JP6868410B2 - Liquid injection head tip, liquid injection head and liquid injection device - Google Patents

Description

The present invention relates to a liquid injection head tip, a liquid injection head and a liquid injection device.

Conventionally, an inkjet printer (liquid injection device) equipped with an inkjet head (liquid injection head) as a device for ejecting droplet-shaped ink onto a recording medium such as recording paper and recording images and characters on the recording medium. There is.
For example, in Patent Document 1, a through hole corresponding to each channel portion is provided in the cover substrate, and an electrode provided on the upper surface of the cover substrate and a drive electrode provided in the drive wall are provided via a conductive member provided in the through hole. The configuration is disclosed.
On the other hand, there is also a configuration in which an ink (liquid) flow path is provided on the cover substrate and a common electrode is formed in the ink flow path.

JP-A-2002-103612

However, if the common electrode is formed in the flow path of the ink, the common electrode may be corroded due to the contact of the ink with the common electrode, and the reliability may be impaired.

The present invention has been made to solve the above problems, and is a liquid injection head tip, a liquid injection head, and a liquid injection device capable of suppressing corrosion of electrodes by a liquid such as ink and improving reliability. The purpose is to provide.

In the (first and second) liquid injection head tips according to one aspect of the present invention, a plurality of injection channels extending along a first direction and a plurality of non-injection channels are orthogonal to the first direction. The actuator plates arranged side by side at intervals in the direction and the first main surface of the actuator plates on the actuator plate side in the third direction orthogonal to the first direction and the second direction are laminated. In the cover plate, a cover plate that closes the plurality of injection channels and the plurality of non-injection channels, a common electrode formed on the inner surface of the injection channel, an individual electrode formed on the inner surface of the non-injection channel, and the cover plate. A connection wiring for connecting the common electrode and the external wiring is provided, and the cover plate has a through hole that penetrates the cover plate in the third direction and is arranged at a place other than the flow path of the liquid. The connecting wiring is formed and is characterized in that the common electrode and the external wiring are connected to each other through the through hole.

According to this configuration, the cover plate penetrates the cover plate in the third direction and is formed with through holes arranged in places other than the liquid flow path, and the connection wiring is a common electrode through the through holes. By connecting the and the external wiring, it is possible to reduce the number of electrodes in a place where there is a possibility of corrosion, as compared with the configuration in which the common electrode is formed in the ink flow path. Therefore, it is possible to suppress corrosion of the electrode by a liquid such as ink and improve reliability. In addition, the choice of electrode metal can be increased as compared with the configuration in which the common electrode is formed in the ink flow path. In addition, it is possible to secure the area of the region where the connection wiring can be formed without being affected by the grooves such as the injection channel and the non-injection channel. In particular, in the configuration in which the injection channel and the non-injection channel are formed on the actuator plate, the channel formation region is likely to be complicated as compared with the configuration in which only the injection channel is formed, so that the strength of the connection portion of various wirings is ensured. However, it is suitable for improving the degree of freedom in layout of various wirings. In addition, since the connection wiring connects the common electrode and the external wiring on the cover plate, the connection wiring is separated from the electrode on the actuator plate side as compared with the configuration in which the connection wiring is arranged on the actuator plate side. , The increase in capacitance can be suppressed.

Here, in particular, in the first liquid injection head tip , the connection wiring is one end surface of the actuator plate in the first direction of the cover plate in a laminated state of the actuator plate and the cover plate. than that is formed in the tail portion extending outward.

According to this configuration, it is possible to secure a large area of the area where the connection wiring can be formed at the tail of the cover plate. Therefore, it becomes easy to improve the degree of freedom in the layout of various wirings while ensuring the strength of the connection portions of the various wirings.

In the liquid injection head tip, the cover plate is formed with a liquid supply path that penetrates the cover plate in the third direction and communicates with the injection channel, and the through hole is other than the liquid supply path. The connection wiring includes an electrode inside the through hole formed on the inner surface of the through hole, and a lead wiring connecting the electrode inside the through hole and the external wiring at the tail of the cover plate. May be provided.

According to this configuration, the common electrode and the external wiring can be electrically connected via the through-hole electrode and the lead wiring at a position avoiding the liquid supply path. Therefore, it is possible to prevent the connection wiring from coming into contact with the liquid such as ink flowing in the liquid supply path.

In the above liquid injection head tip, a portion of the first main surface on the actuator plate side located on one side of the first direction with respect to the injection channel extends from the common electrode and is said to be the first. A plurality of actuator plate-side common pads arranged at intervals in two directions are formed, and among the cover plates, the through holes in the cover plate-side first main surface facing the actuator plate-side first main surface are formed. A plurality of pads extending from the electrodes in the through hole and being arranged at intervals in the second direction, and each of which faces the actuator plate side common pad in the third direction, are arranged on the periphery. May be formed.

According to this configuration, when the actuator plate and the cover plate are joined, the actuator plate side common pad and the cover plate side common pad can be connected, so that the common electrode and the external wiring can be connected to each other via each pad or the like. The connection can be made easily. In addition, the common electrodes formed on the inner surfaces of the plurality of injection channels are conducted from the actuator plate side common pad to the through hole inner electrode via the cover plate side common pad, and the lead wiring connected to the through hole inner electrode is covered. Since it extends to the tail of the plate, the electrode arrangement between the common electrode and the individual electrode can be facilitated.

In the above liquid injection head tip, even if the first main surface on the cover plate side is connected to the plurality of common pads on the cover plate side and a transverse common electrode extending in the second direction is formed. Good.

According to this configuration, a plurality of cover plate side common pads can be connected together by the transverse common electrode, so that there is a case where a plurality of actuator plate side electrodes and a plurality of cover plate side common pads are individually connected. In comparison, the reliability of the electrical connection between the through-hole electrode and the plurality of cover plate side common pads can be improved.

In the liquid injection head tip, a portion of the first main surface on the actuator plate side located on one side of the first direction with respect to the injection channel extends in the second direction and is described as described above. An electrode relief groove facing the transverse common electrode in the third direction may be formed.

According to this configuration, when the actuator plate and the cover plate are joined, the transverse common electrode can be accommodated in the electrode relief groove, so that the electrode on the actuator plate side (for example, an individual electrode) and the transverse common electrode can be separated from each other. It is possible to avoid a short circuit.

In the liquid injection head tip, the through hole may be formed in a slit shape having a length in the extending direction of the cross-sectional common electrode.

According to this configuration, it is easy to increase the formation region of the electrode in the through hole as compared with the case where the through hole is formed in a circular shape, so that the reliability of the electrical connection between the electrode in the through hole and the common transverse electrode is reliable. Can be enhanced. In addition, since it is sufficient to extend the through hole only in the extending direction (second direction) of the transverse common electrode, the length of the liquid injection head tip in the first direction can be shortened.

In the above liquid injection head chip, the lead wiring is at least 3 or more in the second direction on the cover plate side first main surface facing the actuator plate side first main surface in the tail portion of the cover plate. It may be formed by being divided into a plurality of locations and may be provided with a common terminal connected to the external wiring.

According to this configuration, since the common terminal is formed on the cover plate side first main surface of the tail of the cover plate, the external wiring is compared with the case where the common terminal is formed on the cover plate side second main surface. And the common terminal can be easily crimped. In addition, since the common terminal is divided into at least three or more locations in the second direction and formed, the common terminal is formed locally (for example, at both ends in the second direction) as compared with the case where the common terminal is formed locally (for example, at both ends in the second direction). , It is possible to suppress the occurrence of dullness of the drive pulse due to the difference in the nozzle position in the second direction.

In the liquid injection head tip, one end of the tail of the cover plate in the first direction is recessed on the other end side of the cover plate in the first direction and is arranged at intervals in the second direction. The plurality of recesses formed therein may be formed, and the lead-out wiring may connect the electrode in the through hole and the external wiring via the recesses.

According to this configuration, compared with the case where the lead wiring is connected to the through-hole inner electrode and the external wiring through the through-hole (specifically, a through-hole different from the through-hole in which the through-hole inner electrode is formed). Then, since it is sufficient for the cover plate to have a recess forming region smaller than the through hole forming region (specifically, a through hole forming region different from the through hole forming region in which the electrode in the through hole is formed), the liquid injection head The length of the chip in the first direction can be shortened.

Here, in particular, in the second liquid injection head tip , the first main surface on the actuator plate side extends in the second direction at one end of the first direction and has the injection channel in between. The actuator plate side individual wiring for connecting the individual electrodes facing each other is formed, and the first main surface of the cover plate facing the actuator plate side first main surface is formed with the first main surface of the cover plate. The cover plate side individual wiring divided in the second direction is formed at one end in the direction, and the cover plate side individual wiring is a cover plate side individual pad facing the actuator plate side individual wiring in the third direction. , that it has and a separate terminal extending toward one end of the first direction from the cover plate side individual pad.

According to this configuration, when the actuator plate and the cover plate are joined, the individual wiring on the actuator plate side and the individual pad on the cover plate side can be connected to each other. The connection with the external wiring can be easily performed.

The first liquid injection head according to one aspect of the present invention is characterized by including the above-mentioned (first or second) liquid injection head tip.

According to this configuration, in the liquid injection head provided with the above liquid injection head tip, it is possible to suppress corrosion of the electrode by a liquid such as ink and improve reliability. In addition, the choice of electrode metal can be increased as compared with the configuration in which the common electrode is formed in the ink flow path. In addition, it is suitable for improving the degree of freedom in layout of various wirings while ensuring the strength of the connection portions of various wirings. In addition, an increase in capacitance can be suppressed.

The second liquid injection head according to one aspect of the present invention is the side of the cover plate opposite to the first main surface on the cover plate side facing the first main surface on the actuator plate side in the above liquid injection head tip. The second main surface on the cover plate side of the above is provided with a pair of the liquid injection head tips arranged so as to face each other in the third direction, and the cover plate is penetrated in the third direction and communicated with the injection channel. A liquid supply path is formed, a flow path plate is arranged between the pair of the liquid injection head tips, and the flow path plate has an inlet flow communicating with the liquid supply path of the pair of cover plates. characterized that you have road is formed.

According to this configuration, since the first main surface on the cover plate side of each liquid injection head tip is exposed to the outside in the third direction, it is easy to connect the external wiring and the connecting wiring in the two-row type liquid injection head. Can be done.

In the liquid injection head, the plurality of injection channels are opened at the other end surfaces of the actuator plates in the pair of the liquid injection head tips in the first direction, respectively, and the other in the first direction in the pair of actuator plates. An injection plate having an injection hole that communicates with the injection channel is provided on the end side, and the injection channel and the injection are between the pair of actuator plates and the injection plate in the first direction. A feedback plate having a circulation path that communicates with the hole separately may be arranged, and the flow path plate may be formed with an outlet flow path that communicates with the circulation path.

According to this configuration, since the liquid can be circulated between each injection channel and the liquid tank, it is possible to suppress the retention of air bubbles in the vicinity of the injection holes in the injection channel.

