JP6488358B2 - Semiconductor device - Google Patents

Description

The technical field of the invention relates to semiconductor devices. Here, the semiconductor device refers to all elements and devices that function by utilizing semiconductor characteristics.

A technique for forming a transistor using a semiconductor thin film formed over a substrate having an insulating surface has attracted attention. The transistor is widely applied to an electronic device such as an integrated circuit (IC). A silicon-based semiconductor material is widely known as a semiconductor thin film applicable to a transistor, but an oxide semiconductor has attracted attention as another material.

For example, a transistor using a semiconductor thin film made of an amorphous oxide (In—Ga—Zn—O-based amorphous oxide) containing indium (In), gallium (Ga), and zinc (Zn) is disclosed (patent) Reference 1).

JP 2006-165529 A

A semiconductor device such as an integrated circuit (IC) has been improved in performance through miniaturization and higher integration of a semiconductor element made of single crystal silicon or the like (for example, higher operation speed or lower power consumption). . However, as the miniaturization and high integration of semiconductor elements progress, the power consumption due to the current when the transistor is off (called off current or leakage current) increases in the power consumption of the semiconductor device, which cannot be ignored. It has become.

Here, a transistor using an oxide semiconductor with a wide band gap as described above is
Compared to a transistor including a semiconductor material other than an oxide semiconductor such as single crystal silicon, the off-state current is extremely small. On the other hand, compared to a transistor using a semiconductor material other than an oxide semiconductor such as single crystal silicon, a transistor using an oxide semiconductor is not sufficient in terms of high-speed operation.

In view of the above, an object of one embodiment of the disclosed invention is to provide a semiconductor device having a new structure in which a transistor including an oxide semiconductor and a transistor including a semiconductor material other than an oxide semiconductor are stacked. And Another object is to provide a semiconductor device with a new structure in which power consumption is reduced.

Another object is to provide a semiconductor device in which a semiconductor element and a capacitor are efficiently formed.

According to one embodiment of the present invention, a first semiconductor element layer including a transistor formed using a semiconductor material other than an oxide semiconductor such as silicon and a second semiconductor including a transistor formed using an oxide semiconductor A semiconductor device having a stacked structure with an element layer, a wiring layer, or a second layer
The capacitor is provided using a conductive film or an insulating film that is the same layer as the conductive film or the insulating film included in the semiconductor element layer. For example, the following configuration can be employed.

One embodiment of the disclosed invention includes a first transistor in which a channel formation region is provided in a first semiconductor material, a wiring formed over the first transistor, and a first transistor formed over the first transistor. 2 transistors and a capacitor formed on the first transistor. The second transistor includes a first insulating film formed on the wiring, and a first insulating film on the first insulating film. A film made of the second semiconductor material, a gate insulating film formed on the film made of the second semiconductor material, and a film made of the second semiconductor material overlapped with the gate insulating film interposed therebetween And a source electrode and a drain electrode formed in contact with part of the upper surface of the film made of the second semiconductor material, and the capacitor uses a conductive film in the same layer as the wiring The first electrode formed by the Formed using an insulating film of the same layer as the layer is a semiconductor device having a second insulating film, a second electrode formed using a conductive film having the same layer as the gate electrode.

In the above, the second electrode may be electrically connected to the source electrode or the drain electrode. In addition, the first electrode may be electrically connected to the source electrode or the drain electrode. In addition, the capacitor element may include a first electrode, a first insulating film, a second insulating film, and a second electrode.

Another embodiment of the disclosed invention includes a first semiconductor material provided with a channel formation region.
A wiring formed on the first transistor, a second transistor formed on the first transistor, and a capacitor formed on the first transistor, The second transistor includes a first insulating film formed on the wiring, a film made of the second semiconductor material formed on the first insulating film, and a film made of the second semiconductor material. A gate insulating film formed thereon, a gate electrode formed so as to overlap with the film made of the second semiconductor material through the gate insulating film, and a part of the upper surface of the film made of the second semiconductor material The capacitor includes a first electrode formed using a conductive film in the same layer as the wiring, and an insulating film in the same layer as the first insulating film. A second insulating film, a source electrode, and a drain formed using A second electrode formed using a conductive film having the same layer as in the electrode, a semiconductor device having a.

In the above, the first insulating film includes a third insulating film containing silicon nitride, and a fourth insulating film formed on the third insulating film and containing silicon oxide. An opening may be formed in a region overlapping with the first electrode of the film.

In the above, the first insulating film includes a third insulating film containing silicon nitride, and a fourth insulating film formed on the third insulating film and containing silicon oxide. Insulating film and fourth
An opening may be formed in a region overlapping with the first electrode of the insulating film.

In the above, an interlayer insulating film is preferably formed on the first transistor, and the wiring and the first electrode preferably have the same upper surface embedded in the interlayer insulating film and exposed. .

Another embodiment of the disclosed invention includes a first semiconductor material provided with a channel formation region.
A wiring formed on the first transistor, a second transistor formed on the first transistor, and a capacitor formed on the first transistor, The second transistor is formed with a gate electrode formed using a conductive film in the same layer as the wiring, a gate insulating film formed on the gate electrode, and a gate electrode superimposed on the gate insulating film. A capacitor made of a second semiconductor material; and a source electrode and a drain electrode formed in contact with part of the upper surface of the second semiconductor material. The first electrode formed using the film, the first insulating film formed using the same insulating film as the gate insulating film, and the conductive film formed using the same layer as the source and drain electrodes A second electrode, Which is a semiconductor device.

In the above, an interlayer insulating film is formed on the first transistor, and the wiring, the gate electrode, and the first electrode are embedded in the interlayer insulating film, and the exposed upper surfaces form substantially the same plane. preferable.

The first semiconductor material is preferably a silicon semiconductor. The second semiconductor material is preferably an oxide semiconductor, and more preferably contains In, Ga, and Zn.

Further, in this specification and the like, the term “substantially the same” is used to include cases where they are not strictly the same. For example, the expression “substantially the same plane” includes the degree of flatness in a plane obtained by performing the same polishing treatment on a surface containing a plurality of substances (metal, insulator, etc.).

In the present specification and the like, the terms “upper” and “lower” do not limit that the positional relationship between the constituent elements is “directly above” or “directly below”. For example, the expression “a gate electrode over a gate insulating layer” does not exclude the case where another component is included between the gate insulating layer and the gate electrode.

Further, in this specification and the like, the terms “electrode” and “wiring” do not functionally limit these components. For example, an “electrode” may be used as part of a “wiring” and vice versa. Furthermore, the terms “electrode” and “wiring” are used to refer to multiple “electrodes” and “
This includes the case where “wiring” is integrally formed.

In addition, the functions of “source” and “drain” may be switched when transistors having different polarities are employed or when the direction of current changes in circuit operation. Therefore, in this specification, the terms “source” and “drain” can be used interchangeably.

Note that in this specification and the like, “electrically connected” includes a case of being connected via “something having an electric action”. Here, the “thing having some electric action” is not particularly limited as long as it can exchange electric signals between connection targets. For example, “thing having some electric action” includes electrodes, wiring, switching elements such as transistors, resistance elements, inductors, capacitors, and other elements having various functions.

A semiconductor device having a new structure can be provided by stacking a transistor including an oxide semiconductor and a transistor including a semiconductor material other than an oxide semiconductor. Further, power consumption can be reduced in the semiconductor device having the new structure. Further, in the semiconductor device having the new structure, high integration of semiconductor elements can be achieved.

Further, in the semiconductor device, a semiconductor device in which a semiconductor element and a capacitor are efficiently formed can be provided.

FIG. 10 is a cross-sectional view illustrating one embodiment of a semiconductor device. FIG. 10 is a cross-sectional view illustrating one embodiment of a semiconductor device. FIG. 10 is a cross-sectional view illustrating one embodiment of a semiconductor device. FIG. 10 is a cross-sectional view illustrating one embodiment of a semiconductor device. FIG. 10 is a cross-sectional view illustrating one embodiment of a semiconductor device. 10 is a cross-sectional view illustrating one embodiment of a method for manufacturing a semiconductor device. FIG. 10 is a cross-sectional view illustrating one embodiment of a method for manufacturing a semiconductor device. FIG. 10 is a cross-sectional view illustrating one embodiment of a method for manufacturing a semiconductor device. FIG. 10 is a cross-sectional view illustrating one embodiment of a method for manufacturing a semiconductor device. FIG. FIG. 10 is a cross-sectional view illustrating one embodiment of a semiconductor device. 10 is a cross-sectional view illustrating one embodiment of a method for manufacturing a semiconductor device. FIG. 10 is a cross-sectional view illustrating one embodiment of a method for manufacturing a semiconductor device. FIG. 8A and 8B are a circuit diagram and a perspective view illustrating one embodiment of a semiconductor device. FIG. 10 is a circuit diagram illustrating one embodiment of a semiconductor device. FIG. 14 is a cross-sectional view illustrating one embodiment of a semiconductor device. FIG. 10 illustrates an example of a structure of a semiconductor device. FIG. 10 illustrates an example of a structure of a semiconductor device. FIG. 10 illustrates an example of a structure of a semiconductor device. FIG. 10 illustrates an example of a structure of a semiconductor device. FIG. 10 illustrates an example of a structure of a semiconductor device. FIG. 9 illustrates an electronic device.

Hereinafter, embodiments of the invention disclosed in this specification will be described in detail with reference to the drawings. However, the invention disclosed in this specification is not limited to the following description, and it is easily understood by those skilled in the art that modes and details can be variously changed. Further, the invention disclosed in this specification is not construed as being limited to the description of the embodiments below.

In addition, the position, size, range, etc. of each component shown in the drawings etc. are for easy understanding.
It may not represent the actual position, size, range, etc. Therefore, the disclosed invention is
It is not necessarily limited to the position, size, range, etc. disclosed in the drawings.

Note that ordinal numbers such as “first”, “second”, and “third” in this specification and the like are added to avoid confusion between components and are not limited numerically. To do.

(Embodiment 1)
In this embodiment, a semiconductor device and a method for manufacturing the semiconductor device according to one embodiment of the present invention will be described with reference to FIGS.

<Configuration example of semiconductor device>
FIG. 1 is a cross-sectional view illustrating an example of a configuration of a semiconductor device. The semiconductor device shown in FIG.
A transistor 150 provided with a channel formation region in the semiconductor material;
The wiring 128 a is formed on the transistor 0, the transistor 152 is formed on the transistor 150, and the capacitor 154 is formed on the transistor 150. In FIG. 1, the first semiconductor element layer 110 including the transistor 150 using the first semiconductor material is provided in the lower portion, and the transistor 152 using the second semiconductor material and a part of the capacitor 154 are formed in the upper portion. The second semiconductor element layer 130 is included. The first semiconductor element layer 110 and the second semiconductor element layer 130 are electrically connected via a wiring layer 120 formed therebetween. In addition, although the semiconductor device illustrated in FIG. 1 is illustrated as including one transistor 150, one transistor 152, and one capacitor 154, the semiconductor device may include a plurality of transistors.

Here, the first semiconductor material and the second semiconductor material are preferably materials having different band gaps. It is preferable that the first semiconductor material be a semiconductor material other than an oxide semiconductor and the second semiconductor material be an oxide semiconductor. As a semiconductor material other than an oxide semiconductor, for example, silicon, germanium, silicon germanium, silicon carbide, gallium arsenide, or the like can be used, and a single crystal semiconductor is preferably used. A transistor using such a semiconductor material can easily operate at high speed. On the other hand, a transistor including an oxide semiconductor has extremely small off-state current due to its characteristics.

Note that the transistor 150 and the transistor 152 are n-channel transistors,
Any of p-channel transistors can be used. Here, the transistor 15
2 is described as an n-channel transistor.

The transistor 150 provided in the first semiconductor element layer 110 includes the channel formation region 102 provided in the semiconductor substrate 100 and the semiconductor substrate 1 so as to sandwich the channel formation region 102.
Impurity region 104a and impurity region 104b (also referred to as a source region or a drain region) provided in 00, metal compound region 106 in contact with impurity region 104a and impurity region 104b, and channel formation region 102 are provided. Gate insulating film 10
8 and a gate electrode 111 provided over the gate insulating film 108 so as to overlap with the channel formation region 102. Note that the impurity concentration of the impurity region 104a is lower than the impurity concentration of the impurity region 104b.

Note that one of the impurity region 104a, the impurity region 104b, and the metal compound region 106 with the gate electrode 111 interposed therebetween functions as a source region (or a drain region) of the transistor 150, and the impurity region 104a and impurity region with the gate electrode 111 interposed therebetween. The other of 104 b and the metal compound region 106 can function as a drain region (or a source region) of the transistor 150. Therefore, the impurity region 104a, the impurity region 104b, and the metal compound region 106 may be collectively referred to as a source region or a drain region. In addition, in order to describe a connection relation of the transistor, the source and drain regions including the source and drain regions may be expressed as a source electrode and a drain electrode. In other words, in this specification, the description of a source electrode can include a source region, and the description of a drain electrode can include a drain region.

Here, a sidewall insulating film 107 is provided on the side surface of the gate electrode 111.
The impurity region 104 a is provided so as to overlap with the sidewall insulating film 107, but the impurity region 104 b is provided so as not to overlap with the sidewall insulating film 107. In this manner, by providing the sidewall insulating film 107 and providing the impurity regions 104a and 104b having different impurity concentrations, the transistor characteristics of the transistor 150 can be improved. Note that the transistor 150 may not include the sidewall insulating film 107.

Further, a connection electrode 112 a is provided on and in contact with one of the metal compound regions 106, and a connection electrode 112 b is provided on and in contact with the other of the metal compound regions 106. Here, the connection electrode 112 a and the connection electrode 112 b also function as a source electrode and a drain electrode of the transistor 150. Further, a wiring 114a is provided in contact with the connection electrode 112a, and a wiring 114b is provided in contact with the connection electrode 112b.

Further, the element isolation insulating layer 101 is formed on the semiconductor substrate 100 so as to surround the transistor 150.
Is provided. Further, the interlayer insulating film 103 is provided over the transistor 150 so that the upper surfaces of the wirings 114 a and 114 b are exposed. Here, the interlayer insulating film 103
Is formed of a single layer, but is not necessarily a single layer, and may have a laminated structure of two or more layers. For example, an interlayer insulating film having the same thickness as the connection electrode 112a and the connection electrode 112b,
A stacked structure of interlayer insulating films having the same thickness as the wirings 114 a and 114 b can also be used.

The wiring layer 120 formed on the first semiconductor element layer 110 includes an interlayer insulating film 122 formed on the interlayer insulating film 103, the wiring 114a and the wiring 114b, and an interlayer formed on the interlayer insulating film 122. The insulating film 124 includes the interlayer insulating film 122 and the connection electrode 126, the wiring 128 a, and the electrode 128 b formed so as to be embedded in the interlayer insulating film 124.
The wiring 128a and the electrode 128b are provided so that the upper surface is exposed from the interlayer insulating film 124, and are formed using a conductive film of the same layer. In this specification and the like, the term “same layer” means a layer formed using the same material and the same process,
It does not necessarily mean that the thickness of the layer or the height in the cross-sectional view of the layer matches.

Here, the upper surfaces of the interlayer insulating film 122, the wiring 128a, and the electrode 128b preferably form substantially the same plane.

The connection electrode 126 is provided in contact with the upper surface of the wiring 114a.
28 a is provided in contact with the upper surface of the connection electrode 126. That is, the wiring 128 a is electrically connected to the transistor 150 through the connection electrode 126. Note that the disclosed invention is not limited to the structure illustrated in FIG. 1, and the connection electrode 126 and the wiring 128 a are appropriately connected to the gate electrode, the source electrode, or the drain electrode of the transistor 150 in accordance with the circuit structure of the semiconductor device. Can do.

Here, the wiring layer 120 is formed with a laminated structure of the interlayer insulating film 122 and the interlayer insulating film 124. However, the wiring layer 120 does not necessarily have such a laminated structure, and may have a single layer structure.
A stacked structure of more than one layer may be used. For example, an interlayer insulating film having the same thickness as the connection electrode 126 and an interlayer insulating film having the same thickness as the wiring 128a and the electrode 128b can be stacked over the interlayer insulating film 122.

The second semiconductor element layer 130 formed on the wiring layer 120 includes a base insulating film 132a formed on the interlayer insulating film 124, the wiring 128a, and the electrode 128b, and a base insulating film 132.
a base insulating film 132b formed on the base a, a transistor 152 formed on the base insulating film 132b, and a protective insulating film 1 formed on the base insulating film 132b and the transistor 152.
44, an interlayer insulating film 146 formed on the protective insulating film 144, a base insulating film 132a, a base insulating film 132b, a protective insulating film 144, a connection electrode 148a formed to be embedded in the interlayer insulating film 146, and a connection An electrode 148b, a wiring 149a, and a wiring 149b are provided. The wiring 149a and the wiring 149b are provided so that the upper surface is exposed from the interlayer insulating film 146, and are formed using a conductive film of the same layer.

