JP6567831B2 - Crystal device - Google Patents

Description

  The present invention relates to a crystal device used in electronic equipment such as mobile communication equipment.

  The quartz crystal device has, for example, a structure in which a substrate and a lid are joined and a quartz piece mounted on the upper surface of the substrate is hermetically sealed in a recess formed by the substrate and the lid. The crystal piece is placed at a predetermined position of the crystal wafer by using a crystal wafer having crystal axes composed of an X axis, a Y axis, and a Z axis that are orthogonal to each other, for example, by photolithography technology and etching technology. After the crystal piece portion fixed in a predetermined side of the main surface is formed, the predetermined one side of the crystal piece portion is folded and separated into individual pieces.

  Such a crystal piece has a predetermined metal pattern, specifically, a first excitation electrode part, a second excitation electrode part, a first wiring part, a second wiring part, a first mounting terminal, a second mounting terminal, The first lead terminal and the first connection portion are integrally formed. The first excitation electrode part is provided on the upper surface of the crystal piece. The first wiring portion extends from the first excitation electrode portion to the edge portion of the upper surface of the crystal piece. The first lead terminal is provided on the edge of the upper surface of the crystal piece so as to be connected to the end of the first wiring part. The first mounting terminal is provided on the lower surface of the crystal piece at a position facing the first lead terminal. The first connection portion is provided on the side surface of the crystal piece so that one end is connected to the first lead terminal and the other end is connected to the first mounting terminal. The second excitation electrode part is provided on the lower surface of the crystal piece. The second wiring portion extends from the second excitation electrode portion to the edge portion of the lower surface of the crystal piece. The second mounting terminal is provided on the edge of the lower surface of the crystal piece so as to be connected to the end of the second wiring part. In the crystal piece provided with the metal pattern, the mounting terminals (first mounting terminal and second mounting terminal) and the mounting pads (first mounting pad and second mounting pad) provided on the upper surface of the substrate are electrically connected. The adhesive is applied and cured by being applied and mounted on the upper surface of the substrate (see, for example, Patent Document 1).

JP 2014-11647 A

  In the conventional crystal device, the first lead terminal is provided at the edge of the upper surface of the crystal piece, the first mounting terminal is provided at the edge of the lower face of the crystal piece, and one end is connected to the first lead terminal on the side surface of the crystal piece. The first connection part is provided so that the other end is connected to the first mounting terminal while being connected, so that the first drawer terminal, the first mounting terminal, and the first connection part have the same vertical thickness. It is provided integrally. Therefore, in the conventional crystal device, when the shrinkage stress generated when the conductive adhesive provided between the first mounting terminal and the first mounting pad is cured is applied to the first connection portion, the first connection Stress concentrates on the end of the top surface of the crystal piece, which is the connection location between the first lead terminal, or the end of the bottom surface of the crystal piece, which is the connection location between the first connection portion and the first mounting terminal. Therefore, at the end of the upper surface of the crystal piece or the end of the lower surface of the crystal piece, the first connection portion is peeled off, between the first connection portion and the first mounting terminal, and the first connection portion. There is a possibility that a conduction failure with the first lead terminal occurs and the equivalent series resistance value becomes large.

  The present invention provides a crystal device capable of reducing an increase in equivalent series resistance value by reducing poor conduction between the connection portion and the lead terminal and between the connection portion and the mounting terminal. The purpose is to do.

In order to solve the above-described problems, a crystal device according to the present invention includes a substantially rectangular parallelepiped crystal piece, a first excitation electrode portion provided on an upper surface of the crystal piece, and a crystal piece from the first excitation electrode portion. A first wiring portion extending to an edge of the upper surface, a first lead terminal provided at an edge of the upper surface of the crystal piece so as to connect to the first wiring portion, and the lower surface of the crystal piece A first mounting terminal provided at a position facing the first lead terminal, a first connection part provided so that one end overlaps the first lead terminal and the other end overlaps the first mount terminal; The second excitation electrode portion provided on the lower surface of the crystal piece, the second wiring portion extending from the second excitation electrode portion to the edge of the lower surface of the crystal piece, and the second wiring portion A second mounting terminal, a first mounting pad and a second mounting pad provided on the edge of the lower surface of the crystal piece. A conductive adhesive provided between the first mounting pad and the first mounting terminal, and the second mounting pad and the second mounting terminal; A lid joined to the upper surface of the crystal piece, and the width of the first connecting portion provided on the crystal piece when the side surface of the crystal piece is viewed in plan is the width of the crystal piece when the upper surface of the crystal piece is viewed in plan It is narrower than the width of the first connection portion provided on the upper surface.

In the crystal device according to the present invention, the first lead terminal is provided at the edge of the top surface of the crystal piece, the first mounting terminal is provided at the edge of the bottom surface of the crystal piece, and one end overlaps the first lead terminal. The first connection portion is provided so that the end overlaps the first mounting terminal, and the width of the first connection portion provided in the crystal piece when the side surface of the crystal piece is viewed in plan is the plan view of the upper surface of the crystal piece On the top of the quartz piece
Since the width of the first connecting portion is narrower than that of the first connecting portion, the shrinkage stress generated when the conductive adhesive provided between the first mounting terminal and the first mounting pad is solidified is the first connecting portion. In addition to the end of the upper surface of the crystal piece that is the connection location between the first connection portion and the first lead terminal, or the lower surface of the crystal piece that is the connection location between the first connection portion and the first mounting terminal. The stress concentration at the end can be relaxed compared to the conventional case. Therefore, in the quartz crystal device according to the present invention, compared to the conventional case, the stress concentration at the end of the upper surface or the lower surface of the quartz piece can be relaxed, and the peeling of the connection portion at the end of the quartz piece can be reduced. When the shrinkage stress generated when the conductive adhesive hardens is applied to the first connection part, the first connection part peels off at the end of the crystal piece due to the stress concentration, and the first connection part and the first drawer It is possible to reduce a conduction failure with the terminal or a conduction failure between the first connection portion and the first mounting terminal. As a result, in the quartz crystal device according to the present invention, the equivalent series resistance value between the first connection portion and the first mounting terminal and between the first connection portion and the first lead terminal is caused by poor conduction. It becomes possible to reduce the increase.

1 is a perspective view of a crystal device according to the present invention. It is sectional drawing in the AA cross section of FIG. It is a perspective view of the crystal element used with the crystal device concerning the present invention. (A) is a top view of the upper surface of the crystal element used in the crystal device according to the present invention, and (b) is a perspective view of the lower surface of the crystal element used in the crystal device according to the present invention seen through from above. It is the elements on larger scale of the B section of FIG. (A) is sectional drawing in CC cross section of FIG.4 (b), (b) is an enlarged view of the D section of Fig.6 (a). It is an image figure which shows the image of the vibration state of thickness shear vibration.

  As shown in FIGS. 1 to 6, the crystal device according to the present invention is bonded to the crystal element 120, the substrate 110 on which the crystal element 120 is mounted, and the substrate 110. And a lid 130 hermetically sealed in a recess 133 formed by

  The substrate 110 is for mounting the crystal element 120. As shown in FIGS. 1 and 2, the substrate 110 is formed in, for example, a flat rectangular shape, a pair of mounting pads 111 is provided on one main surface, and a plurality of external pads are provided on the other main surface. A terminal 112 is provided. The substrate 110 is provided with a wiring pattern (not shown) for electrically connecting the pair of mounting pads 111 and a predetermined external terminal 112. The substrate 110 is made of an insulating layer made of a ceramic material such as alumina ceramic or glass-ceramic. The substrate 110 may be one in which an insulating layer is used, or a plurality of insulating layers may be stacked.

  Here, according to the drawing, the other main surface of the substrate 110 on which the external terminals 112 are provided is the lower surface of the substrate 110, and one main surface of the substrate 110 facing the opposite side of the lower surface of the substrate 110 is the substrate 110. The top surface.

  The mounting pad 111 is for mounting the crystal element 120 on the substrate 110. For example, when the upper surface of the substrate 110 is viewed in plan, the mounting pads 111 are provided on the upper surface of the substrate 110 so as to be arranged along the short side of the substrate 110.

