JP6446879B2 - Metal substrate - Google Patents

Description

  The present invention relates to a metal substrate, and more particularly, to a metal substrate formed with a plurality of elongated through holes used as a part of a flow path unit of an inkjet head.

  2. Description of the Related Art Conventionally, in an inkjet head, a heat exchanger, or the like, a metal substrate in which a plurality of long through-hole portions are formed by etching is used as a plate material that constitutes a liquid flow path unit. For example, as an ink flow path unit in an inkjet head, a nozzle plate having a plurality of nozzle holes, a base plate having a pressure chamber corresponding to each nozzle hole, a manifold plate that connects each nozzle hole and each pressure chamber, and the like are stacked and fixed. What is made is used (refer patent document 1). As the base plate of the ink flow path unit, a metal substrate in which the plurality of elongated through holes are formed is used, and each elongated through hole constitutes a pressure chamber in the base plate. .

The base plate is manufactured, for example, as shown in FIG.
First, a resist pattern 300 having openings 310 corresponding to the respective elongated through-hole portions 200 of the base plate is formed on the first surface 100A and the second surface 100B of the metal plate 100 (see FIG. 5A). Then, wet etching is performed simultaneously from the first surface 100A and the second surface 100B of the metal plate 100 (see FIGS. 5B to 5D). At this time, the first surface 100A and the second surface 100B of the metal plate 100 are gradually etched from the portion exposed at the opening 310 of the resist pattern 300 (see FIG. 5B). The portion covered with the pattern 300 is also side-etched (see FIG. 5C). And it etches from each of the 1st surface 100A and the 2nd surface 100B, and the elongate through-hole part 200 is formed by penetrating the metal plate 100 in thickness direction (refer FIG.5 (D)).

JP 2007-105896 A

In the base plate manufactured as described above, as shown in FIG. 6, the side wall 230 of the elongated through-hole portion 200 is formed with a protruding portion 240 by side etching. In particular, the long through hole 200 has a first long through hole with a small width in the short direction and a second long through hole with a larger width in the short direction. In the case of having a configuration that is continuous in the direction, the protrusion 240 formed on the side wall 230 of the first elongate through hole and the protrusion 240 formed on the side wall 230 of the second elongate through hole. of, the projection amount H _P from the side wall 230 differs from. The protruding portion 240 causes a large pressure loss when a fluid such as ink passes through the elongated through-hole portion 200. In particular, the first elongate through-hole portion and the second elongate through-hole portion have different pressure losses that occur in a fluid such as ink. Thereby, the supply pressure of the ink supplied toward the nozzle hole is reduced, and it becomes difficult to stably supply the ink toward the nozzle hole.

  While printing with high resolution is required, there is a demand for an inkjet head that can eject ink with a smaller and uniform droplet size from each nozzle hole. For this purpose, it is required to reduce the width of the flow path in the inkjet head and to reduce the pressure loss generated in the fluid such as ink.

  In view of the above problems, the present invention has a long through-hole portion that penetrates in the thickness direction and is used as a fine flow channel, and the inside of the flow channel constituted by the long through-hole portion is fluidized. An object of the present invention is to provide a metal substrate capable of reducing the pressure loss when passing through.

  In order to solve the above problems, the present invention provides a metal substrate having a first surface and a second surface opposite to the first surface, the metal substrate including a first elongated through-hole portion and And a second elongated through-hole portion that is continuous with the first elongated through-hole portion and has a larger opening dimension in the short direction than the first elongated through-hole portion. A through-hole portion is formed so as to penetrate in the thickness direction of the metal substrate, and a substantially middle point of a side wall of the elongated through-hole portion is located inside the elongated through-hole portion. There is a projecting portion projecting toward the metal substrate, and when the cut surface of the elongated through-hole portion in the thickness direction of the metal substrate is viewed, the tip of the projecting portion is the first of the side walls. A line segment connecting the first end located on the surface side and the second end located on the second surface side, or on the outside of the elongated through-hole portion than the line segment. To provide a metal substrate, characterized in that (invention 1).

  In the said invention (invention 1), it is preferable that the said protrusion part exists in the position of 20 to 80% with respect to the thickness of the said metal substrate on the basis of the said 1st surface (invention 2).

