JP6497059B2 - Housing structure of semiconductor power converter - Google Patents

Description

  The present invention relates to a housing structure of a semiconductor power conversion device including a plurality of semiconductor units.

  A semiconductor power conversion device is mainly a semiconductor unit housed in its housing structure, and the semiconductor unit performs power conversion, but the internal semiconductor generates heat during power conversion. There is a need to do. Conventionally, in order to cool a semiconductor unit, it has been generally cooled by a forced air cooling method using a cooling fan.

  FIG. 3A is a front view showing a housing structure of a semiconductor power conversion apparatus in which a plurality of conventionally used semiconductor units are stacked and mounted as disclosed in Patent Document 1 below. 3 (b) is a side view of FIG. 3 (a), and FIG. 3 (c) is a cross-sectional view showing a housing structure of a semiconductor power conversion device including a plurality of semiconductor units of FIG. 3 (a). It is the figure seen from the upper surface.

  As shown in FIG. 3, the semiconductor power conversion device 1 includes a plurality of semiconductor units 11, a wind tunnel 40, and a ceiling plate (not shown) mounted on trays (not shown) provided at the top and bottom of the casing. It is comprised from the ventilation hole 50 provided in illustration. Each semiconductor unit 11 is provided with a cooling fan 21 at the rear of each unit, and each semiconductor unit 11 is cooled by cooling air.

  As shown in FIG. 3B, cooling air is taken from the front by the cooling fan 21 of each semiconductor unit 11, and the internal semiconductor is cooled when passing through the semiconductor unit 11. The cooling air 30 that has cooled the semiconductor passes through the wind tunnel 40 and is exhausted through a ventilation hole 50 provided in the ceiling plate of the housing.

  However, in the above-described conventional semiconductor power conversion device 1 equipped with a plurality of semiconductor units 11, each semiconductor unit 11 drives a cooling fan 21, and as the lower semiconductor unit 11 is formed, the upper semiconductor unit 11 is driven. 11, the pressure loss is increased by the cooling air 30 discharged from the air 11, and the cooling air volume and the air speed are reduced. For this reason, the semiconductor unit 11 placed in the lower part could not be sufficiently cooled, and there was a possibility that the life of the electrical product constituting the semiconductor unit 11 would be reduced or the semiconductor could be damaged.

JP 2006-311679 A

  In the case structure of the conventional semiconductor power converter as shown in FIG. 3, the cooling air necessary for each semiconductor unit 11 increases pressure loss due to the cooling air exhausted by the other semiconductor units 11, There was a problem that the semiconductor unit 11 could not be sufficiently cooled, resulting in a decrease in the life of an electrical product on which the semiconductor unit 11 was mounted and damage to a device having low heat resistance.

  Accordingly, an object of the present invention is to divide a plurality of semiconductor units into groups and provide a wind tunnel for each group, so that sufficient cooling air is supplied to the lower semiconductor unit without increasing the pressure loss at the lower part of the wind tunnel. It is in providing the housing structure of the semiconductor power converter device which can let pass.

In order to solve the above-mentioned problem, the invention according to claim 1 is a housing structure of a semiconductor power conversion device in which a plurality of semiconductor units are stacked and mounted in a housing, and cooling air is passed through the semiconductor units . A first wind tunnel in which the cooling air passes an odd number from the top of the semiconductor unit stored in the housing; and a top of the semiconductor unit in which the cooling air is stored in the housing. And a second wind tunnel that is configured to pass through the even number, and the cooling air that has passed through the semiconductor unit is exhausted outside the casing through the first or second wind tunnel. To do.

According to a second aspect of the present invention, in the first aspect of the invention, the first and second wind tunnels are formed by bending and further welding a sheet metal to a tray provided in the casing. to be also of the.

  According to the present invention, a plurality of semiconductor units are divided into groups, a wind tunnel is provided for each group, and the cooling air passing through the plurality of semiconductor units is made substantially uniform to increase the pressure loss at the bottom of the wind tunnel. Therefore, it is possible to reduce the possibility that the life of the equipment inside the semiconductor unit will be reduced and the equipment may be damaged. That is, by providing a wind tunnel for each group of a plurality of semiconductor units, it is possible to realize a housing structure of a semiconductor power conversion device that can cool the plurality of semiconductor units substantially uniformly.

1 is a front view, a left side view, a right side view, and a cross-sectional view showing a housing structure of a semiconductor power conversion device including a plurality of semiconductor units according to a first embodiment of the present invention. It is the front view, side view, and sectional drawing which show the housing structure of the semiconductor power converter device containing the several semiconductor unit which concerns on the 2nd Example of this invention. It is the front view, side view, and sectional drawing which show the housing | casing structure of the semiconductor power converter device containing the conventional several semiconductor unit.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  1A is a front view showing a housing structure of a semiconductor power conversion device including a plurality of semiconductor units according to the first embodiment of the present invention, and FIG. 1B is a left side of FIG. 1A. FIG. 1C is a right side view of FIG. 1A, and FIG. 1D is a housing structure of a semiconductor power conversion device including a plurality of semiconductor units of FIG. 1A. It is the figure seen from the upper surface in sectional drawing.

