JP6049073B2 - Electronics - Google Patents

Description

  The present invention relates to an electronic device, and more particularly to an electronic device on which a plurality of mounting boards are mounted.

  In recent years, as electronic devices have become smaller in size, a technology for mounting electronic components on a mounting substrate at a high density has become important. Patent Document 1 discloses a technique related to a submarine repeater unit in which a plurality of circuit units are housed in a casing. Patent Document 2 discloses a technique related to a case for an electric facility that can be submerged in water.

JP-A-1-26559 JP-A-2-13883

  As described in the background art, as electronic devices are miniaturized, a technology for mounting electronic components on a mounting board at a high density has become important. On the other hand, when electronic devices are mounted at a high density in a limited space, such as the submarine repeater unit disclosed in Patent Document 1, a structure that efficiently dissipates heat generated from electronic components is required. It becomes.

  In view of the above problems, an object of the present invention is to provide an electronic device having a structure capable of efficiently radiating heat generated from an electronic component.

  An electronic apparatus according to the present invention includes a plurality of mounting boards each mounted with an electronic component, and a housing on which the plurality of mounting boards are mounted. The electronic component includes a first terminal portion and the first terminal. A second terminal portion spaced apart from the terminal portion, and a first concavo-convex portion formed at least in part between the first terminal portion and the second terminal portion. The mounting substrate includes a second concavo-convex portion including a convex portion facing the convex portion provided in the first concavo-convex portion, and the plurality of mounting substrates include the convex portions of the second concavo-convex portion. Are arranged in the circumferential direction of the side wall of the casing so as to face each other, and the casing-side surface of the mounting substrate is mounted in contact with the inner surface of the side wall of the casing. It is configured to be able to transfer heat from the substrate, and the side wall of the casing is continuous in the circumferential direction.

  According to the present invention, it is possible to provide an electronic apparatus having a structure capable of efficiently radiating heat generated from an electronic component.

It is a top view of the transformer with which the electronic device concerning an embodiment is provided. It is a side view of the transformer with which the electronic device concerning an embodiment is provided. It is sectional drawing in the cutting | disconnection line IC-IC of the transformer shown to FIG. 1B. It is sectional drawing in cutting line ID-ID of the trans | transformer shown to FIG. 1B. It is sectional drawing in the cutting | disconnection line IE-IE of the trans | transformer shown to FIG. 1A. It is a top view of the mounting substrate with which the electronic device concerning an embodiment is provided. It is a side view of the mounting substrate with which the electronic device concerning an embodiment is provided. It is a top view which shows the state which mounted the transformer on the mounting board | substrate. It is a side view which shows the state which mounted the transformer on the mounting board | substrate. It is an enlarged view near the uneven | corrugated | grooved part of a transformer and a mounting substrate. It is an enlarged view near the uneven | corrugated | grooved part of a transformer and a mounting substrate. It is an enlarged view near the uneven | corrugated | grooved part of a transformer and a mounting substrate. It is a side view of the housing | casing with which the electronic device concerning embodiment is provided. It is sectional drawing in the cutting | disconnection line VIIB-VIIB of the housing | casing shown to FIG. 8A. It is a side view which shows an example which mounted the mounting board | substrate in the housing | casing. It is a front view which shows an example which mounted the mounting board | substrate in the housing | casing. It is a figure which shows an example which mounted the mounting substrate in the housing | casing, and is the figure which looked at the mounting substrate from the top. It is a side view which shows an example which mounted the mounting board | substrate in the housing | casing. It is a side view which shows the other example which mounted the mounting board | substrate in the housing | casing. It is a side view which shows the other example which mounted the mounting board | substrate in the housing | casing. It is a front view which shows the other example which mounted the mounting board | substrate in the housing | casing. It is a front view which shows the other example which mounted the mounting board | substrate in the housing | casing. It is a front view which shows the other example which mounted the mounting board | substrate in the housing | casing.

  Embodiments of the present invention will be described below with reference to the drawings. Hereinafter, a transformer will be described as an example of an electronic component included in the electronic device, but the present invention can be applied to any electronic component as long as the electronic component is used at a high voltage. Examples of electronic components other than the transformer include a relay, a photocoupler, and a sensor.

  In the following, a transformer having a core part will be described, but the present invention can also be applied to a transformer having no core part. In other words, the core portion is not necessarily provided as long as the primary side conductor layer and the secondary side conductor layer provided in the transformer main body portion can be magnetically coupled. Generally, the conversion efficiency of the transformer is higher when the core portion is provided. However, for example, when the transformer is driven in a high frequency band, sufficient conversion efficiency may be obtained without providing the core portion.

  First, the transformer provided in the electronic device according to the present embodiment will be described. FIG. 1A is a top view of a transformer provided in the electronic apparatus according to the present embodiment. FIG. 1B is a side view of a transformer provided in the electronic apparatus according to the present embodiment. FIG. 1C is a cross-sectional view taken along a cutting line IC-IC of the transformer shown in FIG. 1B. 1D is a cross-sectional view taken along section line ID-ID of the transformer shown in FIG. 1B. FIG. 1E is a cross-sectional view taken along line IE-IE of the transformer shown in FIG. 1A.