The connection electrode 148a is provided in contact with the upper surface of the wiring 128a, and the wiring 149a is provided in contact with the upper surface of the connection electrode 148a. That is, the wiring 149
a is electrically connected to the transistor 150 through the connection electrode 148a.

The transistor 152 provided in the second semiconductor element layer 130 includes an oxide semiconductor film 134 provided over the base insulating film 132b, a gate insulating film 136a formed over the oxide semiconductor film 134, and a gate insulating film. A gate electrode 138a formed so as to overlap with the oxide semiconductor film 134 with 136a interposed therebetween, a sidewall insulating film 140a formed so as to be in contact with at least a side surface of the gate electrode 138a, and at least an upper surface of the oxide semiconductor film 134 A source electrode (or drain electrode) 142a formed in contact with a part thereof; and a drain electrode (or source electrode) 142b. The connection electrode 148b is connected to the source electrode 142a.
The wiring 149b is provided in contact with the upper surface of the connection electrode 148b. The protective insulating film 144 is provided so as to cover the transistor 152. Note that the transistor 152 is not necessarily provided with the sidewall insulating film 140a.

As illustrated in FIG. 1, the oxide semiconductor film 134 is formed with a channel formation region 134c overlapping with the gate electrode 138a and the channel formation region 134c interposed therebetween, and the channel formation region 1
Impurity region 134a and impurity region 134b having a lower resistivity than 34c are included. The source electrode 142a is in contact with the oxide semiconductor film 134 in the impurity region 134a, and the drain electrode 142b is in contact with the oxide semiconductor film 134 in the impurity region 134b. here,
The impurity region 134 a and the impurity region 134 b can also function as a source region and a drain region of the transistor 152. Impurity region 134a and impurity region 134b are
After the gate electrode 138a is formed, an impurity element is introduced using the gate electrode 138a as a mask, so that the gate electrode 138a can be formed in a self-aligned manner.

An oxide semiconductor used for the oxide semiconductor film 134 is at least indium (In).
, Zinc (Zn) or tin (Sn). In particular, it is preferable to contain In and zinc (Zn). In addition, it is preferable to include gallium (Ga) in addition to the stabilizer for reducing variation in electrical characteristics of the transistor including the oxide. Moreover, it is preferable to have tin (Sn) as a stabilizer. Moreover, it is preferable to have hafnium (Hf) as a stabilizer. Moreover, it is preferable to have a zirconium (Zr) as a stabilizer.

As other stabilizers, lanthanoids such as lanthanum (La), cerium (Ce), praseodymium (Pr), neodymium (Nd), samarium (Sm), europium (Eu), gadolinium (Gd), terbium (Tb) Dysprosium (Dy), holmium (Ho), erbium (Er), thulium (Tm), ytterbium (Yb),
You may have any 1 type or multiple types of lutetium (Lu).

For example, as an oxide semiconductor, indium oxide, tin oxide, zinc oxide, binary metal oxides In—Zn oxide, In—Mg oxide, In—Ga oxide, ternary metal In—Ga—Zn-based oxide (also referred to as IGZO), In—Sn—Zn
Oxide, In—Hf—Zn oxide, In—La—Zn oxide, In—Ce—Zn oxide, In—Pr—Zn oxide, In—Nd—Zn oxide, In -Sm-Zn oxide, In-Eu-Zn oxide, In-Gd-Zn oxide, In-Tb-Zn oxide, In-Dy-Zn oxide, In-Ho-Zn oxide Oxide, In-Er-Zn-based oxide, In-Tm-Zn-based oxide, In-Yb-Zn-based oxide, In-Lu-Zn-based oxide,
An In—Sn—Ga—Zn-based oxide, an In—Hf—Ga—Zn-based oxide, or an In—Sn—Hf—Zn-based oxide that is an oxide of a quaternary metal can be used.

Note that here, for example, an In—Ga—Zn-based oxide means an oxide containing In, Ga, and Zn as its main components, and there is no limitation on the ratio of In, Ga, and Zn. Moreover, metal elements other than In, Ga, and Zn may be contained.

Alternatively, a material represented by InMO ₃ (ZnO) _m (m> 0 is satisfied, and m is not an integer) may be used as the oxide semiconductor. Note that M represents one metal element or a plurality of metal elements selected from Ga, Fe, Mn, and Co.

In the case where an oxide whose composition ratio is In ≦ Ga is used as the oxide semiconductor film 134, an oxide semiconductor film having stable characteristics can be obtained. This is because, since Ga has a larger formation energy of oxygen vacancies than In, oxygen vacancies are less likely to occur.
This is because the oxide having the composition a has stable characteristics as compared with the oxide having the composition In> Ga. As such an oxide, for example, In: Ga: Zn = 1: 1: 1,
Alternatively, an In—Ga—Zn-based oxide with an atomic ratio of In: Ga: Zn = 1: 3: 2 or an oxide in the vicinity of the composition thereof may be used.

In the case where an oxide whose composition ratio of In and Ga is In> Ga is used for the oxide semiconductor film 134, the oxide semiconductor film 134 can have high mobility. This is because, in an oxide semiconductor, the s orbital of heavy metal mainly contributes to carrier conduction, and the s orbital overlap tends to increase by increasing the In content, so that the composition of In> Ga is obtained. This is because an oxide has higher mobility than an oxide having a composition of In ≦ Ga. As such an oxide, for example, In: Ga: Zn = 3: 1: 2, or I
An In—Ga—Zn-based oxide with an atomic ratio of n: Ga: Zn = 2: 1: 3 or an oxide in the vicinity of the composition may be used.

The oxide semiconductor film 134 may have a structure in which a plurality of oxide semiconductor films are stacked. For example, an oxide whose composition ratio of In and Ga is In> Ga is used over an oxide semiconductor film using an oxide whose composition ratio of In and Ga is In ≦ Ga. A structure in which oxide semiconductor films are stacked may be employed. Thus, by using an oxide semiconductor film having stable characteristics on the back channel side that is not in contact with the gate insulating film 136a and using an oxide semiconductor film having high mobility on the side in contact with the gate insulating film 136a, a transistor can be obtained. 152
A transistor in which high mobility and high reliability are compatible can be obtained.

Note that the oxide semiconductor is not limited to those described above, and an oxide semiconductor having an appropriate composition may be used depending on required semiconductor characteristics (such as mobility, threshold value, and variation). In order to obtain the required semiconductor characteristics, it is preferable that the carrier concentration, impurity concentration, defect density, atomic ratio of metal element to oxygen, interatomic bond distance, density, and the like are appropriate.

The oxide semiconductor film 134 is preferably highly purified by sufficiently removing impurities such as hydrogen and supplying sufficient oxygen to bring the oxygen into a supersaturated state. Specifically, the hydrogen concentration of the oxide semiconductor film 134 is 5 × 10 ¹⁹ atoms / cm ³ or less, desirably 5 × 10 ¹⁸ atoms / cm ³ or less, and more desirably 5 × 10 ¹⁷ atoms.
/ Cm ³ or less. Note that the hydrogen concentration in the above-described oxide semiconductor film 134 is determined by secondary ion mass spectrometry (SIMS: Secondary Ion Mass Spectroscopy).
measured by y). In this way, the hydrogen concentration is sufficiently reduced and purified,
By using the oxide semiconductor film 134 in which the defect level in the energy gap due to oxygen deficiency is reduced by supplying sufficient oxygen for the transistor 152, for example, at room temperature (25
° C) off current (here, a value per unit channel width (1 μm)) is 100 zA (1
zA (zeptoampere) is 1 × 10 ⁻²¹ A) or less, preferably 10 zA or less. In this manner, by using the i-type (intrinsic) or substantially i-type oxide semiconductor film 134, the transistor 152 with extremely excellent off-state current characteristics can be obtained.

The oxide semiconductor film 134 is preferably in a supersaturated state with more oxygen than the stoichiometric composition. Here, since sufficient oxygen is supplied to make the oxygen supersaturated, an insulating film containing excess oxygen is preferably provided so as to surround the oxide semiconductor film 134.
Further, in order to prevent impurities such as hydrogen from entering the oxide semiconductor film 134, an insulating film functioning as a barrier film is preferably provided so as to surround the insulating film containing excess oxygen. Therefore, in this embodiment, the base insulating film 132a functioning as a barrier film, the base insulating film 132b containing excess oxygen, the gate insulating film 136a containing excess oxygen, and the protective insulating film 144 functioning as a barrier film are provided. Use.

The oxide semiconductor film 134 is in a single crystal state, a polycrystalline (also referred to as polycrystal) state, an amorphous state, or the like.

In this embodiment, the channel formation region 134c of the oxide semiconductor film 134 is formed of CAA.
C-OS (C Axis Aligned Crystalline Oxide Se
a preferred membrane).

The CAAC-OS film is not completely single crystal nor completely amorphous. CAAC-OS
The film is an oxide semiconductor film having a crystal-amorphous mixed phase structure in which an amorphous phase has a crystal part. In addition,
In many cases, the crystal part has a size that fits in a cube whose one side is less than 100 nm. In addition, transmission electron microscope (TEM: Transmission Electron Micror)
In the observation image by (scope), the boundary between the amorphous part and the crystal part included in the CAAC-OS film is not clear. Further, a grain boundary (also referred to as a grain boundary) cannot be confirmed in the CAAC-OS film by TEM. Therefore, in the CAAC-OS film, reduction in electron mobility due to grain boundaries is suppressed.

In the crystal part included in the CAAC-OS film, the c-axis is aligned in a direction parallel to the normal vector of the formation surface of the CAAC-OS film or the normal vector of the surface, and triangular when viewed from the direction perpendicular to the ab plane. It has a shape or hexagonal atomic arrangement, and metal atoms are arranged in layers or metal atoms and oxygen atoms are arranged in layers as viewed from the direction perpendicular to the c-axis. Note that the directions of the a-axis and the b-axis may be different between different crystal parts. In this specification, when simply described as vertical,
The range of 85 ° to 95 ° is also included. In addition, when simply describing as parallel,
A range of 5 ° to 5 ° is also included.

Note that the distribution of crystal parts in the CAAC-OS film is not necessarily uniform. For example, CA
In the formation process of the AC-OS film, when crystal growth is performed from the surface side of the oxide semiconductor film, the ratio of crystal parts in the vicinity of the surface of the oxide semiconductor film may be higher in the vicinity of the surface. C
When an impurity is added to the AAC-OS film, the crystal part in a region to which the impurity is added becomes amorphous in some cases.

Since the c-axis of the crystal part included in the CAAC-OS film is aligned in a direction parallel to the normal vector of the formation surface of the CAAC-OS film or the normal vector of the surface, the shape of the CAAC-OS film (formation surface) Depending on the cross-sectional shape of the surface or the cross-sectional shape of the surface).
Note that the c-axis direction of the crystal part is parallel to the normal vector of the surface where the CAAC-OS film is formed or the normal vector of the surface. The crystal part is formed by film formation or by performing crystallization treatment such as heat treatment after film formation.

A transistor including a CAAC-OS film can reduce variation in electrical characteristics due to irradiation with visible light or ultraviolet light. Therefore, the transistor has high reliability.

  Note that part of oxygen included in the oxide semiconductor film may be replaced with nitrogen.

Further, in an oxide semiconductor having a crystal part such as a CAAC-OS, defects in a bulk can be further reduced, and mobility higher than that of an oxide semiconductor in an amorphous state can be obtained by increasing surface flatness. . In order to improve the flatness of the surface, it is preferable to form an oxide semiconductor on the flat surface. Specifically, the base insulating film 1 on which the oxide semiconductor film 134 is formed.
The average surface roughness (Ra) of the surface of 32b may be 1 nm or less, preferably 0.3 nm or less, more preferably 0.1 nm or less.

Ra is a three-dimensional extension of the centerline average roughness defined in JIS B0601 so that it can be applied to a surface. “A value obtained by averaging the absolute values of deviations from a reference surface to a specified surface” "And is defined by the following equation.

In the above, S ₀ is the measurement surface (coordinates (x ₁ , y ₁ ) (x ₁ , y ₂ ) (x ₂ , y
₁ ) indicates the area of (rectangular region surrounded by four points represented by (x ₂ , y ₂ )), and Z ₀
Indicates the average height of the measurement surface. Ra is an atomic force microscope (AFM).
Evaluation can be made at Microscope).

In the case where the oxide semiconductor film 134 has a structure in which a plurality of oxide semiconductor films are stacked,
A structure in which oxide semiconductor films having different crystallinity are stacked may be employed. In other words, a single crystal oxide semiconductor film, a polycrystalline oxide semiconductor film, an amorphous oxide semiconductor film, or a CAAC-OS film may be stacked as appropriate in combination. For example, in the case where the oxide semiconductor film 134 has a stacked structure of two oxide semiconductor films, when an amorphous oxide semiconductor film is applied to at least one of them, the internal stress of the oxide semiconductor film 134 or the external stress The stress can be relaxed, the variation in transistor characteristics can be reduced, and the reliability of the transistor can be further improved. On the other hand, amorphous oxide semiconductors easily absorb impurities that serve as donors such as hydrogen,
Since oxygen vacancies are likely to occur, the n-type is easily obtained. Therefore, as the oxide semiconductor film provided on the channel side, an oxide semiconductor film having crystallinity such as a CAAC-OS film is preferably used.

Alternatively, the oxide semiconductor film 134 may have a stacked structure of three or more layers, and a structure in which an amorphous oxide semiconductor film is sandwiched between a plurality of crystalline oxide semiconductor films. Alternatively, a structure in which crystalline oxide semiconductor films and amorphous oxide semiconductor films are alternately stacked may be employed.

Note that the oxide semiconductor film 134 may be amorphous or may have crystallinity.
As a crystalline oxide semiconductor layer, a crystalline oxide semiconductor having a c-axis orientation (C Ax
is Aligned Crystalline Oxide Semiconductor
or: also referred to as CAAC) is preferable because the reliability of the transistor can be improved.

Specifically, the CAAC is a non-single crystal and has a triangular, hexagonal, equilateral triangle, or equilateral hexagonal atomic arrangement when viewed from the direction perpendicular to the ab plane. The CAAC includes a phase in which metal atoms are arranged in a layered manner in the c-axis direction, or a phase in which metal atoms and oxygen atoms are arranged in a layered manner.

Further, the capacitor element 154 is formed across the second semiconductor element layer 130 and the wiring layer 120. The capacitor 154 includes an electrode 128b, a base insulating film 132a, and a gate insulating film 136a.
And an electrode 138b formed of a conductive film of the same layer as the gate electrode 138a. That is, the electrode 128b is connected to the capacitor 154.
The electrode 138b functions as the other electrode of the capacitor 154,
The insulating film 136b and the base insulating film 132a function as a dielectric of the capacitor 154. Here, an opening is formed in a region overlapping with the electrode 128b of the base insulating film 132b, and the insulating film 136b and the electrode 138b are formed so as to overlap with the electrode 128b and the base insulating film 132a in the opening. The electrode 1 is the same as the gate electrode 138a.
The side wall insulating film 140b is also provided in contact with at least the side surface 38b.

Further, as illustrated in FIG. 1, the drain electrode 142b of the transistor 152 may be in contact with the upper surface of the electrode 138b. However, the disclosed invention is not limited to the structure illustrated in FIG. 1, and the semiconductor element, the capacitor element, the wiring, and the like included in the first semiconductor element layer 110, the wiring layer 120, and the second semiconductor element layer 130 are They can be appropriately connected in accordance with the configuration of the semiconductor circuit.

Here, the electrode 128b, the insulating film 136b, and the electrode 138 included in the capacitor 154 are formed.
Each b is formed of the same layer as the wiring 128a, the gate insulating film 136a, and the gate electrode 138a, and is formed using the same material and the same process. Accordingly, the capacitor element 154 can be formed without increasing extra steps in the process of forming the transistor 150 of the wiring layer 120 and the second semiconductor element layer 130, and the semiconductor element and the capacitor element are efficiently formed. be able to.

In this manner, by providing the second semiconductor element layer using an oxide semiconductor over the first semiconductor element layer using an oxide semiconductor such as single crystal silicon, a transistor using single crystal silicon or the like is provided. In addition, a semiconductor device having a new structure in which a transistor including an oxide semiconductor is used for one integrated circuit can be provided.

Accordingly, a transistor using single crystal silicon or the like that can easily operate at high speed and a transistor using an oxide semiconductor with extremely low off-state current can be used as appropriate depending on the role of the transistor in the integrated circuit. it can. Thus, for example, in a conventional integrated circuit using single crystal silicon, a transistor using a oxide semiconductor is used as a transistor at a portion where leakage current is large, so that power consumption can be reduced. At this time, since a transistor using single crystal silicon is also used, high-speed operation of the transistor can be maintained.

In addition, a transistor using an oxide semiconductor material is formed by stacking a second semiconductor element layer using an oxide semiconductor over a first semiconductor element layer using an oxide semiconductor such as single crystal silicon. Since the increase of the occupied area due to the provision can be prevented, the semiconductor element having a new structure can be highly integrated.

