JP6616517B2 - BONDING STRUCTURE, FLEXIBLE PANEL PROVIDED WITH THE BONDING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME - Google Patents
BONDING STRUCTURE, FLEXIBLE PANEL PROVIDED WITH THE BONDING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME Download PDFInfo
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- JP6616517B2 JP6616517B2 JP2018540020A JP2018540020A JP6616517B2 JP 6616517 B2 JP6616517 B2 JP 6616517B2 JP 2018540020 A JP2018540020 A JP 2018540020A JP 2018540020 A JP2018540020 A JP 2018540020A JP 6616517 B2 JP6616517 B2 JP 6616517B2
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- 238000004519 manufacturing process Methods 0.000 title claims description 16
- 238000000034 method Methods 0.000 title claims description 6
- 239000011241 protective layer Substances 0.000 claims description 104
- 239000012790 adhesive layer Substances 0.000 claims description 23
- 239000000463 material Substances 0.000 claims description 9
- 229920001296 polysiloxane Polymers 0.000 claims description 7
- 239000010410 layer Substances 0.000 claims description 5
- 239000004642 Polyimide Substances 0.000 claims description 3
- 229920001721 polyimide Polymers 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims 1
- 239000000853 adhesive Substances 0.000 description 9
- 230000001070 adhesive effect Effects 0.000 description 9
- 239000000758 substrate Substances 0.000 description 5
- 238000013459 approach Methods 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 241001391944 Commicarpus scandens Species 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133305—Flexible substrates, e.g. plastics, organic film
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13454—Drivers integrated on the active matrix substrate
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3135—Double encapsulation or coating and encapsulation
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F2201/00—Constructional arrangements not provided for in groups G02F1/00 - G02F7/00
- G02F2201/50—Protective arrangements
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F2202/00—Materials and properties
- G02F2202/02—Materials and properties organic material
- G02F2202/022—Materials and properties organic material polymeric
- G02F2202/023—Materials and properties organic material polymeric curable
Description
本発明は、表示パネルの技術領域に関し、特にフレキシブルパネルボンディング構造及びその製造方法に関する。 The present invention relates to a technical field of a display panel, and more particularly to a flexible panel bonding structure and a manufacturing method thereof.
フレキシブルパネル製造の領域において、フレキシブルパネルは、それ自体の材質が脆弱であるため、製造工程では、非常に破損しやすく、通常フレキシブルパネルを基板（例えば、ステンレスガラス）に張り付けてから、回路エッチング及びボンディングなどの工程を行い、最後に剥離によりフレキシブルパネルと基板とを分離する。ボンディングを例示すると、フレキシブルパネルのボンディング領域に通常チップなどのコンポーネントがボンディングされるとともに、チップの四周に通常多量の回線が分布されるため、フレキシブルパネルと基板との剥離操作に十分注意を払う必要があり、さもなければ、回路が破損しやすくなり不良品が発生してしまう。 In the area of flexible panel manufacturing, the flexible panel itself is fragile, so it is very easy to break in the manufacturing process, usually after the flexible panel is attached to a substrate (for example, stainless steel glass) and then subjected to circuit etching and A process such as bonding is performed, and finally the flexible panel and the substrate are separated by peeling. As an example of bonding, components such as chips are usually bonded to the bonding area of the flexible panel, and usually a large amount of lines are distributed around the four sides of the chip, so it is necessary to pay sufficient attention to the peeling operation between the flexible panel and the substrate. Otherwise, the circuit is easily damaged and a defective product is generated.
