JP6526811B2 - Iii族窒化物結晶を加工する方法 - Google Patents
Iii族窒化物結晶を加工する方法 Download PDFInfo
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- JP6526811B2 JP6526811B2 JP2017529046A JP2017529046A JP6526811B2 JP 6526811 B2 JP6526811 B2 JP 6526811B2 JP 2017529046 A JP2017529046 A JP 2017529046A JP 2017529046 A JP2017529046 A JP 2017529046A JP 6526811 B2 JP6526811 B2 JP 6526811B2
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- group iii
- nitride
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- 239000013078 crystal Substances 0.000 title claims description 250
- 150000004767 nitrides Chemical class 0.000 title claims description 111
- 238000000034 method Methods 0.000 title claims description 94
- 238000012545 processing Methods 0.000 title claims description 40
- 239000000758 substrate Substances 0.000 claims description 81
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 72
- 229910052757 nitrogen Inorganic materials 0.000 claims description 36
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 20
- 239000001301 oxygen Substances 0.000 claims description 20
- 229910052760 oxygen Inorganic materials 0.000 claims description 20
- 239000012071 phase Substances 0.000 claims description 20
- 238000002248 hydride vapour-phase epitaxy Methods 0.000 claims description 17
- 238000000227 grinding Methods 0.000 claims description 10
- 238000000926 separation method Methods 0.000 claims description 10
- 238000001816 cooling Methods 0.000 claims description 9
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 77
- 229910002601 GaN Inorganic materials 0.000 description 72
- 235000012431 wafers Nutrition 0.000 description 37
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 30
- 229910021529 ammonia Inorganic materials 0.000 description 15
- 239000003795 chemical substances by application Substances 0.000 description 12
- 229910052594 sapphire Inorganic materials 0.000 description 12
- 239000010980 sapphire Substances 0.000 description 12
- 238000007726 management method Methods 0.000 description 10
- 230000008569 process Effects 0.000 description 9
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 7
- 229910052733 gallium Inorganic materials 0.000 description 7
- 230000008859 change Effects 0.000 description 6
- 235000015097 nutrients Nutrition 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- 230000008901 benefit Effects 0.000 description 5
- 238000007716 flux method Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 5
- 229910010271 silicon carbide Inorganic materials 0.000 description 5
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 4
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 229910003460 diamond Inorganic materials 0.000 description 4
- 239000010432 diamond Substances 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 238000004544 sputter deposition Methods 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 238000004458 analytical method Methods 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- -1 InN Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- KEAYESYHFKHZAL-UHFFFAOYSA-N Sodium Chemical compound [Na] KEAYESYHFKHZAL-UHFFFAOYSA-N 0.000 description 2
- 238000002441 X-ray diffraction Methods 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- UPWPDUACHOATKO-UHFFFAOYSA-K gallium trichloride Chemical compound Cl[Ga](Cl)Cl UPWPDUACHOATKO-UHFFFAOYSA-K 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 230000005693 optoelectronics Effects 0.000 description 2
- 238000005001 rutherford backscattering spectroscopy Methods 0.000 description 2
- 239000006104 solid solution Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 2
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- 229910002704 AlGaN Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 229910000756 V alloy Inorganic materials 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 1
- 150000001342 alkaline earth metals Chemical class 0.000 description 1
- 230000003466 anti-cipated effect Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000012512 characterization method Methods 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 238000013500 data storage Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000001534 heteroepitaxy Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910000623 nickel–chromium alloy Inorganic materials 0.000 description 1
- 238000010397 one-hybrid screening Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000002128 reflection high energy electron diffraction Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000004627 transmission electron microscopy Methods 0.000 description 1
- 238000000927 vapour-phase epitaxy Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/40—AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
- C30B29/403—AIII-nitrides
- C30B29/406—Gallium nitride