  In the above inventions (Inventions 1 and 2), the opening dimensions in the short direction of the first long through hole portion and the second long through hole portion on the first surface side are respectively It is preferable that it is larger than the opening dimension of the 1st elongate through-hole part in the 2nd surface side and the said 2nd elongate through-hole part in the transversal direction (invention 3).

  In the above inventions (Inventions 1 to 3), the plurality of elongated through holes are formed in parallel with the longitudinal direction of the metal substrate, and the longitudinal direction of the plurality of elongated through holes is Are preferably substantially coincident with the short direction of the metal substrate (Invention 4).

  In the said invention (invention 1-4), it is preferable that the said metal substrate is used for the use in which the said elongate through-hole part comprises a part of fluid flow path (invention 5).

  According to the present invention, when the fluid passes through the flow path constituted by the elongated through-hole portion, the elongated through-hole portion penetrating in the thickness direction is used as a fine flow channel. It is possible to provide a metal substrate capable of reducing the pressure loss.

FIG. 1 is a partially enlarged perspective view showing a schematic configuration of a metal substrate according to an embodiment of the present invention. 2A is an end view taken along line AA in FIG. 1 showing a schematic configuration of a metal substrate according to an embodiment of the present invention, and FIG. 2B shows a schematic configuration of the metal substrate. FIG. 3 is an enlarged view of a portion B in FIG. FIG. 3 is a process flow diagram schematically showing a process of manufacturing a metal substrate according to an embodiment of the present invention in a cut end view. FIG. 4 is a cross-sectional view illustrating a schematic configuration of a main part of the inkjet head according to the embodiment of the present invention. FIG. 5 is a process flow diagram schematically showing a manufacturing process of a conventional base plate (metal substrate) in a cut end view. FIG. 6 is a partially enlarged cut end view showing the shape of the side wall of the long through hole portion of the conventional base plate (metal substrate).

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
[Metal substrate]
FIG. 1 is a partially enlarged perspective view showing a schematic configuration of a metal substrate according to the present embodiment, and FIG. 2A shows a schematic configuration of the metal substrate according to the present embodiment, taken along line AA in FIG. FIG. 2B is a cut end view, and FIG. 2B is an enlarged view of a portion B in FIG.

  As shown in FIG. 1, the metal substrate 1 according to the present embodiment has a first surface 1A and a second surface 1B facing the first surface 1A. The metal substrate 1 has a plurality of elongated through-hole portions 2, 2... Penetrating in the thickness direction of the metal substrate 1 (Z direction in FIG. 1). 1 in the X direction).

  The shape of the metal substrate 1 in the present embodiment is substantially rectangular in plan view, but is not particularly limited. The shape of the metal substrate 1 can be appropriately set according to the use of the metal substrate 1 and the like.

  The size of the metal substrate 1 can be appropriately set according to the use of the metal substrate 1 or the like. For example, the length in the longitudinal direction (X direction in FIG. 1) of the metal substrate 1 is about 30 to 150 mm, and the length in the short side direction (Y direction in FIG. 1) is about 10 to 70 mm. The length (Z direction in FIG. 1) can be set to about 0.025 to 0.102 mm.

  The metal material constituting the metal substrate 1 is not particularly limited, and various metal materials can be used according to the use of the metal substrate 1 or the like. Examples of the metal material include austenitic, ferritic, and martensitic stainless steels; nickel, nickel alloys, cobalt alloys, chromium alloys, and the like.

  In the present embodiment, the long through-hole portion 2 includes a first long through-hole portion 21 having a relatively small opening dimension in the short direction (X direction in FIG. 1) and a first long shape. It includes a second elongated through-hole portion 22 that is continuous with both ends of the through-hole portion 21 and has a relatively large opening dimension in the short-side direction.

  In the present embodiment, the “aperture dimension” refers to irradiation of light parallel to the thickness direction (Z direction in FIG. 1) of the metal substrate 1 from the first surface 1A side (or the second surface 1B side) of the metal substrate 1. And the transmission dimension which can be measured by detecting the light which passed the elongate through-hole part 2 in the 2nd surface 1B side (or 1st surface 1A side), and the said irradiation light are elongate through-hole parts. It can be calculated as an arithmetic average value with the reflection dimension that can be measured by detecting the reflected light reflected by the two edges on the first surface 1A side (or the second surface 1B side). The transmission dimension and the reflection dimension can be measured using, for example, a two-dimensional measuring device (Nikon IV, manufactured by Nikon Corporation).

