JP2016115894A - Housing structure of semiconductor power converter - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a housing structure of semiconductor power converter capable of passing the cooling air sufficiently even to a lower semiconductor unit, without increasing pressure loss under an air duct, by dividing a plurality of semiconductor units into groups, and providing an air duct for each group.SOLUTION: A housing structure of semiconductor power converter is constituted of a plurality of semiconductor units 111, air ducts 140, 141 provided for each group of the plurality of semiconductor units, and a ventilation hole 150 provided in the ceiling board of the housing. Cooling air 130 passing through the semiconductor units 111 is taken in from the front of the semiconductor units 111 by means of a cooling fan 121, and when passing through the semiconductor units 111, the cooling air that has cooled the internal semiconductors passes through an air duct 140 or 141 provided for each group, before being discharged from an air vent 150 provided in the ceiling board of the housing.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a housing structure of a semiconductor power conversion device including a plurality of semiconductor units.

  A semiconductor power conversion device is mainly a semiconductor unit housed in its housing structure, and the semiconductor unit performs power conversion, but the internal semiconductor generates heat during power conversion. There is a need to do. Conventionally, in order to cool a semiconductor unit, it has been generally cooled by a forced air cooling method using a cooling fan.

  FIG. 3A is a front view showing a housing structure of a semiconductor power conversion apparatus in which a plurality of conventionally used semiconductor units are stacked and mounted as disclosed in Patent Document 1 below. 3 (b) is a side view of FIG. 3 (a), and FIG. 3 (c) is a cross-sectional view showing a housing structure of a semiconductor power conversion device including a plurality of semiconductor units of FIG. 3 (a). It is the figure seen from the upper surface.

  As shown in FIG. 3, the semiconductor power conversion device 1 includes a plurality of semiconductor units 11, a wind tunnel 40, and a ceiling plate (not shown) mounted on trays (not shown) provided at the top and bottom of the casing. It is comprised from the ventilation hole 50 provided in illustration. Each semiconductor unit 11 is provided with a cooling fan 21 at the rear of each unit, and each semiconductor unit 11 is cooled by cooling air.

  As shown in FIG. 3B, cooling air is taken from the front by the cooling fan 21 of each semiconductor unit 11, and the internal semiconductor is cooled when passing through the semiconductor unit 11. The cooling air 30 that has cooled the semiconductor passes through the wind tunnel 40 and is exhausted through a ventilation hole 50 provided in the ceiling plate of the housing.

  However, in the above-described conventional semiconductor power conversion device 1 equipped with a plurality of semiconductor units 11, each semiconductor unit 11 drives a cooling fan 21, and as the lower semiconductor unit 11 is formed, the upper semiconductor unit 11 is driven. 11, the pressure loss is increased by the cooling air 30 discharged from the air 11, and the cooling air volume and the air speed are reduced. For this reason, the semiconductor unit 11 placed in the lower part could not be sufficiently cooled, and there was a possibility that the life of the electrical product constituting the semiconductor unit 11 would be reduced or the semiconductor could be damaged.

JP 2006-311679 A

  In the case structure of the conventional semiconductor power converter as shown in FIG. 3, the cooling air necessary for each semiconductor unit 11 increases pressure loss due to the cooling air exhausted by the other semiconductor units 11, There was a problem that the semiconductor unit 11 could not be sufficiently cooled, resulting in a decrease in the life of an electrical product on which the semiconductor unit 11 was mounted and damage to a device having low heat resistance.

  Accordingly, an object of the present invention is to divide a plurality of semiconductor units into groups and provide a wind tunnel for each group, so that sufficient cooling air is supplied to the lower semiconductor unit without increasing the pressure loss at the lower part of the wind tunnel. It is in providing the housing structure of the semiconductor power converter device which can let pass.

  In order to solve the above-mentioned problem, the invention according to claim 1 is to allow a plurality of semiconductor units to pass cooling air necessary for a plurality of semiconductor units in a housing structure of a semiconductor power conversion device in which a plurality of semiconductor units are stacked and mounted in multiple stages. In addition, a plurality of semiconductor units are divided into groups, a wind tunnel is provided for each group, and the cooling air that has passed through the semiconductor units is exhausted outside the housing through the wind tunnel provided for each group. It is what.

  According to a second aspect of the present invention, in the first aspect of the present invention, the wind tunnel provided for each group passes an odd number of the cooling air from the uppermost stage of the semiconductor unit housed in the housing. And a second wind tunnel configured to allow the cooling air to pass through even-numbered counting units from the uppermost stage of the semiconductor unit housed in the housing. It is characterized by this.

  According to a third aspect of the present invention, in the second aspect of the invention, the first and second wind tunnels are formed by bending and further welding a sheet metal to a tray provided in the casing. It is characterized by that.