  As shown in FIGS. 1A and 1B, the transformer 1 included in the electronic apparatus according to the present embodiment includes a transformer main body 10 and a core 12. The transformer main body 10 includes a base material 11, a primary conductor layer 21, and a secondary conductor layer 26 (see FIGS. 1C to 1E).

  The base material 11 is a structure serving as a base material of the transformer main body 10 and can be configured using an insulating material. The base material 11 includes a first terminal portion 18 at the end of the primary side 16 of the base material 11. In addition, the base material 11 includes a second terminal portion 19 at the end of the secondary side 17 of the base material 11. For example, the transformer main body 10 has a rectangular shape, and the first terminal 18 and the second terminal 19 are arranged at the respective ends in the longitudinal direction of the transformer main body 10. The 1st terminal part 18 is a terminal connected with the primary side conductor layer 21 (refer FIG. 1C). The 2nd terminal part 19 is a terminal connected with the secondary side conductor layer 26 (refer FIG. 1D). The first terminal portion 18 and the second terminal portion 19 are exposed to the outside of the base material 11 at the ends of the primary side 16 and the secondary side 17 of the base material 11, respectively.

  The at least part of the surface of the base material 11 between the first terminal portion 18 and the second terminal portion 19 is provided with an uneven portion 13 (convex portion 14 and concave portion 15: first uneven portion). Yes. In the example shown in FIG. 1A and FIG. In other words, the uneven portion 13 is formed on the surface disposed between the first terminal portion 18 and the second terminal portion 19 among the surfaces of the base material 11.

  As shown in FIG. 1C, the primary conductor layer 21 is provided in the base material 11 and is electrically connected to the first terminal portion 18. The primary conductor layer 21 corresponds to the primary winding of the transformer. For example, the primary conductor layer 21 extends from the first terminal portion 18 toward the secondary side 17, and is formed so as to go around the core portion 12 provided in the through hole 20 of the base material 11. At this time, one end of the primary conductor layer 21 is connected to the first terminal portion 18_1, and the other end is connected to the first terminal portion 18_2. The primary conductor layer 21 can be configured using a metal material such as copper or aluminum, for example.

  In addition, in FIG. 1E, although the case where the transformer main body 10 includes four primary conductor layers 21 is shown as an example, the number of layers of the primary conductor layers 21 can be arbitrarily determined. When the plurality of primary conductor layers 21 are provided, the plurality of primary conductor layers 21 can be electrically connected to each other through, for example, through holes. The plurality of primary conductor layers 21 can be electrically connected to each other by connecting the plurality of first terminal portions 18 to each other, for example.

  As shown in FIG. 1D, the secondary conductor layer 26 is provided in the base material 11 and is electrically connected to the second terminal portion 19. The secondary conductor layer 26 corresponds to the secondary winding of the transformer. For example, the secondary conductor layer 26 is formed so as to extend from the second terminal portion 19 in the direction of the primary side 16 and to make a round of the core portion 12 provided in the through hole 20 of the base material 11. At this time, one end of the secondary conductor layer 26 is connected to the second terminal portion 19_1, and the other end is connected to the second terminal portion 19_2. The secondary conductor layer 26 can be configured using a metal material such as copper or aluminum, for example.

  1E shows a case where the transformer main body 10 includes four secondary conductor layers 26 as an example, the number of layers of the secondary conductor layers 26 can be arbitrarily determined. When a plurality of secondary conductor layers 26 are provided, the plurality of secondary conductor layers 26 can be electrically connected to each other through, for example, through holes. In addition, the plurality of secondary conductor layers 26 can be electrically connected to each other, for example, by connecting the plurality of second terminal portions 19 to each other.

  As shown to FIG. 1E, the primary side conductor layer 21 and the secondary side conductor layer 26 are mutually laminated | stacked through the insulating material (base material 11). In the example shown in FIG. 1E, a plurality of primary conductor layers 21 are arranged near the central portion in the stacking direction, and a plurality of secondary conductor layers 26 are arranged on the end portions (upper surface side and lower surface side) in the stacking direction. ing. However, the arrangement of the primary conductor layer 21 and the secondary conductor layer 26 shown in FIG. 1E is an example, and the arrangement of the primary conductor layer 21 and the secondary conductor layer 26 can be arbitrarily determined.

  Moreover, you may comprise the base material 11 using a some insulator board | substrate. In this case, the transformer body 10 can be configured by laminating a plurality of primary conductor layers 21, a plurality of insulator substrates, and a plurality of secondary conductor layers 26. As the insulator substrate constituting the base material 11, for example, a glass epoxy substrate, a glass composite substrate, a paper epoxy substrate, a bakelite substrate, or the like can be used.

