JP6442123B2 - Manufacturing method of ceramic wiring board - Google Patents

Description

The present invention provides a ceramic wiring board having a through-hole penetrating between a surface of a substrate body made of ceramic and a mounting surface facing the surface, or having a recess opening at least on the mounting surface of the substrate body. The present invention relates to a method for manufacturing a plate .

In general, a multilayer ceramic wiring board includes a step of forming through holes for via holes or cavities for a plurality of green sheets, a step of filling a conductive paste in the through holes for via holes, A step of printing a conductive paste to be a wiring layer of a predetermined pattern on at least one surface, a step of laminating and temporarily joining a plurality of such green sheets, a step of pressure-bonding the obtained green sheet laminate, and pressure bonding In the case of taking a large number of green sheet laminates, a step of dividing into individual ceramic wiring boards is further performed after the firing step (see, for example, Patent Document 1).
In addition, the process of forming the through-hole which penetrates a multilayer ceramic wiring board is performed in the state of the green sheet laminated body obtained by temporary joining, and a crimping | compression-bonding process is performed after that.

  By the way, in the step of forming a relatively large-diameter through-hole such as the cavity, a die having a through-hole with respect to the green sheet, and a punch into which a tip portion enters the through-hole via a predetermined clearance, When punching is performed, fine irregularities are formed along the periphery of the mounting surface in the opening portion of the through hole that penetrates between the surface of the green sheet and the mounting surface facing the surface. The Such irregularities remain in the form of plastic deformation in addition to being crushed or broken into fine ceramic pieces when the green sheet laminate is pressed in the thickness direction in the crimping step. There are cases where it is fired as it is. When firing with the unevenness remaining, for example, after mounting electronic components on each surface terminal formed on the surface of the obtained multilayer ceramic wiring board opposite to the mounting surface where the unevenness is located In the process, if the placement surface on which the unevenness is located is placed on the surface of the surface plate, the posture of the multilayer ceramic wiring board becomes unstable. As a result, there are cases where the mounting position of the electronic component is shifted or the electronic component is mounted in an inclined posture.

JP 2013-243131 A (pages 1-14, FIGS. 1-11)

The present invention solves the problems described in the background art, and includes a through-hole penetrating between the surface of the substrate body and the mounting surface facing the surface, or a recess opening at least on the mounting surface, be mounted to the mounting surface on the surface plate, to provide a method of manufacturing a ceramic circuit board reliably maintain the stable position, it is an object.

Means for Solving the Problems and Effects of the Invention

In order to solve the above-mentioned problems, the present invention provides an inclined surface or a curved surface that is lowered on the surface facing the mounting surface on the mounting surface along the opening of the through hole or the recess that opens on the mounting surface. It was conceived to form a surface.
That is, the ceramic wiring board which result obtained in the present invention, or a ceramic layer of a single layer, or formed by laminating a plurality of ceramic layers, and the substrate body and having a mounting surface facing the surface and the surface A ceramic wiring board having a through-hole penetrating between the surface and the mounting surface of the substrate body, or a recess opening at least on the mounting surface, the mounting surface surrounding the opening of the through-hole or along the mounting surface surrounding the opening of the recess, inclined or curved surface is formed, such inclined surface or curved surface that has fallen toward the surface side.

If due to this, said inclined or curved surface on the inner peripheral side of the mounting surface surrounding the opening of the through-hole or recess is formed, the mounting surface surrounding the opening of the through-hole or recess, prefabricated The fine unevenness which has occurred in the punching process at the time is removed.
Therefore, for example, in the process of mounting an electronic component such as an IC chip on the surface side of the ceramic wiring board later, the mounting surface is brought into surface contact with the surface plate, thereby maintaining the ceramic wiring board in a stable posture. Therefore, it is possible to reliably perform appropriate and accurate mounting.
Examples of the electronic component include a hybrid IC, a power module, a light emitting diode, and the like that can ensure heat dissipation by being mounted across the through hole.
Further, in the process of mounting the ceramic wiring board (electronic component device) on which the electronic component is mounted on the motherboard, the ceramic wiring board is maintained in a stable posture by bringing the mounting surface into surface contact with the surface of the motherboard. On the other hand, it is possible to reliably carry out mounting with high accuracy.

