JP6544107B2 - Method of manufacturing on-vehicle electronic control unit, and resin composition for sealing - Google Patents

Description

  The present invention relates to a method of manufacturing an on-vehicle electronic control unit, and a sealing resin composition.

  In recent years, as an on-vehicle electronic control unit, one in which a substrate on which an electronic component or the like is mounted is sealed with a sealing resin has been studied. As such a technique, the thing of patent document 1 and 2 is mentioned, for example.

  Patent Document 1 discloses a wiring board provided with through holes, an electronic component mounted on the wiring board, a metal base on which the wiring board is mounted, and a metal base attached to electrically connect the wiring board to the outside. This technology relates to a resin-sealed electronic control device including a connector to be connected, in which the front surface of the wiring substrate and a part of the metal base are integrally sealed and formed of a thermosetting resin. In Patent Document 2, a substrate having a card edge portion on at least one side of which at least one card edge terminal connected to a mating connector is formed, and the substrate is disposed in a first mold and a second mold; It is a technique relating to a card member having a resin molding portion integrally molded with a synthetic resin material injected into a mold and a second mold and a card edge portion protruding from at least one end.

JP, 2009-147014, A JP, 2013-232312, A

  About the vehicle-mounted electronic control unit, as mentioned above, manufacturing by sealing the board | substrate with which electronic components etc. were mounted by the resin composition for sealing is examined. In this case, sealing of the substrate is performed such that, for example, connection terminals for connecting to the outside provided on the substrate are exposed. However, in the case where a burr is generated in the sealing resin around the connection terminal, there is a possibility that the connection reliability with the outside may be lowered. On the other hand, in the case where a through hole penetrating the substrate is provided, it is also required to improve the filling property of the sealing resin composition to the through hole. So far, in the method of manufacturing an on-vehicle electronic control unit in which a substrate is sealed using a sealing resin composition, excellent suppression of burrs around the connection terminals and filling properties of through holes penetrating the substrate are excellent. It was difficult to realize a good balance.

According to the invention
A second mold comprising a first mold, a cavity together with the first mold, and a recess provided in a region constituting the cavity and separated from a contact portion with the first mold. And the step of preparing
Placing a substrate provided with a connection terminal on one side into the cavity such that the connection terminal is fitted into the recess;
Injecting a sealing resin composition into the cavity;
Equipped with
When the torque value of the sealing resin composition is measured over time using a Labo Plastomill at a rotational speed of 30 rpm and a measurement temperature of 175 ° C., the minimum torque value is 0.5 N · m to 1.2 N.・ M or less,
When the resin composition for sealing is molded at a mold temperature of 175 ° C., an injection pressure of 6.9 MPa, and a curing time of 120 seconds using a slit burr measurement mold having a slit with a thickness of 20 μm and a width of 5 mm. The manufacturing method of the vehicle-mounted electronic control unit whose length of the said resin composition for sealing with which it fills with in a slit is 0.2 mm-1.3 mm is provided.

Moreover, according to the present invention,
It is a resin composition for sealing used for the manufacturing method of the above-mentioned in-vehicle electronic control unit,
Epoxy resin,
Inorganic filler,
Including
When the torque value of the sealing resin composition is measured over time using a Labo Plastomill at a rotational speed of 30 rpm and a measurement temperature of 175 ° C., the minimum torque value is 0.5 N · m to 1.2 N.・ M or less,
When the resin composition for sealing is molded at a mold temperature of 175 ° C., an injection pressure of 6.9 MPa, and a curing time of 120 seconds using a slit burr measurement mold having a slit with a thickness of 20 μm and a width of 5 mm. The sealing resin composition in which the length of the said sealing resin composition filled in a slit is 0.2 mm or more and 1.3 mm or less is provided.

  According to the present invention, in a method of manufacturing an on-vehicle electronic control unit for sealing a substrate using the sealing resin composition, suppression of burrs in the vicinity of the connection terminal, and fillability of through holes penetrating the substrate. Can improve the balance of

It is a cross-sectional schematic diagram which shows an example of the vehicle-mounted electronic control unit which concerns on this embodiment. It is a cross-sectional schematic diagram which shows an example of the manufacturing method of the vehicle-mounted electronic control unit shown in FIG. It is a cross-sectional schematic diagram and planar schematic diagram which show the metal mold | die for slit burr measurement.

  Embodiments will be described below with reference to the drawings. In all the drawings, the same components are denoted by the same reference numerals, and the description thereof will be appropriately omitted.

  FIG. 1 is a schematic cross-sectional view showing an example of the on-vehicle electronic control unit 10 according to the present embodiment. FIG. 2 is a schematic sectional view showing an example of a method of manufacturing the on-vehicle electronic control unit 10 shown in FIG. In addition, the vehicle-mounted electronic control unit 10 which concerns on this embodiment, and its manufacturing method are not limited to what is illustrated by FIG.

The method of manufacturing the on-vehicle electronic control unit according to the present embodiment is performed as follows. First, the first mold 22 and the cavity 28 together with the first mold 22 are formed, and a recess 26 provided in a region constituting the cavity 28 and separated from the contact portion with the first mold 22 is And having a second mold 24. Then, the substrate 12 provided with the connection terminal 18 on one side is placed in the cavity 28 so as to fit the connection terminal 18 in the recess 26. Next, the sealing resin composition is injected into the cavity 28.
The resin composition for sealing has a minimum torque value of 0.5 N · m or more and 2.5 N ·· when the torque value is measured over time under the conditions of a rotation number of 30 rpm and a measurement temperature of 175 ° C. using a Labo Plasto mill. m or less. When the resin composition for sealing is molded at a mold temperature of 175 ° C., an injection pressure of 6.9 MPa, and a curing time of 120 seconds using a slit burr measurement mold having a slit of 20 μm in thickness and 5 mm in width. The length of the sealing resin composition filled in the slit is 2 mm or less.

  In the method of manufacturing an on-vehicle electronic control unit, for example, after arranging a wiring substrate on which electronic parts and the like are mounted in a cavity formed by a first mold and a second mold, a resin composition for sealing is formed in the cavity Sealing of the wiring substrate is performed by injecting a substance. In such a process, as described above, it has been required to improve the balance between the suppression of burrs around the connection terminals and the fillability of through holes penetrating the substrate. In the state where the connection terminal is fitted into a recess provided in a region constituting a cavity of the second mold and at a position separated from the contact portion with the first mold. By performing sealing with the sealing resin composition, generation of burrs around the connection terminals was suppressed. However, it has been difficult to sufficiently suppress the occurrence of burrs around the connection terminals with such a technique alone. In addition, the issues concerning the filling properties of through holes are not solved yet.

  As a result of intensive investigations, the inventor of the present invention suppresses burrs around the connection terminals by simultaneously controlling the minimum torque value measured under specific conditions using a Labo Plastomill and the length of the slit burrs. It has been newly found that a sealing resin composition capable of improving the balance between the filling ability of through holes penetrating a substrate and the like can be obtained. The method of manufacturing the on-vehicle electronic control unit according to the present embodiment is realized based on such knowledge. Therefore, according to the present embodiment, in the method of manufacturing the on-vehicle electronic control unit for sealing the substrate using the sealing resin composition, suppression of burrs around the connection terminals and filling of the through holes penetrating the substrate It is possible to improve the balance between sex and

  Hereinafter, a method of manufacturing the on-vehicle electronic control unit, the sealing resin composition, and the on-vehicle electronic control unit according to the present embodiment will be described in detail.

First, the on-vehicle electronic control unit 10 will be described.
The in-vehicle electronic control unit 10 is used to control an engine, various in-vehicle devices, and the like. As shown in FIG. 1, the on-vehicle electronic control unit 10 includes, for example, a substrate 12, an electronic component 16 mounted on the substrate 12, and a sealing resin 14 for sealing the substrate 12 and the electronic component 16. ing. The substrate 12 has a connection terminal 18 for connecting to the outside on at least one side. The on-vehicle electronic control unit 10 according to an example of the present embodiment is electrically connected to the mating connector via the connecting terminal 18 by fitting the connecting terminal 18 and the mating connector.