FIG. 2 shows a semiconductor device having a structure different from that in FIG. The semiconductor device shown in FIG.
The structure of the capacitor 156 of the semiconductor element layer 130 is different from the structure of the capacitor 154 of the second semiconductor element layer 130 of the semiconductor device shown in FIG. Specifically, in the capacitor 156, an opening is also formed in the base insulating film 132a, and the insulating film 136b is the only insulating film that functions as a dielectric of the capacitor. The drain electrode 142b of the transistor 152 is connected to the electrode 128b instead of the electrode 138b. In this manner, by using only the insulating film 136b as the insulating film functioning as the dielectric of the capacitor, the capacitor 154 shown in FIG.
Since the thickness of the insulating film functioning as a dielectric can be reduced, the capacitance of the capacitor can be further increased. Note that the structure of other portions is similar to that of the semiconductor device shown in FIG. 1, and thus the above description can be referred to for details.

FIG. 3 shows a semiconductor device having a structure different from that in FIG. The semiconductor device shown in FIG.
The structure of the capacitor 158 of the semiconductor element layer 130 is different from the structure of the capacitor 154 of the second semiconductor element layer 130 of the semiconductor device shown in FIG. Specifically, in the capacitor 158, an opening is also formed in the base insulating film 132a, and the insulating film 136b is the only insulating film that functions as a dielectric of the capacitor. In addition, the drain electrode 142b of the transistor 152 and the electrode 138b of the capacitor 158 are connected to each other through a connection electrode 148c, a connection electrode 149c, and a connection electrode 148d provided in the interlayer insulating film 146. Thus, by using only the insulating film 136b as the insulating film functioning as the dielectric of the capacitor, the thickness of the insulating film functioning as a dielectric can be made thinner than the capacitor 154 shown in FIG. In addition, the capacitance of the capacitor can be increased. Note that the structure of other portions is similar to that of the semiconductor device shown in FIG. 1, and thus the above description can be referred to for details.

4 shows a semiconductor device having a structure different from that in FIG. The semiconductor device shown in FIG.
The structure of the capacitor 160 in the semiconductor element layer 130 is different from the structure of the capacitor 154 in the second semiconductor element layer 130 of the semiconductor device shown in FIG. Specifically, the capacitor 160 includes a drain electrode 142b, a base insulating film 132a, and an electrode 128b. The conductive film in the same layer as the gate electrode 138a and the insulating film in the same layer as the gate insulating film 136a are used. It is not done. In this manner, by using only the base insulating film 132a as the insulating film functioning as the dielectric of the capacitor, the thickness of the insulating film functioning as a dielectric can be made thinner than that of the capacitor 154 shown in FIG. Thus, the electric capacity of the capacitor can be increased. Note that the structure of other portions is similar to that of the semiconductor device shown in FIG. 1, and thus the above description can be referred to for details.

FIG. 5 shows a semiconductor device having a structure different from that in FIG. The semiconductor device shown in FIG.
The structure of the capacitor 162 of the semiconductor element layer 130 is different from the structure of the capacitor 154 of the second semiconductor element layer 130 of the semiconductor device shown in FIG. Specifically, the capacitor 162 includes an electrode 138b, a drain electrode 142b, a protective insulating film 144, and an electrode 147, and a conductive film in the same layer as the wiring 128a is not used. The electrode 147 is connected to the wiring 149d through a connection electrode 148e embedded in the interlayer insulating film 146. In this manner, by using only the protective insulating film 144 as the insulating film functioning as the dielectric of the capacitor, the thickness of the insulating film functioning as a dielectric can be made thinner than that of the capacitor 154 shown in FIG. Thus, the electric capacity of the capacitor can be increased. Note that the structure of other portions is similar to that of the semiconductor device shown in FIG. 1, and thus the above description can be referred to for details.

Note that the semiconductor devices shown in FIGS. 1 to 5 are not limited to the configurations shown in the respective drawings, and are included in the first semiconductor element layer 110, the wiring layer 120, and the second semiconductor element layer 130. A semiconductor element, a capacitor element, a wiring, and the like can be appropriately connected in accordance with the structure of the semiconductor circuit. Further, a semiconductor element layer or a wiring layer may be added by further forming an electrode, a wiring, a semiconductor layer, an insulating layer, or the like. For example, a highly integrated semiconductor device can be realized by adopting a multilayer wiring structure including a laminated structure of an insulating layer and a conductive layer as a wiring structure.

<Method for Manufacturing Semiconductor Device>
A method for manufacturing the semiconductor device illustrated in FIGS. 1A to 1C is described below with reference to FIGS.

<Method for Manufacturing First Semiconductor Element Layer>
First, a method for manufacturing the first semiconductor element layer 110 will be described with reference to FIGS.

First, the semiconductor substrate 100 is prepared. As the semiconductor substrate 100, a single crystal semiconductor substrate such as silicon or silicon carbide, a polycrystalline semiconductor substrate, a compound semiconductor substrate such as silicon germanium, an SOI substrate, or the like can be used. Here, an example in which a single crystal silicon substrate is used as the semiconductor substrate 100 is described. In general, “SO
The term “I substrate” refers to a substrate having a structure in which a silicon semiconductor layer is provided on an insulating surface. Use as a concept that includes. That is, the semiconductor layer included in the “SOI substrate” is not limited to the silicon semiconductor layer. The SOI substrate includes a substrate in which a semiconductor layer is provided over an insulating substrate such as a glass substrate with an insulating layer interposed therebetween.

In particular, when a single crystal semiconductor substrate such as silicon is used as the semiconductor substrate 100,
This is preferable because the operation of the transistor 150 can be speeded up.

Next, a protective layer serving as a mask for forming an element isolation insulating layer is formed over the semiconductor substrate 100. As the protective layer, for example, an insulating layer made of silicon oxide, silicon nitride, silicon oxynitride, or the like can be used. Note that an impurity element imparting n-type conductivity or an impurity element imparting p-type conductivity may be added to the semiconductor substrate 100 in order to control the threshold voltage of the transistor before and after this step. Good. N if the semiconductor is silicon
For example, phosphorus or arsenic can be used as the impurity imparting conductivity of the mold.
As the impurity imparting p-type conductivity, for example, boron, aluminum, gallium, or the like can be used.

Next, etching is performed using the protective layer as a mask, and a region not covered by the protective layer (
A part of the semiconductor substrate 100 in the exposed region) is removed. As a result, a semiconductor region 105 isolated from other semiconductor regions is formed. As the etching, dry etching is preferably used, but wet etching may be used. An etching gas and an etchant can be appropriately selected according to the material to be etched.

Next, an element isolation insulating layer 101 is formed by forming an insulating layer so as to cover the semiconductor region 105 and selectively removing the insulating layer in a region overlapping with the semiconductor region 105. The insulating layer is formed using silicon oxide, silicon nitride, silicon oxynitride, or the like. As a method of removing the insulating layer, chemical mechanical polishing (Chemical Mechanical Poly) is used.
There are polishing processes such as a shing (CMP) process and an etching process, and any of them may be used. Note that the protective layer is removed after the semiconductor region 105 is formed or after the element isolation insulating layer 101 is formed.

Next, an insulating film 108 a is formed on the surface of the semiconductor region 105. The insulating film 108a is to be the gate insulating film 108 later, and can be formed by, for example, heat treatment (thermal oxidation treatment, thermal nitridation treatment, or the like) on the surface of the semiconductor region 105. Instead of heat treatment, high-density plasma treatment may be applied. The high-density plasma treatment can be performed using, for example, a rare gas such as He, Ar, Kr, or Xe, or a mixed gas such as oxygen, nitrogen oxide, ammonia, nitrogen, or hydrogen. Needless to say, the insulating layer may be formed by a CVD method, a sputtering method, or the like. The insulating layer includes silicon oxide, silicon oxynitride, silicon nitride, hafnium oxide, aluminum oxide, tantalum oxide, yttrium oxide, hafnium silicate (HfSi _x O _y (x
> 0, y> 0)), hafnium silicate doped with nitrogen (HfSi _x O _y (x> 0,
y> 0)), nitrogen-added hafnium aluminate (HfAl _x O _y (x> 0, y>
0)) and the like are desirable. The thickness of the insulating film 108a can be, for example, 1 nm to 100 nm, preferably 10 nm to 50 nm.

Next, a layer containing a conductive material is formed over the insulating film 108a, and the layer containing the conductive material is selectively etched, so that the gate electrode 111 is formed (see FIG. 6A).

The layer including a conductive material can be formed using a metal material such as aluminum, copper, titanium, tantalum, or tungsten. Alternatively, a layer including a conductive material may be formed using a semiconductor material such as polycrystalline silicon. There is no particular limitation on the formation method, and various film formation methods such as an evaporation method, a CVD method, a sputtering method, and a spin coating method can be used. Note that in this embodiment, an example of the case where the layer including a conductive material is formed using a metal material is described.

As the etching, dry etching is preferably used, but wet etching may be used. An etching gas and an etchant can be appropriately selected according to the material to be etched.

Next, phosphorus (P), arsenic (As), or the like is added to the semiconductor region 105 to form an impurity region 104a having a shallow junction depth (see FIG. 6A). At this time, the channel formation region 102 is formed under the gate electrode 111 of the semiconductor region 105 due to the formation of the impurity region 104a. Here, phosphorus or arsenic is added to form an n-type transistor.
In the case of forming a type transistor, an impurity element such as boron (B) or aluminum (Al) may be added. Here, the concentration of the impurity to be added can be set as appropriate. However, when the semiconductor element is highly miniaturized, it is desirable to increase the concentration.

Next, an insulating film is formed so as to cover the gate electrode 111, the insulating film 108a, and the like, and the insulating film is subjected to highly anisotropic etching treatment, so that the sidewall insulating film 107 is self-aligned.
Form. At the same time, the insulating film 108 a is etched to form the gate insulating film 108. As the insulating film used for the sidewall insulating film 107, an insulating film similar to the insulating film 108a may be used. As the etching, dry etching is preferably used, but wet etching may be used. An etching gas and an etchant can be appropriately selected according to the material to be etched.

Next, phosphorus (P) is formed in a region of the impurity region 104a that does not overlap with the sidewall insulating film 107.
), Arsenic (As), or the like is added to form an impurity region 104b having an impurity concentration higher than that of the impurity region 104a (see FIG. 6B). This treatment can be performed using a method similar to that for the impurity region 104a. Further, an insulating film functioning as a protective film may be provided over the impurity region 104a before the impurity region 104b is formed.

Next, a metal layer 109 is formed so as to cover the gate electrode 111, the sidewall insulating film 107, the impurity region 104a, the impurity region 104b, and the like. The metal layer 109 can be formed by various film formation methods such as a vacuum evaporation method, a sputtering method, and a spin coating method. The metal layer 109 is preferably formed using a metal material that becomes a low-resistance metal compound by reacting with a semiconductor material included in the semiconductor region 105. Examples of such a metal material include titanium, tantalum, tungsten, nickel, cobalt, platinum, and the like.

Next, heat treatment is performed to react the metal layer 109 with the semiconductor material. This
A metal compound region 106 in contact with the impurity region 104a and the impurity region 104b is formed (see FIG. 6C). Note that in the case where polycrystalline silicon or the like is used as the gate electrode 111, a metal compound region is also formed in a portion of the gate electrode 111 that is in contact with the metal layer 109.

As the heat treatment, for example, heat treatment by flash lamp irradiation can be used. Of course, other heat treatment methods may be used, but in order to improve the controllability of the chemical reaction related to the formation of the metal compound, it is desirable to use a method capable of realizing a heat treatment for a very short time. Note that the metal compound region is formed by a reaction between a metal material and a semiconductor material, and is a region in which conductivity is sufficiently increased. By forming the metal compound region, the electrical resistance can be sufficiently reduced and the device characteristics can be improved. Note that the metal layer 109 is removed after the metal compound region 106 is formed.

Next, an interlayer insulating film 103 is formed so as to cover each component formed by the above-described steps,
A connection electrode 112 a is provided in contact with one of the metal compound regions 106 and a connection electrode 112 b is provided in contact with the other of the metal compound regions 106 so as to be embedded in the interlayer insulating film 103.
Further, the wiring 1 is in contact with the connection electrode 112 a so as to be embedded in the interlayer insulating film 103.
A wiring 114b is provided in contact with 14a on the connection electrode 112b. Here, the wiring 114a
The upper surface of the wiring 114 b is exposed from the interlayer insulating film 103.

Note that details of the interlayer insulating film 103, the connection electrode 112a, the connection electrode 112b, the wiring 114a, and the wiring 114b are described below.
26 and wiring 128a, so refer to that.

Through the above steps, the transistor 150 using the semiconductor substrate 100 is formed (FIG. 6D).
reference). Such a transistor 150 has a feature that it can operate at high speed.
Thus, the first semiconductor element layer 110 including the transistor 150 can be formed.

<Manufacturing method of wiring layer>
Next, a method for manufacturing the wiring layer 120 will be described with reference to FIGS.

First, an interlayer insulating film 122 is formed so as to cover each component of the first semiconductor element layer 110,
Further, an interlayer insulating film 124 a is formed on the interlayer insulating film 122.

The interlayer insulating film 122 is preferably an insulating film functioning as a barrier film that prevents entry of impurities diffused from the first semiconductor element layer 110. In particular, when a semiconductor substrate 100 is a single crystal silicon substrate, an SOI substrate, or a substrate provided with a semiconductor element such as silicon, hydrogen contained in the substrate is diffused and mixed into an oxide semiconductor film formed later. Can be prevented. As such an interlayer insulating film 122, for example, a silicon nitride film, a silicon nitride oxide film, an aluminum oxide film, or the like formed using a plasma CVD method, a sputtering method, or the like can be used. In this embodiment, a silicon nitride film formed by a plasma CVD method is used as the base insulating film 132a. Note that in this specification and the like, silicon nitride oxide refers to a composition having a nitrogen content higher than that of oxygen.

In particular, when a metal containing copper is used for the wiring, diffusion of copper can be prevented by using an inorganic insulating film having a high barrier property such as silicon nitride oxide or silicon nitride.
Is preferred.

The interlayer insulating film 124a can be formed using a material including an inorganic insulating material such as silicon oxide, silicon oxynitride, silicon nitride oxide, silicon nitride, or aluminum oxide.
Note that in this specification and the like, silicon oxynitride refers to a material whose oxygen content is higher than that of nitrogen. In particular, the interlayer insulating film 124a has a low dielectric constant (low
-K) It is preferable to use a material because it is possible to sufficiently reduce the capacitance caused by the overlap of various electrodes and wirings. Note that a porous insulating layer using any of these materials may be applied to the interlayer insulating film 124a. A porous insulating layer has a lower dielectric constant than an insulating layer having a high density, and thus it is possible to further reduce capacitance caused by electrodes and wiring. The interlayer insulating film 124a can also be formed using an organic insulating material such as polyimide or acrylic. There is no particular limitation on the formation method, and various film formation methods such as an evaporation method, a CVD method, a sputtering method, and a spin coating method can be used. By using a CVD method with a high film formation speed, the efficiency of semiconductor device manufacturing can be improved. Can be achieved. In the present embodiment, the interlayer insulating film 12
The case where silicon oxide formed by the CVD method is used as 4a will be described.

Next, an opening reaching the wiring 114a is formed in the interlayer insulating film 122 and the interlayer insulating film 124a (see FIG. 7A). The opening can be formed by a method such as etching using a mask. The mask can be formed by a method such as exposure using a photomask. As the etching, either wet etching or dry etching may be used. From the viewpoint of fine processing, it is preferable to use dry etching.

Next, a conductive layer 125 is formed so as to fill the openings formed in the interlayer insulating film 122 and the interlayer insulating film 124a (see FIG. 7B). The conductive layer 125 can be formed using a material and a method similar to those of the layer containing a conductive material used for the gate electrode 111.

Specifically, for example, a titanium film is thinly formed by a PVD method in a region including an opening, and CVD is performed.
A method of forming tungsten so as to be embedded in the opening after thinly forming titanium nitride by a method can be applied. Here, titanium formed by the PVD method has a function of reducing the oxide film at the interface and reducing the contact resistance with the metal compound region 106. Further, titanium nitride formed thereafter has a barrier function that suppresses diffusion of the conductive material.

Next, a part of the conductive layer 125 is removed by CMP treatment or etching treatment, the interlayer insulating film 124a is exposed, and a connection electrode 126 is formed (see FIG. 7C). Where CMP
The treatment is a method of flattening the surface by chemical and mechanical combined action based on the surface of the workpiece. In general, a polishing cloth is attached on the polishing stage, and the polishing stage and the workpiece are rotated or swung while supplying slurry (abrasive) between the workpiece and the polishing cloth. In this method, the surface of the workpiece is polished by the chemical reaction between the slurry and the workpiece surface and the mechanical polishing of the polishing cloth and the workpiece.

Next, an insulating film is formed over the interlayer insulating film 124 a and the connection electrode 126, and the connection electrode 126
And an opening for embedding the electrode 128b at a position where the capacitor 154 is to be formed later, and an interlayer insulating film 124 is formed. (See FIG. 7D). The opening can be formed by the same method as described above. Note that in this embodiment, an insulating film of the same material as the interlayer insulating film 124a is used as the insulating film, but the present invention is not limited thereto, and the interlayer insulating film may have a structure in which two or more kinds of insulating films are stacked. .

