JP6585764B2 - Semiconductor optical device and manufacturing method of semiconductor optical device - Google Patents

Description

  The present invention relates to a semiconductor optical device such as a semiconductor laser device and a method for manufacturing the semiconductor optical device.

  With the explosive growth of the Internet population in recent years, there has been a demand for rapid increase in information transmission and capacity, and optical communication will continue to play an important role in the future. A semiconductor laser element is mainly used as a light source used for optical communication. For short-distance applications up to a transmission distance of about 10 km, a direct modulation method in which a semiconductor laser is directly driven by an electric signal is used. Since this method can realize a module with a simple configuration, power consumption is low and the number of parts can be reduced, so that the cost can be reduced. On the other hand, for optical communication over a long distance exceeding a transmission distance of 10 km, it is not possible to cope with only by directly modulating a semiconductor laser. Therefore, an electro-absorption (EA) modulator integrated with an optical modulator is integrated. Type semiconductor laser elements are used.

  In order to increase the capacity of optical communication, it is necessary to further increase the communication speed of the semiconductor laser than at present. Since the modulation speed of the semiconductor laser is limited by the product of the element capacitance and the element resistance (CR time constant), it is necessary to reduce the element resistance or the element capacitance in order to further increase the speed.

  The basic structure of a semiconductor optical device is roughly classified into two types, a buried-hetero (BH) structure and a ridge wave-guide (RWG) structure. In general, a semiconductor optical device has an active layer such as a MQW (Multiple-Quantum-Well) layer that emits light by recombination of electrons and holes between a p-type cladding layer and an n-type cladding layer. In addition, a diffraction grating layer is formed in the cladding layer to make the oscillation spectrum into a single mode.

  In order to reduce the element resistance, it is effective to reduce the resistance of the p-type cladding layer using holes having lower mobility than electrons as carriers. Here, zinc (Zn) has been conventionally used as a dopant for the p-type cladding layer. As is known, Zn has a property of being easily diffused. If the doping concentration of the p-InP cladding layer is excessively increased to reduce device resistance, the amount of Zn diffused into the adjacent MQW layer will increase significantly, thereby increasing the loss component and degrading the characteristics of the semiconductor laser. End up.

  In particular, in an element having a BH structure, Zn is excessively diffused also in an insulating portion around the MQW layer and the insulating property is deteriorated, so that a current leakage path is formed, and the current flows around without being injected into the MQW layer. The current component that flows through increases. Therefore, when diffusion is taken into consideration, there is a limit to the Zn doping concentration, and there is a limit to the reduction in device resistance due to Zn.

  Non-Patent Document 1 reports Mg as a new dopant replacing Zn. It has been shown that by using Mg for the p-type cladding layer of AlGaInP material, it is possible to perform doping at a lower concentration and higher concentration than Zn.

  Patent Document 1 discloses a problem of doping delay in the case of using Mg as a p-type dopant in an AlGaInP-based material, and a mixed gas of an organometallic compound of Mg and an organometallic compound of Al as a p-type impurity in MOVPE crystal growth. Is disclosed.

Japanese Patent Laid-Open No. 06-013334

IEEE Journal of Quantum Electronics, Vol. 40, No. 12, p. 1634, 2004

  In a semiconductor optical device for optical communication, a wavelength region of 1300 to 1550 nm is generally used. In order to use this wavelength region, an AlGaInP system which is a premise in the above-mentioned Patent Document 1 and Non-Patent Document 1 is used. For example, an InP semiconductor made of In and a V group compound is used instead of the above semiconductor. In this case, when a layer doped with Mg instead of Zn is formed, if the semiconductor film containing Al proposed in Patent Document 1 and Non-Patent Document 1 is sandwiched, the lattice constant of the semiconductor film containing Al is sandwiched between them. Decreases, the difference between the lattice constant of the InP semiconductor film and the lattice constant increases, and lattice mismatching easily occurs. Particularly in a semiconductor element for optical communication, a diffraction grating is often formed, and an attempt is made to form a semiconductor film on which an Al is added on the diffraction grating, which has a high melting point and a small amount of atomic migration that fills the unevenness. In some cases, the irregularities of the diffraction grating tend to cause dislocations and crystal defects due to lattice mismatch. Furthermore, the addition of Al makes the band gap larger than that of InP, so that it becomes a barrier to the current flowing to the MQW layer and may increase resistance.

