JP6587582B2 - Conductive connection device - Google Patents

Description

  The present invention relates to a conductive connection device for connecting another conductor to a minute terminal such as an electrode of a semiconductor device.

  There are various configurations of conductive connection devices as devices for connecting electrodes. For example, a probe used for inspection in a so-called semiconductor pre-process for determining the quality of a semiconductor device in the state of a semiconductor wafer is one of the conductive connection devices. Further, the socket used in the inspection in the subsequent process of the semiconductor device is also a conductive connection device. Furthermore, general plugs and sockets are also conductive connection devices.

  Among various conductive connection devices, a conductive connection device having an extremely fine structure is a conductive connection device in the field of semiconductor devices. The simplest conductive connection device in this field is wire bonding, in which the tip of the wire is melted and joined to the electrode of the semiconductor device. It is difficult to operate. For this reason, the electrode of the semiconductor device is an electrode with a protruding shape such as a copper post and a copper pillar, and a conductive member having a low melting point is provided at the tip of the electrode, and the conductive member is solidified and joined after melting. (Patent Document 1).

In addition, there is a proposal of a hollow connection portion that accepts an electrode having a protruding shape (Patent Document 2).
This is to join the electrode of the shape protruding to the hollow connection portion, after providing a low melting point conductive member between the hollow connection portion and the electrode in advance Heating is performed to melt and bond the conductive member.
In the case of a large structure, various structures can be adopted, but the structure that can be used is limited in the conductive connection device that connects the other conductive member to the electrode having a size of several microns to several tens of microns. .

Japanese Patent Laying-Open No. 2015-88534 JP 2010-80962 A

  As shown in Patent Document 1 and Patent Document 2, when using an electrode having a shape in which a connection terminal protrudes, a low melting point conductive member is interposed and fixed in order to ensure electrical connection. However, when this connection is disconnected, it is necessary to heat and melt the conductive member, which is troublesome. In addition, when there are a large number of protruding electrodes, it is necessary to apply weight after contact with some of the electrodes to bring all the electrodes into contact, and an excessive force is applied to the electrodes that were in contact. There has been a problem that the electrode is deformed or broken. The excessive force applied to the electrode also applies a force to the substrate on which the electrode is provided, causing a problem of deformation of the substrate. Further, there is a problem in that special treatment is required once the connected conductive members are pulled apart.

  An object of the present invention is to eliminate the above-described problems with respect to a conductive member (connected member) protruding like a pillar and to provide a conductive connection device having a more effective structure. Is.

In the conductive connection device of the present invention, a conductive connector is provided on a substrate, and the conductive connector is arranged upright on the pedestal so as to surround a pedestal and a hollow portion that receives the protruding connected member, A plurality of conductive columns that can be bent so as to be pressed toward the inside of the hollow portion, and the pedestal has a shape dug down with an inner portion of a support portion of the conductive column, A side surface of the member to be connected is pressed by a conductive column.

In the conductive connection device according to the present invention, when a protruding member to be connected is inserted into a hollow portion surrounded by a plurality of conductive columns arranged upright on a pedestal, the side surface of the connected member is connected to the plurality of conductive columns. It is configured so that it is pressed by the pedestal, and the pedestal has a shape that is dug down with the inside portion of the support portion of the conductive pillar being flush with each other, so that it occurs when the connected member is inserted into the hollow portion of the conductive connector there is an effect that the stress concentration Ru to relax.

It is sectional drawing which shows the electrically conductive connection apparatus of Embodiment 1 of this invention. It is a perspective view which shows the to-be-connected member of Embodiment 1 of this invention. It is a perspective view which shows the structure of the electrically conductive connector of Embodiment 1 of this invention. It is a perspective view which shows the structure of the electrically conductive connector of Embodiment 1 of this invention. It is a partial cross section perspective view of the conductive connector of Embodiment 1 of this invention. It is a characteristic view of the conductive connector of Embodiment 1 of this invention. It is a perspective view which shows the structure of the conductive connector of Embodiment 2 of this invention. It is the schematic which shows the shape change of the electrically conductive connector of Embodiment 2 of this invention. It is a perspective view which shows the structure of the conductive connector of Embodiment 3 of this invention. It is a top view which shows arrangement | positioning of the conductive connector of Embodiment 4 of this invention. It is a top view which shows arrangement | positioning of the conductive connector of Embodiment 5 of this invention.

