and rear board conveyors 32 and 34 supported by the main body frame 30, and a board supporting device that can be individually raised and lowered with respect to each of the board conveyors 32 and 34 is provided. The board holding devices 42 and 44 for fixedly holding the circuit board 46 in cooperation with each part of the board 34 are constituted.

  Each mounting module 10 includes a plurality of tape feeders 48 that are detachably held on the main body frame 30 and supply one type of electronic circuit component (hereinafter, abbreviated as a component), and one from each of the tape feeders 48. And a mounting device 54 for taking out the components and mounting the components on the circuit board 46 held by each of the board holding devices 42 and 44. The mounting device 54 includes a mounting head 56 and a head moving device 58 that moves the mounting head 56 in the X-axis direction (left-right direction) and the Y-axis direction (front-rear direction), as shown in FIG. . As the mounting head 56, 56a and 56b illustrated in FIG. 4 are prepared, and these are selectively attached to the adapter 60 shown in FIG.

  Of the plurality of types of mounting heads 56a and 56b, the configuration of the mounting head 56b shown in FIG. 4B is representatively shown in FIG. The mounting head 56b includes a rotation holder 68 that is rotated by a fixed angle at a time by a holder rotation motor 66. The rotation holder 68 has a plurality of mounting units 70 that can move in the axial direction at intervals of the fixed angle and individually. It is held rotatably. Therefore, each mounting unit 70 can be turned around the rotation axis of the rotation holding body 68 by the rotation of the rotation holding body 68, and can rotate around its own axis. The absolute phase of the mounting unit 70 is controlled by controlling the rotation of the unit rotation motor 72 and the rotation of the holder rotation motor 66. Further, in a state where the plurality of mounting units 70 are at the specific turning positions, the mounting units 70 are moved up and down in the axial direction by the up and down driving members 76 and 77 (see FIGS. 6 and 7) which are moved up and down by the two unit elevating motors 74 and 75, respectively. . At the lower end of each of the plurality of mounting units 70, a suction nozzle 80 is detachably held, and each suction nozzle 80 is moved up and down as the mounting unit 70 moves up and down. The components are held by suction from the tape feeder 48 and a bulk feeder 90 (see FIGS. 7 and 8) as a head-side feeder to be described later, and are mounted on the circuit board 46 held by the board holding devices 42 and 44. The rotation holder 68 and the motors 66, 72, 74, 75, etc. are held by the head body 82 shown in FIG. 5, and are simultaneously attached and detached by attaching and detaching the head body 82 to and from the adapter 60 (see FIG. 3).

The mounting module 10 can be considered as being divided into the mounting head 56 side and the mounting machine main body side to which the mounting head 56 is attached and detached. The mounting machine main body side is supported by the main body frame 30 of the mounting module 10 and the main body frame 30. And the substrate conveyors 32 and 34, the substrate holding devices 42 and 44, the tape feeder 48, the head moving device 58, and the like. Since the electric control device of the mounting module 10 is installed in the support 28, it is appropriate to consider the portion of the support 28 that houses the electric control device to be the mounting machine body side.
The holding and release of components by the suction nozzle 80 are controlled by a negative pressure supply device and a positive pressure supply device (not shown) provided on the mounting machine main body side, and shown in FIGS. 6 and 7 provided on the mounting head 56. The control is performed by the pressure switching units 84 and 85 shown in FIG. The pressure switching units 84 and 85 hold and release parts by selectively supplying a negative pressure and a positive pressure to the suction nozzle 80 and opening the suction nozzle 80 to the atmosphere by moving the valve spool 86 in the axial direction. Control.

  The plurality of tape feeders 48 supply the components held by the component holding tape one by one, and the bulk feeder 90 transfers the components stored in the component storage chamber 92 shown in FIG. , And are supplied from the component supply section 96 at the end of the guide passage 94 in a line. The component supply sections 96 of the plurality of bulk feeders 90 are arranged in the Y-axis direction, and the component supply sections 96 are selectively moved one by one by moving the bulk feeder 90 in the Y-axis direction by the feeder moving device 98. Is moved to a position facing the mounting unit 70.