  The substrate 12 is, for example, a wiring substrate provided with a circuit wiring on one or both of one surface and the other surface opposite to the one surface. As shown in FIG. 1, the substrate 12 has, for example, a flat plate shape. In the present embodiment, for example, an organic substrate formed of an organic material such as polyimide can be employed as the substrate 12. The thickness of the substrate 12 is not particularly limited, but may be, for example, 0.1 mm or more and 5 mm or less, and preferably 0.5 mm or more and 3 mm or less.

  In the present embodiment, a through hole 120 may be provided in the substrate 12, for example, penetrating the substrate 12 to connect one surface to the other surface. In this case, the wiring provided on one surface of the substrate 12 and the wiring provided on the other surface are electrically connected via the conductor pattern provided in the through hole 120. The conductive pattern is formed along the wall surface of through hole 120. That is, the conductive pattern in through hole 120 is formed in a cylindrical shape. In the through hole 120 after the sealing step, the void (formed by the inner wall surface of the conductive pattern) is filled with the cured product (sealing resin 14) of the sealing resin composition of the present embodiment. The hole diameter of the through hole 120 is not particularly limited, but may be, for example, 0.1 mm or more and 1 mm or less, preferably 0.3 mm or more and 0.8 mm or less. The film thickness of the through hole 120 conductive pattern is not particularly limited as long as the above-mentioned air gap hole is left, but may be, for example, 1 μm or more and 10 μm or less.

  In the present embodiment, since the inside of the through hole 120 of the substrate 12 can be filled with the cured product of the sealing resin composition (the sealing resin 14), the durability of the conductive pattern of the through hole 120 against thermal stress Can be enhanced. Thus, an on-vehicle electronic control unit with excellent reliability can be obtained. Also, a plurality of through holes 120 may be formed in the substrate 12. Thereby, the structure having excellent heat dissipation can be obtained. The conductive pattern may not be formed on all the through holes 120.

  Although the through holes 120 have been described in the present embodiment, the present invention is not limited thereto. Slits (cuts) that divide the connection terminals 18 into a plurality may be formed in the substrate 12. The slit is, for example, a portion used for positioning or the like at the time of connection with the other party. In the present embodiment, the slit width of the slit can be made as narrow as the through hole 120. The cured product (sealing resin 14) of the sealing resin composition of the present embodiment can be filled in a part of the root portion (base opposite to the tip end) of the slit of the substrate 12; The mechanical strength of the connection terminal 18 can be increased.

  For example, an electronic component 16 is mounted on one or both of one surface and the other surface of the substrate 12. The electronic component 16 is not particularly limited as long as it can be mounted on a vehicle-mounted electronic control unit, and for example, a microcomputer may be mentioned.

  The sealing resin 14 is formed by molding a sealing resin composition so as to seal the substrate 12 and the electronic component 16. The sealing resin 14 is provided to seal one or both of the one surface and the other surface of the substrate 12. In FIG. 1, the case where the sealing resin 14 is provided to seal the one side and the other side of the substrate 12 and the electronic component 16 mounted on the substrate 12 is illustrated. The sealing resin 14 may seal only a part of the substrate 12 or may seal the entire substrate 12. In FIG. 1, the case where the sealing resin 14 is provided so as to seal the whole other portion without sealing the connection terminal 18 of the substrate 12 so that the connection terminal 18 is exposed is illustrated. .

  In the on-vehicle electronic control unit 10 according to the present embodiment, the substrate 12 may be mounted, for example, on a metal base. The metal base can function as a heat sink for dissipating heat generated from the electronic component 16, for example. In the present embodiment, for example, the on-vehicle electronic control unit 10 may be formed by integrally sealing and molding a metal base and the substrate 12 mounted on the metal base with the sealing resin composition. it can. Although it does not specifically limit as a metal material which comprises a metal base, For example, iron, copper, and aluminum, and the alloy etc. which contain 1 or 2 types of these, etc. can be included. The on-vehicle electronic control unit 10 may not have a metal base.

Next, the sealing resin composition according to the present embodiment will be described.
The resin composition for sealing has a minimum torque value of 0.5 N · m or more and 2.5 N · m or less when the torque value is measured over time under the conditions of a rotation number of 30 rpm and a measurement temperature of 175 ° C. using a laboplast mill. It is below. Thus, as described above, it is possible to improve the balance between the suppression of burrs around the connection terminals and the fillability of the through holes penetrating the substrate. In the present embodiment, for example, using a Labo Plastomill tester (4C150, manufactured by Toyo Seiki Seisakusho Co., Ltd.), the melting torque of the sealing resin composition is temporally determined under the conditions of 30 rpm and 175 ° C. The lowest torque value can be obtained by

  The minimum torque value of the sealing resin composition is more preferably, for example, 2.0 N · m or less, and particularly preferably 1.5 N · m or less. Thereby, the fillability of the through holes penetrating the substrate can be more effectively improved. Moreover, it can contribute also to the improvement of the filling property to the narrow clearance gap formed between several electronic components 16 grade | etc.,. On the other hand, the minimum torque value of the sealing resin composition is more preferably, for example, 0.6 or more. This makes it possible to more effectively suppress the occurrence of burrs.

  The sealing resin composition is a slit when it is molded at a mold temperature of 175 ° C., an injection pressure of 6.9 MPa, and a curing time of 120 seconds using a slit burr measurement mold having a slit with a thickness of 20 μm and a width of 10 mm. The length of the sealing resin composition filled inside (hereinafter also referred to as slit burr length) is 2 mm or less. Thus, as described above, it is possible to improve the balance between the suppression of burrs around the connection terminals and the fillability of the through holes penetrating the substrate.

FIG. 3 is a schematic view showing the slit burr measurement mold 30. As shown in FIG. FIG. 3A shows a schematic cross-sectional view of the slit burr measurement mold 30, and FIG. 3B shows a schematic plan view of the lower die 34 of the slit burr measurement mold 30. As shown in FIG. In addition, the cross-sectional schematic diagram shown to Fig.3 (a) respond | corresponds to the AA 'cross section in FIG.3 (b).
As shown in FIG. 3, the slit burr measurement mold 30 has a lower mold 34 having a cavity 38 and a slit 36 connected to the cavity 38, and a resin injection port 40 for injecting a resin into the cavity 38. Is provided with an upper mold 32 having The slit 36 has a thickness T of 20 μm and a width W of 5 mm. In the present embodiment, for example, the resin composition for sealing is injected from the resin injection port 40 into the cavity 38, and molding is performed under the conditions of a mold temperature of 175 ° C., an injection pressure of 6.9 MPa, and a curing time of 120 seconds. The length of the sealing resin composition (slit burr) filled in the slit 36 via 38 can be measured, and this can be used as the slit burr length.

  The slit burr length of the sealing resin composition is, for example, more preferably 1.7 mm or less, and particularly preferably 1.5 mm or less. Thereby, the occurrence of burrs can be suppressed more effectively. On the other hand, although the lower limit value of the slit burr length is not particularly limited, it can be, for example, 0.1 mm, and it is 0.2 mm from the viewpoint of improving the filling property in the narrow gap. More preferable.

  In the present embodiment, for sealing, for example, by controlling the preparation method of the sealing resin composition, and appropriately selecting the kind and blending ratio of the components constituting the sealing resin composition, etc. Both the above-mentioned minimum torque value of the resin composition and the above-mentioned slit burr length can be made into a desired range. As a method for preparing a sealing resin composition, for example, after mixing each component, it is estimated by the present inventor that it is important to mill the obtained mixture under a certain condition by a rotary ball mill. There is. For example, it is possible to perform pulverization by a rotary ball mill by adjusting conditions such as a volume filling rate of balls with respect to an apparatus volume, and a material supply amount (kg / hr), and the above-mentioned minimum torque value and the above It is considered to affect the slit burr length. In addition, controlling the conditions of the melt-kneading process after pulverization by a rotary ball mill, or continuously performing the process from mixing of the components to melt-kneading, etc. also affect the characteristics of the sealing resin composition. It is thought that it can be given. In addition, the preparation method of the resin composition for sealing is not limited to said thing.

