JP6436692B2 - Optical module, optical transceiver module, and flexible substrate - Google Patents

Optical module, optical transceiver module, and flexible substrate Download PDF

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JP6436692B2
JP6436692B2 JP2014186103A JP2014186103A JP6436692B2 JP 6436692 B2 JP6436692 B2 JP 6436692B2 JP 2014186103 A JP2014186103 A JP 2014186103A JP 2014186103 A JP2014186103 A JP 2014186103A JP 6436692 B2 JP6436692 B2 JP 6436692B2
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後藤　文敏
文敏 後藤
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日本オクラロ株式会社
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Description

本発明は、光モジュール、光送受信モジュール、及びフレキシブル基板に関する。   The present invention relates to an optical module, an optical transceiver module, and a flexible substrate.

光モジュールは、光高周波部品を備えている。光高周波部品に、高周波電気信号が入力、又は／及び、出力される。そのために、光高周波部品へ入力する電気信号や、光高周波部品から出力する電気信号が、伝送線路を伝搬する。そして、伝送線路と伝送線路との接続箇所や、光高周波部品と伝送線路との接続箇所において、２枚の基板が重畳して接続している。２枚の基板を、上側基板と下側基板と呼ぶこととする。例えば、光高周波部品と配線基板とが接続されている場合を考える。フレキシブル基板などの配線基板が上側基板であり、光高周波部品に備えられるセラミック基板が下側基板である。   The optical module includes optical high frequency components. A high-frequency electrical signal is input to and / or output from the optical high-frequency component. Therefore, an electrical signal input to the optical high frequency component and an electrical signal output from the optical high frequency component propagate through the transmission line. Then, two substrates are overlapped and connected at the connection point between the transmission line and the transmission line, or at the connection point between the optical high-frequency component and the transmission line. The two substrates are referred to as an upper substrate and a lower substrate. For example, consider a case where an optical high-frequency component and a wiring board are connected. A wiring substrate such as a flexible substrate is the upper substrate, and a ceramic substrate provided in the optical high-frequency component is the lower substrate.

上側基板には、高周波電気信号を伝搬させるために、マイクロストリップラインが形成される。上側基板には、さらに、マイクロストリップラインの一方側の端部に接続する端子部（以下、上側基板端部）が形成される。ここで、マイクロストリップラインは、高周波電気信号を伝搬するための伝送線路であり、基板の裏面側に接地電位となる接地導体層が形成され、基板の表面側に線状の信号配線パターンが形成される。また、光高周波部品に備えられる下側基板の端部には、端子部（以下、下側基板端子部）が形成される。上側基板端子部及び下側基板端子部は、ともに、接地用端子と信号用端子を含んでいる。上側基板端子部と下側基板端子部は、はんだ等の導電性接合材を介して、物理的に接して（重畳して）接続される。なお、特許文献１に、フレキシブルプリント基板の構造により、高周波を伝送する基板の共振周波数成分を使用帯域該とする光モジュールが開示されている。   A microstrip line is formed on the upper substrate in order to propagate a high-frequency electric signal. The upper substrate is further formed with a terminal portion (hereinafter referred to as an upper substrate end portion) connected to one end portion of the microstrip line. Here, the microstrip line is a transmission line for propagating a high-frequency electric signal, a ground conductor layer that is a ground potential is formed on the back side of the substrate, and a linear signal wiring pattern is formed on the front side of the substrate. Is done. A terminal portion (hereinafter referred to as a lower substrate terminal portion) is formed at an end portion of the lower substrate provided in the optical high frequency component. Both the upper substrate terminal portion and the lower substrate terminal portion include a ground terminal and a signal terminal. The upper substrate terminal portion and the lower substrate terminal portion are connected in physical contact (overlapping) via a conductive bonding material such as solder. Patent Document 1 discloses an optical module that uses a resonance frequency component of a substrate that transmits a high frequency as a use band due to the structure of the flexible printed circuit board.

特開２００９−９４３９０号公報JP 2009-94390 A

図７Ａ及び図７Ｂはそれぞれ、従来技術に係る上側基板１１１（例えば、配線基板）端部の平面図及び底面図である。図７Ａは上側基板１１１の表面（上面）を、図７Ｂは上側基板１１１の裏面（下面）を、それぞれ示している。図８は、従来技術に係る下側基板１１２（例えば、光高周波部品のセラミック基板）端部の平面図であり、下側基板１１２の表面（上面）を示している。ここでは、一例として、２対の差動伝送線路１２０が上側基板１１１に形成される場合について、示している。１つの差動伝送線路は、上側基板１１１の表面側に形成される１対の信号配線１２１Ａ，１２１Ｂと、基板の裏面側に形成される接地導体層１２２で構成される。   7A and 7B are a plan view and a bottom view, respectively, of an end portion of an upper substrate 111 (for example, a wiring substrate) according to the related art. 7A shows the surface (upper surface) of the upper substrate 111, and FIG. 7B shows the back surface (lower surface) of the upper substrate 111, respectively. FIG. 8 is a plan view of an end portion of a lower substrate 112 (for example, a ceramic substrate of an optical high-frequency component) according to the prior art, and shows a surface (upper surface) of the lower substrate 112. Here, as an example, a case where two pairs of differential transmission lines 120 are formed on the upper substrate 111 is shown. One differential transmission line includes a pair of signal wirings 121A and 121B formed on the front surface side of the upper substrate 111 and a ground conductor layer 122 formed on the back surface side of the substrate.

上側基板１１１の端部には、上側基板端子部１３１が形成されている。上側基板端子部１３１は、複数の接地用端子と、複数の信号用端子と、を含んでいる。それぞれの端子は、上側基板１１１の表面側に形成される表面端子と、上側基板１１１の裏面側に形成される裏面端子とを含んでおり、対をなしている。各対の表面端子と裏面端子とは、平面視して重畳しており、ビアホール１２３（via hole）を介して電気的に接続されている。図７Ａに示す通り、上側基板１１１の端部の表面に、図の左側から順に、接地用表面端子１４１、１対の信号用表面端子１４２Ａ，１４２Ｂと、が繰り返し並んで配置されており、一群の表面端子の両端はともに、接地用表面端子１４１である。図７Ｂに示す通り、上側基板１１１の端部の裏面には、図の左側から順に、接地用裏面端子１５１、１対の信号用裏面端子１５２Ｂ，１５２Ａと、が繰り返し並んで配置されており、一群の裏面端子の両端はともに、接地用裏面端子１５１である。   An upper substrate terminal portion 131 is formed at the end of the upper substrate 111. The upper substrate terminal portion 131 includes a plurality of grounding terminals and a plurality of signal terminals. Each terminal includes a front surface terminal formed on the front surface side of the upper substrate 111 and a back surface terminal formed on the rear surface side of the upper substrate 111, and forms a pair. The pair of front surface terminals and back surface terminals overlap in plan view and are electrically connected via via holes 123 (via holes). As shown in FIG. 7A, a ground surface terminal 141 and a pair of signal surface terminals 142A and 142B are repeatedly arranged on the surface of the end portion of the upper substrate 111 in order from the left side of the drawing. Both ends of the surface terminal are ground surface terminals 141. As shown in FIG. 7B, on the back surface of the end portion of the upper substrate 111, a grounding back surface terminal 151 and a pair of signal back surface terminals 152B, 152A are repeatedly arranged in order from the left side of the drawing. Both ends of the group of back terminals are ground back terminals 151.

下側基板１１２の端部には、下側基板端子部１３２が形成されている。下側基板端子部１３２は、複数の接地用端子と、複数の信号用端子と、を含んでいる。それぞれの端子は、下側基板１１２の表面側に形成される表面端子を含んでいる。図８に示す通り、下側基板１１２の端部の表面には、図の左側から順に、接地用表面端子１６１、１対の信号用表面端子１６２Ａ，１６２Ｂと、が繰り返し並んで配置されており、一群の表面端子の両端はともに、接地用表面端子１６１である。   A lower substrate terminal portion 132 is formed at an end portion of the lower substrate 112. The lower substrate terminal portion 132 includes a plurality of ground terminals and a plurality of signal terminals. Each terminal includes a surface terminal formed on the surface side of the lower substrate 112. As shown in FIG. 8, a ground surface terminal 161 and a pair of signal surface terminals 162A and 162B are repeatedly arranged in order from the left side of the figure on the surface of the end portion of the lower substrate 112. Both ends of the group of surface terminals are ground surface terminals 161.

前述の通り、上側基板１１１の上側基板端子部１３１と、下側基板１１２の下側基板端子部１３２とは、はんだを介して、物理的に接続されている。ここで、上側基板端子部１３１の上側基板裏面端子がはんだを介して下側基板端子部１３２の下側基板表面端子と重畳する接続領域を、図７Ｂに網掛けによって示している。なお、信号配線１２１Ａ（１２１Ｂ）と、信号用表面端子１４２Ａ（１４２Ｂ）とはひと続きの金属箔で形成されており、両者の間には、配線幅が変化する移行領域１２４が設けられる。なお、上側基板１１１の両面（表面及び裏面）にそれぞれ、カバーレイ１２５が形成される。   As described above, the upper substrate terminal portion 131 of the upper substrate 111 and the lower substrate terminal portion 132 of the lower substrate 112 are physically connected via solder. Here, a connection region in which the upper substrate back surface terminal of the upper substrate terminal portion 131 overlaps with the lower substrate surface terminal of the lower substrate terminal portion 132 through solder is shown by hatching in FIG. 7B. The signal wiring 121A (121B) and the signal surface terminal 142A (142B) are formed of a continuous metal foil, and a transition region 124 in which the wiring width changes is provided between them. Note that cover lays 125 are formed on both surfaces (front surface and back surface) of the upper substrate 111, respectively.

光高周波部品の集積化などの要請により、上側基板に形成される伝送線路の数が増大することが考えられる。それに伴い、上側基板１１１の幅は大きくなる。発明者らは、上側基板１１１の幅が大きくなり、上側基板１１１が固くなると、上側基板１１１と下側基板１１２の接続箇所において断線がより高い頻度で発生することを発見した。断線が高い頻度で発生することにより、光モジュールの故障発生率が高くなる問題があった。発明者らは、断線が発生する原因について検討した。その結果、上側基板１１１に外力が加えられると、上側基板の曲げに対して、平面視して接続領域の図の上端（図７Ａに、Ｂとして示す断面）付近に、上側基板１１１にかかる曲げ応力が集中する。これにより、信号配線１２１Ａ（１２１Ｂ）と、信号用表面端子１４２Ａ（１４２Ｂ）との間に位置する移行領域１２４付近で、断線が頻繁に発生することを、発明者らは発見した。各上側基板裏面端子の接続領域の上端が図の縦方向において一致しており（Ｂの矢印が貫く位置）、上側基板１１１にかかる複数回の外力が作用する場合でも、接続領域の上端付近に、上側基板１１１に係る曲げ応力が集中してしまう。   Due to requests for integration of optical high-frequency components, the number of transmission lines formed on the upper substrate may increase. Along with this, the width of the upper substrate 111 increases. The inventors have found that when the width of the upper substrate 111 is increased and the upper substrate 111 is hardened, disconnection occurs more frequently at the connection portion between the upper substrate 111 and the lower substrate 112. There has been a problem that the failure occurrence rate of the optical module is increased due to occurrence of disconnection at a high frequency. The inventors examined the cause of the disconnection. As a result, when an external force is applied to the upper substrate 111, the bending applied to the upper substrate 111 near the upper end of the connection region diagram (cross section shown as B in FIG. 7A) in plan view with respect to the bending of the upper substrate. Stress is concentrated. As a result, the inventors have found that disconnections frequently occur in the vicinity of the transition region 124 located between the signal wiring 121A (121B) and the signal surface terminal 142A (142B). The upper end of the connection region of each upper substrate back surface terminal coincides in the vertical direction of the figure (the position where the arrow B penetrates), and even when multiple external forces are applied to the upper substrate 111, it is near the upper end of the connection region. The bending stress related to the upper substrate 111 is concentrated.

本発明は、かかる課題を鑑みてなされたものであり、断線の発生が抑制される光モジュール、光送受信モジュール、及びフレキシブル基板の提供を目的とする。   The present invention has been made in view of such a problem, and an object thereof is to provide an optical module, an optical transceiver module, and a flexible substrate in which occurrence of disconnection is suppressed.

