JP6441929B2 - Non-contact power feeding device - Google Patents

Description

  The present invention relates to a non-contact power feeding device that feeds power in a non-contact manner by electromagnetic coupling between a power feeding side coil and a power receiving side coil. More specifically, a DC converter is provided on the power receiving side to eliminate voltage adjustment on the power feeding side. The present invention relates to a non-contact power supply apparatus.

  There are a solder printing machine, a component mounting machine, a reflow machine, a board inspection machine, and the like as a substrate working machine for producing a board on which a large number of parts are mounted. In many cases, a substrate production line is constructed by connecting these anti-substrate work machines. Of these, the component mounter generally includes a substrate transfer device, a component supply device, a component transfer device, and a control device. A typical example of the component supply device is a feeder device that feeds out a tape in which a large number of electronic components are stored at a predetermined pitch. The feeder device has a flat shape that is thin in the width direction, and a plurality of feeder devices are generally arranged on a machine base of a component mounting machine. The feeder device includes a motor in a mechanism unit that supplies components, and further includes a control unit that controls the operation of the motor.

  Conventionally, a contact power feeding type multi-terminal connector has been used to feed power from the main body of the component mounting machine to the feeder device. However, in a multi-terminal connector, there is a risk of terminal deformation or breakage due to repeated insertion and removal operations. In recent years, the use of non-contact power feeding devices such as an electromagnetic coupling method and an electrostatic coupling method has been promoted as a countermeasure. Each of the power feeding side coil and the power receiving side coil used in the electromagnetic coupling type non-contact power feeding device includes a core, and both the cores are arranged to face each other to form a magnetic circuit. Furthermore, a resonance capacitor is added to the contactless power supply circuit, and contactless power supply is often performed in consideration of the resonance frequency.

  For example, the non-contact power feeding system disclosed in Patent Document 1 includes a power feeding device in which a plurality of primary coils are arranged along a power feeding surface, and a power receiving device that is installed on the power feeding surface and has a secondary coil. The resonance frequency when the secondary coil is located between the two primary coils or a frequency in the vicinity thereof is used. That is, in the configuration of Patent Document 1, the positional relationship between the plurality of primary coils and the secondary coil is indefinite, and the resonance frequency changes according to the positional relationship. Even so, if the resonance frequency when it exists in the gap position is used, stable output power can be ensured both when the secondary coil exists in front of the primary coil and when it exists in the gap position. Yes. In general, a non-contact power supply apparatus often uses a fixed resonance frequency by fixing the positional relationship between the primary coil and the secondary coil.

  Further, in the electromagnetic coupling type non-contact power feeding device, when the bonding state between the cores is reduced and a gap is generated, the power feeding performance is lowered. For this reason, the technique of maintaining the joining state of cores favorably is developed. For example, an apparatus for performing inductive energy transfer disclosed in Patent Document 2 includes a first magnetic core around which a primary coil is wound, and a second magnetic core around which a secondary coil is wound, The magnetic core is elastically supported so as to be pressed against the other magnetic core. According to this, the plug for contact power feeding can be omitted, and the plug cannot be peeled off.

JP 2013-27132 A JP 2006-191098 A

  By the way, in the electromagnetic coupling type non-contact power feeding device, two methods are roughly used to stabilize the output voltage applied to the electric load on the power receiving side. The first method is a method of detecting the received voltage received on the power receiving side, transmitting the received voltage information from the power receiving side to the power feeding side, adjusting the power feeding voltage on the power feeding side, and controlling the power receiving voltage to be constant. In the first method, a voltage detecting unit is required on the power receiving side, a voltage adjusting unit is required on the power feeding side, and further, means for transmitting received voltage information is also required. For this reason, in the first method, the cost of the non-contact power feeding device increases and the installation space also increases.

  The second method is a method of stabilizing the output voltage even if the received voltage fluctuates by providing a DC converter on the power receiving side and performing voltage adjustment. The second method is simpler and less expensive than the first method. However, the second method has a problem that the received voltage can jump if the electric load on the power receiving side fluctuates or the bonding state between the cores changes when performing non-contact power feeding. In addition, even when the power receiving side device is suddenly attached or detached, the magnetic circuit may change greatly and the power receiving voltage may increase transiently. With respect to these problems, the techniques of Patent Documents 1 and 2 are not effective, and it is necessary to take measures to provide a protection circuit on the power receiving side or to increase the withstand voltage of the DC converter. For this reason, also in the second method, the cost of the non-contact power feeding apparatus is increased and the installation space is increased.

  The application of the non-contact power feeding device is not limited to the feeder device of the component mounting machine, but covers a wide range of fields such as other types of substrate working machines, assembling machines and processing machines for producing other products.