  In the present embodiment, for example, the gel time of the sealing resin composition can be set to 20 seconds or more and 45 seconds or less. This makes it possible to further improve the balance between the suppression of burrs around the connection terminals and the fillability of through holes penetrating the substrate. The gel time of the sealing resin composition is more preferably 23 seconds or more and 40 seconds or less, and particularly preferably 24 seconds or more and 35 seconds or less.

  In the present embodiment, for example, when the curing torque of the sealing resin composition is measured over time at a mold temperature of 175 ° C. using a curastometer, it becomes 0.1 N · m from the start of measurement. The time up to the time (hereinafter also referred to as rising time) can be set to 20 seconds or more and 40 seconds or less. This makes it possible to further improve the balance between the suppression of burrs around the connection terminals and the fillability of through holes penetrating the substrate.

  In the present embodiment, the flow length of the sealing resin composition measured by, for example, spiral flow can be set to 40 cm or more and 150 cm or less. This makes it possible to further improve the balance between the suppression of burrs around the connection terminals and the fillability of through holes penetrating the substrate. The spiral flow flow length of the sealing resin composition is more preferably 45 cm or more and 125 cm or less. The spiral flow measurement is carried out, for example, using a low-pressure transfer molding machine ("KTS-15" manufactured by Kotaki Seiki Co., Ltd.) in a mold for spiral flow measurement according to EMMI-1-66. It can carry out by inject | pouring the resin composition for sealing on conditions of injection pressure 6.9MPa, and curing time 120 seconds, and measuring flow length.

  The gel time, the rise time, and the spiral flow flow length of the sealing resin composition may be controlled, for example, by controlling the method of preparing the sealing resin composition, and types of components constituting the sealing resin composition. It is possible to make each fall within a desired range by appropriately selecting the blending ratio and the like.

The sealing resin composition according to the present embodiment can include, for example, a thermosetting resin and an inorganic filler. As a result, it is possible to contribute to the improvement of the reliability of the on-vehicle electronic control unit 10 by reducing the coefficient of thermal expansion while improving the heat resistance, the humidity resistance, the mechanical strength and the like.
Hereinafter, each component which comprises the resin composition for sealing is explained in full detail.

((A) Thermosetting resin)
The thermosetting resin (A) is, for example, one or more selected from the group consisting of an epoxy resin, a phenol resin, an oxetane resin, a (meth) acrylate resin, an unsaturated polyester resin, a diallyl phthalate resin, and a maleimide resin. Can be included. Among these, an epoxy resin can be included from the viewpoint of improving the curability, storage stability, heat resistance, moisture resistance, and chemical resistance.

  As an epoxy resin contained in a thermosetting resin (A), the monomer which has 2 or more of epoxy groups in 1 molecule, an oligomer, and a polymer general can be used, The molecular weight and molecular structure are not specifically limited. In this embodiment, the epoxy resin is, for example, biphenyl type epoxy resin; bisphenol type epoxy resin such as bisphenol A type epoxy resin, bisphenol F type epoxy resin, tetramethyl bisphenol F type epoxy resin; stilbene type epoxy resin; phenol novolac type epoxy resin Novolak type epoxy resin such as resin, cresol novolac type epoxy resin, etc. Multifunctional epoxy resin such as trisphenol type epoxy resin exemplified by triphenolmethane type epoxy resin, alkyl modified triphenolmethane type epoxy resin, etc. having a phenylene skeleton Phenol aralkyl type epoxy resin, naphthol aralkyl type epoxy resin having a phenylene skeleton, phenol aralkyl type epoxy resin having a biphenylene skeleton, bif Phenol aralkyl type epoxy resins such as naphthol aralkyl type epoxy resins having an ylene skeleton; dihydroxy naphthalene type epoxy resins; naphthol type epoxy resins such as epoxy resins obtained by glycidyl etherifying dihydroxy naphthalene dimer; triglycidyl isocyanurate; Triazine nucleus-containing epoxy resin such as monoallyl diglycidyl isocyanurate; bridged cyclic hydrocarbon compound such as dicyclopentadiene-modified phenolic epoxy resin; and one or more selected from the group consisting of phenolic epoxy resin . Among these, including one or two or more selected from novolac type epoxy resin, biphenyl type epoxy resin, and phenol aralkyl type epoxy resin, various factors such as suppression of burr, filling property, heat resistance, moisture resistance, etc. It is more preferable from the viewpoint of improving the balance of the characteristics.

  The content of the thermosetting resin (A) in the sealing resin composition is preferably 2% by mass or more, and more preferably 3% by mass or more based on the entire sealing resin composition. And particularly preferably 4% by mass or more. By making content of a thermosetting resin (A) more than the said lower limit, the fluidity | liquidity at the time of shaping | molding can be improved. For this reason, the filling property and the molding stability can be improved. On the other hand, the content of the thermosetting resin (A) in the sealing resin composition is preferably 50% by mass or less and 30% by mass or less based on the entire sealing resin composition. Is more preferable, and 15% by mass or less is particularly preferable. By setting the content of the thermosetting resin (A) to the upper limit value or less, the humidity resistance reliability and the reflow resistance of the on-vehicle electronic control unit 10 can be improved.

((B) Hardening agent)
The sealing resin composition can contain a curing agent (B). The curing agent (B) contained in the sealing resin composition can be roughly classified into, for example, three types of a polyaddition type curing agent, a catalyst type curing agent, and a condensation type curing agent.

  The polyaddition type curing agent used as the curing agent (B) is, for example, aliphatic polyamine such as diethylenetriamine (DETA), triethylenetetramine (TETA), metaxylylenediamine (MXDA), diaminodiphenylmethane (DDM), m -Polyamine compounds including dicyandiamide (DICY), organic acid dihydrazide, etc. in addition to aromatic polyamines such as phenylenediamine (MPDA) and diaminodiphenylsulfone (DDS); hexahydrophthalic anhydride (HHPA), methyltetrahydrophthalic anhydride (MTHPA) Acid anhydrides including alicyclic acid anhydrides such as), trimellitic anhydride (TMA), pyromellitic anhydride (PMDA), benzophenonetetracarboxylic acid (BTDA) and the like; Phenol resin-based curing agents such as epoxy resins, polyvinyl phenols and aralkyl type phenol resins; polymercaptan compounds such as polysulfides, thioesters and thioethers; isocyanate compounds such as isocyanate prepolymers and blocked isocyanates; organics such as carboxylic acid-containing polyester resins It contains one or more selected from the group consisting of acids.

  Catalyst-type curing agents used as the curing agent (B) are, for example, tertiary amine compounds such as benzyldimethylamine (BDMA), 2,4,6-trisdimethylaminomethylphenol (DMP-30); 2-methylimidazole And one or more selected from the group consisting of imidazole compounds such as 2-ethyl-4-methylimidazole (EMI 24); and Lewis acids such as BF3 complex.

  The condensation type curing agent used as the curing agent (B) is, for example, one or more selected from the group consisting of resol type phenol resin; urea resin such as methylol group containing urea resin; melamine resin such as methylol group containing melamine resin Including two or more types.