（１）上記課題を解決するために、本発明にかかる光モジュールは、１又は複数の伝送線路と、前記１又は複数の伝送線路に電気的に接続されるとともに、平面視して第１の方向に並び、裏面側に形成される複数の上側基板裏面端子と、を含む、上側基板と、前記複数の上側裏面端子それぞれに重なって接続され、表面側に形成される複数の下側基板表面端子を含む、下側基板と、を備える光モジュールであって、前記複数の上側基板裏面端子は、互いに隣り合うとともに、前記第１の方向に交差する第２の方向を前記下側基板側から前記伝送線路側へともに延伸する、第１裏面端子及び第２裏面端子を含み、前記第１裏面端子は、対応する前記下側基板表面端子と重畳する領域である第１接続領域を有し、前記第２裏面端子は、対応する前記下側基板表面端子と重畳する領域である第２接続領域を有し、前記第２接続領域の前記伝送線路側にある第２先端の位置は、前記第１接続領域の前記伝送線路側にある第１先端の位置より、前記第２の方向に沿って前記伝送線路側にある、ことを特徴とする。   (1) In order to solve the above problems, an optical module according to the present invention is electrically connected to one or a plurality of transmission lines and the one or a plurality of transmission lines, and is first in plan view. A plurality of upper substrate back surface terminals arranged in the direction and formed on the back surface side, and a plurality of lower substrate surfaces formed on the front surface side that are connected to and overlap each of the plurality of upper back surface terminals. A plurality of upper substrate rear surface terminals that are adjacent to each other and have a second direction intersecting the first direction from the lower substrate side. The first back surface terminal and the second back surface terminal that extend together toward the transmission line side, the first back surface terminal has a first connection region that is a region overlapping with the corresponding lower substrate surface terminal, The second back terminal is A second connection region which is a region overlapping with a lower substrate surface terminal, and a position of a second tip on the transmission line side of the second connection region is on the transmission line side of the first connection region It is characterized by being on the transmission line side along the second direction from the position of the first tip.

（２）上記（１）に記載の光モジュールであって、前記上側基板は、前記第１裏面端子の少なくとも一部と平面視して重畳して表面側に形成されるとともに、前記第１裏面端子と電気的に接続される第１表面端子と、表面側に形成されるとともに前記第１表面端子と電気的に接続される前記伝送線路の第１信号配線と、をさらに含んでもよい。   (2) In the optical module according to (1), the upper substrate is formed on the front surface side so as to overlap with at least a part of the first back surface terminal in plan view, and the first back surface. A first surface terminal electrically connected to the terminal and a first signal wiring of the transmission line formed on the surface side and electrically connected to the first surface terminal may be further included.

（３）上記（２）に記載の光モジュールであって、前記第１信号配線の幅は、前記第１表面端子の幅よりも狭くてもよい。   (3) In the optical module according to (2), the width of the first signal wiring may be narrower than the width of the first surface terminal.

（４）上記（１）乃至（３）のいずれかに記載の光モジュールであって、前記上側基板は、表面のうち、平面視して少なくとも前記第１接続領域を除いて形成される保護層をさらに含み、前記保護層は、前記第１接続領域の前記第１先端に対して、平面視して、前記第２の方向に沿って、前記第２接続領域の前記第２先端よりさらに前記下側基板側に及んでいてもよい。   (4) In the optical module according to any one of (1) to (3), the upper substrate is formed on the surface so as to exclude at least the first connection region in plan view. The protective layer further includes the protective layer further than the second tip of the second connection region along the second direction in plan view with respect to the first tip of the first connection region. It may extend to the lower substrate side.

（５）上記（１）乃至（４）のいずれかに記載の光モジュールであって、前記第２裏面端子は、前記第１の方向に並ぶ前記複数の上側基板裏面端子のうち、一方側の端に配置され、前記複数の上側基板裏面端子は、前記第２の方向を前記下側基板側から前記伝送線路側へともに延伸する、第３裏面端子及び第４裏面端子を含み、前記第４裏面端子は、前記複数の上側基板裏面端子のうち、前記一方側とは他方側の端に配置され、前記第３裏面端子は、対応する前記下側基板表面端子と重畳する領域である第３接続領域を有し、前記第４裏面端子は、対応する前記下側基板表面端子と重畳する領域である第４接続領域を有し、前記第４接続領域の前記伝送線路側にある第４先端の位置は、前記第３接続領域の前記伝送線路側にある第３先端の位置より、前記第２の方向に沿って前記伝送線路側にあってもよい。   (5) The optical module according to any one of (1) to (4), wherein the second back surface terminal is one of the plurality of upper substrate back surface terminals arranged in the first direction. The plurality of upper substrate back surface terminals are arranged at ends, and include a third back surface terminal and a fourth back surface terminal that extend in the second direction from the lower substrate side to the transmission line side, and A back terminal is disposed at an end on the other side of the plurality of upper substrate back terminals, and the third back terminal is a region overlapping with the corresponding lower substrate surface terminal. A fourth tip having a connection region, wherein the fourth back surface terminal has a fourth connection region that overlaps the corresponding lower substrate surface terminal, and is located on the transmission line side of the fourth connection region. The position of the third tip is located on the transmission line side of the third connection region. More may be in the transmission line side along the second direction.

（６）上記（１）乃至（５）のいずれかに記載の光モジュールであって、前記上側基板は、前記第２裏面端子の少なくとも一部と平面視して重畳して表面側に形成されるとともに、電気的に接続される第２表面端子、をさらに含んでもよい。   (6) In the optical module according to any one of (1) to (5), the upper substrate is formed on the front surface side so as to overlap with at least a part of the second back surface terminal in plan view. And a second surface terminal that is electrically connected.

（７）上記（６）に記載の光モジュールであって、前記上側基板は、前記第２裏面端子と前記第２表面端子とが平面視して重畳する領域に、前記上側基板の表面から裏面に貫くビアホール、をさらに含んでもよい。   (7) In the optical module according to (6), the upper substrate has a back surface from a surface of the upper substrate to a region where the second back surface terminal and the second surface terminal overlap in plan view. It may further include a via hole penetrating through.

（８）上記（１）乃至（７）のいずれかに記載の光モジュールであって、前記上側基板は、裏面側に形成される前記伝送線路の接地導体層、をさらに含み、前記第２裏面端子は、前記接地導体層に電気的に接続されてもよい。   (8) The optical module according to any one of (1) to (7), wherein the upper substrate further includes a ground conductor layer of the transmission line formed on a back surface side, and the second back surface The terminal may be electrically connected to the ground conductor layer.

（９）上記（１）乃至（７）のいずれかに記載の光モジュールであって、前記上側基板は、直流電圧配線、をさらに含み、前記第２裏面端子は、前記直流電圧配線に電気的に接続されてもよい。   (9) In the optical module according to any one of (1) to (7), the upper substrate further includes a DC voltage wiring, and the second back terminal is electrically connected to the DC voltage wiring. May be connected.

（１０）本発明に係る光送受信モジュールは、上記（１）乃至（９）のいずれかに記載の光モジュールと、他の光モジュールと、を備える光送受信モジュールであって、前記光モジュールと前記他の光モジュールのいずれか一方が光送信器であり、他方が光受信器であってもよい。   (10) An optical transceiver module according to the present invention is an optical transceiver module comprising the optical module according to any one of (1) to (9) above and another optical module, wherein the optical module and the optical module One of the other optical modules may be an optical transmitter, and the other may be an optical receiver.

（１１）本発明に係るフレキシブル基板は、１又は複数の伝送線路と、前記１又は複数の伝送線路に電気的に接続されるとともに、平面視して第１の方向に並び、裏面側に形成される複数の上側基板裏面端子と、を備える、フレキシブル基板であって、前記複数の上側基板裏面端子は、他の基板の表面側に形成される複数の下側基板表面端子それぞれと重なって接続され、前記複数の上側基板裏面端子は、互いに隣り合うとともに、前記第１の方向に交差する第２の方向を前記他の基板側から前記伝送線路側へともに延伸する、第１裏面端子及び第２裏面端子を含み、前記第１裏面端子は、対応する前記下側基板表面端子と重畳する領域である第１接続領域を有し、前記第２裏面端子は、対応する前記下側基板表面端子と重畳する領域である第２接続領域を有し、前記第２接続領域の前記伝送線路側にある第２先端の位置は、前記第１接続領域の前記伝送線路側にある第１先端の位置より、前記第２の方向に沿って前記伝送線路側にあってもよい。   (11) The flexible substrate according to the present invention is electrically connected to one or a plurality of transmission lines and the one or a plurality of transmission lines, arranged in a first direction in plan view, and formed on the back surface side A plurality of upper substrate back surface terminals, wherein the plurality of upper substrate back surface terminals are connected to overlap each of a plurality of lower substrate surface terminals formed on the surface side of another substrate. The plurality of upper substrate back surface terminals are adjacent to each other and extend in a second direction intersecting the first direction from the other substrate side to the transmission line side, The first back surface terminal includes a first connection region that overlaps the corresponding lower substrate surface terminal, and the second back surface terminal corresponds to the corresponding lower substrate surface terminal. Is a region that overlaps The second connection region has a second connection region, and the second connection region has a second tip position that is closer to the transmission line than the first connection point in the first connection region. Along the transmission line side.

本発明により、断線の発生が抑制される光モジュール、光送受信モジュール、及びフレキシブル基板が提供される。   The present invention provides an optical module, an optical transceiver module, and a flexible substrate in which occurrence of disconnection is suppressed.

本発明の第１の実施形態に係る光送受信モジュールの平面図である。1 is a plan view of an optical transceiver module according to a first embodiment of the present invention. 本発明の第１の実施形態に係るフレキシブル基板とセラミック基板の接続を示す模式図である。It is a schematic diagram which shows the connection of the flexible substrate and ceramic substrate which concern on the 1st Embodiment of this invention. 本発明の第１の実施形態に係るフレキシブル基板端部の平面図である。It is a top view of the flexible substrate end concerning a 1st embodiment of the present invention. 本発明の第１の実施形態に係るフレキシブル基板端部の底面図である。It is a bottom view of the flexible substrate end part concerning a 1st embodiment of the present invention. 本発明の第１の実施形態に係るセラミック基板端部の平面図である。It is a top view of the ceramic substrate end part concerning a 1st embodiment of the present invention. 本発明の第２の実施形態に係るフレキシブル基板端部の平面図である。It is a top view of the flexible substrate edge part concerning a 2nd embodiment of the present invention. 本発明の第２の実施形態に係るフレキシブル基板端部の底面図である。It is a bottom view of the flexible substrate end part concerning a 2nd embodiment of the present invention. 本発明の第２の実施形態に係るセラミック基板端部の平面図である。It is a top view of the ceramic substrate edge part which concerns on the 2nd Embodiment of this invention. 従来技術に係る上側基板端部の平面図である。It is a top view of the upper-side board | substrate edge part which concerns on a prior art. 従来技術に係る上側基板端部の底面図である。It is a bottom view of the upper-side board | substrate edge part which concerns on a prior art. 従来技術に係る下側基板端部の平面図である。It is a top view of the lower board | substrate edge part which concerns on a prior art.

以下に、図面に基づき、本発明の実施形態を具体的かつ詳細に説明する。なお、実施形態を説明するための全図において、同一の機能を有する部材には同一の符号を付し、その繰り返しの説明は省略する。なお、以下に示す図は、あくまで、実施形態の実施例を説明するものであって、図の大きさと本実施例記載の縮尺は必ずしも一致するものではない。   Hereinafter, embodiments of the present invention will be described specifically and in detail based on the drawings. Note that components having the same function are denoted by the same reference symbols throughout the drawings for describing the embodiments, and the repetitive description thereof will be omitted. In addition, the figure shown below demonstrates the Example of embodiment to the last, Comprising: The magnitude | size of a figure and the reduced scale as described in a present Example do not necessarily correspond.

［第１の実施形態］
図１は、本発明の第１の実施形態に係る光送受信モジュール１００の平面図である。図１は、光送受信モジュール１００の筐体内部に収納される部品を概略的に示している。具体的には、筐体１の上板（プリント基板２を基準として光受信部品３や光送信部品４等が実装される側の板状部材）を取り除いた状態を示している。なお、本実施例の光送受信モジュール１００はＣＦＰ２の規格に準拠した外形寸法を有しているが、他の規格に準拠した光モジュールや規格に準拠していない独自サイズの光送受信モジュールであってもよい。 [First Embodiment]
FIG. 1 is a plan view of an optical transceiver module 100 according to the first embodiment of the present invention. FIG. 1 schematically shows components housed in the housing of the optical transceiver module 100. Specifically, a state in which the upper plate of the housing 1 (a plate-like member on the side where the optical receiving component 3, the optical transmitting component 4 and the like are mounted with respect to the printed circuit board 2) is removed is shown. The optical transmission / reception module 100 of this embodiment has an external dimension conforming to the CFP2 standard, but is an optical module conforming to another standard or an optical transceiver module of a unique size not conforming to the standard. Also good.

図１に示す通り、筐体１の内部においては平板状のプリント基板２が固定されており、プリント基板２上には、主要光部品である光受信部品３（ＲＯＳＡ）と、光送信部品４（ＴＯＳＡ）と、が実装されており、これら光部品は、部品用トレイ５によってプリント基板２上に固定されている。なお、光受信部品３及び光送信部品４は、光高周波部品の例である。   As shown in FIG. 1, a flat printed board 2 is fixed inside the housing 1, and on the printed board 2, an optical receiving component 3 (ROSA) that is a main optical component, and an optical transmitting component 4. (TOSA) are mounted, and these optical components are fixed on the printed circuit board 2 by a component tray 5. The optical receiving component 3 and the optical transmitting component 4 are examples of optical high frequency components.

