JP6533438B2 - Liquid jet head and liquid jet apparatus - Google Patents

Description

  The present invention relates to a liquid jet head and a liquid jet apparatus.

  Conventionally, an ink jet printer (liquid ejecting apparatus) including an ink jet head (liquid ejecting head) as an apparatus for ejecting droplets of ink onto a recording medium such as recording paper and recording an image or characters on the recording medium There is. The ink jet head includes an actuator plate in which discharge channels and dummy channels are alternately arranged in parallel, and a nozzle plate having a nozzle hole which is disposed on one end side of the actuator plate in the channel extending direction and separately communicates with the discharge channels. have. Further, among the channels, a common electrode to be the reference potential GND is formed on the inner surface of the ejection channel, and an individual electrode to be the drive potential Vdd is formed on the inner surface of the dummy channel.

For example, Patent Document 1 below discloses a configuration in which a manifold is disposed across the other end surface and the back surface in the channel extending direction of the actuator plate. The manifold is formed with an ink supply passage communicating with the discharge channel.
Further, in Patent Document 1 below, the individual wiring is connected to an individual pad formed on the back surface of the actuator plate through one end face in the channel extension direction of the actuator plate. On the other hand, the common wiring is connected to the common pad formed on the back surface of the actuator plate through the other end surface in the channel extending direction of the actuator plate. Each pad is formed on the back surface of the actuator plate on one end side (position not to interfere with the manifold) in the channel extending direction than the above-described manifold. An external wiring such as a flexible printed board electrically connecting between the control means and each pad is crimped to each pad.

JP 7-137245 A

  However, in the configuration of Patent Document 1, there is a problem that the wiring pattern becomes complicated because the individual wiring and the common wiring are routed to both pads on the back surface through both end surfaces in the channel extending direction in the actuator plate. The

Further, in the configuration of Patent Document 1, the external wiring is connected to each pad as described above. In this case, the external wiring is drawn from each pad to the other end side (the side opposite to the nozzle plate side) in the channel extending direction, and is connected to the control means.
However, in the configuration of Patent Document 1, since the manifold is disposed on the other end side in the channel extending direction than each pad, the external wiring is set on the other end side in the channel extending direction while avoiding interference with the manifold. I need to go around. As a result, there has been a problem that the work of crimping external wiring to each pad and the work of routing external wiring to control means become complicated.

  The present invention has been made in consideration of such circumstances, and an object thereof is to simplify various wiring and improve the freedom of layout, and to facilitate connection work of external wiring. A liquid jet head and a liquid jet apparatus are provided.

The present invention provides the following means in order to solve the above problems.
The liquid jet head according to the present invention is filled on the surface of the actuator plate with a liquid extending along the first direction and being juxtaposed spaced apart in the second direction intersecting the first direction. And an injection channel on the surface of the actuator plate, the actuator plate being alternately juxtaposed with the injection channel in the second direction, and the actuator plate in a third direction orthogonal to the first direction and the second direction. The dummy channel not filled with the penetrating liquid, the individual electrode formed on the inner side surface of the dummy channel, the common electrode formed on the inner side surface of the injection channel, and the actuator plate of the actuator plate It is formed on the surface of the tail located between the dummy channels adjacent in the second direction on one end side of the first direction, A common wire connected to an electrode, a lead wire for drawing out the common wire on the back surface side of the tail portion of the actuator plate, and a back surface of the tail portion of the actuator plate are formed in the second direction across the injection channel And an individual pad for connecting the individual electrodes facing each other separately.

  According to this configuration, it is possible to secure an area of a region where individual pads, lead interconnections and the like can be formed, as compared to the case where individual pads and the like are formed on the surface side of the actuator plate where each channel is opened. As a result, the degree of freedom in layout of pads and the like can be improved, and simplification of the wiring pattern can be achieved. In this case, the length of the tail in the first direction can be increased by, for example, drawing a pad or the like from the back surface of the tail to a position overlapping the discharge channel in the third direction It can be shortened. Therefore, the tip length (length in the first direction) of the liquid jet head can be shortened, and the liquid jet head can be miniaturized.

In particular, since each electrode is routed to the back surface through the tail portion of each actuator plate, the wiring pattern is further simplified as compared to the configuration in which each electrode is routed through both end faces in the channel extending direction in the actuator plate as in the prior art. be able to.
In addition, since each electrode is led to the back surface through the tail portion of the actuator plate, it is possible to easily press-fit the external wiring such as the flexible printed circuit with the pad or the like. In addition, interference with peripheral members when drawing the external wiring from the pad to the other end side in the first direction can be avoided. Therefore, it is possible to facilitate the connection work of the external wiring, such as the pressure bonding work of the external wiring to the pad or the like, the routing work of the external wiring to the control means, and the like.

In the liquid jet head according to the present invention, in the back surface of the actuator plate, a connection groove recessed toward the front surface side may be formed in a portion where the individual pad is formed.
According to this configuration, for example, after various wirings are formed by electroless plating, when the plating film formed on the back surface of the actuator plate is removed by grinding or the like, the plating film remaining in the connection groove is used as an individual pad can do. In this way, individual pads can be formed at one time when forming various wirings. Therefore, since it is not necessary to separately perform an electrode forming step for forming an individual pad on the back surface of the actuator plate, the manufacturing efficiency can be improved.

In the liquid jet head according to the present invention, a common pad may be formed on the back surface of the actuator plate, the common pad being connected to the lead wire and extending toward the other end side in the first direction.
According to this configuration, it is possible to shorten the length of the tail in the first direction by drawing the common pad toward the other end side in the first direction. Therefore, the tip length (length in the first direction) of the liquid jet head can be shortened, and the liquid jet head can be miniaturized.

In the liquid jet head according to the present invention, the lead-out wiring may be formed on the inner surface of a through hole formed in the tail portion of the actuator plate.
According to this configuration, by forming the lead-out electrode on the inner surface of the through hole of the actuator plate, the common electrode can be easily routed to the back surface of the actuator plate.

In the liquid jet head according to the present invention, a cover plate which covers the ejection channel and the dummy channel in the third direction is disposed on the surface side of the actuator plate, and the cover plate is provided in the ejection channel. A separate liquid introduction passage may be formed.
According to this configuration, the cover plate, the pad and the like are disposed on different surfaces of the actuator plate. Therefore, compared with the structure which arrange | positions a cover plate, a pad, etc. on the same surface (for example, surface) of an actuator plate, for example, the area of the area | region which can form a pad etc. is securable. Further, when the external wiring is drawn from the pad or the like to the other end side in the first direction, interference with the cover plate can be avoided, so that the connection work of the external wiring can be facilitated.

