JP6593444B2 - アンテナ一体型通信モジュール - Google Patents
アンテナ一体型通信モジュール Download PDFInfo
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- JP6593444B2 JP6593444B2 JP2017539823A JP2017539823A JP6593444B2 JP 6593444 B2 JP6593444 B2 JP 6593444B2 JP 2017539823 A JP2017539823 A JP 2017539823A JP 2017539823 A JP2017539823 A JP 2017539823A JP 6593444 B2 JP6593444 B2 JP 6593444B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q3/00—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system
- H01Q3/26—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elements; varying the distribution of energy across a radiating aperture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/0006—Particular feeding systems
- H01Q21/0025—Modular arrays
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/66—High-frequency adaptations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2291—Supports; Mounting means by structural association with other equipment or articles used in bluetooth or WI-FI devices of Wireless Local Area Networks [WLAN]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/0087—Apparatus or processes specially adapted for manufacturing antenna arrays
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
- H01Q21/061—Two dimensional planar arrays
- H01Q21/062—Two dimensional planar arrays using dipole aerials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
- H01Q21/061—Two dimensional planar arrays
- H01Q21/065—Patch antenna array
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
- H01Q21/061—Two dimensional planar arrays
- H01Q21/067—Two dimensional planar arrays using endfire radiating aerial units transverse to the plane of the array
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q23/00—Antennas with active circuits or circuit elements integrated within them or attached to them
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q25/00—Antennas or antenna systems providing at least two radiating patterns
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q3/00—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system
- H01Q3/26—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elements; varying the distribution of energy across a radiating aperture
- H01Q3/2605—Array of radiating elements provided with a feedback control over the element weights, e.g. adaptive arrays
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B7/00—Radio transmission systems, i.e. using radiation field
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6661—High-frequency adaptations for passive devices
- H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15158—Shape the die mounting substrate being other than a cuboid
- H01L2924/15159—Side view
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
- H01L2924/1533—Connection portion the connection portion being formed on the die mounting surface of the substrate the connection portion being formed both on the die mounting surface of the substrate and outside the die mounting surface of the substrate
