JP2014175829A - Transmission line, antenna device, and manufacturing method for transmission line - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a transmission line and antenna device capable of preventing manufacturing cost from increasing by forming vias for electrically connecting strip conductor patterns 2a, 2b mounted on surfaces of dielectric substrates 1a, 1b, and improving the flexibility of formation positions of vias used for those except a connection between the strip conductor patterns 2a, 2b.SOLUTION: The present invention is configured so that strip conductor patterns 2a, 2b mounted on surfaces of dielectric substrates 1a, 1b are connected with each other through anisotropic conductive adhesive 4.

Description

  The present invention relates to a low-loss transmission line, an antenna device, and a transmission line manufacturing method that can be manufactured at low cost without restrictions on the via formation position.

  Conventional transmission lines used in high-frequency circuits such as an antenna feeding circuit are stacked with a dielectric substrate sandwiched between a plurality of strip conductor patterns and stacked at an appropriate interval along the longitudinal direction of the strip conductor pattern. The strip conductor pattern is connected to each other with vias that are formed by opening (those that can electrically connect conductor patterns between different layers by plating with holes in the holes formed in the dielectric substrate). (For example, Patent Document 1).

JP 2000-59113 A

  However, in the conventional transmission line described in Patent Document 1, it is necessary to provide vias that connect the upper and lower strip conductor patterns at intervals of less than ½ of the wavelength at the frequency of the high-frequency signal to be used. However, there is a problem in that a large number of vias must be provided in a high area, resulting in an increase in manufacturing cost.

  Further, in a normal printed wiring board manufacturing process, it is necessary to first form vias between strip conductor patterns, and vias in other layers (for example, vias for connecting strip conductor patterns and feeding points). There was also a problem that could not be formed freely.

  Therefore, the present invention has been made to solve the above-described problems, and can obtain a low-loss transmission line that can be manufactured at low cost and does not restrict the formation positions of vias other than vias that connect between strip conductor patterns. For the purpose.

  The transmission line of the present invention has a first dielectric in which a first ground conductor pattern is provided on one side, and a first strip conductor pattern is provided on a surface opposite to the surface on which the first ground conductor pattern is provided. A body substrate and a second dielectric substrate provided with a second ground conductor pattern on one side and a second strip conductor pattern on a surface opposite to the surface provided with the second ground conductor pattern; , Provided between a surface of the first dielectric substrate on which the first strip conductor pattern is provided and a surface of the second dielectric substrate on which the second strip conductor pattern is provided, The first strip conductor pattern and the second strip conductor pattern are electrically connected in a direction perpendicular to the surface on which the first strip pattern is provided and the surface on which the second strip pattern is provided. Direction An electric adhesive, and the first strip conductor pattern and the second strip conductor pattern constitute one signal conductor, and the first ground conductor pattern and the second ground conductor are formed from the signal conductor. A high-frequency signal is propagated to the signal conductor by generating an electric field toward the conductor pattern.

  The antenna device of the present invention has a first dielectric in which a first ground conductor pattern is provided on one surface, and a first strip conductor pattern is provided on a surface opposite to the surface on which the first ground conductor pattern is provided. A body substrate and a second dielectric substrate provided with a second ground conductor pattern on one side and a second strip conductor pattern on a surface opposite to the surface provided with the second ground conductor pattern; , Provided on the surface of the second dielectric substrate on which the second ground conductor pattern is provided, and electrically connected to the second strip conductor pattern by vias formed on the first dielectric substrate. A connector connected to input / output an electrical signal; a surface of the first dielectric substrate on which the first strip conductor pattern is provided; and a second strip conductor pattern of the second dielectric substrate. Setting The first strip conductor pattern and the second strip conductor pattern are arranged on the surface on which the first strip pattern is provided and the surface on which the second strip pattern is provided. An anisotropic conductive adhesive electrically connected in a vertical direction to the first dielectric substrate, a third dielectric substrate bonded to the surface of the first dielectric substrate provided with the first ground conductor pattern, Vias formed on the surface of the third dielectric substrate facing the surface bonded to the first dielectric substrate and formed on the first dielectric substrate and the third dielectric substrate. And an antenna conductor pattern electrically connected to the first strip conductor pattern, and the first strip conductor pattern and the second strip conductor pattern constitute one signal conductor. Wherein the propagating high-frequency signals to the signal conductor by an electric field is generated toward from the signal conductor to the first ground conductor pattern and the second ground conductor pattern.