光送受信モジュール１００の光レセプタクル６の光受信用の光レセプタクル側から入力される光信号は、光ファイバ９２を通って、光ファイバ９２を保持する光ファイバトレイ７を経て、光受信部品３で電気信号に変換される。光受信部品３に、フレキシブル基板１１（ＦＰＣ：Flexible Printed Circuit）が接続されており、光受信部品３が出力する高周波の電気信号がフレキシブル基板１１上の伝送線路を伝搬する。また、光受信部品３は、セラミック基板１２（図示せず）を備えている。フレキシブル基板１１（上側基板）の端部には、上側基板端子部３１（図示せず）が形成されており、セラミック基板１２（下側基板）の端部には、下側基板端子部３２（図示せず）が形成されており、上側基板端子部３１と下側基板端子部３２がはんだを介して接続される。光受信部品３が出力する電気信号は、フレキシブル基板１１を経て、電気高周波部品８（増幅器）で増幅され、カードエッジコネクタ９に接続された機器に出力される。なお、光送受信モジュール１００のうち、光信号が入力される光レセプタクル６の光受信用の部分から、光受信部品３を含み、電気信号が出力されるカードエッジコネクタ９の光受信用の部分までが、光受信モジュールに相当する領域（機能）である。   An optical signal input from the optical receiving side of the optical receptacle 6 of the optical transceiver module 100 passes through the optical fiber 92, passes through the optical fiber tray 7 that holds the optical fiber 92, and is electrically supplied by the optical receiving component 3. Converted to a signal. A flexible substrate 11 (FPC: Flexible Printed Circuit) is connected to the optical receiving component 3, and a high-frequency electric signal output from the optical receiving component 3 propagates through a transmission line on the flexible substrate 11. The optical receiving component 3 includes a ceramic substrate 12 (not shown). An upper substrate terminal portion 31 (not shown) is formed at the end of the flexible substrate 11 (upper substrate), and a lower substrate terminal portion 32 (at the end of the ceramic substrate 12 (lower substrate)). (Not shown) is formed, and the upper substrate terminal portion 31 and the lower substrate terminal portion 32 are connected via solder. The electric signal output from the optical receiving component 3 is amplified by the electric high frequency component 8 (amplifier) through the flexible substrate 11 and output to the device connected to the card edge connector 9. In the optical transceiver module 100, from the optical receiving portion of the optical receptacle 6 to which an optical signal is input to the optical receiving portion of the card edge connector 9 that includes the optical receiving component 3 and outputs an electrical signal. Is an area (function) corresponding to the optical receiving module.

また、光送受信モジュール１００のカードエッジコネクタ９に接続された機器から入力される電気信号は、電気高周波部品１０（増幅器）で増幅され、フレキシブル基板９１を経て、光送信部品４で光信号に変換される。光送信部品４にて変換された光信号は、光ファイバ９２や合波器を経て光レセプタクル６から出力される。なお、光送受信モジュール１００のうち、電気信号が入力されるカードエッジコネクタ９の光送信用の部分から、光送信部品４を含み、光信号が出力される光レセプタクル６の光送信用の部分までが、光送信モジュールに相当する領域（機能）である。   In addition, an electrical signal input from a device connected to the card edge connector 9 of the optical transceiver module 100 is amplified by an electrical high-frequency component 10 (amplifier), converted into an optical signal by the optical transmission component 4 via the flexible substrate 91. Is done. The optical signal converted by the optical transmission component 4 is output from the optical receptacle 6 via the optical fiber 92 and the multiplexer. In the optical transceiver module 100, from the optical transmission part of the card edge connector 9 to which an electrical signal is input to the optical transmission part of the optical receptacle 6 that includes the optical transmission component 4 and that outputs the optical signal. Is an area (function) corresponding to the optical transmission module.

本発明の主な特徴は、フレキシブル基板１１の上側基板端子部３１の構成にある。以下、これについて説明する。なお、本明細書において、光モジュールとは、光送信モジュール（光送信器）又は光受信モジュール（光受信器）のいずれかを指すものとする。また、光送受信モジュールとは、光送信モジュール及び光受信モジュールを備えるものである。   The main feature of the present invention is the configuration of the upper substrate terminal portion 31 of the flexible substrate 11. This will be described below. In this specification, an optical module refers to either an optical transmission module (optical transmitter) or an optical reception module (optical receiver). The optical transmission / reception module includes an optical transmission module and an optical reception module.

図２は、当該実施形態に係るフレキシブル基板１１とセラミック基板１２の接続を示す模式図であり、フレキシブル基板１１とその周辺部品の側面を示している。図２に示す通り、光受信部品３と、プリント基板２との間に、フレキシブル基板１１が配置され、フレキシブル基板１１の一方の端部は、光受信部品３のセラミック基板１２と、接続される。なお、実際には、光受信部品３は、前述の通り、プリント基板２上の部品用トレイ５に固定されているが、簡単のために、光受信部品３とプリント基板２は離れて示されている。なお、本願発明は光受信部品３（または光送信部品４）がプリント基板２上に固定されず、互いが重畳していない場合であっても適用できる。   FIG. 2 is a schematic diagram showing the connection between the flexible substrate 11 and the ceramic substrate 12 according to the embodiment, and shows the side surfaces of the flexible substrate 11 and its peripheral components. As shown in FIG. 2, the flexible substrate 11 is disposed between the optical receiving component 3 and the printed circuit board 2, and one end of the flexible substrate 11 is connected to the ceramic substrate 12 of the optical receiving component 3. . In practice, the optical receiving component 3 is fixed to the component tray 5 on the printed circuit board 2 as described above. However, for the sake of simplicity, the optical receiving component 3 and the printed circuit board 2 are shown apart from each other. ing. The present invention can be applied even when the optical receiving component 3 (or the optical transmitting component 4) is not fixed on the printed circuit board 2 and is not superimposed on each other.

図３Ａ及び図３Ｂはそれぞれ、当該実施形態に係るフレキシブル基板１１（上側基板）端部の平面図及び底面図である。図３Ａはフレキシブル基板１１の表面（上面）を、図３Ｂはフレキシブル基板１１の裏面（下面）を、それぞれ示している。図４は、当該実施形態に係るセラミック基板１２（下側基板）端部の平面図であり、セラミック基板１２の表面（上面）を示している。フレキシブル基板１１には、１又は複数の伝送線路が形成されており、ここでは、一例として、２対の差動伝送線路２０が形成される場合について、示している。１つの差動伝送線路は、フレキシブル基板１１の表面側に形成される１対の信号配線２１Ａ，２１Ｂと、フレキシブル基板１１の裏面側に形成される接地導体層２２で構成される。   3A and 3B are a plan view and a bottom view, respectively, of the end portion of the flexible substrate 11 (upper substrate) according to the embodiment. 3A shows the front surface (upper surface) of the flexible substrate 11, and FIG. 3B shows the back surface (lower surface) of the flexible substrate 11. FIG. 4 is a plan view of the end portion of the ceramic substrate 12 (lower substrate) according to this embodiment, and shows the surface (upper surface) of the ceramic substrate 12. One or a plurality of transmission lines are formed on the flexible substrate 11. Here, as an example, a case where two pairs of differential transmission lines 20 are formed is shown. One differential transmission line includes a pair of signal wirings 21 </ b> A and 21 </ b> B formed on the front surface side of the flexible substrate 11 and a ground conductor layer 22 formed on the back surface side of the flexible substrate 11.

フレキシブル基板１１の端部には、上側基板端子部３１が形成されており、ここでは、上側基板端子部３１は、２対の差動伝送線路２０と、移行領域２４を介して、電気的に接続されている。上側基板端子部３１は、複数の接地用端子と、複数の信号用端子と、を含んでいる。それぞれの端子は、フレキシブル基板１１の表面側に形成される上側基板表面端子と、フレキシブル基板１１の裏面側に形成される上側基板裏面端子とを含んでおり、対をなしている。各対の表面端子と裏面端子とは平面視して重畳しており、その重畳する領域にフレキシブル基板１１の表面から裏面に貫く複数のビアホール２３が形成されている。ビアホール２３の内壁は金属メッキ加工が施されるなどしており、表面端子と裏面端子とは、複数のビアホール２３を介して電気的に接続されている。図３Ａに示す通り、フレキシブル基板１１の端部の表面に、平面視して図の横方向（第１の方向）に左側から右側へ順に、接地用表面端子４１Ｌ、１対の信号用表面端子４２Ａ，４２Ｂ、接地用表面端子４１Ｓ、１対の信号用表面端子４２Ａ，４２Ｂ、及び接地用表面端子４１Ｌが、並んで配置されている。横方向に並ぶ複数の表面端子の両端はともに、接地用表面端子４１Ｌである。当該実施形態では、複数の表面端子はともに、フレキシブル基板１１の下端から延伸しており、両端にある接地用表面端子４１Ｌは縦方向に沿う長さが等しく、他の表面端子（信号用表面端子４２Ａ，４２Ｂ及び接地用表面端子４１Ｓ）はともに長さが等しく、両端にある接地用表面端子４１Ｌの長さが、他の表面端子の長さより長くなっている。図３Ｂに示す通り、フレキシブル基板１１の端部の裏面には、平面視して図の横方向（第１の方向）に左側から右側へ順に、接地用裏面端子５１Ｌ、１対の信号用裏面端子５２Ｂ，５２Ａ、接地用裏面端子５１Ｓ、１対の信号用裏面端子５２Ｂ，５２Ａ、及び接地用裏面端子５１Ｌが、並んで配置されている。横方向に並ぶ複数の裏面端子の両端はともに、接地用裏面端子５１Ｌである。   An upper substrate terminal portion 31 is formed at an end portion of the flexible substrate 11. Here, the upper substrate terminal portion 31 is electrically connected via two pairs of differential transmission lines 20 and a transition region 24. It is connected. The upper substrate terminal portion 31 includes a plurality of grounding terminals and a plurality of signal terminals. Each terminal includes an upper substrate front surface terminal formed on the front surface side of the flexible substrate 11 and an upper substrate rear surface terminal formed on the back surface side of the flexible substrate 11 and forms a pair. Each pair of front surface terminals and rear surface terminals overlap in plan view, and a plurality of via holes 23 penetrating from the front surface to the rear surface of the flexible substrate 11 are formed in the overlapping region. The inner wall of the via hole 23 is subjected to metal plating or the like, and the front surface terminal and the back surface terminal are electrically connected via the plurality of via holes 23. As shown in FIG. 3A, on the surface of the end portion of the flexible substrate 11, a ground surface terminal 41 </ b> L and a pair of signal surface terminals are sequentially viewed from the left side to the right side in the horizontal direction (first direction) in the drawing in plan view. 42A, 42B, a ground surface terminal 41S, a pair of signal surface terminals 42A, 42B, and a ground surface terminal 41L are arranged side by side. Both ends of the plurality of surface terminals arranged in the horizontal direction are ground surface terminals 41L. In this embodiment, the plurality of surface terminals are all extended from the lower end of the flexible substrate 11, and the ground surface terminals 41L at both ends are equal in length along the vertical direction, and other surface terminals (signal surface terminals) 42A, 42B and the grounding surface terminal 41S) are equal in length, and the length of the grounding surface terminal 41L at both ends is longer than the length of the other surface terminals. As shown in FIG. 3B, the back surface of the end portion of the flexible substrate 11 has a ground back surface terminal 51L and a pair of signal back surfaces in order from the left side to the right side in the horizontal direction (first direction) in the drawing in plan view. Terminals 52B and 52A, grounding back surface terminal 51S, a pair of signal back surface terminals 52B and 52A, and grounding back surface terminal 51L are arranged side by side. Both ends of the plurality of back terminals arranged in the horizontal direction are ground back terminals 51L.

セラミック基板１２の端部には、下側基板端子部３２が形成されている。下側基板端子部３２は、複数の接地用端子と、複数の信号用端子と、を含んでいる。それぞれの端子は、セラミック基板１２の表面側に形成される下側基板表面端子を含んでいる。フレキシブル基板１１の複数の上側基板裏面端子それぞれは、セラミック基板１２の複数の下側基板表面端子と重なって接続される。図４に示す通り、セラミック基板１２の端部の表面には、平面視して図の横方向に左側から右側へ順に、接地用表面端子６１Ｌ、１対の信号用表面端子６２Ａ，６２Ｂ、接地用表面端子６１Ｓ、１対の信号用表面端子６２Ａ，６２Ｂ、及び接地用表面端子６１Ｌが、並んで配置されている。   A lower substrate terminal portion 32 is formed at the end of the ceramic substrate 12. The lower substrate terminal portion 32 includes a plurality of ground terminals and a plurality of signal terminals. Each terminal includes a lower substrate surface terminal formed on the surface side of the ceramic substrate 12. Each of the plurality of upper substrate rear surface terminals of the flexible substrate 11 is connected to overlap with the plurality of lower substrate surface terminals of the ceramic substrate 12. As shown in FIG. 4, the surface of the end portion of the ceramic substrate 12 has a ground surface terminal 61L, a pair of signal surface terminals 62A and 62B, and a ground in order from the left side to the right side in a plan view. A front surface terminal 61S, a pair of signal surface terminals 62A and 62B, and a ground surface terminal 61L are arranged side by side.

