JP6462181B2 - Electronic control unit - Google Patents

Electronic control unit Download PDF

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JP6462181B2
JP6462181B2 JP2018507070A JP2018507070A JP6462181B2 JP 6462181 B2 JP6462181 B2 JP 6462181B2 JP 2018507070 A JP2018507070 A JP 2018507070A JP 2018507070 A JP2018507070 A JP 2018507070A JP 6462181 B2 JP6462181 B2 JP 6462181B2
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connector
electronic control
control device
electronic
board
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JPWO2017163573A1 (en
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正人 齋藤
正人 齋藤
河合 義夫
義夫 河合
諒 秋葉
諒 秋葉
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Hitachi Astemo Ltd
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Hitachi Automotive Systems Ltd
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Description

本発明は、自動車などに搭載される電子制御装置の構造に関するものである。   The present invention relates to the structure of an electronic control device mounted on an automobile or the like.

近年、自動車では、車室内スペースの確保やエンジンルーム内の部品点数増加の為、エンジンルーム内スペースの小型・狭小化が進んでいる。その為、エンジンルーム内に搭載される電子制御装置に対しても、小型化が求められている。電子制御装置を小型化する為には、電子回路を構成する電子部品や配線基板を小型化する必要がある。   In recent years, in an automobile, the space in the engine room has been reduced in size and size in order to secure a vehicle interior space and increase the number of parts in the engine room. Therefore, downsizing is also required for the electronic control device mounted in the engine room. In order to reduce the size of the electronic control device, it is necessary to reduce the size of electronic components and wiring boards that constitute the electronic circuit.

電子制御装置の配線基板の一端には、外部ケーブルと接続するためのコネクタが取り付けられ、コネクタ端子と電子部品との間は基板配線によって接続される。コネクタ端子を基板配線に接続する方法として、例えば特許文献1及び2に記載のものがある。   A connector for connecting to an external cable is attached to one end of the wiring board of the electronic control device, and the connector terminal and the electronic component are connected by board wiring. As a method for connecting the connector terminal to the substrate wiring, for example, there are methods described in Patent Documents 1 and 2.

特許文献1には、コネクタ部の端子を回路部の本体の対応する導電用バスバーと共に、一の材料から一体に形成する構成が開示されている。   Patent Document 1 discloses a configuration in which the terminal of the connector part is integrally formed from one material together with the corresponding conductive bus bar of the main body of the circuit part.

一方、特許文献2には、コネクタから突出された端子基部の先端から、コネクタと基板との取付面側に略90°屈曲された端子屈曲部が形成され、さらに端子屈曲部の先端から、前記端子基部と略平行となるように屈曲された電気接合部が形成され、電気接合部が基板に密着して接続される構成が開示されている。   On the other hand, in Patent Document 2, a terminal bent portion bent by approximately 90 ° is formed on the mounting surface side of the connector and the substrate from the tip of the terminal base portion protruding from the connector, and further, from the tip of the terminal bent portion, A configuration is disclosed in which an electrical joint bent to be substantially parallel to the terminal base is formed, and the electrical joint is in close contact with the substrate.

特開2011−077003号公報JP 2011-077003 A 特開2007−137390号公報JP 2007-137390 A

しかしながら、特許文献1及び2の構成では、単一の外部ケーブルに接続されるコネクタ端子の束が配線基板の端部付近に集約して配置されているため、コネクタ端子と接続される電子部品ごとに、当該電子部品から配線基板の端部付近まで伸びる基板配線が必要となる。すなわち、電子部品とコネクタ端子とを接続するための配線エリアを配線基板に一定以上確保しておく必要があるため、配線基板の小型化には限界がある。更に、基板配線が長くなることにより、耐ノイズ性が低下するおそれもある。   However, in the configurations of Patent Documents 1 and 2, since a bundle of connector terminals connected to a single external cable is arranged in the vicinity of the end of the wiring board, each electronic component connected to the connector terminal In addition, a board wiring extending from the electronic component to the vicinity of the end of the wiring board is required. That is, there is a limit to downsizing of the wiring board because it is necessary to secure a wiring area for connecting the electronic component and the connector terminal to the wiring board at a certain level or more. Furthermore, noise resistance may be lowered due to the length of the substrate wiring.

また、特許文献1及び2の構成では、コネクタ端子がコネクタハウジング内で横一列に配置されており、配線基板に接続できる端子数が限られている。そのため、多数の信号を内外で授受する電子制御装置には適用できない。   Further, in the configurations of Patent Documents 1 and 2, the connector terminals are arranged in a horizontal row in the connector housing, and the number of terminals that can be connected to the wiring board is limited. Therefore, it cannot be applied to an electronic control device that sends and receives many signals inside and outside.

本発明は、上述した課題を解決するためになされたものであり、その目的は、電子回路基板の配線長を短くすることにより、電子回路基板の小型化及び耐ノイズ性の向上を可能とした電子制御装置を提供することにある。   The present invention has been made to solve the above-described problems, and the object thereof is to reduce the wiring length of the electronic circuit board, thereby reducing the size of the electronic circuit board and improving the noise resistance. It is to provide an electronic control device.

上記課題を解決するために、本発明は、複数の電子部品が実装された電子回路基板と、単一の外部ケーブルと接続されるコネクタと、前記電子回路基板と前記コネクタとを接続する複数の導電部材とを備えた電子制御装置において、前記複数の導電部材のコネクタ側端子は、前記コネクタのコネクタ間口部に複数段かつ複数列に配置され、前記電子回路基板において前記複数の導電部材の基板側端子によって外縁が定まる区画領域の面積は、前記コネクタ間口部において前記コネクタ側端子によって外縁が定まる区画領域の面積よりも大きく、前記複数の導電部材の基板側端子は、前記電子回路基板に設けられた複数の貫通穴のそれぞれに挿通されており、前記コネクタは、前記複数の導電部材の基板側端子を前記複数の貫通穴のそれぞれに対して位置合わせする整列部材を有し、前記整列部材の少なくとも一部は、前記電子回路基板から所定の間隔を隔てて設置され、前記複数の電子部品の少なくとも一部は、前記整列部材の下側に配置されており、前記整列部材は、前記電子回路基板から前記所定の間隔を隔てて設置された一部の下側に、前記複数の導電部材の基板側端子の少なくとも1つを挿通するボス部を有するものとする。

In order to solve the above-described problems, the present invention provides an electronic circuit board on which a plurality of electronic components are mounted, a connector connected to a single external cable, and a plurality of terminals that connect the electronic circuit board and the connector. In the electronic control device including the conductive member, the connector side terminals of the plurality of conductive members are arranged in a plurality of rows and a plurality of rows at the connector opening portion of the connector, and the board of the plurality of conductive members in the electronic circuit board. area of divided areas outer edge is determined by the side pin, the connector much larger than the area of the divided areas outer edge defined by the connector-side terminal in the frontage part, the substrate-side terminals of the plurality of conductive members, said electronic circuit board The connector is inserted through each of the plurality of through-holes, and the connector includes board-side terminals of the plurality of conductive members in the plurality of through-holes, respectively. And aligning at least a part of the alignment member with a predetermined distance from the electronic circuit board, and at least a part of the plurality of electronic components below the alignment member. The alignment member is inserted through at least one of the substrate-side terminals of the plurality of conductive members below a part of the alignment member that is disposed at a predetermined distance from the electronic circuit board. It shall have a boss .

本発明に係る電子制御装置によれば、電子回路基板の小型化及び耐ノイズ性の向上が可能となる。   According to the electronic control device of the present invention, it is possible to reduce the size of the electronic circuit board and improve the noise resistance.

