JP6442153B2 - Grinding wheel and cutting tool manufacturing method - Google Patents
Grinding wheel and cutting tool manufacturing method Download PDFInfo
- Publication number
- JP6442153B2 JP6442153B2 JP2014082033A JP2014082033A JP6442153B2 JP 6442153 B2 JP6442153 B2 JP 6442153B2 JP 2014082033 A JP2014082033 A JP 2014082033A JP 2014082033 A JP2014082033 A JP 2014082033A JP 6442153 B2 JP6442153 B2 JP 6442153B2
- Authority
- JP
- Japan
- Prior art keywords
- particle size
- peak
- grinding wheel
- abrasive grains
- grindstone
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Polishing Bodies And Polishing Tools (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Description
本発明は、研削用砥石および切削工具の製造方法に関する。
The present invention relates to a grinding wheel and a method for manufacturing a cutting tool .
従来から、研削用砥石を用いて研削加工する方法が広く用いられている。研削用砥石（以下、砥石と略すことがある。）の研削性は、砥石を構成する砥粒の粒径が影響することが知られており、クラス分けされて粒径の揃った砥粒が使用される。砥粒の粒径が大きいと加工効率は高いが仕上がり面が粗くなり、砥粒の粒径が小さいと仕上がり面は平滑になるが加工効率が低下することが知られている。 Conventionally, a grinding method using a grinding wheel has been widely used. It is known that the grindability of grinding wheels (hereinafter sometimes abbreviated as “whetstones”) is influenced by the grain size of the abrasive grains that make up the grinding stones. used. It is known that when the grain size of the abrasive grains is large, the processing efficiency is high but the finished surface becomes rough, and when the grain size of the abrasive grains is small, the finished surface becomes smooth but the processing efficiency decreases.
特許文献１では、砥粒の粒径分布に複数のピーク粒径が存在する研削用砥石を用いて、電解インプロセスドレッシング研削することによって、仕上がり面粗さが小さくかつ高能率な研削加工ができることが開示されている。また、特許文献２では、主粒度、粗粒度、細粒度の超砥粒をビトリファイド結合剤で結合した砥石が開示され、このような砥石では、目立てが容易で、研削焼や切粉の目詰まり、溶着が発生しにくく砥粒の保持力に優れることが記載されている。 According to Patent Document 1, by using electrolytic grinding process grinding using a grinding wheel having a plurality of peak particle sizes in the particle size distribution of abrasive grains, the finished surface roughness is small and high-efficiency grinding can be performed. Is disclosed. Further, Patent Document 2 discloses a grindstone in which main abrasive grains, coarse grain sizes, and fine grain superabrasive grains are bonded with a vitrified binder. Such a grindstone is easy to sharpen, and clogging of grinding and cutting chips. Further, it is described that welding hardly occurs and the holding power of abrasive grains is excellent.
しかしながら、上記特許文献１、２に記載されている研削用砥石を用いて、切削工具等のエッジを有する被削材を研削加工すると、エッジに欠けが発生する場合があった。また、近年において、砥石の寿命をさらに延ばすことが求められていた。 However, when a grinding material described in Patent Documents 1 and 2 is used to grind a work material having an edge such as a cutting tool, chipping may occur in the edge. In recent years, it has been required to further extend the life of the grindstone.