  The present invention has been made in view of the above-described problems of the background art, and it is possible to make the device configuration and the circuit configuration simple by suppressing fluctuations in the received voltage, and to contribute to the reduction of the device cost and the reduction of the installation space. Providing a power feeding device is a problem to be solved.

The invention of the non-contact power feeding device according to claim 1 that solves the above-described problem includes a power feeding side coil provided in the power feeding side device, a high frequency power supply circuit that applies a high frequency voltage to the power feeding side coil, and the power feeding side device. A power receiving side device that is provided in a power receiving side device disposed opposite to the power receiving side coil and receives high frequency power by non-contact power feeding by electromagnetically coupling with the power feeding side coil; and the power receiving side device that converts the high frequency power received by the power receiving side coil A power receiving circuit for supplying power to the electrical load; and at least one resonance member connected to at least one of the power supply side coil and the power receiving side coil to form a resonance circuit , the high frequency power supply circuit comprising: using the frequency deviated from the resonant frequency of the resonant circuit, the power supply-side device comprises a bottom plate portion and the front plate belonging to the body of the component mounting machine for mounting electronic components on a substrate A component supply that is a let member and the power receiving side device is detachably mounted on the pallet member by slidingly moving the upper surface of the bottom plate portion from the rear toward the front plate portion, and supplies the electronic component The power supply side coil is disposed on the front plate portion, and the power reception side coil is disposed on the front surface of the component supply device .

According to the invention of the non-contact power supply apparatus according to claim 1, the high-frequency power supply circuit performs non-contact power supply using a frequency that deviates from the resonance frequency of the resonance circuit. As a result, contactless power feeding can be performed at a frequency where the load-dependent characteristic of the received voltage is small and the frequency characteristic is flat, and voltage adjustment does not have to be performed on the power feeding side. In other words, the power receiving side voltage detection unit, the power feeding side voltage adjustment unit, the receiving voltage information transmission means, and the like can be eliminated. In addition, since the jump of the received voltage caused by the fluctuation of the electric load on the power receiving side is suppressed, a withstand voltage measure for providing a protection circuit on the power receiving side becomes unnecessary. Therefore, fluctuations in the received voltage can be suppressed to simplify the device configuration and circuit configuration, thereby contributing to reduction in device cost and reduction in installation space.
In other words, the voltage adjustment function is unnecessary on the side of the pallet member, which can contribute to the reduction of the cost of the pallet member and the reduction of the installation space. In addition, a withstand voltage measure is not required to provide a protection circuit on the component supply device side, which can contribute to a reduction in the cost of the component supply device and a reduction in installation space. Furthermore, the non-contact power supply from the pallet member toward the component supply device is excellent in operation stability.

It is a perspective view which shows the whole structure of the component mounting machine with which the non-contact electric power supply of embodiment of this invention is integrated. It is a circuit diagram which shows the structure of the non-contact electric power feeder of embodiment. It is a side view which shows the condition where a feeder apparatus is mounted in a pallet member. It is the figure which showed qualitatively the characteristic in which the inductance value of a feeding side coil and a receiving side coil changes depending on the gap length of the joint surface of a core. It is the figure which showed the frequency characteristic of the receiving voltage in the favorable joining state with almost no gap length of a electric power feeding side core and a receiving side core. It is the figure which showed the frequency characteristic of the receiving voltage in the unsatisfactory joining state which the gap length of the electric power feeding side core and the receiving side core expanded.

  A non-contact power feeding device 1 according to an embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a perspective view showing an overall configuration of a component mounter 9 in which a non-contact power feeding device 1 according to an embodiment of the present invention is incorporated. In FIG. 1, the direction from the left back to the right front is the X-axis direction for loading and unloading the substrate K, the direction from the right back to the left front is the Y-axis direction, and the direction from the top to the bottom is the Z-axis direction. The component mounter 9 is configured by assembling a substrate transport device 92, a plurality of feeder devices 2, a pallet member 3, a component transfer device 94, a component camera 95, and a control device (not shown) on a machine base 91. . The substrate transfer device 92, the feeder device 2, the component transfer device 94, and the component camera 95 are controlled by a control device, and each performs a predetermined operation.

  The substrate transfer device 92 carries the substrate K into the mounting position, positions it, and carries it out. The substrate transfer device 92 includes first and second guide rails 921, 922, a pair of conveyor belts, a clamp device, and the like. The first and second guide rails 921 and 922 are assembled to the machine base 91 so as to extend in the transport direction (X-axis direction) across the upper center of the machine base 91 and to be parallel to each other. A pair of endless annular conveyor belts (not shown) are arranged in parallel inside the first and second guide rails 921 and 922 facing each other. The pair of conveyor belts rotate in a state where both edges of the substrate K are placed on the conveyor conveyance surface, and carry the substrate K to and from the mounting position set in the center of the machine base 91. A clamp device (not shown) is provided below the conveyor belt at the mounting position. The clamp device pushes up the substrate K, clamps it in a horizontal posture, and positions it at the mounting position. As a result, the component transfer device 94 can perform the mounting operation at the mounting position.

