JP2017135429A - Electronic circuit component mounting method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve a mounting method with an electronic circuit component mounting machine comprising a tape feeder 48 being a mounting machine body-side feeder that is held on a mounting machine body, and a bulk feeder 90 being a head-side feeder that can be moved to an arbitrary position in a movement plane extending across a circuit base material conveyance holding device and the mounting machine body-side feeder.SOLUTION: In parallel with the carry-in of a circuit base material with a circuit base material conveyance holding device, at least part of the reception of a first type component 150 supplied by a tape feeder 48 is performed.SELECTED DRAWING: Figure 13

Description

  In the present invention, one or more mounting machine main body-side feeders that are held by the mounting machine main body and supply the first type electronic circuit components, and are moved to the circuit substrate conveyance holding device and the mounting machine main body side feeder by the head moving device. An electronic circuit component mounting machine including one or more head-side feeders that are held together with a mounting device that mounts electronic circuit components by a plurality of component holders and supplies a second type electronic circuit component to the head body that is The present invention relates to a method for mounting both a first-type electronic circuit component and a second-type electronic circuit component on one circuit substrate, and an electronic circuit component mounting system that implements the method.

Patent Document 1 listed below describes an electronic circuit component mounting machine including a plurality of mounting machine body side feeders 26 and a plurality of bulk feeders 18 as head side feeders, and an electronic circuit component mounting method using the same. Yes.
Further, in Patent Document 2 below, electronic circuit components are taken out from a plurality of tape feeders 4a serving as mounting machine main body side feeders by a plurality of mounting heads 16 having a plurality of suction nozzles 16a and mounted on a substrate W. In the electronic circuit component mounting machine, it is described that the conveyance from the standby position of the substrate W to the mounting work execution position and the mounting preparation by the mounting head 16 are performed in parallel.
According to the electronic circuit component mounting machine and the electronic circuit component mounting method described in Patent Document 1, it is necessary to move the mounting apparatus to the mounting machine body side feeder in order to take out the electronic circuit components from the plurality of bulk feeders 18. Therefore, in the electronic circuit component mounting machine described in the cited document 2, the mounting preparation by the mounting head 16 and the loading of the substrate W are performed in parallel. Can be performed efficiently.

JP 2002-280793 A JP 2008-198778 A

  The present invention has been made with the above situation as a background to further improve the electronic circuit component mounting machine and the electronic circuit component mounting method described in Cited Documents 1 and 2.

In order to solve the above problems, an electronic circuit component mounting method of the present invention includes:
(a) a mounting machine main body, (b) a circuit base material transport and holding device that is held by the mounting machine main body and transports and fixes the circuit base material, and (c) is held by the mounting machine main body, One or more mounting machine body side feeders for supplying the first type electronic circuit components; and (d) a head moving device for the mounting body body, the circuit substrate transport and holding device and the mounting machine body side feeder. And (e) one or more head-side feeders that are held by the head body and supply the second-type electronic circuit components; and (f) A plurality of component holders held by the head main body, the first type electronic circuit components from the mounter main body side feeder and the second type electronic circuit components from the head side feeder by the plurality of component holders. Each receiving and holding said circuit board substrate The first type electronic circuit component with respect to one circuit substrate held by the circuit substrate conveyance holding device by an electronic circuit component mounting machine including a mounting device mounted on the circuit substrate held by the device. And an electronic circuit component mounting method for mounting both the second-type electronic circuit component and
According to a first aspect of the electronic circuit component mounting method, at least a part of the electronic circuit component mounting method receives the first type electronic circuit component in parallel with the circuit base material being carried in by the circuit base material transport and holding device. Including a first type component receiving process during carrying in the base material,
According to a second aspect of the invention, the electronic circuit component mounting method starts receiving the second type electronic circuit component before completing the mounting of the first type electronic circuit component held by the plurality of component holders.・ Including receiving parallel execution process,
According to a third aspect of the present invention, in the electronic circuit component mounting method, at least one of the second type electrons is generated when at least one of a component breakage in the mounting machine main body side feeder and a component receiving error from the mounting machine main body side feeder occurs. Including a specific first type component receiving step of receiving a specific first type component which is a first type electronic circuit component in which the component has run out or a component reception error has occurred after completion of receiving the circuit component,
According to a fourth aspect of the present invention, when the electronic circuit component mounting method requires disposal of any of the first type electronic circuit components held by the plurality of component holders, the head main body is It includes a first-class component receiving process at the time of disposal that disposes on the way to receiving the first-class electronic circuit component,
According to a fifth aspect of the present invention, when the electronic circuit component mounting method requires the disposal of any of the second type electronic circuit components held by the plurality of component holders, The second-type component at the time of disposal which starts the movement of the head body to the component disposal position and causes the other one of the plurality of component holders to receive the second-type electronic circuit component in parallel with the movement. It includes a receiving process.

  According to the above method invention, when both the first type electronic circuit component and the second type electronic circuit component are mounted on one circuit base material, an effect of improving the efficiency of the mounting work can be obtained.

Aspects of the Invention

  In the following, the invention which is recognized as being claimable in the present application (hereinafter referred to as “claimable invention”. The claimable invention is only the “present invention” which is the invention described in the claims). The invention may include subordinate concept inventions or superordinate concept inventions, and may include other concept inventions). As with the claims, each aspect is divided into sections, each section is numbered, and is described in a form that cites the numbers of other sections as necessary. This is for the purpose of facilitating the understanding of the claimable invention, and is not intended to limit the combinations of the constituent elements constituting the claimable invention to those described in the following sections. In other words, the claimable invention should be construed in consideration of the description accompanying each section, the description of the embodiment, the prior art, the common general technical knowledge, and the like. An aspect in which a constituent element is added and an aspect in which the constituent element is deleted from the aspect of each section can be an aspect of the claimable invention.