  Although the opening dimension of the transversal direction of the 1st elongate through-hole part 21 can be suitably set according to the use etc. of the metal substrate 1 which concerns on this embodiment, the said metal substrate 1 is inkjet, for example. When used as a member constituting the ink flow path in the head, it is preferably about 75 to 150 μm, and more preferably about 75 to 120 μm.

  The opening dimension in the short direction of the second elongated through-hole portion 22 can be appropriately set according to the use of the metal substrate 1 according to the present embodiment. For example, the metal substrate 1 is inkjet. When used as a member constituting the ink flow path in the head, the thickness is preferably about 150 to 300 μm, more preferably about 150 to 220 μm.

  Of the opening dimensions in the short direction of the first elongated through-hole portion 21, the opening dimension on the first surface 1A side and the opening dimension on the second surface 1B side may be the same or different. It may be a dimension. Similarly, the opening dimension on the first surface 1A side and the opening dimension on the second surface 1B side may be the same among the opening dimensions in the short direction of the second long through-hole portion 22. However, the dimensions may be different.

  As shown in FIGS. 2 (A) and (B), each elongated through-hole portion 2 (first elongated through-hole portion 21 and second elongated through-hole portion 22) in this embodiment is as follows. The protrusions 24 protrude toward the inner side of the long through-hole portions 2 (21, 22) and extend along the side walls 23 of the long through-hole portions 2 (21, 22). The protrusion 24 is located at a substantially middle point of the side wall 23 of each elongated through-hole 2 (21, 22). In the present embodiment, the “substantially middle point of the side wall 23” means a position of 20 to 80% with respect to the thickness of the metal substrate 1 with respect to the first surface 1A, and preferably the metal substrate 1 The position of 25 to 75% with respect to the thickness of the metal substrate 1 is particularly preferable, and the position of 30 to 70% with respect to the thickness of the metal substrate 1 is particularly preferable.

  And the front-end | tip 24a of the protrusion part 24 is on the virtual line segment VL which connects the 1st end part 23a located in the 1st surface 1A side of the side wall 23, and the 2nd end part 23b located in the 2nd surface 1B side. Or, it is located outside each elongated through-hole portion 2 (21, 22) from the virtual line segment VL. That is, in the first long through-hole portion 21, the dimension between the tips 24a of the projecting parts 24 facing each other in the lateral direction (opening dimension in the lateral direction of the projecting part 24) is the first surface 1A side. It is larger than both the opening dimension in the short direction and the opening dimension in the short direction on the second surface 1B side. Similarly, in the second elongate through-hole portion 22, the dimension between the tips 24a of the projecting portions 24 facing each other (the dimension of the projecting portion 24 in the short direction) is the short direction on the first surface 1A side. And the opening dimension in the short direction on the second surface 1B side.

  As shown in FIG. 5, the conventional metal substrate having the long through hole 200 has openings corresponding to the long through holes 200 on the first surface 100 </ b> A and the second surface 100 </ b> B of the metal plate 100. The resist pattern 300 is formed, and wet etching is performed simultaneously from the first surface 100A and the second surface 100B, and the metal plate 100 is penetrated in the thickness direction to form the elongated through hole 200. The Therefore, as shown in FIG. 6, the tip 240 a of the protrusion 240, which is formed at a substantially middle point of the side wall 230 of the elongated through-hole portion 200 and is caused by side etching, The inner side of the long through-hole portion 200 from the imaginary line segment VL ′ connecting the first end portion 230a located on the first surface side and the second end portion 230b located on the second surface side (of the protrusion 240). It will be located on the side of the side wall 230 facing the side wall 230 where the tip 240a exists.

  However, in the metal substrate 1 according to the present embodiment, the distal end 24a of the protrusion 24 has the first end 23a located on the first surface 1A side of the side wall 23 and the second end located on the second surface 1B side. On the imaginary line segment VL connecting to the end 23b or on the outer side of each elongated through hole 2 (21, 22) from the imaginary line segment VL (the side wall 23 side where the tip 24a of the projection 24 is present) (See FIGS. 2A and 2B).