  The plurality of feeder apparatuses 2 sequentially supply electronic components. The feeder device 2 has a flat shape that extends in the vertical direction (Z-axis direction) and the front-back direction (Y-axis direction) and has a thin width direction (X-axis direction). The plurality of feeder devices 2 are mounted side by side in the width direction (X-axis direction) of the upper surface of the pallet member 3. Each feeder device 2 includes a main body portion 22, a supply reel 23 provided at the rear portion of the main body portion 22, and a component extraction portion 24 provided at the front end of the main body portion 22. An elongated tape (not shown) in which a large number of electronic components are stored at a predetermined pitch is wound and held on the supply reel 23. The tape is fed out by a predetermined pitch by a mechanism portion 56 (shown in FIG. 2), and the electronic components are released from the stored state and sequentially supplied to the component take-out portion 24. Further, an elongated convex portion 25 (shown in FIG. 3) is formed on the bottom surface of the feeder device 2 for easy mounting on the pallet member 3 and positioning.

  The pallet member 3 is a member for mounting a plurality of feeder devices 2 and is detachably held on the upper surface of the machine base 91. The pallet member 3 is a member belonging to the main body of the component mounting machine 9 and includes a bottom plate portion 31 and a front plate portion 32. The bottom plate portion 31 has a rectangular plate shape, and its width dimension (X-axis direction dimension) is smaller than the width dimension of the machine base 91. The front plate portion 32 is erected from the front edge of the bottom plate portion 31. A groove-like slot 33 (shown in FIG. 3) extending in the front-rear direction (Y-axis direction) is formed on the upper surface of the bottom plate portion 31. The feeder device 2 is mounted on the pallet member 3 by being slid from the rear toward the front plate portion 32 with the convex portion 25 on the bottom surface being inserted into the slot 33 of the bottom plate portion 31. Finally, the feeder device 2 is mounted in contact with the bottom plate portion 31 and the front plate portion 32 of the pallet member 3.

  The component transfer device 94 sucks and collects components from the component extraction sections 24 of the plurality of feeder devices 2 and conveys and mounts them to the positioned substrate K. The component transfer device 94 is an XY robot type device that can move horizontally in the X-axis direction and the Y-axis direction. The component transfer device 94 includes a pair of Y-axis rails 941 and 942, a Y-axis slider 943, a head holding unit 944, a suction nozzle 945, and the like. The pair of Y-axis rails 941 and 942 extends in the front-rear direction (Y-axis direction) of the machine base 91 and is disposed above the substrate transfer device 92 and the feeder device 2. A Y-axis slider 943 is mounted on the Y-axis rails 941 and 942 so as to be movable in the Y-axis direction. A head holding portion 944 is mounted on the Y-axis slider 943 so as to be movable in the X-axis direction. The head holding unit 944 is driven in two horizontal directions (X-axis and Y-axis directions) by two servo motors. The head holding unit 944 holds the suction nozzle 945 on the lower side thereof in a replaceable manner. The suction nozzle 945 has a suction opening at the lower end, and sucks electronic components into the suction opening using negative pressure.

  The component camera 95 is provided upward on the upper surface of the machine base 91 between the board transfer device 92 and the feeder device 2. The component camera 95 captures and detects the state of the sucked electronic component while the suction nozzle 945 moves from the feeder device 2 onto the substrate K. When the component camera 95 detects an electronic component suction posture error or rotation angle deviation, the control device 96 finely adjusts the component mounting operation as necessary, and discards the component if mounting is difficult. To do.

  The control device holds the mounting sequence in which the order of mounting the electronic components on the substrate K and the feeder device 2 that supplies the electronic components are designated. The control device controls the component mounting operation according to the mounting sequence based on the imaging data of the component camera 95 and the detection data of a sensor (not shown). In addition, the control device sequentially collects and updates operation data such as the number of boards K that have been produced, the mounting time required for mounting electronic components, and the number of occurrences of component suction errors.

  Next, the description shifts to the contactless power supply device 1 of the embodiment. The non-contact power feeding device 1 of the embodiment is a device that performs non-contact power feeding by an electromagnetic coupling method from the pallet member 3 toward the feeder device 2. The pallet member 3 corresponds to the power supply side device of the present invention, the main body of the substrate working machine, and the main body of the component mounting machine 9. On the other hand, the feeder device 2 corresponds to a power receiving side device, a mounting device, and a component supply device of the present invention. FIG. 2 is a circuit diagram illustrating a configuration of the contactless power supply device 1 of the embodiment.