  When the base material 11 is constituted by using a plurality of insulator substrates, it is preferable to use an insulator substrate made of the same material for each insulator substrate constituting the base material 11. By using an insulating substrate made of the same material, the resistance of the transformer body 10 to vibration and impact can be increased. Further, by using an insulating substrate made of the same material, the thermal expansion coefficient of the insulating substrate constituting the transformer main body 10 can be made substantially equal, and the temperature cycle characteristics of the transformer main body 10 can be improved. it can.

  The core portion 12 is disposed so as to surround at least a part of the primary conductor layer 21 and at least a part of the secondary conductor layer 26. The core part 12 can be comprised using magnetic materials, such as a ferrite. By surrounding the primary side conductor layer 21 and the secondary side conductor layer 26 with the core portion 12, the primary side conductor layer 21 and the secondary side conductor layer 26 can be magnetically coupled. As shown in FIGS. 1A and 1B, the core portion 12 is provided so as to cover the periphery of the transformer main body portion 10 near the secondary side 17. Moreover, as shown in FIGS. 1C and 1D, a part of the core portion 12 is inserted through a through hole 20 formed in the base material 11.

  Here, in the transformer included in the electronic apparatus according to the present embodiment, the voltage of the first terminal unit 18 is higher than the voltage of the second terminal unit 19. Therefore, the core part 12 is provided in the 2nd terminal part 19 side with a low voltage. In other words, the distance between the end portion of the core portion 12 on the first terminal portion 18 side and the first terminal portion 18 is equal to the end portion of the core portion 12 on the second terminal portion 19 side and the second terminal portion 19. And longer than the distance.

  As shown to FIG. 1E, the core part 12 can be comprised using the core members 12a and 12b whose cross-sectional shape is E type. And the core part 12 can be attached to the transformer main body part 10 by sandwiching the transformer main body part 10 between the core members 12a and 12b. As shown in FIG. 1E, since the primary side conductor layer 21 and the secondary side conductor layer 26 are embedded in the base material 11, they do not come into direct contact with the core part 12 and the insulation is maintained.

  In the transformer according to the present embodiment, a high voltage is applied to the first terminal portion 18. Here, since the first terminal portion 18 is exposed to the outside of the base material 11, the creepage distance between the first terminal portion 18 and the second terminal portion 19 (when the core portion 12 is grounded) Needs to ensure a creepage distance between the first terminal portion 18 and the core portion 12. Therefore, in the transformer according to the present embodiment, the concavo-convex portion 13 (the convex portion 14 and the concave portion 15) is formed on at least a part of the surface of the base material 11 between the first terminal portion 18 and the second terminal portion 19. Forming.

  In the present embodiment, since the voltage of the first terminal portion 18 is higher than the voltage of the second terminal portion 19, the convex portion disposed between the first terminal portion 18 and the core portion 12. 14 and the number of the recessed parts 15 are made larger than the number of the convex parts 14 and the recessed parts 15 arrange | positioned between the 2nd terminal part 19 and the core part 12. FIG.

  Next, a mounting board on which the transformer 1 is mounted will be described. FIG. 2A is a top view of a mounting board provided in the electronic apparatus according to the present embodiment. FIG. 2B is a side view of the mounting board provided in the electronic apparatus according to the present embodiment. As shown in FIGS. 2A and 2B, the mounting substrate 30 includes a third terminal portion 31, a fourth terminal portion 32, a through hole 36, and a concavo-convex portion 33 (second concavo-convex portion). In addition, the mounting substrate 30 includes a terminal portion 39 for grounding the core portion 12 of the transformer 1.

  The through hole 36 is formed at a position corresponding to the position where the transformer 1 is disposed (that is, a position corresponding to a position between the core portion 12 and the first terminal portion 18; see FIG. 3A). The mounting substrate 30 is disposed on both sides of the through hole 36 when the mounting substrate 30 is viewed in plan, and the side on which the fourth terminal portion 32 is disposed from the side on which the third terminal portion 31 is disposed. A first region 37 and a second region 38 extending to

  In the first and second regions 37 and 38, a concavo-convex portion 33 (a convex portion 34 and a concave portion 35) is formed, respectively. For example, the concavo-convex portion 33 can be formed on the entire periphery of the first and second regions 37 and 38. That is, the uneven portion 33 can be formed on the front and back surfaces of the mounting substrate 30, the side surface of the through hole 36, and the side surface of the mounting substrate 30 in the first region 37. Similarly, the uneven portion 33 can be formed on the front and back surfaces of the mounting substrate 30, the side surface of the through hole 36, and the side surface of the mounting substrate 30 in the second region 38. The uneven portion 33 is formed at a position corresponding to the uneven portion of the transformer 1 to be mounted.

  For example, the mounting substrate 30 may be configured by laminating a plurality of insulator substrates. In this case, it is preferable to use an insulator substrate made of the same material for each insulator substrate constituting the mounting substrate 30. By using an insulating substrate made of the same material, resistance to vibration and impact of the mounting substrate 30 can be increased. In addition, by using the insulating substrate made of the same material, the thermal expansion coefficients of the insulating substrate constituting the mounting substrate 30 can be made substantially equal, and the temperature cycle characteristics of the mounting substrate 30 can be improved.