(1) (a) a mounting machine main body, (b) a circuit base material transport and holding device that is held by the mounting machine main body and transports and holds the circuit base material, and (c) the mounting machine main body. One or more mounting machine body-side feeders that hold and supply the first type electronic circuit component; and (d) the circuit substrate transport holding device and the mounting machine by a head moving device with respect to the mounting machine body. A head main body that can be moved to an arbitrary position in a moving plane straddling the main body side feeder; (e) one or more head side feeders that are held by the head main body and supply the second type electronic circuit component; (f) A plurality of component holders held by the head main body, and the first type electronic circuit components from the mounter main body side feeder and the second type from the head side feeder by the plurality of component holders. Receive each electronic circuit component and carry the circuit board The first type electronic circuit for one circuit substrate held by the circuit substrate transport holding device by an electronic circuit component mounting machine including a mounting device mounted on the circuit substrate held by the holding device. An electronic circuit component mounting method comprising mounting both a component and the second type electronic circuit component.
(2) As the electronic circuit component mounter, the mounting device held by the head main body has the plurality of component holders in a direction crossing the axis of the component holders in addition to the plurality of component holders. A device provided with a holding device moving device to be moved and a holding device advancing / retreating device for advancing and retreating the component holders in a direction parallel to the axis of the component holders was arbitrarily selected from the plurality of component holders. One component holder selectively receives the first type electronic circuit component from the mounter main body side feeder and the second type electronic circuit component from the head side feeder to the circuit base material conveyance holding device. The electronic circuit component mounting method according to item (1), wherein the electronic circuit component is mounted on a held circuit substrate.
(3) including a first-type / second-type component receiving order determining step of determining a receiving order of the first-type electronic circuit components and the second-type electronic circuit components by the plurality of component holders; The electronic circuit component mounting method according to (2).
(4) The electronic circuit component mounting method according to (3), wherein the first type / second type component receiving order determination step is executed by a computer.
(5) The first type / second type component receiving order determination step is performed on the information on the type and number of the first type electronic circuit components and the second type electronic circuit components to be mounted on the one circuit substrate. The electronic circuit component mounting method according to (3) or (4), which is executed based on the above.
(6) The first-type / second-type component receiving order determination step includes information on mounting positions of the first-type electronic circuit component and the second-type electronic circuit component on the one circuit base, and the plurality of the plurality of types The electronic circuit component mounting method according to any one of (3) to (5), wherein the electronic circuit component mounting method is executed based on at least one of placement information on the mounting machine body of the mounting machine body side feeder.
(7) In the first-type / second-type component receiving order determination step, the number of times of movement of the head main body between the circuit base material conveyance holding device and the mounting machine main body side feeder by the head moving device is possible. (3) to (6), further including a head body movement frequency minimizing step for determining a receiving order of the first type electronic circuit component and the second type electronic circuit component so that the number of the first type electronic circuit component and the second type electronic circuit component is received. The electronic circuit component mounting method according to any one of the above items.
During the operation of the electronic circuit component mounting machine for mounting the first type and the second type electronic circuit components on the circuit base material, particularly the time-consuming operation is performed between the mounting machine main body side feeder and the circuit base material conveyance holding device. It is the movement of the mounting apparatus between the two. Therefore, if the number of times of movement is minimized, the time required for the mounting operation can be minimized, and the work efficiency can be improved.
(8) The first type / second type component receiving order determination step determines the first type electronic circuit component reception and the second type electronic circuit component reception in a collective manner. The electronic circuit component mounting method according to any one of items (3) to (7), including a second type component intensive reception order determination step.
(9) A first type in which the first and second type component intensive receiving order determination step determines that the first type electronic circuit component is received before the second type electronic circuit component is received. The electronic circuit component mounting method according to item (8), including a component reception advance determination step.
(10) including a first-type component receiving step during carrying-in of the base material in which at least a part of the reception of the first type electronic circuit component is performed in parallel with the loading of the circuit base material by the circuit base material transport and holding device (1) Item 9. The electronic circuit component mounting method according to any one of Items (9) to (9).
(11) A mounting / receiving parallel execution step of starting the reception of the second type electronic circuit component before the completion of mounting of the first type electronic circuit component held by the plurality of component holders is provided. Or the electronic circuit component mounting method according to any one of (10).
(12) When at least one of a component breakage in the mounting machine main body side feeder and a component receiving error from the mounting machine main body side feeder occurs, at least after completion of receiving the second type electronic circuit component, The electronic circuit component according to any one of (1) to (11), including a specific first type component receiving step of receiving a specific first type component that is a first type electronic circuit component in which a component receiving error has occurred. Implementation method.
In order to receive the specific type 1 component, it is necessary to move the head body between the circuit base material conveyance holding device and the mounting machine body side feeder, but this number of times should be as small as possible. Is desirable. The number of specific first type components is usually small, and a mounting device having a plurality of component holders usually requires only one movement. In particular, when the number of component holders is large, in many cases, a plurality of empty component holders that have not yet held the components remain in the state where the reception of the second type components is completed. It is possible to immediately start to receive the specific first-type component as soon as the reception is completed. However, it is possible to receive and mount the second type component in parallel, but if the head body starts to move toward the mounter body side feeder, the second type component is mounted. It can't be done. Even if the head body starts to move toward the mounting machine body-side feeder after completion of receiving the second type parts, it does not differ in work efficiency even if it starts to move after completion of mounting the second type parts. If the mounting of the second type component is completed, since all the component holders of the mounting apparatus are in an empty state, even if the number of the specific first type components is large, Even when the number of component holders of the mounting apparatus is relatively small, the movement to the mounting machine main body side feeder for receiving the specific first type component is usually performed only once. Accordingly, it is desirable that the movement of the head main body for receiving the specific first type component is started after the second type component mounting is completed.
(13) When any one of the first type electronic circuit components held by the plurality of component holders needs to be discarded, the head body is on the way to receiving the next first type electronic circuit component. The electronic circuit component mounting method according to any one of items (1) to (12), which includes a first-class component receiving step at the time of disposal for discarding in step (1).
(14) When any one of the second-type electronic circuit components held by the plurality of component holders needs to be discarded, the head moving device immediately moves the head body to the component disposal position. (1) to (13) including a second-class component receiving step at the time of disposal which starts and receives another second-class electronic circuit component in another one of the plurality of component holders in parallel with the movement. The electronic circuit component mounting method according to any one of the above items.
(21) (a) a mounting machine main body, (b) a circuit base material transport and holding device that is held by the mounting machine main body and transports and fixes the circuit base material, and (c) the mounting machine main body. One or more mounting machine body-side feeders that hold and supply the first type electronic circuit component; and (d) the circuit substrate transport holding device and the mounting machine by a head moving device with respect to the mounting machine body. A head main body that can be moved to an arbitrary position in a moving plane straddling the main body side feeder; (e) one or more head side feeders that are held by the head main body and supply the second type electronic circuit component; (f) A plurality of component holders held by the head main body, and the first type electronic circuit components from the mounter main body side feeder and the second type from the head side feeder by the plurality of component holders. Each of the electronic circuit components is received by the circuit base material A mounting device mounted on a circuit base material held by a feeding and holding device; and (g) a control device for controlling the circuit base material transport and holding device, a mounting machine main body side feeder, a head moving device, a head side feeder, and a mounting device; An electronic circuit component mounting machine including:
When it is necessary to mount both the first type electronic circuit component and the second type electronic circuit component on one circuit base material held by the circuit base material transport and holding device, the first type is used. An electronic circuit component mounting system comprising: a component receiving order determining device that determines a receiving order of a seed electronic circuit component and a second type electronic circuit component by the plurality of component holders.
When it is necessary to mount both the first type electronic circuit component and the second type electronic circuit component on one circuit substrate, consider the characteristics of the mounter body side feeder and the head side feeder. However, it is necessary to determine the order of receiving by a plurality of component holders so as to improve the efficiency of the mounting work. However, if the determination rule for this is stored in the component receiving order determination device, the order of reception is automatically determined. Therefore, the efficiency of the mounting work can be easily improved.
(22) The mounting apparatus further includes:
A holder / head-side feeder relative movement device that relatively moves the plurality of component holders and the head-side feeder in a direction intersecting the axis of the component holders;
A retainer advance / retreat device for advancing / retreating each of the plurality of component holders in a direction parallel to an axis of the component holders, and the first type and the first type and one selected arbitrarily from the plurality of component holders The electronic circuit component mounting system according to item (21), wherein the second type electronic circuit component can be selectively received and mounted on the circuit base material held by the circuit base material transport and holding device.
(23) The mounting apparatus is
A rotation holding body that is rotatably held around the rotation axis on the head body, and holds each of the plurality of component holders at a plurality of holding positions on a circumference around the rotation axis. A rotating holder,
By rotating the rotating holder around the rotation axis, the plurality of component holders are swiveled around the rotation axis, and any one of the component holders is connected to the component feeder of the head-side feeder. A holding tool swiveling device that selectively moves to a component receiving position that faces each of the component supply portions of the mounting machine main body side feeder, and the rotating holding body and the holding tool swiveling device include the holding tool / head side feeder. The electronic circuit component mounting system according to item (22) constituting the relative movement device.
(24) The component receiving order determining device determines the receiving order of the first type electronic circuit component and the second type electronic circuit component according to the circuit base material conveyance holding device of the head body by the head moving device and the The electronic circuit component mounting according to any one of (21) to (23), including a head main body movement frequency minimizing unit that determines the number of movements between the mounting machine main body side feeder as much as possible system.
(25) First and second type component intensive in which the component receiving order determination device determines that the first type electronic circuit component and the second type electronic circuit component are received together. The electronic circuit component mounting system according to any one of (21) to (24), including a reception determining unit.
(26) A first type component in which the first / second type component intensive reception determination unit determines that the first type electronic circuit component is received before the second type electronic circuit component is received. The electronic circuit component mounting system according to item (25), including a reception advance determination unit.
(27) The control device receives the first-type component during carrying-in of the base material in which at least part of the reception of the first-type electronic circuit component is performed in parallel with the loading of the circuit base material by the circuit base material transport and holding device. The electronic circuit component mounting system according to any one of (21) to (26), including a control unit.
(28) The mounting / receiving parallel execution control unit that starts receiving the second-type electronic circuit component before the control device completes the mounting of the first-type electronic circuit component held by the plurality of component holders. The electronic circuit component mounting system according to any one of (21) to (27).
(29) After the completion of receipt of the second type electronic circuit component when at least one of a component breakage in the mounting machine main body side feeder and a component receiving error from the mounting machine main body side feeder occurs, , Including a specific first type component reception execution control unit for receiving a specific first type component that is a first type electronic circuit component in which the component has run out or a component reception error has occurred. The electronic circuit component mounting system according to any one of the above.
(30) When the control device needs to discard any one of the first type electronic circuit components held by the plurality of component holders, the head main body receives the next first type electronic circuit. The electronic circuit component mounting system according to any one of items (21) to (29), including a first-type component disposal control unit that causes disposal on the way to receipt of the component.
(31) When the control device needs to discard any of the second type electronic circuit components held by the plurality of component holders, the head moving device immediately discards the components in the head main body. A second-type component disposal control unit that starts movement to a position and causes another one of the plurality of component holders to receive the second-type electronic circuit component in parallel with the movement (21 The electronic circuit component mounting system according to any one of items) to (30).
(32) The head-side feeder includes a bulk feeder that houses electronic circuit components in a stacked state in a component housing portion and supplies the electronic circuit components from a component supply portion in a line. The electronic circuit component mounting system according to any one of the above.