In the liquid jet head according to the present invention, the actuator plate includes a first actuator plate and a second actuator plate which are disposed such that the surfaces thereof face each other in the third direction, and the cover plate is the first A first cover plate disposed on the surface side of the actuator plate, and a second cover plate disposed on the surface side of the second actuator plate, the first cover plate and the second cover A flow path plate is disposed between the plate and the flow path plate, and an inlet flow path communicating with the liquid introduction path of the first cover plate and the second cover plate is formed in the flow path plate. Good.
According to this configuration, since the back surface of each actuator plate can be exposed to the outside in the third direction, it is possible to easily connect the external wiring and each pad or the like in the two-row type liquid jet head.

In the liquid jet head according to the present invention, the jet channel is opened at the other end surface of the first actuator plate and the second actuator plate in the first direction, and the jet channel is formed at the first actuator plate and the second actuator plate. At the other end side of the first direction, an injection plate having injection holes respectively communicating with the injection channel is disposed, and the first actuator plate, the second actuator plate, and the injection plate in the first direction And a spacer plate having a circulation channel communicating the injection channel and the injection holes separately, and an outlet channel communicating with the circulation channel is formed in the channel plate. It may be done.
According to this configuration, since the liquid can be circulated between each discharge channel and the liquid tank, the stagnation of air bubbles in the vicinity of the injection hole in the discharge channel can be suppressed.

A liquid ejecting apparatus according to the present invention includes the liquid ejecting head according to the present invention, and a moving mechanism for relatively moving the liquid ejecting head and the recording medium.
According to this configuration, since the liquid jet head according to the present invention is provided, it is possible to provide an inexpensive and highly reliable liquid jet apparatus.

  According to the present invention, simplification of various wirings and improvement of the degree of freedom can be achieved, and the connection work of external wirings can be facilitated.

It is a schematic block diagram of an ink jet printer. It is a perspective view of an ink jet head. It is a sectional view of an ink jet head. It is a sectional view of an ink jet head. It is the disassembled perspective view which looked at the head chip which concerns on 1st Embodiment from the inside of the Y direction. It is the perspective view which looked at the actuator plate shown in FIG. 5 from the back surface side. It is process drawing (plan view) for demonstrating a mask formation process. It is process drawing (VIII-VII cross section of FIG. 7) for demonstrating a mask formation process. It is process drawing (plan view) for demonstrating a dicing line formation process. It is a process figure (XX cross section of FIG. 9) for demonstrating a dicing line formation process. It is process drawing (XI-XI cross section of FIG. 9) for demonstrating a dicing line formation process. It is process drawing (plan view) for demonstrating a through-hole formation process. It is process drawing (XIII-XIII cross section of FIG. 12) for demonstrating a through-hole formation process. It is process drawing (plan view) for demonstrating a 1st electrode formation process. It is process drawing (XV-XV cross section of FIG. 14) for demonstrating a 1st electrode formation process. It is process drawing (the XVI-XVI cross section of FIG. 14) for demonstrating a 1st electrode formation process. It is a process figure (plan view) for demonstrating a cover wafer preparation process. It is a flowchart (XVIII-XVIII cross section of FIG. 17) for demonstrating a cover wafer preparation process. It is process drawing (plan view) for demonstrating a bonding process. It is process drawing (XX-XX cross section of FIG. 19) for demonstrating a grinding process. It is process drawing (an XXI-XXI cross section of FIG. 19) for demonstrating a grinding process. It is process drawing (bottom view) for demonstrating a 2nd electrode formation process. It is process drawing (bottom view) for demonstrating a singulation process. It is an exploded perspective view of a head chip concerning a modification of a 1st embodiment. It is the perspective view which looked at the actuator plate shown in FIG. 24 from the back surface side. It is an exploded perspective view of a head chip concerning a 2nd embodiment. It is the perspective view which looked at the actuator plate shown in FIG. 26 from the back surface side. It is process drawing for demonstrating a 3rd dicing line formation process and an electrode formation process. It is process drawing for demonstrating a grinding process. It is process drawing for demonstrating a grinding process.

  Hereinafter, embodiments according to the present invention will be described with reference to the drawings. In the following embodiments, an ink jet printer (hereinafter, simply referred to as a printer) which performs recording on a recording medium using ink (liquid) is taken as an example of a liquid ejecting apparatus including the liquid ejecting head of the present invention. Explain. In the drawings used for the following description, the scale of each member is appropriately changed in order to make each member have a recognizable size.

[Printer]
FIG. 1 is a schematic block diagram of the printer 1.
As shown in FIG. 1, the printer 1 according to this embodiment includes a pair of transport means 2 and 3 for transporting a recording medium P such as paper, an ink tank 4 containing ink, and a liquid for recording medium P. An ink jet head (liquid jet head) 5 for discharging ink drops, ink circulation means 6 for circulating the ink between the ink tank 4 and the ink jet head 5, and the ink jet head 5 in the conveyance direction of the recording medium P A scanning unit (moving mechanism) 7 is provided which scans in a direction (hereinafter referred to as the Y direction) to be orthogonal to the X direction). In the drawings, the Z direction indicates the height direction orthogonal to the X direction and the Y direction.

  The conveying means 2 includes a grid roller 11 extending in the Y direction, a pinch roller 12 extending parallel to the grid roller 11, and a drive mechanism (not shown) such as a motor for axially rotating the grid roller 11; Is equipped. Similarly, the conveying means 3 includes a grid roller 13 extending in the Y direction, a pinch roller 14 extending parallel to the grid roller 13, and a drive mechanism (not shown) for axially rotating the grid roller 13. Is equipped.

  The ink tanks 4 are, for example, provided with ink tanks 4Y, 4M, 4C, 4B of four color inks of yellow, magenta, cyan, and black arranged in the X direction.

FIG. 2 is a schematic configuration diagram of the ink jet head 5 and the ink circulation means 6.
As shown in FIGS. 1 and 2, the ink circulation unit 6 includes a circulation channel 23, a pressure pump 24, and a suction pump 25.
The circulation flow path 23 has an ink supply pipe 21 for supplying the ink to the ink jet head 5 and an ink discharge pipe 22 for discharging the ink from the ink jet head 5. The ink supply pipe 21 and the ink discharge pipe 22 are configured by a flexible hose or the like having flexibility that can correspond to the operation of the scanning unit 7 that supports the inkjet head 5.

The pressure pump 24 is connected to the ink supply pipe 21. The pressure pump 24 pressurizes the inside of the ink supply pipe 21, and sends out the ink to the inkjet head 5 through the ink supply pipe 21. Thus, the ink supply pipe 21 side has a positive pressure with respect to the ink jet head 5.
The suction pump 25 is connected to the ink discharge pipe 22. The suction pump 25 decompresses the inside of the ink discharge pipe 22 and sucks the ink from the ink jet head 5. Thereby, the ink discharge pipe 22 side has a negative pressure with respect to the ink jet head 5. The ink can be circulated between the ink jet head 5 and the ink tank 4 through the circulation flow path 23 by driving the pressure pump 24 and the suction pump 25.

