JP2017028082A - Method of manufacturing on-vehicle electronic control unit and resin composition for sealing - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve balance between suppression of burrs around a connection terminal and filling performance of a through hole penetrating through a substrate in a method of manufacturing an on-vehicle electronic control unit for sealing the substrate by using a resin composition for sealing.SOLUTION: A method of manufacturing an on-vehicle electronic control unit includes processes of: preparing a first mold and a second mold that constitutes a cavity together with the first mold and has a recessed portion provided in a region constituting the cavity while separating from an abutment portion to the first mold; disposing a substrate having a connection terminal provided on one side into the cavity so that the connection terminal is fitted into the recessed portion; and filling a predetermined resin composition for sealing into the cavity.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a method for manufacturing an on-vehicle electronic control unit, and a sealing resin composition.

  In recent years, a vehicle-mounted electronic control unit in which a substrate on which an electronic component or the like is mounted is sealed with a sealing resin has been studied. Examples of such a technique include those described in Patent Documents 1 and 2.

  Patent Document 1 discloses an electrical connection between a wiring board provided with a through hole, an electronic component mounted on the wiring board, a metal base on which the wiring board is mounted, and the wiring board and the outside attached to the metal base. This is a technology related to a resin-sealed electronic control device that includes a connector to be connected and in which a front surface of a wiring board and a part of a metal base are integrally sealed with a thermosetting resin. In Patent Document 2, a board having a card edge portion on which at least one card edge terminal connected to a mating connector is formed on at least one surface, the board are disposed in a first mold and a second mold, This is a technique related to a card member that is integrally molded by a synthetic resin material injected into a mold and a second mold, and that has a resin molded part in which a card edge part protrudes from at least one end part.

JP 2009-147014 A JP2013-232323A

  As described above, an in-vehicle electronic control unit has been studied to be manufactured by sealing a substrate on which electronic components and the like are mounted with a sealing resin composition. In this case, for example, the substrate is sealed so that the connection terminals for connecting to the outside provided on the substrate are exposed. However, when burrs occur in the sealing resin around the connection terminals, there is a risk of reducing the reliability of connection with the outside. On the other hand, when a through hole penetrating the substrate is provided, it is also required to improve the filling property of the sealing resin composition with respect to the through hole. Up to now, in the method of manufacturing an in-vehicle electronic control unit that seals a substrate using a sealing resin composition, it is excellent in suppressing burrs around the connection terminal and filling through holes through the substrate. It was difficult to achieve a good balance.

According to the present invention,
A second mold having a first mold and a cavity which forms a cavity together with the first mold and is provided in a region forming the cavity so as to be separated from a contact portion with the first mold. And a step of preparing
Arranging a substrate provided with a connection terminal on one side in the cavity so as to fit the connection terminal in the recess;
Injecting a sealing resin composition into the cavity;
With
When the torque value of the sealing resin composition was measured over time under the conditions of a rotation speed of 30 rpm and a measurement temperature of 175 ° C. using a lab plast mill, the minimum torque value was 0.5 N · m to 2.5 N · m or less,
When the sealing resin composition was molded at a mold temperature of 175 ° C., an injection pressure of 6.9 MPa, and a curing time of 120 seconds using a slit burr measuring mold having a slit with a thickness of 20 μm and a width of 5 mm, There is provided a method for producing an on-vehicle electronic control unit in which the length of the sealing resin composition filled in the slit is 2 mm or less.

Moreover, according to the present invention,
A sealing resin composition used in the above-described method for manufacturing an in-vehicle electronic control unit,
Epoxy resin,
An inorganic filler;
Including
When the torque value of the sealing resin composition was measured over time under the conditions of a rotation speed of 30 rpm and a measurement temperature of 175 ° C. using a lab plast mill, the minimum torque value was 0.5 N · m to 2.5 N · m or less,
When the sealing resin composition was molded at a mold temperature of 175 ° C., an injection pressure of 6.9 MPa, and a curing time of 120 seconds using a slit burr measuring mold having a slit with a thickness of 20 μm and a width of 5 mm, A sealing resin composition in which the length of the sealing resin composition filled in the slit is 2 mm or less is provided.

  According to the present invention, in a method for manufacturing an in-vehicle electronic control unit that seals a substrate using a sealing resin composition, suppression of burrs around a connection terminal, fillability of a through hole penetrating the substrate, The balance can be improved.

It is a cross-sectional schematic diagram which shows an example of the vehicle-mounted electronic control unit which concerns on this embodiment. It is a cross-sectional schematic diagram which shows an example of the manufacturing method of the vehicle-mounted electronic control unit shown in FIG. It is the cross-sectional schematic diagram which shows the metal mold | die for slit burr | flash measurement, and a plane schematic diagram.

  Hereinafter, embodiments will be described with reference to the drawings. In all the drawings, the same reference numerals are given to the same components, and the description will be omitted as appropriate.

  FIG. 1 is a schematic cross-sectional view illustrating an example of an in-vehicle electronic control unit 10 according to the present embodiment. FIG. 2 is a schematic cross-sectional view showing an example of a method for manufacturing the in-vehicle electronic control unit 10 shown in FIG. In addition, the vehicle-mounted electronic control unit 10 which concerns on this embodiment, and its manufacturing method are not limited to what is illustrated by FIG.

The on-vehicle electronic control unit manufacturing method according to the present embodiment is performed as follows. First, a cavity 28 is formed together with the first mold 22 and the first mold 22, and a recess 26 is provided in a region forming the cavity 28 so as to be separated from the contact portion with the first mold 22. A second mold 24 is prepared. Next, the substrate 12 provided with the connection terminals 18 on one side is disposed in the cavity 28 so that the connection terminals 18 are fitted into the recesses 26. Next, a sealing resin composition is injected into the cavity 28.
The resin composition for sealing had a minimum torque value of 0.5 N · m to 2.5 N · m when the torque value was measured over time using a lab plastmill at a rotation speed of 30 rpm and a measurement temperature of 175 ° C. m or less. Further, when a sealing resin composition was molded at a mold temperature of 175 ° C., an injection pressure of 6.9 MPa, and a curing time of 120 seconds using a slit burr measuring mold having a slit with a thickness of 20 μm and a width of 5 mm, The length of the sealing resin composition filled in the slit is 2 mm or less.

  In a method for manufacturing an on-vehicle electronic control unit, for example, after a wiring board on which electronic components are mounted in a cavity formed by a first mold and a second mold, a sealing resin composition is placed in the cavity. By injecting the material, the wiring substrate is sealed. In such a process, as described above, it has been demanded to improve the balance between the suppression of burrs around the connection terminal and the fillability of the through hole penetrating the substrate. The inventor is in a state where the connection terminal is fitted in a recessed portion provided in a region of the second mold that forms the cavity and separated from the contact portion with the first mold. Then, by performing sealing with the sealing resin composition, the occurrence of burrs around the connection terminals was suppressed. However, it has been difficult to sufficiently suppress the generation of burrs around the connection terminals only with such a technique. Moreover, the problem about the filling property to a through hole is still not solved.

  As a result of intensive studies, the inventor has controlled the burr around the connection terminal by simultaneously controlling the minimum torque value measured under specific conditions using a lab plast mill and the length of the slit burr. It was newly found out that a sealing resin composition capable of improving the balance between the filling properties of through-holes penetrating the substrate and improving the balance can be obtained. The manufacturing method of the vehicle-mounted electronic control unit according to the present embodiment is realized based on such knowledge. Therefore, according to the present embodiment, in a method for manufacturing an on-vehicle electronic control unit that seals a substrate using a sealing resin composition, suppression of burrs around a connection terminal and filling of a through hole penetrating the substrate It is possible to improve the balance between the characteristics.