本発明の第1の実施例に係る電子制御装置をコネクタの側から見た分解斜視図である。It is the disassembled perspective view which looked at the electronic control unit concerning the 1st example of the present invention from the connector side. 本発明の第1の実施例に係る電子制御装置をコネクタの反対側から見た分解斜視図である。It is the disassembled perspective view which looked at the electronic control unit concerning the 1st example of the present invention from the opposite side of a connector. 本発明の第1の実施例に係る電子制御装置の縦断面図である。It is a longitudinal cross-sectional view of the electronic control apparatus which concerns on 1st Example of this invention. 本発明の第1の実施例に係る電子制御装置の横断面図(カバー及びベースの図示は省略)である。It is a cross-sectional view (illustration of a cover and a base is abbreviate | omitted) of the electronic control apparatus which concerns on 1st Example of this invention. 本発明の第2の実施例に係る電子制御装置の縦断面図である。It is a longitudinal cross-sectional view of the electronic controller which concerns on 2nd Example of this invention. 本発明の第3の実施例に係る電子制御装置の縦断面図である。It is a longitudinal cross-sectional view of the electronic control apparatus which concerns on the 3rd Example of this invention. 本発明の第4の実施例に係る電子制御装置の縦断面図である。It is a longitudinal cross-sectional view of the electronic control apparatus which concerns on the 4th Example of this invention. 本発明の第5の実施例に係る電子制御装置の縦断面図である。It is a longitudinal cross-sectional view of the electronic control apparatus which concerns on the 5th Example of this invention. 本発明の第6の実施例に係る電子制御装置の横断面図(カバー及びベースの図示は省略)である。It is a cross-sectional view (illustration of a cover and a base is omitted) of an electronic control device according to a sixth embodiment of the present invention. 本発明の第5の実施例に係る電子制御装置の横断面図(カバー及びベースの図示は省略)である。It is a cross-sectional view (illustration of a cover and a base is abbreviate | omitted) of the electronic control apparatus which concerns on the 5th Example of this invention. 本発明の第8の実施例に係る電子制御装置の縦断面図である。It is a longitudinal cross-sectional view of the electronic controller which concerns on the 8th Example of this invention. 本発明の第9の実施例に係る電子制御装置の縦断面図である。It is a longitudinal cross-sectional view of the electronic controller which concerns on the 9th Example of this invention. 本発明の第10の実施例に係る電子制御装置の縦断面図である。It is a longitudinal cross-sectional view of the electronic control apparatus based on the 10th Example of this invention. 本発明の第11の実施例に係る電子制御装置の縦断面図である。It is a longitudinal cross-sectional view of the electronic controller which concerns on 11th Example of this invention. 本発明の第12の実施例に係る電子制御装置の縦断面図である。It is a longitudinal cross-sectional view of the electronic controller which concerns on the 12th Example of this invention.

以下、本発明の実施例を図面を用いて説明する。なお、各図中、同一の部材には同一の符号を付し、重複した説明は適宜省略する。   Embodiments of the present invention will be described below with reference to the drawings. In addition, in each figure, the same code | symbol is attached | subjected to the same member and the overlapping description is abbreviate | omitted suitably.

図1に本発明の第1の実施例に係る電子制御装置を一方の側(後述するコネクタ3の側)から見た分解斜視図を示し、図2に他方の側(コネクタ3の反対側)から見た分解斜視図を示す。また、図3に本実施例に係る電子制御装置の縦断面図を示し、図4に横断面図を示す。なお、図4では、簡略化のため、後述するカバー4及びベース5の図示を省略している。   FIG. 1 shows an exploded perspective view of the electronic control device according to the first embodiment of the present invention as viewed from one side (the connector 3 side described later), and FIG. 2 shows the other side (the opposite side of the connector 3). The exploded perspective view seen from is shown. FIG. 3 is a longitudinal sectional view of the electronic control device according to this embodiment, and FIG. 4 is a transverse sectional view. In FIG. 4, a cover 4 and a base 5 to be described later are not shown for simplification.

本実施例に係る電子制御装置1は、例えば、エンジンルームに搭載されるECU(エンジンコントロールユニット)やATCU(オートマチックトランスミッションコントロールユニット)である。   The electronic control device 1 according to the present embodiment is, for example, an ECU (engine control unit) or an ATCU (automatic transmission control unit) mounted in an engine room.

電子制御装置1は、複数の電子部品22が実装された電子回路基板2と、当該電子回路基板2の一端に取り付けられ、車両ハーネス等の外部ケーブル(図示せず)と接続されるコネクタ3と、電子回路基板2を収容するカバー4及びベース5とを備えている。   The electronic control device 1 includes an electronic circuit board 2 on which a plurality of electronic components 22 are mounted, a connector 3 attached to one end of the electronic circuit board 2 and connected to an external cable (not shown) such as a vehicle harness. A cover 4 and a base 5 for accommodating the electronic circuit board 2 are provided.

カバー4及びベース5は、PBT(ポリブチレンテレフタレート)、PPS(ポリフェニレンサルファイド)、PA(ナイロン)等の樹脂、若しくは、アルミや鉄等を主成分とした金属により成型される。カバー4及びベース5により構成される筐体の内部には、コネクタ3の一部(後述するコネクタ間口部32)が外部に露出する様に電子回路基板2が収納されている。カバー4は、ネジやカジメ等の手段を用いて、ベース5に固定される。カバー4とベース5との接合面及びカバーとコネクタ3との接合面には、それぞれシール部材6が配置されている。これにより、筐体内部への浸水を防止することができる。   The cover 4 and the base 5 are molded from a resin such as PBT (polybutylene terephthalate), PPS (polyphenylene sulfide), PA (nylon), or a metal whose main component is aluminum or iron. The electronic circuit board 2 is accommodated inside the housing constituted by the cover 4 and the base 5 so that a part of the connector 3 (a connector opening portion 32 described later) is exposed to the outside. The cover 4 is fixed to the base 5 using means such as screws and caulking. Seal members 6 are disposed on the joint surface between the cover 4 and the base 5 and the joint surface between the cover and the connector 3, respectively. Thereby, it is possible to prevent water from entering the housing.

電子回路基板2は、ガラスクロスにエポキシ樹脂を含浸させた基材を主材料とし、複数の銅による配線層を有する多層基板である。複数の電子部品22は、電子回路基板2の両面に半田付けにより実装されており、基板配線と共に電気回路を構成している。複数の電子部品22のうち発熱を伴うもの(以下「発熱性電子部品」という。)は、必要に応じて放熱部材(図示せず)を介してカバー4又はベース5と熱的に接続される。これにより、発熱性電子部品で発生した熱を外気に放熱することができる。   The electronic circuit board 2 is a multilayer board having a base material obtained by impregnating glass cloth with an epoxy resin as a main material and having a plurality of copper wiring layers. The plurality of electronic components 22 are mounted on both surfaces of the electronic circuit board 2 by soldering, and constitute an electric circuit together with the board wiring. Of the plurality of electronic components 22, those that generate heat (hereinafter referred to as “heat-generating electronic components”) are thermally connected to the cover 4 or the base 5 via a heat radiating member (not shown) as necessary. . Thereby, the heat generated in the heat-generating electronic component can be radiated to the outside air.

コネクタ3のコネクタハウジング31は、PBT(ポリブチレンテレフタレート)、PA(ポリアミド)、PPS(ポリフェニレンサルファイド)等の樹脂で成型されており、その内部に、銅を主成分とした金属からなる複数の導電部材33を備えている。これら複数の導電部材33は、電子制御装置1の内外で電圧や電流の授受を行う。   The connector housing 31 of the connector 3 is molded from a resin such as PBT (polybutylene terephthalate), PA (polyamide), PPS (polyphenylene sulfide), and the like. A member 33 is provided. The plurality of conductive members 33 exchange voltage and current inside and outside the electronic control device 1.