本発明は、研削加工時に被削材のエッジにおける欠けの発生を抑制できるとともに、長期間使用することができる研削用砥石、およびそれによって加工された切刃を有する切削工具を提供することを目的とする。 An object of the present invention is to provide a grinding wheel that can suppress the occurrence of chipping at the edge of a work material during grinding and can be used for a long period of time, and a cutting tool having a cutting blade machined thereby. And
本発明の研削用砥石は、ダイヤモンド砥粒を結合材で結合してなる砥石部を有して、前記砥石部の断面の研磨面において、前記ダイヤモンド砥粒の粒径分布に複数のピークが存在し、該ピークのピークトップの粒径はいずれも２０μｍ以下であるとともに、前記複数のピークにおける面積が大きい２つのピークのうち、粒径が小さい方を小粒径のピークとし、粒径が大きい方を大粒径のピークとしたとき、小粒径のピークトップの粒径ｐ１と大粒径のピークトップの粒径ｐ２との粒径比ｄｐ（ｐ１／ｐ２）が０．０１〜０．４であり、前記小粒径のピークトップのピーク高さｈ１と前記大粒径のピークトップのピーク高さ
ｈ２の比（ｈ１／ｈ２）が１０〜５０である。
The grinding wheel of the present invention has a grindstone portion formed by bonding diamond abrasive grains with a binder, and a plurality of peaks exist in the particle size distribution of the diamond abrasive grains on the polished surface of the cross section of the grindstone portion. The peak top particle size of each of the peaks is 20 μm or less, and of the two peaks having a large area in the plurality of peaks, the smaller particle size is defined as the small particle size peak, and the particle size is large. When the peak is the large particle size peak, the particle size ratio dp (p1 / p2) between the small particle size peak top particle size p1 and the large particle size peak top particle size p2 is 0.01-0. The ratio (h1 / h2) of the peak height h1 of the peak top with the small particle size to the peak height h2 of the peak top with the large particle size is 10-50.
本発明の切削工具の製造方法は、研削用砥石を用いて研削加工して、切削工具の少なくとも切刃を形成する工程を有する。
The manufacturing method of the cutting tool of this invention has the process of grinding using the grindstone and forming the cutting blade of a cutting tool at least.
本発明によれば、砥石部の表面に露出する砥粒にかかる荷重が分散されて、各砥粒が被削材に対して局所的に過剰な負荷をかけることがない。そのため、研削加工時に被削材の
エッジにおける欠けの発生を抑制できる。そのため、本発明の研削用砥石を用いて加工された切削工具の切刃においては、切刃稜線の凹凸が小さくなり、これによって、切刃のチッピングや偏摩耗が抑制される。また、研削用砥石においては、砥粒の脱落も抑制できるため、砥石部の摩耗を抑制でき、研削用砥石を長く使用することができる。
According to the present invention, the load applied to the abrasive grains exposed on the surface of the grindstone portion is dispersed, and each abrasive grain does not locally apply an excessive load to the work material. Therefore, it is possible to suppress the occurrence of chipping at the edge of the work material during grinding. Therefore, in the cutting blade of the cutting tool processed using the grinding wheel of the present invention, the unevenness of the cutting edge ridge line is reduced, thereby suppressing chipping and uneven wear of the cutting edge. Moreover, in the grinding wheel, since the falling of the abrasive grains can be suppressed, wear of the grinding wheel portion can be suppressed, and the grinding wheel can be used for a long time.
図１の研削用砥石１は、（ａ）概略斜視図、（ｂ）（ａ）のＡ−Ａ断面図に示すように、リング状の台金２の外周面に砥石部３が貼り付けまたは接合されている。砥石部３は、砥粒を結合材で結合してなる。砥粒は、ダイヤモンド、立方晶窒化硼素（ｃＢＮ）、炭化珪素（ＳｉＣ）、酸化アルミニウム（Ａｌ２Ｏ３）、窒化珪素（Ｓｉ３Ｎ４）等の硬質材からなる。結合相は、ビトリファイド結合材、メタル結合材、レジン結合材が使用できる。 As shown in (a) a schematic perspective view and (b) (A) cross-sectional view of FIG. 1, the grinding wheel 1 of FIG. 1 has a grinding stone portion 3 attached to the outer peripheral surface of a ring-shaped base metal 2. It is joined. The grindstone unit 3 is formed by bonding abrasive grains with a binder. The abrasive grains are made of a hard material such as diamond, cubic boron nitride (cBN), silicon carbide (SiC), aluminum oxide (Al 2 O 3 ), or silicon nitride (Si 3 N 4 ). As the binder phase, a vitrified binder, a metal binder, or a resin binder can be used.