  As a result, as shown in FIG. 9, the mounting head 56 corresponds to the bulk component receiving position as the second type component receiving position corresponding to the component supply section 96 of the bulk feeder 90 and the tip end of the tape feeder 48. Although a tape component receiving position is provided as a first type component receiving position, the tape component receiving position is also a component mounting position common to the tape component and the bulk component. The mounting head 56b has a component imaging position between the bulk component receiving position and the tape component receiving position (component mounting position). As shown in FIG. 8, the mounting head 56b is configured such that the distance from the substrate holding devices 42 and 44 is changed by the cam 100 as the suction nozzle 80 is turned. As shown in FIG. 4B, a component imaging device 110 is provided at the maximum position of the distance farthest from the components 42 and 44. The component imaging device 110 includes a CCD camera 112 as an imaging device and a light guide device 114. In the present embodiment, the minimum distance stop position is the component mounting position where the electronic circuit component is mounted on the circuit board, and the component is positioned in the rotation direction of the rotation holder 68 during mounting (the direction indicated by the arrow in FIG. 9). The maximum stop position located downstream from the mounting position and closest to the component mounting position is defined as the bulk component receiving position, and the stop position 180 ° away from the component mounting position on the downstream side is defined as the component imaging position. ing.

  As shown in FIGS. 6 and 7, lifting devices 120 and 122 are provided at positions corresponding to the component mounting position (the first type component receiving position) and the second type component receiving position of the head main body 82, respectively. The unit 70 is moved back and forth in the axial direction with respect to the rotating body holder 68 and moved up and down. As shown in FIG. 6, the elevating device 120 includes an elevating drive member 76 that is raised and lowered by the unit elevating motor 74. The circuit board holding the mounting unit 70 by the substrate holding devices 42 and 44 at the component mounting position. It is lowered toward 46 or the component supply section of the tape feeder 48. As shown in FIG. 7, the lifting device 122 includes a lifting drive member 77 that is raised and lowered by the unit lifting motor 75, and lowers the mounting unit 70 toward the component supply unit 96 of the bulk feeder 90. The above-mentioned pressure switching units 84 and 85 are provided corresponding to these elevating devices 120 and 122, and selectively supply negative pressure and positive pressure to the suction nozzle 80 in accordance with elevating the mounting unit 70. The suction nozzle 80 is opened to the atmosphere, and the holding and release of the components are controlled.

  The operations of the holder rotating motor 66, the unit rotating motor 72, the unit elevating motors 74 and 75, the pressure switching units 84 and 85, and the like are controlled by the individual control device 130 of each mounting module 10 shown in FIG. The individual control device 130 includes a head-side control unit 132 and a main-unit-side control unit 134. The head-side control unit 132 transmits and receives information and instructions in the communication unit 136 by communicating with the communication unit 138 of the main-unit-side control unit 134. At the same time, power is supplied from the main body side control unit 134 to the head side control unit 132 via a power supply line (not shown). The main body side control unit 134 can further exchange information and commands with the general control device 22 via the communication unit 138 and the communication unit 140 itself. In FIG. 10, the configuration of the main body-side control unit 134 shows only those parts necessary for describing the claimable invention.

  As described above, each mounting module 10 can mount components supplied from either the tape feeder 48 or the bulk feeder 90 on the circuit board 46. There are different circumstances. For this reason, in the present embodiment, as shown in FIG. 11, the first type component 150 supplied from the tape feeder 48 indicated by a square and the second component supplied from the bulk feeder 90 indicated by a circle are provided on one circuit board 46. When it is necessary to mix the seed components 152 with each other, the difference in the circumstances of the two feeders 48 and 90 is considered from the viewpoint of improving the efficiency of the mounting operation. Hereinafter, this point will be described.