  Next, a case where the transformer 1 is mounted on the mounting substrate 30 will be described. FIG. 3A is a top view showing a state in which the transformer is mounted on the mounting board. FIG. 3B is a side view showing a state in which the transformer is mounted on the mounting board. As shown in FIG. 3B, the first terminal portion 18 of the transformer 1 is electrically connected to the third terminal portion 31 of the mounting substrate 30 using a lead member 27. Further, the second terminal portion 19 of the transformer 1 is electrically connected to the fourth terminal portion 32 of the mounting substrate 30 using the lead member 28. Further, the core portion 12 of the transformer 1 is electrically connected to a grounding terminal portion 39 using a lead member 29.

  Here, the lead members 27, 28, and 29 may be used as a fixing member that electrically connects the transformer 1 and the mounting substrate 30 and fixes the transformer 1 to the mounting substrate 30. Note that a fixing member may be provided separately from the lead members 27, 28, and 29 to fix the transformer 1 to the mounting substrate 30. Part of the heat generated in the transformer 1 is transmitted to the mounting substrate 30 through the lead members 27, 28, and 29.

  As shown in FIGS. 3A and 3B, in the present embodiment, the uneven portion 13 of the transformer 1 and the uneven portion 33 of the mounting substrate 30 are mounted so as to correspond to each other. In other words, the convex portion 14 of the transformer 1 is disposed so as to face the convex portion 34 of the mounting substrate 30. Further, the recess 15 of the transformer 1 is arranged so as to face the recess 35 of the mounting substrate 30. In other words, the phase of the concavo-convex portion 13 of the transformer 1 and the phase of the concavo-convex portion 33 of the mounting substrate 30 are arranged to be substantially the same.

  Thus, even if the transformer 1 and the mounting substrate 30 are close to each other by arranging the convex portion 14 and the convex portion 34 so as to face each other, the creepage distance in the concave-convex portion of the transformer 1 and the mounting substrate 30. It can suppress that the creepage distance in the uneven | corrugated | grooved part reduces. Therefore, the transformer 1 and the mounting substrate 30 can be arranged close to each other while maintaining the insulation between the transformer 1 and the mounting substrate 30, so that the transformer 1 can be mounted on the mounting substrate 30 in a compact manner.

  FIG. 4 is an enlarged view of the vicinity of the concave and convex portions of the transformer 1 and the mounting substrate 30. As shown in FIG. 4, the creeping distance d <b> 1 in the uneven portion 13 of the transformer 1 is a distance along the uneven portion 13. Further, the creepage distance d <b> 2 in the uneven portion 33 of the mounting substrate 30 is a distance along the uneven portion 33. Here, in the present embodiment, the convex portion 14 of the transformer 1 and the convex portion 34 of the mounting substrate 30 are arranged so as to face each other. In other words, the phase of the uneven portion 13 of the transformer 1 and the phase of the uneven portion 33 of the mounting substrate 30 are configured to be substantially the same.

  Thus, by arranging the convex portion 14 and the convex portion 34 so as to face each other, even when the transformer 1 and the mounting substrate 30 are close to each other, the creepage distance d1 in the concave-convex portion 13 of the transformer 1 It is possible to suppress the creepage distance d2 in the uneven portion 33 of the mounting substrate 30 from decreasing.

  That is, as shown in FIG. 6, when the position of the convex portion 14 of the transformer 1 and the position of the convex portion 34 of the mounting substrate 30 are shifted from each other, the creepage distance in the concave and convex portion 13 of the transformer 1 and the mounting substrate 30 The creepage distance in the uneven portion 33 is the creepage distance d3. That is, when the phase of the uneven portion 13 of the transformer 1 and the phase of the uneven portion 33 of the mounting substrate 30 are shifted, the creeping distance passing through the uneven portions 13 and 33 is the tip of the convex portion 14 and the tip of the convex portion 34. The creeping distance along the side walls and the bottom surface of the recesses 15 and 35 is ignored. For this reason, the creepage distance which passes along the uneven parts 13 and 33 becomes short.

  On the other hand, in the present embodiment, the phase of the concavo-convex portion 13 of the transformer 1 and the phase of the concavo-convex portion 33 of the mounting substrate 30 are configured to be substantially the same. Therefore, even when the uneven portion 13 of the transformer 1 and the uneven portion 33 of the mounting substrate 30 are close to each other, the creeping distance d1 in the uneven portion 13 of the transformer 1 and the creeping distance d2 in the uneven portion 33 of the mounting substrate 30 are the same. Decrease can be suppressed. Therefore, the transformer 1 and the mounting substrate 30 can be arranged close to each other while maintaining the insulation between the transformer 1 and the mounting substrate 30, and the transformer 1 can be mounted on the mounting substrate 30 in a compact manner.