  Among these, from the viewpoint of improving the balance of flame resistance, moisture resistance, electrical properties, curability, storage stability and the like, it is more preferable to include a phenol resin-based curing agent. As a phenol resin-based curing agent, monomers, oligomers, and polymers all having two or more phenolic hydroxyl groups in one molecule can be used, and the molecular weight and molecular structure thereof are not particularly limited. The phenol resin-based curing agent used as the curing agent (B) is, for example, novolac resin such as phenol novolac resin, cresol novolac resin, bisphenol novolac; polyvinyl phenol; polyfunctional phenol resin such as triphenolmethane-type phenol resin; Modified phenolic resin such as terpene modified phenolic resin, dicyclopentadiene modified phenolic resin, etc .; Phenolic aralkyl type phenolic resin such as phenol aralkyl resin having phenylene skeleton and / or biphenylene skeleton, and naphthol aralkyl resin having phenylene and / or biphenylene skeleton; bisphenol A, 1 or 2 types or more selected from the group which consists of bisphenol compounds, such as bisphenol F, are included. Among these, from the viewpoint of improving the curability of the sealing resin composition, it is more preferable to include at least one of a novolac type phenol resin and a phenol aralkyl type phenol resin.

  The content of the curing agent (B) in the sealing resin composition is preferably 1% by mass or more, more preferably 2% by mass or more, based on the entire sealing resin composition. It is particularly preferable that the content is at least% by mass. By making content of a hardening | curing agent (B) more than the said lower limit, the outstanding fluidity | liquidity is implement | achieved at the time of shaping | molding, and the improvement of fillability and a moldability can be aimed at. On the other hand, the content of the curing agent (B) in the sealing resin composition is preferably 40% by mass or less, more preferably 25% by mass or less, based on the entire sealing resin composition. The content is preferably 10% by mass or less. By setting the content of the curing agent (B) to the upper limit value or less, the moisture resistance reliability and the reflow resistance of the on-vehicle electronic control unit 10 can be improved.

((C) curing catalyst)
The sealing resin composition can further include, for example, a curing catalyst (C). The curing catalyst (C) promotes the crosslinking reaction of a thermosetting resin (A) (for example, epoxy group of epoxy resin) and a curing agent (B) (for example, phenolic hydroxyl group of phenol resin type curing agent) What is necessary is just to be used, and what is used for the common resin composition for sealing can be used.

  In the present embodiment, the curing catalyst (C) is, for example, a phosphorus atom-containing compound such as an organic phosphine, a tetra-substituted phosphonium compound, a phosphobetaine compound, an adduct of a phosphine compound and a quinone compound, and an adduct of a phosphonium compound and a silane compound. Imidazole, 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-phenylimidazole, 1-benzyl-2-methylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-undecylimidazole Imidazole compounds such as 1-cyanoethyl-2-phenylimidazole, 2-phenyl-4,5-dihydroxydimethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 1-cyanoethyl-2-undecylimidazolium tri Melitite, 1-cyanoethyl-2-phenylimidazolium trimellitate, 2,4-diamino-6- [2′-methylimidazolyl (1 ′)]-ethyl-s-triazine, 2,4-diamino-6- [2′-undecylimidazolyl (1 ′)]-ethyl-s-triazine, 2,4-diamino-6- [2′-ethyl-4-methylimidazolyl (1 ′)]-ethyl-s-triazine, 2 Isocyanuric acid adduct of 4, 4-diamino-6- [2′-methylimidazolyl (1 ′)]-ethyl-s-triazine 1 or 2 or more types selected from amine-based curing accelerators such as isocyanuric acid adduct of 2-phenylimidazole, isocyanuric acid adduct of 2-methylimidazole, 1,8-diazabicyclo (5,4,0) undecene and the like Can be included. Among these, from the viewpoint of improving the balance of the suppression of burrs and the filling property and the curability, it is more preferable to include one or two or more kinds selected from a phosphorus atom-containing compound and an imidazole compound. Moreover, it is more preferable to contain a phosphorus atom containing compound from a viewpoint of improving hardenability.

  Organic phosphines which can be used in the resin composition for sealing include, for example, primary phosphines such as ethyl phosphine and phenyl phosphine; secondary phosphines such as dimethyl phosphine and diphenyl phosphine; trimethyl phosphine, triethyl phosphine, tributyl phosphine, triphenyl Tertiary phosphines such as phosphines can be mentioned.

  As a tetra-substituted phosphonium compound which can be used by the resin composition for sealing, the compound etc. which are represented by following General formula (4) are mentioned, for example.

（上記一般式（４）において、Ｐはリン原子を表す。Ｒ^４、Ｒ^５、Ｒ^６およびＲ^７は芳香族基またはアルキル基を表す。Ａはヒドロキシル基、カルボキシル基、チオール基から選ばれる官能基のいずれかを芳香環に少なくとも１つ有する芳香族有機酸のアニオンを表す。ＡＨはヒドロキシル基、カルボキシル基、チオール基から選ばれる官能基のいずれかを芳香環に少なくとも１つ有する芳香族有機酸を表す。ｘ、ｙは１〜３の数、ｚは０〜３の数であり、かつｘ＝ｙである。）

(In the above general formula (4), P represents a phosphorus atom. R ⁴ , R ⁵ , R ⁶ and R ⁷ each represent an aromatic group or an alkyl group. A is selected from a hydroxyl group, a carboxyl group and a thiol group An anion of an aromatic organic acid having at least one functional group in at least one aromatic ring is represented by AH is an aromatic group having at least one functional group selected from a hydroxyl group, a carboxyl group and a thiol group in an aromatic ring Represents an organic acid, x and y are a number of 1 to 3, z is a number of 0 to 3 and x = y)

The compound represented by the general formula (4) can be obtained, for example, as follows, but is not limited thereto. First, a tetrasubstituted phosphonium halide, an aromatic organic acid and a base are mixed with an organic solvent and uniformly mixed, and an aromatic organic acid anion is generated in the solution system. Then, water is added to precipitate the compound represented by the general formula (4). In the compounds represented by the general formula (4), R ⁴ , R ⁵ , R ⁶ and R ⁷ bonded to a phosphorus atom are phenyl groups, and AH is a compound having a hydroxyl group in the aromatic ring, ie, phenols And A is preferably the anion of said phenols. The above-mentioned phenols include monocyclic phenols such as phenol, cresol, resorcinol and catechol, condensed polycyclic phenols such as naphthol, dihydroxynaphthalene and anthraquinol, bisphenols such as bisphenol A, bisphenol F and bisphenol S, Examples thereof include polycyclic phenols such as phenylphenol and biphenol.

  As a phosphobetaine compound which can be used by the resin composition for sealing, the compound etc. which are represented by following General formula (5) are mentioned, for example.

（上記一般式（５）において、Ｒ^８は炭素数１〜３のアルキル基、Ｒ^９はヒドロキシル基を表す。ｆは０〜５の数であり、ｇは０〜３の数である。）

(In the above general formula (5), R ⁸ represents an alkyl group having 1 to 3 carbon atoms, R ⁹ represents a hydroxyl group, f is a number of 0 to 5, and g is a number of 0 to 3).

  The compound represented by the general formula (5) is obtained, for example, as follows. First, it is obtained through the step of bringing the triaromatic substituted phosphine which is a tertiary phosphine into contact with a diazonium salt, and substituting the triaromatic substituted phosphine and the diazonium group possessed by the diazonium salt. However, it is not limited to this.

  As an adduct of the phosphine compound and quinone compound which can be used by the resin composition for sealing, the compound etc. which are represented by following General formula (6) are mentioned, for example.

（上記一般式（６）において、Ｐはリン原子を表す。Ｒ^１０、Ｒ^１１およびＲ^１２は炭素数１〜１２のアルキル基または炭素数６〜１２のアリール基を表し、互いに同一であっても異なっていてもよい。Ｒ^１３、Ｒ^１４およびＲ^１５は水素原子または炭素数１〜１２の炭化水素基を表し、互いに同一であっても異なっていてもよく、Ｒ^１４とＲ^１５が結合して環状構造となっていてもよい。）

(In the above general formula (6), P represents a phosphorus atom. R ¹⁰ , R ¹¹ and R ¹² each represent an alkyl group having 1 to 12 carbon atoms or an aryl group having 6 to 12 carbon atoms and are identical to each other R ¹³ , R ¹⁴ and R ¹⁵ each represent a hydrogen atom or a hydrocarbon group having 1 to 12 carbon atoms, which may be the same or different, and R ¹⁴ and R ¹⁵ are bonded to each other And may have a ring structure.)