  Hereinafter, the on-vehicle electronic control unit, the sealing resin composition, and the on-vehicle electronic control unit manufacturing method according to the present embodiment will be described in detail.

First, the in-vehicle electronic control unit 10 will be described.
The on-vehicle electronic control unit 10 is used to control an engine, various on-vehicle devices, and the like. As shown in FIG. 1, the on-vehicle electronic control unit 10 includes, for example, a substrate 12, an electronic component 16 mounted on the substrate 12, and a sealing resin 14 that seals the substrate 12 and the electronic component 16. ing. The substrate 12 has a connection terminal 18 for connecting to the outside on at least one side. The in-vehicle electronic control unit 10 according to an example of the present embodiment is electrically connected to the counterpart connector via the connection terminal 18 by fitting the connection terminal 18 and the counterpart connector.

  The substrate 12 is a wiring substrate in which circuit wiring is provided on one or both of one surface and the other surface opposite to the one surface, for example. As shown in FIG. 1, the substrate 12 has, for example, a flat plate shape. In the present embodiment, for example, an organic substrate formed of an organic material such as polyimide can be used as the substrate 12. The thickness of the substrate 12 is not particularly limited, but may be, for example, 0.1 mm or more and 5 mm or less, and preferably 0.5 mm or more and 3 mm or less.

  In the present embodiment, the substrate 12 may be provided with a through hole 120 that penetrates the substrate 12 and connects one surface to the other surface, for example. In this case, the wiring provided on one surface of the substrate 12 and the wiring provided on the other surface are electrically connected via the conductor pattern provided in the through hole 120. The conductive pattern is formed along the wall surface of the through hole 120. That is, the conductive pattern in the through hole 120 is formed in a cylindrical shape. In the through hole 120 after the sealing step, the voids formed by the inner wall surface of the conductive pattern are filled with a cured product (sealing resin 14) of the sealing resin composition of the present embodiment. The hole diameter of the through hole 120 is not particularly limited, but may be, for example, 0.1 mm to 1 mm, and preferably 0.3 mm to 0.8 mm. The film thickness of the through-hole 120 conductive pattern is not particularly limited as long as the above-described void holes are left, but may be, for example, 1 μm or more and 10 μm or less.

  In this embodiment, since the inside of the through hole 120 of the substrate 12 can be filled with a cured product of the sealing resin composition (sealing resin 14), the durability of the conductive pattern of the through hole 120 against thermal stress. Can be increased. Thereby, the vehicle-mounted electronic control unit excellent in reliability can be obtained. A plurality of through holes 120 may be formed in the substrate 12. Thereby, it can be set as the structure excellent in heat dissipation. The conductive pattern may not be formed in all of the through holes 120.

  In the present embodiment, the through hole 120 has been described. However, the present invention is not limited to this, and a slit (cut) that divides the connection terminal 18 into a plurality of pieces may be formed in the substrate 12. This slit becomes a part used for positioning etc. in the case of connection with the other party, for example. In the present embodiment, the slit width of the slit can be made as narrow as the through hole 120. Since a cured product (sealing resin 14) of the sealing resin composition of the present embodiment can be filled into a part of the base portion of the slit of the substrate 12 (base portion opposite to the tip portion), it is divided. The mechanical strength of the connected connection terminal 18 can be increased.

  For example, an electronic component 16 is mounted on one or both of one surface and the other surface of the substrate 12. The electronic component 16 is not particularly limited as long as it can be mounted on a vehicle-mounted electronic control unit. For example, a microcomputer may be mentioned.

  The sealing resin 14 is formed by molding a sealing resin composition so as to seal the substrate 12 and the electronic component 16. The sealing resin 14 is provided so as to seal one or both of the one surface and the other surface of the substrate 12. In FIG. 1, the case where the sealing resin 14 is provided so that the one surface and other surface of the board | substrate 12, and the electronic component 16 mounted in the board | substrate 12 may be sealed is illustrated. Further, the sealing resin 14 may seal only a part of the substrate 12 or may seal the entire substrate 12. In FIG. 1, the case where the sealing resin 14 is provided so as to seal the entire other part without sealing the connection terminal 18 of the substrate 12 so that the connection terminal 18 is exposed is illustrated. .

  In the vehicle-mounted electronic control unit 10 according to the present embodiment, the substrate 12 may be mounted on a metal base, for example. For example, the metal base can function as a heat sink for dissipating heat generated from the electronic component 16. In this embodiment, for example, the vehicle-mounted electronic control unit 10 can be formed by integrally sealing a metal base and the substrate 12 mounted on the metal base with a sealing resin composition. it can. Although it does not specifically limit as a metal material which comprises a metal base, For example, iron, copper, aluminum, an alloy containing these 1 type, or 2 or more types etc. can be included. The on-vehicle electronic control unit 10 does not have to have a metal base.

Next, the sealing resin composition according to this embodiment will be described.
The sealing resin composition has a minimum torque value of 0.5 N · m or more and 2.5 N · m when the torque value is measured over time using a lab plast mill at a rotation speed of 30 rpm and a measurement temperature of 175 ° C. It is as follows. As a result, as described above, it is possible to improve the balance between the suppression of burrs around the connection terminal and the fillability of the through hole penetrating the substrate. In this embodiment, for example, using a Laboplast mill tester (4C150, manufactured by Toyo Seiki Seisakusho Co., Ltd.), the melting torque of the sealing resin composition is changed over time under the conditions of a rotation speed of 30 rpm and a measurement temperature of 175 ° C. The minimum torque value can be obtained by measuring the above.

  The minimum torque value of the sealing resin composition is more preferably, for example, 2.0 N · m or less, and particularly preferably 1.5 N · m or less. Thereby, the filling property of the through-hole which penetrates a board | substrate can be improved more effectively. Moreover, it can contribute to the improvement of the filling property to the narrow gap formed between the plurality of electronic components 16 or the like. On the other hand, the minimum torque value of the sealing resin composition is more preferably, for example, 0.6 or more. Thereby, it becomes possible to more effectively suppress the generation of burrs.

  When the sealing resin composition was molded at a mold temperature of 175 ° C., an injection pressure of 6.9 MPa, and a curing time of 120 seconds using a slit burr measuring mold having a slit having a thickness of 20 μm and a width of 10 mm, a slit was formed. The length (hereinafter also referred to as slit burr length) of the sealing resin composition filled therein is 2 mm or less. As a result, as described above, it is possible to improve the balance between the suppression of burrs around the connection terminal and the fillability of the through hole penetrating the substrate.

FIG. 3 is a schematic view showing a slit burr measuring mold 30. FIG. 3A shows a schematic cross-sectional view of the slit burr measuring mold 30, and FIG. 3B shows a schematic plan view of the lower mold 34 of the slit burr measuring mold 30. In addition, the cross-sectional schematic diagram shown to Fig.3 (a) respond | corresponds to the AA 'cross section in FIG.3 (b).
As shown in FIG. 3, the slit burr measuring mold 30 includes a lower mold 34 having a cavity 38 and a slit 36 connected to the cavity 38, and a resin injection port 40 for injecting resin into the cavity 38. The upper mold | type 32 which has is provided. The slit 36 has a thickness T of 20 μm and a width W of 5 mm. In this embodiment, for example, when a sealing resin composition is injected from the resin injection port 40 into the cavity 38 and molded under the conditions of a mold temperature of 175 ° C., an injection pressure of 6.9 MPa, and a curing time of 120 seconds, the cavity The length of the sealing resin composition (slit burrs) filled in the slits 36 through 38 can be measured and used as the slit burr length.