従来技術では、図１に示すように、基板ＡがフレキシブルパネルＣの下方に位置付けられ、ボンディング領域内のチップＢとフレキシブルパネルＣ自身との間には、顕著な硬度差が存在するため、実際、剥離時にボンディング領域には、大きな応力を発生させてしまうおそれがある。これにより、チップＢの配置箇所に応力集中が発生し（Ｄ箇所は、応力集中領域である）、当該配置箇所の回線が断裂しやすくなり、フレキシブルパネルボンディング後の剥離良好率が大幅に低下してしまう。 In the prior art, as shown in FIG. 1, the substrate A is positioned below the flexible panel C, and there is a significant hardness difference between the chip B in the bonding region and the flexible panel C itself. There is a possibility that a large stress is generated in the bonding region at the time of peeling. As a result, stress concentration occurs at the placement location of the chip B (D location is a stress concentration region), the line at the placement location is likely to be broken, and the good peeling rate after flexible panel bonding is greatly reduced. End up.
本発明は、従来技術のような課題に鑑みてなされたものであり、フレキシブルパネルボンディング領域の剥離良好率が低いことが改善されるフレキシブルパネルボンディング構造、これを備えるフレキシブルパネル及びボンディング構造の製造方法を提供することを目的とする。 The present invention has been made in view of the problems as in the prior art, and has a flexible panel bonding structure that can improve that the peeling good rate of the flexible panel bonding region is low, a flexible panel including the same, and a method for manufacturing the bonding structure The purpose is to provide.
上記のような課題を解決するため、本発明に係るフレキシブルパネルボンディング構造は、ボンディング領域と、前記ボンディング領域に取り付けられるチップとを含むもの構造であって、前記ボンディング領域には、前記チップの四囲を取り囲むフレキシブル保護層が設けられるものである。 In order to solve the above problems, a flexible panel bonding structure according to the present invention includes a bonding region and a chip attached to the bonding region, and the bonding region has four surroundings of the chip. Is provided with a flexible protective layer.
さらに、上記の構成において、前記フレキシブル保護層は、前記チップの四囲に設けられる第１保護層と、前記第１保護層の外周に設けられる第２保護層とを含む。 Further, in the above configuration, the flexible protective layer includes a first protective layer provided around the chip and a second protective layer provided on an outer periphery of the first protective layer.
さらに、上記の構成において、前記第１保護層は、前記チップの四囲に塗布されるＵＶ接着層であり、前記第２保護層は、前記第１保護層の外周に設けられるシリコーン層である。 Further, in the above configuration, the first protective layer is a UV adhesive layer applied to the four sides of the chip, and the second protective layer is a silicone layer provided on the outer periphery of the first protective layer.
さらに、上記の構成において、前記第１保護層は、前記チップの四囲に塗布されるポリイミド接着層であり、前記第２保護層は、前記第１保護層の外周に設けられるＵＶ接着層である。 Further, in the above configuration, the first protective layer is a polyimide adhesive layer applied to the four sides of the chip, and the second protective layer is a UV adhesive layer provided on the outer periphery of the first protective layer. .
さらに、上記の構成において、前記第１保護層の内側は、前記チップの四周に密着され、前記第２保護層は、前記第１保護層の周辺と接され、前記第２保護層の厚みは、前記第１保護層の厚みよりも小さくなる。 Further, in the above configuration, the inner side of the first protective layer is in close contact with the four circumferences of the chip, the second protective layer is in contact with the periphery of the first protective layer, and the thickness of the second protective layer is , Smaller than the thickness of the first protective layer.
さらに、上記の構成において、前記フレキシブル保護層は、その厚みが前記チップに近づく方向に向かって次第に厚くなる。 Furthermore, in said structure, the said flexible protective layer becomes thick gradually toward the direction which approaches the said chip | tip.
本発明に係るフレキシブルパネルボンディング構造の製造方法は、フレキシブルパネルの表面にボンディング領域を設け、前記ボンディング領域にチップをボンディングし、前記チップの四周にフレキシブル保護層を設けることを含むものである。 The manufacturing method of the flexible panel bonding structure according to the present invention includes providing a bonding region on the surface of the flexible panel, bonding a chip to the bonding region, and providing a flexible protective layer around the four sides of the chip.