Embodiment 1
Hereinafter, a conductive connection device according to Embodiment 1 of the present invention will be described with reference to FIG. In the drawings, the same reference numerals denote the same or corresponding parts.
FIG. 1 is a schematic cross-sectional view illustrating a configuration of a conductive connection device 100 according to the first embodiment. As shown in FIG. 1, the conductive connection device 100 has a structure in which a conductive connector 102 is provided on a substrate 101. The conductive connector 102 includes a pedestal 21 and a plurality of conductive pillars 22 that are disposed on the pedestal 21 in a self-supporting manner. The board 101 is provided with electrical wiring (not shown), and the base 21 of the conductive connector 102 is connected to the electrical wiring. For the sake of explanation, the space of the central portion of the pedestal 21 is designated as the hollow portion 23. The plurality of conductive columns 22 are arranged so as to surround the hollow portion 23. The connected body 200 has a structure in which a connected member 202 is provided so as to protrude from the connected body substrate 201. An electrical wiring (not shown) is provided on the connected substrate 201, and a connected member 202 is connected to the electrical wiring.

As the shape of the connected member 202, there are various shapes, and examples thereof include those shown in FIG. 2A shows a cylindrical shape, FIG. 2B shows a shape in which a hemispherical member is attached to the tip of the cylindrical shape, FIG. 2C shows a shape in which the hemispherical shape of the tip is sharpened, and FIG. Represents the shape of a quadrangular prism. As the shape of the connected member 202, a polygonal columnar shape can be used.
The to-be-connected member 202 is accurately arranged on the to-be-connected body substrate 201, but the conductive connector 102 is provided on the substrate 101 of the conductive connecting device 100 in accordance with the arrangement of the to-be-connected member 202.

The conductive connector 102 is configured to guide the opposite connected member 202 to the hollow portion 23 by the conductive pillar 22 and hold the connected member 202 so as to be wrapped in the region of the hollow portion 23. That is, the conductive column 22 of the conductive connector 102 is formed of an elastic conductive material such as a nickel alloy.
The connected member 202 has a columnar shape as shown in FIG. 2 and has a diameter of about 20 μm to 30 μm and a length of about 30 μm to 40 μm.
On the other hand, the depth of the hollow portion 23 is set to a dimension longer than the length of the member to be connected 202 so as not to contact the surface of the base 21 even if the member to be connected 202 is inserted. For example, the dimension from the surface of the base 21 to the tip of the conductive column 22 is set to about 50 μm to 100 μm.

An inclined portion 24 is provided at each distal end portion of the conductive column 22, and a pressing portion 25 that contacts the connected member 202 and presses the side surface of the connected member 202 on the base side of the inclined portion 24, and the connected portion A recess 26 is provided so as not to contact the member 202. The conductive column 22 is arranged so that the inclined portion 24 at the tip portion is directed toward the center of the hollow portion 23. Therefore, as shown in FIG. 1, when the conductive connection device 100 and the connected body 200 face each other and approach each other and the connected member 202 contacts the tip of the conductive column 22, the tip of the connected member 202 is inclined. Guided by the part 24 and inserted into the hollow part 23. When the distal end of the connected member 202 is inserted into the hollow portion 23, the connected member 202 acts so as to push away the conductive column 22, and the distal end portion of the conductive column 22 bends toward the outside of the hollow portion 23. On the other hand, since the elastic force is applied to the connected member 202 from the plurality of conductive columns 22, the connected member 202 is wrapped by the plurality of conductive columns 22 and is held by receiving pressure from the pressing portion 25. It becomes a state.
That is, electrical conduction is started when the tip of the connected member 202 contacts the tip of the conductive column 22, and the electrical conduction is stable when the side surface of the connected member 202 is sandwiched between the plurality of conductive columns 22. become.

  In this conductive connection device 100, the connected member 202 receives some resistance from the inclined portion 24 of the conductive column 22 at the time of insertion. However, once inserted, the connected member 202 receives a pressing force from the pressing portion 25 on the side surface. Therefore, after receiving the resistance force against insertion, the force applied to the connected member 202 becomes a substantially constant pressing force against the side surface, and the pressing force depends on the depth of insertion of the connected member 202 into the hollow portion 23. It doesn't change even if it changes.