  Here, the insulation between terminals depends on the shortest creepage distance among the creepage distances between the terminals. For this reason, even if the concave portion 35 is formed deeper than the concave portion 15, for example, the insulating property is determined by the creepage distance passing through the concave portion 15. Therefore, it is preferable that the depth of the recess 15 included in the uneven portion 13 and the depth of the recess 35 included in the uneven portion 33 are substantially the same. In addition, it is preferable that the interval between the convex portions 14 included in the uneven portion 13 and the interval between the convex portions 34 included in the uneven portion 33 are substantially the same. Moreover, it is preferable that the space | interval between the convex parts 14 of the uneven | corrugated | grooved part 13 and the space | interval between the convex parts 34 of the uneven | corrugated part 33 are substantially equal intervals. In other words, it is preferable to form the concavo-convex portion 13 and the concavo-convex portion 33 so that the shapes thereof are line symmetric.

  Note that the phase of the concavo-convex portion 13 of the transformer 1 and the phase of the concavo-convex portion 33 of the mounting substrate 30 may be slightly different from each other. Specifically, as shown in FIG. 5, the corner 41 of the n-th (n is a natural number) convex portion 34 and the corner of the (n + 1) -th convex portion 14 caused by a phase shift between the concave and convex portions 13 and 33. If the distance to 42 is longer than the allowable spatial distance, no discharge occurs between the corner 41 and the corner 42, and thus a phase shift in this case is allowed. On the other hand, as shown in FIG. 6, the corner 41 of the n-th (n is a natural number) convex portion 34 and the corner 42 of the (n + 1) -th convex portion 14 caused by a phase shift between the concave-convex portions 13 and 33. When the distance is shorter than the allowable spatial distance, a discharge occurs between the corner portion 41 and the corner portion 42, and thus a phase shift in this case is not allowed.

  Next, the electronic apparatus according to this embodiment will be described. In the electronic apparatus according to the present embodiment, a plurality of mounting boards 30 including a transformer 1 (electronic component) are mounted in a housing 50 (see FIG. 8B). First, the housing 50 will be described. FIG. 7A is a side view of the housing 50 included in the electronic device according to the present embodiment. 7B is a cross-sectional view taken along section line VIIB-VIIB of housing 50 shown in FIG. 7A. As shown in FIGS. 7A and 7B, the housing 50 is a hollow structure whose cavity extends in the longitudinal direction 56, and a plurality of mounting boards 30 can be mounted on the inner surface 52 of the side wall 51 of the housing 50. it can. The side wall 51 of the housing 50 has a shape that is continuous in the circumferential direction 57. For example, the housing 50 shown in FIGS. 7A and 7B has a cylindrical shape. The cross-sectional shape at the outer periphery of the housing 50 is circular, and the cross-sectional shape at the inner periphery (the inner surface 52 of the side wall 51) is a polygon (in the case of FIG. 7B, a regular dodecagon). The housing 50 can be made of a material having high thermal conductivity (for example, a metal material such as aluminum or copper).

  FIG. 8A is a side view showing an example in which a plurality of mounting boards 30 are mounted on a housing 50. FIG. 8B is a front view illustrating an example in which a plurality of mounting boards 30 are mounted on the housing 50 (that is, a view of the housing 50 of FIG. 8A viewed from the left side of the drawing). In FIG. 8A, only the mounting substrate 30a is illustrated for simplifying the drawing. Hereinafter, the case where the mounting boards 30a and 30b are mounted on the housing 50 will be described, but the same applies to the case where other mounting boards 30 are mounted on the housing 50. A plurality of mounting boards are collectively referred to as a mounting board 30.

  As shown in FIG. 8A, the mounting board 30a has a rectangular shape, and the mounting board 30a has the transformer 1a mounted thereon. At this time, the first terminal portion 18 and the second terminal portion 19 of the transformer 1a are arranged in the longitudinal direction of the mounting substrate 30a (see FIG. 3A). Further, the mounting substrate 30 a is disposed on the inner surface 52 of the side wall 51 of the housing 50 so that the longitudinal direction of the mounting substrate 30 a coincides with the longitudinal direction of the housing 50.

  FIG. 9 is a diagram illustrating an example in which the mounting boards 30a and 30b are mounted on the housing 50, and is a view of the mounting boards 30a and 30b as viewed from above. As shown in FIG. 9, the concave and convex portions 33a and 33b of the mounting boards 30a and 30b are respectively formed at both ends in the direction perpendicular to the longitudinal direction of the mounting boards 30a and 30b. The mounting substrates 30a and 30b are arranged so that the end portions in the direction perpendicular to the longitudinal direction of the mounting substrates 30a and 30b face each other. Further, the mounting boards 30a and 30b are arranged so that the convex portions 34a and the convex portions 34b face each other. In other words, the concave and convex portions 33a and 33b of the mounting boards 30a and 30b are arranged so that the phases thereof are substantially the same. Therefore, even when the mounting substrates 30a and 30b are arranged close to each other, it is possible to suppress the creepage distance on the side surfaces of the mounting substrates 30a and 30b from being reduced (see the description of FIGS. 4 to 6). ). Therefore, as shown in FIG. 8B, the distance between the respective mounting substrates 30 can be shortened, and the plurality of mounting substrates 30 can be arranged at high density in the circumferential direction of the side wall 51 of the housing 50. Each mounting substrate 30 is fixed to the housing 50 using a fixing member 58 such as a screw.