  The slit burr length of the sealing resin composition is more preferably, for example, 1.7 mm or less, and particularly preferably 1.5 mm or less. Thereby, generation | occurrence | production of a burr | flash can be suppressed more effectively. On the other hand, the lower limit value of the slit burr length is not particularly limited, but can be set to 0.1 mm, for example, and may be 0.2 mm from the viewpoint of improving the filling ability into a narrow gap. More preferred.

  In this embodiment, for example, by controlling the preparation method of the sealing resin composition, and by appropriately selecting the types and blending ratios of the components constituting the sealing resin composition, etc. Both the minimum torque value and the slit burr length of the resin composition can be within a desired range. As a method for preparing a sealing resin composition, for example, the present inventor presumed that it is important to mix each component and then finely pulverize the obtained mixture with a rotating ball mill under certain conditions. Yes. For example, adjusting the conditions such as the volume filling rate of the ball with respect to the device volume and the material supply amount (kg / hr), and performing fine pulverization with a rotating ball mill, the minimum torque value of the sealing resin composition and the above It is thought to affect the slit burr length. In addition, controlling the conditions of the melt-kneading step after fine pulverization with a rotating ball mill, and continuously performing the process from mixing of each component to melt-kneading affect the properties of the sealing resin composition. It can be given. In addition, the preparation method of the resin composition for sealing is not limited to the above.

  In the present embodiment, for example, the gel time of the sealing resin composition can be 20 seconds or longer and 45 seconds or shorter. As a result, it is possible to further improve the balance between the suppression of burrs around the connection terminal and the fillability of the through hole penetrating the substrate. The gel time of the sealing resin composition is more preferably from 23 seconds to 40 seconds, and particularly preferably from 24 seconds to 35 seconds.

  In the present embodiment, for example, when the curing torque of the sealing resin composition is measured over time at a mold temperature of 175 ° C. using a curast meter, the measurement becomes 0.1 N · m from the start of measurement. Time (hereinafter also referred to as rise time) can be set to 20 seconds to 40 seconds. As a result, it is possible to further improve the balance between the suppression of burrs around the connection terminal and the fillability of the through hole penetrating the substrate.

  In the present embodiment, the flow length of the sealing resin composition measured by, for example, spiral flow can be 40 cm or more and 150 cm or less. As a result, it is possible to further improve the balance between the suppression of burrs around the connection terminal and the fillability of the through hole penetrating the substrate. The spiral flow flow length of the encapsulating resin composition is more preferably 45 cm or more and 125 cm or less. In the spiral flow measurement, for example, using a low-pressure transfer molding machine (“KTS-15” manufactured by Kotaki Seiki Co., Ltd.), a mold for spiral flow measurement according to EMMI-1-66 is used at a mold temperature of 175 ° C. The sealing resin composition is injected under the conditions of an injection pressure of 6.9 MPa and a curing time of 120 seconds, and the flow length is measured.

  The gel time, the rise time, and the spiral flow flow length of the encapsulating resin composition are controlled by, for example, controlling the preparation method of the encapsulating resin composition, and the types of components constituting the encapsulating resin composition It is possible to make each within a desired range by appropriately selecting the blending ratio and the like.

The sealing resin composition according to the present embodiment can include, for example, a thermosetting resin and an inorganic filler. Thereby, it is possible to contribute to improving the reliability of the in-vehicle electronic control unit 10 by reducing the coefficient of thermal expansion while improving heat resistance, moisture resistance reliability, mechanical strength, and the like.
Hereinafter, each component which comprises the resin composition for sealing is explained in full detail.

((A) thermosetting resin)
The thermosetting resin (A) is, for example, one or more selected from the group consisting of epoxy resins, phenol resins, oxetane resins, (meth) acrylate resins, unsaturated polyester resins, diallyl phthalate resins, and maleimide resins. Can be included. Among these, an epoxy resin can be included from the viewpoint of improving curability, storage stability, heat resistance, moisture resistance, and chemical resistance.

  As the epoxy resin contained in the thermosetting resin (A), monomers, oligomers and polymers generally having two or more epoxy groups in one molecule can be used, and the molecular weight and molecular structure are not particularly limited. In this embodiment, the epoxy resin is, for example, a biphenyl type epoxy resin; a bisphenol type epoxy resin such as a bisphenol A type epoxy resin, a bisphenol F type epoxy resin, or a tetramethylbisphenol F type epoxy resin; a stilbene type epoxy resin; a phenol novolac type epoxy. Resin, novolak type epoxy resin such as cresol novolak type epoxy resin; polyfunctional epoxy resin such as trisphenol type epoxy resin exemplified by triphenolmethane type epoxy resin, alkyl-modified triphenolmethane type epoxy resin, etc .; having phenylene skeleton Phenol aralkyl type epoxy resin, naphthol aralkyl type epoxy resin having phenylene skeleton, phenol aralkyl type epoxy resin having biphenylene skeleton, bif Phenol aralkyl type epoxy resins such as naphthol aralkyl type epoxy resins having a nylene skeleton; naphthol type epoxy resins such as dihydroxynaphthalene type epoxy resins and epoxy resins obtained by glycidyl etherification of dihydroxynaphthalene dimers; triglycidyl isocyanurate; Triazine nucleus-containing epoxy resins such as monoallyl diglycidyl isocyanurate; including one or more selected from the group consisting of bridged cyclic hydrocarbon compound-modified phenolic epoxy resins such as dicyclopentadiene-modified phenolic epoxy resins . Among these, inclusion of one or more selected from a novolac-type epoxy resin, a biphenyl-type epoxy resin, and a phenol aralkyl-type epoxy resin may reduce various burrs, fillability, heat resistance, moisture resistance, etc. It is more preferable from the viewpoint of improving the balance of characteristics.

  The content of the thermosetting resin (A) in the encapsulating resin composition is preferably 2% by mass or more, and more preferably 3% by mass or more with respect to the entire encapsulating resin composition. 4% by mass or more is particularly preferable. By making content of a thermosetting resin (A) more than the said lower limit, the fluidity | liquidity at the time of shaping | molding can be improved. For this reason, it is possible to improve filling properties and molding stability. On the other hand, the content of the thermosetting resin (A) in the sealing resin composition is preferably 50% by mass or less, and preferably 30% by mass or less, with respect to the entire sealing resin composition. Is more preferable, and it is especially preferable that it is 15 mass% or less. By setting the content of the thermosetting resin (A) to be equal to or lower than the above upper limit value, it is possible to improve the moisture resistance reliability and the reflow resistance of the in-vehicle electronic control unit 10.

((B) curing agent)
The resin composition for sealing can contain a hardening | curing agent (B). The curing agent (B) contained in the encapsulating resin composition can be roughly classified into three types, for example, a polyaddition type curing agent, a catalyst type curing agent, and a condensation type curing agent.

  Examples of the polyaddition type curing agent used as the curing agent (B) include aliphatic polyamines such as diethylenetriamine (DETA), triethylenetetramine (TETA), and metaxylylenediamine (MXDA), diaminodiphenylmethane (DDM), m -Polyamine compounds containing aromatic polyamines such as phenylenediamine (MPDA) and diaminodiphenylsulfone (DDS), dicyandiamide (DICY), organic acid dihydrazide, etc .; hexahydrophthalic anhydride (HHPA), methyltetrahydrophthalic anhydride (MTHPA) Acid anhydrides including aromatic acid anhydrides such as alicyclic acid anhydrides such as), trimellitic anhydride (TMA), pyromellitic anhydride (PMDA), and benzophenone tetracarboxylic acid (BTDA); Phenolic resin curing agents such as polyol resins, polyvinylphenols, aralkyl-type phenolic resins; polymercaptan compounds such as polysulfides, thioesters and thioethers; isocyanate compounds such as isocyanate prepolymers and blocked isocyanates; organics such as carboxylic acid-containing polyester resins One type or two or more types selected from the group consisting of acids are included.