The liquid injection device according to one aspect of the present invention includes the above-mentioned (first or second) liquid injection head and a moving mechanism for relatively moving the liquid injection head and the recording medium. It is a feature.

According to this configuration, in the liquid injection device provided with the above liquid injection head, it is possible to suppress corrosion of the electrode by a liquid such as ink and improve reliability. In addition, the choice of electrode metal can be increased as compared with the configuration in which the common electrode is formed in the ink flow path. In addition, it is suitable for improving the degree of freedom in layout of various wirings while ensuring the strength of the connection portions of various wirings. In addition, an increase in capacitance can be suppressed.

According to the present invention, it is possible to provide a liquid injection head tip, a liquid injection head, and a liquid injection device capable of suppressing corrosion of electrodes by a liquid such as ink.

It is a schematic block diagram of the inkjet printer which concerns on embodiment. It is a schematic block diagram of the inkjet head and the ink circulation means which concerns on embodiment. It is an exploded perspective view of the inkjet head which concerns on embodiment. It is sectional drawing of the inkjet head which concerns on embodiment. It is sectional drawing of the inkjet head which concerns on embodiment. It is a figure including the VI-VI cross section of FIG. It is an exploded perspective view of the head tip which concerns on embodiment. It is a perspective view of the cover plate which concerns on embodiment. It is a process drawing for demonstrating the wafer preparation process. It is a process drawing for demonstrating the mask pattern forming process which concerns on embodiment. It is a process drawing for demonstrating the channel formation process which concerns on embodiment. It is a process drawing for demonstrating the channel formation process which concerns on embodiment. It is a process drawing for demonstrating the catalyst application process which concerns on embodiment. It is a process drawing for demonstrating the mask removal process which concerns on embodiment. It is a process drawing for demonstrating the plating process which concerns on embodiment. It is a process drawing for demonstrating the plating film removal process which concerns on embodiment. It is a process drawing (plan view) for demonstrating the cover plate manufacturing process. FIG. 17 is a diagram including a cross section of XVIII-XVIII of FIG. It is a figure for demonstrating the common wiring formation process and individual wiring formation process which concerns on embodiment. It is a figure including the XX-XX cross section of FIG. It is a figure for demonstrating the flow path plate manufacturing process which concerns on embodiment. It is a figure including the cross section of XXII-XXII of FIG. 4, and is the process drawing for demonstrating various plate joining process. It is an exploded perspective view of the head tip which concerns on 1st modification of embodiment. It is sectional drawing of the inkjet head which concerns on the 2nd modification of embodiment.

Hereinafter, embodiments according to the present invention will be described with reference to the drawings. In the embodiment, as an example of a liquid injection device including a liquid injection head including the liquid injection head chip of the present invention (hereinafter, simply referred to as “head chip”), ink (liquid) is used as a recording medium. An inkjet printer for recording (hereinafter, simply referred to as a “printer”) will be described as an example. In the drawings used in the following description, the scale of each member is appropriately changed in order to make each member recognizable.

<Printer>
FIG. 1 is a schematic configuration diagram of the printer 1.
As shown in FIG. 1, the printer 1 of the present embodiment includes a pair of transport means 2 and 3, an ink tank 4, an inkjet head 5 (liquid injection head), an ink circulation means 6, a scanning means 7, and the like. To be equipped. In the following description, an orthogonal coordinate system of X, Y, and Z will be used as necessary. The X direction is the transport direction of the recording medium P (for example, paper). The Y direction is the scanning direction of the scanning means 7. The Z direction is a vertical direction orthogonal to the X direction and the Y direction.

The transport means 2 and 3 transport the recording medium P in the X direction. Specifically, the transporting means 2 includes a grit roller 11 extended in the Y direction, a pinch roller 12 extended in parallel with the grit roller 11, and a drive mechanism (non-existent) such as a motor for axially rotating the grit roller 11. (Illustrated) and. The transport means 3 includes a grit roller 13 extending in the Y direction, a pinch roller 14 extending parallel to the grit roller 13, and a drive mechanism (not shown) for axially rotating the grit roller 13.

A plurality of ink tanks 4 are provided side by side in one direction. In the embodiment, the plurality of ink tanks 4 are ink tanks 4Y, 4M, 4C, and 4K, which contain inks of four colors of yellow, magenta, cyan, and black, respectively. In the embodiment, the ink tanks 4Y, 4M, 4C, and 4K are arranged side by side in the X direction.

As shown in FIG. 2, the ink circulation means 6 circulates ink between the ink tank 4 and the inkjet head 5. Specifically, the ink circulation means 6 includes a circulation flow path 23 having an ink supply pipe 21 and an ink discharge pipe 22, a pressurizing pump 24 connected to the ink supply pipe 21, and suction connected to the ink discharge pipe 22. A pump 25 and the like are provided. For example, the ink supply tube 21 and the ink discharge tube 22 are composed of a flexible hose having flexibility capable of following the operation of the scanning means 7 that supports the inkjet head 5.

The pressurizing pump 24 pressurizes the inside of the ink supply pipe 21 and sends ink to the inkjet head 5 through the ink supply pipe 21. As a result, the ink supply tube 21 side has a positive pressure with respect to the inkjet head 5.
The suction pump 25 decompresses the inside of the ink discharge pipe 22 and sucks ink from the inkjet head 5 through the inside of the ink discharge pipe 22. As a result, the ink discharge tube 22 side has a negative pressure with respect to the inkjet head 5. Then, the ink can be circulated between the inkjet head 5 and the ink tank 4 through the circulation flow path 23 by driving the pressurizing pump 24 and the suction pump 25.

As shown in FIG. 1, the scanning means 7 reciprocates the inkjet head 5 in the Y direction. Specifically, the scanning means 7 moves the pair of guide rails 31 and 32 extending in the Y direction, the carriage 33 movably supported by the pair of guide rails 31 and 32, and the carriage 33 in the Y direction. A drive mechanism 34 for driving is provided. The transporting means 2 and 3 and the scanning means 7 function as a moving mechanism for relatively moving the inkjet head 5 and the recording medium P.

The drive mechanism 34 is arranged between the guide rails 31 and 32 in the X direction. The drive mechanism 34 is a drive that rotationally drives a pair of pulleys 35, 36 arranged at intervals in the Y direction, an endless belt 37 wound between the pair of pulleys 35, 36, and one pulley 35. It includes a motor 38.

The carriage 33 is connected to the endless belt 37. A plurality of inkjet heads 5 are mounted on the carriage 33. In the embodiment, the plurality of inkjet heads 5 are inkjet heads 5Y, 5M, 5C, and 5K that eject inks of four colors of yellow, magenta, cyan, and black, respectively. In the embodiment, the inkjet heads 5Y, 5M, 5C, and 5K are arranged side by side in the Y direction.

<Inkjet head>
As shown in FIG. 3, the inkjet head 5 includes a pair of head tips 40A and 40B, a flow path plate 41, an inlet manifold 42, an outlet manifold (not shown), a feedback plate 43, and a nozzle plate 44 (injection). Plate) and. The inkjet head 5 is a so-called edge shoot type that ejects ink from the tip of the ejection channel 54 in the channel extension direction, and is a circulation type (edge shoot circulation type) that circulates ink with the ink tank 4. Is.

<Head tip>
The pair of head tips 40A and 40B are a first head tip 40A and a second head tip 40B. Hereinafter, the first head tip 40A will be mainly described. In the second head chip 40B, the same components as those of the first head chip 40A are designated by the same reference numerals, and detailed description thereof will be omitted.
The first head tip 40A includes an actuator plate 51 and a cover plate 52.

<Actuator plate>
The outer shape of the actuator plate 51 has a rectangular plate shape having a length in the X direction and a short side in the Z direction. In the embodiment, the actuator plate 51 is a so-called chevron type laminated substrate in which two piezoelectric substrates having different polarization directions in the thickness direction (Y direction) are laminated (see FIG. 6). For example, as the piezoelectric substrate, a ceramic substrate made of PZT (lead zirconate titanate) or the like is preferably used.

A plurality of channels 54 and 55 are formed on the first main surface (first main surface on the actuator plate side) of the actuator plate 51 in the Y direction. In the embodiment, the first main surface on the actuator plate side is the Y-direction inner side surface 51f1 of the actuator plate 51 (hereinafter referred to as "AP-side Y-direction inner side surface 51f1"). Here, the inside in the Y direction means the center side of the inkjet head 5 in the Y direction (the side of the flow path plate 41 in the Y direction). In the embodiment, the second main surface on the actuator plate side is the outer surface of the actuator plate 51 in the Y direction (indicated by reference numeral 51f2 in the drawing).

Each of the channels 54 and 55 is formed in a straight line extending in the Z direction (first direction). The channels 54 and 55 are alternately formed at intervals in the X direction (second direction). Each of the channels 54 and 55 is defined by a drive wall 56 made of an actuator plate 51. One channel 54 is an ejection channel 54 (injection channel) filled with ink. The other channel 55 is a non-ejection channel 55 (non-injection channel) that is not filled with ink.
The upper end of the discharge channel 54 is terminated in the actuator plate 51. The lower end of the discharge channel 54 is opened at the lower end surface of the actuator plate 51.

FIG. 4 is a diagram including a cross section of the discharge channel 54 in the first head tip 40A.
As shown in FIG. 4, the discharge channel 54 has an extending portion 54a located at the lower end portion and a rounded portion 54b extending upward from the extending portion 54a.
The extending portion 54a has a uniform groove depth over the entire Z direction. The groove depth of the cut-up portion 54b gradually becomes shallower toward the upper side.

As shown in FIG. 3, the upper end portion of the non-discharge channel 55 is opened at the upper end surface of the actuator plate 51. The lower end of the non-discharge channel 55 is opened at the lower end surface of the actuator plate 51.

FIG. 5 is a view including a cross section of the non-discharge channel 55 in the first head tip 40A.
As shown in FIG. 5, the non-discharge channel 55 has an extending portion 55a located at the lower end portion and a rounded portion 55b extending upward from the extending portion 55a.
The extending portion 55a has a uniform groove depth over the entire Z direction. The length of the extending portion 55a in the non-discharging channel 55 in the Z direction is longer than the length of the extending portion 54a (see FIG. 4) in the discharging channel 54 in the Z direction. The groove depth of the rounded-up portion 55b gradually becomes shallower toward the upper side. The slope of the rounded-up portion 55b in the non-discharge channel 55 is substantially the same as the slope of the rounded-up portion 54b (see FIG. 4) in the discharge channel 54. That is, in the discharge channel 54 and the non-discharge channel 55, the gradient start positions are different due to the difference in the lengths of the extending portions 54a and 55a in the Z direction, but the gradient itself (inclination, curvature) is substantially the same.

As shown in FIG. 4, a common electrode 61 is formed on the inner surface of the discharge channel 54. The common electrode 61 is formed on the entire inner surface of the discharge channel 54. That is, the common electrode 61 is formed on the entire inner surface of the extending portion 54a and the entire inner surface of the cut-up portion 54b.

