JP2017109457A - Liquid spray head and liquid spray device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a liquid spray head and a liquid spray device that can increase yields, and improve flexibility of wiring pattern so as to facilitate wiring formation.SOLUTION: The liquid spray head comprises: an actuator plate 51 in which discharge channels 54 and non-discharge channels 55 are alternately arranged parallely at intervals in an X-direction; a cover plate 52, laminated on a surface of the actuator plate 51, which blocks the discharge channels 54 and the non-discharge channels 55 and has a slit 72 communicating with the discharge channels 54; common electrodes 61 formed on inner surfaces of the discharge channels 54; individual electrodes 63 formed on inner surfaces of the non-discharge channels 55; a protective plate 53 laminated on a backside of the actuator plate 51; and penetrating electrodes 88 and 90 and lead-out wiring 94 and 97, formed in the protective plate 53, which connect the common electrodes 61 and the individual electrode 63 to flexible substrates in the backside of the protective plate 53.SELECTED DRAWING: Figure 6

Description

  The present invention relates to a liquid ejecting head and a liquid ejecting apparatus.

  2. Description of the Related Art As an apparatus that discharges ink droplets onto a recording medium (for example, paper) and records images and characters on the recording medium, there is an ink jet printer that includes an ink jet head (for example, see Patent Document 1 below). ). The inkjet head includes an actuator plate in which ejection channels and non-ejection channels are alternately arranged. Each channel opens at least on the surface of the actuator plate and extends in parallel to each other in a direction intersecting the thickness direction of the actuator plate. A common electrode is formed on the inner surface of the discharge channel. On the other hand, individual electrodes are formed on the inner surface of the non-ejection channel. A cover plate having a slit communicating with the discharge channel is laminated on the surface of the actuator plate.

  By the way, as a formation method of the common electrode and the individual electrode described above, for example, there is a method using electroless plating. In this case, a metal film is first formed on the actuator plate by electroless plating. Thereafter, the metal film formed on the bottom surface of the non-ejection channel is removed. Specifically, the back surface of the actuator plate is ground so that the non-ejection channel opens also on the back surface of the actuator plate (the surface located on the side opposite to the cover plate). Thereby, in the inner surface of a non-ejection channel, the individual electrodes formed on the opposing inner surfaces are electrically separated.

JP 2005-186527 A

In the conventional ink jet head, as described above, the non-ejection channel opens on the back surface of the actuator plate. In this case, the actuator plate is likely to be chipped due to a peripheral member coming into contact with the opening edge of the non-ejection channel on the back surface of the actuator plate during manufacturing.
Further, particles easily enter the non-ejection channel through the opening of the non-ejection channel on the back surface of the actuator plate. In this case, a crack may occur in the actuator plate due to a load acting locally on the inner surface of the non-ejection channel from the particles.
As a result, there is still room for improvement in terms of improving yield.

Furthermore, the common electrode and the individual electrode formed in each channel are connected to the flexible substrate via the wiring formed on the surface of the actuator plate. In this case, the common electrode and the individual electrode are connected to the wiring at the opening edge of each channel on the surface of the actuator plate.
However, on the surface of the actuator plate, the space for wiring is limited because each channel is open. Therefore, there is still room for improvement in terms of improving the degree of freedom of the wiring pattern.

  The present invention has been made in view of such circumstances, and an object thereof is to improve the yield and the degree of freedom of the wiring pattern, and the liquid ejecting head and the liquid that can easily form the wiring It is to provide an injection device.

  In order to solve the above problems, in a liquid jet head according to one embodiment of the present invention, a jet channel and a non-jet channel extending along a first direction are spaced apart in a second direction orthogonal to the first direction. Of the actuator plates arranged alternately and the actuator plates, the actuator plates are stacked on one main surface in a third direction orthogonal to the first direction and the second direction to block the injection channel and the non-injection channel. And a cover plate having a liquid supply path communicating with the ejection channel, a common electrode formed on the inner surface of the ejection channel, an individual electrode formed on the inner surface of the non-ejection channel, and the actuator plate, A protective plate laminated on the other main surface in the third direction, and external wiring mounted on the other main surface of the protective plate; Serial protection plate are formed on, and a, a connection line which connects the external line and the common electrode and the individual electrodes on the other main surface of the protective plate.

According to this aspect, the other main surface of the actuator plate can be protected by laminating the protective plate on the other main surface of the actuator plate. In particular, when each channel is opened on the other main surface of the actuator plate, it is possible to cover each channel with the protective plate. Therefore, it is possible to suppress the peripheral member from coming into contact with the opening edge of each channel on the other main surface of the actuator plate (the drive wall that partitions each channel), and to suppress chipping of the actuator plate.
Moreover, since it can suppress that a particle approachs into each channel through the opening part of each channel on the other main surface of an actuator plate, it can suppress that a crack generate | occur | produces in an actuator plate resulting from a particle.
As a result, the yield can be improved.

In particular, according to this aspect, by connecting the external wiring and the connection wiring on the other main surface of the protection plate, it is possible to secure a space for forming the connection wiring compared to the case where the connection wiring is formed on the actuator plate, for example. . Thereby, the freedom degree of a wiring pattern can be improved and wiring formation can be facilitated.
Furthermore, since the wiring length on the actuator plate can be shortened, an increase in capacitance can be suppressed.
Further, unlike the configuration in which the external wiring and the connection wiring are connected on one main surface of the protection plate, it is not necessary to project the end of the protection plate with respect to the actuator plate in order to secure a mounting portion of the external wiring. Thereby, the length of the liquid ejecting head in the first direction can be shortened. For example, when a plurality of liquid ejecting heads are cut out from one wafer, the number of wafers taken can be increased.

In the above aspect, the individual wiring formed on the other main surface of the actuator plate and spanning the individual electrodes facing each other in the second direction across the ejection channel, and on the other main surface of the actuator plate And a common wiring connected to the common electrode.
According to this aspect, by forming the common wiring and the individual wiring on the other main surface of the actuator plate, it is possible to ensure the conduction between the common electrode and the common wiring and the conduction between the individual electrode and the individual wiring.

In the above aspect, at least a part of the injection channel and the non-injection channel is opened on the other main surface of the actuator plate, and the common wiring is on the other main surface of the actuator plate in the injection channel. The individual wiring may be connected to the individual wiring through an opening on the other main surface of the actuator plate in the non-injection channel.
According to this aspect, by connecting the common wiring and the individual wiring through the opening on the other main surface of the actuator plate in each channel, the number of manufacturing steps can be reduced as compared with the case where a separate through electrode is provided in the actuator plate. And simplification.

In the above aspect, the connection wiring penetrates the protective plate in the third direction and is connected to the common electrode and the individual electrode on one main surface, and the other main main plate in the protective plate. And a lead-out line that is formed on the surface and connects between the through electrode and the external line.
According to this aspect, since the connection wiring has the through electrode penetrating the protection plate in the third direction, the electrode can be easily routed to the extraction wiring formed on the other main surface of the protection plate.

In the above aspect, the through electrode has a plurality of individual through electrodes arranged at intervals in the second direction corresponding to the individual electrodes, and the lead-out wiring is led out from the individual through electrodes, respectively. A plurality of individual lead wires, and a first wiring pitch between the individual lead wires adjacent to each other in the second direction at a connection portion between the individual lead wire and the external wire is the individual lead wire and the individual lead wire. It may be smaller than the second wiring pitch between the individual lead wires adjacent in the second direction at the connection portion with the through electrode.
According to this aspect, since the individual lead-out wirings can be aggregated, it is possible to use an external wiring that is narrower than the width of the protective plate (the width in the second direction).
In this case, by reducing the width of the external wiring, the drive IC can be mounted by tape mounting or the like, so that the cost can be reduced as compared with a wide (for example, equivalent to the width of the protective plate) external wiring.
In addition, by narrowing the external wiring, it is possible to improve the overall length accuracy of the common electrode wiring and the individual electrode wiring formed in the external wiring. As a result, it is possible to easily connect each lead-out wiring and external wiring.

