JP6625602B2 - フィーダ制御装置および制御方法ならびに部品実装装置 - Google Patents
フィーダ制御装置および制御方法ならびに部品実装装置 Download PDFInfo
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- JP6625602B2 JP6625602B2 JP2017503220A JP2017503220A JP6625602B2 JP 6625602 B2 JP6625602 B2 JP 6625602B2 JP 2017503220 A JP2017503220 A JP 2017503220A JP 2017503220 A JP2017503220 A JP 2017503220A JP 6625602 B2 JP6625602 B2 JP 6625602B2
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- 238000000034 method Methods 0.000 title claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 72
- 238000003780 insertion Methods 0.000 claims description 70
- 230000037431 insertion Effects 0.000 claims description 70
- 239000000758 substrate Substances 0.000 claims description 24
- 238000007599 discharging Methods 0.000 claims description 15
- 230000032258 transport Effects 0.000 claims 1
- 238000003825 pressing Methods 0.000 description 9
- 238000001514 detection method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000003860 storage Methods 0.000 description 3
- 238000005304 joining Methods 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/085—Production planning, e.g. of allocation of products to machines, of mounting sequences at machine or facility level
- H05K13/0857—Product-specific machine setup; Changeover of machines or assembly lines to new product type
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0084—Containers and magazines for components, e.g. tube-like magazines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0417—Feeding with belts or tapes
- H05K13/0419—Feeding with belts or tapes tape feeders
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/083—Quality monitoring using results from monitoring devices, e.g. feedback loops
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/086—Supply management, e.g. supply of components or of substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/0882—Control systems for mounting machines or assembly lines, e.g. centralized control, remote links, programming of apparatus and processes as such
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0417—Feeding with belts or tapes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/084—Product tracking, e.g. of substrates during the manufacturing process; Component traceability
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53178—Chip component
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Operations Research (AREA)
- Automation & Control Theory (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Automatic Assembly (AREA)
Description
Claims (5)
- 部品排出指令に基づいて、基板に実装する部品を収納したキャリアテープをテープ挿入口まで自動的に排出し、前記キャリアテープが前記テープ挿入口に挿入されると、挿入された前記キャリアテープを、前記部品が吸着される吸着位置に自動的に搬送する制御装置を備えた部品実装装置におけるフィーダ制御装置であって、
前記制御装置は、
前記部品実装装置によって生産される前記基板の生産切替え時に、次の基板の生産において使用しない前記部品を判別する部品判別部と、
前記部品排出指令として、前記部品判別部によって次の基板の生産に使用しないと判別された前記部品を収納した前記キャリアテープを前記吸着位置から前記テープ挿入口に排出する指令を送出する排出指令部とを備える、
ことを特徴とする部品実装装置におけるフィーダ制御装置。 - 前記制御装置は、前記部品排出指令の後に、前記部品排出指令を報知する表示部を備える請求項1に記載の部品実装装置におけるフィーダ制御装置。
- 部品排出指令に基づいて、基板に実装する部品を収納したキャリアテープをテープ挿入口まで自動的に排出し、前記キャリアテープが前記テープ挿入口に挿入されると、挿入された前記キャリアテープを、前記部品が吸着される吸着位置に自動的に搬送する部品実装装置におけるフィーダ制御方法であって、
前記部品実装装置によって生産される前記基板の生産切替え時に、次の基板の生産において使用しない前記部品を判別し、前記部品排出指令に基づいて、当該部品を収納した前記キャリアテープを前記吸着位置から前記テープ挿入口に排出することを特徴とする部品実装装置におけるフィーダ制御方法。 - 基板に実装する部品を収納したキャリアテープを備え、前記キャリアテープを装填した複数のフィーダが複数の装着位置にそれぞれ装着され、部品排出指令に基づいて、前記キャリアテープを前記フィーダのテープ挿入口まで自動的に排出し、前記キャリアテープが前記テープ挿入口に挿入されると、挿入された前記キャリアテープを、前記部品が吸着される吸着位置に自動的に搬送する部品供給装置を少なくとも一部に有する部品実装装置であって、
前記部品供給装置の前記各フィーダは、前記キャリアテープを駆動するテープ駆動装置を制御する制御部を備え、
前記部品実装装置は、前記各制御部に対して前記部品の排出や供給を指令する制御装置を備え、
前記制御装置は、基板の生産切替え時に、前記制御部に対し、次の基板の生産において使用しない前記部品を判別し、前記部品排出指令として、当該部品を収納した前記キャリアテープを前記吸着位置から前記テープ挿入口に排出する指令を送出することを特徴とする部品実装装置。 - 基板に実装する部品を収納したキャリアテープを備え、前記キャリアテープを装填した複数のフィーダが複数の装着位置にそれぞれ装着され、部品排出指令に基づいて、前記キャリアテープを前記フィーダのテープ挿入口まで自動的に排出し、前記キャリアテープが前記テープ挿入口に挿入されると、挿入された前記キャリアテープを、前記部品が吸着される吸着位置に自動的に搬送する部品供給装置を少なくとも一部に有する部品実装装置であって、