Of the actuator plate 51, a portion 51e (hereinafter referred to as "AP side tail portion 51e") located above the discharge channel 54 is located on the inner side surface in the Y direction of the actuator plate side common pad 62 (hereinafter referred to as "AP side common pad"). 62 ") is formed. The AP-side common pad 62 is formed so as to extend from the upper end of the common electrode 61 to the inner side surface of the AP-side tail portion 51e in the Y direction. That is, the lower end of the AP-side common pad 62 is connected to the common electrode 61 in the protruding channel 54. The upper end of the AP-side common pad 62 is terminated on the inner side surface of the AP-side tail portion 51e in the Y direction. The AP side common pad 62 is continuous with the common electrode 61. As shown in FIG. 3, a plurality of AP-side common pads 62 are arranged on the inner side surface of the AP-side tail portion 51e (see FIG. 7) in the Y direction at intervals in the X direction.

As shown in FIG. 5, an individual electrode 63 is formed on the inner surface of the non-discharge channel 55. As shown in FIG. 6, the individual electrodes 63 are separately formed on the inner surfaces of the non-discharge channels 55 facing each other in the X direction. Therefore, among the individual electrodes 63, the individual electrodes 63 facing each other in the same non-discharge channel 55 are electrically separated from each other on the bottom surface of the non-discharge channel 55. The individual electrode 63 is formed over the entire inner surface of the non-discharge channel 55 (the entire Y-direction and Z-direction).

As shown in FIG. 5, an actuator plate side individual wiring 64 (hereinafter referred to as “AP side individual wiring 64”) is formed on the inner side surface of the AP side tail portion 51e in the Y direction. As shown in FIG. 3, in the AP side individual wiring 64, a portion of the inner side surface of the AP side tail portion 51e (see FIG. 7) in the Y direction, which is located above the AP side common pad 62, extends in the X direction. There is. The AP-side individual wiring 64 connects the individual electrodes 63 facing each other with the discharge channel 54 in between.

<Cover plate>
As shown in FIG. 3, the outer shape of the cover plate 52 has a rectangular plate shape having a length in the X direction and a short side in the Z direction. The longitudinal length of the cover plate 52 is substantially the same as the longitudinal length of the actuator plate 51. On the other hand, the length of the cover plate 52 in the lateral direction is longer than the length of the actuator plate 51 in the lateral direction. Of the cover plate 52, the first main surface (first main surface on the cover plate side) facing the inner side surface 51f1 in the Y direction on the AP side is joined to the inner side surface 51f1 in the Y direction on the AP side. In the embodiment, the first main surface on the cover plate side is the outer surface 52f1 in the Y direction of the cover plate 52 (hereinafter referred to as “the outer surface 52f1 in the CP side in the Y direction”). Here, the outside in the Y direction means the side of the inkjet head 5 opposite to the center side in the Y direction (the side opposite to the side of the flow path plate 41 in the Y direction). In the embodiment, the second main surface on the cover plate side is the inner side surface 52f2 in the Y direction of the cover plate 52 (hereinafter referred to as “CP side inner side surface in the Y direction 52f2”).

The cover plate 52 is formed with a liquid supply path 70 that penetrates the cover plate 52 in the Y direction (third direction) and communicates with the discharge channel 54. The liquid supply path 70 communicates with the common ink chamber 71 that opens the cover plate 52 inward in the Y direction, and has a plurality of slits that open outward in the Y direction and are arranged at intervals in the X direction. 72 and. The common ink chamber 71 communicates with each other in each discharge channel 54 through the slit 72. On the other hand, the common ink chamber 71 does not communicate with the non-ejection channel 55.

As shown in FIG. 4, the common ink chamber 71 is formed on the inner side surface 52f2 in the Y direction on the CP side. The common ink chamber 71 is arranged at substantially the same position as the cut-up portion 54b of the ejection channel 54 in the Z direction. The common ink chamber 71 is formed in a groove shape that is recessed toward the outer surface 52f1 side in the Y direction on the CP side and extends in the X direction. Ink flows into the common ink chamber 71 through the flow path plate 41.

The slit 72 is formed on the outer surface 52f1 in the Y direction on the CP side. The slit 72 is arranged at a position facing the common ink chamber 71 in the Y direction. The slit 72 communicates with the common ink chamber 71 and the ejection channel 54. The width of the slit 72 in the X direction is substantially the same as the width of the discharge channel 54 in the X direction.

The cover plate 52 is formed with through holes 85 that penetrate the cover plate 52 in the Y direction and are arranged at locations other than the ink (liquid) flow path. The through hole 85 is arranged in the cover plate 52 at a position avoiding the liquid supply path 70. The through hole 85 is arranged in a portion of the cover plate 52 above the liquid supply path 70. As shown in FIG. 3, a plurality of through holes 85 are arranged at intervals in the X direction. The distance (arrangement pitch) between the two adjacent through holes 85 is substantially equal. The arrangement pitch of the through holes 85 and the arrangement pitch of the slits 72 are substantially equal to each other. Each through hole 85 and each slit 72 are arranged at substantially the same position in the X direction. That is, the through holes 85 and the slits 72 are arranged side by side in the Z direction.

In the cover plate 52, an electrode 86 in the through hole is formed on the inner surface of the through hole 85. For example, the through-hole inner electrode 86 is formed only on the inner peripheral surface of the through-hole 85 by vapor deposition or the like. The through-hole electrode 86 may be filled in the through-hole 85 with a conductive paste or the like.

As shown in FIG. 7, a cover plate side common pad 66 (hereinafter referred to as “CP side common pad 66”) is formed around the through hole 85 on the CP side Y direction outer surface 52f1. As shown in FIG. 4, the CP-side common pad 66 is formed so as to extend downward from the through-hole inner electrode 86 to the lower side of the CP-side Y-direction outer surface 52f1. That is, the upper end of the CP-side common pad 66 is connected to the through-hole electrode 86 in the through-hole 85. The lower end of the CP-side common pad 66 is terminated between the through hole 85 and the slit 72 on the CP-side Y-direction outer surface 52f1 in the Z-direction. The CP-side common pad 66 is continuous with the through-hole electrode 86. On the other hand, the CP-side common pad 66 is separated upward from the upper end of the slit 72. A plurality of CP-side common pads 66 are arranged on the CP-side Y-direction outer surface 52f1 at intervals in the X-direction (see FIG. 7).

The CP side common pad 66 faces the AP side common pad 62 in the Y direction. As shown in FIG. 7, the CP side common pad 66 is arranged at a position corresponding to the AP side common pad 62 when the actuator plate 51 and the cover plate 52 are joined. That is, when the actuator plate 51 and the cover plate 52 are joined, the CP side common pad 66 and the AP side common pad 62 are electrically connected.

As shown in FIG. 4, a common lead-out wiring 67 (lead-out wiring) is formed around the through hole 85 on the inner side surface 52f2 in the Y direction on the CP side. As shown in FIG. 3, at the upper end of the cover plate 52, a plurality of recesses 73 are formed so as to be recessed inward in the Z direction of the cover plate 52 and arranged at intervals in the X direction. FIG. 3 shows four recesses 73 arranged at substantially equal intervals in the X direction.

As shown in FIG. 4, the common lead-out wiring 67 extends upward from the through hole 85 on the inner side surface 52f2 in the Y direction on the CP side on the inner side surface 52f2 in the Y direction on the CP side, and then passes through the recess 73 at the upper end of the cover plate 52. , It is pulled out to the upper end of the outer surface 52f1 in the Y direction on the CP side. In other words, the common lead-out wiring 67 is pulled out to the outer surface in the Y direction of the portion 52e (hereinafter referred to as “CP side tail portion 52e”) of the cover plate 52 located above the actuator plate 51. As a result, the common electrode 61 formed on the inner surface of the plurality of discharge channels 54 passes through the AP side common pad 62, the CP side common pad 66, the through-hole inner electrode 86, and the common lead wiring 67, and is a flexible substrate at the common terminal 68. It is electrically connected to 45 (external wiring). In the embodiment, the common lead-out wiring 67 and the through-hole electrode 86 constitute a connection wiring 60 that connects the common electrode 61 and the flexible substrate 45. Of the connection wiring 60, the common lead wiring 67 is formed by dividing the cover plate 52 into at least three or more locations in the X direction.

A connection common electrode 82 connected to a plurality of common lead wiring 67s is formed on the inner side surface 52f2 in the Y direction on the CP side. As shown in FIG. 3, the connection common electrode 82 extends in the X direction from the inner side surface 52f2 in the Y direction on the CP side between two adjacent common lead wires 67. The connection common electrode 82 is formed in a band shape along the arrangement direction (X direction) of the plurality of through holes 85 on the inner side surface 52f2 in the Y direction on the CP side. The connection common electrode 82 is connected to the lower ends of the plurality of common lead wiring 67 on the inner side surface 52f2 in the Y direction on the CP side. On the other hand, the connection common electrode 82 is separated upward from the upper end of the common ink chamber 71 on the inner side surface 52f2 in the Y direction on the CP side.

As shown in FIG. 7, the common lead-out wiring 67 includes a common terminal 68 formed by dividing the CP side tail portion 52e into at least three or more locations in the X direction on the outer surface in the Y direction. In the embodiment, four common terminals 68 are arranged on the outer surface of the CP side tail portion 52e in the Y direction at intervals in the X direction. The distance between the two adjacent common terminals 68 is substantially equal.

The cover plate 52 is formed with individual wiring 69 on the cover plate side (hereinafter referred to as “individual wiring 69 on the CP side”). The CP-side individual wiring 69 is formed by being divided in the X-direction at the upper end portion of the CP-side Y-direction outer surface 52f1. The CP-side individual wiring 69 is referred to as a cover plate-side individual pad 69a (hereinafter referred to as "CP-side individual pad 69a") arranged at a position corresponding to the AP-side individual wiring 64 when the actuator plate 51 and the cover plate 52 are joined. ), And an individual terminal 69b formed so as to be inclined outward from the CP side individual pad 69a so as to be located outward in the X direction and then extend linearly upward.

That is, when the actuator plate 51 and the cover plate 52 are joined, the CP side individual pad 69a and the AP side individual wiring 64 are electrically connected. A plurality of CP-side individual pads 69a are arranged at intervals in the X direction. The distance (arrangement pitch) between the two adjacent CP-side individual pads 69a is substantially equal. The plurality of CP-side individual pads 69a and the plurality of CP-side common pads 66 face each other on a one-to-one basis in the Z direction. In other words, each CP side individual pad 69a and each CP side common pad 66 are arranged so as to be aligned in a straight line in the Z direction.

The individual terminal 69b extends to the upper end of the outer surface of the CP side tail portion 52e in the Y direction. As a result, the individual electrodes 63 formed on the inner surfaces of the plurality of non-discharge channels 55 are electrically connected to the flexible substrate 45 (see FIG. 5) at the individual terminals 69b via the AP side individual wiring 64 and the CP side individual pad 69a. Be connected.