In the above aspect, a plurality of the individual lead wires are aggregated in the first wire pitch at a connection portion with the external wire to form a lead wire group, and the lead wire group is spaced in the second direction. A plurality of external wirings may be arranged, and the external wirings may be individually connected to the lead wiring group.
According to this aspect, since the lead wire groups in which the individual lead wires are aggregated plurally are arranged at intervals in the second direction, it is connected to each lead wire group without increasing the width of the protection plate. Interference between external wirings to be performed can be suppressed.
In addition, the increase in the wiring length can be suppressed and the increase in the capacitance can be suppressed as compared with the case where the wiring is routed by increasing the width of the protective plate in order to suppress the interference between the external wirings.

The said aspect WHEREIN: The said protection plate may be comprised with the material whose heat conductivity is higher than the said actuator plate.
According to this aspect, since the protective plate is made of a material having a higher thermal conductivity than the actuator plate, temperature variations in the actuator plate can be alleviated and the liquid temperature can be made uniform. As a result, the liquid ejection speed can be made uniform and the printing stability can be improved.

In the above aspect, the ejection channel and the non-injection channel open at least on the first surface in the first direction of the actuator plate, and communicate with the ejection channel on the first surface of the actuator plate. A spacer plate having a circulation path is provided, and an injection plate having injection holes respectively communicating with the injection channels through the circulation path is provided on the first surface of the spacer plate in the first direction. The cover plate may be provided with a flow path plate having an inlet flow path communicating with the liquid supply path and an outlet flow path communicating with the circulation path.
According to this aspect, since the liquid can be circulated between each injection channel and the liquid tank through the circulation path and the inlet flow path and the outlet flow path of the flow path plate, The retention of bubbles can be suppressed.

A liquid ejecting apparatus according to an aspect of the invention includes the liquid ejecting head according to the above aspect, and a moving mechanism that relatively moves the liquid ejecting head and the recording medium. .
According to this aspect, since the liquid ejecting head according to the above aspect is provided, a liquid ejecting apparatus having excellent reliability can be provided.

  According to one embodiment of the present invention, the yield can be improved, the degree of freedom of the wiring pattern can be improved, and the wiring can be easily formed.

1 is a schematic configuration diagram of an inkjet printer according to an embodiment. It is a schematic block diagram of the inkjet head and ink circulation means which concern on embodiment. It is sectional drawing of the inkjet head which concerns on embodiment. It is sectional drawing of the inkjet head which concerns on embodiment. It is the disassembled perspective view which looked at the head chip which concerns on embodiment from the inner side of the Y direction. It is the disassembled perspective view which looked at the head chip concerning an embodiment from the outside of the Y direction. It is the bottom view which looked at the head chip concerning an embodiment from the outside of the Y direction. It is process drawing for demonstrating a wafer preparation process. It is process drawing for demonstrating a wafer preparation process. It is process drawing for demonstrating a mask formation process. It is process drawing for demonstrating a dicing line formation process. It is process drawing for demonstrating a common electrode and an individual electrode formation process. It is process drawing for demonstrating a removal process. It is process drawing for demonstrating the bonding process. It is process drawing for demonstrating a flow path wafer joining process. It is process drawing for demonstrating a grinding process. It is process drawing for demonstrating a grinding process. It is process drawing for demonstrating a common wiring and individual wiring formation process. It is process drawing for demonstrating a protection wafer preparation process. It is process drawing for demonstrating a protection wafer preparation process. It is process drawing for demonstrating a protection wafer joining process. It is process drawing for demonstrating a penetration electrode formation process. It is process drawing for demonstrating an individualization process.

  Hereinafter, embodiments according to the present invention will be described with reference to the drawings. In the embodiment, as an example of a liquid ejecting apparatus including the liquid ejecting head of the present invention, an ink jet printer (hereinafter simply referred to as a printer) that performs recording on a recording medium using ink (liquid) will be described as an example. To do. In the drawings used for the following description, the scale of each member is appropriately changed in order to make each member a recognizable size.

[Printer]
FIG. 1 is a schematic configuration diagram of the printer 1.
As shown in FIG. 1, the printer 1 according to the present embodiment includes a pair of conveying units 2 and 3, an ink tank 4, an inkjet head 5 (liquid ejecting head) 5, an ink circulating unit 6, and a scanning unit (moving unit). Mechanism) 7. In the following description, an X, Y, Z orthogonal coordinate system is used as necessary. In this case, the X direction coincides with the transport direction of the recording medium P (for example, paper). The Y direction coincides with the scanning direction of the scanning means 7. The Z direction indicates the height direction orthogonal to the X direction and the Y direction.

  The transport means 2 and 3 transport the recording medium P in the X direction. Specifically, the conveying means 2 includes a grit roller 11 extending in the Y direction, a pinch roller 12 extending in parallel to the grit roller 11, and a drive mechanism such as a motor that rotates the grit roller 11. (Shown). Similarly, the conveying means 3 includes a grit roller 13 extending in the Y direction, a pinch roller 14 extending in parallel to the grit roller 13, a drive mechanism (not shown) for rotating the grit roller 13 axially, It has.

  The ink tank 4 includes, for example, ink tanks 4Y, 4M, 4C, and 4K that respectively store yellow, magenta, cyan, and black inks. In the present embodiment, the ink tanks 4Y, 4M, 4C, and 4K are provided side by side in the X direction.

FIG. 2 is a schematic configuration diagram of the inkjet head 5 and the ink circulation means 6.
As shown in FIGS. 1 and 2, the ink circulation means 6 circulates ink between the ink tank 4 and the inkjet head 5. Specifically, the ink circulation means 6 includes a circulation flow path 23 having an ink supply pipe 21 and an ink discharge pipe 22, a pressure pump 24 connected to the ink supply pipe 21, and a suction connected to the ink discharge pipe 22. And a pump 25. The ink supply pipe 21 and the ink discharge pipe 22 are constituted by a flexible hose having flexibility that can follow the operation of the scanning means 7 that supports the inkjet head 5.

The pressurizing pump 24 pressurizes the inside of the ink supply pipe 21 and sends out ink to the inkjet head 5 through the ink supply pipe 21. Thereby, the ink supply pipe 21 side has a positive pressure with respect to the inkjet head 5.
The suction pump 25 decompresses the inside of the ink discharge pipe 22 and sucks ink from the inkjet head 5 through the ink discharge pipe 22. Thereby, the ink discharge pipe 22 side has a negative pressure with respect to the inkjet head 5. The ink can be circulated through the circulation flow path 23 between the inkjet head 5 and the ink tank 4 by driving the pressure pump 24 and the suction pump 25.

  As shown in FIG. 1, the scanning means 7 reciprocates the inkjet head 5 in the Y direction. Specifically, the scanning means 7 includes a pair of guide rails 31 and 32 extending in the Y direction, a carriage 33 movably supported by the pair of guide rails 31 and 32, and moving the carriage 33 in the Y direction. And a drive mechanism 34. The transporting means 2 and 3 and the scanning means 7 constitute a moving mechanism that relatively moves the inkjet head 5 and the recording medium P.

  The drive mechanism 34 is disposed between the guide rails 31 and 32 in the X direction. The drive mechanism 34 is a pair of pulleys 35, 36 that are spaced apart in the Y direction, an endless belt 37 that is wound between the pair of pulleys 35, 36, and a drive that rotationally drives one pulley 35. And a motor 38.

  The carriage 33 is connected to an endless belt 37. A plurality of inkjet heads 5Y, 5M, 5C, and 5K that respectively eject four colors of yellow, magenta, cyan, and black are mounted on the carriage 33. In the present embodiment, the inkjet heads 5Y, 5M, 5C, and 5K are arranged side by side in the Y direction.

<Inkjet head>
Next, the above-described inkjet head 5 will be described in detail. Note that the inkjet heads 5Y, 5M, 5C, and 5K have the same configuration except for the color of the supplied ink, and therefore will be collectively described as the inkjet head 5 in the following description.
3 and 4 are cross-sectional views of the ink-jet head 5.
As shown in FIGS. 3 and 4, each inkjet head 5 discharges ink from an ink tank 4 among so-called edge shoot types that discharge ink from a distal end portion in a channel extending direction of a discharge channel 54 described later. Circulating type (vertical circulation type).