外部ケーブルのコネクタ(図示せず)と嵌合するコネクタ3のコネクタ間口部32には、複数の導電部材33の一方の端部(以下「コネクタ側端子」という。)34が複数段かつ複数列(例えば正方格子状)に整列されている。これにより、複数のコネクタ側端子34を単一の外部ケーブルと接続することが可能となる。なお、複数のコネクタ側端子34を複数のグループ(束)に分け、これらグループごとにコネクタ側端子34を整列させることにより、複数の外部ケーブルと接続することもできる。   A plurality of rows and rows of one end portions (hereinafter referred to as “connector side terminals”) 34 of a plurality of conductive members 33 are formed in the connector opening portion 32 of the connector 3 to be fitted with a connector (not shown) of an external cable. (For example, a square lattice pattern). Thereby, it becomes possible to connect the some connector side terminal 34 with a single external cable. The plurality of connector-side terminals 34 are divided into a plurality of groups (bundles), and the connector-side terminals 34 are aligned for each group, so that they can be connected to a plurality of external cables.

複数の導電部材33は、コネクタ間口部32から筐体内部に向かって延在しており、それぞれ所定の位置で電子回路基板2に対して垂直方向に屈曲され、電子回路基板2と接続される。電子回路基板2との接続方法としては、電子回路基板2に設けられたスルーホール21に導電部材33の他方の端部(以下「基板側端子」という。)35を挿入し、電子回路基板2の裏面からスポットフローにより半田付けする方法や、基板側端子35をスルーホール21にプレスフィットする方法等がある。このように、基板側端子35をスルーホール21に通し、半田付け又はカシメにより固定することで、表面実装により接続した場合と比べて、電子回路基板2の表面上に占める基板側端子35との接続面積を小さくすることができる。これにより、電子回路基板2の部品実装エリアの面積を大きくすることができる。   The plurality of conductive members 33 extend from the connector opening 32 toward the inside of the housing, and are bent in a direction perpendicular to the electronic circuit board 2 at predetermined positions, and connected to the electronic circuit board 2. . As a method for connecting to the electronic circuit board 2, the other end portion (hereinafter referred to as “board-side terminal”) 35 of the conductive member 33 is inserted into the through hole 21 provided in the electronic circuit board 2, and the electronic circuit board 2. There are a method of soldering from the back surface of the substrate by spot flow, a method of press-fitting the substrate side terminal 35 to the through hole 21, and the like. In this way, the board-side terminal 35 occupies the surface of the electronic circuit board 2 as compared with the case where the board-side terminal 35 is passed through the through-hole 21 and fixed by soldering or caulking, compared to the case of connection by surface mounting. The connection area can be reduced. Thereby, the area of the component mounting area of the electronic circuit board 2 can be increased.

図3において、導電部材33aは、コネクタ3の近傍で電子回路基板2に垂直な方向に屈曲され、その基板側端子35aは、電子回路基板2の部品非実装エリアに設けられたスルーホール21aに挿入され、固定されている。一方、導電部材33b,32cは、コネクタ3の遠方で電子回路基板2に垂直な方向に屈曲され、それらの基板側端子35b,35cは、電子回路基板2の部品実装エリアに設けられたスルーホール21b,21cに挿入され、固定されている。そのため、互いに隣接する基板側端子35a,35bの間隔d1は、それぞれに対応してコネクタ側端子34a,34bの間隔(ピッチ)d2よりも大きくなり、互いに隣接する基板側端子35b,35cの間隔d3は、それぞれに対応するコネクタ側端子34a,34bの間隔d4よりも大きくなる。すなわち、コネクタ3の最も近傍に配置された基板側端子35aと最も遠方に配置された基板側端子35cとの間隔D1は、コネクタ間口部32の最下段に配置されたコネクタ側端子34aと最上段に配置されたコネクタ側端子34cとの間隔D2よりも大きくなる。その結果、電子回路基板2において複数の基板側端子35によって外縁が定められる区画領域351(図1及び図4に示す)の面積は、コネクタ間口部32において複数のコネクタ側端子34によって外縁が定められる区画領域341(図1に示す)の面積よりも大きくなる。   In FIG. 3, the conductive member 33 a is bent in the direction perpendicular to the electronic circuit board 2 in the vicinity of the connector 3, and the board-side terminal 35 a is inserted into the through hole 21 a provided in the component non-mounting area of the electronic circuit board 2. Inserted and fixed. On the other hand, the conductive members 33 b and 32 c are bent in the direction perpendicular to the electronic circuit board 2 at a position far from the connector 3, and the board-side terminals 35 b and 35 c are through holes provided in the component mounting area of the electronic circuit board 2. It is inserted and fixed to 21b and 21c. Therefore, the distance d1 between the board-side terminals 35a and 35b adjacent to each other is larger than the distance (pitch) d2 between the connector-side terminals 34a and 34b correspondingly, and the distance d3 between the board-side terminals 35b and 35c adjacent to each other. Is larger than the distance d4 between the corresponding connector side terminals 34a and 34b. That is, the distance D1 between the board-side terminal 35a arranged closest to the connector 3 and the board-side terminal 35c arranged farthest from the connector-side terminal 34a arranged at the lowermost stage of the connector opening 32 and the uppermost stage. It becomes larger than the space | interval D2 with the connector side terminal 34c arrange | positioned in this. As a result, the area of the partition area 351 (shown in FIGS. 1 and 4) in which the outer edge is defined by the plurality of board-side terminals 35 in the electronic circuit board 2 is defined by the plurality of connector-side terminals 34 in the connector opening portion 32. It becomes larger than the area of the partition region 341 (shown in FIG. 1).

また、コネクタ間口部32の上段に配置されたコネクタ側端子34cを有する導電部材33cのリード長は、中段に配置されたコネクタ側端子34bを有する導電部材33bのリード長よりも大きく、中段に配置されたコネクタ側端子34bを有する導電部材33bのリード長は、下段に配置されたコネクタ側端子34aを有する導電部材33aのリード長よりも大きい。このように、リード長の大きな導電部材33のコネクタ側端子を、それより小さなリード長の導電部材33のコネクタ側端子より上段に配置することにより、導電部材33の形状を簡素なL字形状に保ちつつ、導電部材33同士の干渉を防ぐことが可能となる。   In addition, the lead length of the conductive member 33c having the connector side terminal 34c arranged at the upper stage of the connector opening 32 is larger than the lead length of the conductive member 33b having the connector side terminal 34b arranged at the middle stage, and is arranged in the middle stage. The lead length of the conductive member 33b having the connector-side terminal 34b thus formed is larger than the lead length of the conductive member 33a having the connector-side terminal 34a arranged at the lower stage. Thus, by arranging the connector-side terminal of the conductive member 33 with a large lead length above the connector-side terminal of the conductive member 33 with a smaller lead length, the shape of the conductive member 33 is made a simple L-shape. It is possible to prevent interference between the conductive members 33 while maintaining.

図4において、コネクタ3の遠方まで延びた導電部材33c1,33c2,33c3等の基板側端子35b1,35b2,35b3,35c1,35c2,35c3は、それぞれ電気的に接続される電子部品22a,22b,22c,22d,22e,22fの近傍領域221a,221b,221c,221d,221e,221fに配置されている。ここでいう近傍領域とは、電子部品22の外縁から所定の距離以内の領域であり、当該所定の距離は、例えば互いに隣接する電子部品22同士の間隔に基づいて設定される。これにより、コネクタ側端子34と電子部品22とを接続する基板配線の長さを上記所定の距離以下に抑えることができる。なお、電気的に接続される電子部品22が複数ある場合には、コネクタ3の最も近くに実装された電子部品22の近傍領域221に基板側端子35を配置することにより、導電部材33のリード長を抑えることが可能となる。   In FIG. 4, board-side terminals 35b1, 35b2, 35b3, 35c1, 35c2, and 35c3 such as conductive members 33c1, 33c2, and 33c3 extending far from the connector 3 are electrically connected to electronic components 22a, 22b, and 22c, respectively. , 22d, 22e, and 22f are arranged in the adjacent regions 221a, 221b, 221c, 221d, 221e, and 221f. The near region here is a region within a predetermined distance from the outer edge of the electronic component 22, and the predetermined distance is set based on, for example, the interval between the electronic components 22 adjacent to each other. Thereby, the length of the board | substrate wiring which connects the connector side terminal 34 and the electronic component 22 can be restrained below the said predetermined distance. If there are a plurality of electronic components 22 to be electrically connected, the lead of the conductive member 33 can be obtained by arranging the board-side terminal 35 in the vicinity region 221 of the electronic component 22 mounted closest to the connector 3. The length can be suppressed.