FIG. 12 shows a first type of component (tape) using a plurality of suction nozzles 80 (mounting unit 70) that are sequentially turned to a plurality of positions shown in FIG. 9 is a flowchart illustrating a parts receiving order determination routine for determining the receiving order of the parts) 150 and the second type parts (bulk parts) 152. This component receiving order determination routine can be executed in any mounting module 10, but is executed by the overall control device 22 in the present embodiment. Therefore, the integrated control device 22 is provided with an electronic circuit board data storage unit 160 and a component receiving order determination unit 162 as shown in FIG. The electronic circuit board data storage unit 160 stores the types of the first type component 150 and the second type component 152 (hereinafter, abbreviated as components 150 and 152 unless otherwise required) to be mounted by the component mounting line 12 and respective types. The component receiving order determination unit 162 stores electronic circuit board data including the coordinates of the mounting position and the mounting posture (rotational position). The component receiving order determining unit 162 determines the component receiving order shown in FIG. This is the part that executes the decision routine. On the basis of the electronic circuit board data stored in the electronic circuit board data storage unit 160, components 150 and 152 to be mounted by each mounting module 10 are determined, and the determined components 150 and 152 in each mounting module 10 are determined. The receiving order is determined.
The electronic circuit board data is transmitted from a host computer, which manages information necessary for the operation of the entire factory including the mounting line 12 to the communication unit, by controlling the operation device 24 while the operator looks at the display on the display device 26. The electronic circuit board data is stored in the electronic circuit board data storage unit 160 via 140. In addition, the components 150 and 152 to be mounted by each mounting module 10 are determined in principle so that all the suction nozzles 80 held by the rotation holder 68 of one mounting module 10 need to be the same. Done in This is because the work efficiency becomes higher.

  In the part receiving sequence determination routine, in step 1 (abbreviated as S1; the same applies to other steps), the electronic circuit board data stored in the electronic circuit board data storage unit 160 is allocated to each mounting module 10. Is read. Subsequently, in S2, after all the electronic circuit components included in the read electronic circuit board data are sorted into the first type component 150 and the second type component 152, S3 and S4 are repeatedly executed to execute the first type component. The receiving order of the seed parts 150 is determined. At this time, in the present embodiment, the order is determined so that the same first type component 150 supplied from the same tape feeder 48 is received as continuously as possible. In order to perform the mounting operation efficiently, it is desirable that the sum of the moving distances of the mounting head 56b is as short as possible. Therefore, the sum of the moving distance for receiving the component and the moving distance for mounting the component is required. Although it is particularly desirable to shorten the length, the program becomes complicated. In many cases, the order of receiving the one-part parts 150 is determined, and the former is adopted in the present embodiment.

  After determining the receiving order of the first type components 150, S5 and S6 are repeatedly executed, and the receiving order of the second type components 152 is determined. Since the bulk feeder 90 that supplies the second type component 152 moves together with the mounting head 56a, the rotation of the rotation holder 68 by one pitch (the angle between the adjacent mounting units 70) and the bulk by the feeder moving device 98 are performed at the time of receiving the component. In many cases, only the movement of the feeder 90 is necessary, and the time required for these operations is often shorter than the time required for moving the mounting head 56b during component mounting. Therefore, in the present embodiment, the receiving order of the second type components 152 is determined so that the second type components 152 are received in order from those mounted on the circuit board 46 at positions close to each other. However, in consideration of the situation at the time of receiving the parts, the receiving order of the second-type parts 152 is determined so that the number of times of movement of the bulk feeder 90 by the feeder moving device 98 is reduced as much as possible. It is also possible.

  The receiving order data of the components 150 and 152 determined as described above is stored in the component receiving order memory in S7, and the arrangement of the tape feeder 48 on the main frame 30 is determined in S8. This arrangement is based on the electronic circuit board data read in S1 and the data of the receiving order of the first type components 150 determined in S3 and S4, and the mounting head for receiving all the first type components 150 The sum of the movement distances of 56b is determined to be as short as possible, and is stored in the tape feeder arrangement memory. The data of the tape feeder arrangement memory is displayed on the display device 16 of each mounting module 10, and the operator arranges the tape feeder 48 according to the display.