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- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Manufacturing & Machinery (AREA)
- Signal Processing (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Variable-Direction Aerials And Aerial Arrays (AREA)
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Description
第1の誘電体層、及び前記第1の誘電体層の上面及び下面に配置された導体パターンを含む多層基板と、
前記多層基板の上に配置され、前記第1の誘電体層とは異なる材料からなる第2の誘電体層と、
前記第2の誘電体層に形成された少なくとも1つの放射素子と、
前記放射素子と前記導体パターンとを接続する給電線と、
前記多層基板の下面に実装された送受信回路部品と、
前記多層基板の、前記第2の誘電体層が配置された面とは反対側の面に配置され、前記送受信回路部品を覆う第3の誘電体層と、
前記第3の誘電体層に埋設され、一端が前記第1の誘電体層の下面に配置された前記導体パターンに接続され、他端が前記第3の誘電体層の表面まで達する導電性の棒状部材と
を有し、
前記給電線は、前記第2の誘電体層の厚さ方向に延びる導電性の導体ピンを含み、前記導体ピンは、前記放射素子と、前記第1の誘電体層の上面に配置された前記導体パターンとを電気的に接続する。
図1に、第1実施例によるアンテナ一体型通信モジュール1のブロック図を示す。第1実施例によるアンテナ一体型通信モジュール1は、位相のみを制御する32素子のフェイズドアレーアンテナを含み、60GHz帯のミリ波を用いた通信に用いられる。
次に、図8A及び図8Bを参照して、第2実施例によるアンテナ一体型通信モジュール1について説明する。以下、第1実施例との相違点について説明し、共通の構成については説明を省略する。
10 送受信回路部品
11 入出力端子
12 スイッチ(送受切替器)
13 受信用ローノイズアンプ
14 送信用パワーアンプ
15 移相器
16 コンバイナ(信号合成器)
17 周波数コンバータ
18 スプリッタ(信号分波器)
19 移相器
20 放射素子
20A プリンテッドダイポールアンテナ
20B パッチアンテナ
21 接続点
22、23 接地配線
24 給電線
25 電源部
26 ダイプレクサ
30 主機器
40 多層基板
41 第1の誘電体層
42 第2の誘電体層
43 第3の誘電体層
44 接地導体
45 ランド
46 平坦な領域
46n 平坦な領域の法線方向
47 傾斜領域
47n 傾斜領域の法線方向
48 同軸ケーブル用コネクタのレセプタクル
50 棒状部材
53、54、55 導体パターン
56 配線パターン
57 導体パターン
58 接地導体
59 導体パターン
60、61 ランド
70 棒状部材
80 アンテナ基板
81 スルーホール
82 ランド
83 はんだ
85 アンテナ支持誘電体層
86 フィルドビア
87 アンテナ支持誘電体層
88 スルーホール
89 導体パターン
90 接続箇所
Claims (7)
- 第1の誘電体層、及び前記第1の誘電体層の上面及び下面に配置された導体パターンを含む多層基板と、
前記多層基板の上に配置され、前記第1の誘電体層とは異なる材料からなる第2の誘電体層と、
前記第2の誘電体層に形成された少なくとも1つの放射素子と、
前記放射素子と前記導体パターンとを接続する給電線と、
前記多層基板の下面に実装された送受信回路部品と、
前記多層基板の、前記第2の誘電体層が配置された面とは反対側の面に配置され、前記送受信回路部品を覆う第3の誘電体層と、
前記第3の誘電体層に埋設され、一端が前記第1の誘電体層の下面に配置された前記導体パターンに接続され、他端が前記第3の誘電体層の表面まで達する導電性の棒状部材と
を有し、
前記給電線は、前記第2の誘電体層の厚さ方向に延びる導電性の導体ピンを含み、前記導体ピンは、前記放射素子と、前記第1の誘電体層の上面に配置された前記導体パターンとを電気的に接続するアンテナ一体型通信モジュール。 - 前記第2の誘電体層の誘電率が、前記第1の誘電体層の誘電率より小さい請求項1に記載のアンテナ一体型通信モジュール。
- 前記第2の誘電体層の誘電正接が前記第1の誘電体層の誘電正接よりも小さい請求項1または2に記載のアンテナ一体型通信モジュール。
- 前記導体ピンの一方の端面が、前記第1の誘電体層の上面に配置された前記導体パターンの上面に接している請求項1乃至3のいずれか1項に記載のアンテナ一体型通信モジュール。
- 前記導体ピンの、長さ方向に直交する断面の形状及び面積は、長さ方向に関して一定である請求項1乃至4のいずれか1項に記載のアンテナ一体型通信モジュール。
- 前記アンテナ一体型通信モジュールは、複数の前記放射素子を含み、
複数の前記放射素子がアダプティブアレーアンテナを構成している請求項1乃至5のいずれか1項に記載のアンテナ一体型通信モジュール。 - 前記第2の誘電体層の上面が、平坦な領域と、前記平坦な領域に連続する傾斜領域とを含み、前記平坦な領域の法線方向と、前記傾斜領域の法線方向とが、前記第2の誘電体層から遠ざかるに従って相互に離れる向きに前記傾斜領域が傾斜しており、前記平坦な領域と前記傾斜領域とに、それぞれパッチアンテナとして動作する複数の前記放射素子が配置されている請求項6に記載のアンテナ一体型通信モジュール。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015183533 | 2015-09-17 | ||
JP2015183533 | 2015-09-17 | ||
PCT/JP2016/075695 WO2017047396A1 (ja) | 2015-09-17 | 2016-09-01 | アンテナ一体型通信モジュール及びその製造方法 |
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JPWO2017047396A1 JPWO2017047396A1 (ja) | 2018-06-28 |
JP6593444B2 true JP6593444B2 (ja) | 2019-10-23 |
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JP2017539823A Active JP6593444B2 (ja) | 2015-09-17 | 2016-09-01 | アンテナ一体型通信モジュール |
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US (1) | US11081804B2 (ja) |
JP (1) | JP6593444B2 (ja) |