The inkjet head 5 mainly includes a first head chip 40A and a second head chip 40B, a flow path plate 41, an inlet manifold 42, a spacer plate 43, and a nozzle plate (injection plate) 44. Hereinafter, in the Z direction, the nozzle plate 44 side may be referred to as the lower side, and the inlet manifold 42 side may be referred to as the upper side. In the following description, in the Y direction, the direction toward the center of the inkjet head 5 may be referred to as the inside, and the direction away from the center of the inkjet head 5 may be described as the outside.
In the following description, the first head chip 40A among the head chips 40A and 40B will be mainly described. The same configuration as that of the first head chip 40A in the second head chip 40B may be denoted by the same reference numeral as that of the first head chip 40A, and description thereof may be omitted.

FIG. 5 is an exploded perspective view of the head chips 40A and 40B as viewed from the inside in the Y direction.
As shown in FIGS. 3 to 5, the first head chip 40 </ b> A includes a first actuator plate 51, a first cover plate 52, and a first protection plate 53.

(Actuator plate)
The first actuator plate 51 is a laminated substrate in which two piezoelectric substrates having different polarization directions in the thickness direction (Y direction) are laminated (so-called chevron type). As the piezoelectric substrate, for example, a ceramic substrate made of PZT (lead zirconate titanate) or the like is preferably used.

  The first actuator plate 51 is formed with a plurality of channels 54 and 55 that open at least on the surface (the surface located on the inner side in the Y direction: one main surface). Each channel 54, 55 is formed in a straight line extending in the Z direction (first direction). The channels 54 and 55 are alternately formed with an interval in the X direction (second direction). Therefore, the channels 54 and 55 are defined by the drive walls 56 (see FIG. 5) made of the first actuator plate 51, respectively. Specifically, the plurality of channels 54 and 55 are an ejection channel (ejection channel) 54 that is filled with ink and a non-ejection channel (non-ejection channel) 55 that is not filled with ink.

  As shown in FIGS. 3 and 5, the discharge channel 54 has an upper end that terminates in the first actuator plate 51, and a lower end that opens at the lower end surface of the first actuator plate 51. As shown in FIG. 3, the discharge channel 54 has an extending portion 54a located at the lower end portion, and a rounded-up portion 54b extending upward from the extending portion 54a.

The extending portion 54a has a uniform groove depth over the entire Z direction. The extending part 54a penetrates the actuator plate 51 in the Y direction.
The groove depth of the raised portion 54b becomes gradually shallower as it goes upward.

  As shown in FIGS. 4 and 5, the non-ejection channel 55 is formed so that the groove depth in the Y direction is uniform over the entire Z direction. The non-ejection channel 55 penetrates the first actuator plate 51 in the Z direction. Further, the non-ejection channel 55 penetrates the first actuator plate 51 in the Y direction (third direction).

  As shown in FIGS. 3 and 5, a common electrode 61 is formed on the inner surface of the ejection channel 54. The common electrode 61 is formed on the entire inner surface of the ejection channel 54 (the inner surface of the extending portion 54a and the inner surface of the raised portion 54b).

  As shown in FIGS. 4 and 5, individual electrodes 63 are formed on the inner surface of the non-ejection channel 55. The individual electrodes 63 are separately formed on the inner side surfaces of the non-ejection channels 55 facing each other in the X direction. Therefore, among the individual electrodes 63, the individual electrodes 63 facing each other in the same non-ejection channel 55 are electrically separated. The individual electrode 63 is formed over the entire inner surface (the entire Y direction and Z direction) of the non-ejection channel 55.

FIG. 6 is an exploded perspective view of the head chips 40A and 40B as viewed from the outside in the Y direction.
As shown in FIGS. 3 and 6, a common wiring 62 is formed on the back surface (the surface located outside in the Y direction: the other main surface) of the first actuator plate 51. The common wiring 62 is formed in a strip shape extending in the Z direction on the back surface of the first actuator plate 51. A lower portion of the common wiring 62 surrounds the back surface opening of the discharge channel 54. The lower part of the common wiring 62 is connected to the common electrode 61 described above at the opening edge of the back surface of the discharge channel 54. The upper portion of the common wiring 62 extends upward from the back surface opening of the discharge channel 54. The pattern of the common wiring 62 can be appropriately changed as long as at least a part of the pattern is connected to the common electrode 61.

On the back surface of the first actuator plate 51, individual wiring 64 is formed in a portion located above the common wiring 62. The individual wiring 64 is formed in a strip shape extending in the X direction. The individual wiring 64 connects the individual electrodes 63 facing each other in the X direction with the ejection channel 54 interposed therebetween. The individual wiring 64 is formed at a position equivalent to the rounded-up portion 54b even if it is formed in a portion (so-called tail portion) located above the discharge channel 54 in the first actuator plate 51 in the Z direction. It doesn't matter.
Thus, in this embodiment, the common electrode 61 and the individual electrode 63 are routed around the back surface of the first actuator plate 51.

(Cover plate)
As shown in FIGS. 3 to 5, the first cover plate 52 is formed in a plate shape whose outer shape in plan view as viewed from the Y direction is the same as that of the first actuator plate 51. The back surface of the first cover plate 52 is joined to the surface of the first actuator plate 51.

The first cover plate 52 has a common ink chamber 71 formed on the front surface side, and a plurality of slits (liquid supply paths) 72 formed on the back surface side.
The common ink chamber 71 is formed at a position equivalent to the raised portion 54b of the ejection channel 54 in the Z direction. The common ink chamber 71 is formed in a groove shape that is recessed toward the back surface side of the first cover plate 52 and extends in the X direction. Ink flows into the common ink chamber 71 through the flow path plate 41 described above.

  The slit 72 is formed in the common ink chamber 71 at a position facing each ejection channel 54 in the Y direction. The slit 72 penetrates the first cover plate 52 in the Y direction. That is, the above-described common ink chamber 71 communicates with each ejection channel 54 through the slit 72, but does not communicate with the non-ejection channel 55. The slit 72 is formed to have the same width in the X direction as the ejection channel 54.

  Similar to the first head chip 40A described above, the second head chip 40B is configured by stacking a second actuator plate 74, a second cover plate 75, and a second protective plate 76 in the Y direction. The head chips 40A and 40B are arranged at intervals in the Y direction with the surfaces of the cover plates 52 and 75 facing each other in the Y direction.

  As shown in FIGS. 3 and 4, the ejection channels 54 and the non-ejection channels 55 of the second head chip 40B are shifted by a half pitch with respect to the arrangement pitch of the ejection channels 54 and the non-ejection channels 55 of the first head chip 40A. It is arranged. That is, the ejection channels 54 and the non-ejection channels 55 of the head chips 40A and 40B are arranged in a staggered manner. In this case, the ejection channel 54 of the first head chip 40A and the non-ejection channel 55 of the second head chip 40B face each other in the Y direction, and the non-ejection channel 55 of the first head chip 40A and the second head chip 40B. The discharge channel 54 faces the Y direction. Note that the pitch of the channels 54 and 55 of the head chips 40A and 40B can be changed as appropriate.

(Channel plate)
The flow path plate 41 is sandwiched in the Y direction between the first head chip 40A and the second head chip 40B. The flow path plate 41 is formed in a plate shape whose outer shape in plan view as viewed from the Y direction is the same as that of the actuator plates 51 and 74. The surface of the first cover plate 52 is joined to the first main surface in the Y direction (the surface facing the first head chip 40A side) in the flow path plate 41. The surface of the second cover plate 75 is joined to the second main surface in the Y direction (the surface facing the second head chip 40B side) in the flow path plate 41.