  Next, the mounting operation of the components 150 and 152 will be described based on the flowcharts shown in FIGS. First, S11 to S14 of the component mounting routine shown in FIG. 13 are repeatedly executed, and the first-type component 150 is placed one by one in the receiving order memory from the component receiving order memory while the rotation holder 68 is rotated by one pitch. Is read, and the read first-class component 150 is received by the suction nozzle 80. In parallel with this receiving operation, a suction error detection routine shown in FIG. 14 is executed. That is, S41 and S42 are repeatedly executed, and among the suction nozzles 80 that reach the component imaging position illustrated in FIG. 9, the suction nozzles that are scheduled to hold the components 150 and 152 but do not hold the components or the components 150 and 152 are not held. It is determined whether or not there is something that is held but has an abnormal holding posture. The latter determination is made based on whether or not the images of the components 150 and 152 captured by the component imaging device 110 differ from the planned component images by a set ratio or more. The determination is also YES when the picked-up components 150 and 152 are different from the expected ones. If the determination in S41 is YES, in S44, the components 150 and 152 that need to be re-received are stored in the re-reception required component memory, and if the determination in S42 is YES, the components 150 and 152 to be discarded in S43 are required to be discarded. After being stored in the parts memory, it is stored in the required re-receiving parts memory in S44.

  During the execution of the component mounting routine, if the scheduled reception of all of the first type components is completed and the determination of S13 is YES, the process from S21 is executed, but the reception of all the first type components is completed. If the suction nozzle 80 that has reached the first-type component receiving position is no longer an empty suction nozzle (becomes a suction nozzle holding a component) and the determination in S13 or S14 is NO, mounting is performed. The head 56b is moved above the substrate holding devices 42 and 44, and thereafter, steps S16 to S18 are repeatedly executed, and the first type components 150 held by the suction nozzle 80 are sequentially mounted one by one. However, at this time, with respect to the suction nozzle 80 that has reached the component mounting position in FIG. 9, the mounting operation is not performed on the suction nozzle 80 in which the suction error of no suction component or the suction posture abnormality is detected in the suction error detection routine. . The same applies to the mounting operation in other steps. When the mounting operation of the first type components 150 held by all the suction nozzles 80 of the mounting head 56b is completed and the determination in S18 is YES, in S19, it is determined that the discard operation is required by executing the above S43. It is determined whether there is a first-class component 150, and if so, S20 is performed, and the discard operation is performed for all of the suction nozzles 80 that are determined to require the discard operation. The discard of the first type component 150 is performed while the mounting head 56b completes the mounting of the held first type component 150 and moves toward receiving the next first type component 150. After the discard operation or when the determination in S19 is NO, the execution of the component mounting routine returns to S11, and the reception and mounting of the first type component 150 are continued.

  If the determination in S13 is YES, S21 to S26 are repeatedly performed, and the mounting of the first type component 150 and the receiving of the second type component 152 are performed in parallel. First, in S21, it is determined whether or not the component (the first type component 150 at this time) held by the suction nozzle 80 has reached the component mounting position in FIG. 9, but this determination is initially NO. , S23, it is determined whether or not the empty nozzle has reached the second type component receiving position. If the determination is YES, one type 2 component 12 is held in S24, but the empty suction nozzle located at the component mounting position (type 1 component receiving position) is moved to the type 2 component receiving position. Is not determined until YES, and it is determined in S25 whether or not the scheduled reception of the second type component 152 has been completed. At first, of course, this determination is NO, so that the rotation holding body 68 is rotated by one pitch in S26, and S21 and the subsequent steps are executed again. If the determination in S21 is YES during the repetition of the above execution, one component is mounted in S22. If the determination in S23 is YES, one second-type component 152 is held in S24. The mounting of the components in S22 and the holding of the second type component 152 in S24 each require time. However, the YES determinations in S21 and S23 only trigger the start of execution of S22 and S24, and the execution of S22 and S24. Since the next determination is not performed waiting for the end, after both the determinations of S21 and S23 become YES, the mounting operation in S22 and the holding operation in S24 are performed substantially in parallel. Become. While the first type component 150 is reached at the component mounting position, the mounting of the first type component 150 and the holding of the second type component 152 are performed in parallel, but it is difficult to reach the component mounting position. When the second type component 152 is reached, the receiving and mounting of the second type component 152 are performed in parallel.