  In the transmission line manufacturing method of the present invention, a first ground conductor pattern is provided on one side, and a first strip conductor pattern and a third ground conductor are provided on a surface opposite to the surface on which the first ground conductor pattern is provided. Providing a via for connecting the first ground conductor pattern and the third ground conductor pattern to a first dielectric substrate provided with a pattern; and providing a second ground conductor pattern on one side; The second ground conductor pattern and the fourth conductor are provided on a second dielectric substrate provided with a second strip conductor pattern and a fourth ground conductor pattern on a surface opposite to the surface on which the first ground conductor pattern is provided. Providing vias for connecting the ground conductor patterns of the first strip conductor pattern, the first strip conductor pattern and the second strip conductor pattern to the surface on which the first strip pattern is provided and the second strip. An anisotropic conductive adhesive electrically connected in a direction perpendicular to the surface on which the first pattern is provided and the second dielectric substrate on the surface on which the first strip conductor pattern is provided and the second dielectric. And a step of connecting the first dielectric substrate and the second dielectric substrate to be sandwiched between a surface of the body substrate provided with the second strip conductor pattern.

  Since the transmission line of the present invention is configured to connect the upper and lower strip conductor patterns using an anisotropic conductive adhesive, it is not necessary to form vias connecting the strip conductor patterns, and can be manufactured at low cost. Further, since there is no need to form vias connecting between the strip conductor patterns, the positions where vias of other layers are formed are not restricted.

FIG. 3 is a diagram showing a state before the transmission lines according to Embodiment 1 are stacked. FIG. 3 is a perspective view of a transmission line according to the first embodiment. FIG. 3 is a cross-sectional view taken along the line AA ′ of the transmission line according to the first embodiment. FIG. 3 illustrates an electric field direction of a transmission line according to the first embodiment. The figure explaining the manufacturing process of the conventional transmission line. The figure explaining the position shift of the strip conductor pattern which arises by manufacture dispersion | variation. FIG. 6 is a perspective view of a transmission line according to Embodiment 2. FIG. 6 is a cross-sectional view taken along the line AA ′ of the transmission line according to the second embodiment. FIG. 10 is a perspective view according to a transmission line according to the third embodiment. FIG. 6 is a cross-sectional view taken along line AA ′ of the transmission line according to Embodiment 3. Sectional drawing of the transmission line which concerns on Embodiment 4. FIG. Sectional drawing of the antenna apparatus which concerns on Embodiment 5. FIG.

Embodiment 1 FIG.
Hereinafter, the transmission line according to the first embodiment will be described with reference to FIGS. 1 to 5. FIG. 1 is a diagram illustrating a state before the transmission lines according to Embodiment 1 are stacked. FIG. 2 is a perspective view of the transmission line according to the first embodiment. FIG. 3 is a cross-sectional view taken along the line AA ′ of the transmission line according to the first embodiment. FIG. 4 is a diagram illustrating the electric field direction of the transmission line according to the first embodiment. FIG. 5 is a diagram for explaining a conventional manufacturing process of a transmission line.

  Hereinafter, the configuration of the transmission line according to the first embodiment will be described with reference to FIGS. 1 to 2.

  In FIG. 1, the transmission line according to Embodiment 1 includes a dielectric substrate 1a (first dielectric substrate), a dielectric substrate 1b (second dielectric substrate), and a strip conductor pattern 2a (first strip conductor). Pattern), strip conductor pattern 2b (second strip conductor pattern), ground conductor pattern 3a (first ground conductor pattern), ground conductor pattern 3b (second ground conductor pattern), anisotropic conductive adhesive 4 Composed. In the transmission line according to the first embodiment, the dielectric substrates 1a and 1b are opposed to each other so that the center lines in the longitudinal direction of the strip conductor patterns 2a and 2b having the same width coincide with each other. Is bonded through an anisotropic conductive adhesive 4 (FIG. 2).

  The dielectric substrates 1a and 1b are substrates formed of a dielectric made of ceramic, resin, or the like.

  The strip conductor patterns 2a and 2b are rectangular and thin conductor patterns respectively provided on one side of the dielectric substrates 1a and 1b. The strip conductor patterns 2a and 2b are connected to face each other, thereby functioning as one signal conductor for propagating a high-frequency signal.

  The ground conductor patterns 3a and 3b are conductors provided on the surfaces of the dielectric substrates 1a and 1b opposite to the strip conductor patterns 2a and 2b.

