JP2017052214A - Liquid jet head and liquid jet device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a liquid jet head and a liquid jet device that can simplify various wiring, improve a degree of freedom of layout, and facilitate connection work of external wiring.SOLUTION: A liquid jet head comprises: discharge channels 54 and dummy channels alternately arranged in parallel at intervals in an X direction on a surface of an actuator plate 51; an individual electrode formed on an inside surface of each dummy channel; a common electrode 61 formed on an inside surface of each discharge channel 54; common wiring 62 formed on a surface of a tail part of the actuator plate 51 which is located above the discharge channel 54, and connected to the common electrode 61; draw-out wiring 92 for drawing out the common wiring 62 to a rear face side of the tail part of the actuator 51; and an individual pad 94 formed on the rear face of the tail part of the actuator plate 51 and separately connecting the individual electrodes facing in the X direction across the discharge channel 54.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a liquid ejecting head and a liquid ejecting apparatus.

  2. Description of the Related Art Conventionally, an ink jet printer (liquid ejecting apparatus) provided with an ink jet head (liquid ejecting head) as an apparatus for ejecting droplets of ink onto a recording medium such as recording paper and recording images and characters on the recording medium. There is. The inkjet head includes an actuator plate in which discharge channels and dummy channels are alternately arranged, a nozzle plate that is disposed on one end side in the channel extending direction of the actuator plate, and has nozzle holes that communicate with the discharge channels. have. In each channel, a common electrode having a reference potential GND is formed on the inner surface of the ejection channel, and an individual electrode having a drive potential Vdd is formed on the inner surface of the dummy channel.

For example, Patent Document 1 below discloses a configuration in which a manifold is disposed so as to straddle the other end surface and the back surface of the actuator plate in the channel extending direction. An ink supply path that communicates with the ejection channel is formed in the manifold.
In Patent Document 1 below, the individual wiring passes through one end surface of the actuator plate in the channel extending direction and is connected to an individual pad formed on the back surface of the actuator plate. On the other hand, the common wiring passes through the other end surface of the actuator plate in the channel extending direction and is connected to a common pad formed on the back surface of the actuator plate. Each pad is formed on the back surface of the actuator plate on one end side in the channel extending direction (position not interfering with the manifold) with respect to the manifold described above. External wiring such as a flexible printed circuit board that is electrically connected to the control means is pressure-bonded to each pad.

JP 7-137245 A

  However, the configuration of Patent Document 1 has a problem in that the wiring pattern is complicated because the individual wiring and the common wiring are routed to each pad on the back surface through both end surfaces of the actuator plate in the channel extending direction. It was.

Further, in the configuration of Patent Document 1, external wiring is connected to each pad as described above. In this case, the external wiring is routed from each pad to the other end side in the channel extending direction (the side opposite to the nozzle plate side) and connected to the control means.
However, in the configuration of Patent Document 1, since the manifold is arranged on the other end side in the channel extending direction from each pad, external wiring is arranged on the other end side in the channel extending direction while avoiding interference with the manifold. Need to be routed. As a result, there is a problem that the operation of crimping the external wiring to each pad and the operation of routing the external wiring to the control means become complicated.

  The present invention has been made in view of such circumstances, and its purpose is to simplify various wirings and improve the degree of freedom of layout, and to facilitate the work of connecting external wirings. A liquid ejecting head and a liquid ejecting apparatus are provided.

The present invention provides the following means in order to solve the above problems.
The liquid ejecting head according to the present invention is filled with a liquid which extends along the first direction on the surface of the actuator plate and is arranged in parallel in the second direction intersecting the first direction. On the surface of the actuator plate, and in parallel with the injection channel in the second direction, the actuator plate in the third direction orthogonal to the first direction and the second direction. Of the dummy channel that is not filled with the penetrating liquid, the individual electrode formed on the inner surface of the dummy channel, the common electrode formed on the inner surface of the ejection channel, and the ejection channel among the actuator plates The one end side of the first direction is formed on the surface of the tail portion located between the dummy channels adjacent to each other in the second direction. A common wire connected to the electrode, a lead-out wire for drawing out the common wire to the back surface side of the tail portion of the actuator plate, and a second direction formed on the back surface of the tail portion of the actuator plate across the ejection channel And an individual pad for connecting the individual electrodes facing each other separately.

  According to this configuration, for example, the area of a region where an individual pad, a lead-out wiring, or the like can be formed can be ensured as compared with a case where an individual pad or the like is formed on the surface side of the actuator plate where each channel opens. Thereby, the degree of freedom of the layout of pads and the like can be improved and the wiring pattern can be simplified. In this case, the length of the tail in the first direction can be increased by forming the pad or the like on the other end side in the first direction, for example, by drawing the pad or the like from the back surface of the tail to the position overlapping the ejection channel in the third direction. Can be shortened. Therefore, the chip length (the length in the first direction) of the liquid ejecting head can be shortened, and the liquid ejecting head can be downsized.

In particular, since each electrode is routed to the back surface through the tail portion of each actuator plate, the wiring pattern is further simplified as compared with a conventional configuration in which each electrode is routed through both end surfaces in the channel extending direction of the actuator plate. be able to.
Further, since each electrode is routed to the back surface through the tail portion of the actuator plate, the crimping operation between the external wiring such as the flexible printed circuit board and the pad can be easily performed. In addition, it is possible to avoid interference with peripheral members when the external wiring is routed from the pad to the other end side in the first direction. Therefore, it is possible to facilitate the work of connecting the external wiring, such as the work of crimping the external wiring to the pad or the like, and the work of routing the external wiring to the control means.

In the liquid ejecting head according to the aspect of the invention, a connection groove that is recessed toward the front surface may be formed in a portion of the back surface of the actuator plate where the individual pad is formed.
According to this configuration, for example, when various wirings are formed by electroless plating and then the plating film formed on the back surface of the actuator plate is removed by grinding or the like, the plating film remaining in the connection groove is used as an individual pad. can do. Thereby, individual pads can be formed in a lump when various wirings are formed. Therefore, it is not necessary to separately perform an electrode forming process for forming individual pads on the back surface of the actuator plate, and thus the manufacturing efficiency can be improved.

In the liquid ejecting head according to the aspect of the invention, a common pad that is connected to the lead-out wiring and extends toward the other end side in the first direction may be formed on the back surface of the actuator plate.
According to this configuration, the length of the tail portion in the first direction can be shortened by drawing the common pad toward the other end side in the first direction. Therefore, the chip length (the length in the first direction) of the liquid ejecting head can be shortened, and the liquid ejecting head can be downsized.

In the liquid ejecting head according to the aspect of the invention, the lead wiring may be formed on an inner surface of a through hole formed in the tail portion of the actuator plate.
According to this configuration, the common electrode can be easily routed to the back surface of the actuator plate by forming the extraction electrode on the inner surface of the through hole of the actuator plate.