本実施態様においては、砥石部３の断面について研磨した研磨面の走査型顕微鏡写真について、画像解析装置を用いて砥粒の粒径分布を測定した際に、図３に示すように複数のピークが存在する。これらのピークのピークトップの粒径はいずれも２０μｍ以下であるとともに、小粒径のピークトップの粒径ｐ１と大粒径のピークトップの粒径ｐ２との粒径比ｄｐ（ｐ１／ｐ２）が０．０１〜０．４である。なお、小粒径の砥粒と大粒径の砥粒は、ピークトップｐ１、ｐ２を頂点とする各ピークの裾野までの粒径の範囲内の砥粒と定義する。すなわち、小粒径の砥粒と大粒径の砥粒、さらに他の粒径の砥粒との境界は、隣接するピークの谷部とする。 In this embodiment, when the particle size distribution of the abrasive grains is measured using an image analysis device for the scanning micrograph of the polished surface of the grindstone section 3, a plurality of peaks are obtained as shown in FIG. 3. Exists. The particle size of the peak tops of these peaks is 20 μm or less, and the particle size ratio dp (p1 / p2) between the particle size p1 of the small particle size peak and the particle size p2 of the large particle size peak top. Is 0.01 to 0.4. In addition, the abrasive grains having a small particle diameter and the abrasive grains having a large particle diameter are defined as abrasive grains within the range of the particle diameter from the peak tops p1 and p2 to the base of each peak. That is, the boundary between the small grain size abrasive grains, the large grain size abrasive grains, and the other grain size abrasive grains is a valley of adjacent peaks.
これによって、砥石部３の表面に露出した砥粒にかかる荷重が分散されて、砥粒が被削材に対して過剰に負荷をかけることがないので、研削加工時に被削材のエッジにおける欠けの発生が抑制できる。そのため、例えば、図２の切削工具１１の切刃部１６を、砥石１を用いて加工した際には、切刃稜線の凹凸が小さくなるので、チッピングや偏摩耗が抑制される。また、砥石１の砥粒の脱落も抑制できるため、砥石１の摩耗を抑制でき、砥石１を長く使用することができる。ｄｐの望ましい範囲は０．１〜０．２５、特に望ましくは０．１２〜０．２２である。 As a result, the load applied to the abrasive grains exposed on the surface of the grindstone 3 is dispersed, and the abrasive grains do not excessively load the work material. Can be suppressed. Therefore, for example, when the cutting edge portion 16 of the cutting tool 11 of FIG. 2 is processed using the grindstone 1, the unevenness of the cutting edge ridge line is reduced, so that chipping and uneven wear are suppressed. Moreover, since the fall of the abrasive grains of the grindstone 1 can be suppressed, wear of the grindstone 1 can be suppressed, and the grindstone 1 can be used for a long time. A desirable range of dp is 0.1 to 0.25, particularly preferably 0.12 to 0.22.
なお、本発明における砥粒の粒径分布は、砥石部３の研磨面の走査型顕微鏡写真から各砥粒の面積を算出し、この面積を円に換算したときの直径をその砥粒の粒径とする。このとき、粒径は有効数字１ケタ（ただし、粒径が１０μｍ以上では２ケタ）に四捨五入した値とする。砥石部３の研磨面の任意の箇所における砥粒の粒径を、砥粒５０個以上について測定する。１か所の観察で砥粒が５０個以上存在しないときは、任意の複数箇所を観察して合計で５０個以上となるようにすればよい。そして、横軸に砥粒の粒径を、縦軸に砥粒の個数を取って、粒径分布を求める。また、研磨面においては、砥粒が脱落した空隙が存在することがあるが、この空隙も砥粒が脱落したものとみなして、空隙の面積から脱落した砥粒の粒径を算出する。 In addition, the particle size distribution of the abrasive grains in the present invention is calculated by calculating the area of each abrasive grain from a scanning micrograph of the polished surface of the grindstone portion 3, and converting the area into a circle to the diameter of the abrasive grain. The diameter. At this time, the particle size is a value obtained by rounding off to one significant digit (however, it is two digits when the particle size is 10 μm or more). The particle size of the abrasive grains at any location on the polishing surface of the grindstone unit 3 is measured for 50 or more abrasive grains. When 50 or more abrasive grains are not present in one observation, a plurality of arbitrary locations may be observed so that the total number is 50 or more. Then, the particle size distribution is obtained by taking the grain size of the abrasive grains on the horizontal axis and the number of abrasive grains on the vertical axis. On the polished surface, there may be a void from which the abrasive grains have fallen. The void is also regarded as the abrasive grains having been dropped, and the particle size of the abrasive grains that have fallen from the area of the void is calculated.