前記キャリアテープが収納する前記部品の使用予定を常時監視し、使用予定がないと判断したときは、当該部品を収納した前記キャリアテープを前記吸着位置から前記テープ挿入口に排出する前記部品排出指令を送出する制御装置を備えることを特徴とする部品実装装置。
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Application Number | Priority Date | Filing Date | Title |
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PCT/JP2015/056062 WO2016139713A1 (ja) | 2015-03-02 | 2015-03-02 | フィーダ制御装置および制御方法ならびに部品実装装置 |
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JP2019214270A Division JP7041659B2 (ja) | 2019-11-27 | 2019-11-27 | 部品実装装置 |
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JPWO2016139713A1 JPWO2016139713A1 (ja) | 2017-12-07 |
JP6625602B2 true JP6625602B2 (ja) | 2019-12-25 |
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US (1) | US11570940B2 (ja) |
EP (1) | EP3267776B1 (ja) |
JP (1) | JP6625602B2 (ja) |
CN (1) | CN107432105B (ja) |
WO (1) | WO2016139713A1 (ja) |
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CN107409486B (zh) * | 2015-03-06 | 2020-06-05 | 株式会社富士 | 元件种类配置的最优化方法及元件种类配置的最优化装置 |
JP6572443B2 (ja) * | 2016-03-09 | 2019-09-11 | パナソニックIpマネジメント株式会社 | キャリアテープの部品検出装置および部品供給装置 |
WO2018008115A1 (ja) * | 2016-07-06 | 2018-01-11 | 富士機械製造株式会社 | フィーダ |
JP7460307B2 (ja) * | 2016-12-12 | 2024-04-02 | 株式会社Fuji | テープフィーダ段取システム |
EP3806599A4 (en) * | 2018-05-31 | 2021-06-02 | Fuji Corporation | DETERMINATION DEVICE AND COMPONENT MOUNTING DEVICE THEREFORE |
DE102019102633B3 (de) * | 2019-02-04 | 2020-06-18 | Asm Assembly Systems Gmbh & Co. Kg | Verfahren zum Platzieren von Komponenten auf ein Werkstück, Bestückautomat |
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JP3809251B2 (ja) | 1997-07-09 | 2006-08-16 | 富士機械製造株式会社 | 回路部品供給方法および供給システム |
WO2000018208A1 (en) * | 1998-09-17 | 2000-03-30 | Matsushita Electric Industrial Co., Ltd. | Method and apparatus for feeding component, and method and apparatus for mounting component |
US7220095B2 (en) | 2001-05-24 | 2007-05-22 | Lyndaker David W | Self-threading component tape feeder |
EP2059111B1 (en) * | 2006-08-23 | 2014-01-15 | Yamaha Motor Co., Ltd. | Mounting apparatus |
US7850040B2 (en) | 2006-10-23 | 2010-12-14 | Hover-Davis, Inc. | Component tape feeder |
JP4321610B2 (ja) * | 2007-03-09 | 2009-08-26 | パナソニック株式会社 | テープフィーダ |
JP5278184B2 (ja) * | 2009-06-12 | 2013-09-04 | ソニー株式会社 | 部品供給装置、部品実装装置及び部品供給方法 |
JP5467825B2 (ja) * | 2009-09-14 | 2014-04-09 | 富士機械製造株式会社 | 実装機 |
JP2011077096A (ja) * | 2009-09-29 | 2011-04-14 | Hitachi High-Tech Instruments Co Ltd | 電子部品装着装置、部品供給装置及び電子部品装着方法 |
JP5872969B2 (ja) * | 2012-06-08 | 2016-03-01 | ヤマハ発動機株式会社 | 部品供給装置及び表面実装機 |
JP6033588B2 (ja) | 2012-06-29 | 2016-11-30 | ヤマハ発動機株式会社 | フィーダ及びフィーダ制御方法並びに電子部品装着装置 |
JP6267127B2 (ja) | 2012-10-31 | 2018-01-24 | 富士機械製造株式会社 | 段取り替え方法および段取り替え装置 |
JP6031679B2 (ja) * | 2013-07-30 | 2016-11-24 | パナソニックIpマネジメント株式会社 | 部品実装システムにおける段取り替え作業の指示方法および部品実装システム |
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- 2015-03-02 CN CN201580077299.3A patent/CN107432105B/zh active Active
- 2015-03-02 JP JP2017503220A patent/JP6625602B2/ja active Active
- 2015-03-02 US US15/552,363 patent/US11570940B2/en active Active
- 2015-03-02 EP EP15883883.9A patent/EP3267776B1/en active Active
- 2015-03-02 WO PCT/JP2015/056062 patent/WO2016139713A1/ja active Application Filing
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Publication number | Publication date |
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US20180027709A1 (en) | 2018-01-25 |
US11570940B2 (en) | 2023-01-31 |
WO2016139713A1 (ja) | 2016-09-09 |
JPWO2016139713A1 (ja) | 2017-12-07 |
EP3267776B1 (en) | 2020-12-30 |
CN107432105B (zh) | 2019-11-19 |
CN107432105A (zh) | 2017-12-01 |
EP3267776A4 (en) | 2018-01-10 |
EP3267776A1 (en) | 2018-01-10 |
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