  As a phosphine compound used for the adduct of a phosphine compound and a quinone compound, for example, no aromatic ring such as triphenylphosphine, tris (alkylphenyl) phosphine, tris (alkoxyphenyl) phosphine, trinaphthylphosphine, tris (benzyl) phosphine etc. Those having a substituent or a substituent such as an alkyl group or an alkoxyl group are preferable, and examples of the substituent such as an alkyl group or an alkoxyl group include those having 1 to 6 carbon atoms. Triphenyl phosphine is preferred from the viewpoint of availability.

  Moreover, as a quinone compound used for the adduct of a phosphine compound and a quinone compound, benzoquinone and anthraquinones are mentioned, Among these, p-benzoquinone is preferable from the point of storage stability.

  As a method of producing the adduct of the phosphine compound and the quinone compound, the adduct can be obtained by contacting and mixing in a solvent in which both the organic tertiary phosphine and the benzoquinones can be dissolved. As the solvent, ketones such as acetone and methyl ethyl ketone and the like having low solubility in the adduct are preferable. However, it is not limited to this.

In the compounds represented by the general formula (6), compounds in which R ¹⁰ , R ¹¹ and R ¹² bonded to a phosphorus atom are phenyl groups, and R ¹³ , R ¹⁴ and R ¹⁵ are hydrogen atoms, ie 1,1, The compound which added 4-benzoquinone and triphenyl phosphine is preferable at the point which reduces the elasticity modulus at the time of the hardened | cured material of the resin composition for sealings.

  As an adduct of the phosphonium compound and silane compound which can be used by the resin composition for sealing, the compound etc. which are represented by following General formula (7) are mentioned, for example.

（上記一般式（７）において、Ｐはリン原子を表し、Ｓｉは珪素原子を表す。Ｒ^１６、Ｒ^１７、Ｒ^１８およびＲ^１９は、それぞれ、芳香環または複素環を有する有機基、あるいは脂肪族基を表し、互いに同一であっても異なっていてもよい。式中Ｒ^２０は、基Ｙ^２およびＹ^３と結合する有機基である。式中Ｒ^２１は、基Ｙ^４およびＹ^５と結合する有機基である。Ｙ^２およびＹ^３は、プロトン供与性基がプロトンを放出してなる基を表し、同一分子内の基Ｙ^２およびＹ^３が珪素原子と結合してキレート構造を形成するものである。Ｙ^４およびＹ^５はプロトン供与性基がプロトンを放出してなる基を表し、同一分子内の基Ｙ^４およびＹ^５が珪素原子と結合してキレート構造を形成するものである。Ｒ^２０、およびＲ^２１は互いに同一であっても異なっていてもよく、Ｙ^２、Ｙ^３、Ｙ^４およびＹ^５は互いに同一であっても異なっていてもよい。Ｚ^１は芳香環または複素環を有する有機基、あるいは脂肪族基である。）

(In the above general formula (7), P represents a phosphorus atom and Si represents a silicon atom. R ¹⁶ , R ¹⁷ , R ¹⁸ and R ¹⁹ each represent an organic group having an aromatic ring or a heterocyclic ring, or an aliphatic group R ²⁰ is an organic group which is bonded to the groups Y ² and Y ^{3. In the} formula, R ²¹ is a group Y ⁴ and Y ⁵ Y ² and Y ³ each represent a group formed by a proton donating group releasing a proton, and groups Y ² and Y ³ in the same molecule combine with a silicon atom to form a chelate structure Y ⁴ and Y ⁵ each represent a group in which a proton donating group releases a proton, and groups Y ⁴ and Y ⁵ in the same molecule combine with a silicon atom to form a chelate structure. there ^{.R 20,} and ^{R 21} are mutually Or different ^{mere, Y 2, Y 3, Y} 4 and Y ⁵ may .Z ¹ also being the same or different organic group having an aromatic ring or a heterocyclic ring or fat, Group))

In General Formula (7), as R ¹⁶ , R ¹⁷ , R ¹⁸ and R ¹⁹ , for example, phenyl group, methylphenyl group, methoxyphenyl group, hydroxyphenyl group, naphthyl group, hydroxynaphthyl group, benzyl group, methyl group And an ethyl group, an n-butyl group, an n-octyl group and a cyclohexyl group. Among these, an alkyl group such as a phenyl group, a methylphenyl group, a methoxyphenyl group, a hydroxyphenyl group or a hydroxynaphthyl group, an alkoxy group An aromatic group having a substituent such as a hydroxyl group or a non-substituted aromatic group is more preferable.

Further, in the general formula (7), R ²⁰ is an organic group which bonds to Y ² and Y ³ . Similarly, R ²¹ is an organic group linked to the groups Y ⁴ and Y ⁵ . Y ² and Y ³ are groups in which a proton donating group releases a proton, and groups Y ² and Y ³ in the same molecule are bonded to a silicon atom to form a chelate structure. Similarly, Y ⁴ and Y ⁵ are groups in which a proton donating group releases a proton, and groups Y ⁴ and Y ⁵ in the same molecule are bonded to a silicon atom to form a chelate structure. The groups R ²⁰ and R ²¹ may be identical to or different from one another, and the groups Y ² , Y ³ , Y ⁴ and Y ⁵ may be identical to or different from one another. In the group represented by -Y ² -R ²⁰ -Y ^3- and -Y ⁴ -R ²¹ -Y ^{5-in the} general formula (7), the proton donor releases two protons. The proton donor is preferably an organic acid having at least two carboxyl groups or hydroxyl groups in the molecule, and further preferably a carboxyl group or hydroxyl group on adjacent carbons constituting an aromatic ring. An aromatic compound having at least two of them is preferable, and an aromatic compound having at least two hydroxyl groups at adjacent carbons constituting the aromatic ring is more preferable, for example, catechol, pyrogallol, 1,2-dihydroxynaphthalene, 2,3- Dihydroxynaphthalene, 2,2'-biphenol, 1,1'-bi-2-naphthol, salicylic acid, 1-hydroxy-2-naphthoic acid, 3- Examples thereof include droxy-2-naphthoic acid, chloranilic acid, tannic acid, 2-hydroxybenzyl alcohol, 1,2-cyclohexanediol, 1,2-propanediol and glycerin. Among these, catechol, 1,2- Dihydroxy naphthalene and 2,3-dihydroxy naphthalene are more preferred.

Further, Z ¹ in the general formula (7) represents an organic group or an aliphatic group having an aromatic ring or a heterocyclic ring, and specific examples thereof include a methyl group, an ethyl group, a propyl group and a butyl group, Aliphatic hydrocarbon groups such as hexyl group and octyl group, aromatic hydrocarbon groups such as phenyl group, benzyl group, naphthyl group and biphenyl group, glycidyl oxy group such as glycidyl oxypropyl group, mercaptopropyl group and aminopropyl group And mercapto groups, amino-containing alkyl groups, reactive substituents such as vinyl groups, etc., among which methyl, ethyl, phenyl, naphthyl and biphenyl groups are preferred from the viewpoint of thermal stability. , More preferred.

  As a method for producing an adduct of a phosphonium compound and a silane compound, a silane compound such as phenyltrimethoxysilane and a proton donor such as 2,3-dihydroxynaphthalene are added to a flask containing methanol and dissolved, and then room temperature is obtained. Add sodium methoxide-methanol solution dropwise under stirring. Furthermore, when a solution of tetra-substituted phosphonium halide such as tetraphenylphosphonium bromide prepared in advance in methanol is added dropwise thereto under stirring at room temperature, crystals are precipitated. The precipitated crystals are filtered, washed with water and vacuum dried to obtain an adduct of a phosphonium compound and a silane compound. However, it is not limited to this.