  As shown in FIG. 1, the scanning means 7 comprises a pair of guide rails 31 and 32 extending in the Y direction, a carriage 33 supported movably on the pair of guide rails 31 and 32, and a carriage 33 And a drive mechanism 34 for moving in a direction. The drive mechanism 34 rotates a pair of pulleys 35 and 36 disposed between the pair of guide rails 31 and 32, an endless belt 37 wound between the pair of pulleys 35 and 36, and one pulley 35. And a drive motor 38 for driving.

  The pair of pulleys 35 and 36 is disposed between both ends of the pair of guide rails 31 and 32, respectively. The endless belt 37 is disposed between the pair of guide rails 31 and 32. The carriage 33 is connected to the endless belt 37. On the carriage 33, ink jet heads 5Y, 5M, 5C, and 5B of four colors of yellow, magenta, cyan, and black are mounted as a plurality of ink jet heads 5 in the Y direction. The transport means 2 and 3 and the scanning means 7 constitute a moving mechanism for relatively moving the inkjet head 5 and the recording medium P.

<Inkjet head>
Next, the above-described inkjet head 5 will be described in detail. The inkjet heads 5Y, 5M, 5C, and 5B have the same configuration except for the color of the supplied ink, and therefore, the inkjet head 5 will be collectively described in the following description.
FIG. 3 is a cross-sectional view of the inkjet head 5. FIG. 4 is a cross-sectional view of the inkjet head 5.
As shown in FIGS. 3 and 4, each ink jet head 5 discharges ink from the tip of the discharge channel 54, which will be described later, in the channel extending direction. It is a circulation type (longitudinal circulation type) inkjet head 5 to be circulated. Further, the inkjet head 5 of the present embodiment is a two-row type inkjet head 5 in which a plurality of nozzle holes (jet holes) 83 and 84 are formed in two rows.

The inkjet head 5 mainly includes a first head chip 40A and a second head chip 40B, a flow path plate 41, an inlet manifold 42, a spacer plate 43, and a nozzle plate (jet plate) 44. In the following description, in the Z direction, the side of the nozzle plate 44 is referred to as the lower side, and the side opposite to the nozzle plate 44 may be referred to as the upper side. In the following description, in the Y direction, the direction toward the center of the ink jet head 5 may be referred to as the inside, and the direction away from the center of the ink jet head 5 may be referred to as the outside.
In the following description, among the head chips 40A and 40B, the first head chip 40A will be mainly described, and the configuration similar to that of the first head chip 40A in the second head chip 40B is the first head chip 40A and The same reference numerals may be given and the description may be omitted.

FIG. 5 is an exploded perspective view of the head chips 40A and 40B as viewed from the inside in the Y direction.
As shown in FIGS. 3 to 5, the first head chip 40 </ b> A includes a first actuator plate 51 and a first cover plate 52.
The first actuator plate 51 is a laminated substrate in which two piezoelectric substrates having different polarization directions in the thickness direction (Y direction) are laminated (so-called chevron substrate). As the piezoelectric substrate, for example, a ceramic substrate made of PZT (lead zirconate titanate) or the like is suitably used.

  A plurality of channels 54 and 55 opening at least on the surface are formed on the surface (surface located inside in the Y direction) side of the first actuator plate 51. The channels 54 and 55 are formed linearly in the Z direction (first direction), and alternately formed at intervals in the X direction (second direction). Therefore, the channels 54 and 55 are respectively defined by the drive wall 56 (see FIG. 5) formed of the first actuator plate 51. Specifically, the plurality of channels 54 and 55 have a discharge channel (injection channel) 54 filled with ink and a dummy channel 55 not filled with ink.

As shown in FIGS. 3 and 5, the upper end of the discharge channel 54 terminates in the first actuator plate 51, and the lower end opens at the lower end surface of the first actuator plate 51. As shown in FIG. 3, the discharge channel 54 is located at the lower end portion and has an extending portion 54a having a uniform groove depth, and continues upward from the extending portion 54a, and the groove depth increases toward the upper side And a rounded up portion 54b which becomes shallow.
As shown in FIGS. 4 and 5, the dummy channel 55 is formed such that the groove depth in the Y direction is uniform throughout the Z direction. The dummy channel 55 penetrates the first actuator plate 51 in the Z direction, and both ends in the Z direction are open at both end surfaces in the Z direction of the first actuator plate 51. The dummy channel 55 passes through the first actuator plate 51 in the Y direction (third direction).

As shown in FIGS. 3 and 5, a common electrode 61 is formed on the inner surface of the ejection channel 54. The common electrode 61 is formed on the entire inner surface of the ejection channel 54.
A common wire 62 is formed on the surface of a portion (hereinafter simply referred to as a tail portion) of the actuator plate 51 located above the discharge channel 54. The common wiring 62 is formed in a strip extending in the Z direction. The lower end of the common wire 62 is connected to the common electrode 61, and the upper end is terminated on the tail.

  As shown in FIGS. 4 and 5, individual electrodes 63 are formed on the surface (the inner surface of the dummy channel 55) of the drive wall 56 of the actuator plate 51 that defines each dummy channel 55. The individual electrodes 63 are separately formed on the inner side surfaces of the dummy channel 55 opposed in the X direction. Therefore, among the individual electrodes 63, the individual electrodes 63 facing each other in the same dummy channel 55 are electrically separated. Further, the individual electrodes 63 are formed over the entire inner side surface (the whole in the Y direction and the Z direction) of the dummy channel 55.

  As shown in FIGS. 3 and 4, a heat transfer member 66 is disposed below the back surface (the surface located outside in the Y direction) of the first actuator plate 51. The heat transfer member 66 is formed of a material having a thermal conductivity superior to that of the first actuator plate 51. The heat transfer member 66 is extended along the X direction. The heat transfer member 66 has a function of radiating the heat of the actuator plate 51 to the outside and alleviating temperature variations in the actuator plate 51.

  As shown in FIGS. 3 to 5, the cover plate 52 is formed in a plate shape having an outer shape equivalent to that of the first actuator plate 51 when viewed from the Y direction. The back surface of the first cover plate 52 is fixed on the surface of the first actuator plate 51 by bonding or the like.

The first cover plate 52 includes a common ink chamber 71 formed on the front surface side, and a plurality of slits (liquid introduction paths) 72 formed on the back surface side to separately communicate the common ink chamber 71 and the discharge channels 54. ,have.
The common ink chamber 71 is a groove located at the upper end portion of the first cover plate 52 and recessed toward the back surface, and is extended in the X direction. Ink flows into the common ink chamber 71 through the above-described flow path plate 41.

  The slit 72 is formed in the common ink chamber 71 at a position overlapping the cut-out portion 54 b of the ejection channel 54 in the Y direction. The slit 72 penetrates the first cover plate 52 in the Y direction. That is, while the common ink chamber 71 mentioned above communicates separately in each discharge channel 54 through the slit 72, it does not communicate with the dummy channel 55. The slits 72 are formed to have the same width in the X direction as the discharge channel 54.

