JP6463355B2 - Led照明装置及び方法 - Google Patents
Led照明装置及び方法 Download PDFInfo
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
- F21K9/62—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using mixing chambers, e.g. housings with reflective walls
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
- F21K9/65—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction specially adapted for changing the characteristics or the distribution of the light, e.g. by adjustment of parts
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S10/00—Lighting devices or systems producing a varying lighting effect
- F21S10/02—Lighting devices or systems producing a varying lighting effect changing colors
- F21S10/023—Lighting devices or systems producing a varying lighting effect changing colors by selectively switching fixed light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/0015—Fastening arrangements intended to retain light sources
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
- F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
- H05B45/20—Controlling the colour of the light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2105/00—Planar light sources
- F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2105/00—Planar light sources
- F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
- F21Y2105/12—Planar light sources comprising a two-dimensional array of point-like light-generating elements characterised by the geometrical disposition of the light-generating elements, e.g. arranging light-generating elements in differing patterns or densities
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2113/00—Combination of light sources
- F21Y2113/10—Combination of light sources of different colours
- F21Y2113/13—Combination of light sources of different colours comprising an assembly of point-like light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
- Y02B20/30—Semiconductor lamps, e.g. solid state lamps [SSL] light emitting diodes [LED] or organic LED [OLED]
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- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Circuit Arrangement For Electric Light Sources In General (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Description
(i)ウォームホワイトLED3及びクールホワイトLED4が、LEDランプ1の拡散カバー10の表面に比較的近接しているMCPCB2の周辺領域に、環状形状で実装されていることによる、改善されたLEDランプ1からの光の分散及びビーム角、
(ii)ウォームホワイトLED3及びクールホワイトLED4(主な熱源である)からMCB2構造を介する周囲空気への熱伝導経路が実質的に最小化されることにより、小型LEDランプモジュール1の熱放散が改善される。このように熱放散機能が向上することにより、演出することができる相関色温度スペクトルを広げるようにLED照明能力もまた向上する、
(iii)ヒトの眼が知覚する、拡散カバー10を通して直接見えるRGB発光を軽減するように、RGB LED3が、拡散カバー10の表面から比較的離れて配置されているMCPCB2の中心領域2bに配置されていることにより、LEDランプモジュール1から放出される光の混色の全体的な品質もまた改善される。
Claims (7)
- 周辺領域及び中心領域を有するLED実装プラットフォームと、
前記LED実装プラットフォームに実装されたLEDであって、およそ2500Kの相関色温度を表すように動作可能な複数のウォームホワイトLED及びおよそ6500Kの相関色温度を表すように動作可能な複数のクールホワイトLED、並びに、前記LED実装プラットフォームの前記中心領域にクラスター構成で実装された複数のRGB LEDからなり、前記複数のウォームホワイトLED及び前記複数のクールホワイトLEDは、前記LED実装プラットフォームの前記周辺領域の周りに交互に実装されて、実質的に環状形状を形成しているLEDと、
前記複数のウォームホワイトLED、前記複数のクールホワイトLED及び前記複数のRGB LEDから放出される光が、少なくとも180度のビーム角を有する同質の混合された光放射として通過可能に構成された拡散カバーと、