  The tip 24a of the protrusion 24 is preferably located outside the imaginary line segment VL by about 1 to 10 μm, and particularly preferably located about 1 to 5 μm. When the positional relationship between the tip 24a of the projecting portion 24 and the virtual line segment VL is within the above numerical range, the elongated through-hole portion 2 (21, 22) passes through the liquid flow path, for example, the ink flow in the inkjet head. When used as a channel, it is possible to suppress bubble accumulation and ink ejection inhibition in the channel.

  In the metal substrate 1 according to the present embodiment, the tip 24a of the protrusion 24 existing on the side wall 23 of the elongated through hole 2 (21, 22) connects the first end 23a and the second end 23b. The long through hole 2 (21 (21) of the metal substrate 1 is located on the virtual line segment VL or outside the long through hole 2 (21, 22) from the virtual line segment (VL). , 22) can be used as a fluid flow path, the pressure loss generated in the liquid can be reduced. Therefore, for example, when the elongated through-hole portion 2 (21, 22) of the metal substrate 1 is used as the ink flow path in the inkjet head, the ink supply pressure to the nozzles of the inkjet head can be improved. The ink can be stably supplied. Further, since the pressure loss can be reduced, an effect of reducing the burden of supplying electricity to the piezo element in the ink jet head is also achieved.

[Metallic substrate manufacturing method]
The metal substrate 1 having the above-described configuration can be manufactured as follows. FIG. 3 is a process flow diagram showing the manufacturing process of the metal substrate 1 according to this embodiment in a cut end view.

  As shown in FIG. 3A, a metal plate 10 having a first surface 10A and a second surface 10B opposite to the first surface 10A is prepared, and the metal substrate 1 has a long through-hole in the first surface 10A. A resist pattern 30 having an opening 31 corresponding to the hole 2 (21, 22) is formed. In addition, a resist pattern 40 having an opening 41 corresponding to the elongated through hole 2 (21, 22) of the metal substrate 1 is also formed on the second surface 10B of the metal plate 10. At this time, the center in the short direction of the opening 31 of the resist pattern 30 on the first surface 10A and the center in the short direction of the opening 41 of the resist pattern 40 on the second surface 10B are substantially matched. Resist patterns 30 and 40 are formed on the first surface 10A and the second surface 10B, respectively.

  The dimensions of the openings 31 and 41 of the resist patterns 30 and 40 formed on the first surface 10A and the second surface 10B of the metal plate 10 are appropriately determined according to the dimensions of the long through-hole portions 2 (21 and 22). Although it can be set, in the present embodiment, the size of the opening 31 of the first surface 10A is made smaller than the size of the opening 41 of the second surface 10B. As will be described later, in the present embodiment, the etching process is performed from the first surface 10A side of the metal plate 10 under the etching condition that provides an etching amount of about 70 to 90% of the plate thickness, and then the second surface 10B side. Then, the etching process is performed under an etching condition of about 60 to 80% of the plate thickness, and the elongated through-hole portion 2 (21, 22 is set so that the tip 24a of the protruding portion 24 is positioned at a substantially middle point of the plate thickness. ). That is, the etching conditions for each etching process are set so that the etching amount in the etching process from the first surface 10A side of the metal plate 10 is larger than the etching amount in the etching process from the second surface 10B side. At this time, if the opening 31 of the first surface 10A and the opening 41 of the second surface 10B have the same size, the opening size on the first surface 1A side of the elongated through-hole 2 in the metal substrate 1 is as follows. , It becomes larger than the opening size on the second surface 1B side. In order to make the opening dimensions of the first surface 1A side and the second surface 1B side of the elongated through-hole portion 2 (21, 22) substantially the same, an etching process is performed first. The dimension of the opening 31 of the resist pattern 30 on the first surface 10A side of the plate 10 is made smaller than the dimension of the opening 41 of the resist pattern 40 on the second surface 10B side.

  Next, as illustrated in FIG. 3B, a resist layer 60 is formed on the entire second surface 10 </ b> B so as to close the opening 41 of the resist pattern 40. The thickness of the resist layer 60 can be appropriately set within a range in which the resist layer 60 does not disappear by a half-etching process (see FIG. 3C) described later.

  Subsequently, as shown in FIG. 3C, a half etching process (an etching process that does not penetrate through the metal plate 10) is performed from the first surface 10 </ b> A side of the metal plate 10. In the half etching process, the etching amount (depth from the first surface 10A to the lowest point of the groove formed on the first surface 10A side by the half etching process) is 70 to 90% of the plate thickness of the metal plate 10. The etching conditions (the temperature of the etching solution, the degree of the etching solution, the etching time, etc.) are set so as to be approximately.

