JP6531339B2 - 木質床材用1液型常温湿気硬化性接着剤組成物 - Google Patents
木質床材用1液型常温湿気硬化性接着剤組成物 Download PDFInfo
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- JP6531339B2 JP6531339B2 JP2015053787A JP2015053787A JP6531339B2 JP 6531339 B2 JP6531339 B2 JP 6531339B2 JP 2015053787 A JP2015053787 A JP 2015053787A JP 2015053787 A JP2015053787 A JP 2015053787A JP 6531339 B2 JP6531339 B2 JP 6531339B2
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- wood flooring
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- curable adhesive
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- 239000000203 mixture Substances 0.000 title claims description 47
- 239000000853 adhesive Substances 0.000 title claims description 46
- 238000009408 flooring Methods 0.000 title claims description 38
- 239000002023 wood Substances 0.000 title claims description 27
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- 125000005702 oxyalkylene group Chemical group 0.000 claims description 49
- 150000001875 compounds Chemical class 0.000 claims description 30
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 24
- 229910052710 silicon Inorganic materials 0.000 claims description 18
- 125000003277 amino group Chemical group 0.000 claims description 14
- 150000003606 tin compounds Chemical class 0.000 claims description 13
- 239000003822 epoxy resin Substances 0.000 claims description 12
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- 238000010438 heat treatment Methods 0.000 claims description 9
- 125000003700 epoxy group Chemical group 0.000 claims description 8
- 239000010703 silicon Substances 0.000 claims description 8
- -1 trimethoxysilyl group Chemical group 0.000 description 31
- 239000000463 material Substances 0.000 description 25
- 125000004432 carbon atom Chemical group C* 0.000 description 17
- 239000003054 catalyst Substances 0.000 description 17
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- 239000002585 base Substances 0.000 description 6
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 6
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 6
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- 229920001577 copolymer Polymers 0.000 description 5
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- XYYQWMDBQFSCPB-UHFFFAOYSA-N dimethoxymethylsilane Chemical compound COC([SiH3])OC XYYQWMDBQFSCPB-UHFFFAOYSA-N 0.000 description 4
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- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 4
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- 238000003786 synthesis reaction Methods 0.000 description 4
- 230000008719 thickening Effects 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 3
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 3