  In each main surface of the flow path plate 41, an inlet flow path 77 communicating with the common ink chamber 71 described above is formed. Each inlet channel 77 is recessed from each main surface of the channel plate 41 toward the inside in the Y direction. Each inlet channel 77 has a lower end communicating with the common ink chamber 71 described above, and an upper end opened at the upper end surface of the channel plate 41. The inlet channel 77 has the same width in the X direction as the common ink chamber 71. However, the width of the inlet channel 77 may be smaller or larger than the common ink chamber 71.

  An outlet channel 78 is formed at the lower end of the channel plate 41. The outlet channel 78 is recessed upward from the lower end surface of the channel plate 41. The outlet channel 78 penetrates the channel plate 41 in the Y direction. Further, the outlet channel 78 is wider in the X direction than the inlet channel 77 described above. The outlet channel 78 is connected to an outlet manifold (not shown) at a portion located outside the inlet channel 77 in the X direction. The outlet manifold is connected to the ink discharge pipe 22 described above.

(Inlet manifold)
The inlet manifold 42 is joined to the upper end surfaces of the head chips 40A and 40B and the flow path plate 41 together. The inlet manifold 42 is formed with a supply path 80 that communicates with each of the inlet channels 77 described above. The supply path 80 is recessed upward from the lower end surface of the inlet manifold 42. The supply path 80 communicates with each inlet flow path 77 collectively.

(Spacer plate)
The spacer plate 43 is joined to the lower end surfaces (first surfaces) of the head chips 40A and 40B and the flow path plate 41 together. The spacer plate 43 is formed with a plurality of circulation paths (first circulation path 81 and second circulation path 82) that connect between the discharge channels 54 and the outlet channels 78 of the head chips 40A and 40B.

As shown in FIG. 3, the first circulation path 81 is formed at the same position in the X direction as the ejection channel 54 of the first head chip 40A. A plurality of first circulation paths 81 are formed at intervals in the X direction corresponding to the arrangement pitch of the discharge channels 54. Specifically, each first circulation path 81 penetrates the spacer plate 43 in the Z direction. The inner end of the first circulation path 81 in the Y direction is located on the inner side in the Y direction with respect to the surface of the first cover plate 52. The inner end of the first circulation path 81 in the Y direction communicates with the outlet flow path 78 described above. The outer end of the first circulation path 81 in the Y direction communicates with the discharge channel 54 of the first head chip 40A.
The second circulation path 82 is formed at the same position in the X direction as the ejection channel 54 of the second head chip 40B. The second circulation path 82 has an outer end in the Y direction communicating with each discharge channel 54 of the second head chip 40 </ b> B, and an inner end in the Y direction communicating with the outlet channel 78.

(Nozzle plate)
The nozzle plate 44 is joined to the lower end surface of the spacer plate 43. In the nozzle plate 44, a plurality of nozzle holes (first nozzle holes 83 and second nozzle holes 84) penetrating the nozzle plate 44 in the Z direction are arranged.

  The first nozzle holes (injection holes) 83 are respectively formed in portions of the nozzle plate 44 facing the first circulation paths 81 of the spacer plate 43 in the Z direction. That is, the first nozzle holes 83 are arranged on a straight line at the same pitch as the first circulation path 81 and spaced in the X direction. The first nozzle hole 83 communicates with the first circulation path 81 at the center in the Y direction of the first circulation path 81. Thus, each first nozzle hole 83 communicates with the corresponding discharge channel 54 of the first head chip 40A via the first circulation path 81.

  The second nozzle holes (injection holes) 84 are respectively formed in portions of the nozzle plate 44 facing the second circulation paths 82 of the spacer plate 43 in the Z direction. That is, the second nozzle holes 84 are arranged on a straight line at the same pitch as the second circulation path 82 and spaced in the X direction. The second nozzle hole 84 communicates with the second circulation path 82 at the center in the Y direction of the second circulation path 82. Accordingly, each second nozzle hole 84 communicates with the corresponding discharge channel 54 of the second head chip 40B via the second circulation path 82. Accordingly, each non-ejection channel 55 does not communicate with the nozzle holes 83 and 84 and is covered from below by the nozzle plate 44.

(Protective plate)
Here, as shown in FIGS. 3 to 6, in each of the head chips 40 </ b> A and 40 </ b> B, the protective plates (the first protective plate 53 and the second protective plate 76) are provided on the back surfaces of the actuator plates 51 and 74, respectively. It is joined. Each of the protective plates 53 and 76 is formed in a plate shape whose outer shape in plan view as viewed from the Y direction is the same as that of the actuator plates 51 and 74. Each of the protection plates 53 and 76 closes the back surface opening of each of the channels 54 and 55 of the corresponding actuator plate 51 and 74 from the outside in the Y direction.

Each of the protection plates 53 and 76 is made of a material having insulating properties and higher thermal conductivity than the actuator plates 51 and 74. The protective plates 53 and 76 are more preferably made of a material having a thermal expansion coefficient close to that of the actuator plates 51 and 74. Examples of such a material include AlN (for example, a thermal conductivity of 80 to 150 W / m · K, a thermal expansion coefficient of 4.4 to 5.0 × 10 ⁻⁶ 1 / K), and a SiN—BN mixed material ( For example, a thermal conductivity of 30 to 50 W / m · K and a thermal expansion coefficient of 2.0 to 3.0 × 10 ⁻⁶ 1 / K) are preferably used. In the following description, the first protective plate 53 will be mainly described, and the same configuration as the first protective plate 53 in the second protective plate 76 is denoted by the same reference numeral as the first protective plate 53. Description is omitted.

  A common through-hole 87 that penetrates the first protective plate 53 in the Y direction is formed in a portion of the first protective plate 53 that overlaps the common wiring 62 described above in a plan view as viewed from the Y direction. Specifically, the common through hole 87 is formed in the first protective plate 53 at a position above the discharge channel 54 and facing each common wiring 62 in the Y direction. The common through holes 87 are arranged at intervals in the X direction corresponding to the common wires 62. The common through hole 87 has an inner diameter equal to the channel width (width in the X direction) of the discharge channel 54. However, the inner diameter of the common through hole 87 can be changed as appropriate.

  In each common through hole 87, a common through electrode (connection wiring) 88 is formed. The common through electrode 88 is formed of, for example, a conductive paste. The common through electrode 88 is filled in the common through hole 87. The inner end face in the Y direction of the common through electrode 88 is connected to the corresponding common wiring 62 between the front surface of the first protective plate 53 and the back surface of the first actuator plate 51.

  A portion of the first protective plate 53 that is above the common through hole 87 and overlaps the individual wiring 64 described above in a plan view as viewed from the Y direction passes through the first protective plate 53 in the Y direction. An individual through-hole 89 is formed. Specifically, the individual through holes 89 are arranged at intervals in the X direction corresponding to the individual wires 64. The inner diameter of the individual through hole 89 is formed to be equal to the inner diameter of the common through hole 87. However, the inner diameter of the individual through-hole 89 can be changed as appropriate.

  In each individual through hole 89, an individual through electrode (connection wiring) 90 is formed. The individual through electrode 90 is formed of, for example, a conductive paste. The individual through electrode 90 is filled in the individual through hole 89. The inner end face in the Y direction of the individual through electrode 90 is connected to the corresponding individual wiring 64 between the front surface of the first protective plate 53 and the back surface of the first actuator plate 51. A land or the like for connecting the corresponding wirings 62 and 64 and the through electrodes 88 and 90 may be formed on the surface of the first protective plate 53. Moreover, if each penetration electrode 88,90 is the structure exposed on the front and back of the protection plate 53 through each penetration hole 87,89, it will form in only the inner peripheral surface of each penetration hole 87,89 by vapor deposition etc. It doesn't matter.

FIG. 7 is a bottom view of the head chips 40A and 40B as viewed from the outside in the Y direction.
As shown in FIG. 7, a plurality of individual lead wires (connection wires) 94 are formed on the back surface of the first protection plate 53. Each individual lead-out line 94 is formed in a strip shape. A lower end portion of each individual lead-out wiring 94 is connected to each individual through electrode 90 on the back surface of the first protection plate 53.