さらに、上記の構成において、前記チップの四周にフレキシブル保護層を設けることは、前記チップの四周に、それぞれ前記チップ及び前記フレキシブルパネルと接続されるように第１保護層を設けることと、前記第１保護層の外周に第２保護層を設けることとを含み、前記第２保護層の厚みは、前記第１保護層の厚みよりも小さくなることが好ましい。 Further, in the above configuration, providing the flexible protective layer on the four sides of the chip includes providing the first protective layer on the four sides of the chip so as to be connected to the chip and the flexible panel, respectively. Including providing a second protective layer on the outer periphery of the first protective layer, and the thickness of the second protective layer is preferably smaller than the thickness of the first protective layer.
さらに、上記の構成において、前記チップの四周に第１保護層を設けることは、ＵＶ接着層を塗布し、紫外線を照射することでＵＶ接着層を硬化させることを含み、前記第１保護層の外周に第２保護層を設けることは、シリコーン層を、ＵＶ接着層の外周のボンディング領域の全てに分布されるように塗布することを含むことが好ましい。 Further, in the above configuration, providing the first protective layer on the four circumferences of the chip includes applying the UV adhesive layer and curing the UV adhesive layer by irradiating with ultraviolet rays. Providing the second protective layer on the outer periphery preferably includes applying the silicone layer so as to be distributed over the entire bonding region on the outer periphery of the UV adhesive layer.
さらに、上記の構成において、前記チップの四周にフレキシブル保護層を設けることは、前記チップの四周に単一材質の接着層を塗布することを含み、前記接着層は、その厚みが前記チップに近づく方向に向かって次第に厚くなることが好ましい。 Furthermore, in the above configuration, providing the flexible protective layer on the four circumferences of the chip includes applying a single-layer adhesive layer on the four circumferences of the chip, and the thickness of the adhesive layer approaches that of the chip. It is preferable that the thickness gradually increases in the direction.
本発明によれば、チップの四周に硬度の異なるフレキシブル保護層を形成することで、剥離時にチップの四周に発生する応力を大幅に分散することができ、応力段階を形成し、チップの四周に隣接する位置に発生する応力集中を回避し、チップの周辺の回線が断裂するリスクを低下し、最終的にフレキシブルパネルの剥離良好率が向上されるという優れた効果が得られる。 According to the present invention, by forming a flexible protective layer having different hardness on the four circumferences of the chip, the stress generated on the four circumferences of the chip at the time of peeling can be greatly dispersed, forming a stress stage, It is possible to avoid the stress concentration occurring at the adjacent position, reduce the risk of the tearing of the circuit around the chip, and obtain an excellent effect that the peeling good rate of the flexible panel is finally improved.
ここで説明する図面は、本発明を理解しやすくするためのものであり、本発明の一部を構成し、また、本発明の実施例及びその説明は、本発明を限定するものではなく、本発明を解釈するためのものである。
本発明の目的、技術案及び利点をより明確にするために、本発明の実施形態及びそれに対応する図面を参照しながら本発明の技術案を明確かつ詳細に説明する。実施例は、本発明の一部分の実施例に過ぎず、全ての実施例ではないことが明らかである。当業者が、本発明の実施例に基づき、容易に想到し得るその他の実施例は、言うまでもなく本発明の範囲に含まれる。 In order to clarify the objects, technical solutions, and advantages of the present invention, the technical solutions of the present invention will be described clearly and in detail with reference to the embodiments of the present invention and the corresponding drawings. It is clear that the examples are only a part of the embodiments of the present invention and not all examples. Of course, other embodiments that can be easily conceived by those skilled in the art based on the embodiments of the present invention are included in the scope of the present invention.
以下、図面を参照しながら本発明の各実施例の技術案を詳細に説明する。 Hereinafter, the technical solutions of the embodiments of the present invention will be described in detail with reference to the drawings.