  Further, as shown in FIG. 8B, the surface of the mounting substrates 30 a and 30 b on the side of the housing 50 (that is, the back surface of the mounting substrates 30 a and 30 b) is in contact with the inner surface 52 of the side wall 51 of the housing 50. Therefore, the heat of the mounting substrate 30a can be transmitted to the housing 50. The housing 50 is configured to be able to transfer heat transmitted from the mounting substrate 30. That is, the housing 50 is made of a material having high thermal conductivity. Furthermore, the side wall 51 of the housing 50 is continuous in the circumferential direction. Therefore, the heat transmitted from each mounting substrate 30 can be dispersed in the circumferential direction of the side wall 51 of the housing 50 and the longitudinal direction of the housing 50. Therefore, the heat transmitted from the mounting substrate 30 can be efficiently radiated.

  For example, by disposing each mounting board 30 at substantially equal intervals in the circumferential direction of the side wall 51 of the casing 50, the heat transmitted from each mounting board 30 can be evenly distributed in the casing 50. In the case shown in FIG. 8B, the cross-sectional shape of the inner surface 52 of the side wall 51 of the housing 50 is a regular dodecagon. Therefore, by disposing each mounting substrate 30 on each side of the regular dodecagon, each mounting substrate 30 can be disposed at substantially equal intervals, and heat transmitted from each mounting substrate 30 can be transferred to the housing. 50 can be evenly distributed.

  FIG. 10 is a side view showing an example in which the mounting substrate 30 is mounted on the housing 50, and is an enlarged view of a place where the transformer 1 is disposed. As shown in FIG. 10, the back surface 54 of the mounting substrate 30 is in contact with the inner surface 52 of the side wall 51 of the housing 50. A recess 55 is formed in the side wall 51 of the housing 50 at a location facing the bottom surface of the transformer 1. In other words, the recess 55 is formed at a location where the housing 50 and the transformer 1 overlap when the mounting substrate 30 is viewed in plan. The recess 55 may be formed over the inner periphery of the side wall 51 of the housing 50. Further, as shown in FIG. 10, an insulating member 53 is provided on the outer peripheral side of the portion of the side wall 51 of the housing 50 where the recess 55 is formed. In other words, the insulating member 53 is provided on the side wall 51 of the housing 50 where the housing 50 and the transformer 1 overlap when the mounting substrate 30 is viewed in plan.

  As described above, the recess 55 is formed at a position facing the bottom surface of the transformer 1 used at a high voltage, and further, the insulating member 53 is provided on the outer peripheral side of the recess 55, thereby discharging from the transformer 1 to the housing 50. Can be suppressed. As the insulating member 53, a laminate of a plurality of insulating substrates may be used. As the insulator substrate, for example, a glass epoxy substrate, a glass composite substrate, a paper epoxy substrate, a bakelite substrate, or the like can be used. Further, as the insulating member 53, for example, the same insulating material as the insulating material constituting the mounting substrate 30 and the base 11 of the transformer 1 may be used. By using the same insulating material, the thermal expansion coefficients of the transformer 1, the mounting substrate 30, and the insulating member 53 can be made substantially equal, and the temperature cycle characteristics of the electronic device can be improved.

  Further, if the discharge from the transformer 1 to the housing 50 can be suppressed only by forming the recess 55 at a location facing the bottom surface of the transformer 1, the recess 55 is formed as shown in FIG. It is not necessary to provide an insulating member on the outer peripheral side of the location. In this case, for example, by forming the recess 55 deeply, discharge from the transformer 1 to the housing 50 can be suppressed.

  Further, as shown in FIGS. 12 and 13, a base plate 59 may be provided between the mounting substrate 30 and the side wall 51 of the housing 50. The base plate 59 is configured using a material having high thermal conductivity (for example, a metal material such as aluminum or copper). When the base plate 59 is provided, the heat of the mounting substrate 30 is transmitted to the casing 51 through the base plate 59. By providing the base plate 59, the arrangement of the mounting substrate 30 in the housing 50 can be easily adjusted. That is, when the base plate 59 is not provided, it is necessary to change the design of the housing 50 when adjusting the arrangement (particularly the arrangement in the height direction) of the mounting board 30, so that the mounting board 30 can be easily arranged. Can not be adjusted. On the other hand, when the base plate 59 is provided, the arrangement of the mounting boards 30 can be adjusted only by changing the design of each base plate 59. Therefore, the arrangement of the mounting substrate 30 in the housing 50 can be easily adjusted.