In the liquid ejecting head according to the aspect of the invention, a cover plate that covers the ejecting channel and the dummy channel in the third direction is disposed on a surface side of the actuator plate, and the cover plate is disposed in the ejecting channel. A liquid introduction path that communicates with each other may be formed.
According to this configuration, the cover plate and the pad are arranged on different surfaces of the actuator plate. Therefore, for example, the area of the region where the pad or the like can be formed can be ensured as compared with a configuration in which the cover plate and the pad or the like are arranged on the same surface (for example, the surface) of the actuator plate. Further, since the interference with the cover plate can be avoided when the external wiring is routed from the pad or the like to the other end side in the first direction, it is possible to facilitate the connection work of the external wiring.

In the liquid ejecting head according to the aspect of the invention, the actuator plate includes a first actuator plate and a second actuator plate that are disposed with the surfaces facing each other in the third direction, and the cover plate includes the first actuator plate. A first cover plate disposed on the surface side of the actuator plate; and a second cover plate disposed on the surface side of the second actuator plate, the first cover plate and the second cover. A flow path plate is disposed between the plate and the flow path plate. An inlet flow path that communicates with the liquid introduction path of the first cover plate and the second cover plate may be formed on the flow path plate. Good.
According to this configuration, since the back surface of each actuator plate can be exposed to the outside in the third direction, it is possible to easily connect the external wiring and each pad or the like in the two-row type liquid jet head.

In the liquid ejecting head according to the aspect of the invention, the ejection channel may be opened at the other end surface in the first direction of the first actuator plate and the second actuator plate, respectively, and in the first actuator plate and the second actuator plate. The other end side in the first direction is provided with an injection plate having injection holes communicating with the injection channels, and the first actuator plate, the second actuator plate, and the injection plate in the first direction. A spacer plate having a circulation channel that communicates the ejection channel and the ejection hole with each other is disposed between the outlet channel and the outlet channel that communicates with the circulation channel. May be.
According to this configuration, since the liquid can be circulated between each discharge channel and the liquid tank, it is possible to suppress the retention of bubbles in the vicinity of the injection hole in the discharge channel.

The liquid ejecting apparatus according to the present invention includes the liquid ejecting head according to the present invention, and a moving mechanism that relatively moves the liquid ejecting head and the recording medium.
According to this configuration, since the liquid ejecting head according to the present invention is provided, an inexpensive and highly reliable liquid ejecting apparatus can be provided.

  According to the present invention, various wirings can be simplified and the degree of freedom can be improved, and connection work of external wiring can be facilitated.

It is a schematic block diagram of an inkjet printer. It is a perspective view of an inkjet head. It is sectional drawing of an inkjet head. It is sectional drawing of an inkjet head. It is the disassembled perspective view which looked at the head chip concerning a 1st embodiment from the inner side of the Y direction. It is the perspective view which looked at the actuator plate shown in FIG. 5 from the back surface side. It is process drawing (plan view) for demonstrating a mask formation process. It is process drawing (VIII-VII cross section of FIG. 7) for demonstrating a mask formation process. It is process drawing (plan view) for demonstrating a dicing line formation process. It is process drawing (XX cross section of FIG. 9) for demonstrating a dicing line formation process. It is process drawing (XI-XI cross section of FIG. 9) for demonstrating a dicing line formation process. It is process drawing (plan view) for demonstrating a through-hole formation process. It is process drawing (XIII-XIII cross section of FIG. 12) for demonstrating a through-hole formation process. It is process drawing (plan view) for demonstrating a 1st electrode formation process. It is process drawing (XV-XV cross section of FIG. 14) for demonstrating a 1st electrode formation process. It is process drawing (XVI-XVI cross section of FIG. 14) for demonstrating a 1st electrode formation process. It is process drawing (plan view) for demonstrating a cover wafer preparation process. It is process drawing (XVIII-XVIII cross section of FIG. 17) for demonstrating a cover wafer preparation process. It is process drawing (plan view) for demonstrating the bonding process. It is process drawing (XX-XX cross section of FIG. 19) for demonstrating a grinding process. FIG. 20 is a process diagram (XXI-XXI cross-section in FIG. 19) for explaining a grinding process. It is process drawing (bottom view) for demonstrating a 2nd electrode formation process. It is process drawing (bottom view) for demonstrating an individualization process. It is a disassembled perspective view of the head chip which concerns on the modification of 1st Embodiment. It is the perspective view which looked at the actuator plate shown in FIG. 24 from the back surface side. It is a disassembled perspective view of the head chip concerning a 2nd embodiment. It is the perspective view which looked at the actuator plate shown in FIG. 26 from the back surface side. It is process drawing for demonstrating a 3rd dicing line formation process and an electrode formation process. It is process drawing for demonstrating a grinding process. It is process drawing for demonstrating a grinding process.

  Hereinafter, embodiments according to the present invention will be described with reference to the drawings. In the following embodiments, as an example of a liquid ejecting apparatus including the liquid ejecting head of the present invention, an ink jet printer (hereinafter simply referred to as a printer) that performs recording on a recording medium using ink (liquid) is taken as an example. I will explain. In the drawings used for the following description, the scale of each member is appropriately changed in order to make each member a recognizable size.

[Printer]
FIG. 1 is a schematic configuration diagram of the printer 1.
As shown in FIG. 1, the printer 1 according to the present embodiment includes a pair of conveying units 2 and 3 that convey a recording medium P such as paper, an ink tank 4 that contains ink, and a liquid that is applied to the recording medium P. An inkjet head (liquid ejecting head) 5 that ejects droplet-shaped ink, an ink circulation means 6 that circulates ink between the ink tank 4 and the inkjet head 5, and a direction in which the recording medium P is conveyed ( Hereinafter, a scanning unit (moving mechanism) 7 that scans in a direction orthogonal to the X direction (width direction of the recording medium P (hereinafter referred to as Y direction)) is provided. In the figure, the Z direction indicates a height direction orthogonal to the X direction and the Y direction.

  The conveying means 2 includes a grid roller 11 extending in the Y direction, a pinch roller 12 extending in parallel to the grid roller 11, a drive mechanism (not shown) such as a motor for rotating the grid roller 11, and the like. It has. Similarly, the conveying means 3 includes a grid roller 13 extending in the Y direction, a pinch roller 14 extending in parallel to the grid roller 13, a drive mechanism (not shown) that rotates the grid roller 13 in an axis, It has.

  The ink tank 4 is provided with, for example, ink tanks 4Y, 4M, 4C, and 4B of four colors of yellow, magenta, cyan, and black arranged in the X direction.

FIG. 2 is a schematic configuration diagram of the inkjet head 5 and the ink circulation means 6.
As shown in FIGS. 1 and 2, the ink circulation means 6 includes a circulation flow path 23, a pressurization pump 24, and a suction pump 25.
The circulation flow path 23 includes an ink supply pipe 21 that supplies ink to the inkjet head 5 and an ink discharge pipe 22 that discharges ink from the inkjet head 5. The ink supply pipe 21 and the ink discharge pipe 22 are configured by a flexible hose or the like having flexibility that can correspond to the operation of the scanning unit 7 that supports the inkjet head 5.