  The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a semiconductor optical device for optical communication in which device resistance is further reduced.

  In order to solve the above-mentioned problems, we have intensively studied and found that by inserting a layer containing Al prior to the formation of the Mg doping layer, it is possible to suppress the doping delay of the Mg doping layer that grows thereafter. . At the time of forming the Mg-doped layer, the organometallic compound of Al is not supplied at the same time. Therefore, disclosed in Patent Document 1 is that “the organometallic compound of Mg is formed by the mixed organometallic compound of Mg and the organometallic compound of Al. This is a different mechanism from that in which the properties change and the rate of adhesion to intermediate pipes and reaction tubes decreases. The mechanism that can suppress the doping delay by forming the Al-containing layer in advance has not been fully elucidated, but in the process of supplying the organic metal of Al, the organometallic compound of Mg that causes the doping delay is added. It is thought that the factors (impurities etc.) that make it easy to adhere to the pipes and reaction tubes on the way are reduced. Based on the above findings, the following has been invented.

  The semiconductor optical device according to the present invention includes an active layer that emits light by recombination of electrons and holes, a diffraction grating having a pitch determined according to an output wavelength of the emitted light, and formed on the diffraction grating. A semiconductor optical device comprising: a first semiconductor layer containing Al and made of an In and V group compound; and a second semiconductor layer made of In and a V group compound containing Mg and formed on the first semiconductor layer. .

Here, in the semiconductor optical device according to the present invention, the thickness of the first semiconductor layer can be 0.3 nm or more and 5 nm or less. The Al concentration of the first semiconductor layer may be 1 × 10 ^{16 to} 1 × 10 ²⁰ cm ⁻³ .

The semiconductor optical device according to the present invention includes an active layer that emits light by recombination of electrons and holes, and a first semiconductor comprising Al and 1 × 10 ^{16 to} 1 × 10 ²⁰ cm ⁻³ and comprising In and V group compounds. A semiconductor optical device comprising: a layer; and a second semiconductor layer formed on the first semiconductor layer and made of In and V group compounds containing Mg.

  The semiconductor optical device according to the present invention may further include a diffraction grating having a pitch determined according to an output wavelength of the emitted light. The first semiconductor layer may have a thickness of 0.3 nm to 5 nm.

  The method of manufacturing a semiconductor optical device of the present invention includes an active layer forming step of forming an active layer that emits light by recombination of electrons and holes, and a diffraction grating having a pitch determined according to the output wavelength of the emitted light. Forming a diffraction grating, forming a first semiconductor layer formed on the diffraction grating and including at least Al and made of In and a group V compound; and on the first semiconductor layer And a second semiconductor layer forming step of forming a second semiconductor layer made of In and a V group compound containing Mg, and a semiconductor optical device manufacturing method.

In the method for manufacturing a semiconductor optical device of the present invention, the thickness of the first semiconductor layer may be 0.3 nm or more and 5 nm or less. The Al concentration of the first semiconductor layer may be 1 × 10 ^{16 to} 1 × 10 ²⁰ cm ⁻³ .

  For example, an AlInP layer having a very thin film thickness and an Al concentration of a doping level is formed on the outermost surface of the base substrate having the diffraction grating layer, and subsequently an Mg-doped InP layer is formed. As a result, Mg can be doped without delay. Further, since the introduced Al concentration is very low and the AlInP layer is very thin, it does not affect the lattice mismatch or the band structure.

  When an Al-containing semiconductor layer is formed, Mg organic metal is not supplied at the same time according to the present invention, but after subsequent Mg crystal growth of the Mg-doped layer, the doped Mg diffuses into the Al-containing semiconductor layer, and Mg May be mixed in the semiconductor layer containing Al. It goes without saying that this case is also included in the present invention and the effect is obtained.

  Furthermore, the first semiconductor formation step may be a part of a series of steps of the second semiconductor layer formation step. For example, when forming an organic metal containing Al in the crystal growth furnace before reaching the growth temperature of the second semiconductor layer when forming the second semiconductor layer made of In and V group compounds containing Mg It may be. In this case, if the Al-containing layer is formed by Al atoms remaining in the crystal growth furnace before the second semiconductor layer is formed and the desired Al concentration and film thickness are obtained, the effect of the present invention is achieved. can get. Further, when supplying the organic metal containing Al, even if Mg organic metal is supplied at the same time, since the growth temperature of the second semiconductor layer has not been reached, Mg is hardly taken into the layer containing Al. After reaching the growth temperature, the second semiconductor layer containing Mg is formed. However, as described above, Mg may diffuse into the semiconductor layer containing Al after growth.