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- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000002318 adhesion promoter Substances 0.000 description 3
- 125000001931 aliphatic group Chemical group 0.000 description 3
- 150000001412 amines Chemical class 0.000 description 3
- 125000002344 aminooxy group Chemical group [H]N([H])O[*] 0.000 description 3
- 125000003710 aryl alkyl group Chemical group 0.000 description 3
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N butyric aldehyde Natural products CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 description 3
- 239000007795 chemical reaction product Substances 0.000 description 3
- 238000013329 compounding Methods 0.000 description 3
- 125000000753 cycloalkyl group Chemical group 0.000 description 3
- 150000002148 esters Chemical class 0.000 description 3
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 125000000524 functional group Chemical group 0.000 description 3
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 3
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 3
- 239000011120 plywood Substances 0.000 description 3
- 229920000058 polyacrylate Polymers 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 229920000573 polyethylene Polymers 0.000 description 3
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical class [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 3
- 239000011122 softwood Substances 0.000 description 3
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- 238000012360 testing method Methods 0.000 description 3
- HXVNBWAKAOHACI-UHFFFAOYSA-N 2,4-dimethyl-3-pentanone Chemical compound CC(C)C(=O)C(C)C HXVNBWAKAOHACI-UHFFFAOYSA-N 0.000 description 2
- NXQMCAOPTPLPRL-UHFFFAOYSA-N 2-(2-benzoyloxyethoxy)ethyl benzoate Chemical compound C=1C=CC=CC=1C(=O)OCCOCCOC(=O)C1=CC=CC=C1 NXQMCAOPTPLPRL-UHFFFAOYSA-N 0.000 description 2
- SYBYTAAJFKOIEJ-UHFFFAOYSA-N 3-Methylbutan-2-one Chemical compound CC(C)C(C)=O SYBYTAAJFKOIEJ-UHFFFAOYSA-N 0.000 description 2
- HCFAJYNVAYBARA-UHFFFAOYSA-N 4-heptanone Chemical compound CCCC(=O)CCC HCFAJYNVAYBARA-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- IRIAEXORFWYRCZ-UHFFFAOYSA-N Butylbenzyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCC1=CC=CC=C1 IRIAEXORFWYRCZ-UHFFFAOYSA-N 0.000 description 2
- 239000004215 Carbon black (E152) Substances 0.000 description 2
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 2
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- NBBJYMSMWIIQGU-UHFFFAOYSA-N Propionic aldehyde Chemical compound CCC=O NBBJYMSMWIIQGU-UHFFFAOYSA-N 0.000 description 2