It is a perspective view which shows the electronic circuit component mounting system which is one Embodiment of claimable invention. It is a perspective view which removes the ceiling panel of one cover, and shows two mounting modules which are a part of the said electronic circuit component mounting system. It is a perspective view which shows the mounting head and head movement apparatus of the mounting apparatus of the said mounting module. It is a perspective view which shows the said mounting head, (a) is a figure which shows the mounting head provided with one nozzle holder, (b) is a figure which shows the mounting head provided with 12 nozzle holders. It is a perspective view which removes a cover and shows the mounting head provided with 12 said nozzle holders. It is a perspective view which shows the nozzle holder of the mounting head provided with the said 12 nozzle holders, a suction nozzle, a raising / lowering device, a valve switching device, etc. It is a perspective view which shows the nozzle holder of a mounting head provided with the said 12 nozzle holders, a suction nozzle, another raising / lowering apparatus, another valve switching apparatus, etc. FIG. It is a perspective view which shows the mounting head provided with the said 12 nozzle holders from the side in which the bulk feeder was provided. It is a figure which illustrates roughly the stop position of the suction nozzle by rotation of a rotation holding body in the mounting head provided with the said 12 nozzle holders. It is a block diagram which shows roughly the control part of the electronic circuit component mounting system shown in FIG. It is a top view which shows roughly the relative positional relationship of the electronic circuit and tape feeder which should be assembled in one of the said mounting modules. It is a flowchart which shows the component reception order determination routine performed in the integrated control apparatus of the electronic circuit component mounting system shown in FIG. It is a flowchart which shows the principal part of the component mounting routine performed in each of the said mounting module. It is a flowchart which shows a part of said component mounting routine.

Hereinafter, an embodiment of the claimable invention will be described with reference to the drawings. However, the structures of the electronic circuit component mounting system and the mounting module are the same as those described in detail in the specification of Japanese Patent Application No. 2011-206452, and will be described briefly.
As shown in FIG. 1, a mounting module 10 as an example of an electronic circuit component mounting machine includes a plurality of units that constitute a component mounting line 12. Each mounting module 10 includes an operation device 14, a display device (display) 16, and an individual control device. The individual control device is further controlled by the overall control device 22. The overall control device 22 also includes an operation device 24 and a display device (display) 26. The component mounting line 12 and the overall control device 22 constitute an electronic circuit component mounting system.