  According to the semiconductor optical device and the method for manufacturing the semiconductor optical device of the present invention, the device resistance can be further reduced.

1 is a diagram schematically showing an edge-emitting semiconductor laser device that is a semiconductor optical device according to Example 1 of the present invention. FIG. FIG. 2 is a partial cross-sectional perspective view for explaining the structure of the semiconductor laser device of FIG. 1. It is the schematic which expanded the part shown by A of FIG. FIG. 3 is a diagram schematically showing a manufacturing process of the semiconductor laser device of FIG. 2. 6 is a partial cross-sectional perspective view for explaining the structure of a semiconductor laser device according to Example 2. FIG. It is the schematic which expanded the part shown by B of FIG. FIG. 6 is a diagram schematically showing a manufacturing process of the semiconductor laser element of FIG. 5. 6 is a partial cross-sectional perspective view for explaining the structure of a semiconductor laser device according to Example 2. FIG. It is the schematic which expanded the part shown by B of FIG. FIG. 6 is a diagram schematically showing a manufacturing process of the semiconductor laser element of FIG. 5.

  Embodiments of the present invention will be described below with reference to FIGS. In the following example, only the semiconductor optical device on the InP substrate is described, but the present invention is also applicable to other III-V group compound semiconductor devices having the same structure.

  FIG. 1 schematically shows an edge-emitting semiconductor laser device 200 that is a semiconductor optical device according to a first embodiment of the present invention. As shown in this figure, the semiconductor laser element 200 outputs a laser beam 202 from the oscillation region 201 by causing a potential difference between two electrodes provided on opposing surfaces of a substantially rectangular parallelepiped shape.

  FIG. 2 is a partial cross-sectional perspective view for explaining the structure of the semiconductor laser device 200 of FIG. The semiconductor laser element 200 shown here is a DFB (Distributed Feedback) semiconductor laser element. FIG. 3 schematically shows an enlarged view of a portion indicated by A in FIG. 2, and FIG. 4 schematically shows a manufacturing process of the semiconductor laser element 200.

Hereinafter, the manufacturing process of the semiconductor laser device 200 will be described together with the configuration. First, in the buffer layer formation step S <b> 101, the n-InP buffer layer 303 is formed on the n-InP substrate 302. Next, in the active layer forming step S102, the MQW layer 306, which is an active layer made of InGaAsP and emits light by recombination of electrons and holes, is formed. Subsequently, in the diffraction grating forming step S103, the wavelength of the output light is changed. Accordingly, a diffraction grating 309 having a predetermined pitch is formed. Usually, a p-InP cap layer is formed on top for protection. After the diffraction grating formation step S103, in the first semiconductor layer formation step S104, an undoped AlInP layer 311 having a thickness of 1 nm, which is a first semiconductor layer containing Al and made of In and a V group compound, is formed. It can be determined as appropriate in the range of 5 nm or less. This is a film thickness at the atomic layer level, and is set to a thin film thickness that hardly becomes a barrier for conducting carriers. By adopting such a structure, the doping delay can be suppressed and the inserted Al-containing layer has no influence on the crystal structure after the Mg doping layer to be formed next, so that the element structure almost as originally designed. Can be formed. Further, the Al concentration at this time is 1 × 10 ¹⁷ cm ⁻³ , but can be appropriately determined within a range of 1 × 10 ^{16 to} 1 × 10 ²⁰ cm ⁻³ . Here, the lower limit concentration was determined because the effect was obtained up to the measurement limit of the current atomic concentration detection analysis (for example, secondary ion mass spectrometry). The upper limit concentration is determined from the critical value of occurrence of lattice mismatch dislocations in the underlying substrate having irregularities.

Subsequently, the diffraction grating 309 is embedded by the upper p-InP cladding layer 307 which is the second semiconductor layer made of Mg and doped In and V group compounds (second semiconductor layer forming step S105), and p ⁺ -InGaAs is continuously formed. A contact layer 308 is formed (contact layer forming step S106). At this time, no doping delay was observed in the upper p-InP cladding layer 307 due to the insertion of the AlInP layer 311. Subsequently, in the mesa structure forming step S107, a mesa stripe mask is formed in such a multilayer structure, and portions other than the mesa structure are removed by etching, and then appropriate pretreatment is performed, and the Ru-doped InP layer 304 is embedded and grown. I do. At that time, CH ₃ Cl was added simultaneously. Thereafter, in the electrode forming step S108, the passivation film 310, the upper electrode 305, the lower electrode 301, and the like were formed using a normal device manufacturing method, and the semiconductor laser device 200 was completed.