ここで、導電部材33のリード長を大きくすることにより、スルーホール21に対する基板側端子35の位置ずれが大きくなり、コネクタ3を電子回路基板2に取り付ける際、基板側端子35のスルーホール21への挿入性が低下するおそれがある。そこで、本実施例では、基板側端子35のアライメント(位置合わせ)を行うための整列部材36をコネクタ3に設けている。整列部材36には、電子回路基板2の各スルーホール21の位置に対応して複数の貫通穴361が設けられており、これら貫通穴361に基板側端子35がそれぞれ挿通される。これにより、基板側端子35のスルーホール21へのアライメントを確保することができる。   Here, by increasing the lead length of the conductive member 33, the positional deviation of the board side terminal 35 with respect to the through hole 21 increases, and when the connector 3 is attached to the electronic circuit board 2, the board side terminal 35 is moved to the through hole 21. There is a risk that the insertability of the will deteriorate. Therefore, in this embodiment, the connector 3 is provided with an alignment member 36 for performing alignment (positioning) of the board-side terminals 35. The alignment member 36 is provided with a plurality of through holes 361 corresponding to the positions of the respective through holes 21 of the electronic circuit board 2, and the board side terminals 35 are respectively inserted into the through holes 361. Thereby, the alignment to the through hole 21 of the board | substrate side terminal 35 is securable.

図3において、整列部材36は、PBT(ポリブチレンテレフタレート)、PA(ポリアミド)、PPS(ポリフェニレンサルファイド)等の樹脂で成型された折り曲げ形状を有する。整列部材36のコネクタ側端部は、電子回路基板2の部品非実装エリアに密着して設置され、その他の部分は、電子回路基板2の部品実装エリアから所定の間隔を隔てて設置されている。ここでいう所定の高さは、電子回路基板2の上面に実装される電子部品22の高さに基づいて設定される。これにより、整列部材36の下側にも電子部品22を配置することが可能となる。   In FIG. 3, the alignment member 36 has a bent shape molded from a resin such as PBT (polybutylene terephthalate), PA (polyamide), or PPS (polyphenylene sulfide). The connector-side end of the alignment member 36 is installed in close contact with the component non-mounting area of the electronic circuit board 2, and the other portions are installed at a predetermined interval from the component mounting area of the electronic circuit board 2. . The predetermined height here is set based on the height of the electronic component 22 mounted on the upper surface of the electronic circuit board 2. As a result, the electronic component 22 can be arranged below the alignment member 36.

本実施例に係る電子制御装置1によれば、複数の導電部材33の一部を電子回路基板2の部品実装エリアまで延在させ、電気的に接続される電子部品22の近傍領域221に基板側端子35を配置することにより、コネクタ側端子34と当該電子部品22とを接続する基板配線を短くすることができる。これにより、電子回路基板2の配線エリアを縮小することができるため、電子回路基板2の小型化が可能となる。更に、電子回路基板2を小型化することにより、ベース5及びカバー4の小型化及び低コスト化が可能となる。   According to the electronic control apparatus 1 according to the present embodiment, a part of the plurality of conductive members 33 is extended to the component mounting area of the electronic circuit board 2, and the board is disposed in the vicinity region 221 of the electronic component 22 to be electrically connected. By arranging the side terminal 35, the board wiring for connecting the connector side terminal 34 and the electronic component 22 can be shortened. Thereby, since the wiring area of the electronic circuit board 2 can be reduced, the electronic circuit board 2 can be miniaturized. Further, by reducing the size of the electronic circuit board 2, the base 5 and the cover 4 can be reduced in size and cost.

また、コネクタ側端子34と当該電子部品22とを接続する基板配線を短くすることにより、電子回路基板2の耐ノイズ性を向上させることが可能となる。   In addition, the noise resistance of the electronic circuit board 2 can be improved by shortening the board wiring connecting the connector-side terminal 34 and the electronic component 22.

本発明の第2の実施例に係る電子制御装置について、第1の実施例(図3に示す)との相違点を中心に説明する。   An electronic control apparatus according to a second embodiment of the present invention will be described focusing on differences from the first embodiment (shown in FIG. 3).

図5に本実施例に係る電子制御装置の縦断面図を示す。   FIG. 5 shows a longitudinal sectional view of the electronic control device according to this embodiment.

図5において、電子制御装置1は、片面実装の電子回路基板2を備えており、電子部品22が実装されていない電子回路基板2の上面には、平板形状の整列部材36が密着して設置されている。   In FIG. 5, the electronic control device 1 includes a single-side mounted electronic circuit board 2, and a flat plate-shaped alignment member 36 is installed in close contact with the upper surface of the electronic circuit board 2 on which the electronic component 22 is not mounted. Has been.

本実施例に係る電子制御装置1によれば、第1の実施例と同様の効果に加えて、以下の効果が得られる。   According to the electronic control apparatus 1 according to the present embodiment, in addition to the same effects as those of the first embodiment, the following effects can be obtained.

片面実装の電子回路基板2を備えた電子制御装置1において、整列部材36を簡素な平板形状とすることができるため、整列部材36の製造コストを抑えることが可能となる。   In the electronic control device 1 including the electronic circuit board 2 mounted on one side, the alignment member 36 can be formed in a simple flat plate shape, and thus the manufacturing cost of the alignment member 36 can be suppressed.

また、電子回路基板2の上面と密着して設置される整列部材36によって、コネクタ3の遠方(電子回路基板2の部品実装エリア)に配置された基板側端子35b,35cの先端付近を把持することができるため、これら基板側端子35b,35cのスルーホール21b、21cに対するアライメントを向上させることが可能となる。   In addition, the alignment member 36 installed in close contact with the upper surface of the electronic circuit board 2 grips the vicinity of the tips of the board-side terminals 35b and 35c arranged far from the connector 3 (component mounting area of the electronic circuit board 2). Therefore, the alignment of the board side terminals 35b and 35c with respect to the through holes 21b and 21c can be improved.

本発明の第3の実施例に係る電子制御装置について、第1の実施例(図3に示す)との相違点を中心に説明する。   An electronic control apparatus according to a third embodiment of the present invention will be described focusing on differences from the first embodiment (shown in FIG. 3).

図6に本実施例に係る電子制御装置の縦断面図を示す。   FIG. 6 is a longitudinal sectional view of the electronic control device according to this embodiment.

図6において、整列部材36は、電子回路基板2から所定の間隔を隔てて配置される部分(電子回路基板2の部品実装エリアの上方に位置する部分)と電子回路基板2との間に、コネクタ3の遠方に配置された基板側端子35b,35cをそれぞれ挿通する複数のボス部362を一体に備えている。   In FIG. 6, the alignment member 36 is between the electronic circuit board 2 and a part (a part located above the component mounting area of the electronic circuit board 2) arranged at a predetermined interval from the electronic circuit board 2. A plurality of boss portions 362 are integrally provided through the board-side terminals 35b and 35c disposed far from the connector 3, respectively.

本実施例に係る電子制御装置1によれば、第1の実施例と同様の効果に加えて、以下の効果が得られる。   According to the electronic control apparatus 1 according to the present embodiment, in addition to the same effects as those of the first embodiment, the following effects can be obtained.