  The external terminal 112 is for mounting on a motherboard such as an electronic device. When the external terminal 112 is mounted on a motherboard such as an electronic device, the external terminal 112 is connected and fixed to a predetermined mounting pad (not shown) on the motherboard by soldering or the like. The For example, four external terminals 112 are provided, one at each of the four corners of the lower surface of the substrate 110. Two of the external terminals 112 are electrically connected to a pair of mounting pads 111 provided on the upper surface of the substrate 110 by a wiring pattern (not shown) provided on the substrate 110. For example, the substrate 110 has a long side dimension of 0.6 to 5.0 mm and a short side dimension of 0.4 to 3.2 mm in plan view of the upper surface of the substrate 110.

  Here, a method for manufacturing the substrate 110 is described. When the substrate 110 is made of alumina ceramic, first, a plurality of ceramic green sheets obtained by adding and mixing an appropriate organic solvent or the like to a predetermined ceramic material powder is prepared. Also, a predetermined conductive paste is applied to the surface of the ceramic green sheet or a through hole previously formed by punching the ceramic green sheet at a position to be a conductor pattern by using conventionally known screen printing or the like. Next, when a plurality of insulating layers are laminated, ceramic green sheets are laminated, pressed, and fired at a high temperature. After firing, the substrate 110 is produced by applying nickel plating, gold plating, or the like to predetermined portions of the conductor pattern, specifically, the mounting pad 111, the external terminal 112, and the portion that becomes the wiring pattern (not shown). Is done. The conductive paste is made of, for example, a sintered body of metal powder such as tungsten, molybdenum, copper, silver, or palladium.

  The quartz crystal element 120 can obtain a stable mechanical vibration and transmits a reference signal for an electronic device or the like. The crystal element 120 includes a crystal piece 121 and a metal pattern formed on the surface of the crystal piece 121, specifically, an excitation electrode portion 122 (122a, 122b), a wiring portion 123 (123a, 123b), and an extraction terminal. 124 (124a, 124b), a mounting terminal 125 (125a, 125b), and a connection portion 126 (126a, 126b). Further, as shown in FIG. 2, the crystal element 120 has a part of the metal pattern provided on the lower surface of the crystal piece 121, specifically, the mounting terminal 125 by the conductive adhesive 140. A pair of mounting pads 111 provided on the upper surface of the substrate 110 are mounted on the upper surface of the substrate 110 while being bonded and held in electrical connection.

  Here, according to the drawing, when mounted on the substrate 110, the surface of the crystal piece 121 facing the upper surface of the substrate 110 is the lower surface of the crystal piece 121, and the crystal piece 121 facing the opposite side of the lower surface of the crystal piece 121 is The surface is the upper surface of the crystal piece 121. The upper surface of the crystal piece 121 and the lower surface of the crystal piece 121 are defined as the main surface of the crystal piece 121.

  The crystal piece 121 is made of a piezoelectric material that performs stable mechanical vibration. For example, crystal is used, and is formed using a photolithography technique and an etching technique. The crystal piece 121 has a crystal axis composed of an X axis, a Y axis, and a Z axis that are orthogonal to each other, and has a substantially rectangular flat plate shape, for example. The main surface of the crystal piece 121 is parallel to a surface obtained by rotating a surface parallel to the X axis and the Z axis counterclockwise around the X axis as viewed in the negative direction of the X axis. For example, it is parallel to the surface rotated about 37 °. An m-plane (not shown) parallel to the Z axis is formed on a part of the side surface of the crystal piece 121. The m-plane has an angle formed with the main surface of the crystal piece 121, which is a combination of 90 ° and the rotation angle, for example, about 123 °. For this reason, when the crystal piece 121 applies a voltage to both main surfaces of the crystal piece 121 and vibrates in thickness, it can change the vibration state at the end of the crystal piece 121 where the m-plane is formed, The attenuation amount of the vibration displacement at the end portion of the crystal piece 121 can be increased, and the increase in the equivalent series resistance value of the crystal element 120 and thus the crystal device is reduced.

  The predetermined metal pattern formed on the surface of the crystal piece 121 is for applying a voltage to the crystal piece 121 from the outside of the crystal piece 121. Further, the predetermined metal pattern formed on the surface of the crystal piece 121 includes an excitation electrode 122 (first excitation electrode 122a and second excitation electrode 122b) and a wiring portion 123 (first wiring portion 123a and second wiring portion). 123b), the lead terminal 124 (the first lead terminal 124a and the second lead terminal 124b), the mounting terminal 125 (the first mounting terminal 125a and the second mounting terminal 125b), and the connection terminal 126 (the first connection portion 126a and the first lead terminal 124b). It consists of two connecting parts 126b).

  The excitation electrode portion 122 is for causing a reverse piezoelectric effect and a piezoelectric effect in a part of the crystal piece 121 and causing mechanical vibration in a part of the crystal piece 121. The excitation electrode unit 122 is provided in a predetermined portion of the crystal piece 121 by, for example, a photolithography technique and an etching technique. Here, although the case where it is provided by a photolithography technique and an etching technique has been described, an evaporation technique or a sputtering technique may be used as long as it can be provided at a predetermined portion of the crystal piece 121.

  The excitation electrode unit 122 includes a first excitation electrode unit 122a and a second excitation electrode unit 122b. The first excitation electrode portion 122a is provided on the upper surface of the crystal piece 121, and has a substantially rectangular shape when the upper surface of the crystal piece 121 is viewed in plan. The second excitation electrode portion 122b is provided on the lower surface of the crystal piece 121 so as to face the first excitation electrode portion 122a. Further, the second excitation electrode portion 122b has a substantially rectangular shape when the lower surface of the crystal piece 121 is viewed in plan. By applying a voltage to the first excitation electrode portion 122a provided on the upper surface of the crystal piece 121 and the second excitation electrode portion 122b provided on the lower surface of the crystal piece 121, the first excitation electrode portion 122a is applied. As shown in FIG. 7, an electric field is generated between the first excitation electrode portion 122 b and the second excitation electrode portion 122 b, and as shown in FIG. It has a configuration that can cause sliding vibration.

  The wiring part 123 has one end connected to the excitation electrode part 122 and applies a voltage to the excitation electrode part 122. The wiring part 123 is provided integrally with the excitation electrode part 122 in a predetermined part of the crystal piece 121 by, for example, a photolithography technique and an etching technique.

  The wiring part 123 includes a first wiring part 123a and a second wiring part 123b. The first wiring portion 123a extends from the first excitation electrode portion 122a provided on the upper surface of the crystal piece 121 to the edge of the upper surface of the crystal piece 121, and one end is connected to the first excitation electrode portion 122a. The other end is connected to the first lead terminal 124a. The second wiring portion 123b extends from the second excitation electrode portion 122b provided on the lower surface of the crystal piece 121 to the edge of the lower surface of the crystal piece 121, and one end is connected to the second excitation electrode portion 122b. The other end is connected to the second mounting terminal 125b.

  The lead terminal 124 is provided at a predetermined position on the upper surface of the crystal piece 121 by, for example, a photolithography technique and an etching technique. The lead terminal 124 includes a first lead terminal 124a and a second lead terminal 124b. The first lead terminal 124a is provided at the edge of the upper surface of the crystal piece 121 so as to be connected to the other end of the first wiring portion 123a. At this time, the first lead terminal 124 a is provided at a position facing the first mounting terminal 125 a provided on the lower surface of the crystal piece 121. The first lead terminal 124a has a substantially rectangular shape when the upper surface of the crystal piece 121 is viewed in plan. The second lead terminal 124b is provided at the edge of the upper surface of the crystal piece 121. For example, two second lead terminals 124b are provided side by side with the first lead terminal 124a along the edge of a predetermined side of the top surface of the crystal piece 121. ing.