CN (1) | CN108028249B (ja) |
WO (1) | WO2017047396A1 (ja) |
Families Citing this family (46)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10361476B2 (en) * | 2015-05-26 | 2019-07-23 | Qualcomm Incorporated | Antenna structures for wireless communications |
US10205224B2 (en) * | 2016-09-23 | 2019-02-12 | Apple Inc. | Electronic device with millimeter wave antenna arrays |
JP6874829B2 (ja) * | 2017-04-07 | 2021-05-19 | 株式会社村田製作所 | アンテナモジュールおよび通信装置 |
EP3631894B1 (en) * | 2017-06-20 | 2022-03-02 | Viasat, Inc. | Antenna array radiation shielding |
WO2019008913A1 (ja) | 2017-07-06 | 2019-01-10 | 株式会社村田製作所 | アンテナモジュール |
US20200203851A1 (en) * | 2017-08-01 | 2020-06-25 | Hitachi Metals, Ltd. | Multiaxial antenna, wireless communication module, and wireless communication device |
KR102494338B1 (ko) * | 2017-11-08 | 2023-02-01 | 삼성전기주식회사 | 안테나 모듈 |
JP2019097026A (ja) * | 2017-11-22 | 2019-06-20 | 株式会社村田製作所 | 無線通信モジュール |
WO2019143369A1 (en) * | 2018-01-22 | 2019-07-25 | Hewlett-Packard Development Company, L.P. | Display device |
US10594028B2 (en) * | 2018-02-13 | 2020-03-17 | Apple Inc. | Antenna arrays having multi-layer substrates |
KR102003840B1 (ko) * | 2018-03-12 | 2019-07-25 | 삼성전자주식회사 | 안테나 모듈 |
US10396470B1 (en) * | 2018-03-16 | 2019-08-27 | Peraso Technologies Inc. | Wireless system architecture with dependent superstrate for millimeter-wave phased-array antennas |
JP2019176202A (ja) * | 2018-03-26 | 2019-10-10 | 富士通コンポーネント株式会社 | 無線モジュール |
KR102069236B1 (ko) * | 2018-04-23 | 2020-01-22 | 삼성전기주식회사 | 안테나 모듈 |
US10957982B2 (en) * | 2018-04-23 | 2021-03-23 | Samsung Electro-Mechanics Co., Ltd. | Antenna module formed of an antenna package and a connection member |
US10854978B2 (en) | 2018-04-23 | 2020-12-01 | Samsung Electro-Mechanics Co., Ltd. | Antenna apparatus and antenna module |
KR102085791B1 (ko) * | 2018-04-23 | 2020-03-06 | 삼성전기주식회사 | 안테나 장치 및 안테나 모듈 |
DE102019107258A1 (de) * | 2018-05-24 | 2019-11-28 | Samsung Electronics Co., Ltd. | Phased-array-antennenmodul und kommunikationsvorrichtung mit demselben |
WO2020008980A1 (ja) * | 2018-07-03 | 2020-01-09 | 株式会社村田製作所 | アンテナ装置 |
KR102549921B1 (ko) * | 2018-07-17 | 2023-06-29 | 삼성전기주식회사 | 칩 안테나 모듈 |
CN109149068B (zh) * | 2018-08-12 | 2021-04-02 | 瑞声科技(南京)有限公司 | 封装天线系统及移动终端 |
US11637383B2 (en) * | 2018-08-24 | 2023-04-25 | Kyocera Corporation | Structure, antenna, wireless communication module, and wireless communication device |
US11831082B2 (en) * | 2018-08-24 | 2023-11-28 | Kyocera Corporation | Structure, antenna, wireless communication module, and wireless communication device |
WO2020054001A1 (ja) * | 2018-09-12 | 2020-03-19 | 三菱電機株式会社 | 空中線 |
JP7328070B2 (ja) * | 2018-11-02 | 2023-08-16 | 京セラ株式会社 | アンテナ、アレイアンテナ、無線通信モジュール、および無線通信機器 |
CN112106250B (zh) | 2019-02-20 | 2021-07-09 | 株式会社村田制作所 | 天线模块和搭载该天线模块的通信装置以及天线模块的制造方法 |
CN113519091B (zh) * | 2019-03-04 | 2022-10-25 | 株式会社村田制作所 | 通信装置 |
US11223101B2 (en) * | 2019-03-12 | 2022-01-11 | Murata Manufacturing Co., Ltd. | Antenna device, antenna module, and communication apparatus |