  Eventually, if the reception of the scheduled second type component 152 is completed and the determination in S25 is YES, the execution of the component mounting routine proceeds to S27. By executing S27 and S28, one component 150, 152 (in most cases, the second component 152, but when the number of second components 152 to be mounted is small, the first component 150) Is carried out, and the presence or absence of the first-time re-reception required second type component 152 is determined in S29. In S44 of the suction error detection routine, it is determined whether or not each of the second type components 152 has been stored first. The re-reception required component memory also stores components that need to be re-received after the second time for each of the components 150 and 152. However, as will be described later, the re-reception is not performed after the second time, and Since the reacquisition of the first type component 150 is performed separately, it is determined whether or not there is a second type component that first needs to be rereceived. If the determination in S29 is YES, the second type component 152 is re-received in S30.

  Subsequently, in S31, it is determined whether or not the mounting of all the components 150, 152 held in the mounting head 56b is completed. However, the initial determination is, of course, NO, and S27 and subsequent steps are repeatedly executed. Eventually, the determination in S31 becomes YES, and in S32, the suction nozzle 80 is held in an abnormal posture, and in S43 of the suction error detection routine described above, it is determined whether there is any of the components 150 and 152 stored as the necessary disposal components, If the determination is YES, all the discarded components are discarded in S33. In many cases, the second type component 152 is discarded, but the first type component 150 may also be discarded. Thereafter, in S34, it is determined whether or not there is the first-type component 150 stored as the re-necessary component in S44 of the suction error detection routine. If the determination is YES, all the re-need to be re-received are determined in S35, 36. Re-receiving and mounting of the first kind component are performed. As described above, the re-receiving of the second type component 152 is performed in parallel with the mounting of the components 150 and 152, whereas the re-receiving of the first type component 150 is performed by the board holding device 42 of the mounting head 56b. In order to reduce the number of movements between the tape feeder 44 and the tape feeder 48 as much as possible, they are collectively executed at the end.

  After the re-receiving and mounting of the first type component 150, or if the determination in S34 is NO, S37 and S38 are executed. It is determined whether or not any of the components 150 and 152 is stored in the memory requiring re-reception as a component that needs to be re-received for the second and subsequent times. Is displayed on the display device 16. It is not a coincidence that the re-receipt of the same part 150, 152 is required again, even though the re-receipt of any one of the parts 150, 152 has been executed once, and some trouble has occurred, and the operator has Is likely to need to be investigated, the fact that the cause should be investigated is displayed on the display device 16. This display is performed together with or instead of the display of the mounting module 10 on the display device 16 while clearly indicating which mounting module 10 is displayed on the display device 26 of the overall control device 22. Is also possible.

  In the above description, the description has been omitted in order to avoid complexity. However, each time the rotation holder 68 is rotated by one pitch in S12, 17, 26, 27, etc., the suction nozzle 80 and the components held thereon are rotated. The turning positions of 150 and 152 change by one pitch. The individual control device 130 of each mounting module 10 has a portion storing the change of the turning position, and the determination in each step in the component mounting routine is executed based on the stored data of this portion.