  This half-etching process can be performed by, for example, a spray etching method in which an etching solution is sprayed on the first surface 10A side of the metal plate 10 or a dipping method in which the metal plate 10 is immersed in the etching solution. However, the etching method is particularly limited. There is no.

When the half etching process is performed by the spray etching method, the spray pressure for spraying the etching solution can be set to about 1 to 3 kg / cm ² . In the present embodiment, the half etching process is performed from the first surface 10A side of the metal plate 10 so that the etching amount is about 70 to 90% of the thickness of the metal plate 10, so that the metal plate after the half etching process is performed. The remaining part in 10 becomes thin. Therefore, if the spray pressure is too large (exceeding 3 kg / cm ² ), the remaining portion of the metal plate 10 may be deformed, which is not desirable.

  After the half etching process from the first surface 10A side is completed, the depth of the lowest point of the groove formed on the first surface 10A side is measured, and whether or not the groove is formed with a predetermined etching amount. It is preferable to confirm. In the present embodiment, by controlling the etching amount by the half etching process from the first surface 10A side and the etching amount by the half etching process from the second surface 10B side, which will be described later, to a predetermined range, The front end 24a of the protruding portion 24 of the through-hole portion 2 (21, 22) has a first end portion 23a located on the first surface 1A side of the side wall 23 and a second end portion 23b located on the second surface 1B side. Can be positioned on the imaginary line segment VL connecting the two or more to the outside of each elongated through-hole portion 2 (21, 22) with respect to the imaginary line segment VL. On the other hand, even if the half etching process is not performed from the first surface 10A side of the metal plate 10 with the planned etching amount, the half etching process from the second surface 10B side described later is performed as it is, There is a possibility that the tip 24a of the protrusion 24 is positioned inside each of the elongated through-hole portions 2 (21, 22) with respect to the virtual line segment VL. Therefore, after confirming that the groove is formed with a predetermined etching amount by the half etching process from the first surface 10A side of the metal plate 10, the half etching process from the second surface 10B side described later is performed. Is desirable

  The depth of the lowest point of the groove formed by the half etching process from the first surface 10A side can be measured by, for example, an optical interference type surface shape measuring apparatus (for example, Wyko NT9000 series manufactured by Bruker).

  As a result of measuring the depth of the lowest point of the groove formed by the half etching process from the first surface 10A side, when the planned etching amount has not been reached (the groove shallower than the planned depth is formed). ), The half etching process may be performed again from the first surface 10A side so as to achieve the planned etching amount, or a new metal plate 10 is prepared and the first step shown in FIG. You may go again.

  Subsequently, as shown in FIG. 3D, the resist layer 60 on the second surface 10B side of the metal plate 10 is removed, and a resist layer 50 is formed on the first surface 10A side, from the second surface 10B side. Half etching process is performed. In this etching process, the etching conditions (the temperature of the etching solution, the degree of the etching solution, the etching time, etc.) are set so that the etching amount is about 60 to 80% of the thickness of the metal plate 10. Thereby, the front end 24a of the projecting portion 24 existing on the side wall 23 passes through the elongated through-hole portion 2 (21, 22) penetrating in the plate thickness direction of the metal plate 10 and the first surface 1A side of the side wall 23. On the imaginary line segment VL connecting the first end portion 23a located on the second surface 23B and the second end portion 23b located on the second surface 1B side, or each elongated through-hole portion 2 (21, 21) than the imaginary line segment VL. 22) and can be formed outside.

  Note that the etching solution used in the half etching process from the first surface 10A side and the second surface 10B side of the metal plate 10 is generally a metal material etching process depending on the material constituting the metal plate 10 and the like. Can be appropriately selected from the etching solutions used in the above.