  1A, a semiconductor power conversion device 101 includes a plurality of semiconductor units 111 stacked in multiple stages, wind tunnels 140 and 141 provided for each group of the plurality of semiconductor units 111, and a ceiling of a housing. It is comprised from the ventilation hole 150 provided in the board (not shown).

  The cooling air 130 passing through the semiconductor unit 111 is taken from the front of the semiconductor unit 111 by the cooling fan 121 and passes through the semiconductor unit 111 as shown in FIGS. The cooling air that has cooled the internal semiconductor passes through the wind tunnel 140 or the wind tunnel 141 provided for each group of a plurality of semiconductor units, and is exhausted to the outside of the apparatus (outside the casing) through the ventilation holes 150 provided in the ceiling plate of the casing. Is done. Note that the wind tunnel 140 provided for each group of the plurality of semiconductor units 111 and the structure itself for partitioning the wind tunnel 141 exhibit normal creativity while considering a tray (not shown) provided in the housing. This can be easily realized. For example, this can be realized by bending the sheet metal and further performing welding.

  The cooling air of the odd-numbered semiconductor units 111 counted from the uppermost stage passes through the wind tunnel 140, and the cooling air of the even-numbered semiconductor units 111 counted from the uppermost stage passes through the wind tunnel 141.

  Cooling air 130 passes through each semiconductor unit, passes through air tunnels 140 and 141 provided for each group of a plurality of semiconductor units 111, and is exhausted out of the apparatus through ventilation holes 150 provided in the ceiling plate of the housing. By dividing the path up to, the semiconductor units 111 mounted in the housing can be cooled substantially uniformly without increasing the pressure loss in the lower part of the wind tunnel.

  FIG. 2A is a front view showing a housing structure of a semiconductor power conversion device including a plurality of semiconductor units according to a second embodiment of the present invention, and FIG. 2B is a side view of FIG. FIG. 2 and FIG. 2C are cross-sectional views showing the housing structure of the semiconductor power conversion device including the plurality of semiconductor units in FIG.

  2A, a semiconductor power conversion device 201 includes a plurality of semiconductor units 211 stacked in multiple stages, wind tunnels 240, 241, and 242 provided for each group of the plurality of semiconductor units 211, and a housing. It is comprised from the ventilation hole 250 provided in the ceiling board (not shown).

  2B and 2C, the cooling air 230 passing through the semiconductor unit 211 is taken in from the front of the semiconductor unit 211 by the cooling fan 221, and when passing through the semiconductor unit 211, the internal semiconductor is removed. Cooling.

  The cooling air that has cooled the semiconductor passes through the wind tunnels 240, 241, and 242 provided for each group of a plurality of semiconductor units, and is exhausted out of the apparatus through the ventilation holes 250 provided in the ceiling plate of the housing.

  As shown in the figure, the cooling wind of the two semiconductor units 211 passes through the wind tunnel 240 from the uppermost stage, the cooling wind of the two semiconductor units 211 underneath the wind tunnel 241, and further, Cooling air flows through the two semiconductor units 211 located below.

  The structure of the wind tunnel 240, the wind tunnel 241, and the wind tunnel 242, which are provided for each group of the plurality of semiconductor units 211, is normally created by a person skilled in the art in consideration of a tray (not shown) provided in the housing. It can be easily realized by demonstrating power. For example, this can be realized by bending the sheet metal and further performing welding.

  The cooling air 230 passes through each semiconductor unit, passes through the wind tunnels 240, 241, and 242 provided for each group of a plurality of semiconductor units, and is supplied from a ventilation hole 250 provided in a ceiling plate (not shown) of the housing. By dividing the path until the air is exhausted outside, the semiconductor units 211 mounted in the housing can be cooled substantially uniformly without increasing the pressure loss at the bottom of the wind tunnel.

  In the above embodiment, each group is composed of two semiconductor units. However, the number of semiconductor units constituting the group can be selected as appropriate. In order to make the pressure loss value of each semiconductor unit appropriate, for example, the number of semiconductor units constituting the upper group can be made larger than the number of semiconductor units constituting the lower group. Alternatively, the number of semiconductor units constituting the lower group can be made larger than the number of semiconductor units constituting the upper group.

101, 201 Semiconductor power conversion device 111, 211 Semiconductor unit 121, 221 Cooling fan 130, 230 Cooling air 140, 141, 240, 241, 242 Wind tunnel 150, 250 Ventilation hole

Claims (2)

In a housing structure of a semiconductor power conversion device in which a plurality of semiconductor units are stacked and mounted in a housing and the cooling air is allowed to pass through the semiconductor units, the cooling air is the lowest of the semiconductor units stored in the housing. A first wind tunnel configured to pass an odd number from the upper stage, and a second wind path configured to pass the even number counted from the uppermost stage of the semiconductor unit housed in the housing. A housing structure of a semiconductor power conversion device , wherein a wind tunnel is provided, and the cooling air that has passed through the semiconductor unit is exhausted outside the housing through the first or second wind tunnel. Said first and second wind tunnel, the housing bending sheet metal tray provided in the body processed further chassis structure of a semiconductor power conversion device 請 Motomeko 1 wherein you characterized by being configured by welding .

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