The ceramic layer is made of a high-temperature fired ceramic such as alumina, or a low-temperature fired ceramic such as glass-ceramic.
The mounting surface is a surface that faces the surface and contacts the surface plate on which the ceramic wiring substrate is placed when the electronic component is mounted on the surface of the ceramic wiring substrate. When the ceramic wiring board (electronic component device) mounted on the surface is mounted on the motherboard, it is also a surface that contacts the mounting surface of the motherboard.
Further, the front surface and the mounting surface are opposed to each other in the substrate body, and are also surfaces having a relative positional relationship such as a front surface and a back surface.
Further, the placement surface has the inclined surface or the curved surface along the entire circumference on the opening side of the through-hole or the recess, and has a flat surface on the outer peripheral side, A form in which the entire mounting surface is composed only of the inclined surface or the curved surface is also included. Among such forms, the placement surface described above has an inclined surface or a curved surface along the entire circumference on the opening side of the through hole or recess, and a form having a flat surface on the outer peripheral side thereof. It is more desirable because the ceramic wiring board can be placed in a more stable posture.
Furthermore, in the form in which the substrate body is formed of a single ceramic layer, a surface conductor layer such as an external terminal is individually formed on and connected between at least one of the surface and a mounting surface facing the surface. Via conductors that penetrate through the thickness direction.
Further, in the form in which the substrate body is formed by laminating a plurality of ceramic layers, a surface conductor layer such as an external terminal is formed on at least one of the surface and the mounting surface facing the surface, and the internal conductor layer is provided between the ceramic layers. And a plurality of via conductors connecting between the surface conductor layer and the inner conductor layer penetrate along the thickness direction.
In addition, the through-hole or the concave portion includes, for example, a shape that is rectangular (square or rectangular) in a plan view, and a shape that is rounded at each corner.

Further, in the ceramic wiring board, the thickness of the inclined surface or the curved surface on the opening side of the through hole or the concave portion is in the range of 5 μm to 50 μm than the thickness on the peripheral side of the mounting surface in the substrate body. with small, mediolateral width of the inclined surface or curved surface, Ru der least 50 [mu] m.
If due to this, during the punching to form through holes or recesses machined during manufacture, the fine irregularities are formed along the entire circumference of the mounting surface surrounding the opening of the through hole or recess, the In the pressure-bonding step for forming the inclined surface or the curved surface, it is surely crushed and the above-mentioned mounting surface is formed into a uniform flat surface along at least the periphery thereof. Therefore, the mounting process of the electronic component applied to the surface side of the ceramic wiring board and the process of mounting the ceramic wiring board on which the electronic component is mounted on the motherboard are performed with appropriate and high accuracy. that that Do not possible.
In addition, when the range in the difference in thickness is less than 5 μm, it may be difficult to avoid the influence of the fine unevenness in the green sheet or the green sheet laminate even if the inclined surface or the curved surface is formed. When the difference exceeds 50 μm, the opening side of the inclined surface or curved surface becomes too deep from the peripheral side, and is visually conspicuous as a deformation. Therefore, the range is set to avoid such a situation.

On the other hand, a method for manufacturing a ceramic wiring board according to the present invention (Claim 1 ) comprises a ceramic wiring board comprising a single ceramic layer and having a through hole between a surface and a mounting surface facing the surface, or A method for manufacturing a ceramic wiring board, comprising a plurality of ceramic layers laminated, having a through hole between a surface and a mounting surface facing the surface, or having at least a recess opening in the mounting surface. A green sheet body made of a single-layer green sheet and having a through-hole between the surface and a mounting surface facing the surface, or a plurality of green sheets laminated, facing the surface and the surface A step of preparing a green sheet laminate having a through-hole between the mounting surface or at least a recess opening in the mounting surface; and the width of the through-hole or the recess in a plan view The green sheet body or the green sheet laminate is placed on a metal plate having a large-width convex portion protruding on the surface so that the convex portion closes the opening of the through hole or the concave portion. Pressure is applied along the thickness direction from the surface side of the sheet body or the green sheet laminate toward the mounting surface side, and the pressure decreases toward the surface side along the mounting surface surrounding the opening of the through hole or the recess. And a step of forming an inclined surface or a curved surface.

According to this, the convex part of the metal plate closes the opening part of the through hole or the concave part, that is, the opening part of the through hole or concave part overlaps the top surface of the convex part of the metal plate. A step of forming the inclined surface or the curved surface with respect to the green sheet body or the green sheet laminated body is performed in the mounted state. As a result, since the inclined surface or the curved surface can be reliably formed on the mounting surface surrounding the opening of the through hole or the recess, the fine surface located on the mounting surface surrounding the opening of the through hole or the recess is fine. Unevenness can be reliably removed.
Therefore, for example, in the step of mounting the electronic component on the surface side later, by placing the mounting surface in surface contact with the surface plate, it is possible to mount the ceramic wiring board in an appropriate and high accuracy while maintaining a stable posture. It is possible to perform reliably. Further, in the step of mounting the ceramic wiring board on which the electronic component is mounted on the mother board, the mounting surface is brought into surface contact with the mother board, so that the ceramic wiring board is maintained in a stable posture, and appropriate and accurate. It is also possible to reliably carry a high load.

The green sheet contains, for example, alumina as a main component, as well as aluminum nitride, mullite, glass-alumina (ceramic) and the like as a main component.
Further, the single-layer green sheet body has a surface conductor layer such as an external terminal formed on at least one of the surface or a mounting surface opposed to the surface, and via conductors connecting between them are along the thickness direction. Penetrated.
Furthermore, the green sheet laminate has a surface conductor layer such as an external terminal formed on at least one of the surface and a mounting surface facing the surface, and an internal conductor layer is disposed between the green sheet layers. The via conductor connecting the surface conductor layer and the internal conductor layer penetrates along the thickness direction.
Further, in the preparation step, a single layer or return layer green sheet is punched, and the punching and provisional lamination (joining) steps are performed.