  Here, in the first semiconductor layer formation step S104, the second semiconductor layer formation step S105, and the Ru doping InP layer 304 formation step (S107), a metal-organic vapor phase epitaxy (MOVPE) method is used. Using. Hydrogen was used as the carrier gas. Trimethylaluminum (TMA), triethylgallium (TEG), and trimethylindium (TMI) were used as the group III element material. Arsine (AsH3) and phosphine (PH3) were used as the Group V element materials. Further, disilane (Si2H6) was used as the n-type dopant, and cyclopentadienyl magnesium (Cp2Mg) was used as the p-type dopant. As the halogen atom-containing gas to be added, methyl chloride (CH 3 Cl) was used, and as the organometallic raw material for Ru, bisethylcyclopentadienyl ruthenium was used. Note that the crystal growth method is not limited to MOVPE, but includes molecular beam epitaxy (MBE) method, chemical beam epitaxy (CBE) method, metal organic molecular beam epitaxy (MOMBE). The effects of the present invention can also be obtained by techniques such as the -organic Molecular Beam Epitaxy method.

  The threshold current of the semiconductor laser device 200 manufactured in this way was 15 mA at 85 ° C., and showed high light output characteristics exceeding 20 mW. Also, the element resistance was low and the modulation characteristics were good. Furthermore, the device characteristics did not deteriorate even during long-time operation, and high device reliability was shown. Also, the production yield of the semiconductor laser element 200 was high.

  FIG. 5 is a partial cross-sectional perspective view similar to FIG. 2 for illustrating the structure of the semiconductor laser device 400 according to the second embodiment. A semiconductor laser device 400 shown here is a modulator integrated semiconductor optical device, and each of a modulator portion, a waveguide portion, and a laser portion is formed in the semiconductor laser device 400. FIG. 6 schematically shows an enlarged view of the portion indicated by B in FIG. 5, and FIG. 7 schematically shows a manufacturing process of the semiconductor laser device 400. As the growth method, the MOVPE method was used as in Example 1. The raw material of the group III element is the same as in Example 1. Hydrogen chloride (HCl) was used as the halogen atom-containing gas to be added.

  Hereinafter, the manufacturing process of the semiconductor laser element 400 will be described together with the configuration. First, in the buffer layer forming step S <b> 201, the n-InP buffer layer 403 is formed on the n-InP substrate 402. Next, in the active layer / waveguide layer forming step S202, a modulator part MQW layer 404 made of InGaAlAs is grown. Usually, a p-InP cap layer is usually formed on the top for protection. Next, a mask pattern is formed at a desired location on the wafer. Using this as an etching mask, the p-InP cap layer and the modulator section MQW layer 404 are removed. Next, in the active layer diffraction grating forming step S203, the wafer is introduced into the growth furnace, and the laser part MQW layer 406, the diffraction grating 407, and the p-InP cap layer made of InGaAlAs are connected to the butt joint (BJ: Butt-Joint). ) Re-grow. Next, after removing the previous mask, a BJ mask is formed again at desired locations in the modulator section MQW layer 404 and the laser section MQW layer 406, and the MQW and p-InP cap layer are removed by etching. Further, the waveguide layer 405 made of InGaAsP and the p-InP cap layer are regrown BJ. Here, BJ connection was simultaneously performed at two locations of the modulator portion and the laser portion. After removing the wafer from the growth furnace, the mask is removed, and a diffraction grating 407 is formed on the laser unit MQW layer 406.