本実施態様によれば、上記砥粒の粒径分布において小粒径のピークと大粒径のピークとの２つのピークを有するものとするために、砥粒が、ＩＳＯ８４８６−２の規定において規定される番手（＃）が、＃６００〜＃２０００のいずれかの番手の研削用砥石に使用される第２砥粒と、＃２５００〜＃１００００のいずれかの番手の研削用砥石に使用される第１砥粒とを混合する方法が挙げられる。
According to this embodiment, in order to have two peaks, a small particle size peak and a large particle size peak, in the particle size distribution of the abrasive particles, the abrasive particles are defined in ISO 8486-2. The used count (#) is used for the second abrasive grains used for the grinding wheel of any one of # 600 to # 2000, and for the grinding wheel for any of the numbers of # 2500 to # 10000. A method of mixing the first abrasive grains may be mentioned.
ここで、本実施態様によれば、小粒径のピーク、大粒径のピーク以外に他のピークが少なくとも１つ存在していてもよい。他のピークは、小粒径のピークの面積ｓ１、大粒径のピークの面積ｓ２よりも面積が小さい。すなわち、本発明においては、小粒径ピークと大粒径のピークは、砥石部３の研磨面の走査型電子顕微鏡写真において面積の大きい２つのピークと定義される。他のピークは小粒径のピークトップの粒径ｐ１よりも小粒径側に存在しても良く、小粒径のピークトップの粒径ｐ１と大粒径のピークトップの粒径ｐ２との間に存在していてもよく、大粒径のピークトップの粒径ｐ２よりも大粒径側に存在していてもよい。なお、小粒径のピークの面積と大粒径のピークの面積とは、小粒径のピークトップの粒径ｐ１、大粒径のピークトップの粒径ｐ２を頂点とする各ピークの裾野までの粒径の範囲内の砥粒と定義された、小粒径の砥粒と大粒径の砥粒、さらに他の粒径の砥粒の粒径の範囲の小粒径の砥粒と大粒径の砥粒を上記写真にて特定し、それらの面積を求めて、小粒径のピークの面積ｓ１、大粒径のピークの面積ｓ２を算出する。 Here, according to this embodiment, at least one other peak may exist in addition to the small particle peak and the large particle peak. The other peaks are smaller in area than the peak area s1 of the small particle diameter and the peak area s2 of the large particle diameter. That is, in the present invention, the small particle size peak and the large particle size peak are defined as two peaks having a large area in the scanning electron micrograph of the polished surface of the grindstone 3. The other peak may be present on the smaller particle size side than the peak top particle size p1 of the small particle size, and the small particle size peak top particle size p1 and the large particle size peak top particle size p2 It may exist in between, and may exist in the large particle size side rather than the particle size p2 of the peak top of a large particle size. The area of the peak of the small particle size and the area of the peak of the large particle size include the peak top particle size p1 of the small particle size and the base of each peak with the large particle size peak top particle size p2 as the apex. Small grain size and large grain size, and small grain size and large grain size range of other grain sizes. Abrasive grains having a particle diameter are specified in the above photograph, and their areas are determined, and a peak area s1 having a small particle diameter and an area s2 having a large particle diameter are calculated.
本実施態様によれば、小粒径のピークトップのピーク高さｈ１と大粒径のピークトップのピーク高さｈ２との比ｈｐ（ｈ１／ｈ２）が１０〜５０である。これによって、砥石部３の表面に露出した砥粒にかかる荷重がさらに分散されて、研削加工時に被削材のエッジにおける欠けの発生がさらに抑制できる。なお、ピーク高さｈは砥粒の個数である。ｈｐの望ましい範囲は、２０〜４０である。 According to this embodiment, the ratio hp (h1 / h2) between the peak height h1 of the peak top of the small particle size and the peak height h2 of the peak top of the large particle size is 10-50. Thereby, the load applied to the abrasive grains exposed on the surface of the grindstone portion 3 is further dispersed, and the occurrence of chipping at the edge of the work material can be further suppressed during grinding. The peak height h is the number of abrasive grains. A desirable range of hp is 20-40.