A plurality of individual terminals 69b are arranged at intervals in the X direction. The distance (arrangement pitch) between the two adjacent individual terminals 69b is substantially equal. The plurality of individual terminals 69b are arranged between the plurality of common terminals 68 (common terminal group) arranged in the X direction. The arrangement pitch of the individual terminals 69b and the arrangement pitch of the common terminals 68 are substantially evenly spaced.

The cover plate 52 is made of a material having an insulating property and a thermal conductivity equal to or higher than that of the actuator plate 51. For example, when the actuator plate 51 is formed of PZT, the cover plate 52 is preferably formed of PZT or silicon. As a result, the temperature variation in the actuator plate 51 can be alleviated and the ink temperature can be made uniform. As a result, the ink ejection speed can be made uniform and the printing stability can be improved.

<Arrangement of a pair of head tips>
As shown in FIG. 3, the head tips 40A and 40B are arranged at intervals in the Y direction with the inner side surfaces 52f2 of the CP side in the Y direction facing each other in the Y direction.

The discharge channel 54 and the non-discharge channel 55 of the second head chip 40B are arranged with a half pitch deviation in the X direction with respect to the arrangement pitch of the discharge channel 54 and the non-discharge channel 55 of the first head chip 40A. That is, the discharge channels 54 and the non-discharge channels 55 of the head tips 40A and 40B are arranged in a staggered pattern.

That is, as shown in FIG. 4, the discharge channel 54 of the first head tip 40A and the non-discharge channel 55 of the second head tip 40B face each other in the Y direction. As shown in FIG. 5, the non-discharge channel 55 of the first head tip 40A and the discharge channel 54 of the second head tip 40B face each other in the Y direction. The pitches of the channels 54 and 55 of the head tips 40A and 40B can be changed as appropriate.

<Flower plate>
The flow path plate 41 is sandwiched between the first head tip 40A and the second head tip 40B in the Y direction. The flow path plate 41 is integrally formed of the same member. As shown in FIG. 3, the outer shape of the flow path plate 41 has a rectangular plate shape having a length in the X direction and a short side in the Z direction. When viewed from the Y direction, the outer shape of the flow path plate 41 is substantially the same as the outer shape of the cover plate 52.

The CP-side inner side surface 52f2 of the first head tip 40A is joined to the first main surface 41f1 (the surface facing the first head tip 40A side) of the flow path plate 41 in the Y direction. The CP-side inner side surface 52f2 of the second head tip 40B is joined to the second main surface 41f2 (the surface facing the second head tip 40B side) of the flow path plate 41 in the Y direction.

The flow path plate 41 is made of a material having an insulating property and a thermal conductivity equal to or higher than that of the cover plate 52. For example, when the cover plate 52 is made of silicon, the flow path plate 41 is preferably made of silicon or carbon. Thereby, the temperature variation in the cover plate 52 can be alleviated between the head tips 40A and 40B. Therefore, the temperature variation in the actuator plate 51 can be alleviated between the head tips 40A and 40B, and the ink temperature can be made uniform. As a result, the ink ejection speed can be made uniform and the printing stability can be improved.

Each main surface 41f1 and 41f2 of the flow path plate 41 is formed with an inlet flow path 74 that communicates with the common ink chamber 71 separately and an outlet flow path 75 that communicates with the circulation path 76 of the return plate 43 separately. ing.

Each inlet flow path 74 is recessed inward in the Y direction from each main surface 41f1, 41f2 of the flow path plate 41. One end of each inlet flow path 74 in the X direction is opened at one end surface of the flow path plate 41 in the X direction. Each inlet flow path 74 is inclined so as to be located downward from one end surface in the X direction of the flow path plate 41 toward the other end side in the X direction, and then bends toward the other end side in the X direction to form a straight line. It is extending. As shown in FIG. 4, the Z-direction width of the inlet flow path 74 is larger than the Z-direction width of the common ink chamber 71. The width of the inlet flow path 74 in the Z direction may be equal to or less than the width of the common ink chamber 71 in the Z direction.

The inlet flow paths 74 are arranged at intervals in the Y direction between the first head chip 40A and the second head chip 40B in the Y direction. That is, in the flow path plate 41, the portion of each inlet flow path 74 between the Y directions is partitioned by a wall member. As a result, the pressure fluctuation in the channel generated at the time of ink ejection or the like is blocked by the wall member, so that the pressure fluctuation becomes a pressure wave to other channels or the like via the flow path between the head tips 40A and 40B. It is possible to suppress so-called crosstalk that is propagated. Therefore, excellent ejection performance (printing stability) can be obtained.

As shown in FIG. 3, the outlet flow path 75 is recessed inward in the Y direction from the main surfaces 41f1 and 41f2 of the flow path plate 41, and is recessed upward from the lower end surface of the flow path plate 41. .. One end of each outlet flow path 75 is open at the other end surface of the flow path plate 41 in the X direction. Each outlet flow path 75 bends downward from the other end surface of the flow path plate 41 in the X direction in a crank shape, and then extends linearly toward one end side in the X direction. As shown in FIG. 4, the Z-direction width of the outlet flow path 75 is smaller than the Z-direction width of the inlet flow path 74. The depth of the outlet flow path 75 in the Y direction is substantially the same as the depth of the inlet flow path 74 in the Y direction.
The outlet flow path 75 is connected to an outlet manifold (not shown) on the other end surface of the flow path plate 41 in the X direction. The outlet manifold is connected to the ink discharge pipe 22 (see FIG. 1).

The outlet flow paths 75 are arranged at intervals in the Y direction between the first head chip 40A and the second head chip 40B in the Y direction. That is, in the flow path plate 41, the portion of each outlet flow path 75 between the Y directions is partitioned by a wall member. As a result, the pressure fluctuation in the channel generated at the time of ink ejection or the like is blocked by the wall member, so that the pressure fluctuation becomes a pressure wave to other channels or the like via the flow path between the head tips 40A and 40B. It is possible to suppress so-called crosstalk that is propagated. Therefore, excellent ejection performance (printing stability) can be obtained.

In the cross-sectional view of FIG. 4, the inlet flow path 74 and the outlet flow path 75 are not formed in the portion of the flow path plate 41 that overlaps the CP side tail portion 52e in the Y direction. That is, the portion of the flow path plate 41 that overlaps the CP side tail portion 52e in the Y direction is a solid member. As a result, as compared with the case where the portion of the flow path plate 41 that overlaps the CP side tail portion 52e in the Y direction is a hollow member, when the flow path plate 41 and the cover plate 52 are connected, the member escapes at the time of connection. It is possible to avoid crimping defects due to.

<Inlet manifold>
As shown in FIG. 3, the inlet manifold 42 is collectively joined to one end surface of each of the head tips 40A and 40B and the flow path plate 41 in the X direction. The inlet manifold 42 is formed with a supply path 77 that communicates with each inlet flow path 74. The supply path 77 is recessed from the inner end surface of the inlet manifold 42 in the X direction toward the outside in the X direction. The supply path 77 communicates with each inlet flow path 74 collectively. The inlet manifold 42 is connected to the ink supply pipe 21 (see FIG. 1).

<Return plate>
The outer shape of the return plate 43 has a rectangular plate shape having a length in the X direction and a short side in the Y direction. The return plate 43 is collectively joined to the lower end surfaces of the head tips 40A and 40B and the flow path plate 41. In other words, the feedback plate 43 is arranged on the open end side of the discharge channel 54 in the first head tip 40A and the second head tip 40B. The return plate 43 is a spacer plate interposed between the open end of the discharge channel 54 in the first head tip 40A and the second head tip 40B and the upper end of the nozzle plate 44. The return plate 43 is formed with a plurality of circulation paths 76 connecting between the discharge channels 54 of the head tips 40A and 40B and the outlet flow paths 75. The plurality of circulation paths 76 include a first circulation path 76a and a second circulation path 76b. The plurality of circulation paths 76 penetrate the return plate 43 in the Z direction.

As shown in FIG. 4, the first circulation path 76a is formed at substantially the same position in the X direction as the discharge channel 54 of the first head tip 40A. A plurality of first circulation paths 76a are formed at intervals in the X direction corresponding to the arrangement pitch of the discharge channels 54 of the first head chip 40A.

The first circulation path 76a extends in the Y direction. The inner end portion of the first circulation path 76a in the Y direction is located inside the first head chip 40A in the Y direction with respect to the inner side surface 52f2 in the CP side in the Y direction. The inner end of the first circulation path 76a in the Y direction communicates with the outlet flow path 75. The outer ends of the first circulation path 76a in the Y direction communicate with each other in the discharge channel 54 of the first head tip 40A.

Hereinafter, the cross-sectional area of the discharge channel 54 of the first head chip 40A when the portion facing the feedback plate 43 is cut on a plane orthogonal to the ink flow direction is referred to as a “channel-side flow path cross-sectional area”. Here, the portion of the discharge channel 54 of the first head chip 40A that faces the feedback plate 43 means a portion (boundary portion) where the discharge channel 54 and the first circulation path 76a are in contact with each other. That is, the channel-side flow path cross-sectional area means the opening area at the downstream end of the ejection channel 54 of the first head chip 40A in the ink flow direction.
Hereinafter, the cross-sectional area when the first circulation path 76a is cut on a plane orthogonal to the ink flow direction is referred to as a “circulation path side flow path cross-sectional area”. That is, the cross-sectional area of the flow path on the circulation path side means the cross-sectional area when the first circulation path 76 is cut at a plane orthogonal to its own extending direction.
In the embodiment, the circulation path side flow path cross-sectional area is smaller than the channel side flow path cross-sectional area. As a result, as compared with the case where the cross-sectional area of the flow path on the circulation path side is larger than the cross-sectional area of the flow path on the channel side, the pressure fluctuation in the channel generated at the time of ink ejection or the like is a pressure wave to other channels or the like through the flow path. It is possible to suppress the so-called crosstalk that is propagated as a result. Therefore, excellent ejection performance (printing stability) can be obtained.

As shown in FIG. 5, the second circulation path 76b is formed at substantially the same position in the X direction as the discharge channel 54 of the second head tip 40B. A plurality of second circulation paths 76b are formed at intervals in the X direction corresponding to the arrangement pitch of the discharge channels 54 of the second head chip 40B.

The second circulation path 76b extends in the Y direction. The inner end portion of the second circulation path 76b in the Y direction is located inside the second head chip 40B in the Y direction with respect to the inner side surface 52f2 in the CP side in the Y direction. The inner end of the second circulation path 76b in the Y direction communicates with the outlet flow path 75. The outer ends of the second circulation path 76b in the Y direction communicate with each other separately in the discharge channel 54 of the second head tip 40B.

<Nozzle plate>
As shown in FIG. 3, the outer shape of the nozzle plate 44 has a rectangular plate shape having a length in the X direction and a short side in the Y direction. The outer shape of the nozzle plate 44 is substantially the same as the outer shape of the return plate 43. The nozzle plate 44 is joined to the lower end surface of the return plate 43. A plurality of nozzle holes 78 (injection holes) penetrating the nozzle plate 44 in the Z direction are arranged in the nozzle plate 44. The plurality of nozzle holes 78 include a first nozzle hole 78a and a second nozzle hole 78b. The plurality of nozzle holes 78 penetrate the nozzle plate 44 in the Z direction.