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/16—Controlling or regulating
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B7/00—Single-crystal growth from solutions using solvents which are liquid at normal temperature, e.g. aqueous solutions
- C30B7/10—Single-crystal growth from solutions using solvents which are liquid at normal temperature, e.g. aqueous solutions by application of pressure, e.g. hydrothermal processes
- C30B7/105—Single-crystal growth from solutions using solvents which are liquid at normal temperature, e.g. aqueous solutions by application of pressure, e.g. hydrothermal processes using ammonia as solvent, i.e. ammonothermal processes
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201462086699P | 2014-12-02 | 2014-12-02 | |
US62/086,699 | 2014-12-02 | ||
PCT/US2015/063528 WO2016090045A1 (en) | 2014-12-02 | 2015-12-02 | Group iii nitride crystals, their fabrication method, and method of fabricating bulk group iii nitride crystals in supercritical ammonia |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017536325A JP2017536325A (ja) | 2017-12-07 |
JP6526811B2 true JP6526811B2 (ja) | 2019-06-05 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017529046A Active JP6526811B2 (ja) | 2014-12-02 | 2015-12-02 | Iii族窒化物結晶を加工する方法 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP6526811B2 (zh) |
CN (1) | CN107002278B (zh) |
WO (1) | WO2016090045A1 (zh) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9822465B2 (en) | 2006-04-07 | 2017-11-21 | Sixpoint Materials, Inc. | Method of fabricating group III nitride with gradually degraded crystal structure |
JP7117690B2 (ja) * | 2017-09-21 | 2022-08-15 | 国立大学法人大阪大学 | Iii-v族化合物結晶の製造方法および半導体装置の製造方法 |
JP6899958B2 (ja) * | 2018-03-29 | 2021-07-07 | 日本碍子株式会社 | 13族元素窒化物層、自立基板、機能素子および13族元素窒化物層の製造方法 |
EP4108812A1 (en) | 2021-06-24 | 2022-12-28 | Instytut Wysokich Cisnien Polskiej Akademii Nauk | A method for reducing a lateral growth of crystals |
EP4144893A1 (en) * | 2021-09-06 | 2023-03-08 | Instytut Wysokich Cisnien Polskiej Akademii Nauk | A method for reducing or eliminating cracks during crystal growing process and a shaped metal piece for use in this method |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5891008A (en) | 1995-12-15 | 1999-04-06 | The Procter & Gamble Company | Sheet products for use in a pop-up dispenser and method for forming from stretched ribbons |
US5890008A (en) | 1997-06-25 | 1999-03-30 | Sun Microsystems, Inc. | Method for dynamically reconfiguring a processor |
JP2000275303A (ja) | 1999-03-23 | 2000-10-06 | Mitsubishi Electric Corp | バウンダリスキャンテスト方法及びバウンダリスキャンテスト装置 |
TWI277666B (en) | 2001-06-06 | 2007-04-01 | Ammono Sp Zoo | Process and apparatus for obtaining bulk mono-crystalline gallium-containing nitride |
IL161420A0 (en) | 2001-10-26 | 2004-09-27 | Ammono Sp Zoo | Substrate for epitaxy |
US7098487B2 (en) | 2002-12-27 | 2006-08-29 | General Electric Company | Gallium nitride crystal and method of making same |
US7118813B2 (en) * | 2003-11-14 | 2006-10-10 | Cree, Inc. | Vicinal gallium nitride substrate for high quality homoepitaxy |
WO2007008198A1 (en) | 2005-07-08 | 2007-01-18 | The Regents Of The University Of California | Method for growing group iii-nitride crystals in supercritical ammonia using an autoclave |
EP2004882A2 (en) | 2006-04-07 | 2008-12-24 | The Regents of the University of California | Growing large surface area gallium nitride crystals |
US9202872B2 (en) * | 2006-04-07 | 2015-12-01 | Sixpoint Materials, Inc. | Method of growing group III nitride crystals |
US8236237B2 (en) | 2006-07-25 | 2012-08-07 | Fiore Industries, Inc. | Method and apparatus for destruction of biological and chemical agents |
WO2009149299A1 (en) * | 2008-06-04 | 2009-12-10 | Sixpoint Materials | Methods for producing improved crystallinty group iii-nitride crystals from initial group iii-nitride seed by ammonothermal growth |
JP5197283B2 (ja) * | 2008-10-03 | 2013-05-15 | 国立大学法人東京農工大学 | 窒化アルミニウム単結晶基板、積層体、およびこれらの製造方法 |
CN101962804B (zh) * | 2010-10-30 | 2012-05-02 | 北京大学 | 基于外延材料应力控制的GaN厚膜自分离方法 |
CN103305909B (zh) * | 2012-03-14 | 2016-01-20 | 东莞市中镓半导体科技有限公司 | 一种用于GaN生长的复合衬底的制备方法 |
US10611008B2 (en) | 2016-11-20 | 2020-04-07 | Custom Molded Products, Llc | Installation tools for a water containing structure, components suitable for use therewith, and systems and methods of use therefor |
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2015
- 2015-12-02 WO PCT/US2015/063528 patent/WO2016090045A1/en active Application Filing
- 2015-12-02 JP JP2017529046A patent/JP6526811B2/ja active Active
- 2015-12-02 CN CN201580065613.6A patent/CN107002278B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
CN107002278A (zh) | 2017-08-01 |
JP2017536325A (ja) | 2017-12-07 |
CN107002278B (zh) | 2019-07-09 |
WO2016090045A1 (en) | 2016-06-09 |
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