  The anisotropic conductive adhesive 4 is a connection material used for connecting the dielectric substrates 1 a and 1 b, and is composed of an insulating adhesive and conductive particles 5. The conductive particles 5 include, for example, a resin ball coated with a metal film. The anisotropic conductive adhesive 4 is electrically conductive in the vertical direction (perpendicular to the surface of the strip conductor pattern 2a, 2b), and insulative in the lateral direction (horizontal to the surface of the strip conductor pattern). Is preserved. As the anisotropic conductive adhesive 4 used in the present invention, a material in which the conductive particles 5 are arranged at a sufficiently small interval with respect to the wavelength of the frequency of the high frequency signal to be used is used.

  Next, the transmission line connection method according to the first embodiment will be described with reference to FIG. FIG. 3 is a cross-sectional view of the transmission line shown in FIG.

  The anisotropic conductive adhesive 4 is sandwiched between the dielectric substrates 1a and 1b, and is cured by being heated and pressurized to bond the dielectric substrates 1a and 1b. Before the connection, the anisotropic conductive adhesive 4 is not cured and has fluidity. Therefore, when the anisotropic conductive adhesive 4 is sandwiched between the dielectric substrates 1a and 1b, the strip conductor patterns 2a and 2b enter inside. Further, the strip conductor patterns 2 a and 2 b are electrically connected to each other by sandwiching the conductive particles 5 present in the anisotropic conductive adhesive 4. The conductive particles 5 are present in the anisotropic conductive adhesive 4 at sufficiently small intervals with respect to the wavelength of the frequency used. Therefore, the strip conductor patterns 2a and 2b are electrically connected in a direction perpendicular to the surface of the strip conductor patterns 2a and 2b at intervals sufficiently smaller than the wavelength of the high-frequency signal to be used. On the other hand, since the conductive particles 5 do not contact each other, they are not electrically connected in a direction horizontal to the surfaces of the dielectric substrates 1a and 1b.

  Next, the electric field distribution of the transmission line cross section according to the first embodiment will be described with reference to FIG. In the transmission line according to the first embodiment, the input high-frequency signal propagates when the electrical signal flows through the strip conductor patterns 2a and 2b and the ground conductor patterns 3a and 3b, respectively. The strip conductor patterns 2a and 2b are electrically connected to each other, but the strip conductor patterns 2a and 2b are not electrically connected to the ground conductor patterns 3a and 3b. At this time, the strip conductor patterns 2 a and 2 b have the same potential because they are electrically connected by the conductive particles 5 present in the anisotropic conductive adhesive 4. Therefore, as shown in FIG. 4, the electric field E in the cross section of the transmission line is generated from the strip conductor patterns 2a and 2b toward the ground conductor patterns 3a and 3b, respectively. That is, the electric field strength in the conductive adhesive 4 between the strip conductor patterns 2a and 2b has a small distribution. Therefore, even when a material having a large dielectric loss tangent such as chloroprene rubber is used as the material for the anisotropic conductive adhesive 4, dielectric loss due to the anisotropic conductive adhesive 4 can be suppressed. The dielectric loss tangent means an electrical energy loss inside the insulator, and indicates one standard for evaluating the performance as an insulator. The dielectric loss refers to the amount of energy lost as heat when an AC voltage is applied to an insulator.

  Furthermore, if a substrate material having a relative dielectric constant larger than that of the anisotropic conductive adhesive 4 is selected as the substrate material for the dielectric substrates 1a and 1b, the electric field E shown in FIG. Since it concentrates on the high dielectric substrates 1a and 1b, the electric field strength in the conductive adhesive 4 between the strip conductor patterns 2a and 2b has a small distribution. Therefore, even when the anisotropic conductive adhesive 4 having a large dielectric loss tangent is used, a low-loss transmission line can be manufactured. At this time, for example, when the material of the anisotropic conductive adhesive 4 is chloroprene rubber, the substrate material having a relative dielectric constant larger than that of the material of the anisotropic conductive adhesive 4 is a ceramic substrate such as an alumina substrate. It hits.

  Next, the effect of the transmission line according to the first embodiment will be described with reference to FIG. FIG. 5 is a diagram for explaining a conventional manufacturing process of a transmission line. In the description of FIG. 5, 2A and 2B are conventional strip conductor patterns, 3A and 3B are conventional ground conductor patterns, 8A, 8B and 8C are vias, 1A, 1B and 1C are dielectric substrates, and 4A and 4B are Adhesive material. Hereinafter, a process of forming a conventional transmission line via will be described.