  The pallet member 3 includes a high frequency power supply circuit 41, a power supply side capacitor 42, and a power supply side coil 43 shown on the left side of FIG. On the other hand, the feeder device 2 includes a power receiving side coil 51, a power receiving side capacitor 53, a rectifier circuit 54, and a DC converter 55 shown on the right side of FIG. Moreover, the feeder apparatus 2 has a motor and control CPU in the mechanism part 56 as an electric load supplied with electric power.

  The high frequency power supply circuit 41 on the pallet member 3 side outputs a high frequency voltage Vs having a power supply frequency fs. The high frequency power supply circuit 41 can be configured by combining, for example, a DC power source that generates a DC voltage and a switching circuit that generates a high frequency voltage Vs by switching the DC voltage. One output terminal 411 of the high frequency power supply circuit 41 is connected to one end 421 of the power supply side capacitor 42. The other output terminal 412 of the high frequency power supply circuit 41 is directly connected to the other end 432 of the power feeding side coil 43. The power supply side capacitor 42 is an example of a resonance member. The other end 422 of the power supply side capacitor 42 is connected to one end 431 of the power supply side coil 43.

  The power supply side coil 43 is formed by winding a conductor a predetermined number of times around a power supply side core (not shown). The power supply side core has a C-shaped core having a coil formed in the middle portion and having joint surfaces 44 (shown in FIG. 3) at both ends, and a coil formed in the center core and having joint surfaces 44 (shown in FIG. 3) at three locations. It has an E-type core. Examples of the material constituting the power supply side core include a laminate of magnetic steel sheets with high magnetic permeability and ferrite, and may be aluminum with low magnetic permeability. The power feeding side coil 43 and the power feeding side core are disposed near the upper portion of the front plate portion 32 of the pallet member 3 (shown in FIG. 3).

The power supply side capacitor 42 and the power supply side coil 43 are connected in series to form a series resonance circuit. From the electrostatic capacitance value C1 of the power supply side capacitor 42 and the inductance value L1 of the power supply side coil 43, the series resonance frequency f1 is obtained using the following equation 1.
f1 = (1 / 2π) · (L1 · C1) ^−0.5 (Equation 1)

  The power receiving side coil 51 on the feeder device 2 side is formed by winding a conductor around a power receiving side core (not shown) a predetermined number of times. The cross-sectional area and the number of turns of the conductor of the power receiving side coil 51 may be the same as or different from those of the power feeding side coil 43. One end 511 and the other end 512 of the power receiving coil 51 are connected to the rectifier circuit 54. The power receiving side core is preferably made of the same material as the power feeding side core and has the same shape and substantially the same magnetic path cross-sectional area. The joint surface 52 (shown in FIG. 3) of the power receiving side core is formed so as to be opposed to the joint surface 44 of the power feeding side core. The power receiving side coil 51 and the power receiving side core are disposed near the upper part of the front surface of the feeder device 2 (shown in FIG. 3).

  When the joint surface 44 of the power supply side core and the joint surface 52 of the power reception side core are arranged to face each other, a closed magnetic circuit is formed. The power supply side core and the power reception side core electromagnetically couple the power supply side coil 43 and the power reception side coil 51 by forming a magnetic circuit. As a result, the power receiving side coil 51 can receive high frequency power from the power feeding side coil 43 by a non-contact power feeding method. A voltage generated between one end 511 and the other end 512 of the power receiving coil 51 is a power receiving voltage Vr.

The power receiving side capacitor 53 is an example of a resonance member. One end and the other end of the power reception side capacitor 53 are connected to the rectifier circuit 54. The power receiving side coil 51 and the power receiving side capacitor 53 are connected in parallel to form a parallel resonance circuit. From the inductance value L2 of the power receiving side coil 51 and the capacitance value C2 of the power receiving side capacitor 53, the parallel resonance frequency f2 is obtained using the following equation 2.
f2 = (1 / 2π) · (L2 · C2) ^−0.5 (Equation 2)
Incidentally, even if there is a difference between series connection and parallel connection, Expression 1 and Expression 2 are the same shape.

  The rectifier circuit 54 rectifies the high-frequency received voltage Vr received from the power receiving coil 51 to generate a DC voltage Vd, and supplies the DC voltage Vd to the DC converter 55. Examples of the rectifier circuit 54 include a full-wave rectifier circuit in which four diodes are bridge-connected, and a smoothing circuit may be provided as appropriate. The circuit configuration of the rectifier circuit 54 is not limited to the above.

