JP6572979B2 - 製造設備診断支援装置及び製造設備診断支援方法 - Google Patents
製造設備診断支援装置及び製造設備診断支援方法 Download PDFInfo
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- JP6572979B2 JP6572979B2 JP2017565020A JP2017565020A JP6572979B2 JP 6572979 B2 JP6572979 B2 JP 6572979B2 JP 2017565020 A JP2017565020 A JP 2017565020A JP 2017565020 A JP2017565020 A JP 2017565020A JP 6572979 B2 JP6572979 B2 JP 6572979B2
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- 238000004519 manufacturing process Methods 0.000 title claims description 81
- 238000003745 diagnosis Methods 0.000 title claims description 75
- 238000000034 method Methods 0.000 title claims description 32
- 230000005856 abnormality Effects 0.000 claims description 106
- 238000001514 detection method Methods 0.000 claims description 73
- 238000003860 storage Methods 0.000 claims description 53
- 238000013480 data collection Methods 0.000 claims description 36
- 238000013075 data extraction Methods 0.000 claims description 19
- 238000004364 calculation method Methods 0.000 claims description 17
- 238000012544 monitoring process Methods 0.000 claims description 15
- 230000008859 change Effects 0.000 claims description 14
- 239000002994 raw material Substances 0.000 claims description 12
- 238000012545 processing Methods 0.000 claims description 7
- 239000000284 extract Substances 0.000 claims description 5
- 238000005096 rolling process Methods 0.000 description 81
- 239000000047 product Substances 0.000 description 34
- 230000006870 function Effects 0.000 description 20
- 239000000463 material Substances 0.000 description 11
- 238000000137 annealing Methods 0.000 description 5
- 230000002159 abnormal effect Effects 0.000 description 3
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- 238000010586 diagram Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 239000002436 steel type Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000005097 cold rolling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
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- 238000000513 principal component analysis Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Images
Classifications
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B23/00—Testing or monitoring of control systems or parts thereof
- G05B23/02—Electric testing or monitoring
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B23/00—Testing or monitoring of control systems or parts thereof
- G05B23/02—Electric testing or monitoring
- G05B23/0205—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults
- G05B23/0218—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterised by the fault detection method dealing with either existing or incipient faults
- G05B23/0221—Preprocessing measurements, e.g. data collection rate adjustment; Standardization of measurements; Time series or signal analysis, e.g. frequency analysis or wavelets; Trustworthiness of measurements; Indexes therefor; Measurements using easily measured parameters to estimate parameters difficult to measure; Virtual sensor creation; De-noising; Sensor fusion; Unconventional preprocessing inherently present in specific fault detection methods like PCA-based methods
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B23/00—Testing or monitoring of control systems or parts thereof
- G05B23/02—Electric testing or monitoring
- G05B23/0205—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults
- G05B23/0218—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterised by the fault detection method dealing with either existing or incipient faults
- G05B23/0224—Process history based detection method, e.g. whereby history implies the availability of large amounts of data
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/20—Pc systems
- G05B2219/24—Pc safety
- G05B2219/24063—Select signals as function of priority, importance for diagnostic