  As described above, according to the present embodiment, the tip 24a of the protrusion 24 existing on the side wall 23 of the elongated through-hole 2 (21, 22) is connected to the first end 23a and the second end 23b. The long through-hole portion 2 (21, 22) is provided so as to be positioned on the virtual line segment VL connecting the two or more outside the long through-hole portion 2 (21, 22) with respect to the virtual line segment VL. The metal substrate 1 can be manufactured. When the elongated through-hole portion 2 (21, 22) of the metal substrate 1 is used as a fluid flow path, pressure loss generated in the liquid can be reduced. For example, as an ink flow path in an inkjet head When the long through-hole portion 2 (21, 22) of the metal substrate 1 is used, the ink supply pressure to the nozzles of the inkjet head can be improved, and ink can be supplied stably. . Therefore, according to this embodiment, for example, the metal substrate 1 having the long through-hole portions 2 (21, 22) that is useful as an ink flow path in an inkjet head is used as a general wet processing method for a metal material. It can be easily manufactured using an etching method.

[Inkjet head]
Subsequently, an ink jet head using the metal substrate 1 will be described as an example of the use of the metal substrate 1 according to the present embodiment. FIG. 4 is a cross-sectional view showing a schematic configuration of a main part of the ink jet head in the present embodiment.

  As shown in FIG. 4, the inkjet head 70 in the present embodiment includes a nozzle plate 71 having nozzle holes 72 through which ink is ejected, the metal substrate 1 according to the present embodiment provided on the nozzle plate 71, and A vibration plate 73 provided on the first surface 1A (or the second surface 1B) of the metal substrate 1, and a piezo element 75 and an ink tank 76 provided on the vibration plate 73 are provided.

  The metal substrate 1 is provided on the nozzle plate 71 so that the nozzle hole 72 is positioned in the vicinity of one end in the longitudinal direction of the elongated through-hole portion 2 (21, 22). The diaphragm 73 has a hole 74 continuous with the ink tank 76, and the hole 74 is positioned in the vicinity of the other end in the longitudinal direction of the long through hole 2 (21, 22) of the metal substrate 1. As shown, it is provided on the metal substrate 1. Thus, the nozzle plate 71 is attached to the second surface 1B (or the first surface 1A) of the metal substrate 1, the vibration plate 73 is attached to the first surface 1A (the second surface 1B), and the nozzle hole 72 is formed. A hole 74 located at one end in the longitudinal direction of the elongated through hole 2 (21, 22) and continuing to the ink tank 76 is located at the other end in the longitudinal direction of the elongated through hole 2 (21, 22). By being positioned, the elongated through-hole portion 2 (21, 22) of the metal substrate 1 is configured as an ink flow path.

  The elongated through-hole portion 2 (21, 22) configured as an ink flow path in the ink jet head 70 has a first end 24a of the protruding portion 24 positioned at a substantially middle point of the side wall 23 thereof. It is located on the imaginary line segment VL connecting the portion 23a and the second end 23b, or on the outer side of the elongated through hole 2 (21, 22) from the imaginary line segment VL. Therefore, it is possible to reduce the pressure loss that occurs in the ink flowing through the elongated through-hole portion 2 (21, 22). Therefore, ink can be stably supplied to the nozzle holes 72 of the inkjet head 70.

  The embodiment described above is described for facilitating understanding of the present invention, and is not described for limiting the present invention. Therefore, each element disclosed in the above embodiment is intended to include all design changes and equivalents belonging to the technical scope of the present invention.

  EXAMPLES Hereinafter, although an Example etc. are given and this invention is demonstrated further in detail, this invention is not limited at all by the following Example etc.

[Example 1]
A metal plate 10 (SUS316L, plate thickness: 38 μm, size: 300 mm × 300 mm) was prepared, and a photosensitive dry film (manufactured by Asahi Kasei Co., Ltd., Sunfort) was formed on each of the first surface 10A and the second surface 10B of the metal plate 10. AQ-2558) was attached using a roll laminator under the following conditions.

<Lamination conditions>
Laminating speed: 1m / min
Lamination pressure: 4kg
Lamination temperature: 130 ° C

  Next, a photomask having a predetermined opening pattern is prepared, the photomask and the photosensitive dry film affixed to each of the first surface 10A and the second surface 10B are exposed by vacuum contact, and then developed. Thus, line-and-space resist patterns 30 and 40 were formed on the first surface 10A and the second surface 10B, respectively.