  The catalyst-type curing agent used as the curing agent (B) is, for example, a tertiary amine compound such as benzyldimethylamine (BDMA) or 2,4,6-trisdimethylaminomethylphenol (DMP-30); 2-methylimidazole Imidazole compounds such as 2-ethyl-4-methylimidazole (EMI24); one or more selected from the group consisting of Lewis acids such as BF3 complexes.

  The condensation type curing agent used as the curing agent (B) is, for example, one type selected from the group consisting of a resol type phenol resin; a urea resin such as a methylol group-containing urea resin; and a melamine resin such as a methylol group-containing melamine resin; Including two or more types.

  Among these, it is more preferable to include a phenol resin-based curing agent from the viewpoint of improving the balance of flame resistance, moisture resistance, electrical characteristics, curability, storage stability, and the like. As the phenol resin-based curing agent, monomers, oligomers, and polymers in general having two or more phenolic hydroxyl groups in one molecule can be used, and the molecular weight and molecular structure are not particularly limited. The phenol resin-based curing agent used as the curing agent (B) is, for example, a novolac type phenol resin such as a phenol novolak resin, a cresol novolac resin, or a bisphenol novolac; a polyvinyl phenol; a polyfunctional phenol resin such as a triphenolmethane type phenol resin; Modified phenol resins such as terpene-modified phenol resin and dicyclopentadiene-modified phenol resin; phenol aralkyl resins having a phenylene skeleton and / or biphenylene skeleton, phenol aralkyl type phenol resins such as naphthol aralkyl resin having phenylene and / or biphenylene skeleton; bisphenol One type or two or more types selected from the group consisting of bisphenol compounds such as A and bisphenol F are included. Among these, from the viewpoint of improving the curability of the sealing resin composition, it is more preferable to include at least one of a novolac type phenol resin and a phenol aralkyl type phenol resin.

  The content of the curing agent (B) in the encapsulating resin composition is preferably 1% by mass or more, more preferably 2% by mass or more, based on the entire encapsulating resin composition. It is particularly preferable that the content is at least mass%. By setting the content of the curing agent (B) to the above lower limit value or more, excellent fluidity can be realized at the time of molding, and the filling property and moldability can be improved. On the other hand, it is preferable that content of the hardening | curing agent (B) in the resin composition for sealing is 40 mass% or less with respect to the whole resin composition for sealing, and it is more preferable that it is 25 mass% or less. It is preferably 10% by mass or less. By making content of a hardening | curing agent (B) below the said upper limit, the moisture-proof reliability and reflow resistance of the vehicle-mounted electronic control unit 10 can be improved.

((C) Curing catalyst)
The resin composition for sealing can further contain, for example, a curing catalyst (C). The curing catalyst (C) promotes a crosslinking reaction between the thermosetting resin (A) (for example, epoxy group of epoxy resin) and the curing agent (B) (for example, phenolic hydroxyl group of phenol resin-based curing agent). What is necessary is just to use, and what is used for the resin composition for general sealing can be used.

  In this embodiment, the curing catalyst (C) is a phosphorus atom-containing compound such as an organic phosphine, a tetra-substituted phosphonium compound, a phosphobetaine compound, an adduct of a phosphine compound and a quinone compound, or an adduct of a phosphonium compound and a silane compound. Imidazole, 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-phenylimidazole, 1-benzyl-2-methylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-undecylimidazole Imidazole compounds such as 1-cyanoethyl-2-phenylimidazole, 2-phenyl-4,5-dihydroxydimethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 1-cyanoethyl-2-undecylimidazolium tri Meritate, 1-cyanoethyl-2-phenylimidazolium trimellitate, 2,4-diamino-6- [2'-methylimidazolyl (1 ')]-ethyl-s-triazine, 2,4-diamino-6- [2′-undecylimidazolyl (1 ′)]-ethyl-s-triazine, 2,4-diamino-6- [2′-ethyl-4-methylimidazolyl (1 ′)]-ethyl-s-triazine, 2 , 4-Diamino-6- [2'-methylimidazolyl (1 ')]-ethyl-s-triazine isocyanuric acid adduct , One or more selected from amine-based curing accelerators such as 2-phenylimidazole isocyanuric acid adduct, 2-methylimidazole isocyanuric acid adduct, 1,8-diazabicyclo (5,4,0) undecene Can be included. Among these, from the viewpoint of improving the balance of burr suppression, filling properties, and curability, it is more preferable to include one or more selected from phosphorus atom-containing compounds and imidazole compounds. Moreover, it is more preferable that a phosphorus atom containing compound is included from a viewpoint of improving sclerosis | hardenability.

  Examples of the organic phosphine that can be used in the sealing resin composition include a first phosphine such as ethylphosphine and phenylphosphine; a second phosphine such as dimethylphosphine and diphenylphosphine; trimethylphosphine, triethylphosphine, tributylphosphine, and triphenyl. Third phosphine such as phosphine can be mentioned.

  Examples of the tetra-substituted phosphonium compound that can be used in the sealing resin composition include a compound represented by the following general formula (4).

（上記一般式（４）において、Ｐはリン原子を表す。Ｒ^４、Ｒ^５、Ｒ^６およびＲ^７は芳香族基またはアルキル基を表す。Ａはヒドロキシル基、カルボキシル基、チオール基から選ばれる官能基のいずれかを芳香環に少なくとも１つ有する芳香族有機酸のアニオンを表す。ＡＨはヒドロキシル基、カルボキシル基、チオール基から選ばれる官能基のいずれかを芳香環に少なくとも１つ有する芳香族有機酸を表す。ｘ、ｙは１〜３の数、ｚは０〜３の数であり、かつｘ＝ｙである。）

(In the general formula (4), P represents a phosphorus atom. R ⁴ , R ⁵ , R ⁶ and R ⁷ represent an aromatic group or an alkyl group. A is selected from a hydroxyl group, a carboxyl group, and a thiol group. An anion of an aromatic organic acid having at least one functional group in the aromatic ring, AH is an aromatic having at least one functional group selected from a hydroxyl group, a carboxyl group, and a thiol group in the aromatic ring. Represents an organic acid, where x and y are numbers 1 to 3, z is a number 0 to 3, and x = y.

Although the compound represented by General formula (4) is obtained as follows, for example, it is not limited to this. First, a tetra-substituted phosphonium halide, an aromatic organic acid and a base are mixed in an organic solvent and mixed uniformly to generate an aromatic organic acid anion in the solution system. Then, when water is added, the compound represented by the general formula (4) can be precipitated. In the compound represented by the general formula (4), R ⁴ , R ⁵ , R ⁶ and R ⁷ bonded to the phosphorus atom are phenyl groups, and AH is a compound having a hydroxyl group in an aromatic ring, that is, phenols. And A is preferably an anion of the phenol. Examples of the phenols include monocyclic phenols such as phenol, cresol, resorcin, and catechol, condensed polycyclic phenols such as naphthol, dihydroxynaphthalene, and anthraquinol, bisphenols such as bisphenol A, bisphenol F, and bisphenol S, Examples include polycyclic phenols such as phenylphenol and biphenol.