KR102137198B1 (ko) | 2019-03-18 | 2020-07-24 | 삼성전기주식회사 | 안테나 장치, 안테나 모듈 및 그에 배치되는 칩 패치 안테나 |
CN111725623A (zh) * | 2019-03-20 | 2020-09-29 | 三星电机株式会社 | 片式天线模块和电子装置 |
JP6883059B2 (ja) * | 2019-04-18 | 2021-06-09 | 株式会社フジクラ | アンテナ |
JP7059385B2 (ja) * | 2019-04-24 | 2022-04-25 | 株式会社村田製作所 | アンテナモジュールおよびそれを搭載した通信装置 |
KR102461628B1 (ko) * | 2019-06-26 | 2022-11-01 | 삼성전기주식회사 | 안테나 장치 |
KR102134752B1 (ko) * | 2019-06-26 | 2020-07-16 | 삼성전기주식회사 | 안테나 장치 |
KR102207150B1 (ko) | 2019-06-26 | 2021-01-25 | 삼성전기주식회사 | 안테나 장치 |
KR102461629B1 (ko) * | 2019-06-26 | 2022-11-01 | 삼성전기주식회사 | 안테나 장치 |
JP7367381B2 (ja) * | 2019-08-20 | 2023-10-24 | 富士通株式会社 | パッケージ基板及び電子機器 |
JP7342571B2 (ja) * | 2019-09-27 | 2023-09-12 | 日本電気株式会社 | フェーズドアレイアンテナ装置及びその制御方法 |
EP4068500A4 (en) * | 2019-12-19 | 2022-11-30 | Huawei Technologies Co., Ltd. | ANTENNA IN HOUSING DEVICE AND WIRELESS COMMUNICATIONS DEVICE |
US11362049B2 (en) | 2019-12-31 | 2022-06-14 | Advanced Semiconductor Engineering, Inc. | Semiconductor device package |
US11639993B2 (en) | 2020-01-29 | 2023-05-02 | Panasonic Intellectual Property Management Co., Ltd. | Radar apparatus |
KR20210105513A (ko) | 2020-02-19 | 2021-08-27 | 삼성전기주식회사 | 고주파 모듈 |
WO2021261618A1 (ko) * | 2020-06-25 | 2021-12-30 | 엘지전자 주식회사 | 5g 안테나를 구비하는 전자 기기 |
US11923621B2 (en) | 2021-06-03 | 2024-03-05 | Apple Inc. | Radio-frequency modules having high-permittivity antenna layers |
US20220393346A1 (en) * | 2021-06-04 | 2022-12-08 | Innolux Corporation | Electronic device |
KR20230011005A (ko) * | 2021-07-13 | 2023-01-20 | 동우 화인켐 주식회사 | 안테나 패키지 및 이를 포함하는 화상 표시 장치 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05110325A (ja) | 1991-10-15 | 1993-04-30 | Matsushita Electric Works Ltd | 移動体通信用アンテナ |
JP3308734B2 (ja) | 1994-10-13 | 2002-07-29 | 本田技研工業株式会社 | レーダーモジュール |
JP2001326319A (ja) | 2000-05-15 | 2001-11-22 | Hitachi Ltd | アンテナ素子一体型高周波回路モジュール |
JP2004260786A (ja) * | 2003-02-05 | 2004-09-16 | Fujitsu Ltd | アンテナ素子、平面アンテナ、配線基板及び通信装置 |
JP2005260875A (ja) * | 2004-03-15 | 2005-09-22 | Yokowo Co Ltd | 表面実装型パッチアンテナおよびその実装方法 |
US7053833B2 (en) * | 2004-07-22 | 2006-05-30 | Wistron Neweb Corporation | Patch antenna utilizing a polymer dielectric layer |
JP2007124201A (ja) * | 2005-10-27 | 2007-05-17 | Kyocera Corp | アンテナモジュール |
JP4775574B2 (ja) * | 2006-09-06 | 2011-09-21 | ミツミ電機株式会社 | パッチアンテナ |
US8706049B2 (en) * | 2008-12-31 | 2014-04-22 | Intel Corporation | Platform integrated phased array transmit/receive module |
JP5522386B2 (ja) * | 2010-04-27 | 2014-06-18 | ミツミ電機株式会社 | パッチアンテナおよびその製造方法 |
US8830127B2 (en) * | 2010-11-18 | 2014-09-09 | Casio Computer Co., Ltd | Patch antenna and method of mounting the same |
KR20130084124A (ko) | 2012-01-16 | 2013-07-24 | 삼성전자주식회사 | 통신장치 |
US9819098B2 (en) * | 2013-09-11 | 2017-11-14 | International Business Machines Corporation | Antenna-in-package structures with broadside and end-fire radiations |
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US11081804B2 (en) | 2021-08-03 |
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