Furthermore, the width of the top surface of the through hole, the concave portion, or the convex portion is a length along the same side or a diagonal length when they are rectangular (square or rectangular) in plan view. In the case of exhibiting a circular shape in plan view, it is the inner diameter of each.
Further, the inclined surface or the curved surface is formed into any one shape depending on various conditions in the process of forming them.
Further, after the step of forming the inclined surface or the curved surface, a firing step is performed on the obtained single-layer green sheet or green sheet laminate.
In addition, when the preparation step, the laminating step, and the step of forming the inclined surface or the curved surface are performed in a multi-cavity form, after the step of forming the inclined surface or the curved surface, a firing step and individual steps The process of dividing into individual wiring boards is performed.

In addition, the present invention includes a method for manufacturing a ceramic wiring board (Claim 2 ), wherein the protrusion protruding from the surface of the metal plate has a rectangular or trapezoidal vertical cross-sectional shape.
According to this, in the state where the shape of the vertical section of the convex portion is rectangular or trapezoidal, and the top surface of the convex portion and the opening of the through hole or concave portion are placed on top of each other, the green sheet A step of forming the inclined surface or the curved surface on the body or the green sheet laminate is performed. Therefore, the fine unevenness can be surely eliminated, and it is easy to make the resulting inclined surface or curved surface descending to the surface side relatively inconspicuous.
In addition, the metal plate having the convex portion is made of a relatively thin stainless steel plate or the like, and one surface of the steel plate or the like is subjected to, for example, etching.
In addition, the overlapping range of the width of the opening of the through hole or the concave portion and the width of the top surface of the convex portion is about 10 to 150 μm, desirably about 50 to 100 μm.

Further, in the present invention, the step of forming the inclined surface or the curved surface includes the step of forming a release material sheet or a release agent layer between the metal plate having the convex portion and the green sheet body or the green sheet laminate. A method for manufacturing a ceramic wiring board (Claim 3 ) is also included.
According to this, in the step of forming the inclined surface or the curved surface, the mounting surface of the green sheet body or the green sheet laminate is in close contact with the surface of the metal plate including the convex portion at the end of the step. The situation that disappears can be surely prevented. Moreover, it is possible to protect the surface of the metal plate including the convex portions for a long period of time.
In addition, since the said resin film also has a mold release effect | action, the vertical cross section of the convex part of the said metal plate is applicable with respect to both forms with a rectangle (square or a rectangle) shape and trapezoid shape.
The release material sheet includes a resin film or paper.
Further, the release agent layer may be formed by coating a liquid or jelly-like release agent by a spray method or the like.
In addition, when the vertical cross section of the convex portion of the metal plate is rectangular and a release material sheet is used, a curved surface tends to be easily formed on the mounting surface surrounding the opening of the through hole, and the convex portion When the part has a trapezoidal vertical cross section and a release material sheet is used, an inclined surface tends to be easily formed.

In addition, the present invention includes the steps of forming a pre-Symbol inclined surfaces or curved surfaces, also serves as a crimping process of the green sheet laminate, a manufacturing method of a ceramic wiring board (claim 4) is also included.
In this case, since the step of forming the inclined surface or the curved surface can be performed simultaneously with the pressure bonding step of the green sheet laminate, the ceramic wiring board having the inclined surface or the curved surface without increasing the number of manufacturing steps. Can be manufactured efficiently. This also applies to the multi-cavity form.

Vertical cross-sectional view showing an embodiment of the ceramic wiring board more obtained in the present invention. The vertical sectional view which shows the deformation | transformation form of the said ceramic wiring board. Vertical cross-sectional view showing a ceramic wiring substrate of different forms more obtained in the present invention. The vertical sectional view which shows the application form of the said ceramic wiring board. (A), (B) is the vertical sectional view which shows the outline of the crimping | compression-bonding process in the manufacturing method of the said ceramic wiring board by this invention. (A), (B) is a vertical sectional view showing the details of the crimping step in the manufacturing method, and (C) is a vertical sectional view showing the obtained green sheet laminate. (A), (B) is a vertical cross-sectional view showing details of the crimping process of a different form in the manufacturing method, (C) is a vertical cross-sectional view showing the obtained green sheet laminate.

Hereinafter, modes for carrying out the present invention will be described.
Figure 1 is a vertical sectional view showing a ceramic wiring substrate 1a of a form which therefore obtained with the present invention. As shown in FIG. 1, the ceramic wiring substrate 1 a is formed by laminating a plurality of ceramic layers s <b> 1 to s <b> 3, and includes a substrate body 2 a having a front surface 3 and a mounting surface (back surface) 4 facing the front surface 3. The through hole 5 passing through the central portion between the surface 3 and the mounting surface 4 is positioned along the entire circumference of the mounting surface 4 surrounding the opening of the through hole 5, and the bottom view is rectangular. And an inclined surface 10 having a frame shape. A plurality of external terminals (surface conductor layers) 6 are formed on the surface 3, a plurality of external terminals 7 are also formed on the mounting surface 4, and a predetermined pattern is provided between the ceramic layers s1 to s3. The internal wiring layer (inner conductor layer) 8 is formed, and between these layers, the plurality of via conductors 9 individually penetrating the ceramic layers s1 to s3 can be connected to each other.