  In step 1, first, a dielectric substrate 1C in which strip conductor patterns 2A and 2B are formed on both surfaces is formed.

  In step 2, vias 8C are formed on the dielectric substrate 1C provided with the strip conductor patterns 2A and 2B on both sides. The via 8C has a configuration corresponding to the conductive particles 5 of the transmission line according to the first embodiment.

  In step 3, the dielectric substrate 1C on which the vias 8C are formed and the dielectric substrate 1B on which the ground conductor pattern 3B is provided on the lower surface are connected via an adhesive 4B.

  In step 4, a via 8B for connecting the strip conductor pattern 2A and the ground conductor pattern 8B is formed. At this time, since the via 8C is already formed on the dielectric substrate 1C, the formation position of the via 8B is restricted to a position other than the position where the via 8C is already formed.

  In step 5, the dielectric substrates 1B and 1C on which the vias 8B are formed and the dielectric substrate 1A having the upper surface provided with the ground conductor pattern 3A are connected via an adhesive 4A.

  In step 6, vias 8A are formed on the dielectric substrates 1A, 1B, and 1C created in step 5. However, the formation position of the via 8A is limited to a position other than the position different from the vias 8B and 8C that have already been formed.

  As described above, in the conventional transmission line, the via 8C needs to be formed in advance in order to connect the strip conductor patterns 2A and 2B. Therefore, the positions where the vias 8A and 8B are formed are positions other than the via 8C. It will be constrained by.

  On the other hand, FIG. 5B is a cross-sectional view of the transmission line according to Embodiment 1 shown in FIG. 2 cut along a line perpendicular to AA ′. Since the transmission line according to Embodiment 1 uses the anisotropic conductive adhesive 4 to connect the strip conductor patterns 2a and 2b, it is not necessary to form the via 8C in the step 2 of FIG. 5A. Therefore, even when it is necessary to form a via other than the connection between the strip conductor patterns 2a and 2b, the position of the via is not limited.

  As described above, in the transmission line according to the first embodiment, the two dielectric substrates 1a and 1b face each other so that the strip conductor patterns 2a and 2b face each other, and are bonded via the anisotropic conductive adhesive 4. Therefore, the strip conductor patterns 2a and 2b can be used as one signal conductor without providing a via for connecting the strip conductor patterns 2a and 2b. Therefore, an increase in manufacturing cost can be prevented even when a large number of vias must be provided in a region where the frequency of the high-frequency signal to be used is high.

  Further, since the transmission line according to the first embodiment has a small electric field strength generated in the anisotropic conductive adhesive 4, even when a material having a large dielectric loss tangent is used as the material of the anisotropic conductive adhesive 4. The dielectric loss due to the anisotropic conductive adhesive 4 can be suppressed. Therefore, a low-loss transmission line can be manufactured regardless of the material of the anisotropic conductive adhesive 4 used.

Embodiment 2. FIG.
Hereinafter, the transmission line according to the second embodiment will be described with reference to FIGS. FIG. 6 is a diagram for explaining the positional deviation of the strip conductor pattern caused by manufacturing variations. FIG. 7 is a perspective view of a transmission line according to the second embodiment. FIG. 8 is a cross-sectional view taken along the line AA ′ of the transmission line according to the second embodiment. Note that portions corresponding to the configuration of the transmission line according to Embodiment 1 are denoted by the same reference numerals as those in FIG. 1 and description thereof is omitted.

  In the transmission line according to the first embodiment, the dielectric substrates 1a and 1b are bonded face-to-face with the anisotropic conductive adhesive 4 so that the center lines in the longitudinal direction of the strip conductor patterns 2a and 2b coincide with each other. Has been. However, there may be a deviation (position deviation) in the positional relationship between the strip conductor patterns 2a and 2b due to manufacturing variations. The strip conductor patterns 2a and 2b in FIG. 6 are enlarged versions of the strip conductor patterns 2a and 2b in FIG. For example, as shown in FIG. 6A, when there is no misalignment, the end portions of the strip conductor patterns 2a and 2b are usually aligned, so the overlapping area is the area of the strip conductor patterns 2a and 2b. It becomes. On the other hand, when the positional deviation occurs in the short direction of the strip conductor patterns 2a and 2b, the overlapping area of the strip conductor patterns 2a and 2b becomes small as shown in FIG. Therefore, the electrostatic capacitance between the strip conductor patterns 2a and 2b and the ground conductor patterns 3a and 3b increases, and the characteristic impedance of the transmission line decreases.