前記複数のウォームホワイトLED、前記複数のクールホワイトLED及び/又は前記複数のRGB LEDから放出される光の少なくとも1つの発光特性を、複数の照明モードをもたらすようにリモートコントローラーを介して入力される無線制御信号に応じて変更するように構成されたマイクロコントローラーと、を備え、
前記LED実装プラットフォームは、熱伝導経路を提供するように構成された熱伝導性基板を備え、前記LED実装プラットフォームの前記周辺領域の周囲に実装された前記複数のウォームホワイトLED及び前記複数のクールホワイトLEDが発生した熱は、前記熱伝導経路を介して照明装置の外部の周囲空気に伝導し、
前記マイクロコントローラーは、前記複数の照明モードの中から少なくとも第1の照明モードをもたらすために、前記複数のクールホワイトLEDから放出される光に対する前記複数のウォームホワイトLEDから放出される光の比が、およそ1:1から3:1の範囲となるように、前記少なくとも1つの発行特性を変更するように構成されており、
前記マイクロコントローラーは、前記第1の照明モードに関連付けて設定された相対的な最大光束から、前記第1の照明モードに関連付けて設定された相対的な最小光束までの範囲で、前記複数のウォームホワイトLED及び前記複数のクールホワイトLEDによって生成された光束を徐々に低下させるように構成されている、照明装置。 - 前記LED実装プラットフォームは、メタルコアプリント回路基板(MCPCB)又はセラミック基板等の熱伝導性基板を備える、請求項1に記載の照明装置。
- 前記照明装置から熱エネルギーを放散するように構成されたヒートシンクを含む、請求項1または2に記載の照明装置。
- 前記ヒートシンクは、前記LED実装プラットフォームに熱的に結合されている、請求項3に記載の照明装置。
- 選択的に変更される前記少なくとも1つの発光特性は、
(a)前記複数のクールホワイトLED、前記複数のウォームホワイトLED及び/又は前記複数のRGB LEDから放出される光の色彩特性と、
(b)前記複数のクールホワイトLED、前記複数のウォームホワイトLED及び/又は前記複数のRGB LEDから放出される光の相関色温度特性と、
(c)前記複数のクールホワイトLED、前記複数のウォームホワイトLED及び/又は前記複数のRGB LEDから放出される光の輝度特性と、
(d)前記複数のクールホワイトLED、前記複数のウォームホワイトLED及び/又は前記複数のRGB LEDから放出される光の色彩特性、相関温度特性及び/又は輝度特性の比率と、のうちの少なくとも1つを含む、請求項1〜4のいずれか一項に記載の照明装置。 - 前記マイクロコントローラーは、前記複数の照明モードの間で第1の照明モードから第2の照明モードに切り替えるために、前記複数のクールホワイトLED、前記複数のウォームホワイトLED及び/又は前記複数のRGB LEDの前記少なくとも1つの発光特性を徐々に変更するように構成されている、請求項1〜5のいずれか一項に記載の照明装置。
- 前記マイクロコントローラーは、およそ0.1秒〜5.0秒の範囲の期間にわたり、前記複数のクールホワイトLED、前記複数のウォームホワイトLED及び/又は前記複数のRGB LEDの前記少なくとも1つの発光特性を徐々に変更するように構成されている、請求項6に記載の照明装置。
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PCT/CN2014/085050 WO2016026153A1 (en) | 2014-08-22 | 2014-08-22 | Led illumination device and method |
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JP2017510020A JP2017510020A (ja) | 2017-04-06 |
JP6463355B2 true JP6463355B2 (ja) | 2019-01-30 |
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US (1) | US10317019B2 (ja) |
EP (1) | EP3063459A4 (ja) |
JP (1) | JP6463355B2 (ja) |
AU (1) | AU2014404171B9 (ja) |
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CN109669366B (zh) * | 2018-12-29 | 2021-12-24 | 联想(北京)有限公司 | 控制方法和装置 |
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CN103822146A (zh) | 2014-03-04 | 2014-05-28 | 深圳市聚作照明股份有限公司 | 一种快速安装的led灯具 |
US9530943B2 (en) * | 2015-02-27 | 2016-12-27 | Ledengin, Inc. | LED emitter packages with high CRI |
-
2014
- 2014-08-22 WO PCT/CN2014/085050 patent/WO2016026153A1/en active Application Filing
- 2014-08-22 US US15/503,947 patent/US10317019B2/en not_active Expired - Fee Related
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- 2014-08-22 EP EP14900250.3A patent/EP3063459A4/en not_active Withdrawn
- 2014-08-22 JP JP2016524570A patent/JP6463355B2/ja not_active Expired - Fee Related
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WO2016026153A1 (en) | 2016-02-25 |
AU2014404171B9 (en) | 2020-04-02 |
JP2017510020A (ja) | 2017-04-06 |
AU2014404171B2 (en) | 2020-03-26 |
US10317019B2 (en) | 2019-06-11 |
EP3063459A1 (en) | 2016-09-07 |
US20170241601A1 (en) | 2017-08-24 |
AU2014404171A1 (en) | 2016-04-21 |
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