  Similar to the first head chip 40A described above, the second head chip 40B is configured by stacking the second actuator plate 74 and the second cover plate 75 in the Y direction. The head chips 40A and 40B are arranged at intervals in the Y direction with the cover plates 52 and 75 (surface sides of the actuator plates 51 and 74) facing in the Y direction.

  As shown in FIGS. 3 and 4, the ejection channels 54 and the dummy channels 55 of the second head chip 40B are arranged at a half pitch offset with respect to the arrangement pitch of the ejection channels 54 and the dummy channels 55 of the first head chip 40A. ing. That is, the ejection channels 54 and the dummy channels 55 of the head chips 40A and 40B are arranged in a staggered manner. In this case, the discharge channel 54 of the first head chip 40A and the dummy channel 55 of the second head chip 40B face each other in the Y direction, and the discharge of the dummy channel 55 of the first head chip 40A and the second head chip 40B The channel 54 faces in the Y direction.

  The flow path plate 41 is sandwiched between the first head chip 40A and the second head chip 40B. The flow path plate 41 is formed in a plate shape having an outer shape equivalent to that of the actuator plates 51 and 74 when viewed in the Y direction. In the flow path plate 41, the surface of the first cover plate 52 is bonded to the first main surface in the Y direction, and the surface of the second cover plate 75 is bonded to the second main surface.

  In the main surfaces of the flow path plate 41, inlet flow paths 77 communicating with the above-described common ink chamber 71 are formed. Each inlet channel 77 is recessed inward in the Y direction from each main surface of the channel plate 41. Lower ends of the inlet channels 77 communicate with the common ink chamber 71 described above, and upper ends of the inlet channels 77 open at the upper end surface of the channel plate 41. The inlet channel 77 has a width in the X direction equal to that of the common ink chamber 71. However, the width of the inlet channel 77 may be smaller or larger than that of the common ink chamber 71.

  An outlet channel 78 is formed on the lower end surface of the channel plate 41. The outlet channel 78 is recessed upward from the lower end surface of the channel plate 41. The outlet channel 78 penetrates the channel plate 41 in the Y direction. Further, the outlet channel 78 is wider in the X direction than the inlet channel 77 described above. The outlet channel 78 is connected to an outlet manifold (not shown) at a portion located outside the inlet channel 77 in the X direction. The outlet manifold is connected to the ink discharge pipe 22 described above.

  The inlet manifold 42 is collectively joined to the upper end surfaces of the head chips 40A and 40B and the flow path plate 41. The inlet manifold 42 is formed with a supply passage 80 communicating with the above-described inlet flow passages 77. The supply passage 80 is recessed upward from the lower end surface of the inlet manifold 42. The supply passage 80 collectively communicates with each inlet passage 77.

  The spacer plate 43 is collectively joined to the lower end surfaces of the head chips 40A and 40B and the flow path plate 41. A plurality of circulation channels (a first circulation channel 81 and a second circulation channel 82) connecting between the discharge channel 54 of each head chip 40A, 40B and the outlet channel 78 are formed in the spacer plate 43. There is.

As shown in FIG. 3, the first circulation flow path 81 is formed at the same position in the X direction as the discharge channel 54 of the first head chip 40A, and is formed at the same arrangement pitch as the discharge channel 54. . Specifically, the first circulation passage 81 penetrates the spacer plate 43 in the Z direction. In the first circulation flow passage 81, the inner end in the Y direction is located inward of the surface of the first cover plate 52 in the Y direction. In the first circulation flow passage 81, the outer end in the Y direction separately communicates with the discharge channel 54 of the first head chip 40A, and the inner end in the Y direction communicates with the outlet flow passage 78.
The second circulation passage 82 is formed at the same position in the X direction as the ejection channel 54 of the second head chip 40B. In the second circulation flow channel 82, the outer end in the Y direction communicates with each discharge channel 54 of the second head chip 40B, and the inner end in the Y direction communicates with the inside of the outlet flow channel 78.

  The nozzle plate 44 is joined to the lower end surface of the spacer plate 43. In the nozzle plate 44, a plurality of nozzle holes (first nozzle holes 83 and second nozzle holes 84) penetrating the nozzle plate 44 in the Z direction are arranged.

  The first nozzle holes 83 are respectively formed in a portion of the nozzle plate 44 facing the first circulation channel 81 of the spacer plate 43 in the Z direction. That is, the first nozzle holes 83 are arranged on a straight line at the same pitch as the first circulation flow path 81 at intervals in the X direction. Specifically, the first nozzle hole 83 communicates with the inside of the first circulation channel 81 at the central portion of the first circulation channel 81 in the Y direction. Thus, each first nozzle hole 83 is in communication with the corresponding discharge channel 54 of the first head chip 40A via the first circulation channel 81.

  The second nozzle holes 84 are respectively formed in a portion of the nozzle plate 44 facing the second circulation channel 82 of the spacer plate 43 in the Z direction. That is, the second nozzle holes 84 are arranged on a straight line at the same pitch as the second circulation flow path 82 at intervals in the X direction. Specifically, the second nozzle hole 84 communicates with the inside of the second circulation flow channel 82 at the central portion in the Y direction of the second circulation flow channel 82. Thus, each second nozzle hole 84 is in communication with the corresponding discharge channel 54 of the second head chip 40B via the second circulation flow path 82. Therefore, each dummy channel 55 does not communicate with the nozzle holes 83 and 84 and is covered by the nozzle plate 44 from below.

  Here, as shown in FIGS. 3 to 5, of the tails of the actuator plates 51 and 74 described above, the actuator plates 51 and 74 are penetrated in the Y direction at positions overlapping the common wiring 62 in the Y direction. A hole 91 is formed. On the inner surface of the through hole 91, a lead wiring 92 for drawing the common wiring 62 to the back surface of each of the actuator plates 51 and 74 is formed. The inner end portion of the lead-out wiring 92 in the Y direction is connected to the common wiring 62 at the opening edge of the through hole 91.

FIG. 6 is a perspective view of the actuator plates 51 and 74 as viewed from the back side.
As shown in FIG. 6, a common pad 93 is formed on the back surface of the actuator plates 51 and 74. The common pad 93 extends in the Z direction on the back surfaces of the actuator plates 51 and 74. The common pad 93 has its upper end connected to the lead wire 92 at the opening edge of the through hole 91 described above, and the lower end terminates in the actuator plates 51 and 74. The common pad 93 may extend to a position where the lower end portion overlaps with the upper end portion of the ejection channel 54 when viewed in the Y direction.

  In addition, individual pads 94 are formed on portions of the back surface of the tail portion of the actuator plates 51 and 74 that are located above the common pad 93. The individual pads 94 are formed in a strip extending in the X direction. The individual pads 94 connect the individual electrodes 63 facing each other in the X direction with the discharge channel 54 interposed therebetween. Specifically, one end portion in the X direction of the individual pad 94 is connected to the individual electrode 63 formed on the other end side in the X direction in the dummy channel 55 located on the one end side in the X direction with respect to the ejection channel 54 It is done. On the other hand, the other end of the individual pad 94 in the X direction is formed on an individual electrode 63 formed on one end side in the X direction in the dummy channel 55 positioned on the other end side in the X direction with respect to the ejection channel 54 ing.