  The first surface 10A has an opening corresponding to the first long through-hole portion 21 (short-side dimension: 100 μm, long-side dimension: 2.5 mm) and one longitudinal end of the opening. A resist pattern 30 having an opening (short-side dimension: 200 μm, long-side dimension: 2.5 mm) corresponding to the second long through-hole portion 22 is formed. The second surface 10B has an opening corresponding to the first elongated through-hole portion 21 (short-side dimension: 120 μm, long-side dimension: 2.5 mm) and one end portion in the longitudinal direction of the opening. A resist pattern 40 having an opening (short-side dimension: 240 μm, long-side dimension: 2.5 mm) corresponding to the second long through-hole portion 22 is formed. Resist patterns 30 and 40 having 100 openings were formed on the first surface 10A and the second surface 10B, respectively.

  Subsequently, a dry film resist 60 was applied so as to cover the resist pattern 40 on the second surface 10B, and a half-etching process by a dipping method was performed from the first surface 10A side under the following conditions.

<Etching conditions>
Etching temperature: 75 ° C
Baume degree: 49 degrees Etching depth: 30 μm
Etching width: 150 μm

  After the half etching process from the first surface 10A side, the depth of the lowest point of the groove formed on the first surface 10A side is measured by an optical interference type surface shape measuring device (Bruker, Wyko NT9000 series). obtain. The depth of the lowest point was 30 μm, and it was confirmed that the half etching process was performed with the planned etching amount.

  Next, the dry film resist 60 affixed to the second surface 10B side is peeled off, and a dry film resist 50 is affixed to cover the resist pattern 30 on the first surface 10A side, and dipping is performed from the second surface 10B side. A half-etching process was performed. The etching conditions on the second surface 10B side were the same as the etching conditions on the first surface 10A side except that the etching depth was 23 μm.

  The etching depth in the half etching process on the first surface 10A side and the second surface 10B side is such that the tip 24a of the protruding portion 24 of the elongated through-hole portion 2 (21, 22) to be formed is the first surface 1A. It was set to exist at a position of 70% of the plate thickness of the metal substrate 1 with respect to the side.

  After the half etching process on the second surface 10B side, the opening dimension in the short direction of the elongated through-hole portion 2 (21, 22) was measured using a two-dimensional measuring device (Nikon Corporation, NEXIV). On both the 1st surface 1A side and the 2nd surface 1B side, the opening size of the first elongated through-hole portion 21 is 135 μm, and the opening size of the second elongated through-hole portion 22 is 255 μm. It was. And the front-end | tip 24a of the protrusion part 24 of the elongate through-hole part 2 (21, 22) is elongate through-hole part 2 rather than the virtual line segment VL which ties the 1st end part 23a and the 2nd end part 23b. It was located 3 μm outside (21, 22).

[Comparative Example 1]
The lateral dimensions of the openings of the resist patterns 30 and 40 on the first surface 10A and the second surface 10B are 110 μm and 220 μm, respectively, and etching is performed simultaneously from both the first surface 10A and the second surface 10B. Except for this, the elongated through-hole 2 (21, 22) was formed in the metal plate 10 in the same manner as in Example 1. When the opening dimension in the short direction of the elongated through-hole portion 2 (21, 22) was measured using a two-dimensional measuring device (Nikon Corporation, NEXIV), the first surface 1A side and the second surface 1B side were measured. In either case, the opening size of the first elongated through-hole portion 21 was 125 μm, and the opening size of the second elongated through-hole portion 22 was 245 μm. And the front-end | tip 24a of the protrusion part 24 of the elongate through-hole part 2 (21, 22) is elongate through-hole part 2 rather than the virtual line segment VL which ties the 1st end part 23a and the 2nd end part 23b. It was located inside (21, 22).

  The metal substrate of the present invention is useful as a flow path plate through which fluid flows, such as an inkjet head and a heat exchanger.

DESCRIPTION OF SYMBOLS 1 ... Metal substrate 2 ... Elongate through-hole part 21 ... 1st elongate through-hole part 22 ... 2nd elongate through-hole part 23 ... Side wall 24 ... Protrusion part 24a ... Tip

Claims (12)