  FIG. 2 shows one structural unit of the component mounting line 12. In the structural unit, two mounting modules 10 are supported by a common support base 28, and each mounting module 10 is close to each other in the width direction. However, it is supported by the support base 28 so as to be movable in the front-rear direction, and is pulled out forward one by one so that the worker can access the inside of each mounting module 10. Each mounting module 10 includes two front and rear substrate conveyors 32 and 34 supported by the main body frame 30, and a substrate support device that can be moved up and down individually is provided with respect to each substrate conveyor 32 and 34. The substrate holding devices 42 and 44 for holding the circuit board 46 in a fixed manner together with each part 34 are configured.

  Each mounting module 10 includes a plurality of tape feeders 48 that are detachably held on the main body frame 30 and supply one type of electronic circuit components (hereinafter, abbreviated as components), and one from each of the tape feeders 48. And a mounting device 54 for taking out the components and mounting them on the circuit board 46 held by the substrate holding devices 42 and 44. The mounting device 54 includes a mounting head 56 and a head moving device 58 that moves the mounting head 56 in the X-axis direction (left-right direction) and the Y-axis direction (front-back direction), as shown in an enlarged view in FIG. . As the mounting head 56, 56a, 56b and the like illustrated in FIG. 4 are prepared, and these are selectively attached to the adapter 60 shown in FIG.

  Of the plural types of mounting heads 56a and 56b, the configuration of the mounting head 56b shown in FIG. 4B is typically shown in FIG. The mounting head 56b includes a rotation holding body 68 that is rotated by a fixed angle by a holding body rotation motor 66. The rotation holding body 68 has a plurality of mounting units 70 that are movable in the axial direction at intervals of the fixed angle. Is held rotatably. Accordingly, each mounting unit 70 can be rotated about the rotation axis of the rotation holding body 68 by the rotation of the rotation holding body 68 and can rotate about its own axis. The absolute phase of the mounting unit 70 is controlled by the related control between the rotation of the unit rotation motor 72 and the rotation of the holder rotation motor 66. Further, in a state where the plurality of mounting units 70 are in a specific turning position, they are lifted and lowered in the axial direction by lift drive members 76 and 77 (see FIGS. 6 and 7) that are lifted and lowered by the two unit lift motors 74 and 75, respectively. . A suction nozzle 80 is detachably held at the lower end of each of the plurality of mounting units 70, and each suction nozzle 80 is lifted and lowered as each mounting unit 70 is lifted and lowered as the feeder main body side feeder. Components are held and taken out from the tape feeder 48 and a bulk feeder 90 (see FIGS. 7 and 8) as a head-side feeder, which will be described later, and mounted on the circuit board 46 held by the board holding devices 42 and 44. The rotary holding body 68 and the motors 66, 72, 74, 75, etc. are held by the head main body 82 shown in FIG.

The mounting module 10 can be divided into the mounting head 56 side and the mounting machine main body side to which it is attached / detached. The mounting machine main body side is supported by the main body frame 30 of the mounting module 10 and the main body frame 30. The substrate conveyors 32 and 34, the substrate holding devices 42 and 44, the tape feeder 48, the head moving device 58, and the like. The electric control device of the mounting module 10 is installed in the support base 28. Therefore, it is appropriate to consider the portion of the support base 28 containing the electric control device as the mounting machine main body side.
The holding and releasing of the components by the suction nozzle 80 are controlled by a negative pressure supply device and a positive pressure supply device (not shown) provided on the mounting machine main body side, and FIGS. 6 and 7 provided on the mounting head 56. This is performed under the control of the pressure switching units 84 and 85 shown in FIG. The pressure switching units 84 and 85 hold and release parts by selectively supplying negative pressure and positive pressure to the suction nozzle 80 and releasing the suction nozzle 80 to the atmosphere by moving the valve spool 86 in the axial direction. To control.

  The plurality of tape feeders 48 supply the parts held on the part holding tape one by one, and the bulk feeder 90 receives the parts accommodated in the part accommodation chamber 92 shown in FIG. These are supplied from the component supply unit 96 at the tip of the guide passage 94 in a line. The component supply units 96 of the plurality of bulk feeders 90 are arranged in the Y-axis direction, and the component feeders 96 are selectively moved one by one by moving the bulk feeder 90 in the Y-axis direction by the feeder moving device 98. To the position facing the mounting unit 70.

  As a result, the mounting head 56 corresponds to the bulk component receiving position as the second type component receiving position corresponding to the component supply unit 96 of the bulk feeder 90 and the tip of the tape feeder 48, as shown in FIG. A tape component receiving position as a first type component receiving position is provided, and the tape component receiving position is also a component mounting position common to the tape component and the bulk component. The mounting head 56b includes a component imaging position between the bulk component receiving position and the tape component receiving position (component mounting position). As shown in FIG. 8, the mounting head 56 b is configured such that the distance from the substrate holding devices 42 and 44 is changed by the cam 100 as the suction nozzle 80 rotates. As shown in FIG. 4 (b), the component imaging device 110 is provided at the maximum distance position farthest from 42 and 44. The component imaging device 110 includes a CCD camera 112 and a light guide device 114 which are imaging devices. In the present embodiment, the minimum distance stop position is the component mounting position where the electronic circuit component is mounted on the circuit board, and the component in the rotation direction (direction indicated by the arrow in FIG. 9) of the rotation holder 68 at the time of mounting. The distance maximum stop position that is located downstream from the mounting position and is closest to the component mounting position is the bulk component receiving position, and the downstream stop position that is 180 degrees away from the component mounting position is the component imaging position. ing.

  As shown in FIGS. 6 and 7, lifting devices 120 and 122 are provided at positions corresponding to the component mounting position (first type component receiving position) and the second type component receiving position of the head main body 82, respectively. The unit 70 is moved back and forth in the axial direction with respect to the rotating body holding body 68 and moved up and down. As shown in FIG. 6, the elevating device 120 includes an elevating drive member 76 that is moved up and down by the unit elevating motor 74, and a circuit board in which the mounting unit 70 is held by the substrate holding devices 42 and 44 at the component mounting position. It is lowered toward 46 or toward the component feeder of the tape feeder 48. Further, as shown in FIG. 7, the lifting device 122 includes a lifting drive member 77 that is lifted and lowered by the unit lifting motor 75, and lowers the mounting unit 70 toward the component supply unit 96 of the bulk feeder 90. Corresponding to these lifting devices 120 and 122, the aforementioned pressure switching units 84 and 85 are provided, and the negative pressure and the positive pressure are selectively supplied to the suction nozzle 80 in accordance with the lifting and lowering of the mounting unit 70. The suction nozzle 80 is opened to the atmosphere, and the holding and releasing of parts are controlled.