As shown in FIG. 4, the first nozzle hole 78a is formed in a portion of the nozzle plate 44 that faces each first circulation path 76a of the return plate 43 in the Z direction. That is, the first nozzle holes 78a are arranged in a straight line at the same pitch as the first circulation path 76a and at intervals in the X direction. The first nozzle hole 78a communicates with the inside of the first circulation path 76a at the outer end portion of the first circulation path 76a in the Y direction. As a result, each of the first nozzle holes 78a communicates with the corresponding discharge channel 54 of the first head tip 40A via the first circulation path 76a.

As shown in FIG. 5, the second nozzle hole 78b is formed in a portion of the nozzle plate 44 that faces each second circulation path 76b of the return plate 43 in the Z direction. That is, the second nozzle holes 78b are arranged in a straight line at the same pitch as the second circulation path 76b and at intervals in the X direction. The second nozzle hole 78b communicates with the inside of the second circulation path 76b at the outer end portion of the second circulation path 76b in the Y direction. As a result, each of the second nozzle holes 78b communicates with the corresponding discharge channel 54 of the second head tip 40B via the second circulation path 76b.
On the other hand, each non-discharge channel 55 does not communicate with the nozzle holes 78a and 78b, and is covered from below by the return plate 43.

<How to operate the printer>
Next, an operation method of the printer 1 when recording characters, figures, and the like on the recording medium P by using the printer 1 will be described.
As an initial state, it is assumed that the four ink tanks 4 shown in FIG. 1 are sufficiently filled with inks of different colors. Further, the ink in the ink tank 4 is filled in the inkjet head 5 via the ink circulation means 6.

As shown in FIG. 1, when the printer 1 is operated under the initial state, the grit rollers 11 and 13 of the conveying means 2 and 3 rotate, and between these grit rollers 11 and 13 and the pinch rollers 12 and 14. The recording medium P is conveyed in the conveying direction (X direction). Further, at the same time as the recording medium P is conveyed, the drive motor 38 rotates the pulleys 35 and 36 to move the endless belt 37. As a result, the carriage 33 reciprocates in the Y direction while being guided by the guide rails 31 and 32.
Then, during the reciprocating movement of the carriage 33, characters, images, and the like can be recorded on the recording medium P by appropriately ejecting inks of four colors from each inkjet head 5 onto the recording medium P.

Here, the movement of each inkjet head 5 will be described.
Among the edge shoot types as in the present embodiment, in the vertical circulation type inkjet head 5, ink is circulated in the circulation flow path 23 by first operating the pressurizing pump 24 and the suction pump 25 shown in FIG. .. In this case, the ink flowing through the ink supply pipe 21 passes through the supply path 77 of the inlet manifold 42 shown in FIG. 3 and flows into each inlet flow path 74 of the flow path plate 41. The ink that has flowed into each inlet flow path 74 passes through each common ink chamber 71 and is then supplied into each discharge channel 54 through a slit 72. The ink that has flowed into each discharge channel 54 collects in the outlet flow path 75 through the circulation path 76 of the return plate 43, and is then discharged to the ink discharge pipe 22 shown in FIG. 2 through an outlet manifold (not shown). The ink discharged to the ink discharge tube 22 is returned to the ink tank 4 and then supplied to the ink supply tube 21 again. As a result, ink is circulated between the inkjet head 5 and the ink tank 4.

Then, when the reciprocating movement is started by the carriage 33 (see FIG. 1), a driving voltage is applied to the electrodes 61 and 63 via the flexible substrate 45. At this time, a drive voltage is applied between the electrodes 61 and 63 with the individual electrode 63 as the drive potential Vdd and the common electrode 61 as the reference potential GND. Then, the two drive walls 56 that define the discharge channel 54 are deformed by thickness slip, and these two drive walls 56 are deformed so as to project toward the non-discharge channel 55. That is, since the actuator plate 51 of the present embodiment is laminated with two piezoelectric substrates polarized in the thickness direction (Y direction), by applying a drive voltage, the actuator plate 51 in the drive wall 56 can be in the Y direction. It bends and deforms in a V shape around the intermediate position. As a result, the discharge channel 54 is deformed as if it were inflated.

When the volume of the ejection channel 54 increases due to the deformation of the two drive walls 56, the ink in the common ink chamber 71 is guided into the ejection channel 54 through the slit 72. Then, the ink induced inside the ejection channel 54 becomes a pressure wave and propagates inside the ejection channel 54, and is applied between the electrodes 61 and 63 at the timing when the pressure wave reaches the nozzle hole 78. Set the drive voltage to zero.
As a result, the drive wall 56 is restored, and the once increased volume of the discharge channel 54 returns to the original volume. By this operation, the pressure inside the ejection channel 54 increases, and the ink is pressurized. As a result, the ink can be ejected from the nozzle hole 78. At this time, when the ink passes through the nozzle hole 78, it is ejected as droplet-shaped ink droplets. As a result, characters, images, and the like can be recorded on the recording medium P as described above.

The operation method of the inkjet head 5 is not limited to the above-mentioned contents. For example, the drive wall 56 in the normal state may be deformed inward of the discharge channel 54 so that the discharge channel 54 is recessed inward. In this case, it can be realized by setting the voltage applied between the electrodes 61 and 63 to a voltage that is positive or negative opposite to the voltage described above, or by reversing the polarization direction of the actuator plate 51 without changing the positive or negative voltage. is there. Further, after the ejection channel 54 is deformed so as to bulge outward, the ejection channel 54 may be deformed so as to dent inward to increase the pressing force of the ink at the time of ejection.

<Manufacturing method of inkjet head>
Next, a method of manufacturing the inkjet head 5 will be described. The method for manufacturing the inkjet head 5 of the present embodiment includes a head chip manufacturing step, a flow path plate manufacturing step, various plate joining steps, and a joining step such as a feedback plate. The head chip manufacturing step can be performed by the same method for each of the head chips 40A and 40B. Therefore, in the following description, the head chip manufacturing process in the first head chip 40A will be described.

<Head tip manufacturing process>
The head chip manufacturing step of the embodiment includes a wafer preparation step, a mask pattern forming step, a channel forming step, and an electrode forming step as steps on the actuator plate side.

As shown in FIG. 9, in the wafer preparation step, first, two piezoelectric wafers 110a and 110b polarized in the thickness direction (Y direction) are laminated with their polarization directions reversed. As a result, the chevron type actuator wafer 110 is formed.
Then, the surface of the actuator wafer 110 (one piezoelectric wafer 110a) is ground. In the present embodiment, the case where the piezoelectric wafers 110a and 110b having the same thickness are bonded together has been described, but the piezoelectric wafers 110a and 110b having different thicknesses may be bonded in advance.

As shown in FIG. 10, in the mask pattern forming step, the mask pattern 111 used in the electrode forming step is formed. Specifically, after the mounting tape 112 is attached to the back surface of the actuator wafer 110, a mask material such as a photosensitive dry film is attached to the front surface of the actuator wafer 110. Then, by patterning the mask material using a photolithography technique, the partial mask material located in the formation region of the AP-side common pad 62 and the AP-side individual wiring 64 (see FIG. 7) described above is removed from the mask material. .. As a result, a mask pattern 111 is formed on the surface of the actuator wafer 110 so that at least the formation regions of the AP-side common pad 62 and the AP-side individual wiring 64 are opened. In this case, the mask pattern 111 covers the portion of the actuator wafer 110 other than the formation region of the AP-side common pad 62 and the AP-side individual wiring 64. The mask material may be formed on the surface of the actuator wafer 110 by coating or the like.

As shown in FIG. 11, in the channel forming step, the surface of the actuator wafer 110 is cut by a dicing blade or the like (not shown). Specifically, as shown in FIG. 12, a plurality of channels 54 and 55 are formed on the surface of the actuator wafer 110 so as to be arranged in parallel at intervals in the X direction. In this case, on the surface of the actuator wafer 110, the formation regions of the channels 54 and 55 are cut together with the mask pattern 111 described above.

In the mask pattern forming step and the channel forming step described above, the order of the steps may be reversed as long as the mask pattern 111 can be formed into a desired shape. Further, in the mask pattern forming step described above, the mask material at the portion located in the forming region of the discharge channel 54 and the non-discharge channel 55 may be removed in advance.

The electrode forming step includes a degreasing step, an etching step, a lead removing step, a catalyst applying step, a mask removing step, a plating step, and a plating film removing step.
In the degreasing step, dirt such as oil and fat adhering to the actuator wafer 110 is removed.
In the etching step, the actuator wafer 110 is etched with an ammonium fluoride solution or the like. As a result, the adhesion between the plating film formed in the plating process and the actuator wafer 110 is improved.
In the lead removal step, when the actuator wafer 110 is formed by PZT, lead on the surface of the actuator wafer 110 is removed. As a result, the effect of suppressing the catalyst of lead on the surface of the actuator wafer 110 is suppressed.

For example, the catalyst application step is performed by the sensitizer activator method. As shown in FIG. 13, in the sensitizer activator method, first, a sensitizing treatment is performed in which the actuator wafer 110 is adsorbed with the first tin chloride by immersing it in an aqueous solution of the first tin chloride. Subsequently, the actuator wafer 110 is lightly washed by washing with water or the like. Then, the actuator wafer 110 is immersed in an aqueous solution of palladium chloride to adsorb palladium chloride on the actuator wafer 110. Then, a redox reaction occurs between the palladium chloride adsorbed on the actuator wafer 110 and the stannous chloride adsorbed by the sensitizing treatment described above, so that metallic palladium is precipitated as the catalyst 113 (activator). Ting process). The catalyst application step may be performed a plurality of times.
The catalyst application step may be performed by a method other than the above-mentioned sensitizer / activator method. For example, the catalyst application step may be performed by the catalyst accelerator method. In the catalyst accelerator method, the actuator wafer 110 is immersed in a colloidal solution of tin and palladium. Subsequently, the actuator wafer 110 is immersed in an acidic solution (for example, a hydrochloric acid solution) to activate it, and metallic palladium is deposited on the surface of the actuator wafer 110.

Next, as shown in FIG. 14, in the mask removing step, the mask pattern 111 formed on the surface of the actuator wafer 110 is removed by lift-off or the like. The portion of the catalyst 113 provided on the mask pattern 111 is removed together with the mask pattern 111. That is, in the present embodiment, only the portion of the actuator wafer 110 exposed from the mask pattern 111 (the inner surface of each channel 54, 55, the formation region of the AP side common pad 62, the AP side individual wiring 64, etc.) The catalyst 113 remains. The mask removing step may be performed after the plating step.

As shown in FIG. 15, in the plating step, the actuator wafer 110 is immersed in the plating solution. Then, the metal film 114 is deposited on the portion of the actuator wafer 110 to which the catalyst 113 is applied. As the electrode metal used in the plating step, for example, Ni (nickel), Co (cobalt), Cu (copper), Au (gold) and the like are preferable, and Ni is particularly preferable.