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- YZCKVEUIGOORGS-IGMARMGPSA-N Protium Chemical compound [1H] YZCKVEUIGOORGS-IGMARMGPSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- YRKCREAYFQTBPV-UHFFFAOYSA-N acetylacetone Chemical compound CC(=O)CC(C)=O YRKCREAYFQTBPV-UHFFFAOYSA-N 0.000 description 2
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- 125000004423 acyloxy group Chemical group 0.000 description 2
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- 239000011324 bead Substances 0.000 description 2
- 125000002511 behenyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
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- ZUMQLFHCCNIEAO-UHFFFAOYSA-N bis(ethenyl)-silyloxysilane platinum Chemical compound [Pt].[SiH3]O[SiH](C=C)C=C ZUMQLFHCCNIEAO-UHFFFAOYSA-N 0.000 description 2
- HQABUPZFAYXKJW-UHFFFAOYSA-N butan-1-amine Chemical compound CCCCN HQABUPZFAYXKJW-UHFFFAOYSA-N 0.000 description 2
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- XPZBNIUWMDJFPW-UHFFFAOYSA-N 2,2,3-trimethylcyclohexan-1-one Chemical compound CC1CCCC(=O)C1(C)C XPZBNIUWMDJFPW-UHFFFAOYSA-N 0.000 description 1
- AVFZQHWFGFKQIG-UHFFFAOYSA-N 2,2,3-trimethylcyclopentan-1-one Chemical compound CC1CCC(=O)C1(C)C AVFZQHWFGFKQIG-UHFFFAOYSA-N 0.000 description 1
- LTMRRSWNXVJMBA-UHFFFAOYSA-L 2,2-diethylpropanedioate Chemical compound CCC(CC)(C([O-])=O)C([O-])=O LTMRRSWNXVJMBA-UHFFFAOYSA-L 0.000 description 1
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- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- 125000005369 trialkoxysilyl group Chemical group 0.000 description 1
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 1
- GKASDNZWUGIAMG-UHFFFAOYSA-N triethyl orthoformate Chemical compound CCOC(OCC)OCC GKASDNZWUGIAMG-UHFFFAOYSA-N 0.000 description 1
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- LTOKKZDSYQQAHL-UHFFFAOYSA-N trimethoxy-[4-(oxiran-2-yl)butyl]silane Chemical compound CO[Si](OC)(OC)CCCCC1CO1 LTOKKZDSYQQAHL-UHFFFAOYSA-N 0.000 description 1
- UEFJJFILJJDEFC-UHFFFAOYSA-N trimethoxy-[8-(oxiran-2-yl)octyl]silane Chemical compound CO[Si](OC)(OC)CCCCCCCCC1CO1 UEFJJFILJJDEFC-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
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Description
なお、式(3):
(D)架橋性珪素基を有するエポキシ系化合物としては、例えば、4−オキシラニルブチルトリメトキシシラン、8−オキシラニルオクチルトリメトキシシラン、3−グリシドキシプロピルトリメトキシシラン、3−グリシドキシプロピルメチルジメトキシシラン、3−グリシドキシプロピルトリエトキシシラン等が挙げられる。
(D)成分は、単独で使用してもよく、2種類以上併用してもよいが、架橋性珪素基を有する脂環式エポキシ化合物は含有していないことが好ましい。
エポキシ樹脂としては、ビスフェノールA型エポキシ樹脂、ビスフェノールF型エポキシ樹脂等の一般に用いられているエポキシ樹脂を用いることができる。
数平均分子量が約3,000のポリオキシプロピレンジオールを開始剤とし、亜鉛ヘキサシアノコバルテートグライム錯体触媒にてプロピレンオキシドの重合を行い、数平均分子量が14,600(送液システムとして東ソー製HLC−8120GPCを用い、カラムは東ソー製TSK−GEL Hタイプを用い、溶媒はTHFを用いて測定したポリスチレン換算分子量)のポリオキシプロピレングリコールを得た。続いてこの水酸基末端ポリオキシプロピレンジオールの水酸基に対して1.2倍当量のNaOMeのメタノール溶液を添加してメタノールを留去し、さらに3−クロロ−1−プロペンを添加して末端の水酸基をアリル基に変換した。次に得られたアリル基末端ポリオキシプロピレン100重量部に対して白金ジビニルジシロキサン錯体(白金換算で3重量%のイソプロパノール溶液36ppmを加え撹拌しながら、ジメトキシメチルシラン1.7重量部をゆっくりと滴下した。その混合溶液を90℃で2時間反応させた後、未反応のジメトキシメチルシランを減圧下留去することにより、末端がジメトキシメチルシリル基であり、1分子あたりのケイ素基が平均1.5個、数平均分子量14,600である、直鎖状の反応性ケイ素基含有ポリオキシプロピレン重合体(A−1)を得た。