As described above, in the present embodiment, the common electrode 61 and the individual electrodes 63 are drawn to the back surface at the tail portion of the actuator plates 51 and 74.
Note that flexible printed circuit boards 96 and 97 (hereinafter simply referred to as FPCs 96 and 97) for connecting control means (not shown) and the pads 93 and 94 are mounted on the back surface of the tail portion described above. As a result, the drive voltage is applied to the electrodes 61 and 63 from the control unit through the FPCs 96 and 97.

[How the printer works]
Next, the case where characters, figures, etc. are recorded on the recording medium P using the printer 1 configured as described above will be described below.
In the initial state, it is assumed that inks of different colors are sufficiently enclosed in the four ink tanks 4 shown in FIG. Further, the ink in the ink tank 4 is filled in the ink jet head 5 through the ink circulation unit 6.

When the printer 1 is operated in such an initial state, the grid rollers 11 and 13 of the transport means 2 and 3 rotate, and the recording medium is interposed between the grid rollers 11 and 13 and the pinch rollers 12 and 14. Transport P toward the transport direction (X direction). At the same time, the drive motor 38 rotates the pulleys 35 and 36 to move the endless belt 37. Thus, the carriage 33 reciprocates in the Y direction while being guided by the guide rails 31 and 32.
In the meantime, by appropriately discharging the four color inks from the ink jet heads 5 to the recording medium P, it is possible to record characters, images and the like.

Here, the movement of each inkjet head 5 will be described in detail below.
Of the edge chute type as in the present embodiment, in the circulation type ink jet head 5, the pressure pump 24 and the suction pump 25 shown in FIG. 2 are operated to circulate the ink in the circulation flow path 23. In this case, the ink flowing through the ink supply pipe 21 flows into the inlet channels 77 of the channel plate 41 through the supply channel 80 of the inlet manifold 42. The ink having flowed into each inlet channel 77 passes through each common ink chamber 71, and is then supplied into each ejection channel 54 through the slit 72. The ink that has flowed into each discharge channel 54 collects in the outlet channel 78 through the circulation channel 81 of the spacer plate 43 and then is discharged to the ink discharge pipe 22 through the outlet manifold (not shown). The ink discharged to the ink discharge pipe 22 is returned to the ink tank 4 and then supplied to the ink supply pipe 21 again. Thus, the ink is circulated between the inkjet head 5 and the ink tank 4.

  Then, when the reciprocating movement is started by the carriage 33 (see FIG. 1), the control means applies a drive voltage to the electrodes 61 and 63 through the FPCs 96 and 97. Then, thickness slip deformation occurs in the two drive walls 56 that define the discharge channel 54, and these two drive walls 56 deform so as to project toward the dummy channel 55 side. That is, in the actuator plates 51 and 74 of the present embodiment, since two piezoelectric substrates polarized in the thickness direction (Y direction) are stacked, Y in the driving wall 56 is applied by applying a driving voltage. It bends and deforms in a V shape centering on the middle position in the direction. As a result, the discharge channel 54 deforms as if to swell.

The deformation of the two drive walls 56 causes the ink in the common ink chamber 71 to be guided into the discharge channel 54 through the slit 72 when the volume of the discharge channel 54 is increased. Then, the ink induced to the inside of the discharge channel 54 is propagated as a pressure wave as a pressure wave to the inside of the discharge channel 54, and at a timing when this pressure wave reaches the nozzle holes 83 and 84, between the electrodes 61 and 63. Make the applied drive voltage zero.
As a result, the drive wall 56 is restored, and the volume of the discharge channel 54 once increased returns to the original volume. By this operation, the pressure inside the discharge channel 54 is increased, and the ink is pressurized. As a result, the ink can be discharged from the nozzle holes 83 and 84. At this time, when the ink passes through the nozzle holes 83 and 84, it is discharged as ink droplets in the form of droplets. Thus, as described above, characters, images, and the like can be recorded on the recording medium P.

  The operation method of the inkjet head 5 is not limited to the contents described above. For example, the drive wall 56 in the normal state may be deformed to the inside of the discharge channel 54, and the discharge channel 54 may be configured to be recessed as it is. In this case, the voltage applied between the electrodes 61 and 63 can be realized by changing the polarity of the actuator plates 51 and 74 without changing the polarity of the voltage or changing the polarity of the voltage. It is. In addition, after the discharge channel 54 is deformed so as to expand outward, the discharge channel 54 may be deformed so as to be recessed inward, and the pressure force of the ink at the time of discharge may be increased.

[Method of manufacturing head chip]
Next, a method of manufacturing the above-described head chips 40A and 40B will be described. Each of the head chips 40A and 40B can be manufactured by the same method. Therefore, in the following description, a method of manufacturing the first head chip 40A will be described. Further, in the following description, the wafer bonded body 103 is formed by bonding the actuator wafer 101 in which the plurality of first actuator plates 51 are connected in the Z direction and the cover wafer 102 in which the plurality of first cover plates 52 are connected in the Z direction. A method of manufacturing the plurality of first head chips 40A collectively by forming and cutting the wafer bonded body 103 will be described.

  The method of manufacturing the first head chip 40A of the present embodiment mainly includes an actuator wafer manufacturing step, a cover wafer manufacturing step, and an assembly step. Among them, the actuator wafer manufacturing process and the cover wafer manufacturing process can be performed in parallel.

<Actuator wafer manufacturing process>
7 and 8 are process diagrams for explaining the mask formation process.
As shown in FIGS. 7 and 8, in the actuator wafer manufacturing process, first, a mask 105 to be used later in the first electrode forming process is formed on the surface of the actuator wafer 101 (mask forming process). Specifically, first, for example, a mask material such as a photosensitive dry film is attached to the surface of the actuator wafer 101. Thereafter, the mask material is patterned using a photolithography technique to remove the mask material of the portion of the mask material located in the formation region of the common wiring 62 described above. Thus, the mask 105 having the opening 105 a in a portion located in the formation region of the common wiring 62 is formed.

9 to 11 are process diagrams for explaining a dicing line forming process. In FIG. 9 and the subsequent figures, the mask 105 (the opening 105 a) described above is indicated by a chain line.
Subsequently, as shown in FIGS. 9 and 10, the first dicing line 110 to be the discharge channel 54 later is formed by cutting using a dicer (not shown) or the like (first dicing line forming step). Specifically, the dicer is caused to approach the actuator wafer 101 from the front side, and the dicer is caused to travel in the Z direction. Thus, the actuator wafer 101 is cut together with the mask 105. Thereafter, the dicer is caused to travel a predetermined amount, and then the dicer is retracted from the actuator wafer 101. Thereby, the first dicing line 110 is formed.