As shown in FIG. 16, in the plating film removing step, a portion of the metal film 114 (see FIG. 15) located on the bottom surface of the non-ejection channel 55 is removed. Specifically, the laser beam L is scanned in the Z direction while the laser beam L is irradiated toward the bottom surface of the non-ejection channel 55. Then, the portion of the metal coating 114 (see FIG. 15) irradiated with the laser beam L is selectively removed. As a result, the metal coating 114 (see FIG. 15) is separated at the bottom surface of the non-discharge channel 55. As a result, the common electrode 61 and the individual electrode 63 are formed on the inner surfaces of the channels 54 and 55 of the actuator wafer 110, respectively. Further, on the surface of the actuator wafer 110, an AP-side common pad 62 and an AP-side individual wiring 64 (see FIG. 7) connected to the corresponding common electrode 61 and the individual electrode 63 are formed.
A dicer may be used instead of the laser beam L. Further, in the plating film removing step, the portion of the metal film 114 located on the bottom surface of the non-ejection channel 55 is not limited to being removed. For example, in the catalyst removing step, the portion of the catalyst 113 located on the bottom surface of the non-discharge channel 55 may be removed. Specifically, in the catalyst removing step, the laser beam L is scanned in the Z direction while the laser beam L is irradiated toward the bottom surface of the non-ejection channel 55, and the portion of the catalyst 113 irradiated with the laser beam L is scanned. May be selectively removed.
After that, the mounting tape 112 is peeled off, and the actuator wafer 110 is separated into individual pieces using a dicer or the like to complete the actuator plate 51 (see FIG. 5) described above.

The head chip manufacturing step of the embodiment includes a common ink chamber forming step, a slit forming step, a through hole forming step, a recess forming step, and an electrode / wiring forming step as a step on the cover plate side.

As shown in FIG. 17, in the common ink chamber forming step, the cover wafer 120 is sandblasted or the like from the surface side through a mask (not shown) to form the common ink chamber 71.
Subsequently, as shown in FIG. 18, in the slit forming step, sandblasting or the like is performed on the cover wafer 120 from the back surface side through a mask (not shown) to form slits 72 that communicate with each other in the common ink chamber 71.

In the through hole forming step, as shown in FIG. 17, sandblasting or the like is performed on the cover wafer 120 from the surface side through a mask (not shown) to form the surface side through hole 85a. The step of forming the surface-side penetrating recess 85a may be performed in the same step as the step of forming the common ink chamber.
Subsequently, as shown in FIG. 18, in the through hole forming step, sandblasting or the like is performed on the cover wafer 120 from the back surface side through a mask (not shown), and the back surface side through recesses 85b communicate with each other in the front surface side through recesses 85a. To form. By communicating the front surface side through recess 85a and the back surface side through recess 85b in this way, the through hole 85 is formed in the cover wafer 120. The step of forming the back surface side through recess 85b may be performed in the same step as the slit forming step.

In the recess forming step, as shown in FIG. 17, sandblasting or the like is performed on the cover wafer 120 from the front surface side or the back surface side through a mask (not shown) to form a slit 121 for forming the recess 73 (see FIG. 7). .. After that, the cover wafer 120 is fragmented along the axis of the slit 121 using a dicer or the like to form a recess 73 with respect to the cover wafer 120. As a result, the cover plate 52 (see FIG. 3) in which the recess 73 is formed is completed.
The common ink chamber forming step, the slit forming step, the through hole forming step, and the recess forming step are not limited to sandblasting, and may be performed by dicing, cutting, or the like.

Next, as shown in FIG. 19, in the electrode / wiring forming step, the cover plate 52 has a through-hole electrode 86, a CP-side common pad 66, a common lead-out wiring 67, a connection common electrode 82 (see FIG. 20), and a CP. Various electrodes and wiring such as side individual wiring 69 are formed.
Specifically, in the electrode / wiring forming step, as shown in FIG. 20, first, the entire surface of the cover plate 52 (including the front surface, the back surface and the upper end surface, the forming surface of the recess 73, and the forming surface of the through hole 85). , Various electrodes and various wirings (through hole electrode 86, CP side common pad 66, common lead wiring 67, connection common electrode 82 and CP side individual wiring 69) are arranged with a mask (not shown) that opens. After that, an electrode material is formed on the entire surface of the cover plate 52 by electroless plating or the like. As a result, various electrodes and electrode materials serving as various wirings are formed on the entire surface of the cover plate 52 through the opening of the mask. As the mask, for example, a photosensitive dry film or the like can be used. Further, the electrode / wiring forming step is not limited to plating, and may be performed by vapor deposition or the like. Further, in the step of forming the through-hole electrode 86, the through-hole electrode 86 may be formed by filling the through-hole 85 with a conductive paste or the like.
After the electrode / wiring forming process is completed, the mask is removed from the entire surface of the cover plate 52.

Then, each actuator plate 51 and each cover plate 52 are joined to each other to manufacture head tips 40A and 40B. Specifically, the inner side surface 51f1 in the Y direction on each AP side is attached to the outer surface 52f1 in the Y direction on each CP side.

<Flower plate manufacturing process>
The flow path plate manufacturing step of the embodiment includes a flow path forming step and an individualization step.
As shown in FIG. 21, in the flow path forming step (surface side flow path forming step), first, sandblasting or the like is performed on the flow path wafer 130 from the surface side through a mask (not shown), and then the inlet flow path 74 and the outlet flow path 75 are performed. To form.

In addition, in the flow path forming step (back surface side flow path forming step), sandblasting or the like is performed on the flow path wafer 130 from the back surface side through a mask (not shown) to form the inlet flow path 74 and the outlet flow path 75. Each step of the flow path forming step is not limited to sandblasting, and may be performed by dicing, cutting, or the like.

After that, in the individualization step, the flow path wafer 130 is individualized along the axis (virtual line D) of the straight line portion in the X direction in the outlet flow path 75 using a dicer or the like. As a result, the flow path plate 41 (see FIG. 3) is completed.

<Various plate joining processes>
Next, as shown in FIG. 22, in various plate joining steps, the cover plate 52 and the flow path plate 41 of the head tips 40A and 40B are joined. Specifically, the Y-direction outer surfaces (each main surface 41f1, 41f2) of the flow path plate 41 are attached to the CP-side Y-direction inner side surfaces 52f2 of the head tips 40A and 40B.
As a result, the plate joint 5A is produced.
The chips may be divided (individualized) after all the plates are bonded together in a wafer state.

<Joining process for feedback plates, etc.>
Next, the feedback plate 43 and the nozzle plate 44 are joined to the plate joint 5A. After that, the flexible substrate 45 (see FIG. 4) is mounted on the CP side tail portion 52e.
As described above, the inkjet head 5 of the present embodiment is completed.

As described above, in the head tips 40A and 40B according to the present embodiment, a plurality of discharge channels 54 and a plurality of non-discharge channels 55 extending along the Z direction are alternately arranged side by side at intervals in the X direction. A common electrode 61 formed on the inner surface of the discharge channel 54, the cover plate 52 which is laminated on the inner side surface 51f1 in the Y direction on the AP side and closes the plurality of discharge channels 54 and the plurality of non-discharge channels 55. The cover plate 52 includes an individual electrode 63 formed on the inner surface of the non-discharge channel 55, and a connection wiring 60 for connecting the common electrode 61 and the flexible substrate 45 in the cover plate 52. The cover plate 52 includes the cover plate 52. A through hole 85 is formed at a location other than the ink flow path, and the connection wiring 60 connects the common electrode 61 and the flexible substrate 45 via the through hole 85. It is characterized by that.

According to the present embodiment, the cover plate 52 penetrates the cover plate 52 in the Y direction, and through holes 85 are formed at locations other than the ink flow path, and the connection wiring 60 has the through holes 85. By connecting the common electrode 61 and the flexible substrate 45 via the above, it is possible to reduce the number of electrodes in places where there is a possibility of corrosion as compared with the configuration in which the common electrode 61 is formed in the ink flow path. .. Therefore, it is possible to suppress corrosion of the electrode by a liquid such as ink and improve reliability. In addition, the choice of electrode metal can be increased as compared with the configuration in which the common electrode 61 is formed in the ink flow path. For example, a metal (for example, copper, silver, etc.) that is corroded by a liquid such as ink can be used for the connection wiring 60 (electrode). In addition, the area of the region where the connection wiring 60 can be formed can be secured without being affected by the grooves such as the discharge channel 54 and the non-discharge channel 55. In particular, in the configuration in which the discharge channel 54 and the non-discharge channel 55 are formed on the actuator plate 51, the channel formation region is likely to be complicated as compared with the configuration in which only the injection channel is formed. It is suitable for improving the degree of freedom in layout of various wirings while ensuring strength. In addition, since the connection wiring 60 connects the common electrode 61 and the flexible substrate 45 on the cover plate 52, the connection wiring 60 is made into an actuator as compared with the configuration in which the connection wiring 60 is arranged on the actuator plate 51 side. It can be separated from the electrode on the plate 51 side to suppress an increase in capacitance.

Further, in the present embodiment, the connection wiring 60 is formed on the CP side tail portion 52e in a laminated state of the actuator plate 51 and the cover plate 52.

According to the present embodiment, it is possible to secure a wide area in the area where the connection wiring 60 can be formed in the CP side tail portion 52e. Therefore, it becomes easy to improve the degree of freedom in the layout of various wirings while ensuring the strength of the connection portions of various wirings.

Further, in the present embodiment, the cover plate 52 is formed with a liquid supply path 70 that penetrates the cover plate 52 in the Y direction and communicates with the discharge channel 54, and the through hole 85 is a portion other than the liquid supply path 70. The connection wiring 60 connects the through-hole inner electrode 86 formed on the inner surface of the through-hole 85 and the common lead-out wiring 67 that connects the through-hole inner electrode 86 and the flexible substrate 45 at the CP side tail 52e. Be prepared.

According to the present embodiment, the common electrode 61 and the flexible substrate 45 can be electrically connected to each other via the through-hole electrode 86 and the common lead-out wiring 67 at a position avoiding the liquid supply path 70. Therefore, it is possible to prevent the connection wiring 60 from coming into contact with the liquid such as ink flowing in the liquid supply path 70.

Further, in the present embodiment, a plurality of AP-side common pads 62 extending from the common electrode 61 and arranged at intervals in the X-direction are formed on the inner side surface of the AP-side tail 51e in the Y-direction, and the CP is formed. Around the through hole 85 on the outer surface 52f1 in the Y direction on the side, a plurality of electrodes extend from the electrode 86 in the through hole and are arranged at intervals in the X direction, and each of them faces the common pad 62 on the AP side in the Y direction. A common pad 66 on the CP side is formed.