  Thus, by providing the extraction terminal 124 on the upper surface of the crystal piece 121, a voltage is applied to the first excitation electrode portion 122a and the second excitation electrode portion 122b, and the first excitation electrode portion 122a and the second excitation electrode portion 122b are applied. When a portion of the sandwiched crystal piece 121 is subjected to a thickness-slip vibration, a contour-slip vibration in which the contour of the crystal piece 121 vibrates separately from the thickness-slip vibration is less likely to vibrate by the mass of the extraction terminal 124. So it can be attenuated. Since the contour slip vibration is a vibration different from the thickness shear vibration, it may be coupled with the thickness shear vibration. When coupled with the thickness shear vibration, the equivalent series resistance value may be increased. Therefore, in the present embodiment, by providing the lead terminal 124, the vibration of the contour slip vibration is attenuated in the lead terminal 124, and the coupling between the contour slip vibration and the thickness slip vibration is reduced. For this reason, it becomes possible to reduce an increase in the equivalent series resistance value due to the coupling between the contour slip vibration and the thickness shear vibration. That is, even if the lead terminal 124 is only the first lead terminal 124a, such an effect can be obtained. Further, when the lead terminal 124 includes the first lead terminal 124a and the second lead terminal 124b, it is possible to further reduce the increase in the equivalent series resistance value compared to the case where only the first lead terminal 124a is provided. Become.

  When the crystal element 120 is mounted with the conductive adhesive 140 by providing two first lead terminals 124 a and second lead terminals 124 b along the edge of a predetermined side of the upper surface of the crystal piece 121. In addition, the state of the lower surface of the crystal piece 121 and the state of the upper surface of the crystal piece 121 can be made closer. When the crystal element 120 is mounted with the conductive adhesive 140, as shown in FIG. 2, the first mounting terminal 125 a and the second mounting terminal 125 b provided on the lower surface of the crystal piece 121 are formed by the conductive adhesive 140. As a result of the bonding, the conductive adhesive 140 is not provided on the upper surface of the crystal element 120. Therefore, when the lead terminal 124 is not provided on the upper surface side of the crystal piece 121, vibration (thickness shear vibration and contour slip vibration) is affected by bonding with the conductive adhesive 140 on the lower surface side of the crystal piece 121, On the upper surface side of the crystal piece 121, vibration (thickness shear vibration and contour shear vibration) is not affected. For this reason, by providing the first lead terminal 124a and the second lead terminal 124b on the upper surface side of the crystal piece 121, vibration is caused by the mass of the first lead terminal 124a and the second lead terminal 124b on the upper surface side of the crystal piece 121. As a result, the vibration on the upper surface side of the crystal piece 121 can be affected as compared with the conventional case. As a result, when the crystal element 120 is mounted with the conductive adhesive 140, since the influence on the vibration can be made closer on the lower surface side of the crystal piece 121 and the upper surface side of the crystal piece 121, the vibration balance is improved and the equivalent The increase in the series resistance value can be further reduced.

  In addition, the first lead terminal 124 a and the second lead terminal 124 b provided side by side along a predetermined one side of the upper surface of the crystal piece 121 pass through the center of the crystal piece 121 and the predetermined piece of the crystal piece 121. It is provided at a position to be a line object with respect to a virtual perpendicular (not shown) perpendicular to one side. Therefore, the mass of the metal pattern provided on the upper surface of the crystal piece 121 is made closer to the left and right of the virtual perpendicular to the virtual perpendicular perpendicular to a predetermined side of the crystal piece 121 while passing through the center of the crystal piece 121. Can do. For this reason, when a part of the crystal piece 121 is vibrated by applying a voltage, it becomes possible to bring the vibration state on the left and right of the virtual perpendicular close to each other, and the vibration balance on the left and right of the virtual perpendicular can be improved. As a result, it becomes possible to reduce the increase of the equivalent series resistance value.

  The mounting terminal 125 is provided at a predetermined position on the lower surface of the crystal piece 121 by, for example, a photolithography technique and an etching technique. The mounting terminal 125 includes a first mounting terminal 125a and a second mounting terminal 125b. The first mounting terminal 125a is bonded to and electrically connected to the first mounting pad 111 provided on the substrate 110 by the conductive adhesive 140. Therefore, the first mounting terminal 125 a is provided on the lower surface of the crystal piece 121 and at a position facing the first mounting pad 111. At this time, the first mounting terminal 125 a is provided along an edge of a predetermined side of the lower surface of the crystal piece 121 so as to face the first lead terminal 124 a provided on the upper surface of the crystal piece 121.

  The second mounting terminal 125 b is bonded to the second mounting pad 111 provided on the substrate 110 by the conductive adhesive 140 and is electrically connected. Therefore, the second mounting terminal 125 b is provided on the lower surface of the crystal piece 121 and at a position facing the second mounting pad 111. At this time, the second mounting terminal 125b is arranged along the edge of a predetermined side of the lower surface of the crystal piece 121 so as to face the second lead terminal 124b provided on the upper surface of the crystal piece 121. Two terminals 125a are provided side by side. The second mounting terminal 125b is connected to the other end of the second wiring portion 123b, and is electrically connected to the second excitation electrode portion 122b via the second wiring portion 123b.

  As shown in FIG. 4B, two first mounting terminals 125a and second mounting terminals 125b arranged along the edge of a predetermined side of the crystal piece 121 are obtained by viewing the lower surface of the crystal element in plan view. In addition, it is provided so as to be symmetrical with respect to a virtual perpendicular (not shown) perpendicular to a predetermined side of the crystal piece 121 while passing through the center of the crystal piece 121. Therefore, when the mounting terminal 125 and the mounting pad 111 of the substrate 110 are bonded by the conductive adhesive 140, the influence on the thickness-shear vibration due to the bonding of the conductive adhesive 140 can be made closer to the left and right of the virtual perpendicular line. For this reason, the right and left balance with respect to the virtual perpendicular due to bonding with the conductive adhesive 140 can be made closer, the holding state of the crystal element 120 can be further stabilized, and the equivalent series resistance value is reduced from increasing. It becomes possible to make it.

  As shown in FIG. 6B, the excitation electrode portion 122, the wiring portion 123, the lead terminal 124, and the mounting terminal 125 include, for example, a first metal layer M11 and a second metal layer M12. The second metal layer M12 is laminated on M11. The metal material used for the first metal layer M11 has a property of being easily adhered to the crystal piece 121 as compared with the metal material used for the second metal layer M12. Therefore, when the second metal layer M12 is laminated on the first metal layer M11, even a metal material that is difficult to adhere to the crystal piece 121 can be used for the second metal layer M12. If the excitation electrode unit 122 is made only of the second metal layer M12 without providing the first metal layer M11, a part of the second metal layer M12 is easily peeled off, and therefore the quartz crystal element 120 is used with a suction nozzle or the like. When the quartz crystal element 120 is mounted on the substrate 110 by moving the second metal layer M12 due to contact with the suction nozzle, the equivalent series resistance value may increase. That is, the excitation electrode unit 122, the wiring unit 123, the lead terminal 124, and the mounting terminal 125 are configured by the first metal layer M11 and the second metal layer M12 stacked on the first metal layer M12, thereby providing the excitation electrode. It is possible to reduce the separation of part of the portion 122, the wiring portion 123, the lead terminal 124, and the mounting terminal 125, and as a result, it is possible to reduce an increase in the equivalent series resistance value due to the separation.

  For the first metal layer M11, a metal material having good adhesion to the crystal piece 121 is used, and chromium, nichrome, titanium, or nickel is used. For the second metal layer M12, a metal material having a relatively low electrical resistivity is used among metal materials, and gold, silver, aluminum, an alloy mainly containing gold, or an alloy mainly containing silver is used. . In the present embodiment, for example, chromium is used for the first metal layer M11, and gold is used for the second metal layer M12. By using chromium for the first metal layer M11, adhesion between the crystal piece 121 and the second metal layer M12 is ensured. By using gold for the second metal layer M12, the second metal layer M12 is oxidized with surrounding oxygen while suppressing electrical resistance in the excitation electrode portion 122, the wiring portion 123, the lead terminal 124, and the mounting terminal 125, and the crystal element 120 is oxidized. It is possible to reduce the change of the frequency of.