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Automation & Control Theory (AREA)
- Testing And Monitoring For Control Systems (AREA)
- General Factory Administration (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2016/053233 WO2017134772A1 (ja) | 2016-02-03 | 2016-02-03 | 製造設備診断支援装置及び製造設備診断支援方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2017134772A1 JPWO2017134772A1 (ja) | 2018-05-17 |
JP6572979B2 true JP6572979B2 (ja) | 2019-09-11 |
Family
ID=59499678
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017565020A Active JP6572979B2 (ja) | 2016-02-03 | 2016-02-03 | 製造設備診断支援装置及び製造設備診断支援方法 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP6572979B2 (zh) |
KR (1) | KR102042368B1 (zh) |
CN (1) | CN107949813B (zh) |
TW (1) | TWI615694B (zh) |
WO (1) | WO2017134772A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20220018553A (ko) | 2020-07-01 | 2022-02-15 | 도시바 미쓰비시덴키 산교시스템 가부시키가이샤 | 제조 설비의 진단 지원 장치 |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7091743B2 (ja) * | 2018-03-16 | 2022-06-28 | 株式会社リコー | 情報処理装置、情報処理方法、プログラム、および機械装置 |
JP6777686B2 (ja) * | 2018-05-29 | 2020-10-28 | ファナック株式会社 | 診断装置、診断方法及び診断プログラム |
CN112567306A (zh) * | 2018-08-31 | 2021-03-26 | 东芝三菱电机产业系统株式会社 | 制造过程监视装置 |
EP3663011A1 (de) * | 2018-12-05 | 2020-06-10 | Primetals Technologies Austria GmbH | Erfassen und übertragen von daten eines lagers eines stahl- oder walzwerks |
JP7226103B2 (ja) * | 2019-05-29 | 2023-02-21 | オムロン株式会社 | 制御システム、サポート装置およびサポートプログラム |
WO2021220323A1 (ja) * | 2020-04-27 | 2021-11-04 | 三菱電機株式会社 | 状態判定装置 |
WO2022049701A1 (ja) * | 2020-09-03 | 2022-03-10 | 三菱電機株式会社 | 機器分析装置、機器分析方法および機器分析プログラム |
JP7468376B2 (ja) * | 2021-01-21 | 2024-04-19 | 株式会社Tmeic | ロール管理装置 |
CN114789200B (zh) * | 2021-10-14 | 2024-02-09 | 天津市新宇彩板有限公司 | 冷轧机组故障自诊断并记录的方法及系统 |
CN114265390B (zh) * | 2021-12-22 | 2024-02-20 | 苏州华星光电技术有限公司 | 设备数据采集诊断方法、装置、服务器及存储介质 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4458349B2 (ja) * | 2004-08-27 | 2010-04-28 | 日立アプライアンス株式会社 | 機器診断装置、その動作プログラム、機器診断方法 |
US7622308B2 (en) * | 2008-03-07 | 2009-11-24 | Mks Instruments, Inc. | Process control using process data and yield data |
JP5156452B2 (ja) * | 2008-03-27 | 2013-03-06 | 東京エレクトロン株式会社 | 欠陥分類方法、プログラム、コンピュータ記憶媒体及び欠陥分類装置 |
TWI385492B (zh) * | 2008-12-16 | 2013-02-11 | Ind Tech Res Inst | 機台設備的維護分析系統及其方法 |
JP5427107B2 (ja) * | 2010-05-20 | 2014-02-26 | 株式会社日立製作所 | 監視診断装置および監視診断方法 |
CN101937207B (zh) * | 2010-08-27 | 2012-09-05 | 上海交通大学 | 机械设备状态的智能可视化监测与诊断方法 |
JP5565357B2 (ja) | 2011-03-24 | 2014-08-06 | 新日鐵住金株式会社 | 設備診断装置、設備診断方法、設備診断プログラムおよびこれを記録したコンピュータ読み取り可能な記録媒体 |
JP5821363B2 (ja) * | 2011-07-27 | 2015-11-24 | 東芝三菱電機産業システム株式会社 | 製品欠陥要因分析装置 |
US10996662B2 (en) | 2014-05-20 | 2021-05-04 | Toshiba Mitsubishi-Electric Industrial Systems Corporation | Manufacturing equipment diagnosis support system |
-
2016
- 2016-02-03 JP JP2017565020A patent/JP6572979B2/ja active Active
- 2016-02-03 CN CN201680049620.1A patent/CN107949813B/zh active Active
- 2016-02-03 KR KR1020187003229A patent/KR102042368B1/ko active IP Right Grant
- 2016-02-03 WO PCT/JP2016/053233 patent/WO2017134772A1/ja active Application Filing
- 2016-06-03 TW TW105117535A patent/TWI615694B/zh active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20220018553A (ko) | 2020-07-01 | 2022-02-15 | 도시바 미쓰비시덴키 산교시스템 가부시키가이샤 | 제조 설비의 진단 지원 장치 |
TWI789699B (zh) * | 2020-07-01 | 2023-01-11 | 日商東芝三菱電機產業系統股份有限公司 | 製造設備的診斷支援裝置 |
Also Published As
Publication number | Publication date |
---|---|
WO2017134772A1 (ja) | 2017-08-10 |
TW201732475A (zh) | 2017-09-16 |
TWI615694B (zh) | 2018-02-21 |
KR20180026495A (ko) | 2018-03-12 |
CN107949813B (zh) | 2020-06-30 |
JPWO2017134772A1 (ja) | 2018-05-17 |
KR102042368B1 (ko) | 2019-11-07 |
CN107949813A (zh) | 2018-04-20 |
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