  At this time, in a side view as viewed from the X direction, both end portions of the first dicing line 110 in the Z direction are portions corresponding to the above-described raised portions 54b and have an arc shape following the radius of curvature of the dicer. Ru. The length of the first dicing line 110 in the Z direction (traveling distance of the dicer) is set to about two of the discharge channel 54. Then, in the first dicing line forming step, the above-described operation is repeated at intervals in the Z direction and the X direction with respect to the actuator wafer 101 to form a plurality of first dicing lines 110. That is, in the actuator wafer 101, portions corresponding to the lower end portion of the actuator plate 51 and portions corresponding to the upper end portion are connected in a line.

  Next, as shown in FIGS. 9 and 11, a second dicing line 111 to be a dummy channel 55 later is formed (second dicing line forming step). Specifically, the dicer is made to enter portions of the actuator wafer 101 located on both sides of the first dicing line 110 in the X direction, and the dicer is allowed to travel across the entire Z direction of the actuator wafer 101. Thus, the actuator wafer 101 is cut together with the mask 105. In the present embodiment, the processing depth by the dicer is uniform throughout the Z direction. The second dicing line 111 is formed so that the groove depth in the Y direction is deeper than the first dicing line 110.

12 and 13 are process diagrams for explaining the through hole forming process.
Subsequently, as shown in FIGS. 12 and 13, a through hole 91 which penetrates the actuator wafer 101 in the Y direction is formed (through hole forming step). Specifically, two through holes 91 are formed at intervals in the Z direction at portions of the actuator wafer 101 located between the first dicing lines 110 adjacent in the Z direction. In the through hole forming step, a recess having the same depth as that of the second dicing line 111 may be formed instead of the through hole 91.

14 to 16 are process diagrams for explaining a first electrode forming process.
Next, as shown in FIG. 14 to FIG. 16, electrode materials to be later formed into various wires (common electrode 61, individual electrode 63, common wire 62, lead wire 92) are formed on the actuator wafer 101 (first electrode forming step ). In the first electrode forming step of the present embodiment, the electrodes 61 and 63 and the wires 62 and 92 are formed by electroless plating. In the first electrode forming step, first, a catalyst is applied to a region of the actuator wafer 101 which is not covered by the mask 105. Specifically, it is dipped in an aqueous solution of tin-tin chloride, and a sensitizing operation is performed to cause the actuator wafer 101 to adsorb stannous chloride. Subsequently, the actuator wafer 101 is lightly washed by water washing or the like. Thereafter, the actuator wafer 101 is immersed in a palladium chloride aqueous solution to adsorb palladium chloride on the surface of the actuator wafer 101. Then, a redox reaction occurs between palladium chloride adsorbed on the actuator wafer 101 and stannous chloride adsorbed in the above-described sensitizing process, whereby metallic palladium is deposited as a catalyst (activation processing). Next, the actuator wafer 101 to which the catalyst (metal palladium) is applied is immersed in a plating solution, whereby the plating film 120 is deposited on the portion of the actuator wafer 101 to which the catalyst is applied. The plating film 120 is also formed on the entire back surface of the actuator wafer 101.

  Next, the mask 105 formed on the surface of the actuator wafer 101 is removed by lift-off or the like.

<Cover wafer manufacturing process>
17 and 18 are process diagrams for explaining the cover wafer manufacturing process.
As shown in FIGS. 17 and 18, in the cover wafer manufacturing process, sandblasting or the like is first performed on the cover wafer 102 from the front surface side through a mask (not shown) to form a common ink chamber 71 (common ink chamber forming process). At this time, the common ink chamber 71 is formed along the X direction in portions of the cover wafer 102 corresponding to both end portions of the above-described first dicing line 110 in the Z direction.

  Subsequently, sandblasting or the like is performed on the cover wafer 102 from the rear surface side through a mask (not shown) to form slits 72 communicating with each other in the common ink chamber 71 (slit forming step). At this time, the slits 72 are separately formed on portions of the cover wafer 102 corresponding to both end portions of the first dicing lines 110 in the Z direction. Each step of the cover wafer forming step is not limited to sandblasting, and may be performed by dicing or the like.

<Assembly process>
FIG. 19 is a process diagram for illustrating a bonding process.
As shown in FIG. 19, in the assembly process, first, the actuator wafer 101 and the cover wafer 102 are stacked to form a wafer bonded body 103 (bonding process). Specifically, the back surface of the cover wafer 102 and the front surface of the actuator wafer 101 are bonded.

20 and 21 are process diagrams for explaining the grinding process.
Next, as shown in FIGS. 20 and 21, the actuator wafer 101 is viewed from the back side so that the first dicing line 110 does not penetrate the actuator wafer 101 and the second dicing line 111 penetrates the actuator wafer 101. Grind (grinding process).

FIG. 22 is a process diagram for describing a second electrode forming process.
As shown in FIG. 22, the pads 93 and 94 are formed on the back surface of the actuator wafer 101. Specifically, first, on the back surface of the actuator wafer 101, a mask 125 having an opening for forming the pads 93 and 94 is set. Thereafter, an electrode material is deposited on the back surface of the actuator wafer 101 by vapor deposition or the like. Thus, an electrode material to be the pads 93 and 94 is formed on the back surface of the actuator wafer 101 through the opening of the mask 125. In addition, as the mask 125, a metal mask, a photosensitive dry film, etc. can be used, for example. In addition, after the end of the second electrode formation process, the mask is removed from the back surface of the actuator wafer 101.

FIG. 23 is a process diagram for describing a singulation process.
Subsequently, as shown in FIG. 23, the wafer bonded body 103 is cut into pieces for each first head chip 40A (separating step). Specifically, the dicer is caused to travel in the X direction with respect to a portion of the wafer bonded body 103 located at an intermediate position of each first dicing line 110 in the Z direction and between each first dicing line 110. The joined body 103 is cut. At this time, the first dicing line 110 is divided at an intermediate position in the Z direction, and is divided at a portion located between the first dicing lines 110. As a result, a plurality of first head chips 40A are cut out from one wafer bonding body 103.

As described above, in the inkjet head 5 of the present embodiment, the electrodes 61 and 63 are drawn to the back surface side of the actuator plates 51 and 74 in which at least the discharge channel 54 is not opened.
According to this configuration, for example, the area of the area where the pads 93 and 94 can be formed can be secured compared to the case where the pads 93 and 94 are formed on the surface side of the actuator plates 51 and 74 in which the channels 54 and 55 open. . Thus, the degree of freedom in the layout of the pads 93 and 94 can be improved, and the wiring pattern can be simplified. In this case, the length of the tail portion in the Z direction can be shortened by, for example, drawing the lower end portion of the common pad 93 to a position overlapping the discharge channel 54 in the Y direction, or forming the pads 93 and 94 further downward. Therefore, the chip length (length in the Z direction) of the head chips 40A and 40B can be shortened, and the inkjet head 5 can be miniaturized.