In FIG. 1, the thicknesses of the external terminals 6 and 7 and the internal wiring layer 8 are shown to be larger than the actual thickness, and the same applies to FIGS.
The ceramic layers s1 to s3 have, for example, alumina as a main component, and the external terminals 6 and 7, the internal wiring layer 8, and the via conductor 9 are made of, for example, W or Mo.
The through-hole 5 has a rectangular (square or rectangular) shape in plan view.
Further, the inclined surface 10 is formed during the punching process of the manufacturing method described later, and the bottom view has a rectangular frame shape, and the opening side of the through hole 5 faces the surface 3 side of the substrate body 2a. It ’s going down. As shown in FIG. 1, the thickness t1 of the inclined surface 10 on the opening side of the through hole 5 is smaller (thin) in the range of about 5 to 50 μm than the thickness t2 of the peripheral portion of the inclined surface 10, The width w along the inside / outside direction (left-right direction in FIG. 1) of the inclined surface 10 is 50 μm or more. In addition, the angle θ between the inclined surface 10 and the flat mounting surface 4 located outside the inclined surface 10 is in the range of about 150 degrees to 170 degrees.

FIG. 2 is a vertical sectional view showing a ceramic wiring board 1b which is a modification of the ceramic wiring board 1a.
As shown in FIG. 2, the ceramic wiring board 1b includes the same substrate body 2a, through holes 5, external terminals 6 and 7, internal wiring layers 8, and via conductors 9 as well as the through holes 5 as shown in FIG. The curved surface 11 located along the perimeter of the mounting surface 4 surrounding the opening part is provided. The curved surface 11 is a gently curved curved surface having a vertical cross section convex toward the mounting surface 4, and the curved surface is rectangular in a bottom view along the entire circumference of the mounting surface 4 surrounding the opening of the through hole 5. It has a frame shape. The thickness on the opening side of the through hole 5 in the curved surface 11 is smaller than the thickness of the peripheral portion of the curved surface 11 in a range of about 5 to 50 μm, and the width along the inner and outer direction of the curved surface 11 is also as follows. 50 μm or more.

Furthermore, FIG. 3 is a vertical sectional view showing a ceramic wiring board 1c of different forms thus obtained in the present invention.
As shown in FIG. 3, the ceramic wiring substrate 1c includes a substrate body 2c similar to the above, a recess 15 opened in the center of the mounting surface 4 of the substrate body 2c, and a mounting surrounding the opening of the recess 15. And an inclined surface 10 positioned along the entire circumference of the placement surface 4. Instead of the inclined surface 10, a curved surface 11 similar to the above may be provided.
A plurality of external terminals 6 are formed on the surface 3 of the substrate body 2c, and a plurality of external terminals 7 are also formed on the mounting surface 4. A predetermined amount is provided between the ceramic layers s1 and s2 in the substrate body 2c. A plurality of internal wiring layers 18 having a pattern are formed, and an internal wiring layer 8 having a predetermined pattern is formed between the ceramic layers s2 and s3. The ceramic layers s1 to s3 are individually provided between these layers. It is possible to conduct each other through via conductors 9 that penetrate therethrough. The internal wiring layer 18 individually has connection terminals 17 extending to the ceiling surface (bottom surface) 16 of the recess 15 at the center side. The connection terminal 17 is electrically connected to the electrode of the electronic component mounted in the recess 15 later.

FIG. 4 is a vertical sectional view showing a ceramic wiring board 1d which is an applied form of the ceramic wiring board 1c.
As shown in FIG. 4, the ceramic wiring substrate 1d is formed by laminating a plurality of ceramic layers s1 to s6, and includes a substrate body 2d having a surface 3 and a mounting surface 4 facing the surface 3, and the surface. 3 and a pair of upper and lower recesses 15a and 15b that open at the center of the mounting surface 4, a curved surface 11 that is positioned along the entire circumference of the surface 3 that surrounds the opening of the upper recess 15a, and a lower recess 15b. And an inclined surface 10 positioned along the entire circumference of the mounting surface 4 surrounding the opening. The inclined surface 10 and the curved surface 11 may be arranged interchangeably, or both the surface 3 side and the mounting surface 4 side may be the inclined surface 10 or the curved surface 11.

  As shown in FIG. 4, a plurality of external terminals 6 are formed on the surface 3 of the substrate body 2d, and a plurality of external terminals 7 are also formed on the mounting surface 4, and the ceramic layers s1, s2 in the substrate body 2d. The same internal wiring layer 8 is formed between the ceramic layers s3 and s4 and between the ceramic layers s5 and s6. Further, an internal wiring layer 18 similar to the above is formed between the ceramic layers s2, s3 and the ceramic layers s4, s5, and vias individually penetrating the ceramic layers s1 to s6 are provided between these layers. The conductors 9 can conduct each other. The internal wiring layer 18 also individually has connection terminals 17 extending to the bottom surface 16a or the ceiling surface 16b of the recesses 15a and 15b on the center side. The connection terminal 17 is electrically connected to an electrode of an electronic component that is individually mounted in each of the recesses 15a and 15b.