（実施例１）
従来のフレキシブルパネルの剥離良好率が低下するという課題を解決するために、本発明の実施例がフレキシブルパネルに用いられるボンディング構造を提供し、図２に示すように、フレキシブルパネルは、表示領域１０、表示領域１０と接続されるボンディング領域１１及びボンディング領域１１に取り付けられるチップ２０を含んでいる。前記ボンディング領域１１には、前記チップ２０の四周を取り囲むフレキシブル保護層３０が設けられ、すなわち、フレキシブル保護層３０は、水平方向においてチップ２０の四周を取り囲んでいる。ここで、前記フレキシブル保護層３０は、水平方向においてチップ２０の四周に設けられる第１保護層３１と、水平方向において前記第１保護層３１の外周に設けられる第２保護層３２とを含んでおり、前記第１保護層３１と第２保護層３２とは、材質が異なるものの、フレキシブル材質のものであり、第１保護層３１の厚みが第２保護層３２の厚みよりも大きくなっている。
Example 1
In order to solve the problem that the peeling favorable rate of the conventional flexible panel is lowered, the embodiment of the present invention provides a bonding structure used in the flexible panel. As shown in FIG. The bonding area 11 connected to the display area 10 and the chip 20 attached to the bonding area 11 are included. The bonding region 11 is provided with a flexible protective layer 30 that surrounds the four circumferences of the chip 20, that is, the flexible protective layer 30 surrounds the four circumferences of the chip 20 in the horizontal direction. Here, the flexible protective layer 30 includes a first protective layer 31 provided around the chip 20 in the horizontal direction and a second protective layer 32 provided on the outer periphery of the first protective layer 31 in the horizontal direction. The first protective layer 31 and the second protective layer 32 are made of a flexible material, although the materials are different, and the thickness of the first protective layer 31 is larger than the thickness of the second protective layer 32. .
ここで、前記フレキシブルパネルには、前記チップ２０をボンディングするためのボンディング領域１１が設けられ、本実施例では、前記ボンディング領域１１は、前記フレキシブルパネルの一方側に位置付けられ、前記チップ２０は、フレキシブルパネルに取り付けられるように、前記ボンディング領域１１にボンディングされている。前記第１保護層３１は、その内側が前記チップ２０の四周の縁に密着されるように、前記チップ２０の四周を取り囲むことで、チップ２０の四周の縁が第１保護層３１によってフレキシブルパネルの表面と接続されるようになる。前記第２保護層３２は、前記チップ２０の四周領域を被覆するように、前記ボンディング領域１１に分布され、前記第２保護層３２は、前記第１保護層３１を被覆してもよく、第１保護層３１を被覆せずに第１保護層３１の周辺と接するように直接第１保護層３１の外周に塗布してもよい。両方の形態のいずれかによれば、ボンディング領域１１の強度を向上させるとともに、剥離時に発生する応力集中を緩和することができ、必要に応じて選択することが可能である。材質の異なる第１保護層３１及び第２保護層３２を設けることで、チップ２０の四周を硬度が漸次変化するダブル接着層構造を形成し、応力段階を形成し、チップ２０の四周に発生する応力が、次第にチップ２０に近づく方向に向かって次第に大きくなるため、応力を分散することで応力集中を回避する目的を達成することができる。 Here, the flexible panel is provided with a bonding region 11 for bonding the chip 20, and in this embodiment, the bonding region 11 is positioned on one side of the flexible panel, It is bonded to the bonding region 11 so as to be attached to the flexible panel. The first protective layer 31 surrounds the four circumferences of the chip 20 so that the inner side thereof is in close contact with the four circumferential edges of the chip 20, so that the four protective edges of the chip 20 are covered by the first protective layer 31. Be connected with the surface of the. The second protective layer 32 may be distributed in the bonding region 11 so as to cover the four-round region of the chip 20, and the second protective layer 32 may cover the first protective layer 31, You may apply | coat to the outer periphery of the 1st protective layer 31 directly so that the circumference | surroundings of the 1st protective layer 31 may be touched, without coat | covering the 1 protective layer 31. FIG. According to either of the two forms, the strength of the bonding region 11 can be improved and the stress concentration generated at the time of peeling can be relaxed, and selection can be made as necessary. By providing the first protective layer 31 and the second protective layer 32 of different materials, a double adhesive layer structure in which the hardness gradually changes is formed on the four circumferences of the chip 20, a stress stage is formed, and the chip 20 is generated on the four circumferences. Since the stress gradually increases toward the chip 20, the purpose of avoiding stress concentration can be achieved by dispersing the stress.