The pressure pump 24 is connected to the ink supply pipe 21. The pressurizing pump 24 pressurizes the inside of the ink supply pipe 21 and sends out ink to the inkjet head 5 through the ink supply pipe 21. Thereby, the ink supply pipe 21 side has a positive pressure with respect to the inkjet head 5.
The suction pump 25 is connected to the ink discharge pipe 22. The suction pump 25 decompresses the inside of the ink discharge pipe 22 and sucks ink from the inkjet head 5. Thereby, the ink discharge pipe 22 side has a negative pressure with respect to the inkjet head 5. The ink can be circulated between the inkjet head 5 and the ink tank 4 through the circulation flow path 23 by driving the pressurizing pump 24 and the suction pump 25.

  As shown in FIG. 1, the scanning means 7 includes a pair of guide rails 31 and 32 extending in the Y direction, a carriage 33 movably supported by the pair of guide rails 31 and 32, and the carriage 33 as a Y-axis. And a drive mechanism 34 that moves in the direction. The drive mechanism 34 rotates a pair of pulleys 35, 36 disposed between the pair of guide rails 31, 32, an endless belt 37 wound between the pair of pulleys 35, 36, and one pulley 35. And a drive motor 38 to be driven.

  The pair of pulleys 35 and 36 are respectively disposed between both ends of the pair of guide rails 31 and 32. The endless belt 37 is disposed between the pair of guide rails 31 and 32. A carriage 33 is connected to the endless belt 37. On the carriage 33, as a plurality of ink-jet heads 5, ink-jet heads 5Y, 5M, 5C, and 5B of four colors of yellow, magenta, cyan, and black are mounted side by side in the Y direction. The transporting means 2 and 3 and the scanning means 7 constitute a moving mechanism that relatively moves the inkjet head 5 and the recording medium P.

<Inkjet head>
Next, the above-described inkjet head 5 will be described in detail. The inkjet heads 5Y, 5M, 5C, and 5B have the same configuration except for the color of the supplied ink. Therefore, the inkjet heads 5 will be collectively described in the following description.
FIG. 3 is a cross-sectional view of the inkjet head 5. FIG. 4 is a cross-sectional view of the inkjet head 5.
As shown in FIGS. 3 and 4, each inkjet head 5 discharges ink between the ink tank 4 in a so-called edge chute that discharges ink from a distal end portion in a channel extending direction of a discharge channel 54 described later. A circulation type (vertical circulation type) inkjet head 5 that circulates. Further, the inkjet head 5 of the present embodiment is a two-row type inkjet head 5 in which a plurality of nozzle holes (ejection holes) 83 and 84 are formed in two rows.

The inkjet head 5 mainly includes a first head chip 40A and a second head chip 40B, a flow path plate 41, an inlet manifold 42, a spacer plate 43, and a nozzle plate (injection plate) 44. In the following description, in the Z direction, the nozzle plate 44 side may be referred to as the lower side, and the side opposite to the nozzle plate 44 may be referred to as the upper side. In the following description, in the Y direction, the direction toward the center of the inkjet head 5 may be referred to as the inside, and the direction away from the center of the inkjet head 5 may be referred to as the outside.
In the following description, of the head chips 40A and 40B, the first head chip 40A will be mainly described, and the configuration of the second head chip 40B similar to the first head chip 40A is the same as that of the first head chip 40A. The description may be omitted with the same reference numerals.

FIG. 5 is an exploded perspective view of the head chips 40A and 40B as viewed from the inside in the Y direction.
As shown in FIGS. 3 to 5, the first head chip 40 </ b> A includes a first actuator plate 51 and a first cover plate 52.
The first actuator plate 51 is a stacked substrate in which two piezoelectric substrates having different polarization directions in the thickness direction (Y direction) are stacked (a so-called chevron substrate). As the piezoelectric substrate, for example, a ceramic substrate made of PZT (lead zirconate titanate) or the like is preferably used.

  On the surface of the first actuator plate 51 (surface located on the inner side in the Y direction), a plurality of channels 54 and 55 that are open at least on the surface are formed. The channels 54 and 55 are alternately formed linearly in the Z direction (first direction) and spaced apart in the X direction (second direction). Therefore, the channels 54 and 55 are defined by the drive walls 56 (see FIG. 5) made of the first actuator plate 51, respectively. Specifically, the plurality of channels 54 and 55 include a discharge channel (ejection channel) 54 that is filled with ink and a dummy channel 55 that is not filled with ink.

As shown in FIGS. 3 and 5, the discharge channel 54 has an upper end that terminates in the first actuator plate 51, and a lower end that opens at the lower end surface of the first actuator plate 51. As shown in FIG. 3, the discharge channel 54 is located at the lower end portion, has an extended portion 54 a with a uniform groove depth, and continues upward from the extended portion 54 a, and the groove depth decreases toward the upper side. And a raised portion 54b that becomes shallower.
As shown in FIGS. 4 and 5, the dummy channel 55 is formed so that the groove depth in the Y direction is uniform over the entire Z direction. The dummy channel 55 penetrates the first actuator plate 51 in the Z direction, and both end portions in the Z direction are opened at both end surfaces of the first actuator plate 51 in the Z direction. Further, the dummy channel 55 penetrates the first actuator plate 51 in the Y direction (third direction).

As shown in FIGS. 3 and 5, a common electrode 61 is formed on the inner surface of the ejection channel 54. The common electrode 61 is formed on the entire inner surface of the ejection channel 54.
A common wiring 62 is formed on the surface of a portion of the actuator plate 51 that is located above the discharge channel 54 (hereinafter simply referred to as a tail). The common wiring 62 is formed in a strip shape extending in the Z direction. The common wiring 62 has a lower end connected to the common electrode 61 and an upper end terminated on the tail.

  As shown in FIGS. 4 and 5, individual electrodes 63 are formed on the surfaces of the drive walls 56 of the actuator plate 51 that define the dummy channels 55 (inner surfaces of the dummy channels 55). The individual electrodes 63 are individually formed on the inner surface of the dummy channel 55 facing in the X direction. Therefore, among the individual electrodes 63, the individual electrodes 63 facing each other in the same dummy channel 55 are electrically separated. The individual electrode 63 is formed over the entire inner surface (the entire Y direction and the Z direction) of the dummy channel 55.

  As shown in FIGS. 3 and 4, a heat transfer member 66 is disposed below the back surface (the surface located outside in the Y direction) of the first actuator plate 51. The heat transfer member 66 is formed of a material that has better thermal conductivity than the first actuator plate 51. The heat transfer member 66 is extended along the X direction. The heat transfer member 66 has a function of radiating heat of the actuator plate 51 to the outside and relaxing temperature variations in the actuator plate 51.

  As shown in FIGS. 3 to 5, the cover plate 52 is formed in a plate shape having an outer shape equivalent to the first actuator plate 51 in a plan view when viewed from the Y direction. The back surface of the first cover plate 52 is fixed on the surface of the first actuator plate 51 by adhesion or the like.

The first cover plate 52 includes a common ink chamber 71 formed on the front surface side, and a plurality of slits (liquid introduction passages) 72 formed on the back surface side and respectively communicating between the common ink chamber 71 and each ejection channel 54. ,have.
The common ink chamber 71 is a groove that is located at the upper end portion of the first cover plate 52 and is recessed toward the back surface side, and extends in the X direction. Ink flows into the common ink chamber 71 through the flow path plate 41 described above.