  The operations of the holder rotating motor 66, the unit rotating motor 72, the unit lifting motors 74 and 75, the pressure switching units 84 and 85, and the like are controlled by the individual control device 130 of each mounting module 10 shown in FIG. The individual control device 130 includes a head side control unit 132 and a main body side control unit 134, and the head side control unit 132 exchanges information and commands through communication with the communication unit 138 of the main body side control unit 134 in the communication unit 136. In addition, power is supplied from the main body side control unit 134 to the head side control unit 132 by a power line (not shown). Further, the main body side control unit 134 can exchange information and commands with the overall control device 22 through its own communication unit 138 and communication unit 140. In FIG. 10, the configuration of the main body side control unit 134 shows only the parts necessary for the description of the claimable invention.

  As described above, each mounting module 10 can mount components supplied from either the tape feeder 48 or the bulk feeder 90 on the circuit board 46, but the components can be taken out from the feeders 48 and 90. There are different circumstances. Therefore, in the present embodiment, as shown in FIG. 11, the first type component 150 supplied from the tape feeder 48 indicated by a square mark and the second feeder supplied from the bulk feeder 90 indicated by a circle are provided on one circuit board 46. When the seed component 152 needs to be mixedly mounted, a difference in circumstances between the feeders 48 and 90 is considered from the viewpoint of improving the efficiency of the mounting work. This will be described below.

FIG. 12 shows a first type component (tape) by a plurality of suction nozzles 80 (mounting units 70) that are sequentially rotated to a plurality of positions shown in FIG. FIG. 10 is a flowchart showing a part receiving order determination routine for determining a receiving order of a part) 150 and a second type part [bulk part] 152; The component receiving order determination routine may be executed in any mounting module 10, but is executed by the overall control device 22 in this embodiment. Therefore, the overall control device 22 is provided with an electronic circuit board data storage unit 160 and a component receiving order determination unit 162 as shown in FIG. The electronic circuit board data storage unit 160 includes types of first-type components 150 and second-type components 152 (hereinafter, abbreviated as components 150 and 152 unless otherwise specified) to be mounted by the component mounting line 12 and the respective types. This is a part for storing electronic circuit board data including the coordinates of the mounting position and the mounting posture (rotation position), and the component receiving order determining unit 162 is the component receiving order shown in FIG. 12 for each of the plurality of mounting modules 10. This is the part that executes the decision routine. Based on the electronic circuit board data stored in the electronic circuit board data storage unit 160, the components 150 and 152 to be mounted by each mounting module 10 are determined, and the determined components 150 and 152 in each mounting module 10 are determined. The order of receipt is determined.
The electronic circuit board data is transmitted from the host computer that manages information necessary for the work of the entire factory including the mounting line 12 by the operator controlling the operation device 24 while viewing the display on the display device 26, for example. 140 is stored in the electronic circuit board data storage unit 160. The determination of the components 150 and 152 to be mounted by each mounting module 10 is basically such that the plurality of suction nozzles 80 held by the rotation holding body 68 of one mounting module 10 are all the same. To be done. This is because the work efficiency becomes higher.

  In the component receiving order determination routine, in step 1 (abbreviated as S1. The same applies to other steps), the electronic circuit board data corresponding to each mounting module 10 is allocated from the electronic circuit board data storage unit 160. Is read. Subsequently, in S2, all the electronic circuit components included in the read electronic circuit board data are sorted into the first type component 150 and the second type component 152, and then S3 and S4 are repeatedly executed to execute the first type. The order of receiving the seed parts 150 is determined. At this time, in this embodiment, the order is determined so that the same first type component 150 supplied from the same tape feeder 48 is received as much as possible. In order to efficiently perform the mounting work, it is desirable that the total moving distance of the mounting head 56b is as short as possible. For this reason, the total of the moving distance for receiving the component and the moving distance for mounting the component is calculated as follows. Although it is particularly desirable to shorten the length of the program, the program becomes complicated. In practice, either the total of the moving distance for receiving the component or the total of the moving distance for mounting the component is shortened. In many cases, the receiving order of the one-type component 150 is determined, and the former is adopted in this embodiment.

  After the receiving order of the first type component 150 is determined, S5 and S6 are repeatedly executed to determine the receiving order of the second type component 152. Since the bulk feeder 90 that supplies the second type component 152 moves together with the mounting head 56 a, when receiving the component, the rotation of the rotation holding body 68 by one pitch (the angle between the adjacent mounting units 70) and the bulk by the feeder moving device 98. The movement of the feeder 90 is only necessary, and the time required for these is often shorter than the time required for moving the mounting head 56b during component mounting. Therefore, in the present embodiment, the order of receiving the second-type components 152 is determined so that they are received in order from those mounted on the circuit board 46 at positions close to each other. However, in consideration of the circumstances at the time of receiving the parts, for example, the receiving order of the second type parts 152 is determined so that the number of times of movement of the bulk feeder 90 by the feeder moving device 98 is reduced as much as possible. It is also possible.

  The receiving order data of the parts 150 and 152 determined as described above is stored in the parts receiving order memory in S7, and the arrangement of the tape feeder 48 on the main body frame 30 is determined in S8. This arrangement is based on the electronic circuit board data read in S1 and the receiving order data of the first type components 150 determined in S3 and S4, and the mounting head for receiving all the first type components 150. The total moving distance 56b is determined to be as short as possible and stored in the tape feeder arrangement memory. The data in the tape feeder arrangement memory is displayed on the display device 16 of each mounting module 10, and the operator arranges the tape feeder 48 according to this display.

  Next, the mounting operation of the components 150 and 152 will be described based on the flowcharts shown in FIGS. First, S11 to S14 of the component mounting routine shown in FIG. 13 are repeatedly executed, and the rotation holding body 68 is rotated by one pitch while the first type component 150 is sequentially received from the component reception order memory in the order of reception. Is read, and the read first type component 150 is received by the suction nozzle 80. In parallel with this receiving operation, a suction error detection routine shown in FIG. 14 is executed. That is, S41 and 42 are repeatedly executed, and among the suction nozzles 80 that reach the part imaging position shown in FIG. 9, the parts 150 and 152 that are scheduled to be held but not held, or the parts 150 and 152 are It is determined whether or not there is an object that is held but has an abnormal holding posture. The latter determination is made based on whether or not the images of the components 150 and 152 imaged by the component imaging device 110 differ from the scheduled component image by a set ratio or more, so that not only when the suction posture is abnormal, The determination is also YES when the sucked parts 150 and 152 are different from the scheduled ones. If the determination in S41 is YES, the parts 150 and 152 that require re-reception are stored in the re-receivable parts memory in S44, and if the determination in S42 is YES, the parts 150 and 152 that should be discarded in S43 are discarded. After being stored in the component memory, it is stored in the re-reception required component memory in S44.