  Moreover, although the case where the shape of the housing | casing 50 was cylindrical shape (namely, cross-sectional shape was circular) was demonstrated above, the shape of the housing | casing 50 is not limited to a cylindrical shape. For example, as shown in FIG. 14, the casing 60 may have a quadrangular cross-sectional shape. In the case shown in FIG. 14, the cross-sectional shape of the inner surface 62 of the side wall 61 of the housing 60 is a square, and the mounting substrate 30 is mounted on each side of the square. Also in this case, the back surface of the mounting substrate 30 is in contact with the inner surface 62 of the side wall 61 of the housing 60. Further, the respective mounting boards 30 are arranged at substantially equal intervals in the circumferential direction of the side wall 61 of the housing 60. Therefore, the heat transmitted from each mounting substrate 30 can be evenly distributed in the housing 60.

  FIG. 15 is a diagram for explaining a case where the electronic device according to the present embodiment is applied to a device installed on the seabed (hereinafter referred to as a seabed unit). The submarine unit 70 is, for example, a submarine observation unit equipped with a seismometer or a submarine cable. Since the seabed unit 70 is installed on the seabed, the electronic device according to the present embodiment is accommodated in a sealed pressure resistant container.

  As shown in FIG. 15, an insulating layer 71 is provided around the outside of the housing 50 on which the mounting substrate 30 is mounted. Further, an outer casing 72 is provided around the outside of the insulating layer 71. The external casing 72 is a pressure vessel having a predetermined pressure resistance. For example, the external housing 72 can be formed using a metal material. The insulating layer 71 is provided to electrically insulate the housing 50 from the external housing 72.

  As shown in FIG. 15, each mounting substrate 30 is disposed on the inner surface 52 of the side wall 51 of the housing 50. For this reason, another substrate 75 can be disposed in the internal space 73 of the housing 50. In other words, the other substrate 75 can be disposed in the internal space 73 of the housing 50 at a position separated from the side wall 51 of the housing 50.

  Between the housing 50 and the external housing 72, an insulating layer 71 for electrically insulating the housing 50 and the external housing 72 is provided. Since the insulating layer 71 is made of a material having low thermal conductivity, the heat generated inside the submarine unit 70 is difficult to be transmitted to the outer casing 72. Further, since the seabed unit 70 is installed on the seabed, for example, it is necessary to provide lids at both ends of the cylindrical outer casing 72 to make the internal space 73 a closed space. As described above, when the insulating layer 71 is provided around the outside of the housing 50 and the internal space 73 is a closed space, the heat generated inside the submarine unit 70 is hardly radiated.

  In the present embodiment, the mounting substrate 30 on which the electronic component 1 that generates a large amount of heat (for example, an electronic component that is used at a high voltage such as a transformer) is mounted is disposed so as to contact the side wall 51 of the housing 50. ing. Therefore, the heat generated in the electronic component 1 can be transmitted to the housing 50 via the mounting substrate 30. Since the housing 50 is made of a material having high thermal conductivity (for example, a metal material), the heat transmitted from each mounting substrate 30 is transmitted in the circumferential direction of the side wall 51 of the housing 50 and the longitudinal direction of the housing 50. Can be dispersed. Therefore, the heat generated in the electronic component 1 can be efficiently radiated.

  In the present embodiment, each electronic component (such as a transformer) 1 mounted on a plurality of mounting boards 30 is configured to share a predetermined function required by the electronic device with each electronic component 1. It can be an electronic component. For example, when the electronic component is a transformer 1, predetermined power required by the electronic device can be shared by each transformer 1 and transformed. In this way, by transforming by sharing with the plurality of transformers 1, the power applied to each transformer can be reduced, and the reliability of the transformer 1 can be improved. Moreover, the heat which generate | occur | produces with the transformer 1 can be disperse | distributed by dividing and transforming by the some transformer 1. FIG. For example, when the performance of each transformer 1 is the same, the heat released from each transformer 1 is substantially equal. In this case, the heat released from each transformer 1 can be evenly distributed in the housing 50.

  As described in the background art, as electronic devices are miniaturized, a technology for mounting electronic components on a mounting board at a high density has become important. On the other hand, when electronic devices are mounted at a high density in a limited space, such as the submarine repeater unit disclosed in Patent Document 1, a structure that efficiently dissipates heat generated from electronic components is required. It becomes.

  Therefore, in the electronic device according to the present embodiment, the mounting substrate 30 on which the electronic component 1 is mounted is mounted so as to contact the inner surface of the side wall of the housing 50. The housing 50 is configured to be able to transfer heat from the mounting substrate 30, and the side wall 51 of the housing 50 is continuous in the circumferential direction. Therefore, the heat transmitted from each mounting substrate 30 can be dispersed in the circumferential direction of the side wall 51 of the housing 50 and the longitudinal direction of the housing 50. Therefore, the heat transmitted from the mounting substrate 30 can be efficiently radiated.

  Further, the plurality of mounting boards 30 are arranged such that the convex portions 34 of the concave and convex portions 33 formed on the mounting substrate 30 face each other. In other words, they are arranged so that the phases of the concavo-convex portions 33 of the respective mounting substrates 30 are substantially the same. Therefore, even when the respective mounting boards 30 are arranged close to each other, it is possible to suppress the creepage distances on the side surfaces of the respective mounting boards 30 from decreasing. Therefore, the distance between the mounting substrates 30 can be shortened while maintaining the insulating properties of the mounting substrate 30, and the plurality of mounting substrates 30 can be arranged in the circumferential direction of the side wall 51 of the housing 50 with high density. .