  The slit 72 is formed in the common ink chamber 71 at a position that overlaps with the raised portion 54 b of the ejection channel 54 in the Y direction. The slit 72 penetrates the first cover plate 52 in the Y direction. That is, the above-described common ink chamber 71 communicates with each ejection channel 54 through the slit 72, but does not communicate with the dummy channel 55. The slit 72 is formed to have the same width in the X direction as the ejection channel 54.

  Similar to the first head chip 40A described above, the second head chip 40B is configured by laminating a second actuator plate 74 and a second cover plate 75 in the Y direction. The head chips 40A and 40B are arranged at intervals in the Y direction with the cover plates 52 and 75 (surface sides of the actuator plates 51 and 74) facing each other in the Y direction.

  As shown in FIGS. 3 and 4, the ejection channel 54 and the dummy channel 55 of the second head chip 40B are arranged with a half-pitch shift with respect to the arrangement pitch of the ejection channel 54 and the dummy channel 55 of the first head chip 40A. ing. That is, the ejection channels 54 and the dummy channels 55 of the head chips 40A and 40B are arranged in a staggered manner. In this case, the ejection channel 54 of the first head chip 40A and the dummy channel 55 of the second head chip 40B face each other in the Y direction, and the ejection of the dummy channel 55 of the first head chip 40A and the second head chip 40B. The channel 54 faces the Y direction.

  The flow path plate 41 is sandwiched between the first head chip 40A and the second head chip 40B. The flow path plate 41 is formed in a plate shape whose outer shape in plan view as viewed from the Y direction is the same as that of the actuator plates 51 and 74. In the flow path plate 41, the surface of the first cover plate 52 is bonded to the first main surface in the Y direction, and the surface of the second cover plate 75 is bonded to the second main surface.

  In each main surface of the flow path plate 41, an inlet flow path 77 communicating with the common ink chamber 71 described above is formed. Each inlet channel 77 is recessed from each main surface of the channel plate 41 toward the inside in the Y direction. Each inlet channel 77 has a lower end communicating with the common ink chamber 71 described above, and an upper end opened at the upper end surface of the channel plate 41. The inlet channel 77 has the same width in the X direction as the common ink chamber 71. However, the width of the inlet channel 77 may be smaller or larger than the common ink chamber 71.

  An outlet channel 78 is formed at the lower end surface of the channel plate 41. The outlet channel 78 is recessed upward from the lower end surface of the channel plate 41. The outlet channel 78 penetrates the channel plate 41 in the Y direction. Further, the outlet channel 78 is wider in the X direction than the inlet channel 77 described above. The outlet channel 78 is connected to an outlet manifold (not shown) at a portion located outside the inlet channel 77 in the X direction. The outlet manifold is connected to the ink discharge pipe 22 described above.

  The inlet manifold 42 is joined to the upper end surfaces of the head chips 40A and 40B and the flow path plate 41 together. The inlet manifold 42 is formed with a supply path 80 that communicates with each of the inlet channels 77 described above. The supply path 80 is recessed upward from the lower end surface of the inlet manifold 42. The supply path 80 communicates with each inlet flow path 77 collectively.

  The spacer plate 43 is joined to the lower end surfaces of the head chips 40A and 40B and the flow path plate 41 together. The spacer plate 43 is formed with a plurality of circulation channels (first circulation channel 81 and second circulation channel 82) that connect between the discharge channels 54 and the outlet channels 78 of the head chips 40A and 40B. Yes.

As shown in FIG. 3, the first circulation flow path 81 is formed at the same position as the discharge channel 54 of the first head chip 40 </ b> A in the X direction and at the same arrangement pitch as the discharge channel 54. . Specifically, the first circulation channel 81 penetrates the spacer plate 43 in the Z direction. The first circulation channel 81 has an inner end in the Y direction located on the inner side in the Y direction with respect to the surface of the first cover plate 52. The first circulation channel 81 has an outer end portion in the Y direction communicating with the discharge channel 54 of the first head chip 40 </ b> A, and an inner end portion in the Y direction communicating with the outlet channel 78.
The second circulation channel 82 is formed at the same position in the X direction as the ejection channel 54 of the second head chip 40B. The second circulation channel 82 has an outer end in the Y direction communicating with each ejection channel 54 of the second head chip 40B, and an inner end in the Y direction communicating with the outlet channel 78.

  The nozzle plate 44 is joined to the lower end surface of the spacer plate 43. In the nozzle plate 44, a plurality of nozzle holes (first nozzle holes 83 and second nozzle holes 84) penetrating the nozzle plate 44 in the Z direction are arranged.

  The first nozzle holes 83 are respectively formed in portions of the nozzle plate 44 facing the first circulation flow path 81 of the spacer plate 43 in the Z direction. That is, the first nozzle holes 83 are arranged on a straight line at the same pitch as the first circulation flow path 81 and spaced in the X direction. Specifically, the first nozzle hole 83 communicates with the first circulation channel 81 at the center in the Y direction of the first circulation channel 81. Accordingly, each first nozzle hole 83 communicates with the corresponding discharge channel 54 of the first head chip 40 </ b> A via the first circulation channel 81.

  The second nozzle holes 84 are respectively formed in portions of the nozzle plate 44 that face the second circulation channel 82 of the spacer plate 43 in the Z direction. That is, the second nozzle holes 84 are arranged on a straight line at the same pitch as the second circulation flow path 82 and spaced in the X direction. Specifically, the second nozzle hole 84 communicates with the second circulation channel 82 at the center in the Y direction of the second circulation channel 82. Accordingly, each second nozzle hole 84 communicates with the corresponding discharge channel 54 of the second head chip 40B via the second circulation channel 82. Therefore, each dummy channel 55 does not communicate with the nozzle holes 83 and 84 and is covered from below by the nozzle plate 44.

  Here, as shown in FIG. 3 to FIG. 5, the penetrating portions of the actuator plates 51 and 74 that penetrate the actuator plates 51 and 74 in the Y direction are located in positions overlapping with the common wiring 62 in the Y direction. A hole 91 is formed. On the inner surface of the through-hole 91, a lead-out wiring 92 that leads the common wiring 62 to the back surfaces of the actuator plates 51 and 74 is formed. The lead wire 92 has an inner end in the Y direction connected to the common wire 62 at the opening edge of the through hole 91.

FIG. 6 is a perspective view of the actuator plates 51 and 74 viewed from the back side.
As shown in FIG. 6, a common pad 93 is formed on the back surfaces of the actuator plates 51 and 74. The common pad 93 extends in the Z direction on the back surfaces of the actuator plates 51 and 74. The common pad 93 has an upper end connected to the lead-out wiring 92 at the opening edge of the above-described through hole 91 and a lower end terminated in the actuator plates 51 and 74. The common pad 93 may extend to a position where the lower end portion overlaps with the upper end portion of the ejection channel 54 when viewed from the Y direction.