In particular, in the present embodiment, the electrodes 61 and 63 are drawn to the back surface through the tail portions of the actuator plates 51 and 74, respectively. Therefore, the wiring pattern can be further simplified as compared with the conventional configuration in which the electrodes are drawn through both end surfaces in the channel extending direction in the actuator plate.
Further, in the present embodiment, since the electrodes 61 and 63 are drawn to the back surface through the tail portions of the actuator plates 51 and 74, the pressure bonding work between the FPCs 96 and 97 and the pads 93 and 94 can be easily performed. In addition, interference with peripheral members when the FPCs 96 and 97 are drawn upward from the pads 93 and 94 can be avoided. Therefore, it is possible to facilitate the connection work of the FPCs 96 and 97 such as the pressure bonding work of the FPCs 96 and 97 to the pads 93 and 94 and the routing work of the FPCs 96 and 97 to control means.

  In the present embodiment, by forming the lead wire 92 on the inner surface of the through hole 91 of the actuator plate 51, 74, the common electrode 61 can be easily routed to the back surface of the actuator plate 51, 74.

In the present embodiment, the head chips 40A and 40B are disposed with the cover plates 52 and 75 facing each other in the Y direction, and the inlet channels 77 communicating with the discharge channels 54 of the head chips 40A and 40B are provided. The flow path plate 41 is disposed between the head chips 40A and 40B.
According to this configuration, since the back surface of each actuator plate 51, 74 can be exposed to the outside in the Y direction, the connection between the FPC 96, 97 and each pad 93, 94 can be simplified in the two-row type inkjet head 5. It can be carried out.

  In the present embodiment, since the cover plates 52 and 75 are stacked on the surface side of the actuator plates 51 and 74, the cover plates 52 and 75 and the pads 93 and 94 are disposed on different surfaces of the actuator plates 51 and 74. It will be done. Therefore, for example, compared with a configuration in which cover plates 52 and 75 and respective pads 93 and 94 are arranged on the same surface (for example, the surface) of actuator plates 51 and 74, the area of the area where pads 93 and 94 can be formed can be secured. . Further, since interference with the cover plates 52 and 75 can be avoided when the FPCs 96 and 97 are drawn upward from the respective pads 93 and 94, the connection work of the FPCs 96 and 97 can be further facilitated.

In the present embodiment, the spacer plate 43 having the circulation channel 81 is disposed between the actuator plates 51 and 74 and the nozzle plate 44.
According to this configuration, since the ink can be circulated between the head chips 40A and 40B and the ink tank 4, stagnation of air bubbles in the vicinity of the nozzle holes 83 and 84 can be suppressed.

  Further, since the printer 1 according to the present embodiment includes the above-described inkjet head 5, the inexpensive and highly reliable printer 1 can be provided.

(Modification)
Next, a modification of the first embodiment will be described. FIG. 24 is an exploded perspective view of a head chip 140 according to a modification of the first embodiment. The present modification is different from the first embodiment described above in that the common pad 163 is located above the individual pad 170. In the following description, the same components as those of the first embodiment described above are denoted by the same reference numerals and the description thereof will be omitted.

  As shown in FIG. 24, in the head chip 140 of this modification, the upper end portion of the common wiring 162 reaches the upper end edge of the actuator plate 151. At the upper end edge of the actuator plate 151, a lead-out recess 150 which penetrates the actuator plate 151 in the Y direction is formed. The lead-in recess 150 is formed in a semicircular shape in a plan view as viewed from the Y direction. The routing recess 150 is open upward. On the inner surface of the lead-in recess 150, a lead wire 160 is formed. The inner end of the lead-out wiring 160 in the Y direction is connected to the common wiring 162 at the opening edge of the lead-in recess 150.

FIG. 25 is a perspective view of the actuator plate 151 as viewed from the back side.
As shown in FIG. 25, a common pad 163 is formed on the back surface of the actuator plate 151. The common pad 163 extends in the Z direction on the back surface of the actuator plate 151. The upper end of the common pad 163 is connected to the lead wire 160 at the opening edge of the above-described lead-in recess 150, and the lower end is terminated in the actuator plate 151.

  An individual pad 170 is formed on a portion of the back surface of the actuator plate 151 located below the common pad 163. The individual pads 170 are formed in a strip extending in the X direction. The individual pads 170 connect the individual electrodes 63 facing each other in the X direction with the discharge channel 54 interposed therebetween. Preferably, the individual pad 170 is formed so as to straddle the tail portion and the discharge channel 54 in the Z direction. Thereby, the chip length can be shortened.

  Also in this configuration, the same function and effect as those of the above-described first embodiment can be obtained.

Second Embodiment
Next, a second embodiment will be described. FIG. 26 is an exploded perspective view of a head chip 240 according to the second embodiment. FIG. 27 is a perspective view of the actuator plate 251 as viewed from the back side. The present embodiment is different from the above-described first embodiment in that the individual pads 220 are formed in the connection grooves 210 formed on the back surface of the actuator plate 251. In the following description, the same components as those of the first embodiment described above are denoted by the same reference numerals and the description thereof will be omitted.

  As shown in FIGS. 26 and 27, in the head chip 240 of the present embodiment, on the back surface of the actuator plate 251, a connection groove 210 recessed toward the inside in the Y direction is formed. The connection groove 210 is formed on the back surface of the actuator plate 251 in a portion located above the through hole 91. The connection groove 210 is opened upward at the upper end surface of the actuator plate 251. The bottom surface (inner end surface in the Y direction) of the connection groove 210 is located outside the bottom surface (outer end surface in the Y direction) of the discharge channel 54 in the Y direction. The connection groove 210 may be formed in a portion of the tail portion of the actuator plate 251 located below the through hole 91.

  An individual pad 220 is formed on the inner surface of the connection groove 210 to connect the individual electrodes 63 facing each other in the X direction with the discharge channel 54 interposed therebetween. The individual pads 220 are formed over the entire inner surface of the connection groove 210. In the present embodiment, it is preferable to use a so-called bump FPC as the FPC not shown. In this case, the FPC is connected to the lead-out wiring 92 in the through hole 91 or the individual pad 220 in the connection groove 210 via the bump.

Next, a method of manufacturing the head chip 240 of the second embodiment will be described. FIG. 28 is a process diagram for describing a third dicing line forming step and an electrode forming step. In the following description, the description of the same steps as those in the first embodiment described above will be omitted.
As shown in FIG. 28, in the present embodiment, in the actuator wafer manufacturing process, for example, after the through hole forming process, the third dicing line 260 to be the connection groove 210 is formed (third dicing line forming process). Specifically, in the third dicing line forming step, the dicer is caused to travel in the X direction with respect to the portion located between the through holes 91 in the Z direction on the back surface of the actuator wafer 261. At this time, the third dicing line 260 is formed to a depth such that the bottom surface (the inner end surface in the Y direction) is located outside the bottom surface (the outer end surface in the Y direction) of the first dicing line 110 in the Y direction. .