  Furthermore, the uneven part 13 is formed in the electronic component 1, and the electronic component 1 is mounted on the mounting substrate 30 so that the convex part 14 of the electronic component 1 faces the convex part 34 of the mounting substrate. Therefore, even when the electronic component 1 and the mounting substrate 30 are close to each other, it is possible to suppress a decrease in the creeping distance at the uneven portion 13 of the electronic component 1 and the creeping distance at the uneven portion 33 of the mounting substrate 30. it can. Therefore, since the electronic component 1 and the mounting substrate 30 can be disposed close to each other while maintaining the insulation between the electronic component 1 and the mounting substrate 30, the electronic component 1 can be mounted on the mounting substrate 30 in a compact manner.

  The invention according to the present embodiment described above can provide an electronic apparatus having a structure that can efficiently dissipate heat generated from an electronic component.

  Although the present invention has been described with reference to the above embodiment, the present invention is not limited to the configuration of the above embodiment, and those skilled in the art within the scope of the invention of the claims of the present application claims. It goes without saying that various modifications, modifications, and combinations that can be made are included.

1 transformer (electronic parts)
DESCRIPTION OF SYMBOLS 10 Transformer body part 11 Base material 12 Core part 13 Concavity and convexity part 14 Convex part 15 Concave part 16 Primary side 17 Secondary side 18 First terminal part 19 Second terminal part 20 Through-hole 21 Primary side conductor layer 26 Secondary side conductor Layers 27, 28, 29 Lead member 30 Mounting substrate 31 Third terminal portion 32 Fourth terminal portion 33 Concavity and convexity 34 Convex portion 35 Concavity 36 Through hole 37 First region 38 Second region 50, 60 Housing 51 , 61 Side walls 52, 62 Inner surface 53 Insulating member 55 Recessed portion 58 Fixing member 59 Base plate 70 Submarine unit 71 Insulating layer 72 External housing 73 Internal space 75 Substrate

Claims (13)

A plurality of mounting boards each mounted with electronic components;
A housing on which the plurality of mounting boards are mounted,
The electronic component includes at least a first terminal portion, a second terminal portion spaced apart from the first terminal portion, and at least between the first terminal portion and the second terminal portion. A first uneven portion formed in part,
The mounting substrate includes a second concavo-convex portion including a convex portion facing the convex portion provided in the first concavo-convex portion,
The plurality of mounting boards are arranged in the circumferential direction of the side wall of the casing so that the convex portions of the second concavo-convex parts face each other, and the surface of the mounting board on the casing side of the casing It is mounted to contact the inner surface of the side wall,
The case is configured to be able to transfer heat from the mounting substrate, and the side wall of the case is continuous in the circumferential direction.
Electronics.   2. The electronic device according to claim 1, wherein a recess is formed in a portion of the side wall of the housing where the housing and the electronic component overlap when the mounting substrate is viewed in plan.   3. The electronic device according to claim 1, wherein an insulating member is provided in a portion of the side wall of the housing where the housing and the electronic component overlap when the mounting substrate is viewed in plan.   4. The electronic device according to claim 1, wherein the plurality of mounting boards are arranged at substantially equal intervals in a circumferential direction of the side wall of the housing. 5. The mounting board is rectangular,
The first and second terminal portions of the electronic component are arranged in the longitudinal direction of the mounting substrate,
The second concavo-convex portion is formed at both ends in a direction perpendicular to the longitudinal direction of the mounting substrate,
The plurality of mounting boards are arranged such that end portions in a direction perpendicular to the longitudinal direction of the mounting board face each other.
The electronic device as described in any one of Claims 1 thru | or 4. The cross-sectional shape of the inner surface of the side wall of the housing is a polygon,
The plurality of mounting boards are arranged on each side of the polygon,
The electronic device as described in any one of Claims 1 thru | or 5.   The electronic device according to claim 1, wherein the plurality of mounting boards are mounted on the housing via a base plate configured to include a metal material.   The electronic device according to any one of claims 1 to 7, wherein another substrate is disposed in a space that is an internal space of the housing and is separated from a side wall of the housing.   The electronic device according to claim 1, wherein the internal space of the housing is a closed space. An insulating layer covering the outer periphery of the housing;
An outer casing that covers the outer periphery of the insulating layer and has a predetermined pressure resistance;
The electronic device according to any one of claims 1 to 9, further comprising:   11. Each of the electronic components mounted on the plurality of mounting boards is an electronic component configured to share a predetermined function required by the electronic device with each of the electronic components. The electronic device as described in any one.   The electronic device according to any one of claims 1 to 11, wherein heat emitted from each of the electronic components mounted on the plurality of mounting boards is substantially equal.   The electronic device according to claim 1, wherein the electronic component is a transformer.

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