According to the ceramic wiring boards 1a to 1d as described above, the inclined surface 10 or the curved surface 10 is formed along the entire circumference of the mounting surface 4 surrounding the opening of the through hole 5 or the recesses 15 and 15b. Fine irregularities that have occurred in the manufacturing process in advance are removed from the mounting surface 4 surrounding the through holes 5 or the openings of the recesses 15 and 15b.
In addition, the thickness (t1) of the inclined surface 10 or the curved surface 11 on the through hole 5 or the opening side of the recesses 15 and 15b is the thickness (t2) on the peripheral side of the mounting surface 4 in the substrate bodies 2a, 2c and 2d. ) And the width (w) in the inner and outer directions of the inclined surface 10 or the curved surface 11 is 50 μm or more.

Therefore, for example, in the step of mounting electronic components such as IC chips on the surface 3 side of the ceramic wiring boards 1a to 1d, the ceramic wiring board 1a to the ceramic wiring board 1a to It is possible to surely perform appropriate and accurate mounting while maintaining a stable posture of 1d. Examples of the electronic component include a hybrid IC, a power module, and a light emitting diode that can obtain heat dissipation by being mounted on the surface 3 side across the through hole 5 or the recess 15a.
Further, in the step of mounting the ceramic wiring boards 1a to 1d (electronic component devices) on which the electronic components are mounted on the mother board, the mounting surface 4 is brought into surface contact with the surface of the mother board, thereby the ceramic wiring board 1a. It is possible to reliably perform mounting with high accuracy while maintaining a stable posture of ˜1d.
In addition, since the inclined surface 10 and the curved surface 11 cannot be easily visually recognized, the appearance of the ceramic wiring boards 1a to 1d is not impaired at all.

Below, the manufacturing method of the said ceramic wiring board 1a by the multi-piece manufacturing of this invention is demonstrated along FIG. 5, FIG. 5 (A) and 6 (A) mainly show the preparation step, and FIGS. 5 (B) and 6 (B) mainly show a step of forming an inclined surface. C) shows the substrate region Pa of the green sheet laminate GS having the inclined surface, and the external terminals 6, 7, the internal wiring layer 8, and the via conductor 9 are omitted in these drawings. Yes.
Preliminary amounts of alumina powder, binder resin, solvent, etc. are blended to prepare a ceramic slurry, and then the slurry is made into a sheet by the doctor blade method, so that it is relatively large and has a thickness of about 100 to 200 μm. A three-layer green sheet g1 to g3 was produced.
Next, in the plan view of the three-layer green sheets g1 to g3, a plurality of via holes (not shown) are provided at predetermined positions in the substrate region Pa adjacent to each other in the vertical and horizontal directions and subsequently becoming the substrate body 2a. The via conductor 9 was formed by filling with a conductive paste containing W powder in each via hole.

Next, in each of the substrate regions Pa of the three layers of green sheets g1 to g3, the same conductive paste as described above is screen-printed on at least one surface of the green sheets g1 to g3, and the unfired external terminals At least one of 6, 7 and the internal wiring layer 8 was formed individually.
Furthermore, the temporary bonding of stacking the three green sheets g1 to g3 in the thickness direction was performed at room temperature, and the external terminals 6 and 7, the internal wiring layer 8, and the via conductor 9 were formed in each substrate region Pa. A green sheet laminate was obtained.
Then, a punching process using a die having a predetermined through-hole and a punch that enters the through-hole into the through-hole is performed on the central portion of each of the green sheet laminates in the substrate region Pa, and a plan view is obtained. Square-shaped through holes 5 were drilled.
As a result, as shown in the upper part of FIG. 5A, three layers of green sheets g1 to g3 are laminated, and have a surface 3 and a mounting surface 4 facing the surface 3, and the plan view is a lattice shape. A plurality of substrate regions Pa partitioned by a boundary surface (virtual surface) Bd are vertically and horizontally adjacent to each other, and a green sheet laminate GS in which a through hole 5 is located at the center of each inner substrate region Pa Obtained (said preparation step).

Note that the through holes 5 may be individually bonded to the three layers of green sheets g1 to g3, and then temporarily bonded to the green sheets g1 to g3.
In addition, laser processing or grooving processing is performed on each of the surface 3 and the mounting surface 4 of the green sheet laminate GS along each boundary surface Bd so that the planar view has a lattice shape and a vertical cross section. Formed a split groove (not shown) having a V-shape.
As shown in the upper part of FIG. 6A, in the through hole 5 for each substrate region Pa in the green sheet laminate GS, the punching process is performed along the opening of the through hole 5 on the mounting surface 4 side. Further, when pulling out the tip end side of the punch, fine irregularities 14 such as burrs formed by pulling a part of the lowermost green sheet g3 by friction were formed.
Next, as shown in FIGS. 5A and 6A, a relatively thin metal plate 21 was constrained and disposed on the upper surface of the surface plate 20. The metal plate 21 has a horizontally long rectangular (rectangular) cross section protruding on the surface 22 at a position corresponding to the through hole 5 for each substrate region Pa of the green sheet laminate GS, and the through hole in plan view. A plurality of convex portions 23 having a shape similar to the hole 5 are provided at equal intervals in the vertical and horizontal directions. The metal plate 21 is formed by etching one surface of a thin plate of stainless steel (for example, SUS304) so that the plurality of convex portions 23 are formed in a lattice shape in plan view.