  Further, individual pads 94 are formed on portions of the rear surfaces of the tail portions of the actuator plates 51 and 74 that are located above the common pad 93. The individual pad 94 is formed in a strip shape extending in the X direction. The individual pads 94 connect the individual electrodes 63 facing each other in the X direction with the ejection channel 54 interposed therebetween. Specifically, one end portion in the X direction of the individual pad 94 is connected to an individual electrode 63 formed on the other end side in the X direction in the dummy channel 55 located on one end side in the X direction with respect to the ejection channel 54. Has been. On the other hand, the other end portion in the X direction of the individual pad 94 is formed on the individual electrode 63 formed on one end side in the X direction in the dummy channel 55 located on the other end side in the X direction with respect to the ejection channel 54. ing.

Thus, in this embodiment, the common electrode 61 and the individual electrode 63 are routed to the back surface at the tail portions of the actuator plates 51 and 74.
Note that flexible printed circuit boards 96 and 97 (hereinafter simply referred to as FPCs 96 and 97) for connecting the control means (not shown) and the pads 93 and 94 are mounted on the rear surface of the tail portion described above. As a result, a drive voltage is applied to the electrodes 61 and 63 from the control means via the FPCs 96 and 97.

[How the printer works]
Next, a case where characters, figures, and the like are recorded on the recording medium P using the printer 1 configured as described above will be described below.
As an initial state, it is assumed that inks of different colors are sufficiently sealed in the four ink tanks 4 shown in FIG. Further, the ink in the ink tank 4 is filled in the inkjet head 5 via the ink circulating means 6.

Under such an initial state, when the printer 1 is operated, the grid rollers 11 and 13 of the conveying means 2 and 3 rotate, so that the recording medium is interposed between the grid rollers 11 and 13 and the pinch rollers 12 and 14. P is transported in the transport direction (X direction). At the same time, the drive motor 38 rotates the pulleys 35 and 36 to move the endless belt 37. Accordingly, the carriage 33 reciprocates in the Y direction while being guided by the guide rails 31 and 32.
During this time, ink of four colors is appropriately ejected from the inkjet heads 5 onto the recording medium P, so that characters, images, and the like can be recorded.

Here, the movement of each inkjet head 5 will be described in detail below.
Among the edge chute types as in the present embodiment, in the circulation type inkjet head 5, first, the pressure pump 24 and the suction pump 25 shown in FIG. 2 are operated to circulate ink in the circulation flow path 23. In this case, the ink flowing through the ink supply pipe 21 passes through the supply path 80 of the inlet manifold 42 and flows into the respective inlet flow paths 77 of the flow path plate 41. The ink flowing into each inlet channel 77 passes through each common ink chamber 71 and then is supplied into each ejection channel 54 through the slit 72. The ink that has flowed into each ejection channel 54 gathers in the outlet channel 78 through the circulation channel 81 of the spacer plate 43, and is then discharged to the ink discharge pipe 22 through an outlet manifold (not shown). The ink discharged to the ink discharge pipe 22 is returned to the ink tank 4 and then supplied to the ink supply pipe 21 again. Thereby, the ink is circulated between the inkjet head 5 and the ink tank 4.

  When the reciprocation is started by the carriage 33 (see FIG. 1), the control means applies a driving voltage to the electrodes 61 and 63 via the FPCs 96 and 97. Then, thickness-slip deformation occurs in the two drive walls 56 that define the discharge channel 54, and the two drive walls 56 are deformed so as to protrude toward the dummy channel 55. That is, the actuator plates 51 and 74 of the present embodiment are formed by stacking two piezoelectric substrates polarized in the thickness direction (Y direction). It bends and deforms in a V shape centering on the middle position in the direction. Thereby, the discharge channel 54 is deformed so as to expand.

When the volume of the ejection channel 54 increases due to the deformation of the two drive walls 56, the ink in the common ink chamber 71 is guided into the ejection channel 54 through the slit 72. The ink guided to the inside of the discharge channel 54 propagates as a pressure wave to the inside of the discharge channel 54, and at the timing when this pressure wave reaches the nozzle holes 83, 84, it is between the electrodes 61, 63. Apply drive voltage to zero.
As a result, the drive wall 56 is restored, and the volume of the discharge channel 54 once increased returns to the original volume. By this operation, the pressure inside the ejection channel 54 increases and the ink is pressurized. As a result, ink can be ejected from the nozzle holes 83 and 84. At this time, the ink is ejected as droplet-shaped ink droplets when passing through the nozzle holes 83 and 84. Thereby, as described above, characters, images, and the like can be recorded on the recording medium P.

  The operation method of the inkjet head 5 is not limited to the above-described content. For example, the drive wall 56 in the normal state may be deformed inside the discharge channel 54, and the discharge channel 54 may be configured to be recessed inside. In this case, the voltage applied between the electrodes 61 and 63 can be realized by making the voltage opposite to the above-described voltage, or by reversing the polarization direction of the actuator plates 51 and 74 without changing the sign of the voltage. It is. Further, after the ejection channel 54 is deformed so as to swell outward, the ejection channel 54 may be deformed so as to be recessed inward to increase the pressure applied to the ink during ejection.

[Head chip manufacturing method]
Next, a method for manufacturing the above-described head chips 40A and 40B will be described. Each of the head chips 40A and 40B can be manufactured by the same method. Therefore, in the following description, a method for manufacturing the first head chip 40A will be described. Further, in the following description, the wafer bonded body 103 is formed by bonding the actuator wafer 101 in which the plurality of first actuator plates 51 are continuous in the Z direction and the cover wafer 102 in which the plurality of first cover plates 52 are continuous in the Z direction. A method of manufacturing and manufacturing a plurality of first head chips 40A in a lump by forming and cutting the wafer bonded body 103 will be described.

  The manufacturing method of the first head chip 40A of the present embodiment mainly includes an actuator wafer manufacturing process, a cover wafer manufacturing process, and an assembling process. Among them, the actuator wafer manufacturing process and the cover wafer manufacturing process can be performed in parallel.

<Actuator wafer fabrication process>
7 and 8 are process diagrams for explaining the mask formation process.
As shown in FIGS. 7 and 8, in the actuator wafer manufacturing process, a mask 105 to be used later in the first electrode forming process is first formed on the surface of the actuator wafer 101 (mask forming process). Specifically, first, a mask material such as a photosensitive dry film is attached to the surface of the actuator wafer 101. Thereafter, by patterning the mask material using a photolithography technique, a portion of the mask material located in the above-described formation region of the common wiring 62 is removed. As a result, a mask 105 having an opening 105a is formed in a portion located in the formation region of the common wiring 62.

9 to 11 are process diagrams for explaining a dicing line forming process. In FIG. 9 and subsequent figures, the above-described mask 105 (opening 105a) is indicated by a chain line.
Subsequently, as shown in FIGS. 9 and 10, the first dicing line 110 to be the discharge channel 54 later is formed by cutting using a dicer (not shown) or the like (first dicing line forming step). Specifically, a dicer is caused to enter the actuator wafer 101 from the surface side, and the dicer is caused to travel in the Z direction. Thereby, the actuator wafer 101 is cut together with the mask 105. Thereafter, the dicer is made to travel a predetermined amount, and then the dicer is retracted from the actuator wafer 101. Thereby, the first dicing line 110 is formed.