Subsequently, the plating film 120 is formed on the actuator wafer 261 by the same method as the first electrode forming step of the first embodiment. Thereby, the plating film 120 is also formed on the inner surface of the third dicing line 260. The third dicing line forming process may be performed before the through hole forming process, the first dicing line forming process, and the second dicing line forming process.
Also, after the third dicing line process, the processes up to the bonding process are performed by the same method as that of the first embodiment described above.

29 and 30 are process diagrams for explaining the grinding process.
In the grinding process shown in FIGS. 29 and 30, the first dicing line 110 does not penetrate the actuator wafer 261, the second dicing line 111 penetrates the actuator wafer 261, and the third dicing line 260 is not removed. The actuator wafer 261 is ground from the back side. Then, of the plating film 120 formed on the back surface side of the actuator wafer 261, only the portion formed on the inner surface of the third dicing line 260 remains.

  Thereafter, the singulation step is performed by the same method as that of the first embodiment. At this time, the third dicing line 260 is divided at an intermediate position in the Z direction, thereby forming the connection groove 210 described above.

  Thus, in the present embodiment, when the plating film 120 formed on the back surface of the actuator wafer 261 by electroless plating is removed by grinding or the like, the plating film 120 remaining in the connection groove 210 is used as the individual pad 220 can do. In this way, in the electrode formation step, the individual pads 220 can be formed at one time in addition to the respective electrodes and wirings. Therefore, since it is not necessary to separately perform an electrode forming step for forming the individual pads 220 on the back surface of the actuator wafer 261, the manufacturing efficiency can be improved.

  The technical scope of the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the scope of the present invention.

  For example, in the embodiment described above, the inkjet printer 1 has been described as an example of the liquid ejecting apparatus, but the invention is not limited to the printer. For example, a fax machine or an on-demand printer may be used.

  Although the embodiment described above describes the two-row type ink jet head 5 in which the nozzle holes 83 and 84 are arranged in two rows, the invention is not limited to this. For example, the ink jet head 5 may have three or more rows of nozzle holes, or may have one nozzle hole.

In the embodiment described above, the circulation type in which the ink circulates between the ink jet head 5 and the ink tank 4 in the edge chute type has been described, but the invention is not limited thereto.
In addition, the present invention may be applied to a so-called side shoot type ink jet head which ejects ink from the central portion in the channel extending direction in the ejection channel.
In the embodiment described above, the configuration in which the dummy channel 55 penetrates in the Y direction across the entire Z direction in the actuator plate has been described, but the configuration is not limited thereto. I do not care. In this case, the individual pad and the individual electrode 63 may be connected through the portion of the dummy channel 55 which passes through the actuator plate in the Y direction.
In the embodiment described above, the configuration using the chevron substrate as the actuator plate has been described, but it is not limited thereto. That is, a piezoelectric substrate having one polarization direction in the thickness direction may be used as the actuator plate.

  In the embodiment described above, although the case where the lead-out wiring is formed on the inner surface of the through hole 91 and the routing recess 150 is described, the present invention is not limited to this. The design of the lead-out wiring can be changed appropriately as long as the common wiring is drawn around the back surface of the actuator plate.

  In addition, it is possible to replace the components in the above-described embodiment with known components as appropriate without departing from the spirit of the present invention, and the above-described modifications may be combined as appropriate.

1 ... ink jet printer 2 ... transport means (moving mechanism)
3 ... Transporting means (moving mechanism)
5, 5 B, 5 C, 5 M, 5 Y: Ink jet head (liquid jet head)
7 ... Scanning means (moving mechanism)
41 ... flow path plate 43 ... spacer plate 51 ... first actuator plate 52 ... first cover plate 54 ... discharge channel (injection channel)
55 Dummy channel 61 Common electrode 62 Common wiring 63 Individual electrode 72 Slit (liquid introduction path)
74 second actuator plate 75 second cover plate 77 inlet channel 78 outlet channel 81 first circulation channel (circulation channel)
82 ... 2nd circulation channel (circulation channel)
83 ... 1st nozzle hole (injection hole)
84 ... 2nd nozzle hole (injection hole)
92: Lead wiring 93: Common pad 94: Individual pad 151: Actuator plate 160: Lead wiring 162: Common wiring 163: Common pad 170: Individual pad 210: Connection groove 220: Individual pad 251: Actuator plate

Claims (8)

An ejection channel extending along a first direction on the surface of the actuator plate and being spaced apart in a second direction intersecting the first direction, and juxtaposed with liquid;
On the surface of the actuator plate, they are alternately juxtaposed with the ejection channel in the second direction and are not filled with liquid penetrating the actuator plate in a third direction orthogonal to the first direction and the second direction With the dummy channel,
Individual electrodes formed on the inner surface of the dummy channel;
A common electrode formed on an inner surface of the injection channel;
The actuator plate is formed on the surface of a tail portion located between the dummy channels adjacent to the ejection channel in the first direction with respect to the ejection channel and connected to the common electrode. Common wiring to be
A lead wire for drawing out the common wire on the back surface side of the tail portion of the actuator plate;
A liquid jet head comprising: individual pads formed on the back surface of the tail portion of the actuator plate and connecting the individual electrodes facing each other in the second direction with the jet channel interposed therebetween. .   2. The liquid jet head according to claim 1, wherein a connection groove recessed toward the front surface side is formed in a portion where the individual pad is formed on the back surface of the actuator plate.   The common pad which is connected to the lead-out wiring and extends toward the other end side in the first direction is formed on the back surface of the actuator plate. The liquid jet head described.   The liquid ejection head according to any one of claims 1 to 3, wherein the lead-out wiring is formed on an inner surface of a through hole formed in the tail portion of the actuator plate. A cover plate that covers the injection channel and the dummy channel in the third direction is disposed on the surface side of the actuator plate.
The liquid jet head according to any one of claims 1 to 4, wherein the cover plate is formed with a liquid introduction path communicating with each other in the jet channel. The actuator plate includes a first actuator plate and a second actuator plate arranged to face each other in the third direction.
The cover plate includes a first cover plate disposed on the surface side of the first actuator plate, and a second cover plate disposed on the surface side of the second actuator plate.
A flow passage plate is disposed between the first cover plate and the second cover plate,
6. The liquid jet head according to claim 5, wherein an inlet flow path communicating with the liquid introduction path of the first cover plate and the second cover plate is formed in the flow path plate. The injection channel is opened at the other end surface of the first actuator plate and the second actuator plate in the first direction, respectively.
At the other end side of the first actuator plate and the second actuator plate in the first direction, an injection plate having injection holes respectively communicating with the injection channel is disposed.
Between the first actuator plate, the second actuator plate, and the injection plate in the first direction, a spacer plate having a circulation channel that separately connects the injection channel and the injection hole is disposed. ,
7. The liquid jet head according to claim 6, wherein an outlet channel communicating with the circulation channel is formed in the channel plate. A liquid jet head according to any one of claims 1 to 7;
And a moving mechanism for relatively moving the liquid jet head and the recording medium.

Images