  Examples of the phosphobetaine compound that can be used in the encapsulating resin composition include compounds represented by the following general formula (5).

（上記一般式（５）において、Ｒ^８は炭素数１〜３のアルキル基、Ｒ^９はヒドロキシル基を表す。ｆは０〜５の数であり、ｇは０〜３の数である。）

(In the above general formula (5), R ⁸ represents an alkyl group having 1 to 3 carbon atoms, R ⁹ represents a hydroxyl group. F is a number from 0 to 5, and g is a number from 0 to 3.)

  The compound represented by the general formula (5) is obtained, for example, as follows. First, it is obtained through a step of bringing a triaromatic substituted phosphine, which is a third phosphine, into contact with a diazonium salt and replacing the triaromatic substituted phosphine with a diazonium group of the diazonium salt. However, the present invention is not limited to this.

  Examples of the adduct of a phosphine compound and a quinone compound that can be used in the sealing resin composition include a compound represented by the following general formula (6).

（上記一般式（６）において、Ｐはリン原子を表す。Ｒ^１０、Ｒ^１１およびＲ^１２は炭素数１〜１２のアルキル基または炭素数６〜１２のアリール基を表し、互いに同一であっても異なっていてもよい。Ｒ^１３、Ｒ^１４およびＲ^１５は水素原子または炭素数１〜１２の炭化水素基を表し、互いに同一であっても異なっていてもよく、Ｒ^１４とＲ^１５が結合して環状構造となっていてもよい。）

(In the general formula (6), P represents a phosphorus atom. R ¹⁰ , R ¹¹ and R ¹² represent an alkyl group having 1 to 12 carbon atoms or an aryl group having 6 to 12 carbon atoms, and are the same as each other. R ¹³ , R ¹⁴ and R ¹⁵ each represents a hydrogen atom or a hydrocarbon group having 1 to 12 carbon atoms, and may be the same or different from each other, and R ¹⁴ and R ¹⁵ are bonded to each other. And may have a circular structure.)

  Examples of the phosphine compound used as an adduct of a phosphine compound and a quinone compound include an aromatic ring such as triphenylphosphine, tris (alkylphenyl) phosphine, tris (alkoxyphenyl) phosphine, trinaphthylphosphine, and tris (benzyl) phosphine. Those having a substituent or a substituent such as an alkyl group and an alkoxyl group are preferred, and examples of the substituent such as an alkyl group and an alkoxyl group include those having 1 to 6 carbon atoms. From the viewpoint of availability, triphenylphosphine is preferable.

  Moreover, as a quinone compound used for the adduct of a phosphine compound and a quinone compound, a benzoquinone and anthraquinones are mentioned, Especially, p-benzoquinone is preferable from the point of storage stability.

  As a method for producing an adduct of a phosphine compound and a quinone compound, the adduct can be obtained by contacting and mixing in a solvent capable of dissolving both organic tertiary phosphine and benzoquinone. The solvent is preferably a ketone such as acetone or methyl ethyl ketone, which has low solubility in the adduct. However, the present invention is not limited to this.

In the compound represented by the general formula (6), R ¹⁰ , R ¹¹ and R ¹² bonded to the phosphorus atom are phenyl groups, and R ¹³ , R ¹⁴ and R ¹⁵ are hydrogen atoms, ie, 1, A compound in which 4-benzoquinone and triphenylphosphine are added is preferable in that it reduces the thermal elastic modulus of the cured product of the encapsulating resin composition.

  Examples of the adduct of a phosphonium compound and a silane compound that can be used in the sealing resin composition include a compound represented by the following general formula (7).

（上記一般式（７）において、Ｐはリン原子を表し、Ｓｉは珪素原子を表す。Ｒ^１６、Ｒ^１７、Ｒ^１８およびＲ^１９は、それぞれ、芳香環または複素環を有する有機基、あるいは脂肪族基を表し、互いに同一であっても異なっていてもよい。式中Ｒ^２０は、基Ｙ^２およびＹ^３と結合する有機基である。式中Ｒ^２１は、基Ｙ^４およびＹ^５と結合する有機基である。Ｙ^２およびＹ^３は、プロトン供与性基がプロトンを放出してなる基を表し、同一分子内の基Ｙ^２およびＹ^３が珪素原子と結合してキレート構造を形成するものである。Ｙ^４およびＹ^５はプロトン供与性基がプロトンを放出してなる基を表し、同一分子内の基Ｙ^４およびＹ^５が珪素原子と結合してキレート構造を形成するものである。Ｒ^２０、およびＲ^２１は互いに同一であっても異なっていてもよく、Ｙ^２、Ｙ^３、Ｙ^４およびＹ^５は互いに同一であっても異なっていてもよい。Ｚ^１は芳香環または複素環を有する有機基、あるいは脂肪族基である。）

(In the general formula (7), P represents a phosphorus atom and Si represents a silicon atom. R ¹⁶ , R ¹⁷ , R ¹⁸ and R ¹⁹ are each an organic group having an aromatic ring or a heterocyclic ring, or an aliphatic group. Represents a group, which may be the same or different from each other, wherein R ²⁰ is an organic group bonded to the groups Y ² and Y ^{3. In the} formula, R ²¹ represents the groups Y ⁴ and Y ⁵ ; Y ² and Y ³ represent a group formed by releasing a proton from a proton donating group, and groups Y ² and Y ³ in the same molecule are bonded to a silicon atom to form a chelate structure. Y ⁴ and Y ⁵ represent a group formed by releasing a proton from a proton donating group, and groups Y ⁴ and Y ⁵ in the same molecule are combined with a silicon atom to form a chelate structure. there ^{.R 20,} and ^{R 21} are mutually Or different ^{mere, Y 2, Y 3, Y} 4 and Y ⁵ may .Z ¹ also being the same or different organic group having an aromatic ring or a heterocyclic ring or fat, A group.)

In the general formula (7), examples of R ¹⁶ , R ¹⁷ , R ¹⁸ and R ¹⁹ include a phenyl group, a methylphenyl group, a methoxyphenyl group, a hydroxyphenyl group, a naphthyl group, a hydroxynaphthyl group, a benzyl group, and a methyl group. , Ethyl group, n-butyl group, n-octyl group, cyclohexyl group and the like, among these, alkyl groups such as phenyl group, methylphenyl group, methoxyphenyl group, hydroxyphenyl group, hydroxynaphthyl group, and alkoxy groups An aromatic group having a substituent such as a hydroxyl group or an unsubstituted aromatic group is more preferable.

In the general formula ^{(7), R 20} is an organic group bonded to ^{Y 2} and ^{Y 3.} Similarly, R ²¹ is an organic group that binds to groups Y ⁴ and Y ⁵ . Y ² and Y ³ are groups formed by proton-donating groups releasing protons, and groups Y ² and Y ³ in the same molecule are combined with a silicon atom to form a chelate structure. Similarly, Y ⁴ and Y ⁵ are groups formed by proton-donating groups releasing protons, and groups Y ⁴ and Y ⁵ in the same molecule are combined with a silicon atom to form a chelate structure. The groups R ²⁰ and R ²¹ may be the same or different from each other, and the groups Y ² , Y ³ , Y ⁴ , and Y ⁵ may be the same or different from each other. In the group represented by —Y ² —R ²⁰ —Y ³ — and —Y ⁴ —R ²¹ —Y ⁵ — in the general formula (7), the proton donor releases two protons. The proton donor is preferably an organic acid having at least two carboxyl groups or hydroxyl groups in the molecule, and further, a carboxyl group or hydroxyl group on the adjacent carbon constituting the aromatic ring. Are preferable, and aromatic compounds having at least two hydroxyl groups on adjacent carbons constituting the aromatic ring are more preferable. For example, catechol, pyrogallol, 1,2-dihydroxynaphthalene, 2,3- Dihydroxynaphthalene, 2,2′-biphenol, 1,1′-bi-2-naphthol, salicylic acid, 1-hydroxy-2-naphthoic acid, 3- Examples include droxy-2-naphthoic acid, chloranilic acid, tannic acid, 2-hydroxybenzyl alcohol, 1,2-cyclohexanediol, 1,2-propanediol, and glycerin. Among these, catechol, 1,2- Dihydroxynaphthalene and 2,3-dihydroxynaphthalene are more preferable.