数平均分子量が約4,800(合成例1と同様の方法で算出)のポリプロピレングリコールの水酸基に対して1.2倍当量のNaOMeのメタノール溶液を添加してメタノールを留去し、さらに3−クロロ−1−プロペンを添加して末端の水酸基をアリル基に変換した。次に得られたアリル基末端ポリオキシプロピレン100重量部に対して白金ジビニルジシロキサン錯体(白金換算で3重量%のイソプロパノール溶液)36ppmを加え撹拌しながら、ジメトキシメチルシラン5.99重量部をゆっくりと滴下した。その混合溶液を90℃で2時間反応させた後、未反応のジメトキシメチルシランを減圧下留去することにより、末端がジメトキシメチルシリル基であり、1分子あたりのケイ素基が平均1.5個、数平均分子量が4,800である、直鎖状の反応性ケイ素基含有ポリオキシプロピレン重合体(A−2)を得た。
表1に示した(A)成分の架橋性珪素基を有するオキシアルキレン重合体として、合成例で合成した重合体A−1及びA−2を用い、充填剤及び可塑剤を表1に示した量割合で仕込み、加熱減圧混合撹拌を110℃にて2時間行い、配合物質の脱水を行った。さらに、(B)成分の架橋性珪素基及びアミノ基を有する化合物のイミン誘導体、(C)成分の4価の錫化合物、(D)成分の架橋性珪素基を有するエポキシ系化合を所定量添加し、撹拌配合して硬化性接着剤組成物を調製した。(D)成分の使用量としては、前記(B)成分から発生する活性水素1に対して前記(D)成分のエポキシ基が0.5であった。
*1:信越化学工業(株)製、MIBK(メチルイソブチルケトン)と3−アミノプロピルトリメトキシシランの反応物
*2:信越化学工業(株)製、3−アミノプロピルトリメトキシシラン
*3:日東化成(株)製、ジブチル錫塩とテトラエトキシシランとの反応生成物
*4:信越化学工業(株)製、3−グリシドキシプロピルトリエトキシシラン[エポキシシラン]
*5:三菱化学(株)製、ビスフェノールA型エポキシ樹脂
*6:白石カルシウム(株)製、重質炭酸カルシウム
*7:白石カルシウム(株)製、脂肪酸処理膠質炭酸カルシウム
*8:住友スリーエム(株)製、ガラス微小中空球
*9:三井化学(株)製、ポリプロピレントリオール
*10:コルコート(株)製、テトラエトキシシラン
*11:(株)アデカ製、ヒンダードフェノール系酸化防止剤
次のようにして、床材の接着に使用した場合の目隙の大きさを測定した。
床材10(フローリング材、朝日ウッドテック製ニューフォルテフロア 長さ910mm×幅303mm×厚さ12mm)の短手方向に接着剤14を約300mm間隔で幅10mmのビード状に4か所塗布した後、下地針葉樹合板16(長さ1820mm×幅910mm×厚さ28mm)上に図1のように積層した。フローリング材のオス実側を300mm間隔でフロアタッカー12(マックス製38mmフロアステープル(438フロア))で固定した後、23℃50%RH下で1週間養生しフローリング材長手方向の長さをノギスにて測定した。この試験体を60℃で3日間乾燥させた後、同様にフローリング材の長さを測定し、60℃3日間乾燥前後でのフローリング材の収縮長さ(1820mmあたり)を算出した。なお、下地針葉樹合板はあらかじめ60℃で1週間乾燥しておき経時的に収縮しないようにした。床拘束性の試験は、下記評価基準により評価した。
0〜0.4mm以下を◎、0.4mmを超えて0.5mm以下の場合を○、0.5mmを超えて0.8mm以下の場合を△、0.8mmを超える場合を×とした。
接着剤組成物の調製直後(貯蔵前)、及び密閉容器内で50℃の条件で7日経過後(貯蔵後)の23℃での粘度をそれぞれ測定し、増粘率を算出した。また、同様の条件で貯蔵前後の23℃50%RH下16時間養生後の硬化性を、ポリエチレン製容器に充填した接着剤の表面を指触により確認した。接着剤が指に付着しなければ硬化、付着すれば未硬化とした。貯蔵安定性(増粘率及び硬化性)は下記評価基準により評価した。
×:増粘率2倍超え又は貯蔵前後のいずれかもしくは両方で未硬化、△:増粘率2〜1.5倍及び貯蔵前後の両方で硬化、○:増粘率1.5倍未満及び貯蔵前後の両方で硬化。
Claims (7)
- (A)珪素原子に結合した水酸基又は加水分解性基を有し、シロキサン結合を形成することにより架橋し得る珪素含有基を有するオキシアルキレン系重合体、
(B)分子中に珪素原子に結合した水酸基又は加水分解性基を有し、シロキサン結合を形成することにより架橋し得る珪素含有基及びアミノ基を有する化合物のイミン誘導体、
(C)4価の錫化合物、及び
(D)架橋性珪素基を有するエポキシ系化合物、
を含有し、
エポキシ樹脂が、(A)成分100質量部に対し、5質量部以下である、木質床材用1液型常温湿気硬化性接着剤組成物。 - エポキシ樹脂を含有しない、請求項1記載の木質床材用1液型常温湿気硬化性接着剤組成物。
- 前記(D)エポキシ系化合物が架橋性珪素基を有し、1個のエポキシ基を有するエポキシ系化合物である、請求項1又は2記載の木質床材用1液型常温湿気硬化性接着剤組成物。
- 前記(A)オキシアルキレン系重合体が、数平均分子量が8,000〜50,000のオキシアルキレン系重合体と2,000〜6,000のオキシアルキレン系重合体の併用である、請求項1〜3のいずれか1項記載の木質床材用1液型常温湿気硬化性接着剤組成物。
- 前記(C)錫化合物がジアルキル錫系化合物であることを特徴とする請求項1〜4のいずれか1項記載の木質床材用1液型常温湿気硬化性接着剤組成物。
- 木質床材が床暖房用パネルに接着される木質床材であることを特徴とする請求項1〜5のいずれか1項記載の木質床材用1液型常温湿気硬化性接着剤組成物。
- 請求項1〜6のいずれか1項記載の木質床材用1液型常温湿気硬化性接着剤組成物を用いてなる、床構造体。
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