また、本実施態様によれば、砥石部３における砥粒の含有量が２０〜４０体積％であり、結合材の含有量が６０〜８０体積％である。すなわち、砥粒全体の集中度は３０度〜２２０度である。これによって、砥粒の保持力が高く、かつ砥石１の研削効率を高めることができる。砥粒全体の集中度の望ましい範囲は、１００度〜１５０度である。 Moreover, according to this embodiment, content of the abrasive grain in the grindstone part 3 is 20-40 volume%, and content of a binder is 60-80 volume%. That is, the concentration degree of the whole abrasive is 30 to 220 degrees. Thereby, the holding power of the abrasive grains is high, and the grinding efficiency of the grindstone 1 can be increased. A desirable range of the degree of concentration of the entire abrasive is 100 to 150 degrees.
次に、砥石１を用いて研削加工した切削工具の一実施態様について説明する。図２の切削工具１１は、切削工具１１の一方の主面がすくい面１２、側面が逃げ面１３、他方の主面が着座面１４とされており、すくい面１２と逃げ面１３とのなす交差稜線部が切刃部１６をなしている。すくい面１２には、切刃部１６に隣接してブレーカ溝１５が存在する。図２の切削工具１１は一方の主面と他方の主面が対称な形状からなり、切削工具１１をひっくり返して、他方の主面をすくい面１２に、一方の主面を着座面１４にすることができる。切刃部１６のブレーカ溝１５に隣接する部位は、上記砥石１にて研削加工されている。 Next, an embodiment of a cutting tool ground using the grindstone 1 will be described. In the cutting tool 11 of FIG. 2, one main surface of the cutting tool 11 is a rake surface 12, a side surface is a flank surface 13, and the other main surface is a seating surface 14, and the rake surface 12 and the flank surface 13 are formed. The intersecting ridge line portion forms the cutting edge portion 16. The rake face 12 has a breaker groove 15 adjacent to the cutting edge portion 16. The cutting tool 11 shown in FIG. 2 has a shape in which one main surface and the other main surface are symmetrical. The cutting tool 11 is turned over so that the other main surface is a scooping surface 12 and one main surface is a seating surface 14. can do. A portion adjacent to the breaker groove 15 of the cutting edge portion 16 is ground by the grindstone 1.
切削工具１１を製造する際の加工工程について説明する。まず、所望により、すくい面１２は、両頭研削盤を用いて着座面１４と平行になるように研削加工する、いわゆる両頭研削を施す。次に、所望により、上記研削用砥石または従来の研削用砥石を用いて逃げ面１３を研削加工する。そして、切削工具１１のすくい面１２の切刃部１６に隣接する位置に、ブレーカ溝の凹形状を形成するための凸形状からなる上記砥石１を用いてブレーカ溝１５を形成する。ブレーカ溝１５の端部である逃げ面１３との交差部には、ブレーカ溝１５の形成に伴って切刃部１６が形成される。 A processing process when manufacturing the cutting tool 11 will be described. First, if desired, the rake face 12 is subjected to so-called double-head grinding, in which the rake face 12 is ground so as to be parallel to the seating surface 14 using a double-head grinding machine. Next, if desired, the flank 13 is ground using the grinding wheel or a conventional grinding wheel. And the breaker groove | channel 15 is formed in the position adjacent to the cutting edge part 16 of the rake face 12 of the cutting tool 11 using the said grindstone 1 which consists of a convex shape for forming the concave shape of a breaker groove | channel. A cutting edge portion 16 is formed at the intersection with the flank 13 which is an end portion of the breaker groove 15 along with the formation of the breaker groove 15.
本実施態様では、ブレーカ溝１５を形成する際に切刃部１６に欠けが発生しにくく、滑らかな切刃部１６となる。そのため、切刃部１６の切削抵抗が低く、切削工具１１の欠損を抑制することができるとともに、切刃部１６によって切削加工される被削材の切削加工面は平滑となる。さらに、切刃部１６には、所望により、ブラシ研磨、ブラスト研磨、砥石研磨等によって、切刃部１６にホーニング加工を施してもよい。 In this embodiment, when the breaker groove 15 is formed, the cutting edge portion 16 is less likely to be chipped, resulting in a smooth cutting edge portion 16. For this reason, the cutting resistance of the cutting edge portion 16 is low, the chipping of the cutting tool 11 can be suppressed, and the cutting surface of the work material cut by the cutting edge portion 16 becomes smooth. Furthermore, the cutting blade portion 16 may be subjected to honing by brush polishing, blast polishing, grinding wheel polishing, or the like, if desired.