  In the embodiment described above, the disposal of the components 150 and 152 is performed in S32 and S33 after the mounting of the components 150 and 152 is completed. This is because it is necessary to move the mounting head 56b to the component disposal position in order to discard the component, and to prevent the efficiency of the mounting operation from being reduced by the time required for the movement. The suction nozzle 80 holding the component 150.152 cannot be used to hold another component. Further, the components 150 and 152 held in an abnormal posture may fall on the way. In order to avoid these disadvantages, it is also possible to dispose of the parts 150 and 152 during the repeated receiving and mounting of the parts. For example, when the number of suction nozzles holding components in an abnormal posture is equal to or more than a set number (plurality), or after the suction nozzle 80 holds the components 150 and 152 in an abnormal posture, the rotation holding body 68 The discard operation is executed when the disc is rotated by more than a set amount (set rotation angle).

  Further, the above description has been made on the assumption that all the suction nozzles 80 held by the rotation holding body 68 are the same. In this embodiment, the mounting line 12 includes a plurality of mounting modules 10, and as described above, the determination of the components 150 and 152 to be mounted by one mounting module 10 is basically performed by one mounting module 10. This is because the plurality of suction nozzles 80 held by the rotary holding body 68 of the module 10 are all required to be the same, but there are cases where the mounting module 10 does not satisfy this premise. Further, when the mounting operation on one circuit board 46 is performed only by one electronic circuit component mounter, a plurality of types of suction nozzles 80 are often attached. The present invention is also applicable to such a case. However, in this case, in a mounting head that holds a plurality of suction nozzles 80, such as the mounting head 56b, for example, the first type component 150 to be received is still present, and there are empty suction nozzles 80. Since the empty suction nozzle 80 that has moved to the component receiving position is not suitable for the first type component 150 to be received next, there may be a case where the receiving cannot be performed. In this case, the empty suction nozzle 80 is left empty, and the next component to be received next is received by another suction nozzle 80, or the empty suction nozzle 80 receives another component of the first type whose reception order is later. The receiving order can be changed so that the component 150 is received, or the empty suction nozzle 80 can receive the second type component 152. It is also possible to start mounting components already held while the empty suction nozzle 80 remains empty.

As in the above embodiment, if the mounting of the first type component 150 is performed first, the receiving of the first type component 150, which requires a relatively long time, and the loading of the circuit board 46 into the mounting module 10 can be performed. It is possible and desirable to do so in parallel. This feature is characterized in that "the component receiving order is determined so that the number of movements of the mounting head 56b between the board holding devices 42 and 44 and the feeder main body side feeder such as the tape feeder 48 becomes as small as possible". Can be adopted separately.
However, if the mounting of the first type component 150 and the mounting of the second type component 152 are performed at the same time, the mounting head 56b can be moved between the substrate holding devices 42 and 44 and the tape feeder 48 as the main body side feeder. It is desirable to reduce the number of times of movement, and from that viewpoint, the mounting of the second type component 152 may be performed first.
When the mounting of the second type component 152 is performed before the mounting of the first type component 150, a part of the plurality of suction nozzles 80 of the rotation holding body 68 is started at the time of starting the mounting of the first type component 150. The object may already hold the second type component 152, and in that state, the number of the first type components 150 that can be received becomes smaller than the total number of the suction nozzles 80 of the rotary holder 68. There is a possibility that the number of movements to the tape feeder 48 will increase. However, such a situation can be avoided if the rotation holder 68 is moved toward the group of tape feeders 48 to receive the first type components 150 after the completion of mounting the already held second type components. .