本実施例では、前記第１保護層３１は、ＵＶ（Ｕｌｔｒａｖｉｏｌｅｔ Ｒａｙｓ、紫外線）接着剤（紫外線硬化接着剤）を用い、前記第２保護層３２は、シリコーンを用い、前記シリコーンを、ＵＶ接着剤の周辺と接するとともにＵＶ接着剤の外周に位置するボンディング領域１１の全てに分布されるように、ＵＶ接着剤の外周に塗布することが好ましい。 In the present embodiment, the first protective layer 31 uses a UV (Ultraviolet Rays) adhesive (ultraviolet curing adhesive), the second protective layer 32 uses silicone, and the silicone is used as a UV adhesive. It is preferable to apply to the outer periphery of the UV adhesive so that it is distributed over the entire bonding area 11 located on the outer periphery of the UV adhesive and in contact with the periphery of the UV adhesive.
（実施例２）
本発明の実施例がフレキシブルパネルボンディング構造を提供し、また、本発明の実施例がフレキシブルパネルに用いられるボンディング構造を提供し、図２に示すように、前記フレキシブルパネルは、表示領域１０、表示領域１０と接続されるボンディング領域１１及びボンディング領域１１に取り付けられるチップ２０を含んでいる。前記ボンディング領域１１には、前記チップ２０の四周を取り囲むフレキシブル保護層３０が設けられ、前記フレキシブル保護層３０は、単一材質の接着層であり、フレキシブルパネルのボンディング領域１１に塗布され、前記フレキシブル保護層３０の厚みは、前記チップ２０に近づく方向に向かって次第に厚くなり、図３に示すように、すなわち、フレキシブル保護層３０は、そのボンディング領域１１縁に位置する部分の厚みがそのチップ２０の四周の縁に位置する部分の厚みよりも小さくなっている。このように、厚みが漸次変化するフレキシブル保護層３０は、チップ２０の四周に硬度が漸次変化する構造を形成することができ、応力段階を形成し、応力を分散することで応力集中を回避する目的を達成することができる。本実施例の保護層は、単一材質の接着層を用いており、保護層の厚みを制御することで、応力段階を形成し、製造工程を減らすとともに製造の困難性を低下させることができる。
(Example 2)
The embodiment of the present invention provides a flexible panel bonding structure, and the embodiment of the present invention provides a bonding structure used for a flexible panel. As shown in FIG. A bonding region 11 connected to the region 10 and a chip 20 attached to the bonding region 11 are included. The bonding region 11 is provided with a flexible protective layer 30 that surrounds the four circumferences of the chip 20, and the flexible protective layer 30 is a single material adhesive layer that is applied to the bonding region 11 of a flexible panel, and The thickness of the protective layer 30 gradually increases in the direction approaching the chip 20, and as shown in FIG. 3, that is, the flexible protective layer 30 has a thickness located at the edge of the bonding region 11. It is smaller than the thickness of the portion located at the edge of the four circumferences. As described above, the flexible protective layer 30 whose thickness gradually changes can form a structure whose hardness gradually changes around the circumference of the chip 20, and a stress stage is formed to avoid stress concentration by dispersing the stress. Aim can be achieved. The protective layer of the present embodiment uses a single material adhesive layer, and by controlling the thickness of the protective layer, it is possible to form a stress stage, reduce the manufacturing process and reduce the manufacturing difficulty. .