  Therefore, the transmission line according to Embodiment 2 is characterized in that the width of the strip conductor pattern 2a in the short direction is narrower than the width of the strip conductor pattern 2b in the short direction.

  7 and 8, the width of the strip conductor pattern 2a in the short direction is narrower than the width of the strip conductor pattern 2b in the short direction. Similar to the transmission line according to the first embodiment, the dielectric substrates 1a and 1b face each other through the anisotropic conductive adhesive 4 so that the center lines in the longitudinal direction of the strip conductor patterns 2a and 2b coincide with each other. Are piled up.

  As described above, since the width of the strip conductor pattern 2a is made narrower than the width in the short direction of the strip conductor pattern 2b, the strip conductor pattern 2a, 2b can be stripped even when the lateral displacement occurs. The area where the conductor patterns 2a and 2b overlap does not change. Therefore, the change in capacitance between the strip conductor patterns 2a and 2b and the ground conductor patterns 3a and 3b is reduced, and the change in characteristic impedance of the transmission line is also reduced.

  In the transmission line according to the second embodiment, the width of the strip conductor pattern 2a in the short direction is narrower than the width of the strip conductor pattern 2b in the short direction. The transmission line according to the present embodiment is not limited to this, and the width of the strip conductor pattern 2b may be narrower than the width of the strip conductor pattern 2a. That is, the strip conductor patterns 2a and 2b may have different widths in the short direction.

  As described above, in the transmission line according to the second embodiment, the width in the short direction of one strip conductor pattern is narrower than the width in the short direction of the other strip conductor pattern. Even when the strip conductor pattern is displaced in the short direction when it is overlapped, the deviation of the characteristic impedance can be reduced.

Embodiment 3 FIG.
The transmission line according to Embodiment 3 is characterized in that the ground conductor patterns 3a and 3b are electrically connected using an anisotropic conductive adhesive material 4.

  Hereinafter, the transmission line according to the third embodiment will be described with reference to FIGS. 9 and 10. FIG. 9 is a perspective view of a transmission line according to the third embodiment. FIG. 10 is a cross-sectional view taken along the line AA ′ of the transmission line according to the third embodiment. Note that portions corresponding to the configuration of the transmission line according to Embodiment 1 are denoted by the same reference numerals as those in FIG. 1 and description thereof is omitted.

  In FIG. 9, 6a and 6b are ground conductor patterns, and 7a and 7b (7b is described in FIG. 10) are vias.

  The ground conductor pattern 6a (third ground conductor pattern) is provided on the same surface as the strip conductor pattern 2a of the dielectric substrate 1a, and the ground conductor pattern 6b (fourth ground conductor pattern) is provided on the dielectric substrate 1b. The strip conductor pattern 2b is provided on the same surface. The ground conductor patterns 6a and 6b are provided at positions facing each other when the dielectric substrates 1a and 1b are stacked.

  FIG. 10 is an AA ′ cross section of the transmission line shown in FIG. The vias 7a and 7b are formed on the dielectric substrates 1a and 1b so as to electrically connect the ground conductor patterns 3a and 6a and the ground conductor patterns 3b and 6b, respectively. Similar to the transmission line according to the first embodiment, the anisotropic conductive adhesive 4 bonds the dielectric substrates 1a and 1b and electrically connects the strip conductor patterns 2a and 2b. At this time, the conductive particles 5 are also sandwiched between the ground conductor patterns 6a and 6b. Therefore, the ground conductor patterns 6 a and 6 b are electrically connected to each other through the conductive particles 5. Further, since the ground conductor patterns 6a and 6b are connected to the ground conductor patterns 3a and 3b via the vias 7a and 7b, respectively, the ground conductor patterns 3a and 3b are electrically connected to each other.

  As described above, the transmission line according to Embodiment 3 includes two opposite grounds provided on the same surface as the strip conductor patterns 2 a and 2 b by the conductive particles 5 contained in the anisotropic conductive adhesive 4. The conductor patterns 6a and 6b can be electrically connected to each other. Further, after the two dielectric substrates 1a and 1b are stacked, the ground conductor patterns 3a, 1b, and 1b are formed without providing through-holes (vias formed by penetrating the bonded dielectric substrate) in the dielectric substrates 1a and 1b. 3b can be connected.