According to the present embodiment, when the actuator plate 51 and the cover plate 52 are joined, the AP side common pad 62 and the CP side common pad 66 can be connected, so that they are common via the pads 62, 66 and the like. The electrode 61 and the flexible substrate 45 can be easily connected. In addition, the common electrode 61 formed on the inner surface of the plurality of discharge channels 54 is conducted from the AP side common pad 62 to the through hole inner electrode 86 via the CP side common pad 66 and is connected to the through hole inner electrode 86. Since the lead-out wiring 67 extends to the CP side tail portion 52e, the electrode arrangement between the common electrode 61 and the individual electrode 63 can be facilitated.

Further, in the present embodiment, the common lead-out wiring 67 is formed by being divided into at least three or more locations in the X direction on the outer surface of the CP side tail portion 52e in the Y direction, and is a common terminal connected to the flexible substrate 45. 68 is provided.

According to the present embodiment, since the common terminal 68 is formed on the outer surface of the CP side tail portion 52e in the Y direction, the flexible substrate is compared with the case where the common terminal 68 is formed on the inner side surface 52f2 of the CP side in the Y direction. The crimping work between the 45 and the common terminal 68 can be easily performed. In addition, since the common terminal 68 is divided into at least three or more locations in the X direction and formed, the common terminal 68 is formed locally (for example, at both ends in the X direction) as compared with the case where the common terminal 68 is formed locally (for example, at both ends in the X direction). , It is possible to suppress the occurrence of dullness of the drive pulse due to the difference in the nozzle position in the X direction.

Further, in the present embodiment, at the upper end of the CP side tail portion 52e, a plurality of recesses 73 are formed so as to be recessed inside the cover plate 52 and arranged at intervals in the X direction, and the common lead wiring 67 is recessed. The electrode 86 in the through hole and the flexible substrate 45 are connected via 73.

According to the present embodiment, the cover plate 52 has a through hole as compared with the case where the common lead wiring 67 is connected to the through hole inner electrode 86 and the flexible substrate 45 via the through hole 90 (see FIG. 24) described later. Since it is sufficient to have a recess forming region (for example, the forming region of the slit 121 shown in FIG. 17) smaller than the forming region (the forming region of the through hole 90 shown in FIG. 24), the lengths of the head tips 40A and 40B in the Z direction are sufficient. Can be shortened. Therefore, the head chips 40A and 40B can be miniaturized, and the number of wafers taken from a wafer having a predetermined size can be increased.

Further, in the present embodiment, the AP side individual wiring 64 extends in the X direction and connects the individual electrodes 63 facing each other with the discharge channel 54 in between on the inner side surface of the AP side tail portion 51e in the Y direction. The CP-side individual wiring 69 is formed on the CP-side Y-direction outer surface 52f1 and is divided in the X-direction at one end in the Z-direction, and the CP-side individual wiring 69 is combined with the AP-side individual wiring 64 in the Y-direction. It includes a CP-side individual pad 69a and an individual terminal 69b extending from the CP-side individual pad 69a toward the upper end.

According to the present embodiment, when the actuator plate 51 and the cover plate 52 are joined, the AP side individual wiring 64 and the CP side individual pad 69a can be connected, so that the individual wirings 64 and 69 and the individual pads 69a are connected. The individual electrode 63 and the flexible substrate 45 can be easily connected via the above. In the embodiment, since both the individual terminal 69b and the common terminal 68 are formed on the outer surface 52f1 in the Y direction on the CP side, the comparison is made with the case where the individual terminal 69b and the common terminal 68 are formed on different surfaces of the cover plate 52. Therefore, the crimping work between the individual terminals 69b and the common terminals 68 and the flexible substrate 45 can be easily performed.

The inkjet head 5 according to the present embodiment includes the above-mentioned head chips 40A and 40B.

According to the present embodiment, in the inkjet head 5 provided with the head tips 40A and 40B, corrosion of electrodes due to a liquid such as ink can be suppressed and reliability can be improved. In addition, the choice of electrode metal can be increased as compared with the configuration in which the common electrode 61 is formed in the ink flow path. In addition, it is suitable for improving the degree of freedom in layout of various wirings while ensuring the strength of the connection portions of various wirings. In addition, an increase in capacitance can be suppressed.

Further, in the present embodiment, a pair of head tips 40A and 40B arranged so that the inner side surfaces 52f2 in the CP side in the Y direction face each other in the Y direction are provided, and the cover plate 52 penetrates the cover plate 52 in the Y direction. At the same time, a liquid supply path 70 communicating with the discharge channel 54 is formed, a flow path plate 41 is arranged between the pair of head tips 40A and 40B, and the flow path plate 41 has a pair of cover plates 52. An inlet flow path 74 communicating with the liquid supply path 70 is formed.

According to the present embodiment, since the outer surface 52f1 on the CP side in the Y direction of each of the head chips 40A and 40B is exposed to the outside in the Y direction, the flexible substrate 45 and the connection wiring 60 are connected to each other in the two-row type inkjet head 5. The connection can be made easily.

Further, in the present embodiment, the plurality of discharge channels 54 are opened at the lower end surfaces of the actuator plates 51 of the pair of head tips 40A and 40B, and the lower end surfaces of the pair of actuator plates 51 are separately connected to the discharge channels 54. A nozzle plate 44 having a nozzle hole 78 to communicate with is arranged, and a circulation path 76 for communicating the discharge channel 54 and the nozzle hole 78 separately is provided between the pair of actuator plates 51 and the nozzle plate 44 in the Z direction. The feedback plate 43 to be provided is arranged, and the flow path plate 41 is formed with an outlet flow path 75 communicating with the circulation path 76.

According to the present embodiment, since the liquid can be circulated between each discharge channel 54 and the ink tank 4, it is possible to suppress the retention of air bubbles in the vicinity of the nozzle hole 78 in the discharge channel 54.

The printer 1 according to the present embodiment includes the above-mentioned inkjet head 5 and moving mechanisms 2, 3 and 7 for relatively moving the inkjet head 5 and the recording medium P.

According to the present embodiment, in the printer 1 provided with the inkjet head 5 described above, it is possible to suppress corrosion of the electrodes due to a liquid such as ink and improve reliability. In addition, the choice of electrode metal can be increased as compared with the configuration in which the common electrode 61 is formed in the ink flow path. In addition, it is suitable for improving the degree of freedom in layout of various wirings while ensuring the strength of the connection portions of various wirings. In addition, an increase in capacitance can be suppressed.

The technical scope of the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the spirit of the present invention.

For example, in the above-described embodiment, the inkjet printer 1 has been described as an example of the liquid injection device, but the present invention is not limited to the printer. For example, it may be a fax machine, an on-demand printing machine, or the like.

In the above-described embodiment, the two-row type inkjet head 5 in which the nozzle holes 78 are arranged in two rows has been described, but the present invention is not limited to this. For example, the inkjet head 5 may have three or more rows of nozzle holes, or the inkjet head 5 may have one row of nozzle holes.

In the above-described embodiment, among the edge shoot types, the circulation type in which ink circulates between the inkjet head 5 and the ink tank 4 has been described, but the present invention is not limited to this. For example, the present invention may be applied to a so-called side shoot type inkjet head that ejects ink from the central portion of the ejection channel in the channel extension direction.

In the above-described embodiment, the configuration in which the discharge channels 54 and the non-discharge channels 55 are arranged alternately has been described, but the configuration is not limited to this configuration. For example, the present invention may be applied to a so-called three-cycle inkjet head that sequentially ejects ink from all channels.

In the above-described embodiment, the configuration using the chevron type as the actuator plate has been described, but the present invention is not limited to this. That is, a monopole type actuator plate (the polarization direction is one direction in the thickness direction) may be used.

In the above-described embodiment, the configuration in which the connection common electrode 82 connected to the plurality of common leader wirings 67 is formed on the inner side surface 52f2 in the Y direction on the CP side has been described, but the present invention is not limited to this. For example, the connection common electrode 82 may not be formed on the inner side surface 52f2 in the Y direction on the CP side. That is, on the inner side surface 52f2 in the Y direction on the CP side, the portion between the two adjacent common leader wires 67 does not have to be electrically connected.

In the above-described embodiment, the configuration in which the flow path plate 41 is integrally formed of the same member has been described, but the configuration is not limited to this configuration. For example, the flow path plate 41 may be formed of a combination of a plurality of members.

In the following modification, the same configurations as those in the above embodiment are designated by the same reference numerals, and detailed description thereof will be omitted.

<First modification>
For example, as shown in FIG. 23, the cross-sectional common electrode 80 connected to the plurality of CP-side common pads 66 may be formed on the CP-side Y-direction outer surface 52f1. The cross-sectional common electrode 80 extends in the X direction from the outer surface 52f1 in the Y direction on the CP side between the slit 72 and the individual pad 69a on the CP side. The transverse common electrode 80 is formed in a band shape along the X direction on the outer surface 52f1 in the Y direction on the CP side. The cross-sectional common electrode 80 is connected to the upper ends of a plurality of CP-side common pads 66 on the CP-side Y-direction outer surface 52f1. On the other hand, the cross-sectional common electrode 80 does not abut on the CP-side individual pad 69a on the CP-side Y-direction outer surface 52f1.

The through hole 87 may be formed in a slit shape having a length in the extending direction of the transverse common electrode 80. For example, the length of the through hole 87 in the longitudinal direction is substantially the same as the arrangement pitch of two adjacent slits 72. The length and number of through holes 87 can be changed as appropriate.

A relief groove 81 (hereinafter referred to as “electrode relief groove 81”) of the cross-sectional common electrode 80 may be formed on the inner side surface of the AP side tail portion 51e in the Y direction. The electrode relief groove 81 extends in the X direction from the inner side surface of the tail portion 51e on the AP side between the common pad 62 on the AP side and the individual wiring 64 on the AP side. The electrode relief groove 81 faces the transverse common electrode 80 in the Y direction. The electrode relief groove 81 is arranged at a position corresponding to the transverse common electrode 80 when the actuator plate 51 and the cover plate 52 are joined. That is, when the actuator plate 51 and the cover plate 52 are joined, the transverse common electrode 80 is arranged in the electrode relief groove 81.

In this modification, on the CP-side Y-direction outer surface 52f1, a plurality of CP-side common pads 66 are connected and a transverse common electrode 80 extending in the X direction is formed.

According to this modification, since the plurality of CP-side common pads 66 can be preliminarily connected by the transverse common electrode 80, the case where the plurality of CP-side common pads 66 are connected only to the through-hole electrodes 86 In comparison, the reliability of the electrical connection of the plurality of CP-side common pads 66 can be improved.

In this modification, an electrode relief groove 81 extending in the X direction and facing the cross-sectional common electrode 80 in the Y direction is formed on the inner side surface of the AP side tail portion 51e in the Y direction.

According to this modification, when the actuator plate 51 and the cover plate 52 are joined, the transverse common electrode 80 can be accommodated in the electrode relief groove 81, so that the electrodes on the actuator plate 51 side (for example, the AP side individually) can be accommodated. It is possible to prevent the wiring 64) and the cross-sectional common electrode 80 from being short-circuited.

Further, in this modification, the through hole 87 is formed in a slit shape having a length in the extending direction of the transverse common electrode 80.