  The content of the curing catalyst (C) is preferably 0.05% by mass or more, more preferably 0.1% by mass or more, and more preferably 0.15% by mass, based on the entire resin composition for sealing. It is especially preferable that it is more than. By making content of a curing catalyst (C) more than the said lower limit, the curability at the time of sealing molding can be improved effectively. On the other hand, the content of the curing catalyst (C) is preferably 2.0% by mass or less, more preferably 1.0% by mass or less, with respect to the whole resin composition for sealing, and 0. Particularly preferred is 5% by mass or less. By making content of a curing catalyst (C) below into the said upper limit, the fluidity | liquidity at the time of sealing molding can be improved, and it can contribute to an improvement of filling property.

((D) Inorganic filler)
The inorganic filler (D) can include, for example, one or more selected from the group consisting of fused silica, silica such as crystalline silica, alumina, aluminum hydroxide, silicon nitride, and aluminum nitride. Among these, from the viewpoint of excellent versatility, it is more preferable to include silica, and it is particularly preferable to include fused silica. Moreover, it is more preferable to contain aluminum hydroxide from a viewpoint of improving the flame retardance of sealing resin formed using the resin composition for sealing. In the present embodiment, the case in which both silica and aluminum hydroxide are contained can be mentioned as an example of the preferred embodiment.

  The inorganic filler (D) can comprise, for example, crushed silica. Thereby, it is possible to more effectively suppress the burr while reducing the manufacturing cost of the on-vehicle electronic control unit 10. When the inorganic filler (D) contains crushed silica, the content of the crushed silica can be, for example, 10% by weight or more and 100% by weight or less based on the whole of the inorganic filler (D), and is 15% by weight or more and 95% It is more preferable to set it to weight% or less. The inorganic filler (D) can contain spherical silica from the viewpoint of improving the flowability of the sealing resin composition and contributing to the improvement of the molding stability and the filling property. When the inorganic filler (D) contains spherical silica, the content of the spherical silica can be, for example, 10% by weight or more and 100% by weight or less based on the whole of the inorganic filler (D), and is 15% by weight or more and 95% It is more preferable to set it to weight% or less. In the present embodiment, the case where both spherical silica and crushed silica are contained as the inorganic filler (D) can be mentioned as an example of a preferred embodiment.

When the inorganic filler (D) contains silica, the inorganic filler (D) preferably contains, for example, silica having an average particle diameter D50 of 3 μm to ₅₀ μm, and the average particle diameter D ₅₀ of 10 μm to 30 μm It is more preferable to include silica which is Thereby, the balance of the filling property, suppression of burrs, moisture resistance, heat resistance and the like can be more effectively improved. The average particle diameter _{D 50} of the silica, such as the commercially available laser particle size distribution analyzer (e.g., manufactured by Shimadzu Corporation, SALD-7000 etc.) can be measured using the.

  The content of the inorganic filler (D) in the sealing resin composition is preferably 60% by mass or more, and more preferably 70% by mass or more, based on the entire sealing resin composition. By making content of an inorganic filler (D) more than the above-mentioned lower limit, low hygroscopicity and low thermal expansion property are improved, and moisture resistance reliability and reflow resistance of electronic control unit 10 for vehicles are improved more effectively. It can be done. On the other hand, the content of the inorganic filler (D) in the sealing resin composition is preferably 90% by mass or less and 85% by mass or less based on the entire sealing resin composition. More preferable. By making content of an inorganic filler (D) below into the said upper limit, it becomes possible to improve more effectively the fluidity | liquidity and fillability at the time of shaping | molding of the resin composition for sealing.

((E) Other ingredients)
The sealing resin composition may contain, if necessary, various additives such as, for example, a coupling agent, a releasing agent, a coloring agent, an ion capturing agent, an oil, a low stress agent, a flame retardant and an antioxidant. One or more of them can be appropriately blended. The coupling agent is, for example, known silane coupling compounds such as epoxysilane, mercaptosilane, aminosilane, alkylsilane, ureidosilane, vinylsilane, methacrylsilane, etc., titanium compounds, aluminum chelates, aluminum / zirconium compounds, etc. Agents can be included. Among these, it is more preferable to include an epoxysilane and an aminosilane, and it is particularly preferable to include a secondary aminosilane which is an aminosilane, since the effects of the present invention can be further exhibited. The releasing agent is, for example, one or two selected from natural waxes such as carnauba wax, synthetic waxes such as montanic acid ester wax and oxidized polyethylene wax, higher fatty acids such as zinc stearate and metal salts thereof, and paraffins It can include more than types. The colorant can include, for example, one or both of carbon black and black titanium oxide. The ion scavenger can include, for example, hydrotalcite. The oil can include, for example, silicone oil. The low stress agent can include, for example, silicone rubber. The flame retardant can include, for example, one or more selected from magnesium hydroxide, zinc borate, zinc molybdate, and phosphazene. The antioxidant may comprise one or more selected from phenolic antioxidants, phosphorus antioxidants and thioether antioxidants.

Next, a method of manufacturing the on-vehicle electronic control unit 10 will be described.
First, as shown in FIG. 2A, a manufacturing apparatus of the on-vehicle electronic control unit 10 including the first mold 22 and the second mold 24 is prepared. The second mold 24 constitutes a cavity 28 together with the first mold 22 and has a recess 26 provided in a region constituting the cavity 28 so as to be separated from the contact portion with the first mold 22. ing. The connection terminal 18 of the substrate 12 is fitted into the recess 26 as described later. Furthermore, in the present embodiment, the recess 26 may be provided in each of the first mold 22 and the second mold 24, and even if two or more recesses 26 are provided in the second mold 24. Good. Thereby, even when two or more connection terminals 18 are provided apart from each other on the substrate 12, molding of the sealing resin composition is performed so that each connection terminal 18 is not sealed. It becomes possible. The width and depth of the recess 26 can be appropriately changed in accordance with the shape of the connection terminal 18 of the on-vehicle electronic control unit 10.

  In the example shown in FIG. 2, a recess 220 for forming the cavity 28 is formed on one surface of the first mold 22. In addition, a recess 240 for forming the cavity 28 is formed on one surface of the second mold 24. By clamping the first mold 22 and the second mold 24, the concave portion 220 and the concave portion 240 constitute the cavity 28. Further, a recess 26 is formed in a recess 240 for forming the cavity 28 of the second mold 24. In FIG. 2, the recess 26 is formed so as to be recessed in the direction orthogonal to the contact surface of the second die 24 that contacts the first die 22. In this case, the substrate 12 in which the connection terminal 18 is fitted into the recess 26 has, for example, the planar direction in the direction orthogonal to the contact surface. In addition, the position in which the recessed part 26 is formed is not limited to what is shown in FIG.

Next, as shown in FIG. 2B, the substrate 12 provided with the connection terminal 18 on one side is disposed in the cavity 28 so that the connection terminal 18 is fitted into the recess 26. In the present embodiment, the substrate 12 can be disposed in the cavity 28 by, for example, clamping the first mold 22 and the second mold 24 after fitting the connection terminal 18 into the recess 26. On the other hand, after fixing the substrate 12 to the first mold 22, the first mold 22 and the second mold 24 may be clamped so that the connection terminal 18 is fitted into the recess 26. Although either of the first mold 22 and the second mold 24 may be a lower mold, it is more preferable that the second mold 24 be a lower mold from the viewpoint of stably fixing the substrate 12. .
Furthermore, in the present embodiment, a cap that covers a part or the whole of the connection terminal 18 may be attached to the connection terminal 18. In this case, the connection terminal 18 with the cap attached can be fitted into the recess 26. As a result, generation of a gap between the recess 26 and the connection terminal 18 can be suppressed, and generation of burr around the connection terminal 18 can be suppressed more reliably. Although the material which comprises the said cap in particular is not limited, For example, silicone rubber is mentioned.