図３Ａ及び図３Ｂに示す通り、上側基板端子部３１の上側基板表面端子及び上側基板裏面端子はすべて、フレキシブル基板１１の図の下端から、縦方向（第２の方向）を下側から上側へ、帯形状に（矩形状に）延伸している。ここで、第１の方向（図の横方向）と第２の方向（図の縦方向）は互いに交差している。第１の方向と第２の方向は、９０度±５度の範囲で交差しているのが望ましく、直交しているのがさらに望ましい。同様に、図４に示す通り、下側基板端子部３２の下側基板表面端子はすべて、セラミック基板１２の表面を縦方向を上側から下側に、帯形状に延伸している。   As shown in FIGS. 3A and 3B, the upper substrate front surface terminal and the upper substrate rear surface terminal of the upper substrate terminal portion 31 are all from the lower end of the drawing of the flexible substrate 11 in the vertical direction (second direction) from the lower side to the upper side. It is stretched in a band shape (rectangular shape). Here, the first direction (horizontal direction in the figure) and the second direction (vertical direction in the figure) intersect each other. The first direction and the second direction preferably cross each other within a range of 90 ° ± 5 °, and more preferably are orthogonal. Similarly, as shown in FIG. 4, all the lower substrate surface terminals of the lower substrate terminal portion 32 extend the surface of the ceramic substrate 12 in a band shape from the upper side to the lower side.

図３Ａに示す通り、信号用表面端子４２Ａ（４２Ｂ）は所定の幅（例えば、第１の幅とする）で、フレキシブル基板１１の端部（縁）から帯形状に延伸し、移行領域２４において、幅を狭めながらさらに延伸し、信号配線２１Ａ（２１Ｂ）は他の所定の幅（例えば、第２の幅とする）でさらに直線状に延伸する。また、図３Ｂに示す通り、接地用裏面端子５１Ｓ，５１Ｌは所定の幅で、フレキシブル基板１１の端部（縁）から帯形状に延伸し、接地導体層２２に接続している。ここで、基板上に形成される端子は金属端子であり、銅箔などの金属箔によって形成されている。同様に、信号配線や接地導体層も同様に、銅箔などの金属箔によって形成されている。図３Ａに示す信号配線２１Ａ（２１Ｂ）及び信号用表面端子４２Ａ（４２Ｂ）は、ひと続きの金属箔で形成されている。同様に、図３Ｂに示す接地導体層２２は接地用裏面端子５１Ｓ，５１Ｌは、ひと続きの金属箔で形成されている。しかしながら、端子や信号配線、接地導体層は、金属箔に限定されることはなく、十分な導電性が得られるのであれば、他の材料などであってもよい。さらに、図３Ａ及び図３Ｂに示す通り、フレキシブル基板１１の表面及び裏面を覆って、レジスト２６及びカバーレイ２５が、順に形成されている。なお、レジスト２６及びカバーレイ２５は、端子が形成される領域には形成されていない。   As shown in FIG. 3A, the signal surface terminal 42 </ b> A (42 </ b> B) has a predetermined width (for example, the first width), extends from the end (edge) of the flexible substrate 11 into a band shape, and in the transition region 24. The signal wiring 21A (21B) is further extended in a straight line with another predetermined width (for example, the second width) while narrowing the width. Further, as shown in FIG. 3B, the grounding back terminals 51 </ b> S and 51 </ b> L have a predetermined width, extend from the end (edge) of the flexible substrate 11 in a band shape, and are connected to the grounding conductor layer 22. Here, the terminal formed on a board | substrate is a metal terminal, and is formed with metal foil, such as copper foil. Similarly, the signal wiring and the ground conductor layer are similarly formed of a metal foil such as a copper foil. The signal wiring 21A (21B) and the signal surface terminal 42A (42B) shown in FIG. 3A are formed of a continuous metal foil. Similarly, in the ground conductor layer 22 shown in FIG. 3B, the grounding back terminals 51S and 51L are formed of a continuous metal foil. However, the terminal, the signal wiring, and the ground conductor layer are not limited to the metal foil, and may be other materials as long as sufficient conductivity is obtained. Further, as shown in FIGS. 3A and 3B, a resist 26 and a cover lay 25 are sequentially formed so as to cover the front surface and the back surface of the flexible substrate 11. Note that the resist 26 and the cover lay 25 are not formed in the region where the terminals are formed.

フレキシブル基板１１とセラミック基板１２とは、フレキシブル基板１１の上側基板裏面端子と、セラミック基板１２の下側基板表面端子とが、はんだ等の導電性接合材を介して、物理的に接して（重畳して）接続される。ここで、上側基板裏面端子が、対応する下側基板表面端子と重畳する領域を有しており、かかる領域を接続領域とする。上側基板裏面端子の接続領域は、図３Ｂに網掛けの領域として示されている。当該実施形態では、複数の裏面端子は、表面端子と同様に、フレキシブル基板１１の下端から延伸しており、両端にある接地用裏面端子５１Ｌの接続領域は縦方向に沿う長さが等しく、他の裏面端子（信号用裏面端子５２Ａ，５２Ｂ及び接地用裏面端子５１Ｓ）の接続領域はともに長さが等しく、両端にある接地用裏面端子５１Ｌの接続領域の長さが、他の裏面端子の接続領域の長さより長くなっている。図３Ｂに示す通り、接地用裏面端子５１Ｓ，５１Ｌは接地導体層２２に接続しているので、下側基板表面端子に重なって接続される接続領域を上側基板裏面端子の領域と定義してもよい。また、セラミック基板１２の下側基板表面端子の形状は、上側基板裏面端子の接続領域に対応して決定される。   The flexible substrate 11 and the ceramic substrate 12 are in physical contact (overlapping) between the upper substrate back surface terminal of the flexible substrate 11 and the lower substrate surface terminal of the ceramic substrate 12 via a conductive bonding material such as solder. Connected). Here, the upper substrate back surface terminal has a region overlapping with the corresponding lower substrate surface terminal, and this region is defined as a connection region. The connection area of the upper substrate back terminal is shown as a shaded area in FIG. 3B. In the present embodiment, the plurality of back terminals are extended from the lower end of the flexible substrate 11 like the front terminals, and the connection regions of the ground back terminals 51L at both ends are equal in length along the vertical direction. The connection areas of the back terminals (signal back terminals 52A and 52B and grounding back terminal 51S) are equal in length, and the length of the connection area of the grounding back terminal 51L at both ends is the connection of the other back terminal. It is longer than the length of the area. As shown in FIG. 3B, since the grounding back terminals 51S and 51L are connected to the ground conductor layer 22, even if the connection region connected to overlap with the lower substrate surface terminal is defined as the region of the upper substrate back surface terminal. Good. Further, the shape of the lower substrate front surface terminal of the ceramic substrate 12 is determined corresponding to the connection region of the upper substrate rear surface terminal.

本発明の主な特徴は、複数の上側基板裏面端子に含まれ、互いに隣り合って配置される第１裏面端子及び第２裏面端子の構造にあり、具体的には、第２裏面端子の接続領域である第２接続領域の先端（第２先端）の位置が、第１裏面端子の接続領域である第１接続領域の先端（第１先端）の位置より、第２の方向に沿って伝送線路側にあることにある。ここで、第１裏面端子及び第２裏面端子は、第２の方向に沿って延伸しているが、第２の方向（図３Ｂの縦方向）に沿って、図３Ｂの下側が下側基板側であり、上側が伝送線路側である。電気信号の伝搬方向を考えると、例えば、下側基板の下側基板端子から、上側基板の上側基板端子を経て、伝送線路へ伝搬しているからである。又は、その逆もあり得る。すなわち、第１先端（第２先端）は、第１接続領域（第２接続領域）の第２の方向における両端のうち伝送線路側にある端である。一般に、上側基板に外部から外力がかかる場合には、接続領域の先端付近、すなわち、下側基板と接続する部分と接続していない部分との境界付近が、上側基板の主に曲がる箇所となる。しかしながら、本発明においては、第２裏面端子の第２先端が、第１裏面端子の第１先端より、第２の方向に沿ってより配線側に位置することにより、上側基板に外力がかかる場合であっても、第１裏面端子の第１先端付近に上側基板の曲げ箇所として応力が集中することを抑制することが出来る。図７Ａ及び図７Ｂに示す従来技術に係る上側基板１１１のように、複数の上側基板裏面端子の接続領域の先端が縦方向（第２の方向）において同じ位置（図に示すＢ）である場合、上側基板１１１の曲げ箇所が、接続領域の先端（図に示すＢ）を貫く断面にかかり、複数回の外力Ｓがかかった場合に、毎回同じ位置に直線状に曲げ応力が集中するため、断線し易い。本発明に係る上側基板では、複数回の外力Ｓがかかった場合、固定されている第１の先端(Ｐ１)と第２の先端(Ｐ２)の位置が違うことと、曲げ応力のかかり方が曲線状であることより、複数回の外力Ｓが掛かった場合に、応力を集中しにくく曲線状に分散させることができる。それゆえ、信号配線の断線を抑制し、故障発生率の低い、高信頼性の光モジュールを実現することができる。   The main feature of the present invention is the structure of the first back surface terminal and the second back surface terminal that are included in the plurality of upper substrate back surface terminals and arranged adjacent to each other. Specifically, the connection of the second back surface terminals The position of the tip (second tip) of the second connection region that is the region is transmitted along the second direction from the position of the tip (first tip) of the first connection region that is the connection region of the first back terminal. It is on the track side. Here, although the first back terminal and the second back terminal extend along the second direction, the lower side of FIG. 3B is the lower substrate along the second direction (vertical direction of FIG. 3B). The upper side is the transmission line side. Considering the propagation direction of the electric signal, for example, it propagates from the lower board terminal of the lower board to the transmission line through the upper board terminal of the upper board. Or vice versa. That is, the first tip (second tip) is the end on the transmission line side of both ends in the second direction of the first connection region (second connection region). In general, when an external force is applied to the upper substrate from the outside, the vicinity of the tip of the connection region, that is, the boundary between the portion connected to the lower substrate and the portion not connected, is a location where the upper substrate is mainly bent. . However, in the present invention, when the second tip of the second back terminal is located closer to the wiring side in the second direction than the first tip of the first back terminal, an external force is applied to the upper substrate. Even in this case, it is possible to prevent stress from being concentrated as a bent portion of the upper substrate near the first tip of the first back surface terminal. When the tips of the connection regions of the plurality of upper substrate back surface terminals are at the same position (B shown in the figure) in the vertical direction (second direction) as in the upper substrate 111 according to the prior art shown in FIGS. 7A and 7B The bending portion of the upper substrate 111 is applied to the cross section passing through the tip of the connection region (B shown in the figure), and when a plurality of external forces S are applied, the bending stress concentrates linearly at the same position every time. Easy to break. In the upper substrate according to the present invention, when the external force S is applied a plurality of times, the positions of the fixed first tip (P1) and second tip (P2) are different, and how bending stress is applied. Due to the curved shape, when the external force S is applied a plurality of times, the stress is less likely to be concentrated and can be dispersed in a curved shape. Therefore, it is possible to realize a highly reliable optical module that suppresses disconnection of signal wiring and has a low failure rate.

当該実施形態において、第２裏面端子は、例えば、横方向に並ぶ複数の上側基板裏面端子のうち、図３Ｂに示す左端に位置する接地用裏面端子５１Ｌであり、第１裏面端子は、左端から２番目に位置する信号用裏面端子５２Ｂである。接地用裏面端子５１Ｌの接続領域の先端（第２先端）の位置がＰ２として、信号用裏面端子５２Ｂの接続領域の先端（第１先端）の位置がＰ１として、それぞれ図に示されている。   In the present embodiment, the second back terminal is, for example, the grounding back terminal 51L located at the left end shown in FIG. 3B among the plurality of upper substrate back terminals arranged in the horizontal direction, and the first back terminal is from the left end. This is the second signal rear surface terminal 52B. The position of the tip (second tip) of the connection area of the grounding back terminal 51L is shown as P2, and the position of the tip (first tip) of the connection area of the signal back terminal 52B is shown as P1.

第１裏面端子である信号用裏面端子５２Ｂは、ビアホール２３を介して、図３Ａの右端から２番目に位置する信号用表面端子４２Ｂ（第１表面端子）と電気的に接続しており、信号用表面端子４２Ｂは信号配線２１Ｂ（第１信号配線）に接続している。上側基板裏面端子の接続領域は、物理的及び電気的な接続を安定的に得るために、所定の幅以上を確保することが必要である。これに対して、差動伝送線路の信号配線の幅は、配線インピーダンスによって決定されるが、一般には、接続領域（端子）の幅より狭い。それゆえ、図３Ａに示す通り、信号用表面端子４２Ａ，４２Ｂの幅より、移行領域２４において幅が狭くなり、幅が狭い信号配線２１Ａ，２１Ｂとなる。また、フレキシブル基板１１の裏面には、接地導体層２２が設けられるが、信号用端子は、接地導体層２２と電気的に絶縁している必要があるので、接地導体層２２は、信号用裏面端子５２Ａ，５２Ｂから離間しており、図３Ｂの縦方向に沿って、信号用裏面端子５２Ａ，５２Ｂの先端と、接地導体層２２の間には、導体層が設けられない隙間領域が存在する。   The signal back surface terminal 52B, which is the first back surface terminal, is electrically connected to the signal surface terminal 42B (first surface terminal) located second from the right end in FIG. The front surface terminal 42B is connected to the signal wiring 21B (first signal wiring). In order to stably obtain physical and electrical connection, it is necessary to secure a connection width of the upper substrate back surface terminal with a predetermined width or more. In contrast, the width of the signal wiring of the differential transmission line is determined by the wiring impedance, but is generally narrower than the width of the connection region (terminal). Therefore, as shown in FIG. 3A, the width of the transition region 24 is narrower than the width of the signal surface terminals 42A and 42B, and the signal wirings 21A and 21B are narrow. Further, the ground conductor layer 22 is provided on the back surface of the flexible substrate 11. However, since the signal terminal needs to be electrically insulated from the ground conductor layer 22, the ground conductor layer 22 is provided on the back surface for signal. A gap area where no conductor layer is provided exists between the tips of the signal back terminals 52A and 52B and the ground conductor layer 22 along the vertical direction of FIG. 3B. .