Here, in the first head chip 40 </ b> A, the channels 54 and 55 constitute a channel group 85 for each of the plurality of channels 54 and 55. In the present embodiment, each channel 54, 55 constitutes three channel groups 85.
The individual lead wires 94 described above are aggregated for each individual lead wire 94 corresponding to each channel group 85 to form a lead wire group 95. Therefore, in the present embodiment, three lead wire groups 95 are arranged at intervals in the X direction. The number of lead wiring groups 95 is not limited to three, and may be one or a plurality other than three according to the number of channel groups 85.

  In the same lead-out wiring group 95, each individual lead-out wiring 94 extends so as to approach the reference position as it goes upward, assuming an arbitrary position in the X direction in the lead-out wiring group 95 as a reference position. In the present embodiment, the reference position is set at the center in the X direction in the lead-out wiring group 95. Therefore, in the same lead wire group 95, each individual lead wire 94 extends toward the center of the lead wire group 95 in the X direction as it goes upward. The upper end edge of each lead wiring group 95 is disposed at the same position as the upper end edge of the first protection plate 53. However, the upper end edge of each lead-out wiring group 95 may terminate on the first protection plate 53.

  Further, in the same lead wire group 95, the distance (upper wire pitch) between the upper ends of the individual lead wires 94 adjacent to each other in the X direction (connecting portion with the flexible substrate 100 described later) is the distance between the individual lead wires 94. It is smaller than the distance (lower wiring pitch) in the X direction between the lower end portions (connection portions with the individual through electrodes 90). In the present embodiment, the lower wiring pitch is equal to the interval (channel pitch) between the ejection channels 54 adjacent in the X direction. On the other hand, if the upper wiring pitch is smaller than the channel pitch, the design can be changed as appropriate.

  Furthermore, the wiring width of each individual lead-out wiring 94 is equal to the inner diameter of the individual through hole 89. As a result, it is possible to reduce the upper wiring pitch while ensuring the conduction of the individual lead-out wires 94. However, the wiring width of each individual lead-out wiring 94 can be changed as appropriate.

Further, a common lead wiring (connection wiring) 97 is formed on the back surface of the first protection plate 53. In the present embodiment, the common lead wiring 97 is formed for each channel group 85. Each common lead-out line 97 has a common line 98 and an aggregate line 99.
The common wiring 98 is formed on the back surface of the first protection plate 53 in a band shape extending in the X direction at a portion located in the same direction as each common through electrode 88 in the Z direction. Each common wiring 98 is connected (shared) to a common through electrode 88 corresponding to each channel group 85.

  The aggregate wiring 99 is formed in a strip shape extending upward from one end portion of the common wiring 98 in the X direction. The aggregated wiring 99 extends toward the reference position as it goes upward along the individual lead-out lines 94 of the corresponding channel group 85. The aggregated wiring 99 may be formed at both ends of the common wiring 98 in the X direction. Further, it is preferable that the wiring width of the common lead wiring 97 is larger than the inner diameter of the common through hole 87. Thereby, the electrical resistance in each common extraction wiring 97 can be reduced. However, the wiring width of each common lead-out wiring 97 can be changed as appropriate.

  A plurality of flexible boards (external wirings) 100 are mounted on the back surface of the first protective plate 53. Each flexible substrate 100 is configured by mounting a drive IC 101 (for example, tape mounting) on a base film on which common electrode wiring and individual electrode wiring (not shown) are formed. Each flexible substrate 100 is pressure-bonded with an interval in the X direction at the upper end of the back surface of the first protective plate 53. The common electrode wiring and the individual electrode wiring of each flexible substrate 100 are respectively connected to the lead-out wiring group 95 and the aggregated wiring 99 corresponding to each channel group 85.

[How the printer works]
Next, a case where characters, figures, and the like are recorded on the recording medium P using the printer 1 configured as described above will be described below.
As an initial state, it is assumed that inks of different colors are sufficiently sealed in the four ink tanks 4 shown in FIG. Further, the ink in the ink tank 4 is filled in the inkjet head 5 via the ink circulating means 6.

Under such an initial state, when the printer 1 is operated, the grit rollers 11 and 13 of the conveying means 2 and 3 rotate, so that the recording medium is interposed between the grit rollers 11 and 13 and the pinch rollers 12 and 14. P is transported in the transport direction (X direction). At the same time, the drive motor 38 rotates the pulleys 35 and 36 to move the endless belt 37. Accordingly, the carriage 33 reciprocates in the Y direction while being guided by the guide rails 31 and 32.
During this time, ink of four colors is appropriately ejected from the inkjet heads 5 onto the recording medium P, so that characters, images, and the like can be recorded.

Here, the movement of each inkjet head 5 will be described in detail below.
Among the edge chute types as in the present embodiment, in the vertical circulation type inkjet head 5, first, the pressure pump 24 and the suction pump 25 shown in FIG. . In this case, the ink flowing through the ink supply pipe 21 flows into the respective inlet channels 77 of the channel plate 41 through the supply channel 80 of the inlet manifold 42 shown in FIG. The ink flowing into each inlet channel 77 passes through each common ink chamber 71 and then is supplied into each ejection channel 54 through the slit 72. The ink that has flowed into each discharge channel 54 gathers in the outlet flow path 78 through the circulation path 81 of the spacer plate 43, and is then discharged to the ink discharge pipe 22 shown in FIG. The ink discharged to the ink discharge pipe 22 is returned to the ink tank 4 and then supplied to the ink supply pipe 21 again. Thereby, the ink is circulated between the inkjet head 5 and the ink tank 4.

  When reciprocation is started by the carriage 33 (see FIG. 1), a driving voltage is applied to the electrodes 61 and 63 via the flexible substrate 100. At this time, the drive voltage is applied between the electrodes 61 and 63 with the individual electrode 63 set to the drive potential Vdd and the common electrode 61 set to the reference potential GND. Then, thickness-slip deformation occurs in the two drive walls 56 that define the discharge channel 54, and the two drive walls 56 are deformed so as to protrude toward the non-discharge channel 55. That is, the actuator plates 51 and 74 of the present embodiment are formed by stacking two piezoelectric substrates polarized in the thickness direction (Y direction). It bends and deforms in a V shape centering on the middle position in the direction. Thereby, the discharge channel 54 is deformed so as to expand.

When the volume of the ejection channel 54 increases due to the deformation of the two drive walls 56, the ink in the common ink chamber 71 is guided into the ejection channel 54 through the slit 72. The ink guided to the inside of the discharge channel 54 propagates as a pressure wave to the inside of the discharge channel 54, and at the timing when this pressure wave reaches the nozzle holes 83, 84, it is between the electrodes 61, 63. Apply drive voltage to zero.
As a result, the drive wall 56 is restored, and the volume of the discharge channel 54 once increased returns to the original volume. By this operation, the pressure inside the ejection channel 54 increases and the ink is pressurized. As a result, ink can be ejected from the nozzle holes 83 and 84. At this time, the ink is ejected as droplet-shaped ink droplets when passing through the nozzle holes 83 and 84. Thereby, as described above, characters, images, and the like can be recorded on the recording medium P.

  The operation method of the inkjet head 5 is not limited to the above-described content. For example, the drive wall 56 in the normal state may be deformed inside the discharge channel 54, and the discharge channel 54 may be configured to be recessed inside. In this case, the voltage applied between the electrodes 61 and 63 can be realized by making the voltage opposite to the above-described voltage, or by reversing the polarization direction of the actuator plates 51 and 74 without changing the sign of the voltage. It is. Further, after the ejection channel 54 is deformed so as to swell outward, the ejection channel 54 may be deformed so as to be recessed inward to increase the pressure applied to the ink during ejection.

[Head chip manufacturing method]
Next, a method for manufacturing the above-described inkjet head 5 will be described. The manufacturing method of the inkjet head 5 of the present embodiment includes a wafer bonded body manufacturing process, a flow path wafer bonding process, a grinding process, a common wiring / individual wiring forming process, a protective wafer manufacturing process, and a protective wafer bonding process. The through electrode forming step, the singulation step, and the spacer plate joining step are mainly included.