Further, the receiving order of the first type component 150 and the second type component 152 is not limited to the above-described embodiment, and the board holding device 42 of the head main body 82 (mounting head 56b) by the head moving device 58, The receiving order of the first type component 150 and the second type component 152 may be determined so that the number of movements between the type 44 and the tape feeder 48 is reduced as much as possible.
For example, taking as an example a case where the number of suction nozzles 80 of the mounting head 56b is 12, the number of mounted type 1 components 150 is 25, and the number of mounted type 2 components 152 is 10, (1) type 1 In the case of receiving 12 parts → mounting → receiving 12 type 1 components → mounting → receiving 1 type 1 component → mounting → receiving 10 type 2 components → mounting, and (2) receiving 12 type 1 components → The order of receiving 1 type 1 component → mounting → receiving 10 type 2 components → mounting → receiving 12 type 1 components → mounting The order of receiving type 1 and type 2 components is different However, the number of movements of the mounting head 56b for receiving the first type component 150 is the same. Also, as shown in (3) Receiving 8 type 1 components → mounting → receiving 8 type 1 components → mounting → receiving 9 type 1 components → mounting → receiving 10 type 2 components → mounting Even if the number of seed parts 150 received is not the same as the number of suction nozzles 80, the number of movements of the mounting head 56b is the same, or (4) eight first kind parts are received → mounting and three second kind parts Receiving → Mounting → Receiving 8 type 1 parts → Mounting and receiving 3 type 2 parts → Mounting → Receiving 9 type 1 parts → Mounting and receiving 4 type 2 parts → Type 1 If the second type component 152 is received during the mounting of the component 150, the number of movements of the mounting head 56b is the same even if the second type component 152 is not collectively received. There is no significant difference in time.
Rather, for example, in the case of the above (4), if the second type component is received together with the first type component whose mounting position is close to the mounting position of the second type component, the efficiency of the mounting operation is improved. The effect of improving is obtained.

Further, in the above-described embodiment, the plurality of bulk feeders 90 are moved by the feeder moving device 98 so that their component supply units 96 can be selectively moved to the common first type component receiving position. However, for example, as described in Japanese Patent Application No. 2011-206452, a plurality of bulk feeders are arranged such that each of their component supply units corresponds to each of a plurality of turning positions of the suction nozzle 80. It is also possible to adopt a mode fixed to the main body.
Further, in the above-described embodiment, the mounting head including the plurality of suction nozzles 80 has the rotation holding body 68. However, for example, the plurality of suction nozzles are held along a straight line, and An electronic circuit component mounter equipped with a non-rotating type mounting head, such as one that causes selected components to receive and mount components, or an electronic circuit component mounting system including such an electronic circuit component mounter, or The present invention is also applicable to an electronic circuit component mounting method using a mounting machine or a mounting system.

  10: Mounting module 12: Component mounting line 22: Overall control device 42, 44: Board holding device 46: Circuit board 48: Tape feeder (main body side feeder) 54: Mounting device 56: Mounting head (56a, 56b) 68: Rotation Holder 70: Mounting unit 80: Suction nozzle 90: Bulk feeder (head-side feeder) 110: Component imaging device 130: Individual control device 150: First type component 152: Second type component 160: Electronic circuit board data storage unit 162 ： Part receiving order determination unit

Claims (4)