The external shape of the pedestal 21 of the conductive connector 102 of the conductive connection device 100 may be either a prismatic shape or a cylindrical shape as shown in FIGS.
In the structure of the conductive connector 102 shown in FIGS. 3 and 4, a plurality of conductive columns 22 are provided around the pedestal 21, and the pedestal 21 has a shape in which an inner portion of a support portion of the conductive column 22 is dug down. ing. That is, the inner side (hollow part 23 side) of the conductive pillar 22 is formed in a flat shape. By digging down the pedestal 21 and making the inner surface of the conductive column 22 flush, stress concentration generated when the connected member 202 is inserted into the hollow portion 23 of the conductive connector 102 can be reduced. When the connected member 202 is inserted into the hollow portion 23, the conductive column 22 is deformed, but the stress at that time is concentrated at the place where the shape changes. However, as in this embodiment, the pedestal 21 is dug down so that the inner surface of the conductive column 22 is flush, so that the stress at the portion attached to the pedestal 21 is relieved.

Here, the flush surface means that the inner surface of the conductive pillar 22, that is, the surface facing the hollow portion 23 is flush, as shown in a partially broken perspective view in FIG. It is. FIG. 5A shows the same surface in a state where the pedestal 21 is dug down in accordance with the surface of the conductive column 22 so as to be the same surface as the pedestal 21. 5B shows an example in which the side facing the hollow portion 23 of the conductive column 22 is configured so that the surface indicated by the arrow in the drawing is flush with the base 21, regardless of the base 21.
Although the description has been made assuming that the pedestal 21 is provided with the conductive pillars 22, as is apparent from the structure shown in FIGS. 3 and 4, the pedestal 21 may be configured by integrating a plurality of conductive pillars 22. If it satisfies the actual function.

  In the first embodiment, the basic shape of the conductive connector 102 of the conductive connection device 100 is shown. In the first embodiment, the conductive pillar 22 arranged around the side surface of the connected member 202 inserted into the hollow portion 23 is pressed. Therefore, it is desirable that the number of the conductive pillars 22 is two or more, and the pressing force by the respective conductive pillars 22 is balanced at the center of the hollow portion 23. That is, it is desirable to set the vector sum by the conductive pillar 22 to be zero at the center of the hollow portion 23, and by doing so, the to-be-connected member 202 can be prevented from being twisted.

Next, an operation state when the connected member 202 is inserted into the hollow portion 23 of the conductive connector 102 will be described with reference to FIG.
FIG. 6 is a characteristic diagram showing an operation analysis result of the conductive connector 102. Here, the case where the distance from the front-end | tip of the conductive connector 102 to the surface of the base 21 is 40 micrometers is shown. FIG. 6A is a layout diagram showing the positional relationship between the connected member 202 and the conductive connector 102. FIG. 6B is a characteristic diagram showing the Z reaction force. The Z reaction force represents the force (gripping force) with which the conductive connector 102 grips the connected member 202. That is, no gripping force is generated until the connected member 202 contacts the tip of the conductive connector 102, but a substantially constant force is applied by the pressing portion 25 after contacting the inclined portion 24. Appears. FIG. 6C is a characteristic diagram showing a Y reaction force. The Y reaction force represents the force with which the conductive connector 102 tries to push back the connected member 202. That is, pressure is applied in a state where the connected member 202 is in contact with the inclined portion 24 of the conductive connector 102, but almost no resistance is generated after passing through the inclined portion 24. FIG. 6D is a characteristic diagram showing stress in the conductive column 22 of the conductive connector 102. That is, after the connected member 202 contacts the tip of the conductive connector 102, the conductive column 22 is deformed and stress is generated until it passes through the inclined portion 24 and the pressing portion 25. Will never grow.

  The characteristic diagram of FIG. 6 is a characteristic diagram in a state where a columnar connected member 202 having a diameter of 22 μm is inserted into the conductive connector 102 having an opening diameter between the conductive columns 22 of 18 μm. As is apparent from FIG. 5, in the case of the conductive connector 102 shown in the first embodiment, the characteristics are substantially determined when the connected member 202 passes through the pressing portion 25 of the conductive column 22, and the connected Once the member 202 is inserted, there is little change in properties.