Thereafter, a p-InP clad layer 410, which is a second semiconductor layer doped with Mg, is grown. This step was performed according to the following procedure. First, the wafer is introduced into the furnace, and the wafer temperature is increased until the temperature reaches a temperature at which the p-InP cladding layer 410, which is the second semiconductor layer doped with Mg, can be grown. During this temperature rise, organometals of Al and Mg were supplied into the furnace body (first semiconductor formation step S204). as a result. An undoped AlInP layer 415 having a thickness of 0.5 nm, which is the first semiconductor layer, was formed. At this time, the organometallic Mg is supplied into the furnace, but is not taken into the AlInP layer due to the low wafer temperature, and becomes an undoped AlInP layer 415. The Al concentration at this time is 1 × 10 ¹⁹ cm ⁻³ , but can be appropriately determined within the range of 1 × 10 ^{16 to} 1 × 10 ²⁰ cm ⁻³ . Then, before or when the wafer temperature reaches a temperature at which the p-InP clad layer 410 as the second semiconductor layer can be grown, the supply of the organometallic metal of Al is stopped, and the entire surface of the wafer is doped with Mg. A p-InP cladding layer 410, which is a semiconductor layer, is grown (second semiconductor formation step S205). Subsequently, in the contact layer formation step S206, a p ⁺ -InGaAs contact layer is grown, and the crystal growth step is completed.

Due to the insertion of the AlInP layer 415, no doping delay was observed in the p-InP cladding layer 410. Subsequently, in the mesa structure forming step S207, a mesa stripe mask is formed in such a multilayer structure, and portions other than the mesa structure are removed by etching, and then appropriate pretreatment is performed, and the Ru-doped InP layer 408 is embedded and grown. I do. At that time, HCl gas was added simultaneously. In order to prevent return light due to reflection of the emitted light, the light emitting end on the modulator side is buried with a Ru-doped InP layer 408, which has a so-called window structure. After that, in the electrode forming step S208, the p ⁺ -InGaAs contact layer on the waveguide portion is removed, and the p ⁺ -InGaAs contact layer 412 in the modulator portion and the p-InGaAs contact layer 411 in the laser portion are separated. Then, the passivation film 413 was formed, the modulator upper electrode 414, the laser upper electrode 409, and the lower electrode 401 were formed using a normal device fabrication method, and the semiconductor laser device 400 was completed.

  The threshold current of the semiconductor laser device 400 fabricated in this way is 15 mA at 85 ° C., shows a good modulation characteristic of 10 GHz without a cooler in the range of −5 ° C. to 85 ° C., and can operate even for a long time. The characteristics did not deteriorate and showed high device reliability. Also, the production yield of the semiconductor laser device 400 was high. In addition, as MQW of a laser or a modulator, not only an InGaAlAs-based material but also an InGaAsP-based material or a material added with Sb or N can be used.

  FIG. 8 is a partial cross-sectional perspective view similar to FIG. 2 for illustrating the structure of the semiconductor laser device 500 according to the third embodiment. The semiconductor laser device 500 shown here is a back-emitting semiconductor optical device, and the device structure is called a planar BH structure. FIG. 9 schematically shows an enlarged view of a portion indicated by C in FIG. 8, and FIG. 9 schematically shows a manufacturing process of the semiconductor laser device 500. As the growth method, the MOVPE method is used here, however, the method is not limited thereto, and other methods may be used as long as the same effect can be obtained. The raw materials used are the same as in Examples 1-2.

Hereinafter, the manufacturing process of the semiconductor laser device 500 will be described together with the configuration. First, similarly to Example 1, in the buffer layer forming step S301, the active layer forming step S302, and the diffraction grating forming step S303, an n-InP buffer layer 503 and an InGaAlAs-based laser unit MQW are formed on the n-InP substrate 502. A layer 510 and a diffraction grating 511 are formed. At this time, in most cases, a p-InP cap layer is formed for surface protection. After forming the diffraction grating 511 by a normal process, in the first semiconductor layer forming step S304, an Al organic metal was supplied to form a non-doped AlInP layer 514 having a thickness of 0.3 nm. The Al concentration at this time is 1 × 10 ¹⁸ cm ⁻³ , but can be appropriately determined within a range of 1 × 10 ^{16 to} 1 × 10 ²⁰ cm ⁻³ . Subsequently, in the second semiconductor layer forming step S305, the thin first p-InP cladding layer 509 and the InGaAsP cap layer which are Mg-doped second semiconductor layers are embedded.