  During the execution of the component mounting routine, if all scheduled first-type components are received and the determination in S13 is YES, S21 and subsequent steps are executed, but all first-type components are received. If the suction nozzle 80 that has reached the first type component receiving position is no longer an empty suction nozzle (becomes a suction nozzle that holds a component) and the determinations in S13 and S14 are NO, mounting is performed. The head 56b is moved above the substrate holding devices 42 and 44, and thereafter, S16 to S18 are repeatedly executed, and the first type components 150 held by the suction nozzle 80 are sequentially mounted one by one. However, at this time, with respect to the suction nozzle 80 that has reached the component mounting position in FIG. 9, the mounting operation is not performed for the suction nozzle 80 in which a suction error of no suction component or suction posture abnormality is detected in the suction error detection routine. . The same applies to the mounting operation in other steps. If the mounting operation for the first type component 150 held by all the suction nozzles 80 of the mounting head 56b is completed and the determination in S18 is YES, it is determined in S19 that the disposal operation is required by the execution of S43. It is determined whether or not there is the first type component 150. If there is one, S20 is performed, and the discarding operation is performed for all the suction nozzles 80 that are determined to require the discarding operation. The disposal of the first type component 150 is performed in the middle of the mounting head 56b completing the mounting of all the held first type components 150 and going to receive the next first type component 150. After the discarding operation or when the determination in S19 is NO, the execution of the component mounting routine returns to S11, and the reception and mounting of the first type component 150 is continued.

  If the determination in S13 is YES, S21 to S26 are repeatedly executed, and the first type component 150 is mounted and the second type component 152 is received in parallel. First, in S21, it is determined whether or not the component (first type component 150 at this time) held by the suction nozzle 80 has reached the component mounting position in FIG. 9, but this determination is NO initially. In S23, it is determined whether or not the empty nozzle has reached the second type component receiving position. If the determination is YES, one second-type component 12 is held in S24, but the empty suction nozzle located at the component mounting position (first-type component receiving position) is the second-type component receiving position. Until S2 is reached, the determination in S23 is not YES. In S25, it is determined whether or not the scheduled reception of the second type component 152 is completed. Initially, since this determination is of course NO, the rotation holding body 68 is rotated by one pitch in S26, and S21 and subsequent steps are executed again. If the determination in S21 is YES during the repetition of the above execution, one component is mounted in S22. If the determination in S23 is YES, one second-type component 152 is held in S24. Although it takes time to mount the components in S22 and to hold the second type component 152 in S24, the YES determination in S21 and S23 is only the start of execution of S22 and S24, and the execution of S22 and S24 is performed. Since the next determination is not performed after the end, the mounting operation in S22 and the holding operation in S24 are performed substantially in parallel after both the determinations in S21 and S23 are YES. Become. While it is the first type component 150 that reaches the component mounting position, the mounting of the first type component 150 and the holding of the second type component 152 are performed in parallel, but it is possible to reach the component mounting position. When the second type component 152 is reached, the second type component 152 is received and mounted in parallel thereafter.

  Eventually, if the scheduled reception of the second type component 152 is completed and the determination in S25 is YES, the execution of the component mounting routine proceeds to S27. By executing S27, 28, one component 150, 152 (in many cases, the second type component 152, but when the number of second type components 152 to be mounted is small, it is the first type component 150) In step S29, the presence / absence of the first re-reception required type 2 component 152 is determined. In S <b> 44 of the suction error detection routine, it is determined whether or not there is an initially stored one for each of the second type components 152. The re-reception part memory that is required also stores the parts 150 and 152 that require re-reception after the second time. However, as described later, re-reception after the second time is not executed, and Since the first-type component 150 is re-received separately, it is determined whether or not there is a second-type component that needs to be re-received first. If the determination in S29 is YES, the second-type component 152 is received again in S30.

  Subsequently, in S31, it is determined whether or not the mounting of all the components 150 and 152 held by the mounting head 56b has been completed, but the initial determination is of course NO, and S27 and subsequent steps are repeatedly executed. Eventually, the determination in S31 becomes YES, and in S32, it is determined whether or not there are the parts 150 and 152 that are held in the suction nozzle 80 in an abnormal posture and stored in S43 of the aforementioned suction error detection routine as the parts to be discarded. If the determination is YES, all the parts that need to be discarded are discarded in S33. In many cases, the second type component 152 is discarded, but the first type component 150 may also be discarded. Thereafter, in S34, it is determined whether or not there is the first type component 150 stored as a re-reception required component in S44 of the suction error detection routine. If the determination is YES, all the re-reception required in S35 and 36 is required. Re-acceptance and mounting of one type of component is executed. As described above, the second-type component 152 is re-received in parallel with the mounting of the components 150 and 152, whereas the first-type component 150 is re-received in the substrate holding device 42 of the mounting head 56b. In order to reduce the number of times of movement between the tape feeder 48 and the tape feeder 48 as much as possible, they are collectively executed at the end.

  After re-receiving and mounting the first type component 150, or if the determination in S34 is NO, S37 and 38 are executed. It is determined whether or not any of the components 150 and 152 is stored in the re-reception required component memory as being required to be re-received for the second and subsequent times. Is displayed on the display device 16. The fact that one of the parts 150 and 152 is re-received once but the same parts 150 and 152 need to be received again is not a coincidence. Therefore, it is highly likely that it is necessary to investigate the cause, and the display device 16 displays that the cause should be investigated. This display is performed while clearly indicating which mounting module 10 is displayed on the display device 26 of the overall control device 22 together with or instead of the display of the mounting module 10 on the display device 16. Is also possible.

  In the above description, the description is omitted to avoid complication, but each time the rotation holding body 68 is rotated by one pitch in S12, 17, 26, 27, etc., the suction nozzle 80 and the components held thereby. The turning positions 150 and 152 change by one pitch. The individual control device 130 of each mounting module 10 has a portion that stores the change of the turning position, and determination at each step in the component mounting routine is executed based on the stored data of this portion.