（実施例３）
本発明の実施例がフレキシブルパネルボンディング構造の製造方法を提供する。当該フレキシブルパネルボンディング構造の製造方法は、
工程Ｓ０１：フレキシブルパネルの表面にボンディング領域を設け、ボンディング領域にチップをボンディングすることと、
工程Ｓ０２：チップの四周にフレキシブル保護層を設けることとを含んでいる。
(Example 3)
Embodiments of the present invention provide a method for manufacturing a flexible panel bonding structure. The manufacturing method of the flexible panel bonding structure is as follows:
Step S01: providing a bonding area on the surface of the flexible panel and bonding a chip to the bonding area;
Step S02: providing a flexible protective layer on the four circumferences of the chip.
ここで、前記工程Ｓ０２において、「チップの四周にフレキシブル保護層を設ける」ことは、チップの四周に、それぞれチップ及びフレキシブルパネルの表面と接続されるように第１保護層を設けることと、第１保護層の外周に第２保護層を設けることとを含んでおり、第２保護層の厚みは、第１保護層の厚みよりも小さくなっている。 Here, in the step S02, “providing the flexible protective layer on the four sides of the chip” means providing the first protective layer on the four sides of the chip so as to be connected to the surface of the chip and the flexible panel, Providing a second protective layer on the outer periphery of the first protective layer, and the thickness of the second protective layer is smaller than the thickness of the first protective layer.
前記「第１保護層を設ける」ことは、ＵＶ接着層を塗布し、ＵＶ接着層に紫外線を照射することで、ＵＶ接着層を硬化させることが好ましい。前記「第２保護層を設ける」ことは、シリコーン層を、ＵＶ接着剤の周辺と接するとともにＵＶ接着剤の外周に位置するボンディング領域１１の全てに分布されるように、ＵＶ接着剤の外周に塗布することが好ましい。もちろん、前記第１保護層と第２保護層の材質は、その他のフレキシブル材質を用いてもよく、例えば、前記「第１保護層を設ける」ことは、ポリイミド接着層を塗布することを意味してもよく、前記「第２保護層を設ける」ことは、ＵＶ接着層を塗布することを意味してもよく、同様にチップの四周に発生する応力を分散することができ、これらの説明を省略する。 The “providing the first protective layer” is preferably to cure the UV adhesive layer by applying a UV adhesive layer and irradiating the UV adhesive layer with ultraviolet rays. The “providing the second protective layer” means that the silicone layer is disposed on the outer periphery of the UV adhesive so that the silicone layer is in contact with the periphery of the UV adhesive and is distributed in all the bonding regions 11 located on the outer periphery of the UV adhesive. It is preferable to apply. Of course, other flexible materials may be used as the material of the first protective layer and the second protective layer. For example, “providing the first protective layer” means applying a polyimide adhesive layer. The above-mentioned “providing the second protective layer” may mean applying a UV adhesive layer, and similarly, the stress generated in the four circumferences of the chip can be dispersed. Omitted.
もちろん、本発明の実施例の前記工程Ｓ０２において、「チップの四周にフレキシブル保護層を設ける」ことは、その他の形態を用いてもよく、その他の形態とは、チップの四周に厚みが漸次変化する単一材質の接着層を含んでもよく、接着層の厚みは、前記チップに近づく方向に向かって次第に厚くなっている。図３に示すように、このように形成される硬度が漸次変化する構造は、応力段階を形成し、応力を分散することで応力集中を回避する目的を達成することができる。 Of course, in the step S02 of the embodiment of the present invention, “providing a flexible protective layer on the four circumferences of the chip” may use other forms, and the thickness is gradually changed on the four circumferences of the chip. A single material adhesive layer may be included, and the thickness of the adhesive layer is gradually increased toward the chip. As shown in FIG. 3, the structure in which the hardness thus formed gradually changes can achieve the purpose of avoiding stress concentration by forming a stress stage and dispersing the stress.