  The DC converter 55 adjusts the DC voltage Vd received from the rectifier circuit 54 to a predetermined output voltage VL and supplies it to the electric load of the mechanism unit 56. The DC converter 55 generates the output voltage VL even if the received voltage Vr and the DC voltage Vd fluctuate due to a decrease in the degree of electromagnetic coupling between the power feeding side coil 43 and the power receiving side coil 51 or a load fluctuation of the electric load. Has a voltage adjustment function to keep constant. The DC converter 55 has a predetermined withstand voltage performance on the assumption that the input DC voltage Vd rises. The DC converter 55 having high withstand voltage performance increases the cost. As the DC converter 55, for example, a switching regulator can be used. The rectifier circuit 54 and the DC converter 55 constitute a power receiving circuit of the present invention.

  The output voltage VL may be a single DC voltage or a two-stage DC voltage having different magnitudes corresponding to a plurality of types of electric loads. For example, the DC drive voltage of the motor in the mechanism unit 56 and the DC control voltage of the control CPU may be different. In this case, two DC converters 55 can be provided corresponding to the DC drive voltage and the DC control voltage. Further, the DC voltage Vd supplied from the rectifier circuit 54 may be used as it is as the DC drive voltage, and the DC voltage Vd may be converted into a DC control voltage by the single DC converter 55 and supplied.

  Here, the situation where the feeder apparatus 2 is mounted on the pallet member 3 as shown in FIG. 3 is considered. FIG. 3 is a side view showing a situation where the feeder apparatus 2 is mounted on the pallet member 3. When the feeder apparatus 2 is mounted on the pallet member 3, the power receiving side coil 51 and the power receiving side core face the power feeding side coil 43 and the power feeding side core. When the feeder device 2 is slid forward (to the left in the figure) as indicated by the white arrow J, the power supply side core joining surface 44 and the power receiving side core joining surface 52 are aligned. On the other hand, it joins or approaches while decreasing the gap length GL.

  When the feeder apparatus 2 is mounted satisfactorily, the joint surfaces 44 and 52 are joined together, and the gap length GL is almost eliminated. When the feeder device 2 is not mounted properly, some abnormality occurs between the joint surfaces 44 and 52. For example, the gap length GL remains between the joint surfaces 44 and 52, or the joint surfaces 44 and 52 are not parallel to each other, or a foreign object is sandwiched between the joint surfaces 44 and 52. Or, a part of the joint surfaces 44 and 52 is cracked and missing. In such an abnormality, a defect occurs in the magnetic circuit, and the degree of electromagnetic coupling between the power supply side coil 43 and the power reception side coil 51 decreases.

  Furthermore, the inductance value L1 of the power supply side coil 43 and the inductance value L2 of the power reception side coil 51 change according to the state of the magnetic circuit. FIG. 4 is a diagram qualitatively showing characteristics in which the inductance values L1 and L2 of the power supply side coil 43 and the power reception side coil 51 change depending on the gap length GL of the core joint surfaces 44 and 52. As illustrated, when the gap length GL of the joint surfaces 44 and 52 increases, the inductance values L1 and L2 decrease. However, even if the gap length GL is extremely widened, the inductance values L1 and L2 settle to constant values. As the inductance values L1 and L2 change, the resonance frequencies f1 and f2 obtained by Expressions 1 and 2 shift.

  The shift of the resonance frequencies f1 and f2 and the change of the received voltage Vr can be obtained by simulation. FIG. 5 is a diagram showing the frequency characteristics of the received voltage Vr in a good joined state in which there is almost no gap length GL between the power feeding side core and the power receiving side core. FIG. 6 is a diagram illustrating the frequency characteristics of the power reception voltage Vr in an unsatisfactory bonding state in which the gap length GL between the power supply side core and the power reception side core is widened. 5 and 6, the horizontal axis indicates the power supply frequency fs (logarithm display) of the high frequency power supply circuit 41, and the vertical axis indicates the power reception voltage Vr between the one end 511 and the other end 512 of the power reception side coil 51. ing. In the simulation, the magnitude of the high-frequency voltage Vs of the high-frequency power supply circuit 41 is changed as a constant condition, and the power supply frequency fs is changed. Further, the electric load of the mechanism unit 56 is set to two conditions, low load and high load. 5 and 6, the frequency characteristic of the received voltage Vr at the time of low load is indicated by a solid line, and the frequency characteristic of the received voltage Vr at the time of high load is indicated by a broken line.

  As shown in FIG. 5, the frequency characteristic of the received voltage Vr in a good junction state is a double peak characteristic having peaks at two locations. The lower peak frequency fA is derived from the series resonance frequency f1 on the power supply side, and the upper peak frequency fC is derived from the parallel resonance frequency f2 on the power reception side. Further, as shown in FIG. 6, the frequency characteristic of the received voltage Vr in an unsatisfactory junction state is also a double peak characteristic having peaks at two locations. However, the lower and upper peak frequencies fB and fD are shifted to a higher frequency side than FIG.