(a) a mounting machine body, (b) held by the mounting machine body, and a circuit board transport holding device that transports and fixes and holds the circuit board, and (c) held by the mounting machine body, One or more mounter body-side feeders for supplying a first-class electronic circuit component; and (d) a head moving device for the mounter body, the circuit base material transport and holding device and the mounter body-side feeder. (E) one or more head-side feeders which are held by the head body and supply the second type electronic circuit components, and (f) A plurality of component holders held by the head body, the first type electronic circuit components from the mounting machine main body side feeder and the second type electronic circuit components from the head side feeder by the plurality of component holders; Each and receive and hold the circuit substrate An electronic circuit component mounter including a mounting device for mounting on a circuit substrate held by a device, the first type electronic circuit component for one circuit substrate held by the circuit substrate transport / holding device. And an electronic circuit component mounting method for mounting both the second type electronic circuit component, and
A first type component receiving step during loading of the substrate, wherein the electronic circuit component mounting method performs at least a part of receiving the first type electronic circuit component in parallel with the loading of the circuit substrate by the circuit substrate transport / holding device; And a mounting / receiving parallel execution step of starting to receive the second type electronic circuit component before the mounting of the first type electronic circuit component held by the plurality of component holders is completed. Electronic circuit component mounting method. (a) a mounting machine body, (b) held by the mounting machine body, and a circuit board transport holding device that transports and fixes and holds the circuit board, and (c) held by the mounting machine body, One or more mounter body-side feeders for supplying a first-class electronic circuit component; and (d) a head moving device for the mounter body, the circuit base material transport and holding device and the mounter body-side feeder. (E) one or more head-side feeders which are held by the head body and supply the second type electronic circuit components, and (f) A plurality of component holders held by the head body, the first type electronic circuit components from the mounting machine main body side feeder and the second type electronic circuit components from the head side feeder by the plurality of component holders; Each and receive and hold the circuit substrate An electronic circuit component mounter including a mounting device for mounting on a circuit substrate held by a device, the first type electronic circuit component for one circuit substrate held by the circuit substrate transport / holding device. And an electronic circuit component mounting method for mounting both the second type electronic circuit component, and
A first type component receiving step during loading of the substrate, wherein the electronic circuit component mounting method performs at least a part of receiving the first type electronic circuit component in parallel with the loading of the circuit substrate by the circuit substrate transport / holding device; When at least one of a component exhaustion in the mounting machine main body side feeder and a component receiving error from the mounting machine main body side feeder occurs, at least after the completion of receiving the second type electronic circuit component, the component exhaustion or An electronic circuit component mounting method, comprising: a specific first type component receiving step of receiving a specific first type component that is a first type electronic circuit component in which a component receiving error has occurred. (a) a mounting machine body, (b) held by the mounting machine body, and a circuit board transport holding device that transports and fixes and holds the circuit board, and (c) held by the mounting machine body, One or more mounter body-side feeders for supplying a first-class electronic circuit component; and (d) a head moving device for the mounter body, the circuit base material transport and holding device and the mounter body-side feeder. (E) one or more head-side feeders which are held by the head body and supply the second type electronic circuit components, and (f) A plurality of component holders held by the head body, the first type electronic circuit components from the mounting machine main body side feeder and the second type electronic circuit components from the head side feeder by the plurality of component holders; Each and receive and hold the circuit substrate An electronic circuit component mounter including a mounting device for mounting on a circuit substrate held by a device, the first type electronic circuit component for one circuit substrate held by the circuit substrate transport / holding device. And an electronic circuit component mounting method for mounting both the second type electronic circuit component, and
A first type component receiving step during loading of the substrate, wherein the electronic circuit component mounting method performs at least a part of receiving the first type electronic circuit component in parallel with the loading of the circuit substrate by the circuit substrate transport / holding device; When it is necessary to discard any of the first-type electronic circuit components held by the plurality of component holders, the head body is discarded on the way to receiving the next first-type electronic circuit component. And receiving a first-class component at the time of disposal. (a) a mounting machine body, (b) held by the mounting machine body, and a circuit board transport holding device that transports and fixes and holds the circuit board, and (c) held by the mounting machine body, One or more mounter body-side feeders for supplying a first-class electronic circuit component; and (d) a head moving device for the mounter body, the circuit base material transport and holding device and the mounter body-side feeder. (E) one or more head-side feeders which are held by the head body and supply the second type electronic circuit components, and (f) A plurality of component holders held by the head body, the first type electronic circuit components from the mounting machine main body side feeder and the second type electronic circuit components from the head side feeder by the plurality of component holders; Each and receive and hold the circuit substrate An electronic circuit component mounter including a mounting device for mounting on a circuit substrate held by a device, the first type electronic circuit component for one circuit substrate held by the circuit substrate transport / holding device. And an electronic circuit component mounting method for mounting both the second type electronic circuit component, and
A first type component receiving step during loading of the substrate, wherein the electronic circuit component mounting method performs at least a part of receiving the first type electronic circuit component in parallel with the loading of the circuit substrate by the circuit substrate transport / holding device; And when it becomes necessary to discard any of the second-type electronic circuit components held by the plurality of component holders, the head moving device immediately starts moving the head body to the component discarding position. A second type component receiving step at the time of disposal, in which another one of the plurality of component holders receives the second type electronic circuit component in parallel with the movement. Circuit component mounting method.

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