両面実装の電子回路基板2を備えた電子制御装置1において、コネクタ3の遠方(電子回路基板2の部品実装エリア)に配置された基板側端子35b,35cの先端付近をボス部362で把持することができるため、これら基板側端子35b,35cのスルーホール21b、21cに対するアライメントを向上させることが可能となる。   In the electronic control device 1 including the electronic circuit board 2 mounted on both sides, the boss portion 362 holds the vicinity of the tips of the board-side terminals 35b and 35c arranged far from the connector 3 (component mounting area of the electronic circuit board 2). Therefore, the alignment of the board side terminals 35b and 35c with respect to the through holes 21b and 21c can be improved.

本発明の第4の実施例に係る電子制御装置について、第3の実施例(図6に示す)との相違点を中心に説明する。   An electronic control apparatus according to a fourth embodiment of the present invention will be described focusing on differences from the third embodiment (shown in FIG. 6).

図7に本実施例に係る電子制御装置の縦断面図を示す。   FIG. 7 is a longitudinal sectional view of the electronic control device according to this embodiment.

図7において、大電流伝送用の(径が大きい)導電部材33cを電子回路基板2の部品実装エリアの上方まで延在させる一方、その他の(径の小さい)導電部材33a,33bは延在させていない。そのため、本実施例では、互いに隣接する基板側端子35a,35bの間隔d1は、それぞれに対応するコネクタ側端子34a,34bの間隔d2よりも小さくなり、互いに隣接する基板側端子35b,35cの間隔d3がその分拡大している。すなわち、本実施例においても、上述の実施例と同様に、コネクタ3の最も近傍に配置された基板側端子35aと最も遠方に配置された基板側端子35cとの間隔D1は、コネクタ間口部32の最下段に配置されたコネクタ側端子34aと最上段に配置されたコネクタ側端子34cとの間隔D2よりも大きくなる。   In FIG. 7, the conductive member 33c (large diameter) for large current transmission is extended to above the component mounting area of the electronic circuit board 2, while the other conductive members 33a and 33b (small diameter) are extended. Not. Therefore, in this embodiment, the distance d1 between the board-side terminals 35a and 35b adjacent to each other is smaller than the distance d2 between the corresponding connector-side terminals 34a and 34b, and the distance between the board-side terminals 35b and 35c adjacent to each other. d3 is enlarged accordingly. That is, also in the present embodiment, as in the above-described embodiment, the distance D1 between the board-side terminal 35a arranged closest to the connector 3 and the board-side terminal 35c arranged farthest is the connector opening 32. The distance D2 is greater than the distance D2 between the connector side terminal 34a arranged at the lowermost stage and the connector side terminal 34c arranged at the uppermost stage.

本実施例に係る電子制御装置1によれば、第1の実施例と同様の効果に加えて、以下の効果が得られる。   According to the electronic control apparatus 1 according to the present embodiment, in addition to the same effects as those of the first embodiment, the following effects can be obtained.

大電流伝送用の導電部材33cのみを部品実装エリアまで延在させ、大きな幅を要する配線パターンを優先的に短縮することにより、効率良く配線エリアを削減することができる。   By extending only the conductive member 33c for large current transmission to the component mounting area and preferentially shortening the wiring pattern requiring a large width, the wiring area can be efficiently reduced.

また、部品実装エリアまで延在させる導電部材33の数が抑えられるため、コネクタ3の製造コストを抑えることが可能となる。   In addition, since the number of conductive members 33 extending to the component mounting area can be reduced, the manufacturing cost of the connector 3 can be reduced.

本発明の第5の実施例に係る電子制御装置について、第4の実施例(図7に示す)との相違点を中心に説明する。   An electronic control apparatus according to a fifth embodiment of the present invention will be described focusing on differences from the fourth embodiment (shown in FIG. 7).

図8に本実施例に係る電子制御装置の縦断面図を示す。   FIG. 8 is a longitudinal sectional view of the electronic control device according to this embodiment.

図8において、コネクタ3の近傍(電子回路基板2の非部品実装エリア)に配置された基板側端子35a,35bは、整列部材36を介してスルーホール21a,21bにそれぞれ挿入され、コネクタ3の遠方(電子回路基板2の部品実装エリア)に配置された基板側端子35cは整列部材36を介さずにスルーホール21cに挿入されている。コネクタ3の遠方に配置された基板側端子35cを有する導電部材33cは、その他の導電部材33a,33bと比べて径が大きく変形が小さいため、整列部材36を介さずともスルーホール21cに対するアライメントを確保することができる。   In FIG. 8, board-side terminals 35 a and 35 b arranged in the vicinity of the connector 3 (non-component mounting area of the electronic circuit board 2) are inserted into the through holes 21 a and 21 b through the alignment member 36, respectively. The board-side terminal 35c disposed far away (the component mounting area of the electronic circuit board 2) is inserted into the through hole 21c without the alignment member 36 interposed therebetween. The conductive member 33c having the board-side terminal 35c disposed far from the connector 3 is larger in diameter and smaller in deformation than the other conductive members 33a and 33b. Therefore, the alignment with respect to the through hole 21c can be performed without using the alignment member 36. Can be secured.

本実施例に係る電子制御装置1によれば、第1の実施例と同様の効果に加えて、以下の効果が得られる。   According to the electronic control apparatus 1 according to the present embodiment, in addition to the same effects as those of the first embodiment, the following effects can be obtained.

整列部材36をコネクタ3の近傍のみに設置する構成としたことにより、整列部材36を小型でかつ簡素な板形状とすることができるため、整列部材36の製造コストを抑えることが可能となる。   By arranging the alignment member 36 only in the vicinity of the connector 3, the alignment member 36 can be formed in a small and simple plate shape, so that the manufacturing cost of the alignment member 36 can be suppressed.

本発明の第6の実施例に係る電子制御装置について、第1の実施例(図4に示す)との相違点を中心に説明する。   An electronic control apparatus according to a sixth embodiment of the present invention will be described focusing on differences from the first embodiment (shown in FIG. 4).

図9に本実施例に係る電子制御装置1の横断面図(カバー4及びベース5の図示は省略)を示す。   FIG. 9 shows a cross-sectional view of the electronic control device 1 according to this embodiment (the illustration of the cover 4 and the base 5 is omitted).

図9において、導電部材33c1,33c2,33c3は、電子回路基板2に対して垂直方向に屈曲する前に、電子回路基板2に平行でかつコネクタ側端子34c1,34c2,34c3と直交する方向に屈曲しており、導電部材33c1の基板側端子35c1は、電気的に接続される電子部品22gの近傍領域221gに配置され、導電部材33c2,33c5の基板側端子35c2,35c3は、電気的に接続される電子部品22hの近傍領域221hに配置されている。   In FIG. 9, the conductive members 33c1, 33c2, and 33c3 are bent in a direction parallel to the electronic circuit board 2 and perpendicular to the connector side terminals 34c1, 34c2, and 34c3 before being bent in a direction perpendicular to the electronic circuit board 2. The board side terminal 35c1 of the conductive member 33c1 is disposed in the vicinity region 221g of the electronic component 22g to be electrically connected, and the board side terminals 35c2 and 35c3 of the conductive member 33c2 and 33c5 are electrically connected. The electronic component 22h is disposed in the vicinity region 221h.

本実施例に係る電子制御装置1によれば、第1の実施例と同様の効果に加えて、以下の効果が得られる。   According to the electronic control apparatus 1 according to the present embodiment, in addition to the same effects as those of the first embodiment, the following effects can be obtained.