  In other words, when the coupling degree of electromagnetic coupling decreases as the gap length GL increases, the series resonance frequency f1 on the power feeding side increases from the peak frequency fA to the peak frequency fB. Similarly, when the coupling degree of the electromagnetic coupling decreases, the parallel resonance frequency f2 on the power receiving side increases from the peak frequency fC to the peak frequency fD. As described above, since the inductance values L1 and L2 settle to a constant value even when the gap length GL is extremely widened, there is an upper limit for increasing the series resonance frequency f1 and the parallel resonance frequency f2.

In the present embodiment, the high frequency power supply circuit 41 uses a frequency f0 between the series resonance frequency f1 and the parallel resonance frequency f2. Strictly speaking, the high-frequency power supply circuit 41 is higher than the upper limit peak frequency fB at which the series resonance frequency f1 on the power supply side fluctuates when the degree of electromagnetic coupling changes, and the parallel resonance frequency f2 on the power reception side fluctuates. A frequency f0 lower than the lower limit peak frequency fC is used as the feeding frequency fs. The magnitude relationship of each frequency is expressed by the following inequality.
f1 (= shift from fA to fB) <f0 (= fs) <f2 (= shift from fC to fD)

  In addition, when the low load and the high load are compared, the received voltage Vr is higher at the low load in the entire frequency band. In particular, the received voltage Vr at the time of low load jumps greatly in the vicinity of each peak frequency fA, fB, fC, fD. On the other hand, the power receiving voltage Vr at the time of high load increases in the vicinity of the lower peak frequencies fA and fB, but does not jump up significantly as the load is low. Further, the increase in the received voltage Vr at the time of high load is not conspicuous in the vicinity of the upper peak frequencies fC and fD.

  Here, consider a case where the high frequency power supply circuit 41 uses a frequency other than the frequency f0 as the power supply frequency fs. For example, when the high frequency power supply circuit 41 uses the peak frequency fA, the received voltage Vr jumps from Vr1 to Vr2 in FIG. Further, when the high frequency power supply circuit 41 uses the peak frequency fA, when the junction state decreases from FIG. 5 to FIG. 6, the received voltage Vr extremely decreases to Vr3 in FIG. Further, for example, when the high frequency power supply circuit 41 uses the peak frequency fB, the received voltage Vr jumps from Vr4 to Vr5 in FIG.

  Furthermore, when the high frequency power supply circuit 41 uses a frequency between the peak frequency fA and the peak frequency fB, the possibility that the received voltage Vr jumps up when the load changes in the intermediate junction state of FIGS. 5 and 6 cannot be solved. On the other hand, the same applies to the case where the high frequency power supply circuit 41 uses a frequency between the peak frequency fC and the peak frequency fD, and the possibility that the received voltage Vr jumps when the load changes cannot be solved.

  On the other hand, in the embodiment, even if the frequency characteristic of the received voltage Vr shifts with a change in the joining state between the cores, the frequency f0 used by the high frequency power supply circuit 41 does not overlap the peak of the frequency characteristic. The received voltage Vr at the frequency f0 is relatively large and has a small load dependence characteristic, as indicated by Vr6 and Vr7 in FIG. 5 and Vr8 and Vr9 in FIG. Therefore, according to the embodiment, even if the electric load of the feeder device 2 fluctuates and the joining state between the cores changes, the possibility that the received voltage Vr jumps up can be solved. In addition, when the high-frequency power supply circuit 41 outputs the high-frequency voltage Vs, even if the feeder device 2 is suddenly attached / detached, a transient increase in the received voltage Vr can be suppressed.

  In addition, the fact that the received voltage Vr is relatively high means that the high frequency voltage Vs of the high frequency power supply circuit 41 can be small. Further, even if the frequency f0 is slightly shifted (moved left and right in FIGS. 5 and 6), the received voltage Vr hardly changes and the frequency characteristics are flat. That is, a constant power receiving voltage Vr can be obtained even if the power feeding frequency fs varies slightly or the inductance values L1 and L2 and the capacitance values C1 and C2 slightly vary. Therefore, the contactless power supply device 1 of the embodiment is excellent in operation stability.

  Note that even if a frequency lower than the peak frequency fA or a frequency higher than the peak frequency fD is used as the power supply frequency fs, the possibility that the received voltage Vr jumps can be solved. However, in this case, the magnitude of the received voltage Vr is extremely reduced. Accordingly, it is necessary to increase the high frequency voltage Vs of the high frequency power supply circuit 41 in order to obtain the predetermined power receiving voltage Vr, which is not a good idea.