According to this modification, since it is easy to increase the formation region of the through-hole inner electrode 86 as compared with the case where the through-hole is formed in a circular shape, the through-hole inner electrode 86 and the transverse common electrode 80 are electrically connected. The reliability of the connection can be improved. In addition, since it is sufficient to extend the through hole 87 only in the extending direction (X direction) of the transverse common electrode 80, the lengths of the head tips 40A and 40B in the Z direction can be shortened.

<Second modification>
For example, as shown in FIG. 24, instead of the recess 73 (see FIG. 4) of the embodiment, a plurality of cover plates 52 penetrate the upper end of the cover plate 52 in the Y direction and are arranged at intervals in the X direction. The through hole 90 may be formed.

The common lead wiring 67 extends upward from the through hole 85 on the inner side surface 52f2 in the Y direction on the CP side on the inner side surface 52f2 in the Y direction on the CP side, and then passes through the through hole 90 at the upper end of the cover plate 52 in the Y direction on the CP side. It is pulled out to the upper end of the outer side surface 52f1. In other words, the common lead-out wiring 67 is drawn out to the outer surface in the Y direction of the CP side tail portion 52e via the through electrode 91 in the through hole 90. As a result, the common electrode 61 formed on the inner surface of the plurality of discharge channels 54 passes through the AP side common pad 62, the CP side common pad 66, the through-hole inner electrode 86, and the common lead-out wiring 67, and is a flexible substrate at the common terminal 68. It is electrically connected to 45.

For example, the through electrode 91 is formed only on the inner peripheral surface of the through hole 90 by vapor deposition or the like. The through electrode 91 may be filled in the through hole 90 with a conductive paste or the like.

In this modification, at the upper end of the CP side tail 52e, a cover plate 52 is penetrated in the Y direction, and a plurality of through holes 90 arranged at intervals in the X direction are formed, and the common lead wiring 67 is formed. The electrode 86 in the through hole and the flexible substrate 45 are connected to each other through the through hole 90.

According to this modification, the common lead wiring 67 is connected to the through hole forming portion as compared with the case where the common lead wiring 67 is connected to the through hole inner electrode 86 and the flexible substrate 45 via the recess 73 (see FIG. 4). Since it can be protected by the (wall portion), it is possible to prevent the common lead wiring 67 from being damaged in the through hole 90.

In addition, it is possible to replace the constituent elements in the above-described embodiment with well-known constituent elements as appropriate without departing from the spirit of the present invention, and the above-mentioned modifications may be appropriately combined.

1 ... Inkjet printer (liquid injection device)
2 ... Transport means (movement mechanism)
3 ... Transport means (movement mechanism)
5,5K, 5C, 5M, 5Y ... Inkjet head (liquid injection head)
7 ... Scanning means (moving mechanism)
41 ... Flow path plate 43 ... Return plate 44 ... Nozzle plate (injection plate)
45 ... Flexible board (external wiring)
51 ... Actuator plate 51f1 ... Inner surface in Y direction on AP side (first main surface on actuator plate side)
51e ... AP side tail (the part of the actuator plate located on one side of the injection channel in the first direction)
52 ... Cover plate 52f1 ... Outer surface in the Y direction on the CP side (first main surface on the cover plate side)
52f2 ... CP side Y direction inner surface (cover plate side second main surface)
52e ... CP side tail (the tail of the cover plate that extends outward from one end surface of the actuator plate in the first direction)
54 ... Discharge channel (injection channel)
55 ... Non-ejection channel (non-injection channel)
60 ... Connection wiring 61 ... Common electrode 62 ... AP side common pad (actuator plate side common pad)
63 ... Individual electrode 64 ... Individual wiring on the AP side (individual wiring on the actuator plate side)
66 ... CP side common pad (cover plate side common pad)
67 ... Common lead-out electrode (draw-out electrode)
68 ... Common terminal 69 ... CP side individual wiring (cover plate side individual wiring)
69a ... CP side individual pad (cover plate side individual pad)
69b ... Individual terminal 70 ... Liquid supply path 73 ... Recessed 74 ... Inlet flow path 75 ... Outlet flow path 76 ... Circulation path 78 ... Nozzle hole (injection hole)
80 ... Transverse common electrode 81 ... Electrode escape groove 85 ... Through hole 86 ... Through hole electrode 87 ... Through hole P ... Recording medium

Claims (14)

An actuator plate in which a plurality of injection channels extending along the first direction and a plurality of non-injection channels are alternately arranged side by side at intervals in a second direction orthogonal to the first direction.
A cover plate that is laminated on the actuator plate-side first main surface in the first direction and the third direction orthogonal to the second direction of the actuator plate to block the plurality of injection channels and the plurality of non-injection channels. When,
With the common electrode formed on the inner surface of the injection channel,
The individual electrodes formed on the inner surface of the non-injection channel and
In the cover plate, the connection wiring for connecting the common electrode and the external wiring, and
With
The cover plate is formed with a through hole that penetrates the cover plate in the third direction and is arranged at a position other than the flow path of the liquid.
The connection wiring
The common electrode and the external wiring are connected to each other through the through hole, and the common electrode is connected to the external wiring .
A liquid characterized in that, in a laminated state of the actuator plate and the cover plate, the liquid is formed in a tail portion of the cover plate that extends outward from one end surface of the actuator plate in the first direction. Injection head tip. An actuator plate in which a plurality of injection channels extending along the first direction and a plurality of non-injection channels are alternately arranged side by side at intervals in a second direction orthogonal to the first direction.
A cover plate that is laminated on the actuator plate-side first main surface in the first direction and the third direction orthogonal to the second direction of the actuator plate to block the plurality of injection channels and the plurality of non-injection channels. When,
With the common electrode formed on the inner surface of the injection channel,
The individual electrodes formed on the inner surface of the non-injection channel and
In the cover plate, the connection wiring for connecting the common electrode and the external wiring, and
With
The cover plate is formed with a through hole that penetrates the cover plate in the third direction and is arranged at a position other than the flow path of the liquid.
The connection wiring connects the common electrode and the external wiring through the through hole.
The actuator plate side individual extends to the first main surface on the actuator plate side in the second direction at one end in the first direction, and connects the individual electrodes facing each other with the injection channel in between. Wiring is formed,
Of the cover plates, on the cover plate side first main surface facing the actuator plate side first main surface, cover plate side individual wiring divided in the second direction is formed at one end of the first direction. Being done
The individual wiring on the cover plate side is
The cover plate side individual pad facing the actuator plate side individual wiring in the third direction, and the individual pad on the cover plate side.
An individual terminal extending from the cover plate side individual pad toward one end in the first direction,
To prepare
A liquid injection head tip characterized by that. The connection wiring is formed in the tail portion of the cover plate that extends outward from one end surface of the actuator plate in the first direction in a laminated state of the actuator plate and the cover plate. The liquid injection head tip according to claim 2. The cover plate is formed with a liquid supply path that penetrates the cover plate in the third direction and communicates with the injection channel.
The through hole is arranged at a place other than the liquid supply path, and is arranged.
The connection wiring
An electrode inside the through hole formed on the inner surface of the through hole and
A lead wiring that connects the electrode in the through hole and the external wiring at the tail of the cover plate, and
The liquid injection head tip according to claim 1 or 3 , wherein the liquid injection head tip is provided. Of the first main surface on the actuator plate side, a portion located on one side of the injection channel in the first direction extends from the common electrode and is arranged at intervals in the second direction. Multiple actuator plate side common pads are formed,
Among the cover plates, the periphery of the through hole on the first main surface on the cover plate side facing the first main surface on the actuator plate side extends from the electrode in the through hole and is spaced in the second direction. The liquid injection head tip according to claim 4 , wherein a plurality of liquid injection head tips are arranged apart from each other, and each of them forms a cover plate side common pad facing the actuator plate side common pad in the third direction. The fifth aspect of the present invention is characterized in that the first main surface on the cover plate side is connected to the plurality of common pads on the cover plate side and a transverse common electrode extending in the second direction is formed. The liquid injection head tip described. Of the first main surface on the actuator plate side, a portion located on one side of the first direction with respect to the injection channel extends in the second direction and the cross-sectional common electrode in the third direction. The liquid injection head tip according to claim 6 , wherein an electrode relief groove facing the electrode is formed. The liquid injection head tip according to claim 6 or 7 , wherein the through hole is formed in a slit shape having a length in the extending direction of the cross-sectional common electrode. The lead-out wiring is formed by dividing the tail portion of the cover plate into at least three or more portions in the second direction on the first main surface on the cover plate side facing the first main surface on the actuator plate side. The liquid injection head chip according to any one of claims 4 to 8 , further comprising a common terminal connected to the external wiring. At one end of the tail of the cover plate in the first direction, a recess is formed on the other end side of the cover plate in the first direction, and a plurality of recesses arranged at intervals in the second direction are formed. ,
The liquid injection head chip according to any one of claims 4 to 9 , wherein the lead-out wiring connects the electrode in the through hole and the external wiring via the recess. A liquid injection head comprising the liquid injection head tip according to any one of claims 1 to 10. Equipped with a pair of liquid injection head tips
The liquid injection head tip is
An actuator plate in which a plurality of injection channels extending along the first direction and a plurality of non-injection channels are alternately arranged side by side at intervals in a second direction orthogonal to the first direction.
A cover plate that is laminated on the actuator plate-side first main surface in the first direction and the third direction orthogonal to the second direction of the actuator plate to block the plurality of injection channels and the plurality of non-injection channels. When,
With the common electrode formed on the inner surface of the injection channel,
The individual electrodes formed on the inner surface of the non-injection channel and
In the cover plate, the connection wiring for connecting the common electrode and the external wiring, and
With
The cover plate is formed with a through hole that penetrates the cover plate in the third direction and is arranged at a position other than the flow path of the liquid.
The connection wiring connects the common electrode and the external wiring through the through hole.
The pair of liquid injection head tips has the third main surface of the cover plate on the cover plate side opposite to the first main surface on the actuator plate side facing the first main surface on the actuator plate side. They are arranged so that they face each other in the direction.
The cover plate is formed with a liquid supply path that penetrates the cover plate in the third direction and communicates with the injection channel.
A flow path plate is disposed between the pair of liquid injection head tips.
The said channel plate, liquids jet head you characterized in that the inlet channel communicating with the liquid supply passage of the pair of the cover plate is formed. The plurality of injection channels are opened at the other end surface of the actuator plate in the first direction of the pair of liquid injection head tips.
On the other end side of the pair of actuator plates in the first direction, an injection plate having an injection hole communicating with the injection channel is arranged.
A feedback plate having a circulation path for communicating the injection channel and the injection hole separately is arranged between the pair of actuator plates and the injection plate in the first direction.
The liquid injection head according to claim 12, wherein an outlet flow path communicating with the circulation path is formed in the flow path plate. The liquid injection head according to any one of claims 11 to 13.
A moving mechanism that relatively moves the liquid injection head and the recording medium,
A liquid injection device comprising.

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