<Wafer assembly manufacturing process>
In the wafer bonded body manufacturing process, the actuator wafer 110 (see FIG. 8 and the like) and the cover wafer 111 (see FIG. 14 and the like) are bonded to form a wafer bonded body 112 (see FIG. 14 and the like). The wafer bonded body manufacturing process of this embodiment mainly includes a wafer preparation process, a mask forming process, a dicing line forming process, a common electrode / individual electrode forming process, a removing process, and a bonding process. The wafer bonded body 112 can be manufactured by the same method for each of the head chips 40A and 40B. Therefore, in the following description, a wafer bonded body manufacturing process to be the first head chip 40A will be described.

8 and 9 are process diagrams for explaining the wafer preparation process.
As shown in FIG. 8, in the wafer preparation process, first, two piezoelectric wafers 110a and 110b polarized in the thickness direction (Y direction) are stacked. Thus, a chevron type actuator wafer 110 is formed.
Thereafter, as shown in FIG. 9, the surface of the actuator wafer 110 (one piezoelectric wafer 110a) is ground. In this embodiment, the case where the piezoelectric wafers 110a and 110b having the same thickness are bonded is described. However, the piezoelectric wafers 110a and 110b having different thicknesses may be bonded in advance.

FIG. 10 is a process diagram for explaining the mask formation process.
In FIG. 10, in the mask forming process, a mask 116 used later in the common electrode / individual electrode forming process is formed on the surface of the actuator wafer 110. In the mask formation step, a mask material such as a photosensitive dry film is attached to the surface of the actuator wafer 110. Note that the mask 116 does not necessarily have photosensitivity.

FIG. 11 is a process diagram for explaining a dicing line forming process.
Subsequently, as shown in FIG. 11, a first dicing line 120 to be the discharge channel 54 later is formed by cutting using a dicer (not shown) or the like (first dicing line forming step). Specifically, a dicer is made to enter the actuator wafer 110 from the surface side, and the dicer is made to travel in the Z direction. Thereby, the actuator wafer 110 is cut together with the mask 116. Thereafter, the dicer is made to travel a predetermined amount, and then the dicer is retracted from the actuator wafer 110. Thereby, the first dicing line 120 is formed. Note that the length of the first dicing line 120 in the Z direction (the amount of travel of the dicer) is set to the length of about two discharge channels 54. Then, in the first dicing line forming step, the above-described operation is repeatedly performed with respect to the actuator wafer 110 at intervals in the Z direction and the X direction to form a plurality of first dicing lines 120.

  Next, a second dicing line 121 that will later become the non-ejection channel 55 is formed (second dicing line forming step). Specifically, the dicer is made to enter the portions of the actuator wafer 110 that are located on both sides in the X direction with respect to the first dicing line 120, and the dicer is run over the entire Z direction of the actuator wafer 110. Thereby, the actuator wafer 110 is cut together with the mask 116. In this embodiment, the processing depth by the dicer is uniform over the entire Z direction. The second dicing line 121 is formed so that the groove depth in the Y direction is deeper than that of the first dicing line 120. The groove depth of the second dicing line 121 may be equal to or shallower than that of the first dicing line 120.

FIG. 12 is a process diagram for explaining a common electrode / individual electrode forming process.
Next, as shown in FIG. 12, in the common electrode / individual electrode forming step, an electrode material that will later become the common electrode 61 and the individual electrode 63 is formed on the actuator wafer 110. In the common electrode / individual electrode forming step of this embodiment, the electrodes 61 and 63 are formed by electroless plating. In the common electrode / individual electrode forming step, first, a protective tape 125 is attached to the back surface of the actuator wafer 110. Thereafter, a catalyst is applied to the surface of the actuator wafer 110. Specifically, a sensitizing process is performed in which the actuator wafer 110 is immersed in a stannous chloride aqueous solution and the stannous chloride is adsorbed on the actuator wafer 110. Subsequently, the actuator wafer 110 is lightly washed by water washing or the like. Thereafter, the actuator wafer 110 is immersed in a palladium chloride aqueous solution, and palladium chloride is adsorbed on the surface of the actuator wafer 110. Then, an oxidation-reduction reaction occurs between the palladium chloride adsorbed on the actuator wafer 110 and the stannous chloride adsorbed by the sensitizing process described above, so that metal palladium is deposited as a catalyst (activating). processing). Next, the actuator wafer 110 to which the catalyst (metal palladium) is applied is immersed in a plating solution, so that the plating film 130 is deposited on the portion of the actuator wafer 110 to which the catalyst is applied.

FIG. 13 is a process diagram for explaining the removal process.
As shown in FIG. 13, in the removal step, the mask 116 formed on the surface of the actuator wafer 110 is removed by lift-off or the like. As a result, in the plating film 130, the plating film 130 in the region of the actuator wafer 110 that is not covered with the mask 116 and the protective tape 125 (inner surfaces of the dicing lines 120 and 121) remains on the actuator wafer 110. A portion of the plating film 130 formed on the inner surface of the first dicing line 120 later becomes the common electrode 61. On the other hand, the part formed in the inner surface of the 2nd dicing line 121 among the plating films 130 becomes the individual electrode 63 later.

FIG. 14 is a process diagram for explaining the bonding process.
As shown in FIG. 14, in the bonding process, a cover wafer 111 in which a plurality of first cover plates 52 are continuous in the Z direction is bonded to the surface of the actuator wafer 110. As a result, a wafer bonded body 112 in which the wafers 110 and 111 are laminated is completed.

<Flow path wafer bonding process>
FIG. 15 is a process diagram for explaining the flow path wafer bonding process.
Next, as shown in FIG. 15, in the flow path wafer bonding step, the flow path wafer 131 in which a plurality of flow path plates 41 are continuous in the Z direction and the above-described wafer bonded body 112 are bonded. Specifically, the first main surface of the flow path wafer 131 is attached to the surface of the cover wafer 111 in the wafer bonded body 112 that becomes the first head chip 40A. Thereafter, the surface of the cover wafer 111 in the wafer bonded body 112 to be the second head chip 40B is attached to the second main surface of the flow path wafer 131.

<Grinding process>
16 and 17 are process diagrams for explaining the grinding process. In addition, FIG. 17 is a bottom view corresponding to the XVII arrow of FIG.
Next, as shown in FIGS. 16 and 17, in the grinding step, the actuator wafer 110 in each wafer bonded body 112 is ground from the back surface. At this time, the portion of the first dicing line 120 corresponding to the above-described extending portion 54a passes through the actuator wafer 110, and the entire second dicing line 121 passes through the actuator wafer 110. Grind. Here, in the present embodiment, as described above, in the dicing line forming step, the groove depth of the first dicing line 120 is made smaller than the groove depth of the second dicing line 121. Therefore, it is possible to ensure the strength of the portion of the actuator wafer 110 after the grinding process that connects between the drive walls 56 (see FIG. 5) adjacent in the X direction.

<Common wiring / individual wiring formation process>
FIG. 18 is a process diagram (bottom view corresponding to the arrow XVII in FIG. 16) for explaining the common wiring / individual wiring forming process.
As shown in FIG. 18, in the common wiring / individual wiring forming step, common wiring 62 and individual wiring 64 are formed on the back surface of each actuator wafer 110. Specifically, first, a mask (not shown) having openings for forming the wirings 62 and 64 is disposed on the back surface of each actuator wafer 110. Thereafter, an electrode material is formed on the back surface of the actuator wafer 110 by electroless plating or the like. As a result, an electrode material to be the wirings 62 and 64 is formed on the back surface of the actuator wafer 110 through the opening of the mask. In addition, as a mask, a photosensitive dry film etc. can be used, for example. The common wiring / individual wiring forming step is not limited to plating, and may be performed by vapor deposition.
After completion of the common wiring / individual wiring forming process, the mask is removed from the back surface of the actuator wafer 110.