  The non-contact power feeding device 1 of the embodiment includes a power feeding side coil 43 provided on the pallet member 3, a high frequency power supply circuit 41 that applies a high frequency voltage to the power feeding side coil 43, and a feeder device 2 that is disposed to face the pallet member 3. The power receiving side coil 51 that is electromagnetically coupled to the power feeding side coil 43 and receives high frequency power by non-contact power feeding, and the power receiving power that converts the high frequency power received by the power receiving side coil 51 and feeds the electric load to the feeder device 2 At least one resonance member (a power supply side capacitor 42 and a power reception side capacitor 53) connected to at least one of a circuit (rectifier circuit 54 and a DC converter 55) and at least one of a power supply side coil 43 and a power reception side coil 51 to form a resonance circuit. ), And the high frequency power supply circuit 41 uses a frequency f0 deviating from the resonance frequencies f1 and f2 of the resonance circuit.

  According to this, the high frequency power supply circuit 41 performs non-contact power feeding using the frequency f0 deviating from the resonance frequencies f1 and f2 of the resonance circuit. As a result, non-contact power supply can be performed at a frequency f0 having a small load dependency characteristic of the received voltage Vr and a flat frequency characteristic, and the high frequency voltage Vs of the high frequency power supply circuit 41 need not be adjusted. In other words, the power receiving side voltage detection unit, the power feeding side voltage adjustment unit, the receiving voltage information transmission means, and the like can be eliminated. In addition, since the jump of the received voltage Vr caused by the fluctuation of the electric load on the power receiving side is suppressed, a withstand voltage measure for providing a protection circuit on the power receiving side becomes unnecessary. Therefore, fluctuations in the received voltage Vr can be suppressed to simplify the device configuration and circuit configuration, thereby contributing to reduction in device cost and installation space.

  Moreover, since the fluctuation | variation by the load dependence characteristic and frequency characteristic of the receiving voltage Vr is suppressed, the non-contact electric power feeder 1 of embodiment is excellent in operation | movement stability. This means that fluctuations in the power supply frequency fs of the high frequency power supply circuit and fluctuations in the inductance values L1 and L2 and the capacitance values C1 and C2 can be allowed. Therefore, the design and manufacturing freedom of the device 1 is greatly expanded.

  Further, in the contactless power supply device 1 of the embodiment, the high frequency power supply circuit 41 includes a range (peak) in which the resonance frequencies f1 and f2 fluctuate when the coupling degree of electromagnetic coupling between the power supply side coil 43 and the power reception side coil 51 changes. The frequency f0 deviating from the frequencies fA to fB and the peak frequencies fC to fD) is used.

  According to this, even if the frequency characteristic of the received voltage Vr shifts with a change in the joining state between the cores, the frequency f0 used by the high frequency power supply circuit 41 does not overlap the peak of the frequency characteristic. Therefore, the possibility that the received voltage Vr jumps up can be solved. Further, since the frequency characteristic of the power reception voltage Vr is flat in the vicinity of the frequency f0, strictness is not required for the management of the gap length GL of the joint surfaces 44 and 52 between the cores. Therefore, the design and manufacturing freedom of the device 1 is greatly expanded.

  Further, in the contactless power supply device 1 of the embodiment, the resonance member includes a power supply side capacitor 42 connected in series to the power supply side coil 43 and a power reception side capacitor 53 connected in parallel to the power reception side coil 51. In addition, the resonance frequency includes a series resonance frequency f1 that depends on the power supply side coil 43 and the power supply side capacitor 42, and a parallel resonance frequency f2 that depends on the power reception side coil 51 and the power reception side capacitor 53. The frequency f0 between the series resonance frequency f1 and the parallel resonance frequency f2 is used.

  According to this, a relatively large and stable power receiving voltage Vr can be obtained, so that the high frequency voltage Vs of the high frequency power supply circuit 41 can be small. If a frequency deviating from between the series resonance frequency f1 and the parallel resonance frequency f2 is used, the high frequency voltage Vs of the high frequency power supply circuit 41 needs to be increased.

  Furthermore, in the contactless power supply device 1 of the embodiment, the pallet member 3 belongs to the main body of the component mounting machine 9 that mounts electronic components on the board K, and the feeder device 2 is detachably mounted on the component mounting machine 9. The power supply side coil 43 provided in the pallet member 3 has a power supply side iron core that performs electromagnetic coupling, and the power reception side coil 51 provided in the feeder device 2 is a power supply side. When the feeder device 2 is mounted on the pallet member 3 and has a power receiving side iron core that performs electromagnetic coupling in cooperation with the iron core, the joint surface 44 of the power feeding side iron core and the joint surface 52 of the power receiving side iron core face each other to form a gap. Join or approach while reducing the length GL.