  Next, as shown in FIG. 2C, the sealing resin composition is injected into the cavity 28. In the present embodiment, the sealing resin composition injected into the heated mold is molded, and the sealing resin 14 for sealing the substrate 12 and the electronic component 16 is formed. At this time, the connection terminal 18 fitted in the recess 26 is not sealed by the sealing resin 14. Thus, the on-vehicle electronic control unit 10 in which the substrate 12 is sealed by the sealing resin 14 is obtained. Although shaping | molding of the resin composition for sealing is not specifically limited, For example, it can carry out by the transfer molding method.

  Then, after the first mold 22 and the second mold 24 are cooled, the on-vehicle electronic control unit 10 is taken out from the first mold 22 and the second mold 24. The method of manufacturing the on-vehicle electronic control unit 10 according to the present embodiment can be performed, for example, in this manner.

Note that the present invention is not limited to the above-described embodiment, and modifications, improvements, and the like as long as the object of the present invention can be achieved are included in the present invention.
Hereinafter, an example of a reference form is added.
1. A second mold comprising a first mold, a cavity together with the first mold, and a recess provided in a region constituting the cavity and separated from a contact portion with the first mold. And the step of preparing
Placing a substrate provided with a connection terminal on one side into the cavity such that the connection terminal is fitted into the recess;
Injecting a sealing resin composition into the cavity;
Equipped with
When the torque value of the sealing resin composition is measured over time using a Labo Plastomill at a rotational speed of 30 rpm and a measurement temperature of 175 ° C., the minimum torque value is 0.5 N · m to 2.5 N ·· m or less,
When the resin composition for sealing is molded at a mold temperature of 175 ° C., an injection pressure of 6.9 MPa, and a curing time of 120 seconds using a slit burr measurement mold having a slit with a thickness of 20 μm and a width of 5 mm. The manufacturing method of the vehicle-mounted electronic control unit whose length of the said resin composition for sealing with which a slit is filled is 2 mm or less.
2. 1. In the method of manufacturing an on-vehicle electronic control unit according to
The method for producing an on-vehicle electronic control unit, wherein the sealing resin composition has a gel time of 20 seconds to 45 seconds.
3. 1. Or 2. In the method of manufacturing an on-vehicle electronic control unit according to
In the sealing resin composition, the curing torque is measured over time at a mold temperature of 175 ° C. using a curastometer, and the time from the start of measurement to 0.1 N · m is 20 seconds or more A method of manufacturing an on-vehicle electronic control unit having a duration of 40 seconds or less.
4. 1. In the method of manufacturing an on-vehicle electronic control unit according to any one of
The method for producing an on-vehicle electronic control unit, wherein the sealing resin composition contains an inorganic filler.
5. 4. In the method of manufacturing an on-vehicle electronic control unit according to
The manufacturing method of the vehicle-mounted electronic control unit whose content of the said inorganic filler is 60 weight%-90 weight% with respect to the said whole resin composition for sealing.
6. 4. Or 5. In the method of manufacturing an on-vehicle electronic control unit according to
The method for manufacturing an on-vehicle electronic control unit, wherein the inorganic filler comprises crushed silica.
7. 1. In the method of manufacturing an on-vehicle electronic control unit according to any one of
The method for producing an on-vehicle electronic control unit, wherein the sealing resin composition contains an epoxy resin.
8. 7. In the method of manufacturing an on-vehicle electronic control unit according to
The method for producing an on-vehicle electronic control unit, wherein the epoxy resin is one or more selected from a novolac epoxy resin, a biphenyl epoxy resin, and a phenol aralkyl epoxy resin.
9. 1. A sealing resin composition for use in the method of manufacturing an on-vehicle electronic control unit according to any one of
Epoxy resin,
Inorganic filler,
Including
When the torque value of the sealing resin composition is measured over time using a Labo Plastomill at a rotational speed of 30 rpm and a measurement temperature of 175 ° C., the minimum torque value is 0.5 N · m to 2.5 N ·· m or less,
When the resin composition for sealing is molded at a mold temperature of 175 ° C., an injection pressure of 6.9 MPa, and a curing time of 120 seconds using a slit burr measurement mold having a slit with a thickness of 20 μm and a width of 5 mm. The sealing resin composition whose length of the said resin composition for sealing with which a slit is filled is 2 mm or less.

  Next, examples of the present invention will be described.

(Resin composition for sealing)
A sealing resin composition was prepared for each example and each comparative example as follows. First, according to the composition shown in Table 1, each component was premixed for 20 minutes with a Henschel mixer (volume 200 liters, rotation speed 900 rpm) set at room temperature. Then, using a continuous rotary ball mill (dynamic mill MYD25 manufactured by Nippon Coke Kogyo Co., Ltd., screw rotation speed 500 rpm, alumina ball diameter 10 mm, volume filling ratio of the ball to the apparatus volume 50%) of the obtained mixture, The material was pulverized at a material supply rate of 200 kg / hr while maintaining the material temperature at 30 ° C. or less. Then, the finely pulverized mixture is melt-kneaded using a single-screw extrusion kneader (screw diameter D = 46 mm, extruder length = 500 mm, melt-kneaded part length = 7D, screw rotation speed 200 rpm, discharge amount 30 kg / hr) did. Subsequently, the mixture after kneading was cooled and pulverized to obtain a sealing resin composition. In addition, each process from the pre-mixing with a Henschel mixer to obtaining the resin composition for sealing was performed continuously.

  In Table 1, the compounding ratio (weight%) of each component with respect to the whole resin composition for sealing is shown. The details of each component in Table 1 are as follows.

((A) Thermosetting resin)
Thermosetting resin 1: Ortho cresol novolac epoxy resin (EPICLON N-660, manufactured by DIC Corporation)
Thermosetting resin 2: Ortho cresol novolac type epoxy resin (EPICLON N-670-EXP-S, manufactured by DIC Corporation)
Thermosetting resin 3: Phenolic aralkyl type epoxy resin having a biphenylene skeleton (NC-3000, manufactured by Nippon Kayaku Co., Ltd.)
Thermosetting resin 4: Biphenyl type epoxy resin (YX-4000H, manufactured by Mitsubishi Chemical Corporation)

((B) Hardening agent)
Curing agent 1: Novolak type phenol resin (PR-HF-3, manufactured by Sumitomo Bakelite Co., Ltd.)
Curing agent 2: novolak type phenol resin (PR-51470, manufactured by Sumitomo Bakelite Co., Ltd.)
Hardening agent 3: Phenolic aralkyl resin having a biphenylene skeleton (MEH-7851 SS, manufactured by Meiwa Kasei Co., Ltd.)
Curing agent 4: Phenolic aralkyl resin having a phenylene skeleton (XL-225-3L, manufactured by Mitsui Chemicals, Inc.)

((C) curing catalyst)
Curing catalyst 1: Triphenylphosphine (PP-360, manufactured by KAI CO., LTD.)
Curing catalyst 2: Adduct of triphenylphosphine and p-benzoquinone (TPP-BQ)
Curing catalyst 3: 2,4-diamino-6- [2′-methylimidazolyl- (1 ′)]-ethyl-s-triazine (2MZ-A, manufactured by Shikoku Kasei Kogyo Co., Ltd.)

((D) Inorganic filler)
Inorganic filler 1: fused spherical silica (FB-950, manufactured by Denki Kagaku Kogyo Co., Ltd., average particle diameter D ₅₀ = 24 μm)
Inorganic filler 2: fused and crushed silica (RD-8, manufactured by Ryumori, average particle diameter D ₅₀ = 15 μm)
Inorganic filler 3: Aluminum hydroxide

((E) Other ingredients)
Silane coupling agent: N-phenyl-3-aminopropyltrimethoxysilane (KBM-573, manufactured by Shin-Etsu Chemical Co., Ltd.)
Oil: silicone oil (FZ-3730, Toray Dow Corning Co., Ltd.)
Low stress agent: silicone rubber (CF2152, Toray Dow Corning Co., Ltd.)
Releasing agent: Montanic acid ester wax (Recolub WE-4, Clariant Japan Co., Ltd.)
Colorant: carbon black (# 5, manufactured by Mitsubishi Chemical Corporation)

(Melting torque measurement)
The melt torque of each of the examples and the comparative examples was measured for the obtained resin composition for sealing. The measurement is to measure the melting torque of the resin composition for sealing over time under the conditions of a rotation number of 30 rpm and a measurement temperature of 175 ° C. using a laboplast mill tester (4C150, manufactured by Toyo Seiki Seisakusho Co., Ltd.) Went by. And the minimum torque value was calculated from the measurement result. The results are shown in Table 1. The unit in Table 1 is N · m.