まず、表１に示す番手のダイヤモンド砥粒を表１に示す混合比率で混合し、この混合砥粒３０体積％に対して、ビトリファイド結合材を７０体積％の比率で添加し、これに有機バインダを添加し、造粒して、成形用の顆粒粉末を調整した。これを所定の形状に成形し、焼成してリング状の砥石部を作製した。砥石部に含有される砥粒の集中度は１２５度であった。得られた砥石部は、接着剤を用いてリング状の台金の外周面に貼り付けて砥石を作製した。 First, the diamond abrasive grains having the counts shown in Table 1 were mixed at a mixing ratio shown in Table 1, and a vitrified binder was added at a ratio of 70 volume% to 30 volume% of the mixed abrasive grains, and an organic binder was added thereto. Was added and granulated to prepare a granulated powder for molding. This was formed into a predetermined shape and fired to produce a ring-shaped grindstone. The concentration of the abrasive grains contained in the grindstone was 125 degrees. The obtained grindstone part was affixed on the outer peripheral surface of the ring-shaped base metal using an adhesive to produce a grindstone.
得られた砥石に対して、砥石部の断面を研磨した研磨面を観察し、各砥粒の面積を算出して砥粒の粒径を求めた。そして、横軸に砥粒の粒径を、縦軸に砥粒の個数を取って、粒径分布を求めた。この粒径分布から、ピークトップの粒径ｐ１、ｐ２、およびこれらよりも個数が少ないピークトップの粒径ｐ３の有無とそれらのピーク高さ（ｈ１、ｈ２、ｈ３）、比ｄｐ（ｐ１／ｐ２）、比ｈｐ（ｈ１／ｈ２）を求めた。結果は表１に示した。 With respect to the obtained grindstone, the polished surface obtained by polishing the cross section of the grindstone portion was observed, and the area of each abrasive grain was calculated to obtain the grain size of the abrasive grain. Then, the particle size distribution was obtained by taking the grain size of the abrasive grains on the horizontal axis and the number of abrasive grains on the vertical axis. From this particle size distribution, the presence / absence of the peak top particle size p1, p2 and the peak top particle size p3 smaller in number than these, the peak height (h1, h2, h3), the ratio dp (p1 / p2) ) And the ratio hp (h1 / h2). The results are shown in Table 1.
次に、上記砥石を用いて、サーメット（京セラ製サーメット：材種ＴＮ６０）製切削工具（型番TNGG160404L-S）のブレーカ溝を研削加工した。４００個研削加工して、各切削
工具の３つの切刃部を金属顕微鏡で観察し、欠けの有無を確認し、欠けの発生率を表２に示した。また、砥石で研削加工して形成されるブレーカ溝の曲面の曲率半径は初期値１．４ｍｍφであるが、この曲率半径が１．６ｍｍφに変化したときを砥石の寿命として、各砥石の寿命に至るまでに加工できた切削工具のコーナー数を表２に示した。
Next, a breaker groove of a cutting tool (model number TNGG160404L-S) made of cermet (Kyocera cermet: grade TN60) was ground using the above grindstone. 400 pieces were ground and the three cutting edges of each cutting tool were observed with a metal microscope to confirm the presence or absence of chips. Table 2 shows the incidence of chips. In addition, the radius of curvature of the curved surface of the breaker groove formed by grinding with a grindstone is an initial value of 1.4 mmφ. When the radius of curvature changes to 1.6 mmφ, the life of the grindstone is taken as the life of each grindstone. Table 2 shows the number of corners of the cutting tool that could be processed to date.
次に、加工開始から４００個目の切削工具を用いて、下記の条件において、切削試験を行い、切削性能を評価した。結果は表２に示した。
被削材 ：合金鋼（ＳＣＭ４３５）
切削速度：２００ｍ／分
送り速度：０．２ｍｍ／ｒｅｖ
切り込み：１．５ｍｍ
その他 ：水溶性切削液使用
評価項目：切削可能な被削材の個数を測定。
Next, a cutting test was performed using the 400th cutting tool from the start of processing under the following conditions to evaluate the cutting performance. The results are shown in Table 2.