Embodiment 2
As a configuration of the conductive connector 102 of the conductive connection device 100, a plurality of conductive pillars 22 are arranged on the base 21 around the hollow portion 23 of the base 21. As shown in FIG. 7, the conductive connector 102 has a structure in which the base portions of the plurality of conductive pillars 22 are coupled by the pedestal 21 so that the conductive pillars 22 protrude from the pedestal 21. Thus, the dimension of a cross-sectional area can be set by setting the dimension of the radial direction from the hollow part 23, without changing the distance of the adjacent conductive pillar 22 for the several conductive pillar 22, and conducting. The elastic force of the column 22 can be set. By adopting such a shape, the Z reaction force shown in FIG. 6B and the Y reaction force shown in FIG. 6C can be set.

  Further, the conductive column 22 having the shape shown in FIG. 7 is set so that the ratio of the “dimension in the direction of bending” and the “dimension in the direction perpendicular to the direction of bending” of the cross-sectional shape is 50% or more. . This dimensional ratio is an example, and various values can be set. The gripping force shown in FIG. 6B can be set by setting the “dimension in the bending direction”. In other words, the “dimension in the direction of bending” is the thickness of the conductive column 22, and when the conductive column 22 is bent, compression occurs outside the thickness of the conductive column 22, and tensile stress is generated inside, thus greatly contributing to the stress. Therefore, the thickness of the conductive column 22 cannot be increased. However, when the bending amount is small, increasing the thickness of the conductive column 22 until the stress limit is reached is an improvement measure for increasing the needle pressure and the holding force. .

  The “dimension in the direction perpendicular to the bending direction” is the width of the conductive column 22, and even when the width of the conductive column 22 is increased, the stress during bending does not change much. Therefore, it is effective to increase the width of the conductive column 22 when it is desired to increase the needle pressure and the gripping force with low stress. However, the width of the conductive column 22 cannot be increased so much due to the limitation of the overall dimensions of the conductive connector 102. From these conditions, as a measure for increasing the needle pressure, a measure for increasing the thickness of the conductive column 22 to the stress limit and forming a wall at the root of the conductive column 22 to disperse the stress is effective. It should be noted that stress distribution is effective when the wall thickness of the pedestal 21 that supports the conductive column 22 is made slightly thinner than the thickness of the conductive column 22, but if the wall thickness is increased, the stress distribution effect is lost.

Here are some example dimensions. A columnar conductive material having a diameter of 22 μm is used as the dimension of the member to be connected 202, the length of the conductive column 22 of the conductive connector 102 is 70 μm, the diameter of the opening of the space formed by the pressing portion 25 is 18 μm, and pressed The length of the portion 25 is 10 μm, the aforementioned “dimension in the direction of bending” is 9 μm, and the “dimension in the direction perpendicular to the bending direction” is 16 μm, and the connected member 202 is pressed against the conductive connector 102, When proceeding to be inserted, as shown in FIG. 8A, the conductive column 22 is deformed as shown by the broken line while receiving the pressing force of the connected member 202 at the inclined portion 24, thereby changing the connected member 202 into the hollow portion 23. Accept.
The inner diameter of the hollow portion 23 is set larger than the thickness of the connected member 202. Therefore, the connected member 202 only receives pressure to be tightened from the pressing portion 25 of the conductive column 22 and does not receive any other force.

  The deformation of the conductive column 22 that occurs when the conductive connector 102 receives the connected member 202 is shown in FIG. 8B. When the conductive column 22 has a length of 70 μm, the pressing portion 25 contacts the side surface of the connected member 202. In this state, since the diameter of the opening by the conductive pillar 22 is 18 μm and the diameter of the connected member 202 inserted therein is 22 μm, the pressing portion 25 of the conductive pillar 22 in the opening is deformed by 2 μm in the radial direction. Will be. Here, the numerical values of the length of 70 μm and the deformation amount of 2 μm are important. For example, if the diameter of the opening portion of the conductive connector 102 is reduced, the amount of deformation increases, and the region of elastic deformation of the conductive column 22 is exceeded and is destroyed or cannot be restored. The deformation of the conductive column 22 depends on various parameters depending on the shape and material of the conductive column 22, but as a minimum condition, the length (L) of the conductive column 22 and the deformation amount (ΔN) The relationship is preferably 0.01 ≦ (ΔN / L) ≦ 0.10.