As shown in FIG. 6A, the convex portion 23 of the metal plate 21 has a height Ht of about 10 to 40 μm on the side surface 24 on its four sides, and the width of the top surface 23a of the convex portion 23 is opposite to the convex portion 23. It has an overlap OL that is larger in a range of about 10 to 100 μm on one side than the width of the through hole 5 for each substrate region Pa to be processed. That is, the convex portion 23 can block the opening of the through hole 5 along the entire circumference.
Next, a release material sheet 27 made of a resin film such as polyester (PE) and having a thickness of about 50 μm was laid on the entire surface 22 of the metal plate 21 including the plurality of convex portions 23. At this time, the release material sheet 27 was formed with a symmetrically inclined portion so as to form a triangular gap between each side surface 24 of each convex portion 23.
In this state, as shown by the white arrows in FIGS. 5 (A) and 6 (A), the placement surface 4 is placed on the surface 22 of the metal plate 21 on which the release material sheet 27 is laid on the entire surface 22. Are in surface contact, and the green sheet laminate GS is set so that the convex portions 23 and the through holes 5 are individually opposed to each other.

Further, as shown in FIG. 6 (B), each through hole 5 is individually communicated with the surface 3 of the green sheet laminate GS set on the surface 22 of the metal plate 21 via the release material sheet 27. A metal upper plate 28 having a plurality of through holes 29 was placed, and a buffer plate 30 made of synthetic rubber or the like was placed on the upper surface of the upper plate 28. In this state, as shown by a gray arrow in FIG. 6B, the pressure of a green cylinder or the like (not shown) is applied along the thickness direction of the green sheet laminate GS via the buffer plate 30 and the upper plate 28. The pressure bonding step of applying pressure by means was performed in an atmosphere of about 40 to 60 ° C. (step of forming the curved surface).
At this time, each convex portion 23 of the metal plate 21 is placed on the mounting surface 4 of the green sheet laminate GS as shown in FIGS. 5B and 6B by the height Ht and the overlap OL. While closing the whole periphery of the opening part of each through-hole 5 opened to the side, it entered into the lowermost green sheet g3 at a depth of about 10 to 40 μm and crushed the fine uneven part 14. At the same time, each inclined portion of the release material sheet 27 was pushed up to the surface 22 side of the metal plate 21 and pushed up the placement surface 4 side of the green sheet g3 to the surface 3 side.

Then, after releasing the pressure and removing the buffer plate 30 and the upper plate 28, the green sheet laminate GS was taken out from the release material sheet 27 and the metal plate 21. As shown in FIG. 6 (C), the green sheet laminate GS has a vertical cross section that faces downward along the entire circumference of the opening of the through hole 5 that opens in the mounting surface 4 for each substrate region Pa. A relatively inconspicuous curved surface 11 made of a curved surface 13 of four sides that is slightly convex was formed. The curved surface 11 is presumed to have been formed by slightly elastically deforming each inclined portion of the release material sheet 27 in the crimping step.
Thereafter, the green sheet laminate GS is fired, and the surfaces of the external terminals 6 and 7 fired at the same time are coated with a required metal plating, and then each of the plurality of substrate regions Pa along the dividing grooves. By dividing into pieces, a plurality of the ceramic wiring boards 1a could be obtained.

FIG. 7 (A) shows a case where a metal plate 21 having a convex portion 25 of a different form on the surface 22 is used for a green sheet laminate GS prepared in the same manner and including the same concave-convex portion 14 (FIG. 6). It is sectional drawing similar to A). As shown in FIG. 7A, the convex portion 25 has a trapezoidal shape with a flat vertical cross section, and has inclined surfaces 26 that are symmetrical with each other on every four sides of the flat top surface 25a. Since the inclined surface 26 is located along the four sides of the top surface 25a of the convex portion 25 which is rectangular (square or rectangular) in plan view, the convex portion 25 has a substantially quadrangular pyramid shape as a whole. ing. As shown in the figure, the convex portion 25 has the same height Ht as described above, and the width of the top surface 25a is set to have the same overlap OL as the width of the through hole 5.
When the same release material sheet 27 as described above is laid on the entire surface 22 of the metal plate 21 including the projections 25, the release material sheet 27 has a top surface of the projections 25 as shown in FIG. 25a and a pair of left and right inclined surfaces 26 were attached.