  This eliminates the need for a voltage adjustment function on the side of the pallet member 3, and can contribute to a reduction in the cost of the pallet member 3 and a reduction in installation space. Moreover, the withstand voltage measure which provides a protective circuit in the feeder apparatus 2 side is unnecessary, and it can contribute to the reduction of the cost of the feeder apparatus 2, and the reduction of an installation space. Furthermore, the non-contact power feeding from the pallet member 3 toward the feeder device 2 is excellent in operational stability.

  Further, in the contactless power supply device 1 of the embodiment, the power receiving circuit adjusts the high frequency power received by the power receiving coil 51 to direct current, and the direct current voltage Vd received from the rectifying circuit 54 to the output voltage VL. The DC converter 55 is configured.

  According to this, even if the received voltage Vr fluctuates, the output voltage VL applied to the electric load can be stabilized by the voltage adjusting action of the DC converter 55, so that voltage adjustment on the power feeding side can be reliably eliminated. Further, since non-contact power feeding is performed at the frequency f0 where the load-dependent characteristic of the received voltage Vr is small and the frequency characteristic is flat, a measure for increasing the withstand voltage of the DC converter 55 is not necessary. Therefore, it can greatly contribute to the reduction of the device cost and the installation space.

  The magnitude relationship between the series resonance frequency f1 on the power supply side and the parallel resonance frequency f2 on the power reception side is not limited to the embodiment, and the series resonance frequency f1 may be higher than the parallel resonance frequency f2. Various other applications and modifications are possible for the present invention.

  The contactless power supply device of the present invention is widely used for other types of substrate work machines, assembly machines and processing machines for producing other products, in addition to the feeder device 2 of the component mounting machine 9 described in the embodiment. it can.

1: Non-contact power feeding device 2: Feeder device (power receiving side device, mounting device)
3: Pallet member (power supply side device, main body of substrate work machine)
41: High-frequency power circuit 42: Power supply side capacitor (resonance member)
43: Power supply side coil 44: Power supply side core joint surface 51: Power reception side coil 52: Power reception side core joint surface 53: Power reception side capacitor (resonance member) 54: Rectifier circuit 55: DC converter 56: Mechanism (electricity) load)
fA, fB, fC, fD: peak frequency f0: frequency used for feeding frequency Vr, Vr1 to Vr9: received voltage GL: gap length

Claims (6)

A power supply side coil provided in the power supply side device;
A high frequency power supply circuit for applying a high frequency voltage to the power supply side coil;
A power-receiving-side coil that is provided in a power-receiving-side device disposed opposite to the power-feeding-side device, electromagnetically coupled to the power-feeding side coil, and receives high-frequency power by non-contact power feeding;
A power receiving circuit that converts the high-frequency power received by the power receiving coil and supplies power to the electric load of the power receiving device;
Provided with at least one resonance member to form a resonant circuit is connected to at least one of the power supply side coil and the power receiving coil, the high frequency power supply circuit, a frequency deviated from the resonant frequency of the resonant circuit use the,
The power supply side device is a pallet member consisting of a bottom plate portion and a front plate portion belonging to the main body of a component mounter for mounting electronic components on a substrate,
The power receiving device is a component supply device that is detachably mounted on the pallet member by slidingly moving the upper surface of the bottom plate portion from the rear toward the front plate portion, and supplies the electronic component.
The power supply side coil is disposed on the front plate portion,
The power receiving side coil is a non-contact power feeding device disposed on a front surface of the component feeding device.   2. The non-contact power feeding according to claim 1, wherein the high frequency power supply circuit uses a frequency that is out of a range in which the resonance frequency fluctuates when a coupling degree of electromagnetic coupling between the power feeding side coil and the power receiving side coil is changed. apparatus.   The contactless power feeding device according to claim 1, wherein the resonance member includes a power feeding side capacitor connected in series to the power feeding side coil and a power receiving side capacitor connected in parallel to the power receiving side coil. The resonance frequency includes a series resonance frequency depending on the power supply side coil and the power supply side capacitor, and a parallel resonance frequency depending on the power reception side coil and the power reception side capacitor,
The non-contact power feeding device according to claim 3, wherein the high-frequency power supply circuit uses a frequency between the series resonance frequency and the parallel resonance frequency. Before SL feeding conductive coil has a feeding side core responsible for the electromagnetic coupling,
Before Ki受 conductive coil has a power receiving side core responsible for the electromagnetic coupling in conjunction with the power supply side core,
Wherein when the component supplying apparatus is mounted on the pallet member, according to claim 1 to 4 and the cemented surface of the cemented surface and the power receiving side core of the power supply-side core are bonded or approach while reducing the gap length as you face The non-contact electric power feeder as described in any one of . The power receiving circuit, said rectifier circuit for converting the power receiving side RF power coil receives the DC, and according to any one of constituted claims 1-5 comprising a DC converter for adjusting the DC voltage Non-contact power feeding device.

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