さらに、信号用表面端子４２Ａ，４２Ｂの先端付近（移行領域２４）は、断線が生じる可能性が高い箇所であるが、当該実施形態においては、第２裏面端子（接地用裏面端子５１Ｌ）の第２先端（Ｐ２）が、第１裏面端子（信号用裏面端子５２Ｂ）の第１先端（Ｐ１）と比べて、フレキシブル基板１１の端部（下端）より、より遠い（さらに上側の）位置にあるので、フレキシブル基板１１に外力がかかる場合に、第１先端付近に曲げ応力が集中することが抑制され、平面視して上側基板表面端子部付近にある信号配線２０や移行領域２４での断線が抑制される。   Further, the vicinity of the tip of the signal surface terminals 42A and 42B (transition region 24) is a place where the possibility of disconnection is high, but in this embodiment, the second back terminal (the ground back terminal 51L) is the first. 2 The tip (P2) is at a position farther (further above) than the end (lower end) of the flexible substrate 11 compared to the first tip (P1) of the first back terminal (signal back terminal 52B). Therefore, when an external force is applied to the flexible substrate 11, the bending stress is suppressed from concentrating near the first tip, and disconnection in the signal wiring 20 and the transition region 24 near the upper substrate surface terminal portion in plan view is prevented. It is suppressed.

反対に、第２裏面端子の第２先端付近には、より大きい曲げ応力がかかることとなるが、固定されている第１の先端(Ｐ１)と第２の先端(Ｐ２)の位置が違うことと、曲げ応力のかかり方が曲線状であることより、従来技術に係る上側基板１１１と比べると、応力を集中しにくく曲線状に分散させることができている。また、当該実施形態の場合、接地用裏面端子５１Ｌは、接地導体層２２に接続しており、第２接続領域の先端のみならず、図３Ｂの右辺の一部が配線幅の広い接地導体層２２と接している。それゆえ、フレキシブル基板１１に外力がかかり、曲げ応力が先端付近にかかる場合であっても、接地導体層２２と接地用裏面端子５１Ｌとが断絶する可能性は非常に抑制されている。また、接地導体層２２に接続する接地用端子は複数あるので、その観点からも接続の安定性は確保されている。それゆえ、第２裏面端子を接地用端子に選択することにより、接続箇所における断線の発生が抑制されることとなる。   Conversely, a greater bending stress is applied near the second tip of the second back terminal, but the positions of the fixed first tip (P1) and second tip (P2) are different. Since the bending stress is applied in a curved line, the stress is less concentrated and can be distributed in a curved line compared to the upper substrate 111 according to the prior art. Further, in the case of this embodiment, the grounding back surface terminal 51L is connected to the grounding conductor layer 22, and not only the tip of the second connection region but also a part of the right side of FIG. 22 is in contact. Therefore, even when an external force is applied to the flexible substrate 11 and a bending stress is applied to the vicinity of the tip, the possibility that the ground conductor layer 22 and the grounding back terminal 51L are disconnected is extremely suppressed. In addition, since there are a plurality of ground terminals connected to the ground conductor layer 22, the stability of the connection is ensured also from this viewpoint. Therefore, by selecting the second back terminal as the ground terminal, occurrence of disconnection at the connection location is suppressed.

当該実施形態では、第２裏面端子は接地用端子としているが、これに限定されることがないのは言うまでもない。伝送線路の信号配線と比べて、電源配線など直流電圧配線は、インピーダンス整合などの制約もないので、配線幅を十分に確保することが出来る。それゆえ、上側配線が直流電圧配線を含み、第２裏面端子を、直流電圧配線に電気的に接続される端子としてもよい。また、第２裏面端子を、フレキシブル基板１１上の配線（信号配線など）には接続されないダミー端子としてもよい。その場合は、第２裏面端子に対応する下側基板表面端子をダミー端子とすることとなる。   In the present embodiment, the second back terminal is a grounding terminal, but it goes without saying that the present invention is not limited to this. Compared with the signal wiring of the transmission line, the DC voltage wiring such as the power supply wiring has no restriction such as impedance matching, so that the wiring width can be sufficiently secured. Therefore, the upper wiring may include a DC voltage wiring, and the second back surface terminal may be a terminal electrically connected to the DC voltage wiring. The second back terminal may be a dummy terminal that is not connected to a wiring (such as a signal wiring) on the flexible substrate 11. In that case, the lower substrate surface terminal corresponding to the second back terminal is a dummy terminal.

フレキシブル基板１１の上側基板表面端子のうち、信号用表面端子４２Ａ，４２Ｂは、信号用裏面端子５２Ａ，５２Ｂと信号配線２１Ａ，２１Ｂを電気的に接続する役割を担っている。しかしながら、接地用表面端子４１Ｓ，４１Ｌは、ビアホール２３を介して、接地用裏面端子５１Ｓ，５１Ｌと電気的に接続しているが、接地導体層２２との電気的に接続する役割は担っていない。しかしながら、当該実施形態において、上側基板裏面端子と下側基板表面端子ははんだによって接合されている。接合の際、はんだを溶解させるために熱を加える必要があるが、上側基板表面端子を熱することで、ビアホール２３を介して上側基板裏面端子を熱することが出来る。すなわち、上側基板表面端子は、上側基板裏面端子へ熱を伝える役割も担っている。それゆえ、接地用表面端子４１Ｌ（第２表面端子）を、平面視して接地用裏面端子５１Ｌ（第２裏面端子）とより重畳するよう、接地用裏面端子５１Ｌ（第２裏面端子）の長さに対応して長くして形成することが望ましい。また、電気的な接続に加えて、熱伝導の観点からも、接地用表面端子４１Ｌ（第２表面端子）と接地用裏面端子５１Ｌ（第２裏面端子）とが平面視して重畳する領域に、ビアホール２３が設けられることが望ましい。それゆえ、当該実施形態に係る上側基板端子部３１は、はんだ等によって接続する場合など、熱を上側裏面端子へ伝えるのに望ましい構造となっている。   Of the upper substrate surface terminals of the flexible substrate 11, the signal surface terminals 42A and 42B play a role of electrically connecting the signal back terminals 52A and 52B and the signal wirings 21A and 21B. However, although the grounding surface terminals 41S and 41L are electrically connected to the grounding backside terminals 51S and 51L through the via holes 23, they do not play a role of being electrically connected to the grounding conductor layer 22. . However, in the embodiment, the upper substrate back surface terminal and the lower substrate surface terminal are joined by solder. At the time of joining, it is necessary to apply heat to dissolve the solder. However, by heating the upper substrate surface terminal, the upper substrate back surface terminal can be heated via the via hole 23. That is, the upper substrate front surface terminal also plays a role of transferring heat to the upper substrate rear surface terminal. Therefore, the length of the grounding back surface terminal 51L (second back surface terminal) is such that the grounding surface terminal 41L (second surface terminal) overlaps the grounding back surface terminal 51L (second back surface terminal) in plan view. It is desirable to make it longer corresponding to the thickness. In addition to electrical connection, from the viewpoint of heat conduction, the grounding surface terminal 41L (second surface terminal) and the grounding back surface terminal 51L (second back surface terminal) overlap with each other in plan view. The via hole 23 is preferably provided. Therefore, the upper substrate terminal portion 31 according to the embodiment has a desirable structure for transferring heat to the upper back surface terminal, for example, when connecting by solder or the like.

なお、当該実施形態に係る複数の上側基板裏面端子の接続領域それぞれは、フレキシブル基板１１の下端（縁）から第２の方向に延伸しており、接続領域の第２の方向に沿って長いものが、接続領域の先端（伝送線側の端）がより伝送線側に位置している。しかし、接続領域のもう一方の端（下側基板側の端）の位置は、上側基板裏面端子と下側基板表面端子との電気的及び物理的な接続が確保される範囲において、異なっていてもよい。   In addition, each connection area | region of the some upper substrate back surface terminal which concerns on the said embodiment is extended in the 2nd direction from the lower end (edge) of the flexible substrate 11, and is long along the 2nd direction of a connection area | region. However, the tip of the connection region (end on the transmission line side) is located closer to the transmission line side. However, the position of the other end (end on the lower substrate side) of the connection region is different within a range in which electrical and physical connection between the upper substrate back surface terminal and the lower substrate surface terminal is ensured. Also good.

また、当該実施形態では、１つのプリント基板２と１つの光受信部品３を１つのフレキシブル基板１１の上側基板端子部３１で接続する場合について示しているが、これに限定されることはない。１つのフレキシブル基板１１で複数の光部品(光受信部品３または光送信部品４)と１つのプリント基板とを接続するために、１つのフレキシブル基板１１上に、複数の光部品それぞれに対応して、複数の上側基板端子部が存在してもよい。本発明に係る第１裏面端子及び第２裏面端子は、ともに１つの光部品又は該光部品から延びる複数の配線に接続される１つの上側基板端子部に属しているものとする。反対に、第１裏面端子が、ある光部品又は該光部品から延びる複数の配線に接続されるある上側基板端子部に属し、第２裏面端子が、他の光部品又は該他の光部品から延びる他の複数の配線に接続される他の上側基板端子部に属する場合は、たとえ、第１裏面端子と第２裏面端子が隣り合って配置されていたとしても、本発明には含めないものとする。   Moreover, although the said embodiment has shown about the case where the one printed circuit board 2 and the one optical receiving component 3 are connected by the upper board | substrate terminal part 31 of the one flexible substrate 11, it is not limited to this. In order to connect a plurality of optical components (the optical receiving component 3 or the optical transmitting component 4) and one printed circuit board with one flexible substrate 11, a plurality of optical components corresponding to each of the plurality of optical components are provided on one flexible substrate 11. There may be a plurality of upper substrate terminal portions. Both the 1st back terminal and the 2nd back terminal concerning the present invention shall belong to one upper substrate terminal part connected to one optical component or a plurality of wirings extended from the optical component. On the contrary, the first back terminal belongs to a certain optical component or a certain upper substrate terminal connected to a plurality of wirings extending from the optical component, and the second back terminal is derived from another optical component or the other optical component. When belonging to another upper substrate terminal connected to a plurality of other extending wirings, even if the first back terminal and the second back terminal are arranged next to each other, they are not included in the present invention And

当該実施形態では、図３Ａ及び図３Ｂに示す通り、フレキシブル基板１１の表面及び裏面に、カバーレイ２５が形成されている。カバーレイ２５は、フレキシブル基板の表面（裏面）を保護する保護層であり、ポリイミドなどの樹脂が材料として用いられる。カバーレイ２５は、基板上の電気配線（接地導体層や信号配線）を電気的に外部から遮断するのみならず、フレキシブル基板１１の曲げに対しても物理的に保護することが出来る。当該実施形態では、フレキシブル基板１１の表面及び裏面それぞれに、カバーレイ２５が形成されているが、上側基板表面端子及び上側基板裏面端子それぞれが形成される領域を除いて形成される。当該実施形態において、平面視して、複数の上側基板表面端子及び複数の上側基板裏面端子（の接続領域）は、それぞれ重畳している。それゆえ、フレキシブル基板１１の表面に形成されるカバーレイ２５は、表面のうち、平面視して少なくとも第１接続領域を除いて形成されている。   In the embodiment, as shown in FIGS. 3A and 3B, coverlays 25 are formed on the front surface and the back surface of the flexible substrate 11. The coverlay 25 is a protective layer that protects the front surface (back surface) of the flexible substrate, and a resin such as polyimide is used as a material. The cover lay 25 not only electrically cuts off the electrical wiring (ground conductor layer and signal wiring) on the substrate from the outside, but can also physically protect the flexible substrate 11 against bending. In this embodiment, the cover lay 25 is formed on each of the front and back surfaces of the flexible substrate 11, but is formed except for the region where the upper substrate front surface terminal and the upper substrate back surface terminal are formed. In the embodiment, the plurality of upper substrate front surface terminals and the plurality of upper substrate rear surface terminals (connection regions thereof) overlap each other in plan view. Therefore, the coverlay 25 formed on the surface of the flexible substrate 11 is formed on the surface excluding at least the first connection region in plan view.