  According to a fourth aspect of the invention, in the first aspect of the invention, the group of semiconductor units is composed of a predetermined number of semiconductor units in order from the top.

  The invention described in claim 5 is characterized in that, in the invention described in claim 1, the number of semiconductor units constituting the group of the semiconductor units is configured such that the upper stage is larger than the lower stage. To do.

  The invention described in claim 6 is characterized in that, in the invention described in claim 1, the number of semiconductor units constituting the group of the semiconductor units is configured so that the number in the lower stage is larger than that in the upper stage. To do.

  According to a seventh aspect of the present invention, in the first aspect of the present invention, the wind tunnel provided for each of the groups includes the first and the first counts from the top of the semiconductor unit in which the cooling air is housed in the housing. A first wind tunnel adapted to pass through two semiconductor units, and third and fourth semiconductor units counted from the uppermost stage of the semiconductor unit in which the cooling air is housed in the housing. A second wind tunnel configured to pass through, and a third wind tunnel configured such that the cooling air passes through the fifth and sixth semiconductor units counted from the uppermost stage of the semiconductor unit housed in the housing. It is characterized by being comprised.

  The invention according to claim 8 is the invention according to claim 7, wherein the first to third wind tunnels are formed by bending and further welding a sheet metal to a tray provided in the casing. It is what.

  According to the present invention, a plurality of semiconductor units are divided into groups, a wind tunnel is provided for each group, and the cooling air passing through the plurality of semiconductor units is made substantially uniform to increase the pressure loss at the bottom of the wind tunnel. Therefore, it is possible to reduce the possibility that the life of the equipment inside the semiconductor unit will be reduced and the equipment may be damaged. That is, by providing a wind tunnel for each group of a plurality of semiconductor units, it is possible to realize a housing structure of a semiconductor power conversion device that can cool the plurality of semiconductor units substantially uniformly.

1 is a front view, a left side view, a right side view, and a cross-sectional view showing a housing structure of a semiconductor power conversion device including a plurality of semiconductor units according to a first embodiment of the present invention. It is the front view, side view, and sectional drawing which show the housing structure of the semiconductor power converter device containing the several semiconductor unit which concerns on the 2nd Example of this invention. It is the front view, side view, and sectional drawing which show the housing | casing structure of the semiconductor power converter device containing the conventional several semiconductor unit.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  1A is a front view showing a housing structure of a semiconductor power conversion device including a plurality of semiconductor units according to the first embodiment of the present invention, and FIG. 1B is a left side of FIG. 1A. FIG. 1C is a right side view of FIG. 1A, and FIG. 1D is a housing structure of a semiconductor power conversion device including a plurality of semiconductor units of FIG. 1A. It is the figure seen from the upper surface in sectional drawing.

  1A, a semiconductor power conversion device 101 includes a plurality of semiconductor units 111 stacked in multiple stages, wind tunnels 140 and 141 provided for each group of the plurality of semiconductor units 111, and a ceiling of a housing. It is comprised from the ventilation hole 150 provided in the board (not shown).

  The cooling air 130 passing through the semiconductor unit 111 is taken from the front of the semiconductor unit 111 by the cooling fan 121 and passes through the semiconductor unit 111 as shown in FIGS. The cooling air that has cooled the internal semiconductor passes through the wind tunnel 140 or the wind tunnel 141 provided for each group of a plurality of semiconductor units, and is exhausted to the outside of the apparatus (outside the casing) through the ventilation holes 150 provided in the ceiling plate of the casing. Is done. Note that the wind tunnel 140 provided for each group of the plurality of semiconductor units 111 and the structure itself for partitioning the wind tunnel 141 exhibit normal creativity while considering a tray (not shown) provided in the housing. This can be easily realized. For example, this can be realized by bending the sheet metal and further performing welding.

  The cooling air of the odd-numbered semiconductor units 111 counted from the uppermost stage passes through the wind tunnel 140, and the cooling air of the even-numbered semiconductor units 111 counted from the uppermost stage passes through the wind tunnel 141.

  Cooling air 130 passes through each semiconductor unit, passes through air tunnels 140 and 141 provided for each group of a plurality of semiconductor units 111, and is exhausted out of the apparatus through ventilation holes 150 provided in the ceiling plate of the housing. By dividing the path up to, the semiconductor units 111 mounted in the housing can be cooled substantially uniformly without increasing the pressure loss in the lower part of the wind tunnel.

  FIG. 2A is a front view showing a housing structure of a semiconductor power conversion device including a plurality of semiconductor units according to a second embodiment of the present invention, and FIG. 2B is a side view of FIG. FIG. 2 and FIG. 2C are cross-sectional views showing the housing structure of the semiconductor power conversion device including the plurality of semiconductor units in FIG.