A metal substrate having a first surface and a second surface facing the first surface,
The metal substrate has a first elongated through-hole portion and a continuous opening dimension in the shorter direction than the first elongated through-hole portion, continuous to the first elongated through-hole portion. A long through hole including a large second long through hole is formed so as to penetrate in the thickness direction of the metal substrate;
The metal substrate is used for applications in which the elongated through-hole portion constitutes a liquid flow path,
At a substantially middle point of the side wall of the elongated through-hole portion, there is a protruding portion that protrudes toward the inside of the elongated through-hole portion,
When the cut surface of the elongated through-hole portion in the thickness direction of the metal substrate is viewed, the tip of the protruding portion is a first end portion located on the first surface side of the side wall and the It is located on the line connecting the second end located on the second surface side or on the outer side of the elongated through-hole part than the line segment, and the side wall of the elongated through-hole part Both the portion between the first end and the protruding portion and the portion between the second end and the protruding portion have a convex curved shape toward the outside of the elongated through-hole portion. metal substrate, wherein the Rukoto Oh. A metal substrate having a first surface and a second surface facing the first surface,
The metal substrate has a first elongated through-hole portion and a continuous opening dimension in the shorter direction than the first elongated through-hole portion, continuous to the first elongated through-hole portion. A long through hole including a large second long through hole is formed by etching so as to penetrate in the thickness direction of the metal substrate,
The metal substrate is used for applications in which the elongated through-hole portion constitutes a liquid flow path,
At a substantially middle point of the side wall of the elongated through-hole portion, there is a protruding portion that protrudes toward the inside of the elongated through-hole portion,
When the cut surface of the elongated through-hole portion in the thickness direction of the metal substrate is viewed, the tip of the protruding portion is a first end portion located on the first surface side of the side wall and the A metal substrate, wherein the metal substrate is located on a line segment connecting the second end portions located on the second surface side or on the outer side of the elongated through-hole portion with respect to the line segment. 3. The metal substrate according to claim 1, wherein a tip of the projecting portion is present at a position of 20 to 80% with respect to a thickness of the metal substrate with respect to the first surface. The opening dimensions in the short direction of the first long through-hole portion and the second long through-hole portion on the first surface side are the first long length on the second surface side, respectively. Jo through hole and the second metal substrate according to any one of claims 1-3, wherein greater than the lateral direction of the opening dimension of the elongated through-hole. A plurality of the elongated through-hole portions are formed so as to be parallel to the longitudinal direction of the metal substrate,
The metal substrate according to any one of claims 1 to 4 , wherein a longitudinal direction of the plurality of long through-hole portions substantially coincides with a short direction of the metal substrate. A method for producing the metal substrate according to claim 1,
A metal plate preparation step of preparing a metal plate having a first surface and a second surface facing the first surface;
Using the first resist pattern formed on the first surface of the metal plate and having an opening corresponding to the elongated through hole as a mask, the metal plate is etched from the first surface side. Process,
Using the second resist pattern formed on the second surface of the metal plate and having an opening corresponding to the elongated through hole as a mask, the metal plate after the first etching step is used as the second surface. A second etching step for etching from the side,
Etching conditions in each of the first etching step and the second etching step are such that the etching amount of the metal plate in the first etching step is larger than the etching amount of the metal plate in the second etching step. Is set,
The etching amount in the first etching step is an amount that is 70 to 90% of the plate thickness of the metal plate, and the etching amount in the second etching step is an amount that is 60 to 80% of the thickness of the metal plate plate. A method for producing a metal substrate, characterized in that: The metal plate on which the first resist layer covering the second surface is formed on the second surface is subjected to the first etching step,
The method of manufacturing a metal substrate according to claim 6, wherein the metal plate on which the second resist layer covering the first surface is formed on the first surface is subjected to the second etching step. . A resist pattern forming step of forming the first resist pattern on the first surface of the metal plate and forming the second resist pattern on the second surface;
The metal plate having the first resist pattern formed on the first surface and the second resist pattern formed on the second surface is subjected to the first etching step and the second etching step. The method for producing a metal substrate according to claim 6 or 7, characterized in that   The method for manufacturing a metal substrate according to claim 6, wherein an opening size of the opening portion of the first resist pattern is smaller than an opening size of the opening portion of the second resist pattern. .   After the etching of the metal plate in the first etching step is completed, the method further includes a step of confirming whether the etching amount of the metal plate is 70 to 90% of the plate thickness of the metal plate. The method for producing a metal substrate according to claim 6, wherein the metal substrate is a metal substrate.   In each of the first etching step and the second etching step, the metal plate is etched by a spray etching method in which an etching solution is sprayed on each of the first surface and the second surface of the metal plate. The manufacturing method of the metal substrate in any one of Claims 6-10. The method for producing a metal substrate according to claim 11, wherein a spray pressure for spraying the etching solution is 1 to 3 kg / cm ² .

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