実験によれば、本発明の実施例１、実施例２及び実施例３が提供するフレキシブルパネルボンディング構造及びその製造方法は、ボンディング領域１１内のチップの四周に硬度が漸次変化するフレキシブル保護層３０（例えば、第１保護層３１及び第２保護層３２）を形成することができ、図３から図５に示すように、フレキシブル保護層３０によってボンディング領域１１の応力を四周から中心位置に向かう応力段階に形成し、すなわち、ボンディング領域１１の縁に位置する部分の応力が最も小さく（この部分のモース硬度が最も小さいことから）、応力が次第にチップに近づく方向に向かって次第に大きくなり（モース硬度が次第に大きくなることから）、このように、チップ２０の四周に発生する応力を大幅に分散することができ、剥離時にチップ２０の四周に隣接する位置に発生する応力集中を回避し、チップ２０の周辺の回線が断裂するリスクを低下し、最終的にフレキシブルパネルの剥離良好率が向上される。 According to experiments, the flexible panel bonding structure and the manufacturing method thereof provided by the first, second, and third embodiments of the present invention have the flexible protective layer 30 in which the hardness gradually changes around the four sides of the chip in the bonding region 11. (For example, the first protective layer 31 and the second protective layer 32) can be formed, and as shown in FIGS. 3 to 5, the stress of the bonding region 11 is caused by the flexible protective layer 30 toward the center position from the four circumferences. In other words, the stress at the edge of the bonding region 11 is the smallest (because the Mohs hardness of this part is the smallest), and the stress gradually increases toward the chip (Mohs hardness). Thus, the stress generated on the four circumferences of the chip 20 can be greatly dispersed in this way, To avoid stress concentration occurring at a position adjacent to the four sides of the chip 20 when releasing the line around the chip 20 decreases the risk of tearing, peeling good index of ultimate flexible panel is improved.
上記の説明は、本発明の実施例にすぎず、本発明を制限するためのものではない。当業者にとって、本発明に様々な変更及び変形を加えることが可能である。本発明の技術思想内のいかなる変更、同等置換、改良などは、本発明の特許請求の範囲に含まれる。 The above descriptions are merely examples of the present invention and are not intended to limit the present invention. It will be apparent to those skilled in the art that various modifications and variations can be made to the present invention. Any changes, equivalent replacements, improvements, etc. within the technical idea of the present invention are included in the claims of the present invention.
Claims (9)
前記ボンディング領域には、前記チップの四囲を取り囲むフレキシブル保護層が設けられ、前記フレキシブル保護層の内側が前記チップの四周の縁に密着しており、
前記フレキシブル保護層のモース硬度は、前記チップに近づく方向に向かって大きくなり、
前記フレキシブル保護層の厚みが前記チップに近づく方向に向かって厚くなる
ことを特徴とするフレキシブルパネルボンディング構造。 A flexible panel bonding structure including a bonding area and a chip attached to the bonding area,
The bonding region is provided with a flexible protective layer that surrounds the four sides of the chip, and the inner side of the flexible protective layer is in close contact with the four peripheral edges of the chip,
Mohs hardness of the flexible protective layer, Ri Na increases toward the direction approaching to the tip,
The flexible panel bonding structure, wherein the thickness of the flexible protective layer increases in a direction approaching the chip .
前記第１保護層のモース硬度は、前記第２保護層のモース硬度より大きい
ことを特徴とする請求項１に記載のフレキシブルパネルボンディング構造。 The flexible protective layer includes a first protective layer provided on the four sides of the chip, and a second protective layer provided on the outer periphery of the first protective layer,
The flexible panel bonding structure according to claim 1, wherein the Mohs hardness of the first protective layer is greater than the Mohs hardness of the second protective layer.
ことを特徴とする請求項１に記載のフレキシブルパネルボンディング構造。 The flexible protective layer includes a first protective layer that is provided in the four surroundings of the chip without being present in the entire bonding region, and a second protective layer that is present in the entire bonding region and covers the first protective layer. Including,
The flexible panel bonding structure according to claim 1.
前記第２保護層は、シリコーン層である
ことを特徴とする請求項２又は３に記載のフレキシブルパネルボンディング構造。 The first protective layer is a UV adhesive layer;
The flexible panel bonding structure according to claim 2 or 3 , wherein the second protective layer is a silicone layer.
前記第２保護層は、ＵＶ接着層である
ことを特徴とする請求項２又は３に記載のフレキシブルパネルボンディング構造。 The first protective layer is a polyimide adhesive layer;
The second protective layer is a flexible panel bonding structure according to claim 2 or 3, characterized in that a UV adhesive layer.
請求項１から５のいずれか１項に記載のフレキシブルパネルボンディング構造を含む
ことを特徴とするフレキシブルパネル。 A flexible panel,
A flexible panel comprising the flexible panel bonding structure according to any one of claims 1 to 5 .
フレキシブルパネルの表面にボンディング領域を設け、前記ボンディング領域にチップをボンディングし、前記チップの四周にフレキシブル保護層を設けることを含み、
前記フレキシブル保護層の内側が前記チップの四周の縁に密着しており、前記フレキシブル保護層のモース硬度が前記チップに近づく方向に向かって大きくなり、前記フレキシブル保護層の厚みが前記チップに近づく方向に向かって厚くなる
ことを特徴とするフレキシブルパネルボンディング構造の製造方法。 A method of manufacturing a flexible panel bonding structure,
Including providing a bonding region on the surface of the flexible panel, bonding a chip to the bonding region, and providing a flexible protective layer on the four circumferences of the chip;
It said inner flexible protective layer adhered closely to the four sides of the edge of the chip, the Ri Mohs hardness of the flexible protective layer is Na increases toward the direction approaching the tip, the thickness of the flexible protective layer closer to the tip A method of manufacturing a flexible panel bonding structure, characterized in that the thickness increases in the direction .
前記チップの四周に、それぞれ前記チップ及び前記フレキシブルパネルと接続されるように第１保護層を設けることと、
前記第１保護層の外周に第２保護層を設けることとを含み、
前記第２保護層のモース硬度は、前記第１保護層のモース硬度より小さい
ことを特徴とする請求項７に記載のフレキシブルパネルボンディング構造の製造方法。 Providing a flexible protective layer around the four sides of the chip,
Providing a first protective layer to be connected to the chip and the flexible panel, respectively, on the four circumferences of the chip;
Providing a second protective layer on the outer periphery of the first protective layer,
The method for manufacturing a flexible panel bonding structure according to claim 7 , wherein the Mohs hardness of the second protective layer is smaller than the Mohs hardness of the first protective layer.
前記チップの四周に単一材質の接着層を塗布することを含み、
前記接着層は、その厚みが前記チップに近づく前記方向に向かって厚くなる
ことを特徴とする請求項７に記載のフレキシブルパネルボンディング構造の製造方法。 Providing a flexible protective layer around the four sides of the chip,
Applying a single material adhesive layer around the four sides of the chip;
The method for manufacturing a flexible panel bonding structure according to claim 7 , wherein the thickness of the adhesive layer increases toward the direction approaching the chip.
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| US9269647B2 (en) * | 2014-05-29 | 2016-02-23 | Samsung Electronics Co., Ltd. | Semiconductor package having heat dissipating member |
-
2016
- 2016-01-26 CN CN201610052071.5A patent/CN106997882B/en active Active
- 2016-11-30 KR KR1020187023416A patent/KR20180107152A/en not_active IP Right Cessation
- 2016-11-30 EP EP16887726.4A patent/EP3382759A4/en active Pending
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| EP3382759A1 (en) | 2018-10-03 |
| JP2019506638A (en) | 2019-03-07 |
| CN106997882B (en) | 2020-05-22 |
| US10727125B2 (en) | 2020-07-28 |
| CN106997882A (en) | 2017-08-01 |
| WO2017128855A1 (en) | 2017-08-03 |
| KR20180107152A (en) | 2018-10-01 |
| TWI683426B (en) | 2020-01-21 |
| EP3382759A4 (en) | 2019-01-02 |
| US20190080962A1 (en) | 2019-03-14 |
| TW201737474A (en) | 2017-10-16 |
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