Z ¹ in the general formula (7) represents an organic group or an aliphatic group having an aromatic ring or a heterocyclic ring, and specific examples thereof include a methyl group, an ethyl group, a propyl group, a butyl group, Aliphatic hydrocarbon groups such as hexyl group and octyl group, aromatic hydrocarbon groups such as phenyl group, benzyl group, naphthyl group and biphenyl group, glycidyloxy groups such as glycidyloxypropyl group, mercaptopropyl group and aminopropyl group Reactive groups such as mercapto groups, alkyl groups having amino groups, and vinyl groups. Among these, methyl groups, ethyl groups, phenyl groups, naphthyl groups, and biphenyl groups are preferred from the viewpoint of thermal stability. More preferable.

  As a method for producing an adduct of a phosphonium compound and a silane compound, a silane compound such as phenyltrimethoxysilane and a proton donor such as 2,3-dihydroxynaphthalene are added to a flask containing methanol and dissolved, and then room temperature. Sodium methoxide-methanol solution is added dropwise with stirring. Furthermore, when a solution prepared by dissolving a tetra-substituted phosphonium halide such as tetraphenylphosphonium bromide in methanol in methanol is added dropwise with stirring at room temperature, crystals are precipitated. The precipitated crystals are filtered, washed with water, and vacuum dried to obtain an adduct of a phosphonium compound and a silane compound. However, it is not limited to this.

  The content of the curing catalyst (C) is preferably 0.05% by mass or more, more preferably 0.1% by mass or more, and 0.15% by mass with respect to the entire sealing resin composition. The above is particularly preferable. By making content of a curing catalyst (C) more than the said lower limit, sclerosis | hardenability at the time of sealing molding can be improved effectively. On the other hand, the content of the curing catalyst (C) is preferably 2.0% by mass or less, more preferably 1.0% by mass or less, based on the whole sealing resin composition. It is particularly preferably 5% by mass or less. By making content of a curing catalyst (C) below the said upper limit, the fluidity | liquidity at the time of sealing molding can be improved and it can contribute to the improvement of a filling property.

((D) inorganic filler)
The inorganic filler (D) can include one or more selected from the group consisting of silica such as fused silica and crystalline silica, alumina, aluminum hydroxide, silicon nitride, and aluminum nitride. Among these, from the viewpoint of excellent versatility, it is more preferable to include silica, and it is particularly preferable to include fused silica. Moreover, it is more preferable that aluminum hydroxide is included from a viewpoint of improving the flame retardance of the sealing resin formed using the resin composition for sealing. In this embodiment, the case where both a silica and aluminum hydroxide are included can be mentioned as an example of a preferable aspect.

  The inorganic filler (D) can contain, for example, crushed silica. Thereby, it is possible to more effectively suppress burrs while reducing the manufacturing cost of the in-vehicle electronic control unit 10. When the inorganic filler (D) contains crushed silica, the content of crushed silica can be, for example, 10 wt% or more and 100 wt% or less with respect to the entire inorganic filler (D), and 15 wt% or more and 95 wt%. It is more preferable to set the weight% or less. Moreover, an inorganic filler (D) can contain spherical silica from a viewpoint which improves the fluidity | liquidity of the resin composition for sealing, and contributes to a shaping | molding stability and a fillability improvement. When the inorganic filler (D) contains spherical silica, the content of the spherical silica can be, for example, 10% by weight or more and 100% by weight or less, and 15% by weight or more and 95% by weight with respect to the whole inorganic filler (D). It is more preferable to set the weight% or less. In this embodiment, the case where both spherical silica and crushed silica are included as the inorganic filler (D) can be mentioned as an example of a preferred embodiment.

If an inorganic filler (D) comprises silica, inorganic filler (D), for example preferably comprises a silica average particle diameter _{D 50} is 3μm or more 50μm or less, an average particle diameter _{D 50} of 10μm or more 30μm or less More preferably, it contains silica. Thereby, balance, such as filling property, suppression of a burr | flash, moisture resistance, and heat resistance, can be improved more effectively. The average particle diameter _{D 50} of the silica, such as the commercially available laser particle size distribution analyzer (e.g., manufactured by Shimadzu Corporation, SALD-7000 etc.) can be measured using the.

  The content of the inorganic filler (D) in the encapsulating resin composition is preferably 60% by mass or more, and more preferably 70% by mass or more with respect to the entire encapsulating resin composition. By setting the content of the inorganic filler (D) to the above lower limit value or more, low moisture absorption and low thermal expansion are improved, and moisture resistance reliability and reflow resistance of the in-vehicle electronic control unit 10 are more effectively improved. Can be made. On the other hand, the content of the inorganic filler (D) in the encapsulating resin composition is preferably 90% by mass or less and more preferably 85% by mass or less with respect to the entire encapsulating resin composition. More preferred. By making content of an inorganic filler (D) below the said upper limit, it becomes possible to improve the fluidity | liquidity and filling property at the time of shaping | molding of the resin composition for sealing more effectively.

((E) Other ingredients)
For the sealing resin composition, various additives such as a coupling agent, a release agent, a colorant, an ion scavenger, an oil, a low stress agent, a flame retardant, and an antioxidant are added as necessary. One or more of them can be appropriately blended. Coupling agents are known couplings such as various silane compounds such as epoxy silane, mercapto silane, amino silane, alkyl silane, ureido silane, vinyl silane, methacryl silane, titanium compounds, aluminum chelates, and aluminum / zirconium compounds. An agent can be included. Among these, it is more preferable that epoxysilane and aminosilane are included, and it is particularly preferable that secondary aminosilane that is aminosilane is included because the effects of the present application can be further expressed. The releasability-imparting agent is, for example, one or two selected from natural waxes such as carnauba wax, synthetic waxes such as montanic acid ester wax and oxidized polyethylene wax, higher fatty acids such as zinc stearate and metal salts thereof, and paraffin. More than types can be included. The colorant can include, for example, one or both of carbon black and black titanium oxide. The ion scavenger can include, for example, hydrotalcite. The oil can include, for example, silicone oil. The low stress agent can include, for example, silicone rubber. The flame retardant may include one or more selected from, for example, magnesium hydroxide, zinc borate, zinc molybdate, and phosphazene. Antioxidant can contain the 1 type (s) or 2 or more types selected from a phenolic antioxidant, phosphorus antioxidant, and thioether type | system | group antioxidant.