  At this time, in a side view as viewed from the X direction, both end portions in the Z direction of the first dicing line 110 are portions corresponding to the above-described rounded-up portions 54b, and have an arc shape that follows the radius of curvature of the dicer. The Note that the length in the Z direction of the first dicing line 110 (the amount of travel of the dicer) is set to a length of about two of the discharge channels 54. Then, in the first dicing line forming step, the above-described operation is repeatedly performed with respect to the actuator wafer 101 at intervals in the Z direction and the X direction to form a plurality of first dicing lines 110. That is, the actuator wafer 101 is connected in a state where the portions corresponding to the lower end portion and the portions corresponding to the upper end portion of the actuator plate 51 face each other.

  Next, as shown in FIGS. 9 and 11, a second dicing line 111 to be a dummy channel 55 later is formed (second dicing line forming step). Specifically, the dicer is caused to enter the portions of the actuator wafer 101 that are located on both sides in the X direction with respect to the first dicing line 110, and the dicer is run over the entire Z direction of the actuator wafer 101. Thereby, the actuator wafer 101 is cut together with the mask 105. In this embodiment, the processing depth by the dicer is uniform over the entire Z direction. The second dicing line 111 is formed so that the groove depth in the Y direction is deeper than the first dicing line 110.

12 and 13 are process diagrams for explaining the through hole forming process.
Subsequently, as shown in FIGS. 12 and 13, a through hole 91 that penetrates the actuator wafer 101 in the Y direction is formed (through hole forming step). Specifically, two through holes 91 are formed in the portion of the actuator wafer 101 located between the first dicing lines 110 adjacent in the Z direction with a gap in the Z direction. In the through hole forming step, a recess having a depth equivalent to that of the second dicing line 111 may be formed instead of the through hole 91.

14 to 16 are process diagrams for explaining the first electrode forming process.
Next, as shown in FIGS. 14 to 16, electrode materials that will later become various wires (common electrode 61, individual electrode 63, common wire 62, and lead wire 92) are formed on the actuator wafer 101 (first electrode forming step). ). In the first electrode formation step of the present embodiment, the electrodes 61 and 63 and the wirings 62 and 92 are formed by electroless plating. In the first electrode forming step, first, a catalyst is applied to a region of the actuator wafer 101 that is not covered with the mask 105. Specifically, a sensitizing process is performed in which the actuator wafer 101 is adsorbed with stannous chloride by being immersed in a stannous chloride aqueous solution. Subsequently, the actuator wafer 101 is lightly washed by water washing or the like. Thereafter, the actuator wafer 101 is immersed in an aqueous palladium chloride solution, and palladium chloride is adsorbed on the surface of the actuator wafer 101. Then, an oxidation-reduction reaction occurs between the palladium chloride adsorbed on the actuator wafer 101 and the stannous chloride adsorbed by the sensitizing process described above, so that metal palladium is deposited as a catalyst (activating). processing). Next, the actuator wafer 101 to which the catalyst (metal palladium) is applied is immersed in a plating solution, so that the plating film 120 is deposited on the portion of the actuator wafer 101 to which the catalyst is applied. The plating film 120 is also formed on the entire back surface of the actuator wafer 101.

  Next, the mask 105 formed on the surface of the actuator wafer 101 is removed by lift-off or the like.

<Cover wafer production process>
17 and 18 are process diagrams for explaining a cover wafer manufacturing process.
As shown in FIGS. 17 and 18, in the cover wafer manufacturing process, first, sandblasting or the like is performed on the cover wafer 102 from the front side through a mask (not shown) to form a common ink chamber 71 (common ink chamber forming process). At this time, the common ink chamber 71 is formed along the X direction on the cover wafer 102 at portions corresponding to both ends in the Z direction of the first dicing line 110 described above.

  Subsequently, sandblasting or the like is performed on the cover wafer 102 from the back side through a mask (not shown) to form slits 72 communicating with each other in the common ink chamber 71 (slit forming step). At this time, the slits 72 are separately formed on the cover wafer 102 at portions corresponding to both end portions of each first dicing line 110 in the Z direction. Each process of the cover wafer forming process is not limited to sand blasting, and may be performed by dicing or the like.

<Assembly process>
FIG. 19 is a process diagram for explaining the bonding process.
As shown in FIG. 19, in the assembly process, first, the actuator wafer 101 and the cover wafer 102 are laminated to form a wafer bonded body 103 (bonding process). Specifically, the back surface of the cover wafer 102 and the front surface of the actuator wafer 101 are bonded together.

20 and 21 are process diagrams for explaining the grinding process.
Next, as shown in FIGS. 20 and 21, the actuator wafer 101 is moved from the back side so that the first dicing line 110 does not penetrate the actuator wafer 101 and the second dicing line 111 penetrates the actuator wafer 101. Grind (grinding process).

FIG. 22 is a process diagram for explaining the second electrode formation process.
As shown in FIG. 22, pads 93 and 94 are formed on the back surface of the actuator wafer 101. Specifically, first, a mask 125 having openings for forming the pads 93 and 94 is set on the back surface of the actuator wafer 101. Thereafter, an electrode material is deposited on the back surface of the actuator wafer 101 by vapor deposition or the like. As a result, electrode materials to be the pads 93 and 94 are formed on the back surface of the actuator wafer 101 through the openings of the mask 125. For example, a metal mask or a photosensitive dry film can be used as the mask 125. Further, after the second electrode forming step is completed, the mask is removed from the back surface of the actuator wafer 101.

FIG. 23 is a process diagram for explaining the singulation process.
Subsequently, as shown in FIG. 23, the wafer bonded body 103 is cut for each first head chip 40A (individualization step). Specifically, a dicer is run in the X direction with respect to the intermediate position of each first dicing line 110 in the Z direction and a portion located between each first dicing line 110 in the wafer bonded body 103, and the wafer is moved. The joined body 103 is cut. At this time, the first dicing line 110 is divided at an intermediate position in the Z direction, and is divided at a portion positioned between the first dicing lines 110. Thereby, a plurality of first head chips 40A are cut out from one wafer bonded body 103.

Thus, in the inkjet head 5 of the present embodiment, the electrodes 61 and 63 are routed to at least the back side of the actuator plates 51 and 74 where the discharge channel 54 is not open.
According to this configuration, for example, the area of the area where the pads 93 and 94 can be formed can be secured as compared with the case where the pads 93 and 94 are formed on the surface side of the actuator plates 51 and 74 where the channels 54 and 55 are opened. . As a result, the degree of freedom of the layout of the pads 93 and 94 can be improved, and the wiring pattern can be simplified. In this case, the length of the tail in the Z direction can be shortened by forming the pads 93 and 94 further downward, for example, by drawing the lower end of the common pad 93 to a position where it overlaps the ejection channel 54 in the Y direction. Therefore, the chip length (the length in the Z direction) of the head chips 40A and 40B can be shortened, and the inkjet head 5 can be downsized.