In the mesa structure forming step S306, a mesa stripe mask is formed in such a multilayer structure, and portions other than the mesa structure are removed by etching, and then appropriate pretreatment is performed to form the Ru-doped InP layer 504 according to the method of the present invention. And buried growth. At that time, CH ₃ Cl was added simultaneously. Next, after removing the mask and performing an appropriate pretreatment to remove the InGaAsP cap layer, in the second first semiconductor layer forming step S307, an organometallic metal of Al is supplied to form the thickness of the first semiconductor layer. A 5 nm thick non-doped AlInP layer 508 was formed. The Al concentration at this time was 1 × 10 ¹⁸ cm ⁻³ . Subsequently, in the second semiconductor layer formation step S308 for the second time, a second p-InP clad layer 505 and a p-InGaAsP contact layer 506, which are Mg-doped second semiconductor layers, were continuously formed. At that time, regrowth was performed under the condition that the unevenness due to the crystal plane formed by the Ru embedded growth was flattened. Thereafter, in the reflecting mirror / electrode forming step S309, a reflecting mirror 512 having an angle of 135 degrees is formed on the surface, a back lens 513 for converging outgoing light is formed on the back surface, and an upper electrode 507 and a lower electrode 501 are formed. The semiconductor laser device 500 was completed.

  The semiconductor laser device 500 thus fabricated had a low element resistance of 2 ohms and oscillated at a low threshold current of 10 mA even at 85 ° C. In addition, a good modulation characteristic of 10 GHz was exhibited without a cooler, and the element characteristics were not deteriorated even after long-time operation, and high element reliability was exhibited. Also, the production yield of the semiconductor laser device 500 was high.

200 Semiconductor laser device, 201 Oscillation region, 202 Laser light, 301 Lower electrode, 302 n-InP substrate, 303 n-InP buffer layer, 304 Ru-doped InP layer, 305 Upper electrode, 306 MQW layer, 307 Upper p-InP clad Layer, 308 p + -InGaAs contact layer, 309 diffraction grating, 310 passivation film, 311 undoped AlInP layer, 400 semiconductor laser element, 401 lower electrode, 402 n-InP substrate, 403 n-InP buffer layer, 404 modulator section MQW Layer, 405 waveguide layer, 406 laser part MQW layer, 407 diffraction grating, 408 Ru-doped InP layer, 409 laser part upper electrode, 410 p-InP cladding layer, 411 laser part p + -InGaAs contact layer, 412 modulation P + -I of the vessel GaAs contact layer, 413 passivation film, 414 modulator upper electrode, 415 undoped AlInP layer, 500 semiconductor laser element, 501 lower electrode, 502 n-InP substrate, 503 n-InP buffer layer, 504 Ru-doped InP layer, 505 Second p-InP cladding layer, 506 p + -InGaAs contact layer, 507 top electrode, 508 undoped AlInP layer, 509 first p-InP cladding layer, 510 MQW layer, 511 diffraction grating, 512 135 degree reflector, 513 Back lens, 514 Undoped AlInP layer.

Claims (4)

An active layer that emits light by recombination of electrons and holes;
A diffraction grating having a pitch determined according to an output wavelength of the emitted light;
A first semiconductor layer formed on and in contact with the diffraction grating, comprising at least Al, and comprising In and a group V compound;
A second semiconductor layer formed on the first semiconductor layer and made of In and V compounds containing Mg,
The thickness of the first semiconductor layer state, and are more 5nm or less 0.3 nm,
The concentration of Al in the first semiconductor layer is 1 × 10 ¹⁶ or more and 1 × 10 ²⁰ cm ⁻³ or less,
A semiconductor optical device. The semiconductor optical device according to claim 1 ,
The semiconductor optical device, wherein the first semiconductor layer is an AlInP layer, and the second semiconductor layer is an InP layer. An active layer forming step of forming an active layer that emits light by recombination of electrons and holes; a diffraction grating forming step of forming a diffraction grating having a pitch determined according to an output wavelength of the emitted light;
A first semiconductor layer forming step of forming a first semiconductor layer formed on and in contact with the diffraction grating and including at least Al and made of In and a V group compound;
A second semiconductor layer forming step of forming a second semiconductor layer formed on the first semiconductor layer and made of an In and V group compound containing Mg,
The thickness of the first semiconductor layer state, and are more 5nm or less 0.3 nm,
The concentration of Al in the first semiconductor layer is 1 × 10 ¹⁶ or more and 1 × 10 ²⁰ cm ⁻³ or less,
A method of manufacturing a semiconductor optical device. In the manufacturing method of the semiconductor optical device according to claim 3 ,
The method of manufacturing a semiconductor optical device, wherein the first semiconductor layer is an AlInP layer, and the second semiconductor layer is an InP layer.

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