<Protective wafer manufacturing process>
19 and 20 are process diagrams for explaining a protective wafer manufacturing process. The protective wafer 140 can be manufactured by the same method for each of the head chips 40A and 40B. Therefore, in the following description, a protective wafer manufacturing process to be the first head chip 40A will be described.
As shown in FIG. 19, in the protective wafer manufacturing process, first, lead wires 94 and 97 are formed on the back surface of the protective wafer 140 made of the constituent material of the protective plate 53 (lead wire forming process). Specifically, a mask is formed on the back surface of the protective wafer 140 so that the formation regions of the lead wires 94 and 97 are opened. Thereafter, an electrode material is formed on the back surface of the protective wafer 140 by vapor deposition, electroless plating, or the like. As a result, an electrode material to be the lead wires 94 and 97 is formed on the back surface of the protective wafer 140 through the opening of the mask. In addition, as a mask, a metal mask, a photosensitive dry film, etc. can be used, for example. Further, after completion of the lead wiring formation process, the mask is removed from the back surface of the protective wafer 140.

  As shown in FIG. 20, the common through hole 87 and the individual through hole 89 are formed in the protective wafer 140 (through hole forming step). Specifically, a common through hole 87 is formed in a portion of the protective wafer 140 that overlaps each common wiring 62 when viewed from the Y direction. Further, an individual through-hole 89 is formed in a portion of the protective wafer 140 that overlaps each individual wiring 64 when viewed from the Y direction. Note that the through-hole forming step can be performed using a laser or the like, for example.

<Protective wafer bonding process>
FIG. 21 is a process diagram for explaining the protective wafer bonding process.
Next, in the protective wafer bonding step, the protective wafer 140 is bonded to the back surface of the cover wafer 111 in each wafer bonded body 112. Specifically, the surface of the protective wafer 140 is bonded to the back surface of the cover wafer 111 in a state where the corresponding wirings 62 and 64 and the through holes 87 and 89 are aligned. As a result, the wirings 62 and 64 are exposed through the through holes 87 and 89. After the protective wafer bonding step, the head bonded body 150 in which the wafer bonded body 112, the flow path wafer 131, and the protective wafer 140 are bonded is completed.

<Penetration electrode formation process>
FIG. 22 is a process diagram for explaining the through electrode forming process.
As shown in FIG. 22, in the through electrode forming step, the through electrodes 88 and 90 are formed in the through holes 87 and 89. Specifically, the conductive paste is dried after filling the through holes 87 and 89 with the conductive paste. Thereby, the through electrodes 88 and 90 are formed in the respective through holes 87 and 89. In the protective wafer manufacturing process described above, the through hole forming process may be performed before the lead wiring forming process. In this case, an electrode material is formed on at least the inner peripheral surface of the through holes 87 and 89 in the lead wiring formation process. Therefore, it is possible to omit the through electrode forming step, and to improve the manufacturing efficiency.

<Individualization process>
FIG. 23 is a process diagram for explaining the singulation process.
Subsequently, as shown in FIG. 23, the head assembly 150 is cut for each inkjet head 5 in the singulation process. Specifically, in the head bonded body 150, an intermediate position in the Z direction of each first dicing line 120 formed on the actuator wafer 110 and a portion located between each first dicing line 120 adjacent in the Z direction. On the other hand, the dicer is run in the X direction. As a result, the first dicing line 120 is divided at an intermediate position in the Z direction, and is divided at a portion positioned between the first dicing lines 120 adjacent in the Z direction. Thereby, a plurality of head joined pieces 151 are cut out from one head joined body 150.

<Spacer plate joining process>
Next, the spacer plate 43 and the nozzle plate 44 are joined to the cut out head joining piece 151. Thereafter, the flexible substrate 100 is mounted on the back surface of the protective plate 53.
Thus, the ink jet head 5 of the present embodiment is completed.

Thus, in the inkjet head 5 of this embodiment, the protective plate 53 that covers the channels 54 and 55 is disposed on the back surface of the actuator plate 51.
According to this configuration, the back surface of the actuator plate 51 can be protected, so that the peripheral members are prevented from coming into contact with the back surface opening edges (drive walls 56) of the channels 54 and 55, and the actuator plate 51 is not chipped. Can be suppressed.
Moreover, since it can suppress that a particle approachs into each channel 54 and 55 through the back surface opening part of each channel 54 and 55, it can suppress that a crack generate | occur | produces in the actuator plate 51 resulting from a particle.
As a result, the yield can be improved.

In particular, in the present embodiment, by forming the lead wires 94 and 97 on the back surface of the protection plate 53, a space for forming the lead wire can be ensured as compared with the case where the lead wire is formed on the back surface of the actuator plate 51, for example. Thereby, the freedom degree of a wiring pattern can be improved and wiring formation can be facilitated.
Furthermore, since the wiring length on the actuator plate 51 can be shortened, an increase in capacitance can be suppressed.
Further, unlike the configuration in which the flexible substrate and the lead-out wiring are connected on the surface of the protection plate 53, it is not necessary to project the upper end portion of the protection plate 53 with respect to the actuator plate 51 in order to secure the mounting portion of the flexible substrate. . Thereby, the length of the inkjet head 5 in the Z direction can be shortened, and when a plurality of head joined pieces 151 are cut out from one head joined body 150, the number of wafers taken can be increased.

In the present embodiment, the common wiring 62 that connects the common electrode 61 and the common extraction wiring 97 and the individual wiring 64 that connects the individual electrode 63 and the individual extraction wiring 94 are formed on the back surface of the actuator plate 51, respectively. .
According to this configuration, by forming the common wiring 62 and the individual wiring 64 on the actuator plate 51, it is possible to ensure conduction between the common electrode 61 and the common wiring 62 and conduction between the individual electrode 63 and the individual wiring 64.

  In the present embodiment, the common wiring 62 and the individual wiring 64 are connected through the back surface openings of the channels 54 and 55, so that the number of manufacturing steps can be reduced and simplified as compared with the case where a separate through electrode or the like is provided on the actuator plate 51. Can be achieved.

  In the present embodiment, the protection plate 53 is formed by forming the common through electrode 88 for connecting the common wiring 62 and the common extraction wiring 97 and the individual through electrode 90 for connecting the individual wiring 64 and the individual extraction wiring 94 on the protection plate 53. The electrode can be easily routed around the back surface of the plate 53.

Here, in the present embodiment, the upper wiring pitch of the individual lead-out wiring 94 is set to be smaller than the lower wiring pitch.
According to this configuration, it is possible to use the flexible substrate 100 that is narrower than the chip width (width in the X direction) of the head chips 40A and 40B by aggregating the individual lead-out wirings 94.
In this case, by reducing the width of the flexible substrate 100, the drive IC 101 can be mounted by tape mounting or the like, so that the cost can be reduced compared to a flexible substrate having a wide width (for example, equivalent to the chip width).
Further, by making the flexible substrate 100 narrow, the overall length accuracy of the common electrode wiring and the individual electrode wiring can be improved. As a result, the connection work between the lead wires 94 and 97 and the flexible substrate 100 can be easily performed.

In the present embodiment, since the lead wire groups 95 in which a plurality of individual lead wires 94 are aggregated are arranged at intervals in the X direction, they are connected to the lead wire groups 95 without increasing the chip width. Interference between the flexible substrates 100 can be suppressed.
In addition, an increase in the wiring length can be suppressed and an increase in capacitance can be suppressed as compared with the case where the chip width is increased and the wiring is routed in order to suppress interference between the flexible substrates 100.

  In the present embodiment, since the protection plate 53 is made of a material having a higher thermal conductivity than the actuator plate 51, temperature variations in the actuator plate 51 can be alleviated and the ink temperature can be made uniform. As a result, the ink ejection speed can be made uniform, and the printing stability can be improved.

In this embodiment, the spacer plate 43 having the circulation path 81 is disposed between the actuator plates 51 and 74 and the nozzle plate 44.
According to this configuration, since ink can be circulated between the head chips 40A and 40B and the ink tank 4, it is possible to suppress the retention of bubbles in the vicinity of the nozzle holes 83 and 84.