カバーレイ２５は、接着剤などによって貼付されて固定されるので、作製誤差を考慮して、カバーレイ２５の外縁と、はんだ接続の際に熱を加える領域である上側基板表面端子（の先端）とは離間して形成されている。それゆえ、当該実施形態では、図３Ａに示す通り、カバーレイ２５の下端（外縁のうち、図に示す下端）は、図３Ａの左側から右側にかけて、左端の接地用表面端子４１Ｌの先端より所定の幅をもって上側（伝送線路側）を右向きに延伸し、左端の接地用表面端子４１Ｌと隣接する信号用表面端子４２Ａとの間で直角に屈曲して、信号用表面端子４２Ａの先端より所定の幅をもって上側となる箇所まで下向きに延伸する。かかる箇所は、縦方向に沿って、接地用表面端子４１Ｌの先端より下側にあり、図３ＡにＡを用いて示している。そして、かかる箇所において直角に屈曲して、信号用表面端子４２Ａ，４２Ｂ及び接地用表面端子４１Ｓの先端より所定の幅をもって上側を右向きにさらに延伸する。右端から２番目の信号用表面端子４２Ｂ（第１表面端子）と右端の接地用表面端子４１Ｌ（第２表面端子）との間で直角に屈曲して、接地用表面端子４１Ｌの先端より所定の幅をもって上側となる箇所まで上向きに延伸し、直角に屈曲して、右端の接地用表面端子４１Ｌの先端より所定の幅をもって上側を右向きに延伸している。ここで、平面視して、カバーレイ２５の下端の、横方向（第１方向）における位置に注目すると、両端の接地用表面端子４１Ｌにおける部分は、他の上側基板表面端子における部分よりも、上側（伝送線路側）にある。そして、平面視して、カバーレイ２５の下端のうち、他の上側基板表面端子における部分は、縦方向（第２の方向）に沿って両端の接地用表面端子４１Ｌの先端（第２先端）より下側（下側基板側）にある。   Since the cover lay 25 is affixed and fixed with an adhesive or the like, in consideration of manufacturing errors, the outer edge of the cover lay 25 and the upper substrate surface terminal (tip) which is a region to which heat is applied during solder connection. And are separated from each other. Therefore, in the present embodiment, as shown in FIG. 3A, the lower end of the cover lay 25 (outer edge, the lower end shown in the figure) is predetermined from the left end of the left side of FIG. The upper side (transmission line side) is extended to the right with a width of 1 mm, bent at a right angle between the grounding surface terminal 41L at the left end and the adjacent signal surface terminal 42A, and a predetermined length from the tip of the signal surface terminal 42A. Extends downward to the upper side with a width. Such a portion is located below the front end of the grounding surface terminal 41L along the vertical direction, and is indicated by A in FIG. 3A. Then, it is bent at a right angle at such a location, and is further extended rightward with a predetermined width from the tips of the signal surface terminals 42A and 42B and the ground surface terminal 41S. Bent at a right angle between the signal surface terminal 42B (first surface terminal) second from the right end and the ground surface terminal 41L (second surface terminal) at the right end, and a predetermined value is applied from the tip of the ground surface terminal 41L. It extends upward to a location that is on the upper side with a width, bends at a right angle, and extends upward on the right side with a predetermined width from the tip of the grounding surface terminal 41L on the right end. Here, in plan view, when attention is paid to the position in the lateral direction (first direction) of the lower end of the cover lay 25, the portions of the ground surface terminal 41L at both ends are more than the portions of the other upper substrate surface terminals. It is on the upper side (transmission line side). Then, in plan view, the portion of the lower end of the cover lay 25 at the other upper substrate surface terminal is the tip (second tip) of the ground surface terminal 41L at both ends along the vertical direction (second direction). It is on the lower side (lower substrate side).

よって、カバーレイ２５は、右端から２番目の信号用表面端子４２Ｂ（第１表面端子）に対して、平面視して、右端の接地用表面端子４１Ｌ（第２表面端子）の先端よりも下側（第２の方向に沿って下側基板側）まで及んでいる。ここで、上側基板表面端子は上側基板裏面端子（の接続領域）と、平面視して重畳しているので、カバーレイ２５は、第１接続領域に対して、平面視して、第２接続領域の第２先端より下側（第２の方向に沿って下側基板側）まで及んでいる。本発明により、第１裏面端子の第１先端付近において、フレキシブル基板１１が実際に曲がる箇所は、第１先端よりもさらに上側（伝送線路側）に移動するが、かかる箇所をカバーレイ２５で覆うことが出来る。   Therefore, the cover lay 25 is lower than the tip of the right-side grounding surface terminal 41L (second surface terminal) in plan view with respect to the second signal surface terminal 42B (first surface terminal) from the right end. It extends to the side (the lower substrate side along the second direction). Here, since the upper substrate front surface terminal overlaps with the upper substrate rear surface terminal (connection region thereof) in a plan view, the coverlay 25 is a second connection in a plan view with respect to the first connection region. It extends from the second tip of the region to the lower side (the lower substrate side along the second direction). According to the present invention, in the vicinity of the first tip of the first back terminal, the portion where the flexible substrate 11 is actually bent moves further upward (on the transmission line side) than the first tip, but this portion is covered with the cover lay 25. I can do it.

以上、当該実施形態において、図３Ｂに示す、左端の接地用裏面端子５１Ｌを第２裏面端子として、左端から２番目の信号用裏面端子５２Ｂを第１裏面端子として説明したが、これに限定されることはない。右端の接地用裏面端子５１Ｌを第２裏面端子として、右端から２番目の信号用裏面端子５２Ｂを第１裏面端子としてもよいのは言うまでもない。さらに、左端（一方側の端）に配置される接地用裏面端子５１Ｌを第２裏面端子とし、さらに、右端（一方側とは他方側の端）に配置される接地用裏面端子５１Ｌを第４裏面端子とし、これに隣り合う右端から２番目の信号用裏面端子５２Ａを第３裏面端子として、第４裏面端子の接続領域（第４接続領域）の先端（第４先端）の位置が、第３裏面端子の接続領域（第３接続領域）の位置より、上側（第２の方向に沿って伝送線路側）にあるのが望ましい。   In the above embodiment, the left end grounding back surface terminal 51L shown in FIG. 3B has been described as the second back surface terminal, and the second signal back surface terminal 52B from the left end has been described as the first back surface terminal. Never happen. It goes without saying that the grounding back terminal 51L at the right end may be the second back terminal, and the second signal back terminal 52B from the right end may be the first back terminal. Further, the grounding back terminal 51L disposed at the left end (one end) is used as a second back terminal, and the ground back terminal 51L disposed at the right end (one end is the other end) is the fourth back terminal. The back terminal is a back terminal, and the second signal back terminal 52A from the right end adjacent to the back terminal is the third back terminal. It is desirable to be on the upper side (transmission line side along the second direction) from the position of the connection region (third connection region) of the three back terminals.

さらに、当該実施形態に係る複数の上側基板裏面端子のように、両端の上側基板裏面端子（接地用裏面端子５１Ｌ）の接続領域の先端の位置（図３Ｂに示すＰ２）がともに、他の上側基板裏面端子の接続領域の先端の位置（図３Ｂに示すＰ１）の接続領域の先端すべてよりも、上側にあるのがさらに望ましい。かかる構造とすることにより、フレキシブル基板１１に配置されるすべての信号配線における断線を抑制することが出来る。フレキシブル基板１１に図２に示す外力Ｓがかかる場合に、フレキシブル基板１１の曲げ応力がかかるおよその箇所を、図３Ａに、曲線Ｂとして示している。そして、前述の通り、フレキシブル基板１１に係る複数回の外力Ｓによって、フレキシブル基板１１にかかる曲げ応力が分散し易い構造となっている。   Further, like the plurality of upper substrate back surface terminals according to the embodiment, the positions (P2 shown in FIG. 3B) of the connection regions of the upper substrate back surface terminals (grounding back surface terminals 51L) at both ends are both on the other upper side. It is more desirable to be above the entire tip of the connection region at the tip position (P1 shown in FIG. 3B) of the connection region of the substrate back surface terminal. By adopting such a structure, disconnection in all signal wirings arranged on the flexible substrate 11 can be suppressed. When the external force S shown in FIG. 2 is applied to the flexible substrate 11, an approximate location where the bending stress of the flexible substrate 11 is applied is shown as a curve B in FIG. 3A. As described above, the bending stress applied to the flexible substrate 11 is easily dispersed by the external force S applied to the flexible substrate 11 a plurality of times.

図３Ａに示す通り、両端の接地用表面端子４１Ｌの間の領域において、カバーレイ２５の下端は、図３ＡにＡと示す位置にあり、図３Ａに曲線Ｂとして示すフレキシブル基板１１の曲げ箇所のうち、信号配線を横切る部分はすべて、カバーレイ２５によって覆われている。すなわち、当該実施形態に係るフレキシブル基板１１では、図２に示すカバーレイ２５の下端よりも伝送線路側（図２の右側、図３Ａ及び図３Ｂの上側）に、フレキシブル基板１１の曲げ箇所（Ｂ）が発生している。図７Ａに示す従来技術に係る上側基板１１１には、カバーレイ１２５が形成されているが、カバーレイ１２５の下端は図７ＡのＡと示す位置にあり、接続領域の先端よりも上側であり、カバーレイ１２５は上側基板１１１の曲げ場所（図７ＡのＢ）を覆っていない。カバーレイ１２５の下端となる位置Ａは、図２に、（Ａ）として記されている。   As shown in FIG. 3A, in the region between the ground surface terminals 41L at both ends, the lower end of the cover lay 25 is at the position indicated by A in FIG. Of these, all portions crossing the signal wiring are covered with the coverlay 25. That is, in the flexible substrate 11 according to the present embodiment, the bent portion (B of the flexible substrate 11 is located on the transmission line side (the right side of FIG. 2, the upper side of FIGS. 3A and 3B) from the lower end of the cover lay 25 shown in FIG. ) Has occurred. In the upper substrate 111 according to the prior art shown in FIG. 7A, a cover lay 125 is formed, but the lower end of the cover lay 125 is at the position indicated by A in FIG. 7A and is above the tip of the connection region, The coverlay 125 does not cover the bending place (B in FIG. 7A) of the upper substrate 111. The position A which is the lower end of the cover lay 125 is indicated as (A) in FIG.

なお、ここでは、フレキシブル基板１１の表面に形成されるカバーレイ２５について説明したが、フレキシブル基板１１の裏面に形成されるカバーレイ２５についても同様である。また、両面ともにカバーレイ２５が形成されるのがさらに望ましい。本発明に係る保護層は、カバーレイ２５に限定されることはなく、基板の表面を覆う保護膜であって、基板の曲げに対して基板に形成される電気配線などを物理的に保護するものであればよい。なお、作製誤差を考慮すると、カバーレイ２５の外縁を複数の上側基板表面端子（上側基板裏面端子）の近傍まで延ばすことが出来ず、カバーレイ２５と端子の間には隙間領域を設けざるを得ない。かかる隙間領域の一部を保護するために、レジスト２６が設けられている。レジスト２６は絶縁膜であり、基板表面の電気配線（接地導体層や信号配線）を電気的に外部から遮断することが出来る。ただし、レジスト２６はフレキシブル基板１１の曲げに対して物理的に保護することにはほとんど寄与していない。しかしながら、レジスト２６の作製精度は、カバーレイ２５より作製精度はよいので、カバーレイ２５と端子との間の隙間領域の一部をさらに電気的に保護することが出来る。カバーレイ２５と端子との間の隙間領域の一部に形成されるレジスト２６を網掛けの領域として、図３Ａ及び図３Ｂに示している。   Here, the cover lay 25 formed on the front surface of the flexible substrate 11 has been described, but the same applies to the cover lay 25 formed on the back surface of the flexible substrate 11. Further, it is more desirable that cover lays 25 are formed on both sides. The protective layer according to the present invention is not limited to the cover lay 25, and is a protective film that covers the surface of the substrate, and physically protects electrical wiring and the like formed on the substrate against bending of the substrate. Anything is acceptable. In consideration of manufacturing errors, the outer edge of the cover lay 25 cannot be extended to the vicinity of the plurality of upper substrate front surface terminals (upper substrate back surface terminals), and a gap region must be provided between the cover lay 25 and the terminals. I don't get it. A resist 26 is provided to protect a part of the gap area. The resist 26 is an insulating film, and can electrically shield the electrical wiring (ground conductor layer and signal wiring) on the substrate surface from the outside. However, the resist 26 hardly contributes to physically protecting the flexible substrate 11 against bending. However, since the fabrication accuracy of the resist 26 is better than that of the cover lay 25, a part of the gap region between the cover lay 25 and the terminal can be further electrically protected. 3A and 3B show a resist 26 formed in a part of a gap area between the cover lay 25 and the terminal as a shaded area.