In particular, in the present embodiment, the electrodes 61 and 63 are routed to the back surface through the tail portions of the actuator plates 51 and 74, respectively. Therefore, the wiring pattern can be further simplified as compared with a conventional configuration in which each electrode is routed through both end faces in the channel extending direction of the actuator plate.
In the present embodiment, since the electrodes 61 and 63 are routed to the back surface through the tail portions of the actuator plates 51 and 74, the crimping operation between the FPCs 96 and 97 and the pads 93 and 94 can be easily performed. Further, interference with peripheral members when the FPCs 96 and 97 are routed upward from the pads 93 and 94 can be avoided. Therefore, it is possible to facilitate the connecting work of the FPCs 96 and 97, such as the crimping work of the FPCs 96 and 97 to the pads 93 and 94 and the drawing work of the FPCs 96 and 97 to the control means.

  In the present embodiment, the common electrode 61 can be easily routed to the back surfaces of the actuator plates 51 and 74 by forming the lead wiring 92 on the inner surfaces of the through holes 91 of the actuator plates 51 and 74.

In the present embodiment, the head chips 40A and 40B are arranged with the cover plates 52 and 75 facing each other in the Y direction, and an inlet channel 77 communicating with the discharge channel 54 of each head chip 40A and 40B is provided. The flow path plate 41 is provided between the head chips 40A and 40B.
According to this configuration, since the back surfaces of the actuator plates 51 and 74 can be exposed to the outside in the Y direction, the FPCs 96 and 97 and the pads 93 and 94 can be easily connected in the two-row type inkjet head 5. It can be carried out.

  In this embodiment, since the cover plates 52 and 75 are laminated on the surface side of the actuator plates 51 and 74, the cover plates 52 and 75 and the pads 93 and 94 are arranged on different surfaces of the actuator plates 51 and 74. Will be. Therefore, for example, compared to a configuration in which the cover plates 52 and 75 and the pads 93 and 94 are arranged on the same surface (for example, the surface) of the actuator plates 51 and 74, the area of the region where the pads 93 and 94 can be formed can be secured. . Further, since the interference with the cover plates 52 and 75 can be avoided when the FPCs 96 and 97 are routed upward from the pads 93 and 94, the connection work of the FPCs 96 and 97 can be further facilitated.

In this embodiment, the spacer plate 43 having the circulation flow path 81 is disposed between the actuator plates 51 and 74 and the nozzle plate 44.
According to this configuration, since ink can be circulated between the head chips 40A and 40B and the ink tank 4, it is possible to suppress the retention of bubbles in the vicinity of the nozzle holes 83 and 84.

  And since the printer 1 of this embodiment is equipped with the inkjet head 5 mentioned above, the inexpensive and highly reliable printer 1 can be provided.

(Modification)
Next, a modification of the first embodiment will be described. FIG. 24 is an exploded perspective view of a head chip 140 according to a modification of the first embodiment. This modification differs from the first embodiment described above in that the common pad 163 is located above the individual pad 170. In the following description, the same components as those in the first embodiment described above are denoted by the same reference numerals and description thereof is omitted.

  As shown in FIG. 24, in the head chip 140 of this modification example, the upper end portion of the common wiring 162 reaches the upper end edge of the actuator plate 151. At the upper end edge of the actuator plate 151, a routing recess 150 that penetrates the actuator plate 151 in the Y direction is formed. The routing recess 150 is formed in a semicircular shape in plan view as viewed from the Y direction. The routing recess 150 is opened upward. A lead wiring 160 is formed on the inner surface of the routing recess 150. The lead-out wiring 160 is connected to the common wiring 162 at the opening edge of the recessed portion 150 at the inner end in the Y direction.

FIG. 25 is a perspective view of the actuator plate 151 viewed from the back side.
As shown in FIG. 25, a common pad 163 is formed on the back surface of the actuator plate 151. The common pad 163 extends in the Z direction on the back surface of the actuator plate 151. The common pad 163 has an upper end connected to the lead wiring 160 at the opening edge of the routing recess 150 described above, and a lower end terminating in the actuator plate 151.

  On the back surface of the actuator plate 151, an individual pad 170 is formed in a portion located below the common pad 163. The individual pads 170 are formed in a strip shape extending in the X direction. The individual pads 170 connect the individual electrodes 63 facing each other in the X direction with the ejection channel 54 interposed therebetween. The individual pad 170 is preferably formed so as to straddle the tail and the discharge channel 54 in the Z direction. Thereby, the chip length can be shortened.

  Even in this configuration, the same effects as those of the first embodiment described above can be achieved.

(Second Embodiment)
Next, a second embodiment will be described. FIG. 26 is an exploded perspective view of a head chip 240 according to the second embodiment. FIG. 27 is a perspective view of the actuator plate 251 viewed from the back side. This embodiment is different from the first embodiment described above in that the individual pads 220 are formed in the connection grooves 210 formed on the back surface of the actuator plate 251. In the following description, the same components as those in the first embodiment described above are denoted by the same reference numerals and description thereof is omitted.

  As shown in FIGS. 26 and 27, in the head chip 240 of this embodiment, a connection groove 210 that is recessed toward the inside in the Y direction is formed on the back surface of the actuator plate 251. The connection groove 210 is formed in a portion located above the through hole 91 on the back surface of the actuator plate 251. The connection groove 210 is opened upward on the upper end surface of the actuator plate 251. Note that the bottom surface (inner end surface in the Y direction) of the connection groove 210 is located outside the bottom surface (outer end surface in the Y direction) of the discharge channel 54 in the Y direction. Further, the connection groove 210 may be formed in a portion of the tail portion of the actuator plate 251 located below the through hole 91.

  On the inner surface of the connection groove 210, an individual pad 220 for connecting the individual electrodes 63 facing each other in the X direction with the discharge channel 54 interposed therebetween is formed. The individual pad 220 is formed over the entire inner surface of the connection groove 210. In the present embodiment, it is preferable to use a so-called bump FPC as the FPC (not shown). In this case, the FPC is connected to the lead-out wiring 92 in the through hole 91 and the individual pad 220 in the connection groove 210 via the bump.

Next, a method for manufacturing the head chip 240 of the second embodiment will be described. FIG. 28 is a process diagram for explaining a third dicing line formation step and an electrode formation step. In the following description, description of steps similar to those in the first embodiment described above will be omitted.
As shown in FIG. 28, in the present embodiment, in the actuator wafer manufacturing process, for example, after the through hole forming process, the third dicing line 260 to be the connection groove 210 is formed (third dicing line forming process). Specifically, in the third dicing line forming step, a dicer is caused to travel in the X direction with respect to a portion located between the through holes 91 in the Z direction on the back surface of the actuator wafer 261. At this time, the third dicing line 260 is formed to a depth such that the bottom surface (inner end surface in the Y direction) is located outside the bottom surface of the first dicing line 110 (outer end surface in the Y direction). .

Subsequently, the plating film 120 is formed on the actuator wafer 261 by the same method as the first electrode formation step of the first embodiment. Thereby, the plating film 120 is also formed on the inner surface of the third dicing line 260. Note that the third dicing line formation step may be performed before the through hole formation step, the first dicing line formation step, and the second dicing line formation step.
Further, after the third dicing line process, the process up to the bonding process is performed by the same method as in the first embodiment described above.