Work material: Alloy steel (SCM435)
Cutting speed: 200 m / min Feed speed: 0.2 mm / rev
Cutting depth: 1.5mm
Others: Use of water-soluble cutting fluid Evaluation item: Measures the number of workable materials.
表１、２の結果によれば、砥粒の粒径分布において１つのピークのみが存在する試料Ｎｏ．１、大粒径のピークトップの粒径ｐ２が２０μｍより大きい試料Ｎｏ．２、小粒径のピークトップの粒径ｐ１と大粒径のピークトップの粒径ｐ２との粒径比ｄｐが０．４よりも大きい試料Ｎｏ．３、小粒径のピークトップの粒径ｐ１と大粒径のピークトップｐ２の粒径との粒径比ｄｐが０．０１よりも小さい試料Ｎｏ．４では、切削工具の切刃の欠けが多く、砥石の寿命も短いものであった。 According to the results of Tables 1 and 2, sample No. 1 in which only one peak exists in the particle size distribution of the abrasive grains. 1. Sample No. 1 in which the particle size p2 of the peak top having a large particle size is larger than 20 μm. 2. Sample No. 2 in which the particle size ratio dp between the peak top particle size p1 of the small particle size and the peak top particle size p2 of the large particle size is larger than 0.4. 3. Sample No. 3 in which the particle size ratio dp between the particle size p1 of the peak top with a small particle size and the particle size of the peak top p2 with a large particle size is smaller than 0.01. In No. 4, the cutting tool had many chips, and the grinding wheel had a short life.
一方、本発明の範囲内である試料Ｎｏ．５〜７においては、切削工具の切刃の欠けが抑制され、砥石の寿命が長く、切削工具の寿命も良好であった。 On the other hand, Sample No. which is within the scope of the present invention. In Nos. 5 to 7 , chipping of the cutting edge of the cutting tool was suppressed, the life of the grindstone was long, and the life of the cutting tool was also good.
１・・・研削用砥石（砥石）
２・・・台金
３・・・砥石部
１１・・切削工具
１２・・すくい面
１３・・逃げ面
１４・・着座面
１５・・ブレーカ溝
１６・・切刃部
1 ... Grinding wheel (grinding wheel)
2 ... Base 3 ... Grinding wheel 11 · · Cutting tool 12 · · Rake face 13 · · Flank 14 · · Seating surface 15 · · Breaker groove 16 · · Cutting edge
Claims (5)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014082033A JP6442153B2 (en) | 2014-04-11 | 2014-04-11 | Grinding wheel and cutting tool manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014082033A JP6442153B2 (en) | 2014-04-11 | 2014-04-11 | Grinding wheel and cutting tool manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2015202529A JP2015202529A (en) | 2015-11-16 |
| JP6442153B2 true JP6442153B2 (en) | 2018-12-19 |
Family
ID=54596323
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014082033A Active JP6442153B2 (en) | 2014-04-11 | 2014-04-11 | Grinding wheel and cutting tool manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6442153B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20210149441A (en) * | 2020-06-02 | 2021-12-09 | 주식회사 세한텍 | Wheel for grinding glass sheet and manufacturing method thereof |
| KR20210149440A (en) * | 2020-06-02 | 2021-12-09 | 주식회사 세한텍 | Wheel for grinding glass sheet and manufacturing method thereof |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5451090A (en) * | 1977-09-29 | 1979-04-21 | Mitsui Kensaku Toishi Kk | Vitrified grinding stone mixed with cubic boron nitride |
| JPS5524813A (en) * | 1978-08-03 | 1980-02-22 | Showa Denko Kk | Alumina grinding grain |
| JPS6048263A (en) * | 1983-08-29 | 1985-03-15 | Tokyo Daiyamondo Kogu Seisakusho:Kk | Synthetic type free ring cup boron-nitride grindstone for setting of band saw for wooden work |
| JPS63200970A (en) * | 1987-02-17 | 1988-08-19 | Hitachi Ltd | Grinding wheel |
| JPH03239475A (en) * | 1990-02-14 | 1991-10-25 | Nippon Seiko Kk | Superfinishing grinding wheel |
| ZA943646B (en) * | 1993-05-27 | 1995-01-27 | De Beers Ind Diamond | A method of making an abrasive compact |
| JPH0796464A (en) * | 1993-09-28 | 1995-04-11 | Toyoda Mach Works Ltd | Vitrified grinding wheel with super hard abrasive grain |
| JPH0985627A (en) * | 1995-09-26 | 1997-03-31 | Matsushita Electric Ind Co Ltd | Grinding wheel |
| JP2000246647A (en) * | 1999-03-01 | 2000-09-12 | Noritake Co Ltd | Vitrified extra-abrasive grain grinding wheel and manufacture thereof |