  2A, a semiconductor power conversion device 201 includes a plurality of semiconductor units 211 stacked in multiple stages, wind tunnels 240, 241, and 242 provided for each group of the plurality of semiconductor units 211, and a housing. It is comprised from the ventilation hole 250 provided in the ceiling board (not shown).

  2B and 2C, the cooling air 230 passing through the semiconductor unit 211 is taken in from the front of the semiconductor unit 211 by the cooling fan 221, and when passing through the semiconductor unit 211, the internal semiconductor is removed. Cooling.

  The cooling air that has cooled the semiconductor passes through the wind tunnels 240, 241, and 242 provided for each group of a plurality of semiconductor units, and is exhausted out of the apparatus through the ventilation holes 250 provided in the ceiling plate of the housing.

  As shown in the figure, the cooling wind of the two semiconductor units 211 passes through the wind tunnel 240 from the uppermost stage, the cooling wind of the two semiconductor units 211 underneath the wind tunnel 241, and further, Cooling air flows through the two semiconductor units 211 located below.

  The structure of the wind tunnel 240, the wind tunnel 241, and the wind tunnel 242, which are provided for each group of the plurality of semiconductor units 211, is normally created by a person skilled in the art in consideration of a tray (not shown) provided in the housing. It can be easily realized by demonstrating power. For example, this can be realized by bending the sheet metal and further performing welding.

  The cooling air 230 passes through each semiconductor unit, passes through the wind tunnels 240, 241, and 242 provided for each group of a plurality of semiconductor units, and is supplied from a ventilation hole 250 provided in a ceiling plate (not shown) of the housing. By dividing the path until the air is exhausted outside, the semiconductor units 211 mounted in the housing can be cooled substantially uniformly without increasing the pressure loss at the bottom of the wind tunnel.

  In the above embodiment, each group is composed of two semiconductor units. However, the number of semiconductor units constituting the group can be selected as appropriate. In order to make the pressure loss value of each semiconductor unit appropriate, for example, the number of semiconductor units constituting the upper group can be made larger than the number of semiconductor units constituting the lower group. Alternatively, the number of semiconductor units constituting the lower group can be made larger than the number of semiconductor units constituting the upper group.

101, 201 Semiconductor power conversion device 111, 211 Semiconductor unit 121, 221 Cooling fan 130, 230 Cooling air 140, 141, 240, 241, 242 Wind tunnel 150, 250 Ventilation hole

Claims (8)

  In the housing structure of the semiconductor power conversion device in which a plurality of semiconductor units are stacked and mounted, in order to pass the cooling air necessary for the plurality of semiconductor units, a wind tunnel is provided for each group of the plurality of semiconductor units, A housing structure of a semiconductor power conversion device, wherein cooling air that has passed through a semiconductor unit is exhausted outside the housing through a wind tunnel for each group.   The wind tunnel provided for each group includes a first wind tunnel in which the cooling air passes an odd number from the uppermost stage of the semiconductor unit housed in the housing, and the cooling air flows in the housing. The housing of the semiconductor power conversion device according to claim 1, comprising: a second wind tunnel configured to pass through an even number counted from the uppermost stage of the semiconductor unit housed in the body. Construction.   3. The semiconductor power conversion device according to claim 2, wherein the first and second wind tunnels are formed by bending and further welding a sheet metal to a tray provided in the casing. 4. Enclosure structure.   2. The housing structure of a semiconductor power conversion device according to claim 1, wherein the group of the semiconductor units includes a predetermined number of semiconductor units in order from the top.   2. The housing structure of a semiconductor power conversion device according to claim 1, wherein the number of semiconductor units constituting the group of semiconductor units is configured such that the upper stage has a larger number than the lower stage.   2. The housing structure of a semiconductor power conversion device according to claim 1, wherein the number of semiconductor units constituting the group of semiconductor units is configured to be larger in the lower stage than in the upper stage.   A wind tunnel provided for each group includes a first wind tunnel in which the cooling air passes through the first and second semiconductor units counted from the uppermost stage of the semiconductor unit housed in the housing; A second wind tunnel in which the cooling air is counted from the uppermost stage of the semiconductor unit housed in the housing and passed through the third and fourth semiconductor units, and the cooling air is 2. The third wind tunnel configured to pass through the fifth and sixth semiconductor units counted from the uppermost stage of the semiconductor unit housed in the casing, and the third wind tunnel according to claim 1, Housing structure for semiconductor power conversion equipment.   8. The housing structure of a semiconductor power conversion device according to claim 7, wherein the first to third wind tunnels are formed by bending and further welding a sheet metal to a tray provided in the housing.

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