Next, the manufacturing method of the vehicle-mounted electronic control unit 10 will be described.
First, as shown to Fig.2 (a), the manufacturing apparatus of the vehicle-mounted electronic control unit 10 provided with the 1st metal mold | die 22 and the 2nd metal mold | die 24 is prepared. The second mold 24 constitutes a cavity 28 together with the first mold 22, and has a recess 26 provided in a region constituting the cavity 28 so as to be separated from the contact portion with the first mold 22. ing. As will be described later, the connection terminal 18 of the substrate 12 is fitted into the recess 26. In the present embodiment, the first mold 22 and the second mold 24 may each be provided with a recess 26, or the second mold 24 may be provided with two or more recesses 26. Good. Thereby, even if it is a case where the two or more connection terminals 18 are provided in the board | substrate 12 mutually spaced apart, shaping | molding of the resin composition for sealing can be performed so that each connection terminal 18 may not be sealed. It becomes possible. Note that the width and depth of the recess 26 can be appropriately changed according to the shape of the connection terminal 18 of the in-vehicle electronic control unit 10.

  In the example shown in FIG. 2, a recess 220 for forming the cavity 28 is formed on one surface of the first mold 22. Further, a recess 240 for forming the cavity 28 is formed on one surface of the second mold 24. By clamping the first mold 22 and the second mold 24, the cavity 28 is constituted by the recess 220 and the recess 240. A recess 26 is formed in a recess 240 for configuring the cavity 28 in the second mold 24. In FIG. 2, a recess 26 is formed so as to be recessed in a direction orthogonal to the contact surface that contacts the first mold 22 of the second mold 24. In this case, the substrate 12 in which the connection terminal 18 is fitted in the recess 26 has a planar direction in a direction orthogonal to the contact surface, for example. The position where the recess 26 is formed is not limited to that shown in FIG.

Next, as shown in FIG. 2B, the substrate 12 provided with the connection terminals 18 on one side is disposed in the cavity 28 so that the connection terminals 18 are fitted into the recesses 26. In the present embodiment, for example, after the connection terminal 18 is fitted into the recess 26, the first mold 22 and the second mold 24 are clamped to place the substrate 12 in the cavity 28. On the other hand, after fixing the substrate 12 to the first mold 22, the first mold 22 and the second mold 24 may be clamped so that the connection terminal 18 is fitted in the recess 26. Any of the first mold 22 and the second mold 24 may be a lower mold, but it is more preferable to use the second mold 24 as a lower mold from the viewpoint of stably fixing the substrate 12. .
In the present embodiment, a cap that covers part or all of the connection terminal 18 may be attached to the connection terminal 18. In this case, the connection terminal 18 to which the cap is attached can be fitted into the recess 26. Thereby, generation | occurrence | production of the clearance gap between the recessed part 26 and the connection terminal 18 is suppressed, and generation | occurrence | production of the burr | flash in the periphery of the connection terminal 18 can be suppressed more reliably. Although the material which comprises the said cap is not specifically limited, For example, a silicone rubber is mentioned.

  Next, as shown in FIG. 2C, the sealing resin composition is injected into the cavity 28. In this embodiment, the sealing resin composition injected into the heated mold is molded, and the sealing resin 14 for sealing the substrate 12 and the electronic component 16 is formed. At this time, the connection terminal 18 fitted in the recess 26 is not sealed with the sealing resin 14. In this way, the in-vehicle electronic control unit 10 in which the substrate 12 is sealed with the sealing resin 14 is obtained. The molding of the sealing resin composition is not particularly limited, but can be performed, for example, by a transfer molding method.

  Next, after cooling the first mold 22 and the second mold 24, the vehicle-mounted electronic control unit 10 is taken out from the first mold 22 and the second mold 24. The manufacturing method of the vehicle-mounted electronic control unit 10 according to the present embodiment can be performed in this manner, for example.

  It should be noted that the present invention is not limited to the above-described embodiments, and modifications, improvements, and the like within the scope that can achieve the object of the present invention are included in the present invention.

  Next, examples of the present invention will be described.

(Resin composition for sealing)
About each Example and each comparative example, the resin composition for sealing was prepared as follows. First, according to the formulation shown in Table 1, each component was premixed for 20 minutes with a Henschel mixer (capacity 200 liters, rotation speed 900 rpm) set to room temperature. Next, the obtained mixture was used using a continuous rotating ball mill (Nippon Coke Industries, Ltd., dynamic mill MYD25, screw rotation speed 500 rpm, alumina ball diameter 10 mm, volume filling rate of balls with respect to the device volume 50%), The material was supplied at a feed rate of 200 kg / hr and was finely pulverized while maintaining the material temperature at 30 ° C. Next, the finely pulverized mixture was melt kneaded using a single screw extrusion kneader (screw diameter D = 46 mm, extruder length = 500 mm, melt kneading section length = 7 D, screw rotation speed 200 rpm, discharge rate 30 kg / hr). did. Next, the kneaded mixture was cooled and pulverized to obtain a sealing resin composition. In addition, each process from the preliminary mixing by a Henschel mixer to obtaining the sealing resin composition was continuously performed.

  Table 1 shows the blending ratio (% by weight) of each component with respect to the entire sealing resin composition. The details of each component in Table 1 are as follows.

((A) thermosetting resin)
Thermosetting resin 1: Orthocresol novolac type epoxy resin (EPICLON N-660, manufactured by DIC Corporation)
Thermosetting resin 2: Orthocresol novolac type epoxy resin (EPICLON N-670-EXP-S, manufactured by DIC Corporation)
Thermosetting resin 3: phenol aralkyl type epoxy resin having a biphenylene skeleton (NC-3000, manufactured by Nippon Kayaku Co., Ltd.)
Thermosetting resin 4: Biphenyl type epoxy resin (YX-4000H, manufactured by Mitsubishi Chemical Corporation)

((B) curing agent)
Curing agent 1: Novolac type phenolic resin (PR-HF-3, manufactured by Sumitomo Bakelite Co., Ltd.)
Curing agent 2: Novolac type phenol resin (PR-51470, manufactured by Sumitomo Bakelite Co., Ltd.)
Curing agent 3: Phenol aralkyl resin having a biphenylene skeleton (MEH-7851SS, manufactured by Meiwa Kasei Co., Ltd.)
Curing agent 4: Phenol aralkyl resin having a phenylene skeleton (XL-225-3L, manufactured by Mitsui Chemicals, Inc.)

((C) Curing catalyst)
Curing catalyst 1: triphenylphosphine (PP-360, manufactured by KAI Kasei Co., Ltd.)
Curing catalyst 2: adduct of triphenylphosphine and p-benzoquinone (TPP-BQ)
Curing catalyst 3: 2,4-diamino-6- [2′-methylimidazolyl- (1 ′)]-ethyl-s-triazine (2MZ-A, manufactured by Shikoku Chemicals Co., Ltd.)

((D) inorganic filler)
Inorganic filler 1: fused spherical silica (FB-950, manufactured by Denki Kagaku Kogyo Co., Ltd., average particle diameter D ₅₀ = 24 μm)
Inorganic filler 2: fused crushed silica (RD-8, manufactured by Tatsumori Co., Ltd., average particle diameter D ₅₀ = 15 μm)
Inorganic filler 3: Aluminum hydroxide

((E) Other ingredients)
Silane coupling agent: N-phenyl-3-aminopropyltrimethoxysilane (KBM-573, manufactured by Shin-Etsu Chemical Co., Ltd.)
Oil: Silicone oil (FZ-3730, manufactured by Toray Dow Corning Co., Ltd.)
Low stress agent: Silicone rubber (CF2152, manufactured by Toray Dow Corning Co., Ltd.)
Release agent: Montanate ester wax (Recove WE-4, manufactured by Clariant Japan Co., Ltd.)
Colorant: Carbon black (# 5, manufactured by Mitsubishi Chemical Corporation)

(Melt torque measurement)
About each Example and each comparative example, the melt torque was measured about the obtained resin composition for sealing. The measurement is to measure the melting torque of the sealing resin composition over time under the conditions of a rotation speed of 30 rpm and a measurement temperature of 175 ° C. using a lab plast mill tester (manufactured by Toyo Seiki Seisakusho, 4C150). It went by. And the minimum torque value was computed from the measurement result. The results are shown in Table 1. The unit in Table 1 is N · m.