導電部材33を電子回路基板2に垂直な方向に屈曲させる前に、コネクタ側端子34と電子回路基板2の垂直方向とで定義される平面と交差する方向に屈曲させることにより、コネクタ側端子34の延長上の近傍にない電子部品22の近傍領域221に基板側端子35を配置することができる。これにより、任意の位置に配置された電子部品22の近傍領域221に基板側端子35を配置することが可能となり、電子部品22のレイアウトの自由度を向上させることが可能となる。   Before the conductive member 33 is bent in the direction perpendicular to the electronic circuit board 2, the connector side terminal 34 is bent by bending in a direction intersecting with a plane defined by the connector side terminal 34 and the vertical direction of the electronic circuit board 2. The board-side terminal 35 can be disposed in the vicinity region 221 of the electronic component 22 that is not in the vicinity of the extension of the board. As a result, the board-side terminals 35 can be arranged in the vicinity region 221 of the electronic component 22 arranged at an arbitrary position, and the degree of freedom in layout of the electronic component 22 can be improved.

本発明の第7の実施例に係る電子制御装置について、第6の実施例(図9に示す)との相違点を中心に説明する。   An electronic control apparatus according to a seventh embodiment of the present invention will be described focusing on differences from the sixth embodiment (shown in FIG. 9).

図10に本実施例に係る電子制御装置1の横断面図(カバー4及びベース5の図示は省略)を示す。   FIG. 10 is a cross-sectional view of the electronic control device 1 according to this embodiment (the illustration of the cover 4 and the base 5 is omitted).

図10において、発熱性電子部品23aの近傍領域231aに、導電部材33b2の基板側端子35b2、導電部材33b1の基板側端子35b1及び導電部材33c1の基板側端子35c1が配置され、発熱性電子部品23bの近傍領域231bには、導電部材33c2の基板側端子35c2、導電部材33b3の基板側端子35b3及び導電部材33c3の基板側端子35c3が配置されている。なお、基板側端子35b2,35b1,35c1は、必ずしも発熱性電子部品23aと電気的に接続されるものでなくて良く、基板側端子35c2,35b3,35c3は、必ずしも発熱性電子部品23bと電気的に接続されるものでなくて良い。   In FIG. 10, the board-side terminal 35b2 of the conductive member 33b2, the board-side terminal 35b1 of the conductive member 33b1, and the board-side terminal 35c1 of the conductive member 33c1 are arranged in the vicinity region 231a of the heat-generating electronic component 23a. The board-side terminal 35c2 of the conductive member 33c2, the board-side terminal 35b3 of the conductive member 33b3, and the board-side terminal 35c3 of the conductive member 33c3 are disposed in the vicinity region 231b. The board-side terminals 35b2, 35b1, and 35c1 do not necessarily need to be electrically connected to the heat-generating electronic component 23a, and the board-side terminals 35c2, 35b3, and 35c3 are not necessarily electrically connected to the heat-generating electronic component 23b. It does not have to be connected to.

本実施例に係る電子制御装置1によれば、第1の実施例と同様の効果に加えて、以下の効果が得られる。   According to the electronic control apparatus 1 according to the present embodiment, in addition to the same effects as those of the first embodiment, the following effects can be obtained.

発熱性電子部品23の近傍領域231に複数の基板側端子35を配置することにより、発熱性電子部品23で発生した熱を複数の導電部材33を介して放熱することができるため、電子回路基板2の放熱性を向上させることが可能となる。   By arranging the plurality of board-side terminals 35 in the vicinity region 231 of the heat-generating electronic component 23, the heat generated in the heat-generating electronic component 23 can be radiated through the plurality of conductive members 33. The heat dissipation of 2 can be improved.

本発明の第8の実施例に係る電子制御装置について、第5の実施例(図8に示す)との相違点を中心に説明する。   An electronic control apparatus according to an eighth embodiment of the present invention will be described focusing on differences from the fifth embodiment (shown in FIG. 8).

図11に本実施例に係る電子制御装置の縦断面図を示す。   FIG. 11 is a longitudinal sectional view of the electronic control device according to this embodiment.

図11において、発熱性電子部品23の近傍領域231に、径の大きな基板側端子35cが配置されている。なお、基板側端子35cは、必ずしも発熱性電子部品23と電気的に接続されるものでなくて良い。   In FIG. 11, a board-side terminal 35 c having a large diameter is arranged in a region 231 near the heat-generating electronic component 23. The board-side terminal 35c does not necessarily have to be electrically connected to the heat-generating electronic component 23.

本実施例に係る電子制御装置1によれば、第1の実施例と同様の効果に加えて、以下の効果が得られる。   According to the electronic control apparatus 1 according to the present embodiment, in addition to the same effects as those of the first embodiment, the following effects can be obtained.

発熱性電子部品23の近傍領域231に、基板側端子35cを配置することにより、発熱性電子部品23で発生した熱を表面積の大きな導電部材33cを介して放熱することができるため、電子回路基板2の放熱性を向上させることが可能となる。   By arranging the board-side terminal 35c in the vicinity region 231 of the heat-generating electronic component 23, the heat generated in the heat-generating electronic component 23 can be radiated through the conductive member 33c having a large surface area. The heat dissipation of 2 can be improved.

本発明の第9の実施例に係る電子制御装置について、第8の実施例(図11に示す)との相違点を中心に説明する。   An electronic control apparatus according to a ninth embodiment of the present invention will be described focusing on differences from the eighth embodiment (shown in FIG. 11).

図12に本実施例に係る電子制御装置の縦断面図を示す。   FIG. 12 is a longitudinal sectional view of the electronic control device according to this embodiment.

図12において、発熱性電子部品23の近傍領域231には、小電流用の径の小さい導電部材33cの基板側端子35cが配置されている。導電部材33cの一部には、放熱フィン331が設けられている。なお、放熱フィン331は、発熱性電子部品23からの伝熱距離が小さくなるように、電子回路基板2に近傍に配置することが望ましい。   In FIG. 12, in the vicinity region 231 of the heat-generating electronic component 23, the board-side terminal 35c of the conductive member 33c having a small diameter for small current is arranged. A heat radiating fin 331 is provided in a part of the conductive member 33c. Note that it is desirable to dispose the heat dissipating fins 331 in the vicinity of the electronic circuit board 2 so that the heat transfer distance from the heat-generating electronic component 23 is reduced.

本実施例に係る電子制御装置1によれば、第8の実施例と同様の効果に加えて、以下の効果が得られる。   According to the electronic control apparatus 1 according to the present embodiment, in addition to the same effects as in the eighth embodiment, the following effects can be obtained.

発熱性電子部品23の近傍領域231に配置された基板側端子35cを有する導電部材33cに放熱フィン331を設けたことにより、径の小さい導電部材33の基板側端子35を発熱性電子部品23の近傍領域231に配置した場合であっても、発熱性電子部品23で発生した熱を効率的に放熱することが可能となる。   By providing the heat radiating fins 331 to the conductive member 33c having the board-side terminal 35c disposed in the vicinity region 231 of the heat-generating electronic component 23, the board-side terminal 35 of the conductive member 33 having a small diameter is connected to the heat-generating electronic component 23. Even when it is disposed in the vicinity region 231, the heat generated in the heat-generating electronic component 23 can be efficiently radiated.

本発明の第10の実施例に係る電子制御装置について、第9の実施例(図12に示す)との相違点を中心に説明する。   An electronic control apparatus according to a tenth embodiment of the present invention will be described focusing on differences from the ninth embodiment (shown in FIG. 12).

図13に本実施例に係る電子制御装置の縦断面図を示す。   FIG. 13 is a longitudinal sectional view of the electronic control device according to this embodiment.

図13において、発熱性電子部品23の近傍領域231に複数のスルーホール21cが設けられており、これら複数のスルーホール21cには、放熱フィン331から分岐して伸びる複数の基板側端子35cがそれぞれ挿入されている。   In FIG. 13, a plurality of through holes 21 c are provided in the vicinity region 231 of the heat-generating electronic component 23, and a plurality of board-side terminals 35 c extending from the heat radiation fins 331 are extended to the plurality of through holes 21 c, respectively. Has been inserted.