  The connection portion 126 is for electrically connecting the mounting terminal 125 and the extraction terminal 124. The connection portion 126 is provided over the upper surface of the crystal piece 121, the side surface of the crystal piece 121, and the lower surface of the crystal piece 121 so that one end overlaps the lead terminal 124 and the other end overlaps the mounting terminal 125.

  With such a configuration, when stress is applied in a direction perpendicular to the lower surface of the crystal piece 121 and from the upper surface of the crystal piece 121 toward the lower surface of the crystal piece 121, at the end of the upper surface of the crystal piece 121. Since the connecting portion 127 is formed and the stress is dispersed accordingly, film peeling due to stress concentration can be reduced. Therefore, when the conductive adhesive 140 is cured, even when contraction stress is applied in a direction perpendicular to the lower surface of the crystal piece 121 and from the upper surface to the lower surface of the crystal piece 121, compared to the conventional case. Thus, film peeling due to stress concentration at the end of the upper surface of the crystal piece 121 can be reduced. For this reason, it becomes possible to reduce the occurrence of poor conduction between the lead terminal 124 and the connecting portion 127 due to film peeling, and to reduce the increase in the equivalent series resistance value caused by this poor conduction.

  Further, with such a configuration, when stress is applied in a direction parallel to the lower surface of the crystal piece 121 and toward the inner edge from the outer edge of the crystal piece 121, a connection portion is formed at the end of the lower surface of the crystal piece 121. Since the film thickness in the vertical direction is increased by 127, film peeling due to stress concentration can be reduced. Accordingly, when the conductive adhesive 140 is cured, even when stress is applied in a direction parallel to the lower surface of the crystal piece 121 and toward the inner edge from the outer edge of the crystal piece 121, compared to the conventional case. Further, film peeling due to stress concentration at the end of the lower surface of the crystal piece 121 can be reduced. For this reason, it is possible to reduce the occurrence of poor conduction between the mounting terminal 125 and the connection portion 126 due to film peeling, and to reduce the increase in the equivalent series resistance value caused by this conduction failure.

  As shown in FIGS. 4A and 4B, the connection portion 126 has a circular arc shape at both ends of the connection portion 126 when the crystal piece 121 is viewed in plan. At this time, the center of the circle of the arc is located on the outer edge side of the crystal piece 121. In this way, when stress is applied in a direction parallel to the lower surface of the crystal piece 121 and inward from the outer edge of the crystal piece 121, the stress can be relaxed at the end of the connection portion 126. It becomes possible. Therefore, when both ends of the connecting portion 126 are formed in an arc shape and the center of the circle of the arc is positioned on the outer edge side of the crystal piece 121, the conductive adhesive 140 is cured when the conductive adhesive 140 is cured. Even when a contraction stress is applied in a direction parallel to the lower surface and inward from the outer edge of the crystal piece 121, it can be relaxed at the end of the connection portion 126. For this reason, since the crystal element 120 can relieve the stress applied to the end of the crystal piece 121, it is possible to reduce peeling of the connection portion 126 at the end of the crystal piece 121. As a result, poor conduction between the first connection 126a and the first mounting end 125a can be reduced, and the equivalent series resistance value due to poor conduction between the first connection 126a and the first mounting terminal 125a increases. This can be reduced.

  In particular, when both end portions of the connecting portion 126 are made into a semicircle or semi-ellipse, contraction stress is applied in a direction parallel to the lower surface of the crystal piece 121 and inward from the outer edge of the crystal piece 121. Even so, it can be more relaxed at the end of the connecting portion 126. For this reason, the stress applied to the end portion of the crystal piece 121 can be relaxed, and peeling of the connection portion 126 at the end portion of the crystal 121 can be reduced. As a result, the conduction failure between the first connection portion 126a and the first mounting terminal 125a can be reduced, and the equivalent series resistance value due to the conduction failure between the first connection portion 126a and the first mounting terminal 125a is increased. It can be reduced.

  As shown in FIG. 3, the width of the connection portion 126 provided on the side surface of the crystal piece 121 is narrower than the width of the connection portion 126 provided on the upper surface of the crystal piece 121. Yes. Here, the width of the connecting portion 126 provided on the side surface of the crystal piece 121 means that the first lead terminal 124a and the second lead terminal 124b are provided side by side in a plan view of the side face of the crystal piece 126. It is the length of the connection part 126 parallel to the predetermined one side of the quartz crystal piece 121. In the present embodiment, the width of the connection portion 126 provided on the side surface of the crystal piece 121 is referred to as a side surface distance. As shown in FIG. 5, the side distance of the first connection portion 126a is defined as a first side surface distance SD1, and the side surface distance of the second connection portion 126b is defined as a second side surface distance (not shown). The width of the connecting portion 126 provided on the upper surface of the crystal piece 121 is such that the first lead terminal 124a and the second lead terminal 124b are provided side by side when the top surface of the crystal piece 121 is viewed in plan. This is the length of the connecting portion 126 on a predetermined side of the crystal piece 121. In the present embodiment, the width of the connection portion 126 provided on the upper surface of the crystal piece 121 is referred to as the upper surface distance. As shown in FIG. 5, the upper surface distance of the first connection portion 126a is a first upper surface distance UD1, and the upper surface distance of the second connection portion 126b is a second upper surface distance (not shown). Accordingly, in the first connection portion 126a, the first side surface distance SD1 is shorter than the first upper surface distance UD1, and in the second connection portion 126b, the second side surface distance is shorter than the second upper surface distance. Yes.

  By adopting such a configuration, it is possible to reduce the vibration inhibition to the thickness shear vibration, and it is possible to reduce the increase of the equivalent series resistance value. The following can be considered as the reason. When a voltage is applied to the excitation electrode portion 122 of the crystal piece 121, a part of the crystal piece 121 sandwiched between the excitation electrode portions 122 starts thickness-shear vibration due to the inverse piezoelectric effect and the piezoelectric effect. As described above, the thickness shear vibration vibrates in the direction from the upper surface of the crystal piece 121 toward the lower surface of the crystal piece 121, that is, in the thickness direction in the vertical direction of the crystal piece 121. When a voltage is applied to the excitation electrode unit 122, the thickness shear vibration state of the crystal piece 121 is such that a part of the crystal piece 121 sandwiched by the excitation electrode unit 122 undergoes the most thickness shear vibration and is sandwiched by the excitation electrode unit 122. Even in the portion of the crystal piece 121 that is not present, vibration leaks from a portion of the crystal piece 121 sandwiched between the excitation electrode portions 122, and the thickness piece vibrates. Further, in the crystal piece 121 not sandwiched between the excitation electrode portions 122, the thickness shear vibration is gradually attenuated from the outer edge of the excitation electrode portion 122 toward the end portion of the crystal piece 121. Therefore, thickness shear vibration is also generated at the end of the crystal piece 121. That is, since the thickness shear vibration is also generated at the end of the crystal piece 121, when the state of the crystal piece 121 in the thickness direction in the vertical direction, in other words, the state of the side surface of the crystal piece 121 changes, for example, the crystal piece When a material different from a crystal such as a metal material is provided on the side surface of 121, the thickness shear vibration of the crystal piece 121 is affected. Therefore, by reducing the amount of change in the state of the side surface of the crystal piece 121, it is possible to reduce the vibration inhibition to the thickness shear vibration of the crystal piece 121, and to reduce the increase of the equivalent series resistance value. It becomes possible.

  In the present embodiment, since the lead terminal 124 provided on the upper surface of the crystal piece 121 and the mounting terminal 125 provided on the upper surface of the crystal piece 121 are electrically connected by the connection portion 126, A part of the connection portion 126 is provided on the side surface of the crystal piece 121. At this time, the width (side distance) of the connection portion 126 provided on the side surface of the crystal piece 121 is narrower than the width (upper surface distance) of the connection portion 126 provided on the upper surface of the crystal piece 121. Thus, by reducing the width of the connection portion 126 provided on the side surface of the crystal piece 121, the amount of change in the state of the side surface of the crystal piece 121 by the connection portion 126 can be reduced. It becomes possible to reduce the vibration inhibition to the thickness shear vibration. As a result, it is possible to reduce the increase in the equivalent series resistance value due to the inhibition of the thickness shear vibration of the crystal piece 121.