Next, a conductive layer is formed so as to fill the opening formed in the interlayer insulating film 124, and a part of the conductive layer is removed by performing a CMP process or an etching process, thereby exposing the interlayer insulating film 124 and wiring. 128a and an electrode 128b are formed (see FIG. 7E). At this time, the interlayer insulating film 1
24, the upper surfaces of the wiring 128a and the electrode 128b preferably form substantially the same plane. In this manner, by planarizing the surfaces of the interlayer insulating film 124, the wiring 128a, and the electrode 128b, favorable electrodes, wirings, insulating layers, semiconductor layers, and the like can be formed in later steps.

The conductive layer can be formed using a material and a method similar to those of the layer containing a conductive material used for the connection electrode 126. In particular, when reducing the wiring resistance, copper (Cu) or a conductive material containing copper can be used. In that case, by using a conductive material containing an element having a melting point higher than that of Cu, such as W, Ta, Mo, Ti, or Cr, the conductive layer is formed so as to sandwich the conductive layer, thereby suppressing migration of the wiring 128a and the like. The reliability of the semiconductor device can be improved.

Here, the CMP process may be performed once or a plurality of times. C divided into multiple times
When performing MP treatment, it is preferable to perform final polishing at a low polishing rate after performing primary polishing at a high polishing rate. By combining polishing with different polishing rates in this manner, the flatness of the surfaces of the interlayer insulating film 124, the wiring 128a, and the electrode 128b can be further improved.

In this manner, the electrode 128b included in the capacitor 154 is formed using the same layer as the wiring 128a, and is formed using the same material and the same process. Accordingly, the capacitor element 154 can be formed without increasing extra steps in the process of forming the transistor 150 of the wiring layer 120 and the second semiconductor element layer 130, and the semiconductor element and the capacitor element are efficiently formed. be able to.

Note that the interlayer insulating film 103, the connection electrode 112a, the connection electrode 112b, and the wiring 114 described above are used.
a and the wiring 114b, the interlayer insulating film 124, the connection electrode 126, and the wiring 128
It can be formed using the same material and method as a.

  Thus, the wiring layer 120 can be formed.

Note that the method for manufacturing the wiring layer 120 is not limited to the method described with reference to FIGS. For example, after the openings corresponding to the connection electrode 126, the wiring 128a, and the electrode 128b are first formed in the interlayer insulating film 124, the connection electrode 126, the wiring 128a, and the electrode 128b are formed by embedding a conductive material in the opening. it can. In this case, the connection electrode 126, the wiring 128a, and the electrode 128b are formed of the same material.

<Method for Manufacturing Second Semiconductor Element Layer>
Next, a method for manufacturing the second semiconductor element layer 130 will be described with reference to FIGS.

First, the base insulating film 132a is formed over the interlayer insulating film 124, the wiring 128a, and the electrode 128b, and the base insulating film 132b is formed over the base insulating film 132a.

The base insulating film 132a is preferably an insulating film functioning as a barrier film that prevents entry of impurities diffused from a lower layer than the base insulating film 132a. In particular, when a semiconductor substrate 100 is a single crystal silicon substrate, an SOI substrate, or a substrate provided with a semiconductor element such as silicon, hydrogen contained in the substrate is diffused and mixed into an oxide semiconductor film formed later. Can be prevented. As such a base insulating film 132a, for example, a silicon nitride film, a silicon nitride oxide film, an aluminum oxide film, or the like formed by a plasma CVD method, a sputtering method, or the like can be used.

In this embodiment, a silicon nitride film formed by a plasma CVD method is used as the base insulating film 132a.

If the base insulating film 132b is an insulating film containing excess oxygen (an insulating film containing oxygen exceeding the stoichiometric composition ratio), an oxide semiconductor film formed later with excess oxygen contained in the base insulating film 132b It is preferable because it is possible to compensate for oxygen deficiency. Base insulating film 132b
In order to contain excess oxygen, for example, the base insulating film 132b may be formed in an oxygen atmosphere. Alternatively, oxygen (including at least one of oxygen radicals, oxygen atoms, and oxygen ions) may be injected into the base insulating film 132b after film formation to form an oxygen-excess region. As an oxygen implantation method, an ion implantation method, an ion doping method, a plasma immersion ion implantation method, a plasma treatment, or the like can be used.

As such a base insulating film 132b, for example, a silicon oxynitride film or a silicon oxide film formed by a plasma CVD method, a sputtering method, or the like can be used. Oxygen can be supplied to these insulating films using, for example, an apparatus for performing an etching process on a semiconductor device or an apparatus for performing ashing on a resist mask. Note that in this specification and the like, silicon oxynitride refers to a material whose oxygen content is higher than that of nitrogen.

In this embodiment, as the base insulating film 132b, a silicon oxynitride film which is formed by a plasma CVD method and is subjected to plasma treatment in an atmosphere containing oxygen to contain excess oxygen is used.

In addition, it is preferable to improve the planarity of the surface of the base insulating film 132b by performing polishing treatment (for example, CMP processing), dry etching processing, plasma processing, or the like on the base insulating film 132b. In this manner, by improving the planarity of the surface of the base insulating film 132b, the crystallinity of the oxide semiconductor film 134 provided over the base insulating film 132b can be improved.

As the plasma treatment, for example, reverse sputtering in which an argon gas is introduced to generate plasma can be performed. Reverse sputtering refers to R on the substrate side in an argon atmosphere.
In this method, a voltage is applied using an F power source to form plasma in the vicinity of the substrate to modify the surface. Note that nitrogen, helium, oxygen, or the like may be used instead of the argon atmosphere. When reverse sputtering is performed, powdery substances (also referred to as particles or dust) attached to the deposition surface of the oxide semiconductor film 134 can be removed.

As a process for improving flatness, the polishing process, the dry etching process, and the plasma process may be performed a plurality of times, or a combination thereof may be performed. In the case where the steps are performed in combination, the order of steps is not particularly limited, and may be set as appropriate depending on the unevenness state of the deposition surface of the oxide semiconductor film 134.

Here, regarding the region of the base insulating film 132b that overlaps with the channel formation region 134c later, it is particularly preferable to improve surface flatness. Specifically, the base insulating film 132b
The average surface roughness (Ra) is 0.15 nm or less, preferably 0.8.
It should be 1 nm or less.

Next, an oxide semiconductor film is formed over the base insulating film 132b. The oxide semiconductor film 113 is formed of
As described above, a single layer structure or a laminated structure may be used. Further, it may be an amorphous oxide semiconductor or a crystalline oxide semiconductor. In the case where the oxide semiconductor film has an amorphous structure, a crystalline oxide semiconductor may be formed by performing heat treatment on the oxide semiconductor with an amorphous structure in a later manufacturing process. The heat treatment temperature for crystallizing the amorphous oxide semiconductor is 250 ° C. or higher and 700 ° C. or lower, preferably 400 ° C. or higher, more preferably 500 ° C. or higher, and further preferably 550 ° C. or higher. Note that the heat treatment can also serve as another heat treatment in the manufacturing process. For example, the thickness of the oxide semiconductor film is preferably 1 nm to 30 nm, and more preferably 5 nm to 10 nm.

As a method for forming the oxide semiconductor film, a sputtering method, MBE (Molecular Be
am Epitaxy), CVD, pulsed laser deposition, ALD (Atomic L)
ayer Deposition) method or the like can be used as appropriate. The oxide semiconductor film 113 is a sputtering apparatus that performs film formation in a state where a plurality of substrate surfaces are set substantially perpendicular to the surface of the sputtering target, a so-called CP sputtering apparatus (Column).
Alternatively, a film may be formed using a ner plasma sputtering system.

When forming the oxide semiconductor film, it is preferable to reduce the concentration of hydrogen contained in the oxide semiconductor film as much as possible. In order to reduce the hydrogen concentration, for example, in the case where film formation is performed using a sputtering method, as an atmospheric gas supplied into the processing chamber of the sputtering apparatus, hydrogen,
A high-purity rare gas (typically argon) from which impurities such as water, a hydroxyl group, or a hydride are removed, oxygen, and a mixed gas of a rare gas and oxygen are used as appropriate.

In addition, the hydrogen concentration in the formed oxide semiconductor layer can be reduced by introducing a sputtering gas from which hydrogen and moisture are removed while removing residual moisture in the deposition chamber. In order to remove moisture remaining in the deposition chamber, it is preferable to use an adsorption-type vacuum pump such as a cryopump, an ion pump, or a titanium sublimation pump. Further, a turbo molecular pump provided with a cold trap may be used. The film formation chamber evacuated using a cryopump has a high exhaust capability such as a compound containing hydrogen atoms (more preferably a compound containing carbon atoms) such as hydrogen molecules and water (H ₂ O). The concentration of impurities contained in the oxide semiconductor film 113 formed in the film chamber can be reduced.

In the case where the oxide semiconductor film is formed by a sputtering method, the relative density (filling rate) of the metal oxide target used for film formation is 90% to 100%, preferably 95% to 99.99.
9% or less. By using a metal oxide target having a high relative density, the formed oxide semiconductor layer can be a dense film.

In addition, forming the oxide semiconductor film while keeping the semiconductor substrate 100 at a high temperature is also effective in reducing the concentration of impurities that can be contained in the oxide semiconductor film. The temperature at which the semiconductor substrate 100 is heated may be 150 ° C. or higher and 450 ° C. or lower, and preferably the substrate temperature may be 200 ° C. or higher and 350 ° C. or lower. Also, by heating the substrate at a high temperature during film formation,
A crystalline oxide semiconductor layer can be formed.

In the case where a film is formed using a sputtering method, the target is the oxide semiconductor film 1 described above.
What is necessary is just to set suitably according to 34 materials and its composition. For example, In: Ga: Zn =
In-Ga with an atomic ratio of 1: 1: 1, In: Ga: Zn = 1: 3: 2, In: Ga: Zn = 3: 1: 2, or In: Ga: Zn = 2: 1: 3. A Zn-based oxide or an oxide in the vicinity of the composition may be used as a target. However, the target is not limited to these materials and compositions.

Note that an oxide semiconductor film is formed under conditions such that a large amount of oxygen is contained during film formation (for example, oxygen 10
The film is formed by sputtering in a 0% atmosphere and contains a large amount of oxygen (preferably the oxide semiconductor has an excessive oxygen content relative to the stoichiometric composition ratio in the crystalline state. It is preferable to use a film that includes such a region.

A sputtering gas used for forming the oxide semiconductor film is preferably a high-purity gas from which impurities such as hydrogen, water, a hydroxyl group, or hydride are removed.

In the case where a CAAC-OS film is used as the oxide semiconductor film, there are three methods for obtaining the CAAC-OS film. The first is a method in which an oxide semiconductor layer is formed at a film formation temperature of 200 ° C. or higher and 450 ° C. or lower, and is c-axis oriented substantially perpendicular to the surface. The second method is a method in which an oxide semiconductor layer is formed with a thin film thickness, and then heat treatment is performed at 200 ° C. to 700 ° C. so that the c-axis alignment is approximately perpendicular to the surface. Third, after the first layer is thinned, 2
In this method, heat treatment is performed at a temperature of 00 ° C. or more and 700 ° C. or less, a second layer is formed, and the c-axis orientation is approximately perpendicular to the surface.

In addition, in order to remove (dehydrate or dehydrogenate) excess hydrogen (including water and a hydroxyl group) included in the oxide semiconductor film, heat treatment is preferably performed on the oxide semiconductor film with an electric furnace or the like. . The temperature of the heat treatment is 300 ° C. or higher and 700 ° C. or lower, or lower than the strain point of the substrate. The heat treatment can be performed under reduced pressure or in a nitrogen atmosphere.

Note that the heat treatment apparatus is not limited to an electric furnace, and an apparatus for heating an object to be processed by heat conduction or heat radiation from a heating element such as a resistance heating element may be used. For example, GRTA (Gas
Rapid Thermal Annealing (LRID) device, LRTA (Lamp Rap
RTA (Rapid Therm) such as id Thermal Annealing)
al Annealing) apparatus can be used. The LRTA apparatus is an apparatus that heats an object to be processed by radiation of light (electromagnetic waves) emitted from a lamp such as a halogen lamp, a metal halide lamp, a xenon arc lamp, a carbon arc lamp, a high pressure sodium lamp, or a high pressure mercury lamp. The GRTA apparatus is an apparatus that performs heat treatment using a high-temperature gas. As the high-temperature gas, an inert gas that does not react with an object to be processed by heat treatment, such as nitrogen or a rare gas such as argon, is used.

For example, as a heat treatment using a GRTA apparatus, the substrate may be put in an inert gas heated to a high temperature of 650 ° C. to 700 ° C., heated for several minutes, and then the substrate may be taken out of the inert gas. .

In the heat treatment, it is preferable that water, hydrogen, or the like be not contained in nitrogen or a rare gas such as helium, neon, or argon. Alternatively, the purity of nitrogen or a rare gas such as helium, neon, or argon introduced into the heat treatment apparatus is 6N (99.9999%) or more, preferably 7N
(99.99999%) or more (that is, the impurity concentration is 1 ppm or less, preferably 0.1 ppm)
Or less).

By this heat treatment, hydrogen which is an impurity imparting n-type conductivity can be removed from the oxide semiconductor. For example, the concentration of hydrogen contained in the oxide semiconductor film after dehydration or dehydrogenation treatment can be 5 × 10 ¹⁹ / cm ³ or less, preferably 5 × 10 ¹⁸ / cm ³ or less.

Note that heat treatment for dehydration or dehydrogenation may be performed at any timing in the manufacturing process of the transistor 152 as long as it is performed after the oxide semiconductor layer is formed. However, in the case where an aluminum oxide film is used as the gate insulating film 136a or the protective insulating film 144, it is preferably performed before the aluminum oxide film is formed. Further, the heat treatment for dehydration or dehydrogenation may be performed a plurality of times or may be combined with other heat treatment.

In addition, after the oxide semiconductor film is heated by the heat treatment, the high temperature oxygen gas, the high purity oxygen dinitride gas, or ultra-dry air (
The moisture content when measured using a CRDS (cavity ring down laser spectroscopy) type dew point meter is 20 ppm (-55 ° C. in terms of dew point) or less, preferably 1 ppm or less, more preferably 10 ppb or less). May be. It is preferable that water, hydrogen, or the like be not contained in the oxygen gas or the oxygen dinitride gas. Alternatively, the purity of the oxygen gas or oxygen dinitride gas introduced into the heat treatment apparatus is 6 N or more, preferably 7 N or more (that is, the impurity concentration in the oxygen gas or oxygen dinitride gas is 1 ppm or less, preferably 0.1 ppm or less). To do. By supplying oxygen, which is a main component material of the oxide semiconductor, which has been simultaneously reduced by the process of removing impurities by dehydration or dehydrogenation treatment by the action of oxygen gas or oxygen dinitride gas, The semiconductor film 113 can be highly purified and electrically i-type (intrinsic). By using such a highly purified oxide semiconductor, a transistor with extremely excellent off characteristics can be obtained.

Alternatively, oxygen (at least including any of oxygen radicals, oxygen atoms, and oxygen ions) may be introduced into the oxide semiconductor layer subjected to dehydration or dehydrogenation treatment to supply oxygen into the film. Good.

In the oxygen introduction step, oxygen may be directly introduced into the oxide semiconductor film, or oxygen may be introduced into the oxide semiconductor film through another film such as a gate insulating film 136a to be formed later. .
In the case where oxygen is introduced through another film, an ion implantation method, an ion doping method, a plasma immersion ion implantation method, or the like may be used. However, when oxygen is directly introduced into an exposed oxide semiconductor film, In addition to the above method, plasma treatment or the like can also be used.

The introduction of oxygen into the oxide semiconductor film may be after dehydration or dehydrogenation treatment,
There is no particular limitation. Further, oxygen may be introduced into the oxide semiconductor film subjected to the dehydration or dehydrogenation treatment a plurality of times. In the case where the oxide semiconductor film has a stacked structure of a plurality of layers,
Oxygen may be introduced after the formation of each oxide semiconductor layer.

Next, an oxide semiconductor film can be formed in the island-shaped oxide semiconductor film 134 by a photolithography process (see FIG. 8A).

A resist mask for forming the island-shaped oxide semiconductor film 134 may be formed by an inkjet method. When the resist mask is formed by an ink-jet method, a manufacturing cost can be reduced because a photomask is not used.

Note that the etching of the oxide semiconductor film 134 may be dry etching or wet etching, or both of them may be used. For example, as an etchant used for wet etching of the oxide semiconductor film, a mixed solution of phosphoric acid, acetic acid, and nitric acid, or the like can be used. Moreover, ITO-07N (manufactured by Kanto Chemical Co., Inc.) may be used. ICP (Inductive
The etching may be performed by dry etching using an ery coupled plasma (inductively coupled plasma) etching method.