  In the embodiment described above, the discarding of the components 150 and 152 is executed in S32 and 33 after the mounting of the components 150 and 152 is completed. This is because it is necessary to move the mounting head 56b to the component disposal position in order to discard the component, and in order to avoid a decrease in the efficiency of the mounting operation for the time required for the movement, it should be discarded. The suction nozzle 80 holding the part 150.152 cannot be used to hold another part. Further, the parts 150 and 152 held in an abnormal posture may fall in the middle. In order to avoid these disadvantages, it is possible to discard the components in the middle of receiving and mounting the components 150 and 152 repeatedly. For example, when the number of suction nozzles holding a component in an abnormal posture becomes a set number (plural) or more, or after the suction nozzle 80 holds the components 150 and 152 in an abnormal posture, the rotary holding body 68 is For example, when the rotation is greater than the set amount (set rotation angle), the discarding operation is executed.

  The above description has been made on the assumption that all the suction nozzles 80 held by the rotary holding body 68 are the same. In the present embodiment, the mounting line 12 includes a plurality of mounting modules 10, and as described above, the determination of the components 150 and 152 to be mounted by one mounting module 10 is basically one mounting. This is because the plurality of suction nozzles 80 held by the rotation holding body 68 of the module 10 are all the same, but there may be a mounting module 10 where this premise does not apply. In addition, when the mounting operation on one circuit board 46 is performed by only one electronic circuit component mounting machine, a plurality of types of suction nozzles 80 are often attached. Even in such a case, the claimable invention can be applied. However, in that case, in the mounting head that holds a plurality of suction nozzles 80, such as the mounting head 56b, for example, there are still the first type components 150 to be received and there are empty suction nozzles 80, but the first type Since the empty suction nozzle 80 that has moved to the component receiving position is not suitable for the first type component 150 to be received next, there may be a case where it cannot be received. In that case, the empty suction nozzle 80 remains empty, and another suction nozzle 80 is made to receive the next component to be received, or another empty first suction nozzle 80 having a later receiving order. It is possible to change the order of receiving such as receiving the component 150 or to allow the empty suction nozzle 80 to receive the second type component 152. It is also possible to start mounting of already held components while the empty suction nozzle 80 remains empty.

As in the above embodiment, if the first type component 150 is mounted first, the first type component 150 that requires a relatively long time is received and the circuit board 46 is carried into the mounting module 10. It can be done in parallel and is desirable. This feature is that “the component receiving order is determined so that the number of movements between the board holding devices 42 and 44 of the mounting head 56 b and the feeder main body side feeder such as the tape feeder 48 is minimized”. Can also be adopted separately.
However, if the mounting of the first type component 150 and the mounting of the second type component 152 are performed together, the mounting head 56b is placed between the board holding devices 42 and 44 and the tape feeder 48 as the main body side feeder. From this point of view, the second type component 152 may be mounted first.
In addition, when the mounting of the second type component 152 is performed before the mounting of the first type component 150, at the start of the mounting of the first type component 150, a part of the plurality of suction nozzles 80 of the rotation holding body 68 is used. In some cases, the number of the first type parts 150 that can be received is smaller than the total number of the suction nozzles 80 of the rotary holding body 68, so that the rotary holding body The number of movements to the 68 tape feeders 48 may increase. However, such a situation can be avoided if the rotation holding body 68 is moved toward the group of tape feeders 48 to receive the first type component 150 after the mounting of the already held second type component. .

Further, the receiving order of the first type component 150 and the second type component 152 is not limited to that in the above embodiment, and the substrate holding device 42 of the head main body 82 (mounting head 56b) by the head moving device 58, The receiving order of the first type component 150 and the second type component 152 may be determined so that the number of movements between the first type component 150 and the tape feeder 48 is as small as possible.
For example, in the case where the number of suction nozzles 80 of the mounting head 56b is 12, the number of mounted first type components 150 is 25, and the number of mounted second type components 152 is 10, for example, (1) First type Receiving 12 parts → Mounting → Receiving 12 first type parts → Mounting → Receiving 1 type 1 part → Mounting → Receiving 10 type 2 parts → Mounting (2) Receiving 12 type 1 parts → Mounting → Receiving one first-type component → Mounting → Receiving 10 second-class components → Mounting → Receiving 12 first-class components → The order of receiving the first- and second-class components is different in the case of mounting. However, the number of movements of the mounting head 56b for receiving the first type component 150 is the same. In addition, (3) receiving 8 parts of first type → mounting → receiving 8 parts of first type → mounting → receiving 9 parts of first type → mounting → receiving 10 parts of second type → mounting The number of movements of the mounting head 56b is the same even if the number of the seed parts 150 received is not the same as the number of the suction nozzles 80, or (4) receiving eight first-type parts → mounting and three second-type parts Receiving → Mounting → Receiving 8 parts of type 1 → Mounting and receiving 3 parts of type 2 → Mounting → Receiving 9 parts of type 1 → Receiving mounting and 4 parts of type 2 → Mounting If the second type component 152 is received during the mounting of the component 150, the number of movements of the mounting head 56b is the same even if the second type component 152 is not received collectively, and the total amount required for the mounting operation. There is no big difference in time.
Rather, for example, in the case of (4) above, if receiving the second type component is performed together with receiving the first type component whose mounting position is close to the mounting position of the second type component, the efficiency of the mounting work is improved. An improving effect is obtained.

Moreover, in the said embodiment, when the several bulk feeder 90 is moved by the feeder moving apparatus 98, those components supply parts 96 are selectively moved to a common 1st type components receiving position. However, as described in Japanese Patent Application No. 2011-206452, for example, a plurality of bulk feeders are arranged so that their respective component supply units correspond to the plurality of swiveling positions of the suction nozzle 80, respectively. It is also possible to adopt a mode fixed to the main body.
In the above-described embodiment, the mounting head including the plurality of suction nozzles 80 has the rotation holding body 68. For example, the plurality of suction nozzles are held along a straight line, and the suction nozzles Electronic circuit component mounting machine equipped with a non-rotating type mounting head, or an electronic circuit component mounting system including such an electronic circuit component mounting machine, etc. The claimable invention can be applied to an electronic circuit component mounting method using a mounting machine or a mounting system.