  In the connection portion 126, the area of the portion where the extraction terminal 124 and the connection portion 126 overlap is more than half of the area of the extraction terminal 124 when the upper surface of the crystal piece 121 is planar. By adopting such a configuration, the connection with the lead terminal 124 can be more reliably ensured by the connection portion 126 provided on the upper surface of the crystal piece 121. Therefore, even when the extraction terminal 124 is provided on the inner edge side from the outer edge of the upper surface of the crystal piece 121, electrical connection between the connection portion 126 and the extraction terminal 124 can be ensured more reliably, and the connection portion 126. It is possible to reduce an increase in the equivalent series resistance value due to poor conduction between the lead terminal 124 and the lead terminal 124.

  The connection portion 126 is provided on a side surface including a predetermined side of the upper surface of the crystal piece 121 in which the first extraction terminal 124a and the second extraction terminal 124b are arranged in a plan view when the upper surface of the crystal piece 121 is viewed in plan. Yes. By doing so, the distance from the side of the excitation electrode portion 122 facing the lead terminal 124 side to the connection portion 126 provided on the side surface of the crystal piece 121 in a plan view of the upper surface of the crystal piece 121 is made longer. It becomes possible to do. Therefore, it is possible to further reduce the influence on the thickness-shear vibration that has leaked to the end of the crystal piece 121, and to reduce the increase of the equivalent series resistance value.

  For example, the connection part 126 uses a sputtering technique or a vapor deposition technique. As shown in FIG. Is provided in a U shape on the upper surface of the crystal piece 121, the lower surface of the crystal piece 121, and the side surface of the crystal piece 121 so that the other end overlaps the mounting terminal 125. In this way, by connecting one end of the connecting portion 126 with the lead terminal 124 and the other end of the connecting portion 126 with the mounting terminal 125, the area of the overlapping portion between the connecting portion 126 and the lead terminal 124 and the connecting portion Since the area of the portion where 126 and the mounting terminal 125 overlap can be increased, it is possible to reliably ensure the continuity between the connecting portion 126 and the lead terminal 124 and the continuity between the connecting portion 126 and the mounting terminal 125. Become.

  In addition, by providing the connection portion 126 using a sputtering technique or a vapor deposition technique, the connection part 126 can be provided more reliably on the side surface of the crystal piece 121 than in the case where a photolithography technique and an etching technique are used. When the photolithography technique and the etching technique are used, the adjacent crystal piece 121 or the like becomes a shadow, and the side surface of the crystal piece 121 cannot be irradiated with ultraviolet light having a necessary intensity, and the connection portion provided on the side surface of the crystal piece 121 A part of 126 may become thinner than a desired line width. As a result, the electrical resistance of the connecting portion 126 increases, and the equivalent series resistance value of the crystal element 120 may increase. That is, by providing the connection part 126 using a sputtering technique or a vapor deposition technique, the connection part 126 can be reliably provided on the side surface of the crystal piece 121, and further compared with the case where the photolithography technique and the etching technique are used. Thus, it is possible to reduce the line width of the connection portion 126 provided in the crystal piece 121 from becoming smaller than a desired line width, and to reduce the equivalent series resistance value from increasing.

  As shown in FIG. 6B, the connection portion 126 is composed of, for example, a third metal layer M13 and a fourth metal layer M14, and the fourth metal layer M14 is stacked on the third metal layer M13. It has become. Since one end of the connection portion 126 overlaps with the lead terminal 124 and the other end of the connection portion 126 overlaps with the mounting terminal 125, when attention is paid to one end side of the connection portion 126, the upper surface of the crystal piece 121 is first The metal layer M11, the second metal layer M12, the third metal layer M13, and the fourth metal layer M14 are stacked in this order. The first metal layer M11, the second metal layer M12, the third metal layer M13, and the fourth metal layer M14 are stacked in this order.

  For the third metal layer M13, a metal material having good adhesion to the crystal piece 121 is used, and for example, chromium, nichrome, titanium, or nickel is used. By using such a metal material, it is possible to use a metal material that does not easily adhere to the crystal piece 121 for the fourth metal layer M14. If the connection portion 126 is made only of the fourth metal layer M14 without providing the third metal layer M13, a part of the fourth metal layer M14 is easily peeled off. When the crystal element 120 is moved and mounted on the substrate 110, the fourth metal layer M14 may be peeled off due to contact with the suction nozzle or the surroundings, and the equivalent series resistance value may increase. That is, the connection portion 126 includes the third metal layer M13 and the fourth metal layer M14 laminated on the third metal layer M13, thereby reducing a part of the connection portion 126 from peeling off. As a result, an increase in the equivalent series resistance value due to peeling can be reduced.

  For the fourth metal layer M14, a metal material having a relatively low electrical resistivity among metal materials, for example, gold, silver, aluminum, an alloy mainly containing gold, or an alloy mainly containing silver is used. Thereby, the electrical resistance of the connection portion, specifically, the fourth metal layer can be reduced, and the increase in the equivalent series resistance value can be reduced.

  The fourth metal layer M14 is made of a metal material having a lower electrical resistivity than the second metal layer M12. Thereby, compared with the case where the same metal material as the 2nd metal layer M12 is used, an electrical resistance value can be reduced more. Further, even when the width (side distance) of the connection portion 126 provided on the side surface of the crystal piece 121 is small, the thickness of the connection portion 126 in the vertical direction is set to the excitation electrode portion 122, the wiring portion 123, and the extraction terminal. Increasing the thickness in the vertical direction from 124 and the mounting terminal 125 can reduce the increase in the electrical resistance value due to the small volume of the connection portion 126. For this reason, it becomes possible to reduce that an equivalent series resistance value becomes large.

  In the present embodiment, for example, chromium is used for the third metal layer M13, and silver is used for the fourth metal layer M14. By using chromium for the third metal layer M13, the adhesion between the crystal piece 121 and the fourth metal layer M14 is ensured, and the adhesion between the second metal layer M12 and the fourth metal layer M14 is also ensured. be able to. By using silver for the fourth metal layer M14, it is possible to reduce the change in the frequency of the crystal element 120 due to the oxidation of the fourth metal layer M14 with the surrounding oxygen while further suppressing the electrical resistance in the connection portion 126. . Further, by using silver for the fourth metal layer M14, when the conductive adhesive 140 containing conductive powder as a conductive filler in a silicone-based resin binder is used, Since it is possible to reduce the formation of a coating film with a binder, it is possible to ensure electrical continuity with the conductive filler contained in the conductive adhesive 140. Here, although the case where the fourth metal layer M14 is made of silver is described, it is a metal mainly composed of silver to which about several percent of palladium or the like is added in order to reduce silver sulfidation. May be.

  Here, the size of the crystal element 120 will be described. The crystal piece 121 has a long side of 0.5 to 4.6 mm and a short side of 0.4 to 2.8 mm in plan view of the crystal piece 121, and the vertical direction of the crystal piece 121. The thickness is 10 to 300 μm. In the excitation electrode portion 122, the first excitation electrode portion 122a and the second excitation electrode portion 122b have the same size, and the side parallel to the long side of the crystal piece 121 is 0. The side parallel to the short side of the crystal piece 121 is 0.3 to 2.7 mm, and the thickness in the vertical direction is 50 to 500 mm. The wiring part 123 has a thickness in the vertical direction of 50 to 500 mm. The lead terminal 124 has a side parallel to the long side of the crystal piece 121 of 25 to 300 mm and a side parallel to the short side of the crystal piece 121 of 75 to 500 mm in plan view of the crystal piece 121. The thickness in the vertical direction is 50 to 500 mm. The mounting terminal 125 has a side parallel to the long side of the crystal piece 121 of 25 to 300 mm in plan view of the crystal piece 121 and a side parallel to the short side of the crystal piece 121 of 75 to 500 mm. The thickness in the vertical direction is 50 to 500 mm. The connection portion 126 has a width (upper surface distance) provided on the upper surface of the crystal piece 121 of 75 to 500 mm, and a width (side distance) provided on the side surface of the crystal piece 121 of 30 to 400 mm. The thickness in the vertical direction is 50 to 500 mm.

  Here, a method of mounting the crystal element 120 on the substrate 110 by electrically bonding the crystal element 120 to the pair of mounting pads 111 provided on the upper surface of the substrate 110 using the conductive adhesive 140 is used. explain. First, the conductive adhesive 140 is applied onto the mounting pad 111 by, for example, a dispenser. Thereafter, the crystal element 120 is transported onto the conductive adhesive 140, and the crystal element 120 is placed so that the conductive adhesive 140 is sandwiched between the mounting pad 111 and the lower surface of the crystal piece 121, and is heated and cured in this state. The At this time, the conductive adhesive 140 applied to one mounting pad 111 is sandwiched between the one mounting pad 111 and the first mounting terminal 125 a provided on the lower surface of the crystal piece 121, while the one mounting pad 111 is mounted. The pad 111 and the first connection portion 126a are also sandwiched. The conductive adhesive 140 is cured by being heated and cured, and the one mounting pad 111 and the first connection portion 125a are electrically bonded to each other while the one mounting pad 111 and the first mounting terminal 125a are electrically bonded to each other. It is adhered to. The conductive adhesive 140 applied to the other mounting pad 111 is sandwiched between the other mounting pad 111 and the second mounting terminal 125b provided on the lower surface of the crystal piece 121, while the other mounting pad 111 and The second connecting portion 126b is also sandwiched. The conductive adhesive 140 is hardened by being heated and cured, and electrically bonds the other mounting pad 111 and the second mounting terminal 125b to each other while bonding the other mounting pad 111 and the second connection portion 126b. It is electrically bonded. Thus, by providing the conductive adhesive 140 not only between the mounting terminal 125 and the mounting pad 111 but also between the connection terminal 126 and the mounting pad 111, shrinkage when the conductive adhesive 140 is cured. When stress is applied, shrinkage stress is applied to the mounting terminal and the connection portion 126, as compared with the case where the conductive adhesive 140 is provided only between the mounting pad 111 and the mounting terminal 125 as in the past, The shrinkage stress applied to the mounting terminal 125 can be reduced. For this reason, it becomes possible to reduce that a part of the mounting terminal 125 is peeled off due to the contraction stress and the equivalent series resistance value is increased.

  The conductive adhesive 140 is for mounting the crystal element 120 on the upper surface of the substrate 110. The conductive adhesive 140 contains a conductive powder as a conductive filler in a silicone-based resin binder. As the conductive powder, one containing aluminum, molybdenum, tungsten, platinum, palladium, silver, titanium, nickel, nickel iron, or a combination thereof is used. Further, as the binder, for example, a silicone resin, an epoxy resin, a polyimide resin, or a bismaleimide resin is used.

  The conductive adhesive 140 is applied onto the mounting pad 111, and is hardened by being heated and cured while being sandwiched between the mounting pad 111 and the mounting terminal 125, so that the mounting pad 111 and the mounting terminal 125 are electrically connected. Glued. For example, when the conductive adhesive 140 is heat-cured, the resin binder contracts and the conductive fillers are closer to each other. Can be electrically connected with each other. For this reason, when the conductive adhesive 140 is cured by heating and solidified, the conductive adhesive 140 contracts. Therefore, when the conductive adhesive 140 is cured by heating and solidified, stress (in the direction toward the conductive adhesive 140 from the mounting pad 111, the mounting terminal 125, and the connection portion 126 that are in contact with the conductive adhesive 140 respectively) (Shrinkage stress) is applied.

  The lid 130 is bonded to the upper surface of the substrate 110 by the bonding member 150 and hermetically seals the crystal element 120 mounted on the upper surface of the substrate 110. Further, the lid body 130 includes a sealing base portion 131 and a sealing frame portion 132. The lid 130 is provided with a sealing frame portion 132 on the lower surface of the sealing base 131, and a recess 133 is formed between the lower surface of the sealing base 131 and the inner wall surface of the sealing frame portion 132.

  The sealing base 131 has, for example, a substantially rectangular parallelepiped shape, and the size of the main surface is larger than the size of the main surface of the crystal piece 121 and smaller than the upper surface of the substrate 110. The sealing frame part 132 is comprised from the frame part 132a and the collar part 132b. The frame portion 132 a is for forming the concave portion 133 in the lid body 130, and is provided along the outer edge of the lower surface of the sealing base portion 131. In the recess 133, the crystal element 120 mounted on the upper surface of the base 110 is accommodated. The flange 132b is provided to secure an area for joining the lid 130 and the substrate 110 and increase the joining strength. The flange portion 132b is annular along the outer peripheral surface of the frame portion 132a and extends to the outer edge side of the frame portion 132a. The sealing base 131 and the sealing frame 132 are made of, for example, an alloy containing at least one of iron, nickel, and cobalt, and are integrally formed. Such a lid 130 is for hermetically sealing the recess 133 in a vacuum state or the recess 133 filled with nitrogen gas or the like. Specifically, the lid body 130 is a bonding member provided between the lower surface of the sealing frame portion 132 (the lower surface of the frame portion 132a and the lower surface of the flange portion 132b) and the upper surface of the substrate 110 in a predetermined atmosphere. When the heat is applied, the joining member 150 is melted, and the lower surface of the sealing frame portion 132 and the upper surface of the substrate 110 are melt-bonded.

  Here, a method for manufacturing the lid 130 will be described. For the production of the lid 130, for example, conventionally known press working is used. A rectangular flat plate is prepared, and the flat plate is sandwiched and pressed by a pair of molds having a convex portion and a concave portion having the same shape as the concave portion 133 of the lid 130, and the sealing base portion 131 and the sealing frame portion 132 are pressed. Is provided to form the recess 133. In this manner, the lid body 130 is formed by plastic processing of a flat plate using press processing.

  The joining member 150 is between the lower surface of the sealing frame 132 of the lid 130 and the upper surface of the substrate 110, specifically, between the lower surface of the frame portion 132a and the upper surface of the substrate 110, and the lower surface of the flange portion 132b. And the upper surface of the substrate 110 for joining the lid 130 and the substrate 110 together. In the case of glass, for example, the joining member 150 is a glass that melts at 300 ° C. to 400 ° C., and is made of, for example, low-melting glass containing vanadium or lead oxide glass. The composition of the lead oxide glass is composed of lead oxide, lead fluoride, titanium dioxide, niobium oxide, boron oxide, zinc oxide, ferric oxide, copper oxide, and calcium oxide.

  Next, a method for joining the lid 130 and the substrate 110 using the joining member 150 will be described. The glass used as the raw material of the joining member 150 is a paste in which a binder and a solvent are added. After being melted, the glass is solidified and bonded to another member. The bonding member 150 is provided by applying and drying glass frit paste on the lower surface of the sealing frame portion 132, specifically, the lower surface of the frame portion 132a and the lower surface of the flange portion 132b by screen printing, for example. Yes.

  In addition, in the case of an insulating resin, for example, the bonding member 150 is made of an epoxy resin or a polyimide resin. At this time, the insulating resin is applied to the lower surface of the sealing frame portion of the lid. The lid body to which the insulating resin is applied is placed so that the insulating resin is sandwiched between the lower surface of the sealing frame portion and the upper surface of the substrate. Thereafter, the insulating resin is heated and cured to join the lid and the substrate.

