JP6530893B2 - 結合を低減するためのワイヤボンド壁を有する半導体パッケージ - Google Patents
結合を低減するためのワイヤボンド壁を有する半導体パッケージ Download PDFInfo
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Description
Claims (20)
- 基板と、
前記基板上の第1の回路であって、該第1の回路は、第1の電気デバイス、第2の電気デバイス、ならびに、前記第1の電気デバイスおよび前記第2の電気デバイスを相互接続する第1のワイヤ・ボンド・アレイを含む、第1の回路と、
前記第1の回路に隣接する、前記基板上の第2の回路であって、該第2の回路は、第3の電気デバイス、第4の電気デバイス、ならびに、前記第3の電気デバイスおよび前記第4の電気デバイスを相互接続する第2のワイヤ・ボンド・アレイを含む、第2の回路と、
前記第1の回路および前記第2の回路の各々に沿ったルートを形成するように前記第1の回路と前記第2の回路との間で前記基板上に配置された複数の接続パッドと、
前記第1の回路と前記第2の回路との間で前記基板の上に複数のワイヤボンドを含み、且つ前記複数の接続パッドを電気的に接続する、ワイヤボンド壁であって、該ワイヤボンド壁は、前記第1の回路および前記第2の回路の少なくとも一方の動作中に前記第1の回路と前記第2の回路との間の電磁結合を遮断するシールドとして動作するように構成されている、ワイヤボンド壁とを備える、パッケージ。 - 前記複数のワイヤボンドは相互接続されており、前記基板の、前記第1の回路および前記第2の回路の少なくとも一部分の間に位置する領域に沿って延在している、請求項1に記載のパッケージ。
- 前記複数のワイヤボンドは、少なくとも第1の列のワイヤボンドおよび第2の列のワイヤボンドにて配置されており、前記第1の列のワイヤボンドは前記第2の列のワイヤボンドと平行に配置されている、請求項2に記載のパッケージ。
- 前記第1の回路はドハティ増幅器のキャリア増幅器である、請求項1に記載のパッケージ。
- 前記第2の回路はドハティ増幅器のピーク増幅器である、請求項4に記載のパッケージ。
- 前記ワイヤボンド壁はグランド電圧端子に接続されている、請求項1に記載のパッケージ。
- 前記ワイヤボンド壁は集積型受動デバイスに接続されている、請求項1に記載のパッケージ。
- 前記集積型受動デバイスのキャパシタンスおよびインダクタンスの少なくとも一方は、前記集積型受動デバイスが前記ワイヤボンド壁に接続されているときに、特定の周波数帯の前記第1の回路と前記第2の回路との間の電磁結合を低減するように選択されている、請求項7に記載のパッケージ。
- 前記第1の電気デバイス、第2の電気デバイス、第3の電気デバイス、および第4の電気デバイスの少なくとも1つは、キャパシタ、およびトランジスタの少なくとも一方を含む、請求項1に記載のパッケージ。
- 基板と、
前記基板上のキャリア増幅器と、
前記キャリア増幅器に隣接する、前記基板上のピーク増幅器と、
前記基板上の複数のワイヤボンドであって、該複数のワイヤボンドは、相互接続されており、前記基板の、前記キャリア増幅器および前記ピーク増幅器の少なくとも一部分の間に位置する領域に沿って延在しており、該複数のワイヤボンドは、前記キャリア増幅器および前記ピーク増幅器の少なくとも一方の動作中に前記キャリア増幅器と前記ピーク増幅器との間の電磁結合を遮断するシールドとして動作するように構成されたワイヤボンド壁を形成する、複数のワイヤボンドとを備える、ドハティ増幅器パッケージ。 - 前記キャリア増幅器および前記ピーク増幅器の各々に沿ったルートを形成するように前記キャリア増幅器と前記ピーク増幅器との間で前記基板の上に配置された複数の接続パッドを含み、前記複数のワイヤボンドは、前記複数の接続パッドを電気的に相互接続する、請求項10に記載のドハティ増幅器パッケージ。
- 前記複数の接続パッドはグランド電圧に接続されている、請求項11に記載のドハティ増幅器パッケージ。
- 前記複数のワイヤボンドはグランド電圧端子に接続されている、請求項10に記載のドハティ増幅器パッケージ。
- 前記複数のワイヤボンドは集積型受動デバイスに接続されている、請求項10に記載のドハティ増幅器パッケージ。
- 前記集積型受動デバイスのキャパシタンスおよびインダクタンスの少なくとも一方は、前記集積型受動デバイスが前記複数のワイヤボンドに接続されているときに、および、前記キャリア増幅器および前記ピーク増幅器の少なくとも一方の動作中に、特定の周波数帯の前記キャリア増幅器と前記ピーク増幅器との間の電磁結合を低減するように選択されている、請求項14に記載のドハティ増幅器パッケージ。
- 前記キャリア増幅器は、該キャリア増幅器の第1の電気デバイスと該キャリア増幅器の第2の電気デバイスとを相互接続する第1のワイヤ・ボンド・アレイを含み、
前記ピーク増幅器は、該ピーク増幅器の第3の電気デバイスと該ピーク増幅器の第4の電気デバイスとを相互接続する第2のワイヤ・ボンド・アレイを含む、請求項10に記載のドハティ増幅器パッケージ。 - 基板上にキャリア増幅器を取り付ける工程と、
前記キャリア増幅器に隣接して、前記基板上にピーク増幅器を取り付ける工程と、
前記基板の、前記キャリア増幅器および前記ピーク増幅器の少なくとも一部分の間に位置する領域に沿って、前記基板上に複数の相互接続されたワイヤボンドを形成する工程であって、該複数のワイヤボンドは、前記キャリア増幅器および前記ピーク増幅器の少なくとも一方の動作中に前記キャリア増幅器と前記ピーク増幅器との間の電磁結合を遮断するシールドとして動作するように構成されたワイヤボンド壁を形成する、形成する工程とを備える、方法。 - 前記キャリア増幅器および前記ピーク増幅器の各々に沿ったルートを形成するように、前記キャリア増幅器と前記ピーク増幅器との間で、前記基板の上に複数の接続パッドを形成する工程を含み、前記複数のワイヤボンドは、前記複数の接続パッドを電気的に相互接続する、請求項17に記載の方法。
- 前記複数の接続パッドをグランド電圧端子に接続する工程を含む、請求項18に記載の方法。
- 前記基板に集積型受動デバイスを載置する工程と、
前記複数のワイヤボンドを前記集積型受動デバイスに接続する工程とを含む、請求項17に記載の方法。
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