29 and 30 are process diagrams for explaining the grinding process.
29 and 30, the first dicing line 110 does not penetrate the actuator wafer 261, the second dicing line 111 does not penetrate the actuator wafer 261, and the third dicing line 260 is not removed. The actuator wafer 261 is ground from the back side. Then, only a portion formed on the inner surface of the third dicing line 260 remains in the plating film 120 formed on the back surface side of the actuator wafer 261.

  Then, the singulation process is performed by the same method as in the first embodiment. At this time, the third dicing line 260 is divided at an intermediate position in the Z direction, whereby the connection groove 210 described above is formed.

  Thus, in this embodiment, when the plating film 120 formed on the back surface of the actuator wafer 261 is removed by grinding or the like by electroless plating, the plating film 120 remaining in the connection groove 210 is used as the individual pad 220. can do. Thereby, in an electrode formation process, in addition to each electrode and wiring, the individual pad 220 can be formed in a lump. Therefore, it is not necessary to separately perform an electrode forming process for forming the individual pads 220 on the back surface of the actuator wafer 261, and thus the manufacturing efficiency can be improved.

  The technical scope of the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit of the present invention.

  For example, in the above-described embodiment, the ink jet printer 1 is described as an example of the liquid ejecting apparatus, but the present invention is not limited to the printer. For example, a fax machine or an on-demand printer may be used.

  In the above-described embodiment, the two-row type inkjet head 5 in which the nozzle holes 83 and 84 are arranged in two rows has been described. However, the present invention is not limited to this. For example, the inkjet head 5 may have three or more rows of nozzle holes, or the inkjet head 5 may have one row of nozzle holes.

In the embodiment described above, the circulation type in which the ink circulates between the inkjet head 5 and the ink tank 4 among the edge shoot types has been described, but the present invention is not limited thereto.
Further, the present invention may be applied to a so-called side shoot type ink jet head that ejects ink from a central portion of the ejection channel in the channel extending direction.
In the above-described embodiment, the configuration in which the dummy channel 55 penetrates in the Y direction over the entire Z direction in the actuator plate has been described. However, the present invention is not limited to this, and only if the actuator plate penetrates only the tail portion of the actuator plate. I do not care. In this case, the individual pad and the individual electrode 63 may be connected through a portion of the dummy channel 55 that penetrates the actuator plate in the Y direction.
In the above-described embodiment, the configuration using the chevron substrate as the actuator plate has been described, but the configuration is not limited thereto. That is, a piezoelectric substrate whose polarization direction is the thickness direction and unidirectional may be used as the actuator plate.

  In the above-described embodiment, the case where the lead-out wiring is formed on the inner surface of the through hole 91 or the routing recess 150 has been described, but the present invention is not limited thereto. The design of the lead-out wiring can be changed as appropriate as long as the common wiring is routed around the back surface of the actuator plate.

  In addition, in the range which does not deviate from the meaning of this invention, it is possible to replace suitably the component in the embodiment mentioned above by a known component, and you may combine each modification mentioned above suitably.

DESCRIPTION OF SYMBOLS 1 ... Inkjet printer 2 ... Conveyance means (movement mechanism)
3 ... Conveying means (moving mechanism)
5, 5B, 5C, 5M, 5Y ... Inkjet head (liquid ejecting head)
7. Scanning means (moving mechanism)
41 ... Flow path plate 43 ... Spacer plate 51 ... First actuator plate 52 ... First cover plate 54 ... Discharge channel (injection channel)
55 ... Dummy channel 61 ... Common electrode 62 ... Common wiring 63 ... Individual electrode 72 ... Slit (liquid introduction path)
74 ... Second actuator plate 75 ... Second cover plate 77 ... Inlet channel 78 ... Outlet channel 81 ... First circulation channel (circulation channel)
82 ... Second circulation channel (circulation channel)
83 ... 1st nozzle hole (injection hole)
84 ... Second nozzle hole (injection hole)
92 ... Lead wiring 93 ... Common pad 94 ... Individual pad 151 ... Actuator plate 160 ... Lead wiring 162 ... Common wiring 163 ... Common pad 170 ... Individual pad 210 ... Connection groove 220 ... Individual pad 251 ... Actuator plate

Claims (8)

An ejection channel filled with a liquid that extends along the first direction on the surface of the actuator plate and is arranged in parallel in the second direction intersecting the first direction;
On the surface of the actuator plate, the jet channel is alternately arranged in the second direction, and the liquid penetrating the actuator plate in the third direction orthogonal to the first direction and the second direction is not filled. A dummy channel,
An individual electrode formed on the inner surface of the dummy channel;
A common electrode formed on the inner surface of the ejection channel;
Of the actuator plate, one end side in the first direction with respect to the ejection channel, formed on the surface of the tail portion located between the dummy channels adjacent in the second direction, and connected to the common electrode Common wiring,
A lead-out wiring that pulls out the common wiring on the back side of the tail in the actuator plate;
A liquid ejecting head comprising: an individual pad that is formed on the back surface of the tail portion of the actuator plate and that connects the individual electrodes facing each other in the second direction across the ejection channel. .   2. The liquid jet head according to claim 1, wherein a connection groove that is recessed toward the front surface side is formed in a portion of the back surface of the actuator plate where the individual pad is formed.   The common pad which extends toward the other end side in the first direction is formed on the back surface of the actuator plate and connected to the lead-out wiring. The liquid jet head described.   The liquid ejecting head according to claim 1, wherein the lead-out wiring is formed on an inner surface of a through hole formed in the tail portion of the actuator plate. A cover plate that covers the ejection channel and the dummy channel in the third direction is disposed on the surface side of the actuator plate,
5. The liquid ejecting head according to claim 1, wherein the cover plate is formed with a liquid introduction path that communicates with each other in the ejection channel. 6. The actuator plate includes a first actuator plate and a second actuator plate arranged with the surfaces facing each other in the third direction,
The cover plate includes a first cover plate disposed on the surface side of the first actuator plate, and a second cover plate disposed on the surface side of the second actuator plate,
A flow path plate is disposed between the first cover plate and the second cover plate,
6. The liquid jet head according to claim 5, wherein the flow path plate is formed with an inlet flow path communicating with the liquid introduction path of the first cover plate and the second cover plate. The ejection channel opens at the other end surface of the first actuator plate and the second actuator plate in the first direction,
On the other end side in the first direction of the first actuator plate and the second actuator plate, an injection plate having an injection hole communicating with the injection channel is disposed.
Between the first actuator plate, the second actuator plate, and the injection plate in the first direction, a spacer plate having a circulation channel that communicates the injection channel and the injection hole separately is disposed. ,
The liquid ejecting head according to claim 6, wherein an outlet channel that communicates with the circulation channel is formed in the channel plate. A liquid ejecting head according to any one of claims 1 to 7,
A liquid ejecting apparatus comprising: a moving mechanism that relatively moves the liquid ejecting head and the recording medium.

Images