Next, an opening is formed in a region overlapping with the electrode 128b of the base insulating film 132b. The opening can be formed using a method similar to the method of forming the opening in the interlayer insulating film 124. In the case of forming the semiconductor device illustrated in FIGS. 2 and 3, the base insulating film 132a may be etched in addition to the base insulating film 132b to form an opening through which the upper surface of the electrode 128b is exposed.

Next, the insulating film 136 which covers the oxide semiconductor film 134 and forms the gate insulating film 136a and the insulating film 136b in a later step is formed (see FIG. 8B). Here, the insulating film 136
The film thickness is preferably, for example, from 1 nm to 20 nm.

The insulating film 136 contains excess oxygen (insulating film containing oxygen exceeding the stoichiometric composition ratio).
It is preferable that oxygen vacancies in the oxide semiconductor film 134 be filled with excess oxygen contained in the insulating film 136. In order to contain excess oxygen in the insulating film 136,
For example, the insulating film 136 may be formed in an oxygen atmosphere. Alternatively, the insulating film 13 after film formation
6 may be implanted with oxygen (including at least one of oxygen radicals, oxygen atoms, and oxygen ions) to form an oxygen-excess region. As an oxygen implantation method, an ion implantation method, an ion doping method, a plasma immersion ion implantation method, a plasma treatment, or the like can be used.

As such an insulating film 136, for example, a silicon oxynitride film or a silicon oxide film formed by a plasma CVD method, a sputtering method, or the like can be used. For these insulating films, for example, an apparatus for performing an etching process on a semiconductor device,
Oxygen can be supplied using an apparatus for performing ashing on the resist mask. In this embodiment, as the insulating film 136, a silicon oxynitride film which is formed using a plasma CVD method and is subjected to plasma treatment in an atmosphere containing oxygen to include excess oxygen is used.

The insulating film 136 can have a stacked structure, and an insulating film functioning as a barrier film used for the base insulating film 132a may be provided over the insulating film containing excess oxygen. In the case where an aluminum oxide film is used for the insulating film functioning as a barrier film, the aluminum oxide film is formed by performing plasma treatment in an atmosphere containing oxygen after the aluminum film is formed by a plasma CVD method, a sputtering method, or the like. You can also

In particular, an aluminum oxide film has a high blocking effect (blocking effect) that prevents both hydrogen, moisture and other impurities, and oxygen from passing through the film. Therefore, the aluminum oxide film is formed of an oxide semiconductor film 134 of impurities such as hydrogen and moisture that cause fluctuations during and after the manufacturing process.
It functions as a barrier film that prevents entry into oxygen and release of oxygen, which is a main component material of the oxide semiconductor, from the oxide semiconductor film 134.

Further, heat treatment can be performed after the insulating film 136 is formed, so that an amount of oxygen exceeding the stoichiometric composition ratio included in the insulating film 136 can be supplied to the oxide semiconductor film 134. The heat treatment temperature is preferably 250 ° C. or higher and 700 ° C. or lower, or 400 ° C. or higher and 700 ° C. or lower, or less than the strain point of the substrate. For example, a substrate is introduced into an electric furnace which is one of heat treatment apparatuses, and heat treatment is performed at 250 ° C. for 1 hour in a nitrogen atmosphere.

At this time, by covering the insulating film containing excess oxygen that supplies oxygen with a dense barrier film, it prevents diffusion of oxygen from the insulating film containing excess oxygen that supplies oxygen, Oxygen can be supplied to the oxide semiconductor film 134.

In this manner, the insulating film containing excess oxygen that supplies oxygen is wrapped in a dense barrier film and subjected to heat treatment, whereby the oxide semiconductor film 134 substantially matches the stoichiometric composition. Or supersaturated with more oxygen than the stoichiometric composition.

As described above, an i-type (intrinsic) oxide semiconductor is formed by removing hydrogen or moisture from an oxide semiconductor film, highly purified so that impurities are not contained as much as possible, and supplying oxygen to fill oxygen vacancies. Alternatively, an oxide semiconductor that is as close to i-type (intrinsic) as possible can be obtained. By doing so, the Fermi level (Ef) of the oxide semiconductor can be brought to the same level as the intrinsic Fermi level (Ei). Therefore, by using the oxide semiconductor film for a transistor,
Variation in the threshold voltage Vth of the transistor due to oxygen deficiency and a threshold voltage shift ΔVth can be reduced.

Next, the gate electrode 138a is formed over the insulating film 136 so as to overlap with the oxide semiconductor film 134, and the electrode 138b is formed so as to overlap with the electrode 128b in the opening provided in the base insulating film 132b. The gate electrode 138a and the electrode 138b can be formed by a plasma CVD method, a sputtering method, or the like. Further, the gate electrode 138a and the electrode 138b
The materials are molybdenum, titanium, tantalum, tungsten, aluminum, copper, chromium,
A metal film containing an element selected from neodymium and scandium, or a metal nitride film (a titanium nitride film, a molybdenum nitride film, or a tungsten nitride film) containing any of the above elements as a component can be used. Alternatively, a semiconductor film typified by a polycrystalline silicon film doped with an impurity element such as phosphorus, or a silicide film such as nickel silicide may be used as the gate electrode 138a and the electrode 138b. The gate electrode 138a and the electrode 138b may have a single-layer structure or a stacked structure.

The materials of the gate electrode 138a and the electrode 138b are indium tin oxide, indium oxide containing tungsten oxide, indium zinc oxide containing tungsten oxide, indium oxide containing titanium oxide, and indium tin oxide containing titanium oxide. Alternatively, a conductive material such as indium zinc oxide or indium tin oxide to which silicon oxide is added can be used. Alternatively, a stacked structure of the conductive material and the metal material can be employed.

Further, as one layer of the gate electrode 138a in contact with the insulating film 136, a metal oxide containing nitrogen, specifically, an In—Ga—Zn—O film containing nitrogen, an In—Sn—O film containing nitrogen,
An In—Ga—O film containing nitrogen, an In—Zn—O film containing nitrogen, an Sn—O film containing nitrogen, an In—O film containing nitrogen, a metal nitride film (InN, SnN, etc.) Can be used. These films have a work function of 5 eV (electron volt), preferably 5.5 eV (electron volt) or more, and when used as a gate electrode layer, the threshold voltage of the electrical characteristics of the transistor can be made positive. In other words, a so-called normally-off switching element can be realized.

Note that the gate electrode 138 a is formed of a conductive film (not shown) provided over the insulating film 136.
It can be formed by processing using a mask. Here, the mask used for processing can be a mask having a finer pattern by performing a slimming process on a mask formed by a photolithography method or the like.

As the slimming treatment, for example, an ashing treatment using radical oxygen (oxygen radical) or the like can be applied. However, the slimming process need not be limited to the ashing process as long as the mask formed by a photolithography method or the like can be processed into a finer pattern. In addition, since the channel length (L) of the transistor is determined by the mask formed by the slimming process, a process with good controllability can be applied as the slimming process. As a result of the slimming process, a mask formed by a photolithography method or the like is less than the resolution limit of the exposure apparatus, preferably 1
It is possible to reduce the line width to / 2 or less, more preferably 1/3 or less. Thereby, further miniaturization of the transistor can be achieved.

In this manner, the electrode 138b included in the capacitor 154 is formed using the same layer as the gate electrode 138a and is formed using the same material and the same process. Thus, the wiring layer 120
In addition, the capacitor 154 can be formed without increasing extra steps in the step of forming the transistor 150 of the second semiconductor element layer 130, and the semiconductor element and the capacitor can be formed efficiently.

Next, the impurity element 135 is introduced into the oxide semiconductor film 134 using the gate electrode 138a as a mask, so that the impurity region 134a, the impurity region 134b, and the channel formation region 134c are formed in a self-aligned manner (see FIG. 8C). Thus, the channel formation region 134c is formed so as to be sandwiched between the impurity region 134a and the impurity region 134b. Note that as illustrated in FIG. 8C, a resist mask 137 or the like may be provided over a region where the impurity element 135 is not necessarily introduced so that the impurity is not introduced.

As the impurity element 135, an impurity that changes the conductivity of the oxide semiconductor film 134 is preferably used. As the impurity element 135, a Group 15 element (typically phosphorus (P), arsenic (A
s), and antimony (Sb)), boron (B), aluminum (Al), nitrogen (N)
, Argon (Ar), helium (He), neon (Ne), indium (In), fluorine (F), chlorine (Cl), titanium (Ti), and zinc (Zn) Can be used.

As a method for introducing the impurity element 135, an ion implantation method, an ion doping method, or the like can be used. In that case, a single ion of the impurity element 135 or a fluoride or chloride ion may be used.

In particular, in the case where a crystalline oxide semiconductor film such as a CAAC-OS film is used as the oxide semiconductor film 134, an element having a large atomic weight such as argon is introduced by an ion implantation method or an ion doping method. Since part of the physical semiconductor film 134 becomes amorphous and becomes n-type, the impurity region 134a and the impurity region 134b whose resistivity is lower than that of the channel formation region 134c can be formed.

The step of introducing the impurity element 135 may be controlled by appropriately setting the implantation conditions such as the acceleration voltage and the dose, and the thickness of the film to be passed.

In addition, the impurity element 135 may be introduced while the semiconductor substrate 100 is heated. Further, heat treatment may be performed after the impurity element 135 introduction treatment.

Note that the treatment for introducing the impurity element 135 into the oxide semiconductor film 134 may be performed a plurality of times, and a plurality of types of impurity elements may be used.

Next, an insulating film is formed over the insulating film 136, the gate electrode 138a, and the electrode 138b, and the insulating film is etched. The sidewall insulating film 140a and the sidewall that are in contact with at least the side surfaces of the gate electrode 138a and the electrode 138b are formed. An insulating film 140b is formed. At this time, the insulating film 136 is also etched, so that the gate insulating film 136a and the electrode 138 overlapping with the gate electrode 138a and the sidewall insulating film 140a are formed.
An insulating film 136b overlapping with b and the sidewall insulating film 140b is also formed (FIG. 8D
)reference). Here, the sidewall insulating film 140a and the sidewall insulating film 140b
For the insulating film used for, a material similar to that used for the insulating film 136 can be used.

In the etching treatment, it is preferable that the insulating film 136b and the base insulating film 132b have high selectivity. For example, as described above, a silicon oxide film or a silicon oxynitride film may be used for the insulating film 136b, and a silicon nitride film may be used for the base insulating film 132b.

The sidewall insulating film 140a and the sidewall insulating film 140b can be formed in a self-aligned manner by performing a highly anisotropic etching process on the insulating film. For example, it is preferable to use a dry etching method. Examples of the etching gas used for the dry etching method include a gas containing fluorine such as trifluoromethane, octafluorocyclobutane, and tetrafluoromethane. A rare gas or hydrogen may be added to the etching gas. The dry etching method is preferably a reactive ion etching method (RIE method) in which a high frequency voltage is applied to the substrate.

The sidewall insulating film 140a and the sidewall insulating film 140b are provided so as to be in contact with the side surfaces of the gate electrode 138a and the electrode 138b, but an insulating film that covers the upper surface may be formed by photolithography. Further, the sidewall insulating film 140
In addition to a and the sidewall insulating film 140b, the gate electrode 138a and the electrode 138
An insulating film may be provided so as to overlap with the upper surface of b.

In this manner, the insulating film 136b included in the capacitor 154 is replaced with the gate insulating film 136a.
Are formed in the same layer and in the same material and in the same process. Thereby, the wiring layer 1
The capacitor element 154 can be formed without adding extra steps in the process of forming the transistor 150 of the 20th and second semiconductor element layers 130, and the semiconductor element and the capacitor element can be formed efficiently.

Next, the base insulating film 132b, the oxide semiconductor film 134, the gate electrode 138a, and the electrode 138
b. A conductive film is formed over the sidewall insulating film 140a and the sidewall insulating film 140b, and the conductive film is processed to form the source electrode 142a and the drain electrode 142b (see FIG. 9A).

Here, as the conductive film used as the source electrode 142a and the drain electrode 142b, for example, a metal film containing an element selected from Al, Cr, Cu, Ta, Ti, Mo, and W, or the above-described element is used as a component. A metal nitride film (a titanium nitride film, a molybdenum nitride film, a tungsten nitride film) or the like can be used. Further, a refractory metal film such as Ti, Mo, W or the like or a metal nitride film thereof (titanium nitride film, molybdenum nitride film, tungsten nitride film) is provided on one or both of the lower side or the upper side of a metal film such as Al or Cu. It is good also as a structure which laminated | stacked. The conductive film may be formed using a conductive metal oxide. As the conductive metal oxide, indium oxide (In ₂ O ₃ ), tin oxide (SnO ₂ ), zinc oxide (ZnO), indium tin oxide (In ₂ O ₃ —SnO ₂ , abbreviated as ITO), oxidation Indium zinc oxide (In ₂ O ₃ —ZnO) or a metal oxide material containing silicon oxide can be used.

The source electrode 142a and the drain electrode 142b may be formed by forming a resist mask over the conductive film using a photolithography process and selectively etching to remove at least the conductive film over the gate electrode 138a. Accordingly, the conductive film is divided with the gate electrode 138a interposed therebetween, and thus can function as the source electrode 142a and the drain electrode 142b.

In the photolithography process, ultraviolet light, KrF laser light, A
It is preferable to use rF laser light. Accordingly, the channel length of the transistor 152 is reduced (specifically, 100 nm or less, preferably 60 nm or less, more preferably 30 nm).
The operation speed of the transistor 152 can be increased. In the case of performing exposure with a channel length of less than 25 nm, for example, exposure at the time of forming a resist mask in a photolithography process may be performed using extreme ultraviolet light having a very short wavelength of several nm to several tens of nm. Exposure by extreme ultraviolet light has a high resolution and a large depth of focus.

Note that as a method for forming the source electrode 142a and the drain electrode 142b other than the above, a planarization film is further provided over the conductive film, and the planarization film and the conductive film are polished by a CMP process to be the source electrode 142a. There is also a method of forming the drain electrode 142b. At this time, by providing an insulating film over the gate electrode 138a and the electrode 138b as described above, the electrodes can be prevented from being polished.

In FIG. 9A, the drain electrode 142b is formed so that the drain electrode 142b is in contact with the oxide semiconductor film 134 and the electrode 138b. In the case of forming the semiconductor device illustrated in FIG. 2, the drain electrode 142b may be provided so as to be in contact with the electrode 128b through the above-described opening and not in contact with the electrode 138b. In the case of forming the semiconductor device illustrated in FIG. 3, the drain electrode 142b may be provided so as not to overlap with the opening of the base insulating film 132b.

Next, the protective insulating film 144 is formed over the base insulating film 132b, the gate electrode 138a, the source electrode 142a, and the drain electrode 142b (see FIG. 9B).

The protective insulating film 144 can be formed by a plasma CVD method, a sputtering method, an evaporation method, or the like. As the protective insulating film 144, an inorganic insulating film such as a silicon oxide film, a silicon oxynitride film, an aluminum oxynitride film, or a gallium oxide film can be typically used.

As the protective insulating film 144, an aluminum oxide film, a hafnium oxide film, a magnesium oxide film, a zirconium oxide film, a lanthanum oxide film, a barium oxide film, or a metal nitride film (eg, an aluminum nitride film) can be used. In particular, the aluminum oxide film is
Oxide semiconductor film of impurities such as hydrogen and moisture, which has a high blocking effect (blocking effect) of preventing both hydrogen and moisture impurities and oxygen from passing through the film, and causes variation during and after the manufacturing process It can be preferably applied because it functions as a protective film that prevents entry into oxygen 134 and release of oxygen, which is a main component material of the oxide semiconductor, from the oxide semiconductor film 134.

  Note that the protective insulating film 144 may be a single layer or a stacked layer.

The protective insulating film 144 is preferably formed using a method by which impurities such as water and hydrogen are not mixed into the protective insulating film 144 as appropriate, such as a sputtering method. As in the formation of the oxide semiconductor film 134, an adsorption-type vacuum pump (such as a cryopump) is preferably used to remove residual moisture in the deposition chamber of the protective insulating film 144. The concentration of impurities contained in the protective insulating film 144 formed in the film formation chamber evacuated using a cryopump can be reduced. Further, as an evacuation unit for removing moisture remaining in the deposition chamber of the protective insulating film 144, a turbo molecular pump provided with a cold trap may be used.

Next, an interlayer insulating film 146 is formed so as to cover each component formed by the above-described steps,
An opening through which the wiring 128a is exposed and an opening through which the source electrode 142a is exposed are formed in the interlayer insulating film 146, the protective insulating film 144, the base insulating film 132a, and the base insulating film 132b, and the connection electrode 148a and the wiring are embedded so as to fill the opening. 149a, a connection electrode 148b, and a wiring 149b are formed.

Note that the details of the interlayer insulating film 146, the connection electrode 148a, the connection electrode 148b, the wiring 149a, and the wiring 149b are the same as those of the interlayer insulating film 124, the connection electrode 126, and the wiring 128a of the wiring layer 120.

Through the above steps, the transistor 152 and the capacitor 154 including the oxide semiconductor film 134 are used.
Is formed (see FIG. 9C). Such a transistor 152 has a feature of extremely low off-state current.

Through the above steps, the second semiconductor element layer 130 including the transistor 152 and the capacitor 154 can be formed. In this manner, a semiconductor device having the first semiconductor element layer 110, the wiring layer 120, and the second semiconductor element layer 130 can be formed.

Note that before and after each of the above steps, a step of forming an electrode, a wiring, a semiconductor layer, an insulating layer, or the like may be further included. For example, a highly integrated semiconductor device can be realized by adopting a multilayer wiring structure including a laminated structure of an insulating layer and a conductive layer as a wiring structure.

In this manner, by providing the second semiconductor element layer using an oxide semiconductor over the first semiconductor element layer using an oxide semiconductor such as single crystal silicon, a transistor using single crystal silicon or the like is provided. In addition, a semiconductor device having a new structure in which a transistor including an oxide semiconductor is used for one integrated circuit can be provided.

This reduces power consumption while maintaining high-speed operation using a transistor that uses single crystal silicon or the like that is easy to operate at high speed and a transistor that uses an oxide semiconductor with extremely low off-state current. Thus, a semiconductor device having a new structure can be provided.

In addition, a transistor using an oxide semiconductor material is formed by stacking a second semiconductor element layer using an oxide semiconductor over a first semiconductor element layer using an oxide semiconductor such as single crystal silicon. Since the increase of the occupied area due to the provision can be prevented, the semiconductor element having a new structure can be highly integrated.

In addition, the capacitor element can be formed without increasing unnecessary steps in the step of forming the transistor using the oxide semiconductor of the wiring layer and the second semiconductor element layer, and the semiconductor element and the capacitor element can be efficiently formed. can do.

The structures, methods, and the like described in this embodiment can be combined as appropriate with any of the structures, methods, and the like described in the other embodiments.

(Embodiment 2)
In this embodiment, a semiconductor device and a method for manufacturing the semiconductor device, which are different from the semiconductor device described in Embodiment 1, will be described with reference to FIGS.

<Configuration example of semiconductor device>
FIG. 10 is a cross-sectional view illustrating an example of a structure of a semiconductor device. The semiconductor device shown in FIG.
A transistor 150 provided with a channel formation region in the first semiconductor material; a wiring 128 a formed over the transistor 150; a transistor 166 formed over the transistor 150; and a capacitor formed over the transistor 150. 168. In FIG. 10, the first semiconductor element layer 110 including the transistor 150 using the first semiconductor material is provided in the lower part, and a part of the transistor 166 using the second semiconductor material is used in the upper part.
And the second semiconductor element layer 170 including a part of the capacitor 168.
Further, the wiring layer 1 formed between the first semiconductor element layer 110 and the second semiconductor element layer 170.
20 is electrically connected. 10 illustrates a structure including one transistor 150, one transistor 166, and one capacitor 168; however, the semiconductor device may include a plurality of transistors.

The semiconductor device described in this embodiment includes a part of the wiring layer 120 and the second semiconductor element layer 17.
The configuration of 0 is different from the semiconductor device described in the above embodiment. Note that the structure of the first semiconductor element layer 110 is similar to that of the semiconductor device illustrated in FIG. 1, and thus the description of Embodiment 1 can be referred to for details.

The wiring layer 120 formed on the first semiconductor element layer 110 includes an interlayer insulating film 122 formed on the interlayer insulating film 103, the wiring 114a and the wiring 114b, and an interlayer formed on the interlayer insulating film 122. The insulating film 124, the connection electrode 126, the wiring 128a, the electrode 128b, and the gate electrode 1 formed so as to be embedded in the interlayer insulating film 122 and the interlayer insulating film 124
28c. The wiring 128a, the electrode 128b, and the gate electrode 128c are provided so that the upper surface is exposed from the interlayer insulating film 124, and are formed using a conductive film of the same layer. Here, it is preferable that the upper surfaces of the interlayer insulating film 122, the wiring 128a, the electrode 128b, and the gate electrode 128c form substantially the same plane. Here, the interlayer insulating film 12
2. Since the structure of the interlayer insulating film 124, the connection electrode 126, the wiring 128a, and the electrode 128b is the same as that of the semiconductor device illustrated in FIG. 1, the description in Embodiment 1 can be referred to for details.

The second semiconductor element layer 170 formed on the wiring layer 120 includes a gate insulating film 172 formed on the interlayer insulating film 124, the wiring 128a, the electrode 128b, and the gate electrode 128c.
A transistor 166 including the gate insulating film 172, and a gate insulating film 172
And the protective insulating film 144 formed over the transistor 166, the interlayer insulating film 146 formed over the protective insulating film 144, the gate insulating film 172, the protective insulating film 144, and the interlayer insulating film 146. Connection electrode 148a, connection electrode 148b, wiring 14
9a and wiring 149b. Here, regarding the structures of the protective insulating film 144, the interlayer insulating film 146, the connection electrode 148a, the connection electrode 148b, the wiring 149a, and the wiring 149b,
Since it is similar to the semiconductor device illustrated in FIG. 1, the description of Embodiment Mode 1 can be referred to for details.

The transistor 166 includes a gate electrode 128c provided in the wiring layer 120, a gate insulating film 172 provided on the gate electrode 128c, and a gate electrode 12 on the gate insulating film 172.
An upper surface of the oxide semiconductor film 174 through the oxide semiconductor film 174 provided so as to overlap with the channel 8c, a channel protective film 176 formed over the oxide semiconductor film 174, and an opening formed in the channel protective film 176. A source electrode (or drain electrode) 182a and a drain electrode (or source electrode) 182b which are formed in contact with at least a part thereof. Note that as the oxide semiconductor film 174, a film similar to the oxide semiconductor film 134 described in Embodiment 1 can be used.

The connection electrode 148b is provided so as to be in contact with the upper surface of the source electrode 182a.

Further, the capacitor 168 is formed across the second semiconductor element layer 170 and the wiring layer 120. The capacitor 168 includes an electrode 128b, a gate insulating film 172, and a drain electrode 182b.
And. That is, the electrode 128b functions as one electrode of the capacitor 168, the drain electrode 182b functions as the other electrode of the capacitor 168, and the gate insulating film 17
2 functions as a dielectric of the capacitor 168. Will do. Here, an opening is formed in a region overlapping with the electrode 128 b of the channel protective film 176, and the drain electrode 182 b is formed so as to overlap with the electrode 128 b and be in contact with the gate insulating film 172 in the opening. Note that the channel protective film 176 is not necessarily provided with an opening in a region overlapping with the electrode 128b. In that case, the channel protective film 176 also functions as a dielectric of the capacitor 168.

Here, the electrode 128b included in the capacitor 168 is formed using the same layer as the wiring 128a.
It is formed by the same material and the same process. Further, the gate insulating film 172 and the drain electrode 182 b included in the capacitor 168 form a transistor 166. Accordingly, the capacitor 168 can be formed without increasing extra steps in the step of forming the transistor 166 of the wiring layer 120 and the second semiconductor element layer 170, and the semiconductor element and the capacitor are efficiently formed. be able to.

Note that in the semiconductor device described in this embodiment, the transistor 166 is a so-called channel stop transistor; however, the semiconductor device described in this embodiment is not limited thereto. For example, the transistor 166 can be a channel-etched transistor.

<Method for Manufacturing Semiconductor Device>
A method for manufacturing the semiconductor device illustrated in FIG. 10 is described below with reference to FIGS.

Note that the manufacturing method of the first semiconductor element layer 110 and the wiring layer 120 is the same as that in Embodiment Mode 1, and thus the description of Embodiment Mode 1 is referred to. Further, the gate electrode 128c of the wiring layer 120 can be formed simultaneously with the electrode 128b.

<Method for Manufacturing Second Semiconductor Element Layer>
A method for manufacturing the second semiconductor element layer 170 will be described with reference to FIGS.

First, the gate insulating film 172 is formed over the interlayer insulating film 124, the wiring 128a, the electrode 128b, and the gate electrode 128c.

The gate insulating film 172 is preferably an insulating film that functions as a barrier film to prevent entry of impurities diffused from a lower layer than the gate insulating film 172, and has the same insulation as the base insulating film 132a described in Embodiment 1. It is preferable to use a membrane. Alternatively, an insulating film containing excess oxygen may be stacked over the insulating film functioning as the barrier film. In that case, an insulating film similar to the base insulating film 132b described in Embodiment 1 is stacked. The structure may be provided.

In addition, it is preferable that the planarity of the surface of the gate insulating film 172 be improved by performing polishing treatment (for example, CMP treatment), dry etching treatment, plasma treatment, or the like on the gate insulating film 172. The description of Embodiment Mode 1 can be referred to for details of this step.

Next, an oxide semiconductor film is formed over the gate insulating film 172, and an island-shaped oxide semiconductor film 174 is formed by a photolithography process so as to overlap with the gate electrode 128c (FIG. 11A). reference). The description of the oxide semiconductor film 134 in Embodiment 1 can be referred to for details of this step.

Next, a channel protective film 176 is formed over the oxide semiconductor film 174 and the gate insulating film 172 (see FIG. 11B). As the channel protective film 176, an insulating film containing excess oxygen (
An insulating film containing oxygen exceeding the stoichiometric composition ratio is preferable because oxygen vacancies in the oxide semiconductor film 174 can be filled by excess oxygen contained in the channel protective film 176. Therefore, it is preferable to use an insulating film similar to the insulating film 136 described in Embodiment 1.

Further, heat treatment can be performed after the channel protective film 176 is formed, so that an amount of oxygen exceeding the stoichiometric composition ratio contained in the channel protective film 176 can be supplied to the oxide semiconductor film 174. The heat treatment temperature is preferably 250 ° C. or higher and 700 ° C. or lower, or 400 ° C. or higher and 700 ° C. or lower, or less than the strain point of the substrate. For example, a substrate is introduced into an electric furnace which is one of heat treatment apparatuses, and heat treatment is performed at 250 ° C. for 1 hour in a nitrogen atmosphere.

Next, a resist mask is formed over the channel protective film 176 by a photolithography step, and an opening over the oxide semiconductor film 174 and an opening overlapping with the electrode 128b are formed (
FIG. 11C). The etching of the channel protective film 176 here may be dry etching or wet etching, or both may be used.

In this manner, by providing the channel protective film 176 in contact with the oxide semiconductor film 174, damage to the back channel side of the oxide semiconductor film 174 due to etching of the source electrode 182a and the drain electrode 182b (for example, during etching) Damage due to plasma or etching agent) can be prevented. This has stable electrical properties,
A semiconductor device including an oxide semiconductor can be provided.

Next, a conductive film used for a source electrode and a drain electrode is formed over the channel protective film 176 and the oxide semiconductor film 174, and the conductive film is selectively etched by a photolithography process, so that the source electrode 182a and the drain electrode are formed. 182b is formed (FIG. 11D).
reference). Here, the source electrode 182a and the drain electrode 182b are in contact with the upper surface of the oxide semiconductor film 174 through the opening formed in the channel protective film 176 in the above step. Further, the drain electrode 182b is in contact with the gate insulating film 172 in the opening formed in the channel protective film 176 so as to overlap with the electrode 128b.

Since the process can be performed using the same material and method as the process shown in FIG. 9A, the description of FIG. 9A can be referred to for the details of the source electrode 182a and the drain electrode 182b. it can.

Next, the protective insulating film 144 is formed over the channel protective film 176, the source electrode 182a, and the drain electrode 182b (see FIG. 12A). Here, the description in Embodiment 1 can be referred to for the protective insulating film 144.

Next, an interlayer insulating film 146 is formed so as to cover each component formed by the above-described steps,
Interlayer insulating film 146, protective insulating film 144, channel protective film 176, and gate insulating film 172
An opening through which the wiring 128a is exposed and an opening through which the source electrode 182a is exposed are formed, and the connection electrode 148a and the wiring 149a, and the connection electrode 148b and the wiring 149b are formed so as to fill the opening. Note that the interlayer insulating film 146, the connection electrode 148a, and the connection electrode 14
For the details of the wiring 8b, the wiring 149a, and the wiring 149b, the description in Embodiment 1 can be referred to.

Through the above steps, the transistor 166 and the capacitor 168 including the oxide semiconductor film 174 are used.
Is formed (see FIG. 12B). Such a transistor 166 has a feature of extremely low off-state current.

Through the above steps, the second semiconductor element layer 170 including the transistor 166 and the capacitor 168 can be formed. In this manner, a semiconductor device including the first semiconductor element layer 110, the wiring layer 120, and the second semiconductor element layer 170 can be formed.

In this manner, by providing the second semiconductor element layer using an oxide semiconductor over the first semiconductor element layer using an oxide semiconductor such as single crystal silicon, a transistor using single crystal silicon or the like is provided. In addition, a semiconductor device having a new structure in which a transistor including an oxide semiconductor is used for one integrated circuit can be provided.

This reduces power consumption while maintaining high-speed operation using a transistor that uses single crystal silicon or the like that is easy to operate at high speed and a transistor that uses an oxide semiconductor with extremely low off-state current. Thus, a semiconductor device having a new structure can be provided.

In addition, a transistor using an oxide semiconductor material is formed by stacking a second semiconductor element layer using an oxide semiconductor over a first semiconductor element layer using an oxide semiconductor such as single crystal silicon. Since the increase of the occupied area due to the provision can be prevented, the semiconductor element having a new structure can be highly integrated.

In addition, the capacitor element can be formed without increasing unnecessary steps in the step of forming the transistor using the oxide semiconductor of the wiring layer and the second semiconductor element layer, and the semiconductor element and the capacitor element can be efficiently formed. can do.

The structures, methods, and the like described in this embodiment can be combined as appropriate with any of the structures, methods, and the like described in the other embodiments.

(Embodiment 3)
In this embodiment, a semiconductor device which uses the semiconductor device described in the above embodiment, can hold stored contents even in a state where power is not supplied, and has no limit on the number of writing times is illustrated in FIG. The explanation will be given.

FIG. 13A illustrates an example of a circuit configuration of a semiconductor device, and FIG. 13B is a conceptual diagram illustrating an example of a semiconductor device. First, the semiconductor device illustrated in FIG. 13A is described, and then the semiconductor device illustrated in FIG. 13B is described below.

In the semiconductor device illustrated in FIG. 13A, the bit line BL and the source or drain electrode of the transistor 252 are electrically connected, the word line WL and the gate electrode of the transistor 252 are electrically connected, and the transistor 252 The source electrode or the drain electrode of the capacitor and the first terminal of the capacitor 254 are electrically connected. Here, the transistor 252 is formed using an oxide semiconductor material.

Next, the case where data is written and held in the semiconductor device (memory cell 250) illustrated in FIG. 13A is described.

First, the potential of the word line WL is set to a potential at which the transistor 252 is turned on, so that the transistor 252 is turned on. Accordingly, the potential of the bit line BL is changed to the capacitor 254.
(Write). After that, the potential of the word line WL is set to a potential at which the transistor 252 is turned off, and the transistor 252 is turned off.
The potential of the first terminal of the capacitor 254 is held (held).

The transistor 252 including an oxide semiconductor has a feature of extremely low off-state current. Therefore, when the transistor 252 is turned off, the potential of the first terminal of the capacitor 254 (or the charge accumulated in the capacitor 254) can be held for an extremely long time.

Next, reading of information will be described. When the transistor 252 is turned on, the floating bit line BL and the capacitor 254 are brought into conduction, and the bit line BL and the capacitor 254 are brought into conduction.
The charge is redistributed between the two. As a result, the potential of the bit line BL changes. The amount of change in the potential of the bit line BL varies depending on the potential of the first terminal of the capacitor 254 (or the charge accumulated in the capacitor 254).

For example, the potential of the first terminal of the capacitor 254 is V, the capacitor of the capacitor 254 is C, the capacitor component of the bit line BL (hereinafter also referred to as bit line capacitor) is CB, and before the charge is redistributed. When the potential of the bit line BL is VB0, the potential of the bit line BL after the charge is redistributed is (CB * VB0 + C * V) / (CB + C). Therefore, when the potential of the first terminal of the capacitor 254 assumes two states of V1 and V0 (V1> V0) as the state of the memory cell 250, the potential of the bit line BL when the potential V1 is held. (= CB * VB0 + C * V1
) / (CB + C)) is the potential (= CB * V) of the bit line BL when the potential V0 is held.
It can be seen that it is higher than (B0 + C * V0) / (CB + C)).

Then, information can be read by comparing the potential of the bit line BL with a predetermined potential.

As described above, the semiconductor device illustrated in FIG. 13A can hold charge that is accumulated in the capacitor 254 for a long time because the off-state current of the transistor 252 is extremely small. That is, the refresh operation is not necessary or the frequency of the refresh operation can be extremely low, so that power consumption can be sufficiently reduced.
Further, stored data can be retained for a long time even when power is not supplied.

  Next, the semiconductor device illustrated in FIG. 13B is described.

A semiconductor device illustrated in FIG. 13B includes memory cell arrays 251a to 251n (n is an integer greater than or equal to 2) including a plurality of memory cells 250 illustrated in FIG. A peripheral circuit 253 necessary for operating the memory cell array 251 (memory cell arrays 251a to 251n) is provided in the lower part. Note that the peripheral circuit 253 is electrically connected to the memory cell array 251.

With the structure shown in FIG. 13B, the peripheral circuit 253 is replaced with the memory cell array 25.
1 (memory cell array 251a to memory cell 251n) can be provided immediately below, so that the semiconductor device can be downsized.

A transistor provided in the peripheral circuit 253 is preferably formed using a semiconductor material different from that of the transistor 252. For example, silicon, germanium, silicon germanium, silicon carbide, gallium arsenide, or the like can be used, and a single crystal semiconductor is preferably used. In addition, an organic semiconductor material or the like may be used. A transistor using such a semiconductor material can operate at a sufficiently high speed. Therefore, various transistors (logic circuits, drive circuits, etc.) that require high-speed operation can be suitably realized by the transistors.

A specific structure of the semiconductor device illustrated in FIG. 13B can be described with reference to the semiconductor device illustrated in FIG. That is, the first peripheral circuit 153 shown in FIG.
The second semiconductor element layer 130 shown in FIG. 1 can be used as the memory cell arrays 251a to 251n shown in FIG. 13B. Here, the second semiconductor element layer 130 and the wiring layer 120 can be appropriately stacked according to the number of layers of the memory cell array.

Here, the transistor 252 and the capacitor 2 of the memory cell 250 illustrated in FIG.
As the transistor 54, the transistor 152 and the capacitor 154 illustrated in FIG.
Thus, the gate electrode 138a, the source electrode 142a, and the drain electrode 142b illustrated in FIG. 1 can be used as the gate electrode, the source electrode, and the drain electrode of the transistor 252 illustrated in FIG. In addition, as the bit line BL illustrated in FIG.
9b can be a wiring connected to the gate electrode 138a as the word line WL shown in FIG.

Note that in this embodiment, the specific structure of the semiconductor device illustrated in FIG.
However, the structure of another semiconductor device described in Embodiment 1 or 2 can be set as appropriate and used.

In this manner, a peripheral circuit using a transistor using a material other than an oxide semiconductor (in other words, a transistor that can operate at a sufficiently high speed), a transistor using an oxide semiconductor (
In a broader sense, a semiconductor device having an unprecedented characteristic can be realized by integrally including a memory circuit using a transistor having a sufficiently small off-state current. Further, the peripheral circuit and the memory circuit have a stacked structure, whereby the semiconductor device can be integrated.

In this manner, power consumption is maintained while maintaining high-speed operation using a transistor using single crystal silicon or the like that can easily operate at high speed and a transistor using an oxide semiconductor with extremely low off-state current. It is possible to provide a semiconductor device that achieves a reduction in the above.

Further, in the semiconductor device, a capacitor element can be formed without increasing extra steps in the step of forming the transistor using the oxide semiconductor of the wiring layer and the second semiconductor element layer. Can be formed efficiently.

This embodiment can be implemented in appropriate combination with the structures described in the other embodiments.

(Embodiment 4)
This embodiment mode is different from Embodiment Mode 3 in which the semiconductor device described in the above embodiment mode is used, stored contents can be held even in a state where power is not supplied, and the number of writings is not limited. An example of a semiconductor device will be described with reference to FIGS.

  FIG. 14 illustrates an example of a circuit configuration of the semiconductor device described in this embodiment.

In FIG. 14, the first wiring (1st Line) and the source electrode of the transistor 350 are electrically connected, and the second wiring (2nd Line) and the drain electrode of the transistor 350 are electrically connected. Yes. Further, the third wiring (3rd Line) and one of the source electrode and the drain electrode of the transistor 352 are electrically connected, and the fourth wiring (4th Line) and the gate electrode of the transistor 352 are electrically connected. It is connected to the. The other of the gate electrode of the transistor 350 and the source or drain electrode of the transistor 352 is electrically connected to one of the electrodes of the capacitor 356 to form a node FG, and a fifth wiring (5th Line). The other electrode of the capacitor 356 is electrically connected. Here, the transistor 350 is formed using a semiconductor material other than an oxide semiconductor such as single crystal silicon, and the transistor 352 is formed using an oxide semiconductor material.

In the semiconductor device illustrated in FIG. 14, information can be written, held, and read as follows by utilizing the feature that the potential of the gate electrode of the transistor 350 can be held.

Information writing and holding will be described. First, the potential of the fourth wiring is set to a potential at which the transistor 352 is turned on, so that the transistor 352 is turned on. Accordingly, the potential of the third wiring is supplied to the gate electrode of the transistor 350 and the capacitor 356. That is, a predetermined charge is given to the gate electrode of the transistor 350 (
writing). Here, a charge giving two different potential levels (hereinafter referred to as a Low level charge,
Any of high level charges) is given. After that, the potential of the fourth wiring is set to a potential at which the transistor 352 is turned off and the transistor 352 is turned off, whereby the charge given to the gate electrode of the transistor 350 is held (
Retention).

Since the off-state current of the transistor 352 including an oxide semiconductor is extremely small, the charge of the gate electrode (node FG) of the transistor 350 is held for a long time.

Next, reading of information will be described. When an appropriate potential (readout potential) is applied to the fifth wiring in a state where a predetermined potential (constant potential) is applied to the first wiring, the first wiring is changed according to the amount of charge held in the gate electrode of the transistor 350. The two wirings have different potentials. In general, when the transistor 350 is an n-channel transistor, the apparent threshold V _{th_H in the} case where a high level charge is applied to the gate electrode of the transistor 350 is a low level charge applied to the gate electrode of the transistor 350. This is because it becomes lower than the apparent threshold value V _{th_L} of the case. Here, the apparent threshold voltage refers to the potential of the fifth wiring necessary for turning on the transistor 350. Therefore, the charge given to the gate electrode of the transistor 350 can be determined by _setting the potential of the fifth wiring to a potential V _{0 that} is intermediate between V _{th_H} and V _{th_L} . For example, in the case where a high-level charge is applied in writing, the transistor 350 is turned “on” when the potential of the fifth wiring becomes V ₀ (> V _{th_H} ). When a low level charge is given,
Even when the potential of the fifth wiring becomes V ₀ (<V _{th_L} ), the transistor 350 remains in the “off state”. Therefore, the held information can be read by looking at the potential of the second wiring.

Since the transistor 350 formed using a semiconductor material other than an oxide semiconductor such as single crystal silicon can operate at a sufficiently high speed, reading speed of information can be increased.

Note that in the case of using memory cells arranged in an array, it is necessary to read only information of a desired memory cell. In the case where information is not read out in this way, a potential at which the transistor 350 is turned “off” regardless of the state of the gate electrode, that is, V th — _H
A smaller potential may be supplied to the fifth wiring. _{Alternatively, a} potential at which the transistor 350 is turned on regardless of the state of the gate electrode, that is, a potential higher than V _{th_L} may be _supplied to the fifth wiring.

In the semiconductor device described in this embodiment, stored data can be held for an extremely long time by using a transistor with an extremely small off-state current that uses an oxide semiconductor for a channel formation region. That is, the refresh operation is not necessary or the frequency of the refresh operation can be extremely low, so that power consumption can be sufficiently reduced. In addition, stored data can be held for a long time even when power is not supplied (note that a potential is preferably fixed).

In addition, in the semiconductor device described in this embodiment, high voltage is not required for writing data,
There is no problem of deterioration of the element. For example, unlike the conventional nonvolatile memory, it is not necessary to inject electrons into the floating gate or extract electrons from the floating gate, so that there is no problem of deterioration of the gate insulating film. That is, in the semiconductor device according to the disclosed invention, there is no limit to the number of rewritable times that is a problem in the conventional nonvolatile memory,
Reliability is dramatically improved. Further, since data is written depending on the on / off state of the transistor, high-speed operation can be easily realized.

Next, a specific structure of the semiconductor device illustrated in FIG. 14 is described with reference to a cross-sectional view illustrated in FIG. The semiconductor device illustrated in FIG. 15 includes a first semiconductor element layer 310 including a transistor 350 including a semiconductor material other than an oxide semiconductor such as single crystal silicon in a lower portion, and a transistor including an oxide semiconductor material in an upper portion. 352 and the second semiconductor element layer 330 including part of the capacitor 356. The first semiconductor element layer 310 and the second semiconductor element layer 330 are also provided.
Are electrically connected via a wiring layer 320 formed therebetween. Here, the structures of the transistor 350, the transistor 352, and the capacitor 356 are similar to the structures of the transistor 150, the transistor 152, and the capacitor 156 in the semiconductor device illustrated in FIG.

15 includes a connection electrode 112c, a wiring 114c, and a connection electrode 126a.
These electrodes provide the gate electrode 111 of the transistor 350 and the capacitor 3
The semiconductor device shown in FIG. 2 is different in that 56 electrodes 128b and the drain electrode 142b of the transistor 352 are connected. Here, the connecting electrode 112c is connected electrode 11c.
2a, the connection electrode 112b, the wiring 114c are formed in the same layer as the wiring 114a and the wiring 114b, and the connection electrode 126a is formed in the same layer as the connection electrode 126, and have the same configuration. 15 is the same as that of the semiconductor device shown in FIG. 2, and therefore, the same reference numerals as those shown in FIG. 2 are used for the details, and the previous embodiment is referred to for details. Can do.

Here, the wiring 114b is replaced with the second wiring (2nd) as the first wiring (1st Line).
Line 149a as a third line (Line) and wiring 149 as a third line (3rd Line)
b is a wiring that is connected to the gate electrode 138a as a fourth wiring (4th Line).
As the fifth wiring (5th Line), a wiring connected to the electrode 138b can be used. In addition, the gate electrode 111, the connection electrode 112c, the wiring 114c, the connection electrode 126a, the electrode 128b, and the drain electrode 142b correspond to the node FG.

Note that although the semiconductor device illustrated in FIG. 15 is described as a specific structure of the semiconductor device illustrated in FIG. 14 in this embodiment, the structure of the semiconductor device illustrated in Embodiment 1 or 2 is described. It can also be set and used as appropriate.

In this manner, by providing the second semiconductor element layer using an oxide semiconductor over the first semiconductor element layer using an oxide semiconductor such as single crystal silicon, a transistor using single crystal silicon or the like is provided. In addition, a semiconductor device having a new structure in which a transistor including an oxide semiconductor is used for one integrated circuit can be provided.

This reduces power consumption while maintaining high-speed operation using a transistor that uses single crystal silicon or the like that is easy to operate at high speed and a transistor that uses an oxide semiconductor with extremely low off-state current. Thus, a semiconductor device having a new structure can be provided.

In addition, a transistor using an oxide semiconductor material is formed by stacking a second semiconductor element layer using an oxide semiconductor over a first semiconductor element layer using an oxide semiconductor such as single crystal silicon. Since the increase of the occupied area due to the provision can be prevented, the semiconductor element having a new structure can be highly integrated.

Further, in the semiconductor device, a capacitor element can be formed without increasing extra steps in the step of forming the transistor using the oxide semiconductor of the wiring layer and the second semiconductor element layer. Can be formed efficiently.

The structures, methods, and the like described in this embodiment can be combined as appropriate with any of the structures, methods, and the like described in the other embodiments.

(Embodiment 5)
The semiconductor device described in any of the above embodiments is used for at least part of a CPU (Central
Processing Unit) can be configured.

FIG. 16A is a block diagram illustrating a specific structure of a CPU. A CPU illustrated in FIG. 16A is provided over a substrate 1190 with an arithmetic circuit (ALU: Arithmetic logic).
unit) 1191, ALU controller 1192, instruction decoder 119
3, interrupt controller 1194, timing controller 1195, register 1
196, register controller 1197, bus interface (Bus I / F) 11
98, rewritable ROM 1199, and ROM interface (ROM I / F
) 1189. As the substrate 1190, a semiconductor substrate, an SOI substrate, a glass substrate, or the like is used. The ROM 1199 and the ROM interface 1189 may be provided in separate chips. Needless to say, the CPU illustrated in FIG. 16A is just an example in which the configuration is simplified, and an actual CPU may have various configurations depending on the application.

Instructions input to the CPU via the bus interface 1198 are input to the instruction decoder 1193, decoded, and then input to the ALU controller 1192, interrupt controller 1194, register controller 1197, and timing controller 1195.

The ALU controller 1192, interrupt controller 1194, register controller 1197, and timing controller 1195 perform various controls based on the decoded instructions. Specifically, the ALU controller 1192 generates a signal for controlling the operation of the ALU 1191. The interrupt controller 1194 determines and processes an interrupt request from an external input / output device or a peripheral circuit from the priority or mask state during execution of the CPU program. The register controller 1197 generates an address of the register 1196, and reads and writes the register 1196 according to the state of the CPU.

The timing controller 1195 includes an ALU 1191 and an ALU controller 11.
92, a signal for controlling the operation timing of the instruction decoder 1193, the interrupt controller 1194, and the register controller 1197 is generated. For example, the timing controller 1195 includes an internal clock generation unit that generates an internal clock signal CLK2 based on the reference clock signal CLK1, and supplies the internal clock signal CLK2 to the various circuits.

In the CPU illustrated in FIG. 16A, a memory cell is provided in the register 1196.
As the memory cell of the register 1196, a memory cell including the semiconductor device described in any of the above embodiments can be used.

In the CPU shown in FIG. 16A, the register controller 1197 has an ALU 119.
1, the holding operation in the register 1196 is selected. That is, in a memory cell included in the register 1196, data is held by a phase inversion element,
Select whether to hold data by the capacitor. When data retention by the phase inverting element is selected, the power supply voltage is supplied to the memory cells in the register 1196. When holding of data in the capacitor is selected, data is rewritten to the capacitor and supply of power supply voltage to the memory cells in the register 1196 can be stopped.

The power supply is stopped by providing a switching element between the memory cell group and a node to which the power supply potential VDD or the power supply potential VSS is applied, as shown in FIG. 16B or FIG. 16C. Can do. The circuits in FIGS. 16B and 16C will be described below.

16B and 16C, the oxide semiconductor material of the second semiconductor element layer disclosed in the above embodiment is used as a switching element that controls supply of a power supply potential to a memory cell. An example of a structure of a memory circuit including a transistor is shown.

A memory device illustrated in FIG. 16B includes a switching element 1141 and a memory cell group 1143 including a plurality of memory cells 1142. Specifically, for each memory cell 1142, the memory cell described in the above embodiment can be used. Memory cell group 11
A high-level power supply potential VDD is supplied to each memory cell 1142 of 43 through a switching element 1141. Further, each memory cell 1142 included in the memory cell group 1143 is supplied with the potential of the signal IN and the low-level power supply potential VSS.

In FIG. 16B, the transistor using the oxide semiconductor material of the second semiconductor element layer disclosed in the above embodiment is used as the switching element 1141, and the transistor is supplied to a gate electrode thereof. Switching is controlled by the signal SigA.

Note that FIG. 16B illustrates a structure in which the switching element 1141 includes only one transistor; however, there is no particular limitation, and a plurality of transistors may be included. In the case where the switching element 1141 includes a plurality of transistors functioning as switching elements, the plurality of transistors may be connected in parallel, may be connected in series, or may be combined in series and parallel. May be connected.

In FIG. 16B, the switching element 1141 controls the supply of the high-level power supply potential VDD to each memory cell 1142 included in the memory cell group 1143. However, the switching element 1141 controls the low-level power supply potential VDD. The supply of the power supply potential VSS may be controlled.

FIG. 16C illustrates an example of a memory device in which a low-level power supply potential VSS is supplied to each memory cell 1142 included in the memory cell group 1143 through the switching element 1141. The switching element 1141 can control supply of the low-level power supply potential VSS to each memory cell 1142 included in the memory cell group 1143.

Between the memory cell group and the node to which the power supply potential VDD or the power supply potential VSS is applied,
Even when a switching element is provided to temporarily stop the operation of the CPU and stop the supply of power supply voltage, data can be retained and power consumption can be reduced.
Specifically, for example, the operation of the CPU can be stopped while the user of the personal computer stops inputting information to an input device such as a keyboard, thereby reducing power consumption. it can.

In the CPU described in this embodiment, the second semiconductor using an oxide semiconductor over the first semiconductor element layer using an oxide semiconductor such as single crystal silicon described in the above embodiment is used. The semiconductor device is provided with an element layer. Accordingly, a transistor using single crystal silicon or the like that can easily operate at high speed and a transistor using an oxide semiconductor with extremely low off-state current can be used as appropriate depending on the role of the transistor included in the CPU. it can.
Therefore, a CPU that can reduce power consumption while maintaining high-speed operation can be provided.

In addition, a transistor using an oxide semiconductor material is formed by stacking a second semiconductor element layer using an oxide semiconductor over a first semiconductor element layer using an oxide semiconductor such as single crystal silicon. Since an increase in the occupied area due to the provision can be prevented, high integration of the CPU can be achieved.

In addition, a capacitor can be formed without increasing extra steps in the step of forming the transistor using the oxide semiconductor of the wiring layer and the second semiconductor element layer, and the semiconductor element and the capacitor constituting the CPU can be formed. It can be formed efficiently.

Here, the CPU has been described as an example, but a DSP (Digital Signal)
Processor), custom LSI, FPGA (Field Program)
le Gate Array).

Incidentally, a magnetic tunnel junction element (MTJ element) is known as a nonvolatile random access memory. An MTJ element is an element that stores information by being in a low resistance state if the spin directions in the films arranged above and below the insulating film are parallel and in a high resistance state if the spin directions are antiparallel. Therefore, the principle is completely different from that of the memory including an oxide semiconductor described in this embodiment. Table 1 shows a comparison between the MTJ element and the semiconductor device according to the present embodiment.

Since the MTJ element uses a magnetic material, there is a drawback that the magnetism is lost when the temperature is higher than the Curie temperature. Further, since the MTJ element is current driven, it is compatible with a silicon bipolar device, but the bipolar device is not suitable for integration. The MTJ element has a problem that although the write current is very small, the power consumption increases due to the increase in memory capacity.

In principle, the MTJ element is weak in magnetic field resistance, and when exposed to a strong magnetic field, the direction of spin tends to go wrong. In addition, it is necessary to control the magnetization fluctuation caused by the nanoscale formation of the magnetic material used in the MTJ element.

Furthermore, since the MTJ element uses a rare earth element, it requires considerable care to incorporate it into a silicon semiconductor process that dislikes metal contamination. The MTJ element is considered to be expensive in view of the material cost per bit.

On the other hand, the transistor using the oxide semiconductor material of the second semiconductor element layer described in the above embodiment has an element structure and an operation principle except that the semiconductor material forming the channel is a metal oxide. It is similar to a silicon MOSFET. In addition, a transistor including an oxide semiconductor is not affected by a magnetic field and has a characteristic that a soft error cannot occur. Therefore, it can be said that the compatibility with the silicon integrated circuit is very good.

In addition, as shown in Table 1, the memory combining the transistor using an oxide semiconductor and the transistor using silicon, which is described in the above embodiment, has higher heat resistance and 3D (3D) than the spintronic device. This is advantageous in many respects, such as a layered structure having more than one layer) and magnetic field resistance. Note that the overhead power in Table 1 means that when multiple processors spin on a lock, these processors compete for the lock and generate excessive traffic on the bus and system interconnect. This is the power consumed for so-called overhead.

Thus, by using a memory using an oxide semiconductor that has many advantages over spintronic devices, it is possible to realize CPU power saving.

The structures, methods, and the like described in this embodiment can be combined as appropriate with any of the structures, methods, and the like described in the other embodiments.

(Embodiment 6)
In this embodiment, the semiconductor device described in the above embodiment is a mobile phone, a smartphone,
An example of application to a portable device such as an electronic book will be described with reference to FIGS.

In portable devices such as mobile phones, smartphones, and electronic books, SRAM or DRAM is used for temporary storage of image data. The reason why SRAM or DRAM is used is that the flash memory has a slow response and is not suitable for image processing. On the other hand, when SRAM or DRAM is used for temporary storage of image data, it has the following characteristics.

In a normal SRAM, as shown in FIG.
It consists of six transistors 1 to 1706, which are driven by an X decoder 1707 and a Y decoder 1708. The transistor 1703 and the transistor 1705, and the transistor 1704 and the transistor 1706 constitute an inverter, and can be driven at high speed. However, since one memory cell is composed of 6 transistors, there is a disadvantage that the cell area is large. S when the minimum dimension of the design rule is F
The memory cell area of the RAM is usually a 100~150F ^2. For this reason, SRAM has the highest unit price per bit among various memories.

On the other hand, in the DRAM, the memory cell has a transistor 171 as shown in FIG.
1 and a storage capacitor 1712, which includes an X decoder 1713 and a Y decoder 1
It is driven at 714. One cell has one transistor and one capacitor, and has a small area. The memory cell area of DRAM is usually 10F ² or less. However,
DRAM always needs refreshing and consumes power even when it is not rewritten.

However, the memory cell area of the semiconductor device described in the above embodiment is around 10F ² and frequent refreshing is not necessary. Therefore, the memory cell area can be reduced and the power consumption can be reduced.

FIG. 18 shows a block diagram of a portable device. 18 includes an RF circuit 1801, an analog baseband circuit 1802, a digital baseband circuit 1803, a battery 18 and the like.
04, power supply circuit 1805, application processor 1806, flash memory 18
10, display controller 1811, memory circuit 1812, display 1813
, A touch sensor 1819, an audio circuit 1817, a keyboard 1818, and the like. A display 1813 includes a display portion 1814, a source driver 1815, and a gate driver 1816. The application processor 1806 is a CPU 180.
7, a DSP 1808, and an interface 1809 (also referred to as IF).
In general, the memory circuit 1812 includes an SRAM or a DRAM. By adopting the semiconductor device described in the above embodiment for this portion, information can be written and read at high speed, and long-term storage can be performed. In addition, power consumption can be sufficiently reduced.

FIG. 19 illustrates an example in which the semiconductor device described in any of the above embodiments is used for the memory circuit 1950 of the display. A memory circuit 1950 illustrated in FIG. 19 includes a memory 1952 and a memory 19.
53, a switch 1954, a switch 1955, and a memory controller 1951. Further, the memory circuit reads a signal line from the image data (input image data), a memory 1952, and a data (stored image data) stored in the memory 1953, and a display controller 1956 for performing control and a display controller 1956.
A display 1957 is connected for display by a signal from.

First, certain image data is formed by an application processor (not shown) (input image data A). The input image data A is stored in the memory 19 via the switch 1954.
52. The image data stored in the memory 1952 (stored image data A)
Display 1 via switch 1955 and display controller 1956
Sent to 957 and displayed.

When there is no change in the input image data A, the stored image data A is normally sent from the memory 1952 through the switch 1955 at a cycle of about 30 to 60 Hz.
6 is read out.

Next, for example, when the user performs an operation of rewriting the screen (that is, when the input image data A is changed), the application processor forms new image data (input image data B). The input image data B is stored in the memory 1953 via the switch 1954. During this time, the stored image data A is periodically read from the memory 1952 via the switch 1955. When new image data (stored image data B) is stored in the memory 1953, the stored image data B is read from the next frame of the display 1957, and the display 1 is displayed via the switch 1955 and the display controller 1956.
The stored image data B is sent to 957 for display. This reading is continued until new image data is stored in the memory 1952 next time.

As described above, the memory 1952 and the memory 1953 display the display 1957 by alternately writing image data and reading image data. In addition,
The memory 1952 and the memory 1953 are not limited to different memories, and one memory may be divided and used. By employing the semiconductor device described in any of the above embodiments for the memory 1952 and the memory 1953, information can be written and read at high speed, data can be stored for a long time, and power consumption can be sufficiently reduced. it can.

FIG. 20 shows a block diagram of an electronic book. FIG. 20 shows a battery 2001 and a power supply circuit 200.
2, microprocessor 2003, flash memory 2004, audio circuit 2005, keyboard 2006, memory circuit 2007, touch panel 2008, display 2009,
It is comprised by the display controller 2010.

Here, the semiconductor device described in any of the above embodiments can be used for the memory circuit 2007 in FIG. The role of the memory circuit 2007 has a function of temporarily holding the contents of a book. An example of a function is when a user uses a highlight function. When a user is reading an electronic book, the user may want to mark a specific part. This marking function is called a highlight function, and is to show the difference from the surroundings by changing the display color, underlining, making the character thicker, or changing the font of the character. This is a function for storing and holding information on a location designated by the user. If this information is stored for a long time, it may be copied to the flash memory 2004. Even in such a case, by adopting the semiconductor device described in the above embodiment, writing and reading of information can be performed at high speed, long-term storage can be performed, and power consumption can be sufficiently reduced. Can do.

As described above, the portable device described in this embodiment includes the semiconductor device according to any of the above embodiments. This realizes a portable device that can read data at high speed, can store data for a long period of time, and has low power consumption.

The structures, methods, and the like described in this embodiment can be combined as appropriate with any of the structures, methods, and the like described in the other embodiments.

(Embodiment 7)

The semiconductor device disclosed in this specification can be applied to a variety of electronic devices (including game machines). Electronic devices include televisions, monitors and other display devices, lighting devices, desktop or notebook personal computers, word processors, DVDs (Digital)
l Versatile Disc), an image playback device for playing back still images or moving images stored in a recording medium, portable CD player, radio, tape recorder, headphone stereo, stereo, cordless telephone cordless handset, transceiver, portable radio, mobile phone , Car phones, portable game machines, calculators, personal digital assistants, electronic notebooks, electronic books, electronic translators, voice input devices, video cameras, digital still cameras, electric shavers, microwave ovens and other high-frequency heating devices, electric rice cookers , Air conditioning equipment such as electric washing machines, vacuum cleaners, air conditioners,
Examples include dishwashers, dish dryers, clothes dryers, futon dryers, electric refrigerators, electric freezers, electric refrigerators, DNA storage freezers, smoke detectors, radiation measuring instruments, and medical devices such as dialysis machines. Further examples include industrial equipment such as guide lights, traffic lights, belt conveyors, elevators, escalators, industrial robots, and power storage systems. In addition, an engine using petroleum, a moving body driven by an electric motor using electric power from a non-aqueous secondary battery, and the like are also included in the category of electric equipment. Examples of the moving body include an electric vehicle (EV), a hybrid vehicle (HEV) having both an internal combustion engine and an electric motor, and a plug-in hybrid vehicle (PHE).
V), tracked vehicles in which these tire wheels are changed to endless tracks, motorbikes including electric assist bicycles, motorcycles, electric wheelchairs, golf carts, small or large ships, submarines,
Examples include helicopters, aircraft, rockets, artificial satellites, space probes, planetary probes, and spacecraft. Specific examples of these electronic devices are shown in FIGS.

In FIG. 21A, an air conditioner including an indoor unit 3300 and an outdoor unit 3304 is an example of an electrical device using the CPU described in Embodiment 5. Specifically, the indoor unit 3300 includes a housing 3301, an air outlet 3302, a CPU 3303, and the like. FIG.
) Illustrates the case where the CPU 3303 is provided in the indoor unit 3300, but the CPU 3303 may be provided in the outdoor unit 3304. Alternatively, the CPU 3303 may be provided in both the indoor unit 3300 and the outdoor unit 3304. Since the CPU includes a transistor including an oxide semiconductor as described in Embodiment 5 and can reduce power consumption, the power consumption of the air conditioner can be reduced.

In FIG. 21A, an electric refrigerator-freezer 3310 is an example of an electric device including a CPU including an oxide semiconductor. Specifically, the electric refrigerator-freezer 3310 includes a housing 3311, a refrigerator compartment door 3312, a freezer compartment door 3313, a vegetable compartment door 3314, a CPU 3315, and the like. In FIG. 21A, the CPU 3315 is provided inside the housing 3311. By using the CPU described in Embodiment 5 for the CPU 3315 of the electric refrigerator-freezer 3310, power consumption of the electric refrigerator-freezer 3310 can be reduced.

In FIG. 21C, the video display device 3320 is an example of an electrical device including a CPU including an oxide semiconductor. Specifically, the video display device 3320 includes a housing 3321 and a display unit 3.
322, a CPU 3323, and the like. In FIG. 21A, the CPU 3323 has the housing 332.
1 is provided. The CPU described in Embodiment 5 is replaced with the CP of the video display device 3320.
By using for U3323, the power consumption of the video display device 3320 can be reduced.

FIG. 21B illustrates an example of an electric vehicle which is an example of an electric device. Electric car 33
30, a secondary battery 3331 is mounted. The power of the secondary battery 3331 is supplied from the control circuit 3
The output is adjusted by 332 and supplied to the driving device 3333. The control circuit 3332
Control is performed by a processing device 3334 having a ROM, a RAM, a CPU, etc. (not shown). By using the CPU described in Embodiment 5 for the CPU of the electric vehicle 3330, power consumption of the electric vehicle can be reduced.

Drive device 3333 is configured by a DC motor or an AC motor alone, or a combination of an electric motor and an internal combustion engine. The processing device 3334 is based on input information such as operation information (acceleration, deceleration, stop, etc.) of the driver of the electric vehicle 3330 and information at the time of traveling (information such as uphill and downhill, load information on the drive wheels). The control signal is output to the control circuit 3332.
The control circuit 3332 controls the output of the driving device 3333 by adjusting the electric energy supplied from the secondary battery 3331 according to the control signal of the processing device 3334. When an AC motor is mounted, an inverter that converts direct current to alternating current is also built in, although not shown.

  This embodiment can be implemented in appropriate combination with any of the other embodiments.

100 semiconductor substrate 101 element isolation insulating layer 102 channel forming region 103 interlayer insulating film 104a impurity region 104b impurity region 105 semiconductor region 106 metal compound region 107 sidewall insulating film 108 gate insulating film 108a insulating film 109 metal layer 110 semiconductor element layer 111 gate Electrode 112a Connection electrode 112b Connection electrode 112c Connection electrode 113 Oxide semiconductor film 114a Wiring 114b Wiring 114c Wiring 120 Wiring layer 122 Interlayer insulating film 124 Interlayer insulating film 124a Interlayer insulating film 125 Conductive layer 126 Connecting electrode 126a Connecting electrode 128a Wiring 128b Electrode 128c Gate electrode 130 Semiconductor element layer 132a Underlying insulating film 132b Underlying insulating film 134 Oxide semiconductor film 134a Impurity region 134b Impurity region 134c Channel formation region 135 Pure element 136 Insulating film 136a Gate insulating film 136b Insulating film 137 Resist mask 138a Gate electrode 138b Electrode 140a Side wall insulating film 140b Side wall insulating film 142a Source electrode 142b Drain electrode 144 Protective insulating film 146 Interlayer insulating film 147 Electrode 148a Connection electrode 148b connection electrode 148c connection electrode 148d connection electrode 148e connection electrode 149a wiring 149b wiring 149c connection electrode 149d wiring 150 transistor 152 transistor 154 capacitor element 156 capacitor element 158 capacitor element 162 capacitor element 162 capacitor element 166 transistor 168 capacitor element 170 semiconductor element layer 172 Gate insulating film 174 Oxide semiconductor film 176 Channel protective film 182a Source electrode 182b Drain electrode 250 Memory cell 251 Memory cell array 251a Memory cell array 251n Memory cell 252 Transistor 253 Peripheral circuit 254 Capacitor 310 Semiconductor element layer 320 Wiring layer 330 Semiconductor element layer 350 Transistor 352 Transistor 356 Capacitor 1141 Switching element 1142 Memory cell 1143 Memory cell group 1189 ROM interface 1190 Substrate 1191 ALU
1192 ALU Controller 1193 Instruction Decoder 1194 Interrupt Controller 1195 Timing Controller 1196 Register 1197 Register Controller 1198 Bus Interface 1199 ROM
1701 Transistor 1703 Transistor 1704 Transistor 1705 Transistor 1706 Transistor 1707 X decoder 1708 Y decoder 1711 Transistor 1712 Holding capacity 1713 X decoder 1714 Y decoder 1801 RF circuit 1802 Analog baseband circuit 1803 Digital baseband circuit 1804 Battery 1805 Power supply circuit 1806 Application processor 1807 CPU
1808 DSP
1809 Interface 1810 Flash memory 1811 Display controller 1812 Memory circuit 1813 Display 1814 Display unit 1815 Source driver 1816 Gate driver 1817 Audio circuit 1818 Keyboard 1819 Touch sensor 1950 Memory circuit 1951 Memory controller 1952 Memory 1953 Memory 1954 Switch 1955 Switch 1956 Display controller 1957 Display 2001 Battery 2002 Power supply circuit 2003 Microprocessor 2004 Flash memory 2005 Audio circuit 2006 Keyboard 2007 Memory circuit 2008 Touch panel 2009 Display 2010 Display controller 3300 Indoor unit 3301 Housing 3302 Air outlet 3303 C U
3304 Outdoor unit 3310 Electric refrigerator-freezer 3311 Housing 3312 Refrigeration room door 3313 Freezing room door 3314 Vegetable room door 3315 CPU
3320 Video display device 3321 Housing 3322 Display unit 3323 CPU
3330 Electric vehicle 3331 Secondary battery 3332 Control circuit 3333 Driving device 3334 Processing device

Claims (2)

A first electrode of a capacitive element;
A first insulating film provided on and in contact with the first electrode;
A second insulating film provided on and in contact with the first insulating film;
A transistor provided on and in contact with the second insulating film,
The transistor includes an oxide semiconductor film in which a channel is formed, and a conductive film that functions as a source electrode or a drain electrode.
The conductive film covers a side surface of the second insulating film;
The semiconductor device, wherein the conductive film functions as a second electrode of the capacitor. A first electrode of a capacitive element;
A first insulating film provided on and in contact with the first electrode;
A second insulating film provided on and in contact with the first insulating film;
A transistor provided on and in contact with the second insulating film,
The transistor includes an oxide semiconductor film in which a channel is formed, and a conductive film that functions as a source electrode or a drain electrode.
The conductive film covers a side surface of the second insulating film;
The conductive film is in contact with the upper surface of the first insulating film;
The semiconductor device, wherein the conductive film functions as a second electrode of the capacitor.

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