［第２の実施形態］
図５Ａ及び図５Ｂはそれぞれ、本発明の第２の実施形態に係るフレキシブル基板１１（上側基板）端部の平面図及び底面図である。図６は、当該実施形態に係るセラミック基板１２（下側基板）端部の平面図である。当該実施形態に係るフレキシブル基板１１の端部及びセラミック基板１２の端部の構造が第１の実施形態と異なっているが、それ以外については同じである。具体的には、フレキシブル基板１１において、２対の伝送線路の間に位置する接地用端子の構造が第１の実施形態と異なり、それに伴って、セラミック基板１２の接地用端子の構造が第１の実施形態と異なっている。図５Ａ及び図５Ｂに示す通り、図の中央に位置する接地用表面端子４１Ｌ及び接地用裏面端子５１Ｌが、両端の接地用端子と同じ長さまで延伸している。それに伴って、図６に示す通り、図の中央に位置する接地用表面端子６１Ｌが両端の接地用表面端子６１Ｌと同じ長さまで延伸している。それにともなって、フレキシブル基板１１の両面それぞれに形成されるレジスト２６の下端及びカバーレイ２５の下端が、端子上に形成されないように上側に移動している。 [Second Embodiment]
5A and 5B are a plan view and a bottom view, respectively, of the end portion of the flexible substrate 11 (upper substrate) according to the second embodiment of the present invention. FIG. 6 is a plan view of an end portion of the ceramic substrate 12 (lower substrate) according to the embodiment. Although the structure of the edge part of the flexible substrate 11 which concerns on the said embodiment, and the edge part of the ceramic substrate 12 differs from 1st Embodiment, it is the same about other than that. Specifically, the structure of the ground terminal located between the two pairs of transmission lines in the flexible substrate 11 is different from that of the first embodiment, and accordingly, the structure of the ground terminal of the ceramic substrate 12 is the first. This is different from the embodiment. As shown in FIGS. 5A and 5B, the grounding surface terminal 41L and the grounding back surface terminal 51L located at the center of the drawing extend to the same length as the grounding terminals at both ends. Accordingly, as shown in FIG. 6, the grounding surface terminal 61L located at the center of the drawing extends to the same length as the grounding surface terminals 61L at both ends. Accordingly, the lower end of the resist 26 and the lower end of the cover lay 25 formed on both surfaces of the flexible substrate 11 are moved upward so as not to be formed on the terminals.

フレキシブル基板１１の接地用端子すべてが、信号用端子よりも長くすることにより、フレキシブル基板１１とセラミック基板１２との間の、電気的接続はもちろんのこと、物理的な接続をより安定化することが出来、また、フレキシブル基板１１に外力Ｓがかかる場合、フレキシブル基板１１の端子部に発生する曲げ応力を、接地用裏面端子の接続領域の先端により集中させることが出来るので、信号配線の断線をより抑制することが出来る。なお、第２実施形態に係るフレキシブル基板１１では、両端の接地用裏面端子５１Ｌのみならず、中央の接地用裏面端子５１Ｌを第２裏面端子として、隣り合う信号用裏面端子のいずれかを第１裏面端子とすることが出来る。このように、第２裏面端子は両端に限定されることはなく、本発明の効果が得られる。また、図５Ｂに示す複数の上側基板裏面端子のうち、左端（右端）から順に並ぶ４つの裏面端子を、順に、第２裏面端子、第１裏面端子、第３裏面端子、第４裏面端子としてもよい。   By making all the grounding terminals of the flexible substrate 11 longer than the signal terminals, the physical connection as well as the electrical connection between the flexible substrate 11 and the ceramic substrate 12 can be further stabilized. In addition, when an external force S is applied to the flexible substrate 11, the bending stress generated in the terminal portion of the flexible substrate 11 can be concentrated at the tip of the connection region of the back terminal for grounding. It can be further suppressed. In the flexible substrate 11 according to the second embodiment, not only the grounding back terminal 51L at both ends but also the central grounding back terminal 51L is the second back terminal, and any of the adjacent signal back terminals is the first. It can be a back terminal. Thus, the second back terminal is not limited to both ends, and the effect of the present invention can be obtained. Moreover, four back terminals arranged in order from the left end (right end) among the plurality of upper substrate back terminals shown in FIG. Also good.

以上、本発明の実施形態に係る光送受信モジュール１００、及びフレキシブル基板１１について説明した。本発明は、上記実施形態には限定されず、広く適用することが出来る。上記実施形態において、上側基板の表面端子と裏面端子は重畳している。すなわち、平面視して、各表面端子の領域と対応する裏面端子の領域は一致している。また、平面視して、上側基板の各裏面端子の領域と、下側基板の対応する表面端子の領域は一致している。しかし、これらに限定されることはない。表面端子は裏面端子と電気的に接続していればよく、ビアホールなど両者の接続手段を確保するために、表面端子は、平面視して少なくとも裏面端子の一部と重畳していればよい。   The optical transceiver module 100 and the flexible substrate 11 according to the embodiment of the present invention have been described above. The present invention is not limited to the above embodiment and can be widely applied. In the above embodiment, the front surface terminal and the back surface terminal of the upper substrate overlap each other. That is, in the plan view, the area of the front surface terminals corresponds to the area of the back surface terminals. In plan view, the area of each back terminal of the upper substrate and the area of the corresponding front surface terminal of the lower substrate coincide. However, it is not limited to these. The front surface terminal only needs to be electrically connected to the rear surface terminal, and the front surface terminal only needs to overlap at least a part of the rear surface terminal in plan view in order to secure a connection means such as a via hole.

また、当該実施形態において、端子の形状はすべて帯形状（矩形状）としているが、これに限定されることはなく、複数の表面端子（裏面端子）が順に第１の方向に沿って並んで配置出来るよう、第２の方向に延伸する形状（簡単に言えば、細長い形状）であればよい。かかる場合であっても、端子の幅とは、第２の方向に延伸する形状の第２の方向に直交する方向（例えば、第１の方向）に沿って最も広い長さを幅とすればよく、端子の先端とは、第２の方向に沿って、最も伝送線路側にある位置とすればよい。   Moreover, in the said embodiment, although all the shapes of the terminal are made into strip | belt shape (rectangular shape), it is not limited to this, A several surface terminal (back surface terminal) is located in a line along the 1st direction in order. Any shape that extends in the second direction (in short, an elongated shape) may be used so that it can be arranged. Even in such a case, if the width of the terminal is the widest length along the direction (for example, the first direction) orthogonal to the second direction of the shape extending in the second direction, The terminal tip may be the position closest to the transmission line along the second direction.

本発明に係る上側基板は、フレキシブル基板が最適であるが、これに限定されることはなく、他の配線基板などであってもよい。図７Ａ及び図７Ｂに示す従来技術に係る上側基板１１１がフレキシブル基板である場合、上側基板１１１に形成する伝送線路の数を増加させるのに伴って、フレキシブル基板の柔軟性が低下し、曲げ箇所がより集中してしまい、信号配線の断線が発生しすくなる。かかる問題を解決するために、フレキシブル基板の柔軟性を向上させればよく、フレキシブル基板の幅を狭くすることと、フレキシブル基板の厚みを薄くすることが考えられる。しかしながら、端子の幅やピッチは、所望の特性や作製精度の観点から所定の値以上を確保する必要があるので、フレキシブル基板の幅を狭くすることには限界がある。また、フレキシブル基板の厚みを薄くすると、所望のインピーダンスを達成するために、信号配線の配線幅を狭くこととなるが、やはり作製精度上、限界がある。よって、作製上必要なフレキシブル基板の幅と厚みを確保しつつ、形成する伝送線路の数を増加させる場合に、本発明は格別の効果を奏する。   The upper substrate according to the present invention is optimally a flexible substrate, but is not limited to this, and may be another wiring substrate. When the upper substrate 111 according to the related art shown in FIGS. 7A and 7B is a flexible substrate, the flexibility of the flexible substrate is reduced as the number of transmission lines formed on the upper substrate 111 is increased. Becomes more concentrated, and the signal wiring is less likely to break. In order to solve such a problem, the flexibility of the flexible substrate may be improved, and it is conceivable to reduce the width of the flexible substrate and to reduce the thickness of the flexible substrate. However, since it is necessary to ensure the terminal width and pitch at a predetermined value or more from the viewpoint of desired characteristics and manufacturing accuracy, there is a limit to narrowing the width of the flexible substrate. Further, if the thickness of the flexible substrate is reduced, the wiring width of the signal wiring is reduced in order to achieve a desired impedance. However, there is a limit in manufacturing accuracy. Therefore, when increasing the number of transmission lines to be formed while ensuring the width and thickness of the flexible substrate necessary for production, the present invention has a special effect.

上記実施形態では、フレキシブル基板１１に２対の差動伝送線路が形成される場合について説明したが、これに限定されることはない。差動伝送線路ではなく、他の伝送線路、例えばシングルの伝送線路であってもよい。その場合、１本の伝送線路に、フレキシブル基板１１の表面に形成される信号配線は１本である。また、フレキシブル基板１１に形成される伝送線路の数は２に限定されることはなく、上側基板により多くの伝送線路が形成される場合に本発明の効果は高まる。   In the above embodiment, the case where two pairs of differential transmission lines are formed on the flexible substrate 11 has been described. However, the present invention is not limited to this. Instead of the differential transmission line, another transmission line, for example, a single transmission line may be used. In that case, one signal line is formed on the surface of the flexible substrate 11 in one transmission line. The number of transmission lines formed on the flexible substrate 11 is not limited to two, and the effect of the present invention is enhanced when many transmission lines are formed on the upper substrate.

本発明に係る上側基板及び下側基板は、フレキシブル基板及び光部品のセラミック基板と、それぞれしているが、これらに限定されることはなく、本発明は、伝送線路と伝送線路の接続箇所や、伝送線路と光部品の接続箇所などに、広く適用することが出来る。例えば、図２に示すフレキシブル基板１１とプリント基板２の接続箇所に、本発明を適用してもよい。また、上側基板及び下側基板がともにフレキシブル基板などの配線基板であってもよい。なお、ここでは、簡単な説明のために、２枚の基板が重畳することによって接続していることを鑑みて、２枚の基板を上側基板と下側基板としている。２枚の基板の上下関係は便宜的に定義したものに過ぎない。より厳密に、上下方向に依らず、２枚の基板を第１の基板及び第２の基板としてもよい。また、マイクロストリップラインにおいて、慣習上、誘電体層の２つの面のうち、信号配線が形成される面を表面（上面）と、接地導体層が形成される面を裏面（下面）としているので、便宜上、上側基板の２つの面のうち、信号配線が形成される側の面を表面と、接地導体層が形成される側の面を裏面としている。より厳密に、表裏の定義に依らず、上側基板の２つ面のうち、下側基板に対向する側を第１の面、第２の面の反対側を第２の面としてもよい。下側基板の２つの面についても同様である。   The upper substrate and the lower substrate according to the present invention are respectively a flexible substrate and a ceramic substrate of an optical component, but the present invention is not limited to these, and the present invention is not limited to a connection point between a transmission line and a transmission line. The present invention can be widely applied to connection points between transmission lines and optical components. For example, you may apply this invention to the connection location of the flexible substrate 11 and the printed circuit board 2 which are shown in FIG. Further, both the upper substrate and the lower substrate may be wiring substrates such as flexible substrates. Here, for the sake of simple explanation, the two substrates are referred to as an upper substrate and a lower substrate in view of the fact that the two substrates are connected by overlapping. The vertical relationship between the two substrates is merely defined for convenience. More strictly, two substrates may be used as the first substrate and the second substrate regardless of the vertical direction. In addition, in the microstrip line, of the two surfaces of the dielectric layer, the surface on which the signal wiring is formed is conventionally the front surface (upper surface) and the surface on which the ground conductor layer is formed is the back surface (lower surface). For convenience, of the two surfaces of the upper substrate, the surface on which the signal wiring is formed is the front surface, and the surface on which the ground conductor layer is formed is the back surface. More strictly, regardless of the definition of the front and back surfaces, of the two surfaces of the upper substrate, the side facing the lower substrate may be the first surface and the opposite side of the second surface may be the second surface. The same applies to the two surfaces of the lower substrate.

上記実施形態に係る光モジュールは光受信モジュールであり、上記実施形態に係る光送受信モジュール１００は、上記実施形態に係る光受信モジュールと、公知の光送信モジュールを備える光送受信モジュールとしたが、これに限定されることはない。本発明に係る光モジュールは、光送信器又は光受信器のいずれかの単体であってもよいし、本発明に係る光送受信モジュールが、本発明に係る光送信モジュールと、公知の光受信モジュールを備えていてもよいし、本発明に係る光送信モジュールと、本発明に係る光受信モジュールの両方を備えていてもよい。   The optical module according to the embodiment is an optical receiver module, and the optical transceiver module 100 according to the embodiment is an optical transceiver module including the optical receiver module according to the embodiment and a known optical transmitter module. It is not limited to. The optical module according to the present invention may be either a single unit of an optical transmitter or an optical receiver, or the optical transmission / reception module according to the present invention includes the optical transmission module according to the present invention and a known optical reception module. The optical transmission module according to the present invention and the optical reception module according to the present invention may be provided.

さらに上記実施形態に係る光モジュールにおいては、両端にある接地用表面端子４１Lの長さが揃っている場合について説明したが、平面視して接地用表面端子４１Lの伝送線路側の端が信号用表面端子４１Ａ、４２Bの伝送線路側の端より伝送路側に位置していれば、両端にある接地用表面端子４１Lの長さや接地用表面端子４１Lの伝送線路側の端の位置が異なっても本願発明の効果は得られる。   Furthermore, in the optical module according to the above-described embodiment, the case where the lengths of the grounding surface terminals 41L at the both ends are aligned has been described, but the end of the grounding surface terminal 41L on the transmission line side in a plan view is used for signals. As long as the surface terminals 41A and 42B are located closer to the transmission line than the transmission line side ends, the length of the grounding surface terminal 41L at both ends and the position of the grounding surface terminal 41L on the transmission line side are different. The effects of the invention can be obtained.