(Slit burr measurement)
About each Example and each comparative example, the slit burr | flash measurement was performed as follows about the obtained resin composition for sealing. First, a slit burr measuring mold 30 shown in FIG. 3 was prepared. The slit burr measuring mold 30 includes a lower mold 34 having a cavity 38 and a slit 36 connected to the cavity 38, and an upper mold 32 having a resin injection port 40 for injecting resin into the cavity 38. ing. The slit 36 has a thickness T of 20 μm and a width W of 5 mm. Next, a sealing resin composition was molded using a slit burr measuring mold 30 at a mold temperature of 175 ° C., an injection pressure of 6.9 MPa, an injection time of 15 seconds, and a curing time of 120 seconds. Next, the length of the sealing resin composition (slit burr) filled in the slit 36 through the cavity 38 was measured. The length of the resin that flowed out to the slit was measured with a caliper. The results are shown in Table 1. The unit in Table 1 is mm.

(Spiral flow measurement)
About each Example and each comparative example, spiral flow measurement was performed with respect to the obtained resin composition for sealing. Spiral flow measurement was performed using a low-pressure transfer molding machine (“KTS-15” manufactured by Kotaki Seiki Co., Ltd.) in a mold for spiral flow measurement according to EMMI-1-66, at a mold temperature of 175 ° C. and injection pressure. The sealing resin composition was injected under conditions of 6.9 MPa and a curing time of 120 seconds, and the flow length was measured. The results are shown in Table 1. The unit in Table 1 is cm.

(Gel time measurement)
About each Example and each comparative example, the gel time of the obtained resin composition for sealing was measured. The gel time was measured by measuring the time (gel time) until the resin composition for sealing was melted on a hot plate heated to 175 ° C. and then cured while kneading with a spatula. The results are shown in Table 1. The unit in Table 1 is seconds.

(Manufacture of in-vehicle electronic control units)
About each Example and each comparative example, the vehicle-mounted electronic control unit was manufactured as follows using the resin composition for sealing obtained above. First, a first mold, and a second mold that forms a cavity together with the first mold and has a recess provided in a region that forms the cavity apart from a contact portion with the first mold. Prepared. Next, the connection terminal was fitted into the recess of the second mold on the wiring board (length 30 mm × width 50 mm × width 1 mmt) provided with the connection terminal on one side. The wiring board had through holes (hole diameter 0.4 mm) penetrating the upper and lower surfaces. Next, the first mold and the second mold were clamped to form a cavity in which the wiring board was placed. Next, a sealing resin composition was injected into the cavity and molded to form a sealing resin that covers a portion of the wiring board excluding the connection terminals. The sealing resin composition was molded under the conditions of a mold temperature of 175 ° C., an injection pressure of 6.9 MPa, an injection time of 15 seconds, and a curing time of 120 seconds. In this way, an in-vehicle electronic control unit was manufactured.

(Burr suppression evaluation around connection terminals)
About each Example and each comparative example, it was observed whether the burr | flash produced in sealing resin around the connection terminal of the vehicle-mounted electronic control unit obtained above. Here, the evaluation of burr suppression was carried out with a burr length of less than 1 mm or a burr that did not occur as ◯, and a burr that was 1 mm or more as x. The results are shown in Table 1.

(Evaluation of fillability in through holes)
For each example and each comparative example, it was observed whether or not the through hole of the wiring board was filled with the sealing resin in the connection terminal portion of the on-vehicle electronic control unit obtained above. Here, the evaluation of the filling property was performed by assuming that no void that could cause a problem on the product was generated, and x if the void that might cause a problem on the product was generated. The results are shown in Table 1.

DESCRIPTION OF SYMBOLS 10 Vehicle-mounted electronic control unit 12 Board | substrate 14 Sealing resin 16 Electronic component 18 Connection terminal 22 1st metal mold | die 24 2nd metal mold | die 26,220,240 Crevice 28,38 Cavity 30 Slit burr measuring metal mold 32 Upper mold 34 Lower Mold 36 Slit 40 Resin inlet 120 Through hole

Claims (9)

A second mold having a first mold and a cavity which forms a cavity together with the first mold and is provided in a region forming the cavity so as to be separated from a contact portion with the first mold. And a step of preparing
Arranging a substrate provided with a connection terminal on one side in the cavity so as to fit the connection terminal in the recess;
Injecting a sealing resin composition into the cavity;
With
When the torque value of the sealing resin composition was measured over time under the conditions of a rotation speed of 30 rpm and a measurement temperature of 175 ° C. using a lab plast mill, the minimum torque value was 0.5 N · m to 2.5 N · m or less,
When the sealing resin composition was molded at a mold temperature of 175 ° C., an injection pressure of 6.9 MPa, and a curing time of 120 seconds using a slit burr measuring mold having a slit with a thickness of 20 μm and a width of 5 mm, The manufacturing method of the vehicle-mounted electronic control unit whose length of the said resin composition for sealing filled in a slit is 2 mm or less. In the manufacturing method of the vehicle-mounted electronic control unit of Claim 1,
The sealing resin composition is a method for producing an on-vehicle electronic control unit having a gel time of 20 seconds to 45 seconds. In the manufacturing method of the vehicle-mounted electronic control unit of Claim 1 or 2,
The sealing resin composition has a time of 20 seconds or more from the start of measurement to 0.1 N · m when the curing torque is measured over time at a mold temperature of 175 ° C. using a curast meter. A method for manufacturing an on-vehicle electronic control unit that is 40 seconds or less. In the manufacturing method of the vehicle-mounted electronic control unit as described in any one of Claims 1-3,
The sealing resin composition is a method for manufacturing an on-vehicle electronic control unit including an inorganic filler. In the manufacturing method of the vehicle-mounted electronic control unit of Claim 4,
The manufacturing method of the vehicle-mounted electronic control unit whose content of the said inorganic filler is 60 to 90 weight% with respect to the said whole resin composition for sealing. In the manufacturing method of the vehicle-mounted electronic control unit of Claim 4 or 5,
The said inorganic filler is a manufacturing method of the vehicle-mounted electronic control unit containing crushing silica. In the manufacturing method of the vehicle-mounted electronic control unit as described in any one of Claims 1-6,
The sealing resin composition is a method for manufacturing an in-vehicle electronic control unit including an epoxy resin. In the manufacturing method of the vehicle-mounted electronic control unit of Claim 7,
The said epoxy resin is a manufacturing method of the vehicle-mounted electronic control unit containing 1 type, or 2 or more types selected from a novolak-type epoxy resin, a biphenyl type epoxy resin, and a phenol aralkyl type epoxy resin. A sealing resin composition used in the method for producing an on-vehicle electronic control unit according to any one of claims 1 to 8,
Epoxy resin,
An inorganic filler;
Including
When the torque value of the sealing resin composition was measured over time under the conditions of a rotation speed of 30 rpm and a measurement temperature of 175 ° C. using a lab plast mill, the minimum torque value was 0.5 N · m to 2.5 N · m or less,
When the sealing resin composition was molded at a mold temperature of 175 ° C., an injection pressure of 6.9 MPa, and a curing time of 120 seconds using a slit burr measuring mold having a slit with a thickness of 20 μm and a width of 5 mm, The sealing resin composition in which the length of the sealing resin composition filled in the slit is 2 mm or less.

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