本実施例に係る電子制御装置1によれば、第9の実施例と同様の効果に加えて、以下の効果が得られる。   According to the electronic control apparatus 1 according to the present embodiment, in addition to the same effects as those of the ninth embodiment, the following effects can be obtained.

発熱性電子部品23の近傍領域231に配置された複数の基板側端子35cを放熱フィン331に接続することにより、発熱性電子部品23から放熱フィン331への伝熱効率を向上させることが可能となる。   By connecting the plurality of board-side terminals 35c arranged in the vicinity region 231 of the heat generating electronic component 23 to the heat radiating fins 331, the heat transfer efficiency from the heat generating electronic component 23 to the heat radiating fins 331 can be improved. .

本発明の第11の実施例に係る電子制御装置について、第1の実施例(図3に示す)との相違点を中心に説明する。   An electronic control apparatus according to an eleventh embodiment of the present invention will be described focusing on differences from the first embodiment (shown in FIG. 3).

図14に本実施例に係る電子制御装置の縦断面図を示す。   FIG. 14 is a longitudinal sectional view of the electronic control device according to this embodiment.

図14において、電子回路基板2の全体及び導電部材33a,33b,33c(コネクタ間口部32から露出しているコネクタ側端子34a,34b,34cの一部を除く)は、封止樹脂7によって封止されている。封止樹脂7の材料としては、例えば、エポキシ系、ウレタン系、シリコーン系、ポリエステル系などが挙げられる。封止樹脂7の下側には、電子回路基板2と平行に放熱板8が取り付けられている。   In FIG. 14, the entire electronic circuit board 2 and the conductive members 33 a, 33 b, 33 c (excluding a part of the connector side terminals 34 a, 34 b, 34 c exposed from the connector opening 32) are sealed with the sealing resin 7. It has been stopped. Examples of the material of the sealing resin 7 include an epoxy system, a urethane system, a silicone system, and a polyester system. A heat sink 8 is attached below the sealing resin 7 in parallel with the electronic circuit board 2.

本実施例に係る電子制御装置1によれば、第1の実施例と同様の効果に加えて、以下の効果が得られる。   According to the electronic control apparatus 1 according to the present embodiment, in addition to the same effects as those of the first embodiment, the following effects can be obtained.

電子回路基板2の全体及び導電部材33a,33b,33cを封止樹脂7で固定することにより、導電部材33a,33b,33cの振れが抑制され、電子制御装置1の耐震性を向上させることが可能となる。   By fixing the entire electronic circuit board 2 and the conductive members 33a, 33b, and 33c with the sealing resin 7, the vibration of the conductive members 33a, 33b, and 33c is suppressed, and the vibration resistance of the electronic control device 1 can be improved. It becomes possible.

また、電子部品22及び導電部材33a,33b,33cが封止樹脂7に接触しているため、これら電子部品22及び導電部材33a,33b,33cで発生した熱を、電子回路基板2及びコネクタハウジング31を介して外気に放熱するだけでなく、封止樹脂7及び放熱板8を介しても外気に放熱することができる。これにより、電子回路基板2の放熱性を向上させることが可能となる。   Further, since the electronic component 22 and the conductive members 33a, 33b, and 33c are in contact with the sealing resin 7, the heat generated in the electronic component 22 and the conductive members 33a, 33b, and 33c is transferred to the electronic circuit board 2 and the connector housing. In addition to radiating heat to the outside air via 31, heat can also be radiated to the outside air via the sealing resin 7 and the heat sink 8. Thereby, the heat dissipation of the electronic circuit board 2 can be improved.

また、電子回路基板2の全体を封止樹脂7で封止することにより、ベース5及びカバー4(図3に示す)が不要となるため、電子制御装置1の更なる小型化が可能となる。   Further, by sealing the entire electronic circuit board 2 with the sealing resin 7, the base 5 and the cover 4 (shown in FIG. 3) are not required, so that the electronic control device 1 can be further reduced in size. .

本発明の第12の実施例に係る電子制御装置について、第11の実施例(図14に示す)との相違点を中心に説明する。   An electronic control apparatus according to a twelfth embodiment of the present invention will be described focusing on differences from the eleventh embodiment (shown in FIG. 14).

図15に本実施例に係る電子制御装置の縦断面図を示す。   FIG. 15 is a longitudinal sectional view of the electronic control device according to this embodiment.

図15において、コネクタ3には整列部材36(図14に示す)が設けられていない。コネクタ3の近傍(電子回路基板2の非部品実装エリア)に配置された基板側端子35a,35bを有する導電部材33a,33bは、リード長が小さく変形が小さいため、基板側端子35a,35bのスルーホール21a,21bに対する位置ずれを抑制することができる。一方、コネクタ3の遠方(電子回路基板2の部品実装エリア)に配置された基板側端子35cを有する導電部材33cは、断面積が大きく変形が小さいため、基板側端子35cのスルーホール21cに対する位置ずれを抑制することができる。そのため、コネクタ3に整列部材36(図14に示す)を設けなくても、全ての基板側端子35,35b,35cのアライメントを確保することができる。   In FIG. 15, the connector 3 is not provided with the alignment member 36 (shown in FIG. 14). Since the conductive members 33a and 33b having the board side terminals 35a and 35b arranged in the vicinity of the connector 3 (non-component mounting area of the electronic circuit board 2) have a small lead length and small deformation, the board members 35a and 35b A positional shift with respect to the through holes 21a and 21b can be suppressed. On the other hand, the conductive member 33c having the board-side terminal 35c disposed far from the connector 3 (the component mounting area of the electronic circuit board 2) has a large cross-sectional area and small deformation, and therefore the position of the board-side terminal 35c relative to the through hole 21c. Deviation can be suppressed. Therefore, even if the connector 3 is not provided with the alignment member 36 (shown in FIG. 14), the alignment of all the board-side terminals 35, 35b, and 35c can be ensured.

本実施例に係る電子制御装置1によれば、第11の実施例と同様の効果に加えて、以下の効果が得られる。   According to the electronic control apparatus 1 according to the present embodiment, in addition to the same effects as those of the eleventh embodiment, the following effects can be obtained.

整列部材36(図4に示す)が不要となるため、電子制御装置1の製造コストを抑えることが可能となる。   Since the alignment member 36 (shown in FIG. 4) is not required, the manufacturing cost of the electronic control device 1 can be reduced.

以上、本発明の実施例について詳述したが、本発明は、上記した実施例に限定されるものではなく、様々な変形例が含まれる。例えば、上記した実施例は、本発明を分かり易く説明するために詳細に説明したものであり、必ずしも説明した全ての構成を備えるものに限定されるものではない。また、ある実施例の構成に他の実施例の構成の一部を加えることも可能であり、ある実施例の構成の一部を削除し、あるいは、他の実施例の一部と置き換えることも可能である。   As mentioned above, although the Example of this invention was explained in full detail, this invention is not limited to an above-described Example, Various modifications are included. For example, the above-described embodiments have been described in detail for easy understanding of the present invention, and are not necessarily limited to those having all the configurations described. It is also possible to add a part of the configuration of another embodiment to the configuration of a certain embodiment, and delete a part of the configuration of a certain embodiment or replace it with a part of another embodiment. Is possible.