This is determined by the dimension of the diameter of the connected member 202, the dimension of the opening of the conductive column 22, and the length of the conductive column 22. When the value is smaller than the minimum value, the pressing force by the conductive column 22 is too small. When the value is larger than the maximum value, the amount of deformation is too large and the conductive column 22 is broken.
Further, as shown in FIG. 8C, when the pressing portion 25 of the conductive column 22 receives the connected member 202, in order to be in a state shown by a broken line, it is inclined inward in advance by the inclination θ due to the deformation amount. If it is made the shape, the contact between the pressing portion 25 and the side surface of the connected member 202 is close to the surface contact.

Embodiment 3
FIG. 9 further shows a configuration for setting the elastic force of the conductive connector 102 of the conductive connection device 100.
In the structure shown in FIG. 9, the shape of the conductive column 22 is changed, and the tip portion is reduced with respect to the root portion of the conductive column 22. That is, the conductive column of the conductive connector has a shape in which the root portion has a larger cross-sectional area than the tip portion, and by adopting such a shape, only the maximum stress is obtained without reducing the Y reaction force. Can be reduced.

Embodiment 4
The conductive connector 102 having the structure shown in FIGS. 7 and 9 is a single structure, and a plurality of the conductive connectors 102 are arranged on the substrate 101 to correspond to the electrodes of the semiconductor device. When this state is represented by a cross-sectional view, it is as shown in FIG. 1, but when this state is represented by a plan view, it is arranged as shown in FIG.
FIG. 10 is a plan view when a plurality of conductive connectors 102 are arranged on the substrate 101. The plan view shown in FIG. 10 shows a state in which a plurality of conductive connectors 102 are arranged in a matrix so that the side surfaces of the base 21 are aligned. As a result, conductive connection can be made corresponding to the plurality of connected members 202.

Embodiment 5
In the case of the conductive connector 102 having the structure shown in FIG. 10, the conductive column 22 may be deformed by the insertion of the connected member 202, and the conductive columns 22 of the adjacent conductive connectors 102 may come into contact with each other. As shown in FIG. 11, the contact problem due to the deformation of the conductive pillar 22 is formed in a matrix shape with the conductive connectors 102 rotated on the substrate 101 and the respective conductive connectors 102 rotated at a predetermined angle. To deal with it That is, in the fifth embodiment, the conductive connectors 102 are arranged on the substrate 101 in a matrix with the respective conductive connectors 102 rotated by 45 degrees, and the bending deformation of the respective conductive columns 22 is Consideration is given so that the conductive columns 22 of the adjacent conductive connectors 102 do not come into contact with each other and occur inside the space formed by the adjacent conductive connectors 102.

  Note that the present invention can be freely combined with any embodiment within the scope of the invention, and any component of the embodiment can be changed or omitted as appropriate.

21 pedestal, 22 conductive pillar, 23 hollow part, 24 inclined part,
25 pressing portion, 26 recess, 100 conductive connecting device, 101 substrate,
102 conductive connector, 200 connected body, 201 connected body substrate,
202 Connected member

Claims (2)

A conductive connector is provided on the board, and the conductive connector is arranged on the base so as to surround the base and the hollow part that receives the protruding connected member, and toward the inside of the hollow part. A plurality of conductive columns that can be bent so that each of them is pressed, and the pedestal has a shape that is dug down with an inner portion of a support portion of the conductive column being flush with the conductive column, A conductive connecting device characterized in that the side surface is pressed. A conductive connector is provided on the board, and the conductive connector is arranged on the base so as to surround the base and the hollow part that receives the protruding connected member, and toward the inside of the hollow part. A plurality of conductive columns that can be bent so as to be pressed, and the relationship between the length (L) of the conductive column and the deformation amount (ΔN) of the bending is 0.01 ≦ (ΔN / L) ≦ 0. 10. The conductive connection device according to claim 10, wherein a side surface of the connected member is pressed by the conductive column.

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