  10: Mounting module 12: Component mounting line 22: Overall control device 42, 44: Board holding device 46: Circuit board 48: Tape feeder (main body side feeder) 54: Mounting device 56: Mounting head (56a, 56b) 68: Rotation Holding body 70: Mounting unit 80: Suction nozzle 90: Bulk feeder (head side feeder) 110: Component imaging device 130: Individual control device 150: First type component 152: Second type component 160: Electronic circuit board data storage unit 162 : Parts receipt order determination section

Claims (7)

(a) a mounting machine main body, (b) a circuit base material transport and holding device that is held by the mounting machine main body and transports and fixes the circuit base material, and (c) is held by the mounting machine main body, One or more mounting machine body side feeders for supplying the first type electronic circuit components; and (d) a head moving device for the mounting body body, the circuit substrate transport and holding device and the mounting machine body side feeder. And (e) one or more head-side feeders that are held by the head body and supply the second-type electronic circuit components; and (f) A plurality of component holders held by the head main body, the first type electronic circuit components from the mounter main body side feeder and the second type electronic circuit components from the head side feeder by the plurality of component holders. Each receiving and holding said circuit board substrate The first type electronic circuit component with respect to one circuit substrate held by the circuit substrate conveyance holding device by an electronic circuit component mounting machine including a mounting device mounted on the circuit substrate held by the device. And an electronic circuit component mounting method for mounting both the second-type electronic circuit component and
The electronic circuit component mounting method includes a first-class component receiving step during carrying-in of the base material in which at least a part of the first-type electronic circuit component is received in parallel with the loading of the circuit base material by the circuit base material transport and holding device. An electronic circuit component mounting method comprising: (a) a mounting machine main body, (b) a circuit base material transport and holding device that is held by the mounting machine main body and transports and fixes the circuit base material, and (c) is held by the mounting machine main body, One or more mounting machine body side feeders for supplying the first type electronic circuit components; and (d) a head moving device for the mounting body body, the circuit substrate transport and holding device and the mounting machine body side feeder. And (e) one or more head-side feeders that are held by the head body and supply the second-type electronic circuit components; and (f) A plurality of component holders held by the head main body, the first type electronic circuit components from the mounter main body side feeder and the second type electronic circuit components from the head side feeder by the plurality of component holders. Each receiving and holding said circuit board substrate The first type electronic circuit component with respect to one circuit substrate held by the circuit substrate conveyance holding device by an electronic circuit component mounting machine including a mounting device mounted on the circuit substrate held by the device. And an electronic circuit component mounting method for mounting both the second-type electronic circuit component and
The electronic circuit component mounting method includes a mounting / receiving parallel execution step of starting receiving the second type electronic circuit component before completing the mounting of the first type electronic circuit component held by the plurality of component holders. An electronic circuit component mounting method comprising: (a) a mounting machine main body, (b) a circuit base material transport and holding device that is held by the mounting machine main body and transports and fixes the circuit base material, and (c) is held by the mounting machine main body, One or more mounting machine body side feeders for supplying the first type electronic circuit components; and (d) a head moving device for the mounting body body, the circuit substrate transport and holding device and the mounting machine body side feeder. And (e) one or more head-side feeders that are held by the head body and supply the second-type electronic circuit components; and (f) A plurality of component holders held by the head main body, the first type electronic circuit components from the mounter main body side feeder and the second type electronic circuit components from the head side feeder by the plurality of component holders. Each receiving and holding said circuit board substrate The first type electronic circuit component with respect to one circuit substrate held by the circuit substrate conveyance holding device by an electronic circuit component mounting machine including a mounting device mounted on the circuit substrate held by the device. And an electronic circuit component mounting method for mounting both the second-type electronic circuit component and
In the electronic circuit component mounting method, at least one of the second-type electronic circuit components has been received when at least one of a component breakage in the mounter main body side feeder and a component reception error from the mounter main body side feeder occurs. An electronic circuit component mounting method comprising: a specific first-type component receiving step for receiving a specific first-type component that is a first-type electronic circuit component in which the component has run out or a component reception error has occurred. (a) a mounting machine main body, (b) a circuit base material transport and holding device that is held by the mounting machine main body and transports and fixes the circuit base material, and (c) is held by the mounting machine main body, One or more mounting machine body side feeders for supplying the first type electronic circuit components; and (d) a head moving device for the mounting body body, the circuit substrate transport and holding device and the mounting machine body side feeder. And (e) one or more head-side feeders that are held by the head body and supply the second-type electronic circuit components; and (f) A plurality of component holders held by the head main body, the first type electronic circuit components from the mounter main body side feeder and the second type electronic circuit components from the head side feeder by the plurality of component holders. Each receiving and holding said circuit board substrate The first type electronic circuit component with respect to one circuit substrate held by the circuit substrate conveyance holding device by an electronic circuit component mounting machine including a mounting device mounted on the circuit substrate held by the device. And an electronic circuit component mounting method for mounting both the second-type electronic circuit component and
In the electronic circuit component mounting method, when any one of the first type electronic circuit components held by the plurality of component holders needs to be discarded, the head main body is connected to the next first type electronic circuit component. An electronic circuit component mounting method comprising: a first-class component receiving step at the time of disposal for performing disposal on the way to receipt. (a) a mounting machine main body, (b) a circuit base material transport and holding device that is held by the mounting machine main body and transports and fixes the circuit base material, and (c) is held by the mounting machine main body, One or more mounting machine body side feeders for supplying the first type electronic circuit components; and (d) a head moving device for the mounting body body, the circuit substrate transport and holding device and the mounting machine body side feeder. And (e) one or more head-side feeders that are held by the head body and supply the second-type electronic circuit components; and (f) A plurality of component holders held by the head main body, the first type electronic circuit components from the mounter main body side feeder and the second type electronic circuit components from the head side feeder by the plurality of component holders. Each receiving and holding said circuit board substrate The first type electronic circuit component with respect to one circuit substrate held by the circuit substrate conveyance holding device by an electronic circuit component mounting machine including a mounting device mounted on the circuit substrate held by the device. And an electronic circuit component mounting method for mounting both the second-type electronic circuit component and
In the electronic circuit component mounting method, when any one of the second type electronic circuit components held by the plurality of component holders needs to be discarded, the head moving device immediately discards the components of the head main body. Including a second type component receiving step at the time of disposal that starts movement to a position and causes another one of the plurality of component holders to receive the second type electronic circuit component in parallel with the movement. An electronic circuit component mounting method characterized by the above.   The first and second type component receiving order determining step determines the first and second types so that the first type electronic circuit component and the second type electronic circuit component are received together. 6. The electronic circuit component mounting method according to claim 1, further comprising a seed component intensive receiving order determination step.   The first and second type component receiving order determining step determines the first and second types so that the first type electronic circuit component and the second type electronic circuit component are received together. 6. The electronic circuit component mounting method according to claim 1, further comprising a seed component intensive receiving order determination step.

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