| JP3542520B2 (en) * | 1999-06-01 | 2004-07-14 | 株式会社ノリタケカンパニーリミテド | Vitrified whetstone |
| CN101506397B (en) * | 2006-07-28 | 2014-06-25 | 六号元素（产品）（控股）公司 | Abrasive compacts |
| EP2049306B1 (en) * | 2006-07-31 | 2013-07-03 | Element Six Abrasives S.A. | Abrasive compacts |
| JP2011140097A (en) * | 2010-01-08 | 2011-07-21 | Noritake Co Ltd | Grindstone |
| US8651203B2 (en) * | 2011-02-17 | 2014-02-18 | Baker Hughes Incorporated | Polycrystalline compacts including metallic alloy compositions in interstitial spaces between grains of hard material, cutting elements and earth-boring tools including such polycrystalline compacts, and related methods |
-
2014
- 2014-04-11 JP JP2014082033A patent/JP6442153B2/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20210149441A (en) * | 2020-06-02 | 2021-12-09 | 주식회사 세한텍 | Wheel for grinding glass sheet and manufacturing method thereof |
| KR20210149440A (en) * | 2020-06-02 | 2021-12-09 | 주식회사 세한텍 | Wheel for grinding glass sheet and manufacturing method thereof |
| KR102341351B1 (en) | 2020-06-02 | 2021-12-21 | 주식회사 세한텍 | Wheel for grinding glass sheet and manufacturing method thereof |
| KR102432920B1 (en) * | 2020-06-02 | 2022-08-17 | 주식회사 세한텍 | Wheel for grinding glass sheet and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2015202529A (en) | 2015-11-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4860689B2 (en) | Cutting tip for cutting tool and cutting tool | |
| JP4742845B2 (en) | Method for processing chamfered portion of semiconductor wafer and method for correcting groove shape of grindstone | |
| CN104411430B (en) | Cutting element | |
| JP5740673B2 (en) | cBN cutting tools | |
| JP4957000B2 (en) | Cutting tools | |
| JP6442153B2 (en) | Grinding wheel and cutting tool manufacturing method | |
| JP5464493B2 (en) | Cutting insert | |
| JP2017170554A (en) | Vitrified grindstone for low pressure lapping for lapping machine and polishing method using the same | |
| JP3086667B2 (en) | Super abrasive whetstone | |
| CN105500226A (en) | Novel ultrahard abrasive grinding wheel | |
| JP2015202528A (en) | Grinding wheel and cutting tool processed thereby | |
| JP2014205225A (en) | Grinding abrasive wheel for high-hardness brittle material | |
| CN113329846B (en) | Metal bond grindstone for high-hardness brittle material | |
| JP2015091627A (en) | Cbn cutting tool | |
| KR102221333B1 (en) | Abrasive tools | |
| JP2652020B2 (en) | How to sharpen ceramic blades | |
| JP2012254486A (en) | Extra-high pressure sintered rotary cutting tool | |
| JP6918217B2 (en) | Polycrystalline abrasive grains and grinding wheels equipped with them | |
| CN213795982U (en) | Diamond roller with controllable three-dimensional distribution of abrasive materials | |
| JP2018043312A (en) | Cup type vitrified grind stone for grind stone | |
| CN209050619U (en) | A kind of integrated grinding wheel of corase grinding fine grinding | |
| KR100959022B1 (en) | Cutter?wheel and method of manufacturing the same | |
| JP2016190317A (en) | CBN Cutting tool | |
| JP3537367B2 (en) | Milling tools | |
| JP2007015054A (en) | Resin bonded super-grinding tool and grinding wheel using the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20170222 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20171130 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20180109 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20180309 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20180703 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20180903 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20181025 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20181126 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 6442153 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |