JP6559075B2 - High frequency device and high frequency module - Google Patents

Description

  The present invention relates to a high-frequency device and a high-frequency module including a plurality of high-frequency signal generation sources.

  In the high-frequency device and the high-frequency module, electromagnetic resonance occurs due to the closed space formed by the package or the casing, and the isolation in the package near the use frequency is lowered. Due to the lowering of isolation, frequency ripple is generated, and oscillation occurs depending on the state.

  In order to avoid this problem, conventionally, as disclosed in Patent Document 1, an electromagnetic wave absorber is adhered to a package or a casing.

Japanese Patent No. 4610134

  However, the electromagnetic wave absorber alone may not ensure the necessary isolation. In recent years, the required amount of isolation tends to increase due to the higher gain of the amplifier mounted in the package. There is a need for a strategy to make it easier.

  The present invention has been made in view of the above, and an object of the present invention is to obtain a high-frequency device that achieves high isolation in a package.

  In order to solve the above-described problems and achieve the object, the present invention includes an integrated circuit having a plurality of elements, a package surrounding the integrated circuit, and an electromagnetic wave absorber installed outside the package. In the present invention, the package has a package base on which the integrated circuit is mounted, a cylindrical shape surrounding the integrated circuit from the side, a seal ring having one end fixed to the package base, a plate shape, and a seal ring. The other end of the cover. In the present invention, at least one of the package base, the seal ring, and the cover includes a slot that radiates a high-frequency signal generated in the integrated circuit to the outside of the package, and the electromagnetic wave absorber is provided at least at a position facing the slot. Yes.

  According to the present invention, it is possible to obtain a high-frequency device that achieves high isolation in a package.

Sectional drawing which shows the structure of the high frequency device which concerns on Embodiment 1 of this invention The perspective view of the package of the high frequency device concerning Embodiment 1 Sectional drawing which shows the structure of the high frequency device concerning Embodiment 2 of this invention Three views of a package cover of a high-frequency device according to the second embodiment Sectional drawing which shows the structure of the high frequency device concerning Embodiment 3 of this invention Three views of the cover of the package of the high-frequency device according to the third embodiment Three views showing another structure of the cover of the high-frequency device according to the third embodiment Sectional drawing which shows the structure of the high frequency module concerning Embodiment 4 of this invention

  Hereinafter, high-frequency devices and high-frequency modules according to embodiments of the present invention will be described in detail with reference to the drawings. Note that the present invention is not limited to the embodiments.

Embodiment 1 FIG.
FIG. 1 is a cross-sectional view showing the configuration of the high-frequency device according to Embodiment 1 of the present invention. The high-frequency device 10 includes an integrated circuit 2 in which a plurality of elements are integrated, and a package 3 that covers the integrated circuit 2. Examples of elements integrated in the integrated circuit 2 include, but are not limited to, a switching element, an amplifier, and a circulator. The integrated circuit 2 is exemplified by a monolithic microwave integrated circuit, but is not limited thereto. The package 3 includes a package base 1 on which the integrated circuit 2 is mounted, a square cylindrical seal ring 3a, and a plate-like cover 3b. One end side 3a1 of the seal ring 3a is fixed to the package base 1, and the other end side 3a2 is closed by a cover 3b. The package base 1 includes a feedthrough 1a straddling the inside and outside of the seal ring 3a. The integrated circuit 2 and the feedthrough 1a are connected by a wire 4.

  An electromagnetic wave absorber 5 is installed outside the package 3.

  FIG. 2 is a perspective view of the package of the high-frequency device according to the first embodiment. In FIG. 2, the surface current flowing through the package 3 in the TE (Transverse Electric) 101 mode is indicated by an arrow. The seal ring 3 a and the cover 3 b are provided with a slot 6. The slot 6 is provided by forming a slit in the seal ring 3a and the cover 3b. The slot 6 is orthogonal to the surface current flowing through the package 3 in the TE101 mode. Therefore, the high frequency signal generated in the high frequency device 10 is efficiently radiated from the slot 6 to the outside of the package 3.

  The high frequency signal radiated from the slot 6 to the outside of the package 3 is absorbed by the electromagnetic wave absorber 5.

The distribution of the surface current flowing through the package 3 can be calculated based on the dimensions of the package 3 and the dimensions and materials of the mounted components inside the package. Therefore, the slot 6 can be designed to be orthogonal to the surface current flowing through the package 3 when the high-frequency device 10 is designed.

  In addition, the electromagnetic wave absorber 5 should just be arrange | positioned facing the slot 6 at least. Further, the electromagnetic wave absorber 5 may be installed in a state having a gap between the slot 6.

  In the above description, the slot 6 is provided in the seal ring 3a and the cover 3b. However, the slot 6 may be provided in the package base 1. That is, at least one of the package base 1, the seal ring 3 a, and the cover 3 b only needs to include the slot 6 that radiates a high-frequency signal generated in the integrated circuit 2 to the outside of the package 3.

  In the above description, the slot 6 is provided in a direction orthogonal to the surface current flowing in the package 3 in the TE101 mode. However, the surface current and the slot 6 do not necessarily have to be orthogonal. That is, the slot 6 may be provided in a direction that intersects the surface current flowing in the package 3 at a non-right angle. Further, the slot 6 may be provided in a direction that intersects perpendicularly or non-orthogonally with the surface current flowing in the package 3 in a mode other than the TE101 mode.

  In the high frequency device 10 according to the first embodiment, a high frequency signal propagating through the package 3 is radiated out of the package 3 through the slot 6 and absorbed by the electromagnetic wave absorber 5. Therefore, the electromagnetic resonance of the high-frequency signal in the package 3 is suppressed, and high isolation in the package 3 can be realized.

Embodiment 2. FIG.
FIG. 3 is a cross-sectional view showing the configuration of the high-frequency device according to Embodiment 2 of the present invention. The high-frequency device 10 according to the second embodiment includes the integrated circuit 2 mounted on the package base 1 and the package 3 that covers the integrated circuit 2 as in the first embodiment. Different.

  The cover 3b of the package 3 of the high frequency device 10 according to the second embodiment includes a lid portion 36 that contacts the other end of the seal ring 3a, an electromagnetic wave absorber 32 installed on the inner surface of the lid portion 36, and electromagnetic wave absorption. And a metallized layer 31 provided on the entire surface of the body 32.

  FIG. 4 is a three-side view of the cover of the package of the high-frequency device according to the second embodiment. In the cover 3b of the package 3 according to the second embodiment, by forming the slot 31a in the metallized layer 31, the high frequency signal generated by the element on the integrated circuit 2 is radiated from the slot 31a to the lid portion 36 side. It is absorbed by the electromagnetic wave absorber 32.

  Since the high-frequency device 10 according to the second embodiment does not have a slot in the seal ring 3a and the lid portion 36, airtightness can be ensured and the electromagnetic wave absorber 32 can be accommodated in the package 3. , Increase in size of the device can be suppressed.

Embodiment 3 FIG.
FIG. 5 is a cross-sectional view showing the configuration of the high-frequency device according to Embodiment 3 of the present invention. FIG. 6 is a three-side view of the cover of the package of the high-frequency device according to the third embodiment. The cover 3b of the package 3 according to the third embodiment includes a lid portion 36 that contacts the other end of the seal ring 3a, an electromagnetic wave absorber 33 installed on the inner surface of the lid portion 36, and the electromagnetic wave absorber 33. And a conductive plate 34 disposed in parallel with the lid portion 36. The conductive plate 34 has a reduced shape of the outer shape of the lid portion 36 and is installed with a gap between the conductive plate 34 and the seal ring 3a. That is, as shown in FIG. 5, a slot 37 is formed by a gap between the conductive plate 34 and the seal ring 3a. A high-frequency signal generated by an element on the integrated circuit 2 is radiated from the slot 37 toward the lid 36 and reaches the electromagnetic wave absorber 33 through a parallel plate mode waveguide between the cover 3 b and the conductive plate 34. And absorbed. Although FIG. 5 illustrates a configuration in which the peripheral edge of the conductive plate 34 protrudes from the electromagnetic wave absorber 33, the peripheral edge of the conductive plate 34 may not protrude from the electromagnetic wave absorber 33.

  Since the high-frequency device 10 according to the third embodiment does not have a slot in the seal ring 3a and the lid portion 36, airtightness can be ensured, and the electromagnetic wave absorber 33 can be accommodated in the package 3. , Increase in size of the device can be suppressed.

  FIG. 7 is a trihedral view showing another structure of the cover of the high-frequency device according to the third embodiment. The cover 3b shown in FIG. 7 includes an electromagnetic wave absorber 33 installed on the inner surface of the lid portion 36, and a conductive plate 34 installed in parallel with the lid portion 36 via the electromagnetic wave absorber 33. A dielectric 35 is provided in a gap between the portion 36 and the conductive plate 34. The gap between the lid portion 36 and the conductive plate 34 referred to here is a portion around the electromagnetic wave absorber 33. By installing the dielectric 35 between the lid 36 and the conductive plate 34, the wavelength of the high-frequency signal is shortened, so that there is an effect of miniaturization.

Embodiment 4 FIG.
FIG. 8 is a cross-sectional view showing the configuration of the high-frequency module according to Embodiment 4 of the present invention. A printed circuit board 21 on which a plurality of high-frequency devices are mounted, and a housing 22 that houses the printed circuit board 21 are provided. The housing 22 includes a side wall portion 22a that covers the printed circuit board 21 from the side, a top surface portion 22b that covers the printed circuit board 21 from above, and a bottom surface portion 22c that covers the printed circuit board 21 from below. That is, the outer surface of the housing 22 is configured by the top surface portion 22b, the side wall portion 22a, and the bottom surface portion 22c. A conductive plate 24 is installed on the inner side surface of the top surface portion 22 b via an electromagnetic wave absorber 23.

  The conductive plate 24 is a reduced shape of the outer shape of the top surface portion 22b. Therefore, as shown in FIG. 8, a gap is formed between the conductive plate 24 and the side wall portion 22a. A gap between the conductive plate 24 and the side wall portion 22 a constitutes a slot 25. The high-frequency signals generated by the plurality of high-frequency devices 10 are radiated to the top surface portion 22 b side by the slots 25, and reach the electromagnetic wave absorber 23 through the parallel plate mode waveguide between the top surface portion 22 b and the conductive plate 24. And absorbed. Although FIG. 8 illustrates a configuration in which the peripheral portion of the conductive plate 24 protrudes from the electromagnetic wave absorber 23, the peripheral portion of the conductive plate 24 may not protrude from the electromagnetic wave absorber 32.

  The high-frequency module 20 according to the fourth embodiment is an application of the structure of the high-frequency device 10 according to the third embodiment, and can achieve high isolation in the housing 22. In the above description, a plurality of high-frequency devices are mounted on the printed circuit board 21, but the present invention is not limited to high-frequency devices. Moreover, you may install the electromagnetic wave absorber 23 and the electroconductive plate 24 other than the top | upper surface part 22b. That is, the electromagnetic wave absorber 23 and the conductive plate 24 may be installed on at least one of the outer surfaces of the housing 22.

  In addition, although the high frequency module which applied the structure of the high frequency device which concerns on Embodiment 3 was demonstrated here, the structure of the high frequency device which concerns on Embodiment 1, 2 can also be applied to a high frequency module. That is, a slot that radiates a high-frequency signal generated by the high-frequency device to the outside of the casing 22 may be provided on at least one surface of the casing 22, and an electromagnetic wave absorber may be provided at least at a location facing the slot. Further, an electromagnetic wave absorber in which a metallized layer is formed on the surface and a slot is formed in the metallized layer may be provided on the inner surface of at least one surface of the housing 22.

  The high-frequency module 20 according to the fourth embodiment can ensure airtightness because no slit is provided in the housing 22, and has a structure in which the electromagnetic wave absorber 23 is accommodated in the housing 22. Increase in size can be suppressed.

  The configuration described in the above embodiment shows an example of the contents of the present invention, and can be combined with another known technique, and can be combined with other configurations without departing from the gist of the present invention. It is also possible to omit or change the part.

1 package base, 1a feedthrough, 2 integrated circuit, 3 package, 3a seal ring, 3a1 one end side, 3a2 other end side, 3b cover, 4 wires, 5, 23, 32, 33 electromagnetic wave absorber, 6, 25, 31a , 37 slots, 10 high frequency devices, 20 high frequency modules, 21 printed circuit boards, 22 housings, 22a side walls, 22b top surfaces, 22c bottom surfaces, 24, 34 conductive plates, 31 metallized layers, 35 dielectrics, 36 lids Department.

Claims (7)

An integrated circuit having a plurality of elements, a package surrounding the integrated circuit, and an electromagnetic wave absorber disposed outside the package,
The package is
A package base on which the integrated circuit is mounted;
Presenting a cylindrical shape surrounding the integrated circuit from the side, a seal ring having one end fixed to the package base;
A cover having a plate shape and closing the other end of the seal ring,
The package base, the seal ring and at least the package base or the sealing ring of the cover is provided with a slot that emits high-frequency signal generated in the integrated circuit to the outside the package,
The high-frequency device, wherein the electromagnetic wave absorber is provided at least at a position facing the slot.   The high-frequency device according to claim 1, wherein the slot is provided in a direction orthogonal to a surface current flowing on a surface of the package. A printed circuit board on which a plurality of high-frequency devices are mounted, a box-shaped housing that accommodates the printed circuit board, and an electromagnetic wave absorber installed outside the housing,
The housing includes a slot that radiates a high-frequency signal generated by the high-frequency device to the outside of at least the bottom surface or the side surface of the bottom surface, the side surface, and the top surface .
The high-frequency module, wherein the electromagnetic wave absorber is provided at least at a position facing the slot. The high frequency module according to claim 3 , wherein the slot is provided in a direction orthogonal to a surface current flowing on a surface of the housing. A printed circuit board on which a plurality of high-frequency devices are mounted, and a box-shaped housing that houses the printed circuit board,
At least the bottom surface or the side surface of the bottom surface, the side surface, and the top surface of the housing is provided on the inner surface, the metallized layer formed on the surface of the electromagnetic wave absorber, and the metallized layer. A high frequency module comprising a slot. A printed circuit board on which a plurality of high-frequency devices are mounted, and a box-shaped housing that houses the printed circuit board,
The housing is installed in parallel with the electromagnetic wave absorber installed on at least the bottom surface or the inner surface of the side surface among the bottom surface, the side surface, and the top surface, and the surface on which the electromagnetic wave absorber is installed via the electromagnetic wave absorber. A conductive plate,
The high-frequency module according to claim 1, wherein the conductive plate has a reduced shape of an outer shape of the surface on which the electromagnetic wave absorber is installed, and is installed with a gap between a peripheral portion and the housing. The high frequency module according to claim 6 , wherein a dielectric is installed in a gap between the inner surface of the housing on which the electromagnetic wave absorber is installed and the conductive plate.

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