１ 筐体、２ プリント基板、３ 光受信部品、４ 光送信部品、５ 部品用トレイ、６ 光レセプタクル、７ 光ファイバトレイ、８，１０ 電気高周波部品、９ カードエッジコネクタ、１１，９１ フレキシブル基板、１２ セラミック基板、２０ 差動伝送線路、２１Ａ，２１Ｂ，１２１Ａ，１２１Ｂ 信号配線、２２，１２２ 接地導体層、２３，１２３ ビアホール、２４，１２４ 移行領域、２５，１２５ カバーレイ、２６ レジスト、３１，１３１ 上側基板端子部、３２，１３２ 下側基板端子部、４１Ｌ，４１Ｓ，６１Ｌ，６１Ｓ，１４１ 接地用表面端子、４２Ａ，４２Ｂ，６２Ａ，６２Ｂ，１４２Ａ，１４２Ｂ 信号用表面端子、５１Ｌ，５１Ｓ，１５１ 接地用裏面端子、５２Ａ，５２Ｂ，１５２Ａ，１５２Ｂ 信号用裏面端子、９２ 光ファイバ、１００ 光送受信モジュール。   DESCRIPTION OF SYMBOLS 1 Case, 2 Printed circuit board, 3 Optical receiving component, 4 Optical transmitting component, 5 Component tray, 6 Optical receptacle, 7 Optical fiber tray, 8, 10 Electric high frequency component, 9 Card edge connector, 11, 91 Flexible substrate, 12 ceramic substrate, 20 differential transmission line, 21A, 21B, 121A, 121B signal wiring, 22, 122 ground conductor layer, 23, 123 via hole, 24, 124 transition region, 25, 125 coverlay, 26 resist, 31, 131 Upper board terminal section, 32, 132 Lower board terminal section, 41L, 41S, 61L, 61S, 141 Ground surface terminal, 42A, 42B, 62A, 62B, 142A, 142B Signal surface terminal, 51L, 51S, 151 Ground Back terminal, 52A, 52B, 152A, 152B Signal back terminal 92 optical fiber, 100 optical transceiver module.

Claims (8)

１又は複数の伝送線路と、前記１又は複数の伝送線路に電気的に接続されるとともに、平面視して第１の方向に並び、裏面側に形成される複数の上側基板裏面端子と、を含む、上側基板と、
前記複数の上側裏面端子それぞれに重なって接続され、表面側に形成される複数の下側基板表面端子を含む、下側基板と、
を備える光モジュールであって、
前記複数の上側基板裏面端子は、互いに隣り合うとともに、前記第１の方向に交差する第２の方向を前記下側基板側から前記伝送線路側へともに延伸する、第１裏面端子及び第２裏面端子を含み、
前記第１裏面端子は、対応する前記下側基板表面端子と重畳する領域である第１接続領域を有し、
前記第２裏面端子は、対応する前記下側基板表面端子と重畳する領域である第２接続領域を有し、
前記第２接続領域の前記伝送線路側にある第２先端の位置は、前記第１接続領域の前記伝送線路側にある第１先端の位置より、前記第２の方向に沿って前記伝送線路側にあり、
前記上側基板は、
前記第１裏面端子の少なくとも一部と平面視して重畳して表面側に形成されるとともに、前記第１裏面端子と電気的に接続される第１表面端子と、
表面側に形成される前記伝送線路の第１信号配線と、
表面側に形成されるとともに前記第１表面端子と前記第１信号配線とを電気的に接続する第１移行領域と、
をさらに含み、
前記第１信号配線の幅は、前記第１表面端子の幅よりも狭く、
前記第１移行領域の幅は、前記第１表面端子との接続側から前記第１信号配線との接続側にかけて徐々に狭くなり、
前記上側基板は、表面のうち、平面視して少なくとも前記第１接続領域を除くとともに前記第１移行領域の少なくとも一部と重畳して形成される保護層をさらに含み、
前記保護層は、前記第１接続領域の前記第１先端に対して、平面視して、前記第２の方向に沿って、前記第２接続領域の前記第２先端よりさらに前記下側基板側に及んでいる、
ことを特徴とする、光モジュール。 One or a plurality of transmission lines, and a plurality of upper substrate rear surface terminals formed on the back surface side, which are electrically connected to the one or more transmission lines, arranged in a first direction in plan view, and Including an upper substrate;
A plurality of lower substrate surface terminals connected to overlap each of the plurality of upper back terminals, and formed on the front surface side; a lower substrate; and
An optical module comprising:
The plurality of upper substrate back surface terminals are adjacent to each other, and extend in a second direction intersecting the first direction from the lower substrate side to the transmission line side, and a first back surface terminal and a second back surface Including terminals,
The first back surface terminal has a first connection region that is a region overlapping with the corresponding lower substrate surface terminal,
The second back surface terminal has a second connection region that is a region overlapping with the corresponding lower substrate surface terminal,
The position of the second tip on the transmission line side of the second connection region is closer to the transmission line side along the second direction than the position of the first tip on the transmission line side of the first connection region. near it is,
The upper substrate is
A first surface terminal that is formed on the front surface side to overlap with at least a portion of the first back surface terminal in plan view and electrically connected to the first back surface terminal;
A first signal wiring of the transmission line formed on the surface side;
A first transition region formed on the surface side and electrically connecting the first surface terminal and the first signal wiring;
Further including
The width of the first signal wiring is narrower than the width of the first surface terminal,
The width of the first transition region gradually decreases from the connection side with the first surface terminal to the connection side with the first signal wiring,
The upper substrate further includes a protective layer formed to overlap at least a part of the first transition region while removing at least the first connection region in a plan view of the surface,
The protective layer is further on the lower substrate side than the second tip of the second connection region along the second direction in plan view with respect to the first tip of the first connection region. ,
An optical module characterized by that. 請求項１に記載の光モジュールであって、
前記第２裏面端子は、前記第１の方向に並ぶ前記複数の上側基板裏面端子のうち、一方側の端に配置され、
前記複数の上側基板裏面端子は、互いに隣り合うとともに、前記第２の方向を前記下側基板側から前記伝送線路側へともに延伸する、第３裏面端子及び第４裏面端子をさらに含み、
前記第４裏面端子は、前記第１の方向に並ぶ前記複数の上側基板裏面端子のうち、前記一方側とは他方側の端に配置され、
前記第３裏面端子は、対応する前記下側基板表面端子と重畳する領域である第３接続領域を有し、
前記第４裏面端子は、対応する前記下側基板表面端子と重畳する領域である第４接続領域を有し、
前記第４接続領域の前記伝送線路側にある第４先端の位置は、前記第３接続領域の前記伝送線路側にある第３先端の位置より、前記第２の方向に沿って前記伝送線路側にある、
ことを特徴とする、光モジュール。 The optical module according to claim 1 ,
The second back terminal is disposed at one end of the plurality of upper substrate back terminals arranged in the first direction,
The plurality of upper substrate back surface terminals further include a third back surface terminal and a fourth back surface terminal, which are adjacent to each other and extend in the second direction from the lower substrate side to the transmission line side,
The fourth back terminal is disposed at an end on the other side of the plurality of upper substrate back terminals arranged in the first direction, the one side being,
The third back surface terminal has a third connection region that is a region overlapping with the corresponding lower substrate surface terminal,
The fourth back surface terminal has a fourth connection region that is a region overlapping with the corresponding lower substrate surface terminal,
The position of the fourth tip on the transmission line side of the fourth connection region is closer to the transmission line side along the second direction than the position of the third tip on the transmission line side of the third connection region. It is in,
An optical module characterized by that. 請求項１又は２に記載の光モジュールであって、
前記上側基板は、
前記第２裏面端子の少なくとも一部と平面視して重畳して表面側に形成されるとともに、電気的に接続される第２表面端子、をさらに含む、
ことを特徴とする、光モジュール。 The optical module according to claim 1 or 2 ,
The upper substrate is
A second surface terminal that is formed on the front surface side and overlapped with at least a part of the second back surface terminal in plan view, and is electrically connected;
An optical module characterized by that. 請求項３に記載の光モジュールであって、
前記上側基板は、
前記第２裏面端子と前記第２表面端子とが平面視して重畳する領域に、前記上側基板の表面から裏面に貫くビアホール、をさらに含む、
ことを特徴とする、光モジュール。 The optical module according to claim 3 ,
The upper substrate is
In the region where the second back surface terminal and the second surface terminal overlap in plan view, further includes a via hole penetrating from the surface of the upper substrate to the back surface,
An optical module characterized by that. 請求項１乃至請求項４のいずれかに記載の光モジュールであって、
前記上側基板は、
裏面側に形成される前記伝送線路の接地導体層、をさらに含み、
前記第２裏面端子は、前記接地導体層に電気的に接続される、
ことを特徴とする、光モジュール。 An optical module according to any one of claims 1 to 4 ,
The upper substrate is
Further including a ground conductor layer of the transmission line formed on the back side,
The second back terminal is electrically connected to the ground conductor layer;
An optical module characterized by that. 請求項１乃至請求項５のいずれかに記載の光モジュールであって、
前記上側基板は、
直流電圧配線、をさらに含み、
前記第２裏面端子は、前記直流電圧配線に電気的に接続される、
ことを特徴とする、光モジュール。 An optical module according to any one of claims 1 to 5 ,
The upper substrate is
DC voltage wiring further,
The second back terminal is electrically connected to the DC voltage wiring;
An optical module characterized by that. 請求項１乃至請求項６のいずれかに記載の光モジュールと、他の光モジュールと、を備える光送受信モジュールであって、
前記光モジュールと前記他の光モジュールのいずれか一方が光送信器であり、他方が光受信器である、
ことを特徴とする、光送受信モジュール。 An optical transceiver module comprising the optical module according to any one of claims 1 to 6 and another optical module,
Either one of the optical module and the other optical module is an optical transmitter, and the other is an optical receiver.
An optical transceiver module characterized by the above. １又は複数の伝送線路と、
前記１又は複数の伝送線路に電気的に接続されるとともに、平面視して第１の方向に並び、裏面側に形成される複数の上側基板裏面端子と、
を備える、フレキシブル基板であって、
前記複数の上側基板裏面端子は、他の基板の表面側に形成される複数の下側基板表面端子それぞれと重なって接続され、
前記複数の上側基板裏面端子は、互いに隣り合うとともに、前記第１の方向に交差する第２の方向を前記他の基板側から前記伝送線路側へともに延伸する、第１裏面端子及び第２裏面端子を含み、
前記第１裏面端子は、対応する前記下側基板表面端子と重畳する領域である第１接続領域を有し、
前記第２裏面端子は、対応する前記下側基板表面端子と重畳する領域である第２接続領域を有し、
前記第２接続領域の前記伝送線路側にある第２先端の位置は、前記第１接続領域の前記伝送線路側にある第１先端の位置より、前記第２の方向に沿って前記伝送線路側にあり、
前記第１裏面端子の少なくとも一部と平面視して重畳して表面側に形成されるとともに、前記第１裏面端子と電気的に接続される第１表面端子と、
表面側に形成される前記伝送線路の第１信号配線と、
表面側に形成されるとともに前記第１表面端子と前記第１信号配線とを電気的に接続する第１移行領域と、
をさらに含み、
前記第１信号配線の幅は、前記第１表面端子の幅よりも狭く、
前記第１移行領域の幅は、前記第１表面端子との接続側から前記第１信号配線との接続側にかけて徐々に狭くなり、
前記上側基板は、表面のうち、平面視して少なくとも前記第１接続領域を除くとともに前記第１移行領域の少なくとも一部と重畳して形成される保護層をさらに含み、
前記保護層は、前記第１接続領域の前記第１先端に対して、平面視して、前記第２の方向に沿って、前記第２接続領域の前記第２先端よりさらに前記下側基板側に及んでいる、
ことを特徴とする、フレキシブル基板。 One or more transmission lines;
A plurality of upper substrate rear surface terminals that are electrically connected to the one or more transmission lines, arranged in a first direction in plan view, and formed on the rear surface side;
A flexible substrate comprising:
The plurality of upper substrate rear surface terminals are connected to overlap each of a plurality of lower substrate surface terminals formed on the surface side of another substrate,
The plurality of upper substrate back surface terminals are adjacent to each other, and extend in a second direction intersecting the first direction from the other substrate side to the transmission line side, and a first back surface terminal and a second back surface Including terminals,
The first back surface terminal has a first connection region that is a region overlapping with the corresponding lower substrate surface terminal,
The second back surface terminal has a second connection region that is a region overlapping with the corresponding lower substrate surface terminal,
The position of the second tip on the transmission line side of the second connection region is closer to the transmission line side along the second direction than the position of the first tip on the transmission line side of the first connection region. near it is,
A first surface terminal that is formed on the front surface side to overlap with at least a portion of the first back surface terminal in plan view and electrically connected to the first back surface terminal;
A first signal wiring of the transmission line formed on the surface side;
A first transition region formed on the surface side and electrically connecting the first surface terminal and the first signal wiring;
Further including
The width of the first signal wiring is narrower than the width of the first surface terminal,
The width of the first transition region gradually decreases from the connection side with the first surface terminal to the connection side with the first signal wiring,
The upper substrate further includes a protective layer formed to overlap at least a part of the first transition region while removing at least the first connection region in a plan view of the surface,
The protective layer is further on the lower substrate side than the second tip of the second connection region along the second direction in plan view with respect to the first tip of the first connection region. ,
A flexible substrate characterized by the above.
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