Next, as shown by the white arrow in FIG. 7A, the green sheet laminate GS was set on the surface 22 of the metal plate 21 having the convex portions 25 constrained on the surface plate 20.
Further, as shown in FIG. 7 (B), after the upper plate 28 and the buffer plate 30 similar to the above are placed on the surface 3 of the green sheet laminate GS, in this state, the gray arrow in the drawing shows. As described above, the pressure-bonding step of applying pressure to the green sheet laminate GS along the thickness direction by the same pressure means through the buffer plate 30 and the upper plate 28 was performed in the same manner as described above (inclined surface). Forming step).
At this time, each convex portion 25 of the metal plate 21 is opened by the height Ht and the overlap OL, as shown in FIG. 7B, through each opening that opens to the placement surface 4 side of the green sheet laminate GS. While closing the whole periphery of the opening part of the hole 5, it entered into the lowermost green sheet g3 at a depth of about 10 to 40 μm and crushed the fine uneven part 14. At the same time, the release material sheet 27 pushed the placement surface 4 side of the green sheet g3 together with the surface 22 of the metal plate 21 to the surface 3 side of the laminate GS.

Further, after releasing the pressure and removing the buffer plate 30 and the upper plate 28, the green sheet laminate GS was taken out from the release material sheet 27 and the metal plate 21. As shown in FIG. 7C, the green sheet laminate GS has a slight vertical cross section in the drawing along the entire circumference of the opening of the through hole 5 that opens in the mounting surface 4 for each substrate region Pa. A relatively inconspicuous inclined surface 10 composed of four inclined tapered surfaces 12 was formed. The inclined surface 10 is presumed to be formed by plastically deforming the inclined surface 26 of the convex portion 25 on the mounting surface 4 side of the lowermost green sheet g3 in the crimping step.
Thereafter, the green sheet laminate GS is fired, and the surfaces of the external terminals 6 and 7 fired at the same time are coated with a required metal plating, and then each of the plurality of substrate regions Pa along the dividing grooves. A plurality of the ceramic wiring boards 1b could be obtained by dividing into pieces.

According to the method for manufacturing ceramic wiring boards 1a and 1b according to the present invention as described above, the through holes are formed so that the convex portions 23 and 25 of the metal plate 21 block the openings of the through holes 5. 5 and the top surfaces 23a and 25a of the convex portions 23 and 25 are overlapped (OL) with respect to the mounting surface 4 surrounding the opening of the through hole 5 of the green sheet laminate GS. The step of forming the inclined surface 10 or the curved surface 11 that is relatively inconspicuous was performed. As a result, the inclined surface 10 or the curved surface 11 can be reliably formed on the mounting surface 4 surrounding the opening of the through hole 5, so that the positioning surface 4 is positioned on the mounting surface 4 surrounding the opening of the through hole 5. The fine irregularities 14 could be reliably removed.
Moreover, since the release material sheet 27 is interposed between the metal plate 21 having the convex portions 23 and 25 and the green sheet laminate GS, in the step of forming the inclined surface 10 or the curved surface 11, It was also possible to reliably prevent the placement surface 4 of the green sheet laminate GS from being in close contact with the surface 22 of the metal plate 21 including the convex portions 23 and 25 at the end of the process.

Furthermore, since the step of forming the inclined surface 10 or the curved surface 11 can be performed simultaneously with the step of pressure-bonding the green sheet laminate GS, a plurality of the ceramic wiring boards 1a and 1b can be efficiently manufactured. .
In addition, for example, in the process of mounting electronic components on the surface 3 side later, the ceramic wiring boards 1a and 1b are appropriately maintained while maintaining a stable posture by bringing the mounting surface 4 into surface contact with the surface plate. In addition, it is possible to reliably perform mounting with high accuracy. Further, in the step of mounting the ceramic wiring boards 1a and 1b on which the electronic components are mounted on the mother board, the ceramic wiring boards 1a and 1b are stabilized by bringing their mounting surfaces 4 into surface contact with the mother board. While maintaining the posture, it is possible to reliably carry out appropriate and accurate mounting.

In addition, although the outer peripheral side of the inclined surface 10 or the curved surface 11 constitutes a part of the flat mounting surface 4 before firing, the inclined surface is warped during firing after the firing. A region to be a part of the surface 10 or the curved surface 11 is included.
Further, in order to manufacture the ceramic wiring substrate 1c in which the concave portion 15 is opened on the mounting surface 4, the uppermost green sheet g1 constituting the green sheet laminate GS is flat without the above-described through holes. A plurality of ceramic wiring boards are obtained by applying a green sheet and temporarily bonding the green sheets g2 and g3 having the same through-holes and then crimping the obtained green sheet laminate GS. 1c can be manufactured.
Furthermore, in order to manufacture the ceramic wiring board 1d having the recess 15a opened on the surface 3 and the recess 15b opened on the mounting surface 4, the green sheet g1 on the uppermost layer side constituting the same green sheet laminate GS is used. , G2 and the green sheets g5 and g6 on the lowermost layer side, and the above-mentioned through holes are formed, and the flat green sheets g3 and g4 having no through holes as described above are sandwiched therebetween and temporarily joined, A plurality of ceramic wiring boards 1d can be manufactured by performing a step of pressure-bonding the obtained green sheet laminate GS similar to the above.
Also in the manufacturing method of these ceramic wiring boards 1c and 1d, it is possible to have the same effect as the manufacturing method of the ceramic wiring boards 1a and 1b.