1…電子制御装置、2…電子回路基板、21,21a,21b,21c…スルーホール、22,22a,22b,22c,22d,22e,22f,22g,22h…電子部品、221,221a,221b,221c,221d,221e,221f,221g,221h…近傍領域、23,23a,23b…発熱性電子部品、231,231a,231b…近傍領域、3…コネクタ、31…コネクタハウジング、32…コネクタ間口部、33,33a,33b,33b1,33b2,33b3,33c,33c1,33c2,33c3…導電部材、331…放熱フィン、34,34a,34b,34c,34c1,34c2,34c3…コネクタ側端子、341…区画領域、35,35a,35b,35c,35b1,35b2,35b3,35c1,35c2,35c3…基板側端子、351…区画領域、36…整列部材、361…貫通穴、362…ボス部、4…カバー、5…ベース、6…シール部材、7…封止樹脂、8…放熱板。   DESCRIPTION OF SYMBOLS 1 ... Electronic control apparatus, 2 ... Electronic circuit board, 21, 21a, 21b, 21c ... Through hole, 22, 22a, 22b, 22c, 22d, 22e, 22f, 22g, 22h ... Electronic component, 221, 221a, 221b, 221c, 221d, 221e, 221f, 221g, 221h ... vicinity region, 23, 23a, 23b ... exothermic electronic components, 231, 231a, 231b ... vicinity region, 3 ... connector, 31 ... connector housing, 32 ... connector opening, 33,33a, 33b, 33b1,33b2,33b3,33c, 33c1,33c2,33c3 ... conductive member, 331 ... radiating fin, 34,34a, 34b, 34c, 34c1,34c2,34c3 ... connector side terminal, 341 ... partition area , 35, 35a, 35b, 35c, 35b1, 35b2, 35b , 35 c 1, 35 c 2, 35 c 3... Substrate side terminal, 351... Partitioned area, 36... Alignment member, 361. 8 ... Radiator.

Claims (11)

複数の電子部品が実装された電子回路基板と、
単一の外部ケーブルと接続されるコネクタと、
前記電子回路基板と前記コネクタとを接続する複数の導電部材とを備えた電子制御装置において、
前記複数の導電部材のコネクタ側端子は、前記コネクタのコネクタ間口部に複数段かつ複数列に配置され、
前記電子回路基板において前記複数の導電部材の基板側端子によって外縁が定まる区画領域の面積は、前記コネクタ間口部において前記コネクタ側端子によって外縁が定まる区画領域の面積よりも大きく、
前記複数の導電部材の基板側端子は、前記電子回路基板に設けられた複数の貫通穴のそれぞれに挿通されており、
前記コネクタは、前記複数の導電部材の基板側端子を前記複数の貫通穴のそれぞれに対して位置合わせする整列部材を有し、
前記整列部材の少なくとも一部は、前記電子回路基板から所定の間隔を隔てて設置され、
前記複数の電子部品の少なくとも一部は、前記整列部材の下側に配置されており、
前記整列部材は、前記電子回路基板から前記所定の間隔を隔てて設置された一部の下側に、前記複数の導電部材の基板側端子の少なくとも1つを挿通するボス部を有することを特徴とする電子制御装置。
An electronic circuit board on which a plurality of electronic components are mounted;
A connector connected to a single external cable;
In an electronic control device comprising a plurality of conductive members for connecting the electronic circuit board and the connector,
The connector-side terminals of the plurality of conductive members are arranged in a plurality of stages and a plurality of rows in the connector opening portion of the connector,
The area of the divided areas the outer edge is determined by the substrate-side terminals of the plurality of conductive members in the electronic circuit board is much larger than the area of the divided areas outer edge by the connector-side terminal in the connector frontage part is determined,
The board-side terminals of the plurality of conductive members are respectively inserted into a plurality of through holes provided in the electronic circuit board,
The connector has an alignment member that aligns the board-side terminals of the plurality of conductive members with respect to each of the plurality of through holes,
At least a part of the alignment member is installed at a predetermined interval from the electronic circuit board,
At least some of the plurality of electronic components are disposed below the alignment member,
The alignment member has a boss portion that passes through at least one of the substrate-side terminals of the plurality of conductive members, below a part of the alignment circuit that is spaced from the electronic circuit board by a predetermined distance. An electronic control device.
請求項1に記載の電子制御装置において、
前記複数の導電部材のうち所定の導電部材の基板側端子は、当該所定の導電部材と電気的に接続される前記複数の電子部品のいずれかであって前記コネクタの最も近くに実装された電子部品の近傍領域に配置されたことを特徴とする電子制御装置。
The electronic control device according to claim 1.
The board-side terminal of the predetermined conductive member among the plurality of conductive members is one of the plurality of electronic components that are electrically connected to the predetermined conductive member and is mounted closest to the connector. An electronic control device arranged in the vicinity of a component.
請求項1に記載の電子制御装置において、
コネクタ間口の上段に配置されたコネクタ側端子を有する導電部材の基板側端子は、コネクタ間口の下段に配置されたコネクタ側端子を有する導電部材の基板側端子よりも前記コネクタから離して配置されていることを特徴とする電子制御装置。
The electronic control device according to claim 1.
The board-side terminal of the conductive member having the connector-side terminal arranged at the upper stage of the connector front end is arranged farther from the connector than the board-side terminal of the conductive member having the connector-side terminal arranged at the lower stage of the connector front end. An electronic control device characterized by comprising:
請求項1に記載の電子制御装置において、
前記複数の導電部材のうち部品実装エリアの上方まで延在させる所定の導電部材の断面積は、部品実装エリアの上方まで延在させないその他の導電部材の断面積よりも大きいことを特徴とする電子制御装置。
The electronic control device according to claim 1.
The cross-sectional area of a predetermined conductive member that extends above the component mounting area among the plurality of conductive members is larger than the cross-sectional area of other conductive members that do not extend above the component mounting area. Control device.
請求項に記載の電子制御装置において、
前記所定の導電部材のコネクタ側端子は、前記コネクタ間口部の最上段に配置されていることを特徴とする電子制御装置。
The electronic control device according to claim 4 .
The electronic control device according to claim 1, wherein the connector-side terminal of the predetermined conductive member is arranged at the uppermost stage of the connector opening.
請求項1に記載の電子制御装置において、
前記複数の導電部材の少なくとも1つは、前記コネクタ側端子と前記電子回路基板の垂直方向とで定義される平面と交差する方向に屈曲していることを特徴とする電子制御装置。
The electronic control device according to claim 1.
At least one of the plurality of conductive members is bent in a direction intersecting a plane defined by the connector-side terminal and a vertical direction of the electronic circuit board.
請求項1に記載の電子制御装置において、
前記複数の電子部品は、発熱性電子部品を含み、
前記複数の導電部材の少なくとも1つである所定の導電部材の基板側端子は、前記発熱性電子部品の近傍領域に配置されたことを特徴とする電子制御装置。
The electronic control device according to claim 1.
The plurality of electronic components include heat-generating electronic components,
The electronic control device according to claim 1, wherein a substrate-side terminal of a predetermined conductive member that is at least one of the plurality of conductive members is disposed in a region near the heat-generating electronic component.
請求項に記載の電子制御装置において、
前記所定の導電部材の断面積は、その他の導電部材の断面積よりも大きいことを特徴とする電子制御装置。
The electronic control device according to claim 7 .
The electronic control device according to claim 1, wherein a cross-sectional area of the predetermined conductive member is larger than a cross-sectional area of other conductive members.
請求項に記載の電子制御装置において、
前記所定の導電部材は、放熱フィンを有することを特徴とする電子制御装置。
The electronic control device according to claim 7 .
The electronic control apparatus according to claim 1, wherein the predetermined conductive member includes a heat radiating fin.
請求項に記載の電子制御装置において、
前記所定の導電部材は、前記放熱フィンと前記発熱性電子部品の近傍領域とを接続する複数の基板側端子を有することを特徴とする電子制御装置。
The electronic control device according to claim 9 .
The electronic control apparatus, wherein the predetermined conductive member includes a plurality of board-side terminals that connect the heat radiating fins and a region near the heat-generating electronic component.
請求項1に記載の電子制御装置において、
前記電子回路基板は、封止樹脂によって封止されていることを特徴とする電子制御装置。
The electronic control device according to claim 1.
The electronic control device is characterized in that the electronic circuit board is sealed with a sealing resin.
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