(Slit burr measurement)
Slit burr measurement was carried out as follows for each of the examples and the comparative examples with respect to the obtained resin composition for sealing. First, a slit burr measurement mold 30 shown in FIG. 3 was prepared. The slit burr measurement mold 30 has a lower mold 34 having a cavity 38 and a slit 36 connected to the cavity 38, and an upper mold 32 having a resin injection port 40 for injecting a resin into the cavity 38. ing. The slit 36 has a thickness T of 20 μm and a width W of 5 mm. Subsequently, using the slit burr measurement mold 30, a resin composition for sealing was molded at a mold temperature of 175 ° C., an injection pressure of 6.9 MPa, an injection time of 15 seconds, and a curing time of 120 seconds. Next, the length of the sealing resin composition (slit burr) filled in the slit 36 via the cavity 38 was measured. The length of the resin which flowed out to the slit was measured with a caliper. The results are shown in Table 1. The unit in Table 1 is mm.

(Spiral flow measurement)
Spiral flow measurement was performed on the obtained sealing resin composition for each example and each comparative example. Spiral flow measurement is performed using a low-pressure transfer molding machine ("KTS-15" manufactured by Kotaki Seiki Co., Ltd.) in a mold for spiral flow measurement according to EMMI-1-66. Mold temperature 175 ° C, injection pressure The sealing resin composition was injected under the conditions of 6.9 MPa and a curing time of 120 seconds, and the flow length was measured. The results are shown in Table 1. The unit in Table 1 is cm.

(Gel time measurement)
The gel time of the obtained resin composition for sealing was measured about each Example and each comparative example. The measurement of gel time was performed by measuring the time (gel time) until hardening while melting with a spatula after melting the resin composition for sealing on a hot plate heated to 175 ° C. The results are shown in Table 1. The unit in Table 1 is seconds.

(Manufacturing of in-vehicle electronic control unit)
About each Example and each comparative example, the vehicle-mounted electronic control unit was manufactured as follows using the resin composition for sealing obtained above. First, a first mold, and a second mold having a recess which constitutes a cavity together with the first mold and which is provided apart from a contact portion with the first mold in a region constituting the cavity Prepared. Next, the wiring board (30 mm long × 50 mm wide × 1 mm wide) provided with a connection terminal on one side was fitted into the recess of the second mold. The wiring substrate had through holes (hole diameter: 0.4 mm) penetrating the upper and lower surfaces. Then, the first mold and the second mold were clamped to form a cavity in which the wiring board was disposed. Next, the sealing resin composition was injected into the cavity and molded to form a sealing resin that covers a portion of the wiring substrate excluding the connection terminal. Molding of the sealing resin composition was performed under the conditions of a mold temperature of 175 ° C., an injection pressure of 6.9 MPa, an injection time of 15 seconds, and a curing time of 120 seconds. Thus, an on-vehicle electronic control unit was manufactured.

(Evaluation of burr suppression around connection terminals)
About each Example and each comparative example, it was observed whether burring had arisen in sealing resin in the connection terminal circumference of the in-vehicle electronic control unit obtained above. Here, evaluation of burr suppression was performed, where the length of the burr was less than 1 mm, or a burr was not generated as ○, and a burr having a diameter of 1 mm or more was generated as x. The results are shown in Table 1.

(Evaluation of fillability to through holes)
About each Example and each comparative example, in the connection terminal part of the vehicle-mounted electronic control unit obtained above, it was observed whether the inside of the through hole of the wiring board was filled with sealing resin. In this case, the evaluation of the filling property was performed, with ○ indicating that no void that could cause a problem on the product occurred and と し て indicating that a void that could cause a problem on the product. The results are shown in Table 1.

DESCRIPTION OF SYMBOLS 10 automotive electronic control unit 12 substrate 14 sealing resin 16 electronic component 18 connection terminal 22 first mold 24 second mold 26, 220, 240 recess 28, 38 cavity 30 slit burr measurement mold 32 upper mold 34 lower Mold 36 Slit 40 Resin Filler 120 Through Hole

Claims (9)

A second mold comprising a first mold, a cavity together with the first mold, and a recess provided in a region constituting the cavity and separated from a contact portion with the first mold. And the step of preparing
Placing a substrate provided with a connection terminal on one side into the cavity such that the connection terminal is fitted into the recess;
Injecting a sealing resin composition into the cavity;
Equipped with
When the torque value of the sealing resin composition is measured over time using a Labo Plastomill at a rotational speed of 30 rpm and a measurement temperature of 175 ° C., the minimum torque value is 0.5 N · m to 1.2 N.・ M or less,
When the resin composition for sealing is molded at a mold temperature of 175 ° C., an injection pressure of 6.9 MPa, and a curing time of 120 seconds using a slit burr measurement mold having a slit with a thickness of 20 μm and a width of 5 mm. The manufacturing method of the vehicle-mounted electronic control unit whose length of the said resin composition for sealing with which the inside of a slit is filled is 0.2 mm or more and 1.3 mm or less. In the method of manufacturing an on-vehicle electronic control unit according to claim 1,
The method for producing an on-vehicle electronic control unit, wherein the sealing resin composition has a gel time of 20 seconds to 45 seconds. In the method of manufacturing an on-vehicle electronic control unit according to claim 1 or 2,
In the sealing resin composition, the curing torque is measured over time at a mold temperature of 175 ° C. using a curastometer, and the time from the start of measurement to 0.1 N · m is 20 seconds or more A method of manufacturing an on-vehicle electronic control unit having a duration of 40 seconds or less. In the method of manufacturing an on-vehicle electronic control unit according to any one of claims 1 to 3.
The method for producing an on-vehicle electronic control unit, wherein the sealing resin composition contains an inorganic filler. In the method of manufacturing an on-vehicle electronic control unit according to claim 4.
The manufacturing method of the vehicle-mounted electronic control unit whose content of the said inorganic filler is 60 weight%-90 weight% with respect to the said whole resin composition for sealing. In the method of manufacturing an on-vehicle electronic control unit according to claim 4 or 5,
The method for manufacturing an on-vehicle electronic control unit, wherein the inorganic filler comprises crushed silica. In the method of manufacturing an on-vehicle electronic control unit according to any one of claims 1 to 6,
The method for producing an on-vehicle electronic control unit, wherein the sealing resin composition contains an epoxy resin. In the method of manufacturing an on-vehicle electronic control unit according to claim 7,
The method for producing an on-vehicle electronic control unit, wherein the epoxy resin is one or more selected from a novolac epoxy resin, a biphenyl epoxy resin, and a phenol aralkyl epoxy resin. It is the resin composition for sealing used for the manufacturing method of the vehicle-mounted electronic control unit as described in any one of Claims 1-8,
Epoxy resin,
Inorganic filler,
Including
When the torque value of the sealing resin composition is measured over time using a Labo Plastomill at a rotational speed of 30 rpm and a measurement temperature of 175 ° C., the minimum torque value is 0.5 N · m to 1.2 N.・ M or less,
When the resin composition for sealing is molded at a mold temperature of 175 ° C., an injection pressure of 6.9 MPa, and a curing time of 120 seconds using a slit burr measurement mold having a slit with a thickness of 20 μm and a width of 5 mm. The sealing resin composition whose length of the said resin composition for sealing with which a slit is filled is 0.2 mm or more and 1.3 mm or less.

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