The present invention is not limited to the embodiments described above.
For example, the ceramic component of the ceramic layer or the ceramic component of the green sheet may be a high-temperature fired ceramic such as aluminum nitride or mullite, or a low-temperature fired ceramic such as glass-ceramic. In the case of a ceramic layer made of such a low-temperature fired ceramic, the external terminals 6, 7, the internal wiring layer 8, the via conductor 9, etc. are mainly made of Ag or Cu.
Further, the substrate body may be formed of a single ceramic layer, and the manufacturing method thereof uses a single-layer green sheet and the inclined surface with respect to the green sheet body in which through holes are formed in the green sheet. Alternatively, a process of forming a curved surface is performed.
Furthermore, the through-hole or the recess may be a regular polygon or a deformed polygon that is a pentagon or more in a plan view or a bottom view, or may be a circle, an ellipse, or an oval.

In addition, the through-hole or the concave portion has a plurality of through-holes, a plurality of concave portions, and both the through-hole and the concave portion provided in the same substrate body, and the inclined surface along the opening on each placement surface side. Or it is good also as a form which formed the curved surface.
Furthermore, the inclined surface is not limited to a form with a single tapered surface along the inner and outer directions of the placement surface, but may be a form composed of a plurality of tapered surfaces along the inner and outer directions.
Further, the curved surface is not limited to a single curved surface along the inner and outer directions of the placement surface, and may be a plurality of curved surfaces along the inner and outer directions.
Further, the through hole or the recess may be further formed along the surface of the opening of the through hole or the recess that opens to the surface side of the substrate body.

Further, the convex portion 23 and the convex portion 25 may be provided on the surface 22 of the metal plate 21 in a similar pattern in plan view.
Furthermore, a metal plate 21 having at least one of the convex portion 23 and the convex portion 25 may be used on the surface 3 side of the green sheet laminate GS instead of the upper plate 28.
Further, instead of the release material sheet 27, a liquid or jelly-like release agent may be coated on the surface 22 of the metal plate 21 by a spray method.
In addition, the manufacturing method may be a method of manufacturing the ceramic wiring boards 1a to 1d one by one.

According to the present invention, there is provided a through hole penetrating between the surface of the substrate body and the mounting surface facing the surface, or at least a recess opening in the mounting surface, and the through hole or the opening of the recess has fine irregularities along the periphery, even when the mounting surface of the unevenness in a later step is positioned is placed on the platen, the method for producing a ceramic wiring board that reliably maintain the stable posture It can be reliably provided.

1a to 1d ............ Ceramic wiring boards 2a, 2c, 2d ... Board body 3 …………………… Surface 4 …………………… Mounting surface 5 …………………… Penetration Hole 10 ………………… Inclined surface 11 ………………… Curved surface 15, 15b ……… Concavity 21 ………………… Metal plate 22 ………………… Surface of metal plate 23, 25 ............ Projection 27 .................. Release material sheet s1 to s6 ...... Ceramic layer g1 to g3 ...... Green sheet GS ……………… Green sheet laminate

Claims (4)

A ceramic wiring board made of a single ceramic layer and having a through-hole between the surface and a mounting surface facing the surface, or a plurality of ceramic layers laminated, and the surface facing the surface. A method of manufacturing a ceramic wiring board having a through hole between the mounting surface or at least a recess opening in the mounting surface,
A green sheet body made of a single-layer green sheet and having a through hole between the surface and a mounting surface facing the surface, or a plurality of green sheets laminated, and a surface facing the surface. Preparing a green sheet laminate having a through-hole between the mounting surface or at least a recess opening in the mounting surface;
The green sheet body or the green sheet laminate is placed on a metal plate having a convex portion with a width larger than the width of the through hole or the concave portion in a plan view, and the convex portion is the through hole or It is placed so as to close the opening of the recess, pressure is applied along the thickness direction from the surface side of the green sheet body or the green sheet laminate to the placement surface side, and the opening of the through hole or recess is formed. Forming an inclined surface or a curved surface that descends toward the surface side along a surrounding mounting surface;
A method of manufacturing a ceramic wiring board. The convex part protruding from the surface of the metal plate has a rectangular or trapezoidal shape in the vertical cross section.
The method for manufacturing a ceramic wiring board according to claim 1 . The step of forming the inclined surface or the curved surface includes a release material sheet or a release agent layer interposed between the metal plate having the convex portion and the green sheet body or the green sheet laminate.
The method of manufacturing a ceramic wiring board according to claim 1 or 2 , wherein The step of forming the inclined surface or the curved surface also serves as a pressure bonding step of the green sheet laminate ,
The method for manufacturing a ceramic wiring board according to any one of claims 1 to 3, wherein:

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