  The crystal device according to the present embodiment includes a substantially rectangular parallelepiped crystal piece 121, a first excitation electrode portion 122a provided on the upper surface of the crystal piece 121, and an edge of the upper surface of the crystal piece 121 from the first excitation electrode portion 122a. A first wiring portion 123a extending to the first wiring portion, a first lead terminal 124a provided at an edge of the upper surface of the crystal piece 121 so as to be connected to the first wiring portion 123a, and a lower surface of the crystal piece 121 The first mounting terminal 125a provided at a position facing the first extraction terminal 124a, and the first mounting terminal 125a provided so that one end overlaps the first extraction terminal 124a and the other end overlaps the first mounting terminal 125a. The connection portion 126a, the second excitation electrode portion 122a provided on the lower surface of the crystal piece 121, and the second wiring portion 123 extending from the second excitation electrode portion 122b to the edge of the lower surface of the crystal piece 121. The second mounting terminal 125b provided at the edge of the lower surface of the crystal piece 121, the first mounting pad 111, and the second mounting pad 111 are provided on the upper surface so as to be connected to the second wiring portion 122b. A conductive adhesive 140 provided between the substrate 110, the first mounting pad 111 and the first mounting terminal 125a, and between the second mounting pad 111 and the second mounting terminal 125b; A lid 130 joined to the upper surface.

  In this embodiment, with such a configuration, the film thickness in the vertical direction can be increased by the amount of the connecting portion 127 at the end of the upper surface of the crystal piece 121, and perpendicular to the lower surface of the crystal piece 121. In addition, when stress is applied in a direction from the upper surface of the crystal piece 121 toward the lower surface of the crystal piece 121, film peeling due to stress concentration at the end of the upper surface of the crystal piece 121 can be reduced. Therefore, in the present embodiment, even when the conductive adhesive 140 is cured, even when contraction stress is applied in a direction perpendicular to the lower surface of the crystal piece 121 and from the upper surface to the lower surface of the crystal piece 121. Compared with the prior art, film peeling due to stress concentration at the end of the upper surface of the crystal piece 121 can be reduced. For this reason, in this embodiment, it is possible to reduce the occurrence of poor conduction between the lead terminal 124 and the connecting portion 127 due to film peeling, and to reduce the increase in the equivalent series resistance value caused by this poor conduction. It becomes.

  In addition, the crystal device according to the present embodiment includes a second lead terminal 124b provided at a position facing the two mounting terminals 125b on the lower surface of the crystal piece 121, and one end overlapping the second lead terminal 124b while the other end is overlapped. And a second connection portion 126b provided so as to overlap the second mounting terminal 125b. Thus, by providing the 2nd extraction terminal 124b on the upper surface of the crystal piece 121, a voltage is applied to the 1st excitation electrode part 122a and the 2nd excitation electrode part 122b, and the 1st excitation electrode part 122a and the 2nd excitation electrode part When a portion of the crystal piece 121 sandwiched between 122b is subjected to a thickness-shear vibration, a contour-slip vibration in which the contour of the crystal piece 121 vibrates separately from the thickness-slip vibration is equal to the mass of the second lead terminal 124b. Since it becomes difficult to vibrate, it can be attenuated. Therefore, in the present embodiment, it is possible to reduce the increase of the equivalent series resistance value due to the combination of the contour shear vibration and the thickness shear vibration. In the present embodiment, such an effect can be achieved even if the lead terminal 124 is only the first lead terminal 124a. However, the lead terminal 124 is connected to the first lead terminal 124a and the second lead terminal 124b. In this case, it is possible to further reduce the increase in the equivalent series resistance value as compared with the case of only the first lead terminal 124a.

  In the present embodiment, the crystal element 120 is made of a conductive adhesive by providing two first lead terminals 124a and second lead terminals 124b side by side along an edge of a predetermined side of the upper surface of the crystal piece 121. When mounted at 140, the state of the lower surface of the crystal piece 121 and the state of the upper surface of the crystal piece 121 can be made closer. Therefore, in this embodiment, by providing the first extraction terminal 124 a and the second extraction terminal 124 b on the upper surface side of the crystal piece 121, the masses of the first extraction terminal 124 a and the second extraction terminal 124 b on the upper surface side of the crystal piece 121. Therefore, the vibration on the upper surface side of the crystal piece 121 can be affected as compared with the conventional case. As a result, in this embodiment, when the crystal element 120 is mounted with the conductive adhesive 140, the influence on the vibration can be made closer to the lower surface side of the crystal piece 121 and the upper surface side of the crystal piece 121, so that the vibration balance And an increase in the equivalent series resistance value can be further reduced.

  In the crystal device according to the present embodiment, the end of the first connection portion 126 a has an arc shape, and the center of the arc circle is located on the outer edge side of the crystal piece 121. By doing in this way, in this embodiment, when stress is applied in a direction parallel to the lower surface of the crystal piece 121 and inward from the outer edge of the crystal piece 121, this stress is applied to the first connection portion 126a. It is possible to relax at the end. Therefore, in this embodiment, the both ends of the 1st connection part 126a are made into circular arc shape, and the conductive adhesive 140 hardens | cures by making the center of the circle | round | yen of this circular arc be located in the outer edge side of the crystal piece 121. Sometimes, even when contraction stress is applied in a direction parallel to the lower surface of the crystal piece 121 and inward from the outer edge of the crystal piece 121, it can be relaxed at the end of the first connection portion 126a. . For this reason, in this embodiment, the stress applied to the end portion of the crystal piece 121 can be relaxed, and peeling of the first connection portion 126a at the end portion of the crystal piece 121 can be reduced. As a result, the conduction failure between the first connection portion 126a and the first mounting terminal 125a can be reduced, and the equivalent series resistance value due to the conduction failure between the first connection portion 126a and the first mounting terminal 125a is increased. Can be reduced.

  Further, in the present embodiment in which the end portion of the first connection portion 126a has a semicircular shape or a semielliptical shape, the crystal device according to the present embodiment is parallel to the lower surface of the crystal piece 121 in this manner. And even if it is a case where contraction stress is added to the direction which goes to the inner side from the outer edge of the crystal piece 121, it can relieve | moderate more by the edge part of the 1st connection part 126a. For this reason, in this embodiment, the stress applied to the end portion of the crystal piece 121 can be relieved, and peeling of the first connection portion 126a at the end portion of the crystal 121 can be reduced. As a result, in this embodiment, the conduction failure between the first connection portion 126a and the first mounting terminal 125a can be reduced, and the equivalent series resistance value due to the conduction failure between the first connection portion 126a and the first mounting terminal 125a. Can be reduced.

  In the crystal device according to the present embodiment, the width of the first connection portion 126a provided on the side surface of the crystal piece 121 is compared with the width of the first connection portion 126a provided on the upper surface of the crystal piece 121. It is narrower. In the present embodiment, by adopting such a configuration, it is possible to reduce the vibration inhibition to the thickness shear vibration, and it is possible to reduce the increase of the equivalent series resistance value. This is because the thickness shear vibration also vibrates in the end portion of the crystal piece 121. As described above, the thickness shear vibration vibrates in the direction from the upper surface of the crystal piece 121 toward the lower surface of the crystal piece 121, that is, in the thickness direction in the vertical direction of the crystal piece 121, as shown in FIG. . When a voltage is applied to the excitation electrode unit 122, a part of the crystal piece 121 sandwiched between the excitation electrode units 122 vibrates in thickness due to the reverse piezoelectric effect and the piezoelectric effect, but at this time, it is not sandwiched between the excitation electrode units 122. The thickness shear vibration is leaking to the part. Accordingly, although the thickness shear vibration is gradually attenuated from a part of the crystal piece 121 sandwiched between the excitation electrode portions 122, the thickness shear vibration is also present at the end portion of the crystal piece 121. For this reason, depending on the state of the side surface of the crystal piece 121, the thickness shear vibration that vibrates in the thickness direction in the vertical direction of the crystal piece 121 is easily affected. From the above, the area can be reduced by narrowing the width of the connecting portion 126 provided on the side surface portion of the crystal piece 121, the change in the side surface state of the crystal piece 121 can be reduced, and the crystal piece 121. It is possible to further reduce the inhibition of the thickness-shear vibration at the end portion. As a result, it is possible to reduce the vibration inhibition to the thickness shear vibration and to reduce the increase of the equivalent series resistance value.

  In the crystal device according to the present embodiment, the area of the portion where the first extraction terminal 124a and the first connection portion 126a overlap when the upper surface of the crystal piece 121 is viewed in plan is the area of the first extraction terminal 124a. It is more than half of. In the present embodiment, with such a configuration, the first connection portion 126a provided on the upper surface of the crystal piece 121 can more reliably ensure electrical continuity with the first lead terminal 124a. Therefore, in this embodiment, even if the first lead terminal 124a is provided on the inner edge side from the outer edge of the upper surface of the crystal piece 121, the first connection portion 126a and the first lead terminal 124a are more electrically connected. It can be ensured reliably, and it is possible to reduce an increase in the equivalent series resistance value due to poor conduction between the first connection portion 126a and the first lead terminal 124a.

  In the crystal device according to the present embodiment, the conductive adhesive 140 is not only between the first mounting terminal 125a and the first mounting pad 111, but also the other end of the first connection terminal 126a and the first mounting pad 111. It is also provided between. In this embodiment, by doing in this way, when contraction stress is applied when the conductive adhesive 140 is cured, the contraction stress is applied to the first mounting terminal 125a and the first connection portion 126a. Thus, compared with the case where the conductive adhesive 140 is provided only between the mounting pad 111 and the first mounting terminal 125a, the contraction stress applied to the first mounting terminal 125a can be reduced. For this reason, in this embodiment, it becomes possible to reduce that a part of 1st mounting terminal 125a peels by contraction stress, and an equivalent series resistance value becomes large.

  Further, the crystal device according to the present embodiment includes a first excitation electrode portion 122a, a second excitation electrode portion 122b, a first mounting terminal 125a, a second mounting terminal 125b, a first wiring portion 123a, a second wiring portion 123b, The first lead terminal 124a includes a first metal layer M11 and a second metal layer M12 provided on the first metal layer M11, and the first connection portion 126a includes a third metal layer M13 and a third metal layer M13. It consists of a fourth metal layer M14 provided on the metal layer M13. By adopting such a configuration, a crystal piece 121 is used for the second metal layer M12 and the fourth metal layer M14 by using a metal having high adhesion to the crystal piece 121 for the first metal layer M11 and the third metal layer M13. It is possible to use a metal material that is difficult to adhere to. Therefore, in this embodiment, when the crystal element 120 is moved by the suction nozzle or the like and the crystal element 120 is mounted on the substrate 110, the second metal layer M12 and the fourth metal layer M14 are brought into contact with the suction nozzle and the surroundings. Part peeling can be reduced. For this reason, in this embodiment, it becomes possible to reduce an increase in the equivalent series resistance value due to separation of a part of the second metal layer M12 and the fourth metal layer M14.

  The quartz crystal device according to this embodiment uses a metal material different from the second metal layer M12 and the fourth metal M14, and the electric resistivity of the metal material of the fourth metal layer M14 is the second metal layer. It is smaller than the electrical resistivity of the metal material of M12. In the present embodiment, by adopting such a configuration, the electrical resistance of the connection portion 126 including the third metal layer M13 and the fourth metal layer M14 can be reduced, and the same metal as the second metal layer M12 is used. The electric resistance value can be further reduced as compared with the case where a material is used. Therefore, in this embodiment, it becomes possible to reduce the electrical resistance value of the connection part 126, and it can reduce that the equivalent series resistance value of the crystal element 120 and a crystal device becomes large.

  In the quartz crystal device according to this embodiment, a metal material containing gold as a main component is used for the second metal layer M12, and a metal material containing silver as a main component is used for the fourth metal layer M14. In the present embodiment, by using a metal material mainly composed of gold for the second metal layer M12 as described above, the electrical resistance in the excitation electrode portion 122, the wiring portion 123, the extraction terminal 124, and the mounting terminal 125 is suppressed. It is possible to reduce the change in the frequency of the crystal element 120 due to oxidation of the second metal layer M12 with surrounding oxygen. Further, by using a metal material mainly composed of silver for the fourth metal layer M14, the fourth metal layer M14 is oxidized with the surrounding oxygen while suppressing the electric resistance at the connection portion 126, and the frequency of the crystal element 120 is increased. Can be reduced. Here, the case where the fourth metal layer M14 is made of silver has been described. However, in order to reduce the sulfidation of silver, it is a metal mainly composed of silver to which about several percent of palladium or the like is added. Also good. Therefore, by adopting such a configuration, the second metal layer M12 and the fourth metal layer M14 reduce the frequency change caused by alteration due to the surrounding environment while reducing the increase in the equivalent series resistance value. be able to.

  In the present embodiment, the case where the crystal piece has a substantially rectangular flat plate shape is described. However, when the upper surface is viewed in plan, the crystal piece has a substantially rectangular shape, for example, the thickness of the crystal piece in the vertical direction. May be a mesa-type crystal piece that is thick at the center of the crystal piece, or, for example, an inverted mesa-type crystal piece whose thickness in the vertical direction of the crystal piece is thin at the center of the crystal piece. There may be.

110 ... substrate 111 ... mounting pad 112 ... external terminal 120 ... crystal element 121 ... crystal piece 122 ... excitation electrode part 122a ... first excitation electrode part 122b ... first Double excitation electrode part 123... Wiring part 123 a... First wiring part 123 b... Second wiring part 124 .. extraction terminal 124 a... First extraction terminal 124 b. ..Mounting terminal 125a ... first mounting terminal 125b ... second mounting terminal 126 ... connecting portion 126a ... first connecting portion 126b ... second connecting portion 130 ... lid body 131 .... Sealing base part 132 ... Sealing frame part 140 ... Conductive adhesive 150 ... Joining member

Claims (7)

An approximately rectangular parallelepiped crystal piece;
A first excitation electrode provided on an upper surface of the crystal piece;
A first wiring portion extending from the first excitation electrode portion to the edge of the upper surface of the crystal piece;
A first lead terminal provided at an edge of the upper surface of the crystal piece so as to be connected to the first wiring part;
A first mounting terminal provided at a position facing the first lead terminal on the lower surface of the crystal piece;
A first connection portion provided so that one end overlaps the first lead terminal and the other end overlaps the first mounting terminal;
A second excitation electrode portion provided on the lower surface of the crystal piece;
A second wiring portion extending from the second excitation electrode portion to the edge of the lower surface of the crystal piece;
A second mounting terminal provided at an edge of the lower surface of the crystal piece so as to connect to the second wiring portion;
A substrate on which the first mounting pad and the second mounting pad are provided on the upper surface;
A conductive adhesive provided between the first mounting pad and the first mounting terminal; and between the second mounting pad and the second mounting terminal;
A lid joined to the upper surface of the substrate,
The width of the first connection portion provided on the crystal piece when the side surface of the crystal piece is viewed in plan is the width of the first connection portion provided on the upper surface of the crystal piece when the top surface of the crystal piece is viewed in plan. A crystal device that is narrower than the width of the connection. The crystal device according to claim 1,
A second lead terminal provided at a position facing the second mounting terminal on the lower surface of the crystal piece;
A second connection portion provided so that one end overlaps the second lead terminal and the other end overlaps the second mounting terminal;
A crystal device characterized by comprising: The crystal device according to claim 1,
In plan view of the upper surface of the crystal piece,
A quartz crystal device in which an area of a portion where the first lead terminal and the first connection portion overlap is more than half of an area of the first lead terminal. The crystal device according to claim 1,
The crystal device in which the conductive adhesive is provided not only between the first mounting terminal and the first mounting pad but also between the other end of the first connection portion and the first mounting pad. . The crystal device according to claim 1,
The first excitation electrode part, the second excitation electrode part, the first mounting terminal, the second mounting terminal, the first wiring part, the second wiring part, and the first lead terminal are a first metal layer and The second metal layer provided on the first metal layer,
The quartz crystal device, wherein the first connection portion includes a third metal layer and a fourth metal layer provided on the third metal layer. The crystal device according to claim 5,
Different metal materials are used for the second metal layer and the fourth metal layer,
A quartz crystal device in which an electrical resistivity of the metal material of the fourth metal layer is smaller than an electrical resistivity of the metal material of the second metal layer. The crystal device according to claim 6,
A quartz crystal device in which a metal material mainly composed of gold is used for the second metal layer, and a metal material mainly composed of silver is used for the fourth metal layer.

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