  And since the printer 1 of this embodiment is equipped with the inkjet head 5 mentioned above, the inexpensive and highly reliable printer 1 can be provided.

  The technical scope of the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit of the present invention.

  For example, in the above-described embodiment, the ink jet printer 1 is described as an example of the liquid ejecting apparatus, but the present invention is not limited to the printer. For example, a fax machine or an on-demand printer may be used.

  In the above-described embodiment, the two-row type inkjet head 5 in which the nozzle holes 83 and 84 are arranged in two rows has been described. However, the present invention is not limited to this. For example, the inkjet head 5 may have three or more rows of nozzle holes, or the inkjet head 5 may have one row of nozzle holes.

In the embodiment described above, the circulation type in which the ink circulates between the inkjet head 5 and the ink tank 4 among the edge shoot types has been described, but the present invention is not limited thereto.
Further, the present invention may be applied to a so-called side shoot type ink jet head that ejects ink from a central portion of the ejection channel in the channel extending direction.
In the above-described embodiment, the configuration in which the channels 54 and 55 penetrate the actuator plate 51 in the Y direction has been described. However, the present invention is not limited to this. In this case, a separate through electrode or the like may be provided, and the common electrode 61 or the individual electrode 63 may be routed around the back surface of the actuator plate 51.

Further, even when each of the channels 54 and 55 penetrates the actuator plate 51 in the Y direction, it does not matter as long as at least a part in the Z direction penetrates. In this case, the individual electrode 63 and the individual wiring 64 may be connected through a portion of the non-ejection channel 55 that penetrates the actuator plate in the Y direction.
In the above-described embodiment, the configuration using the chevron type as the actuator plate has been described, but is not limited thereto. That is, a monopole type (the polarization direction is one direction in the thickness direction) may be used.

In the above-described embodiment, the configuration in which the flexible substrate 100 is separately mounted on the plurality of lead wiring groups 95 has been described. However, the present invention is not limited to this. There may be one lead wire group 95 and one flexible substrate 100 or a plurality other than three.
In the above-described embodiment, the configuration in which the individual lead-out wiring 94 and the aggregated wiring 99 are aggregated has been described, but the present invention is not limited to this.

  In the present embodiment, if the lead wires 94 and 97 are formed on the back surface of the protective plate 53, the conduction between the common electrode 61 and the common lead wire 97, the individual electrode 63 and the individual lead wire 94, and The design of the continuity between can be changed as appropriate. In this case, for example, the following configuration may be adopted.

In the embodiment described above, the case where the common wiring 62 and the individual wiring 64 are formed on the back surface of the actuator plate 51 has been described. However, the common wiring and the individual wiring may be formed on the surface of the protective plate 53.
In the above-described embodiment, the configuration in which the conduction between the common electrode 61 and the common wiring 62 and the conduction between the individual electrode 63 and the individual wiring 64 are performed through the back surface openings of the channels 54 and 55 has been described. I can't. For example, a separate through hole may be provided in the actuator plate 51.
In the above-described embodiment, the configuration in which the common electrode 61 is shared on the protective plate 53 has been described. However, the common electrode 61 may be shared on the actuator plate 51.

  In the above-described embodiment, the configuration in which the lead wires 94 and 97 are drawn upward has been described. However, the configuration is not limited thereto, and a configuration in which the lead wires 94 and 97 are drawn downward may be used.

  In addition, in the range which does not deviate from the meaning of this invention, it is possible to replace suitably the component in the embodiment mentioned above by a known component, and you may combine each modification mentioned above suitably.

DESCRIPTION OF SYMBOLS 1 ... Inkjet printer 2 ... Conveyance means (movement mechanism)
3 ... Conveying means (moving mechanism)
5, 5K, 5C, 5M, 5Y ... Inkjet head (liquid ejecting head)
7. Scanning means (moving mechanism)
41 ... Flow path plate 43 ... Spacer plate 44 ... Nozzle plate (spray plate)
51 ... 1st actuator plate (actuator plate)
52. First cover plate (cover plate)
53 ... 1st protection plate (protection plate)
54 ... Discharge channel (injection channel)
55 ... Non-ejection channel (non-injection channel)
61 ... Common electrode 62 ... Common wiring 63 ... Individual electrode 64 ... Individual wiring 72 ... Slit (liquid supply path)
74 ... Second actuator plate (actuator plate)
75 ... Second cover plate (cover plate)
76 ... Second protection plate (protection plate)
77 ... Inlet channel 78 ... Outlet channel 81 ... First circulation path (circulation path)
82 ... Second circuit (circulation path)
83 ... 1st nozzle hole (injection hole)
84 ... Second nozzle hole (injection hole)
88 ... Common through electrode (connection wiring)
90 ... Individual through electrode (connection wiring)
94 ... Individual lead wiring (connection wiring)
95 ... Lead wiring group 97 ... Common lead wiring (connection wiring)
100: Flexible substrate (external wiring)

Claims (9)

An actuator plate in which injection channels and non-injection channels extending along a first direction are alternately arranged in parallel in a second direction orthogonal to the first direction;
A liquid supply that is stacked on one main surface of the actuator plate in a third direction orthogonal to the first direction and the second direction, closes the ejection channel and the non-ejection channel, and communicates with the ejection channel. A cover plate having a path;
A common electrode formed on the inner surface of the ejection channel;
An individual electrode formed on the inner surface of the non-injection channel;
Among the actuator plates, a protective plate laminated on the other main surface in the third direction;
External wiring mounted on the other main surface of the protective plate;
A liquid ejecting head, comprising: a connection wiring formed on the protection plate and connecting the common electrode, the individual electrode, and the external wiring on the other main surface of the protection plate. An individual wiring formed on the other main surface of the actuator plate and spanning the individual electrodes facing each other in the second direction across the ejection channel;
The liquid ejecting head according to claim 1, further comprising a common wiring formed on the other main surface of the actuator plate and connected to the common electrode. At least a part of the ejection channel and the non-injection channel opens on the other main surface of the actuator plate;
The common wiring is connected to the common electrode through an opening on the other main surface of the actuator plate in the ejection channel;
The liquid ejecting head according to claim 2, wherein the individual wiring is connected to the individual wiring through an opening on the other main surface of the actuator plate in the non-ejection channel. The connection wiring is
Penetrating electrodes that pass through the protective plate in the third direction and are connected to the common electrode and the individual electrodes on one main surface;
The lead wire which is formed on the other main surface of the protection plate and connects between the through electrode and the external wire is provided. The liquid jet head described. The through electrode has a plurality of individual through electrodes arranged at intervals in the second direction corresponding to the individual electrodes,
The lead-out wiring has a plurality of individual lead-out wirings each drawn from the individual through electrode,
The first wiring pitch between the individual lead wires adjacent in the second direction at the connection portion between the individual lead wire and the external wire is the first wiring pitch at the connection portion between the individual lead wire and the individual through electrode. The liquid ejecting head according to claim 4, wherein the liquid ejecting head is smaller than a second wiring pitch between the individual lead wirings adjacent in two directions. The individual lead wirings are arranged in the first wiring pitch at a connecting portion with the external wiring to form a lead wiring group,
A plurality of the lead wiring groups are arranged at intervals in the second direction,
The liquid ejecting head according to claim 5, wherein the external wiring is individually connected to the lead wiring group.   The liquid ejecting head according to claim 1, wherein the protective plate is made of a material having a higher thermal conductivity than the actuator plate. The ejection channel and the non-injection channel open on at least a first surface of the actuator plate in the first direction;
A spacer plate having a circulation path communicating with the ejection channel is disposed on the first surface of the actuator plate.
The first surface of the spacer plate in the first direction is provided with an injection plate having injection holes respectively communicating with the injection channels through the circulation path.
The flow path plate having an inlet flow path communicating with the liquid supply path and an outlet flow path communicating with the circulation path is disposed on the cover plate. The liquid ejecting head according to any one of the above. The liquid jet head according to any one of claims 1 to 8,
A liquid ejecting apparatus comprising: a moving mechanism that relatively moves the liquid ejecting head and the recording medium.

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