Embodiment 4 FIG.
The transmission line according to the fourth embodiment includes the vias 8a and 8b and the input / output units 9a and 9b, so that an electrical signal can be input from the outside to the strip conductor patterns 2a and 2b or output to the outside. Features.

  Hereinafter, the configuration of the transmission line according to the fourth embodiment will be described with reference to FIG. FIG. 11 is a sectional view of a transmission line according to the fourth embodiment. Note that portions corresponding to the configuration of the transmission line according to Embodiment 1 are denoted by the same reference numerals as those in FIG. 1 and description thereof is omitted.

  The transmission line according to Embodiment 4 includes vias 8a and 8b and input / output units 9a and 9b.

  The via 8a is a via formed on the dielectric substrate 1a and having one end connected to the strip conductor pattern 2a. The via 8b is formed on the dielectric substrate 1b, and one end thereof is connected to the strip conductor pattern 2b.

  The input / output units 9a and 9b are terminals for inputting and outputting electrical signals. The input / output unit 9a (first input / output unit) is electrically connected to an end opposite to the end of the via 8a to which the strip conductor pattern 2a is connected. The input / output unit 9b (second input / output unit) is electrically connected to the end opposite to the end to which the strip conductor pattern 2b of the via 8b is connected. The input / output portions 9a and 9b are formed by removing a part of the ground conductor patterns 3a and 3b. The input / output units 9a and 9b can input and output electrical signals by connecting to external terminals. Since the input / output portions 9a and 9b are formed by removing a part of the ground conductor patterns 3a and 3b, they are not electrically connected to the ground conductor patterns 3a and 3b.

  In the transmission line according to Embodiment 4, there is no need to form vias (8C in FIG. 5) that connect the strip conductor patterns 2a and 2b, so the vias 8a and 8b are formed on the dielectric substrates 1a and 1b before lamination. On the other hand, it is formed by performing through-hole processing. Therefore, the vias 8a and 8b can be arranged independently of each other. That is, the input / output units 9a and 9b can be arranged independently of each other.

  As described above, in the transmission line according to Embodiment 4, one end is connected to the strip conductor patterns 2a and 2b, and the other end is connected to the input / output units 9a and 9b. Since vias are formed on the two dielectric substrates 1a and 1b, electric signals can be input and output from the outside.

  In addition, since the arrangement of vias provided on the two dielectric substrates can be determined independently, the design of the vias connected to the signal input / output unit is not limited when a multilayer circuit is configured. be able to. In addition, since it is not necessary to form through-holes that connect the upper and lower ground conductor patterns after lamination, the manufacturing cost can be reduced.

Embodiment 5 FIG.
The antenna device according to the fifth embodiment is characterized in that the connector 10 and the antenna conductor pattern 12 are mounted based on the transmission line according to the fourth embodiment.

  Hereinafter, the configuration of the antenna device according to Embodiment 5 will be described with reference to FIG. FIG. 12 is a cross-sectional view of the antenna device according to the fifth embodiment. In addition, the same code | symbol as FIG.1 and FIG.11 is attached | subjected to the part equivalent to the structure of the transmission line which concerns on Embodiment 1 and Embodiment 4, and the description is abbreviate | omitted.

  In FIG. 12, 1c is a dielectric substrate (third dielectric substrate), 12 is an antenna conductor pattern constituting a patch antenna, 10 is a surface mount type connector mounted on the lower surface of the dielectric substrate 1b, and 11 is an antenna conductor. This is a feeding point for supplying an electric signal to the pattern 12. The dielectric substrates 1a and 1c are integrated by the lamination method shown in step 3 and step 5 of FIG. 5, and the via 8a is configured to connect the strip conductor pattern 2a and the antenna conductor pattern 12. .

  The connector 10 supplies an externally supplied power signal to the strip conductor patterns 2a and 2b provided on the dielectric substrates 1a and 1b. The supplied electric signal is supplied to the antenna conductor pattern 12 through the strip conductor patterns 2a and 2b and the via 8a.

  The high-frequency signal input from the connector 10 propagates through the signal conductor composed of the strip conductor patterns 2a and 2b via the via 8b, and is radiated from the patch antenna constituted by the antenna conductor pattern 12 via the via 8a. .

  In the antenna device according to Embodiment 5, the number of antenna conductor patterns 12 is one. However, the present invention is not limited to this, and a plurality of antenna conductor patterns 12 may be provided.

  Since the antenna device according to Embodiment 5 is obtained by connecting the dielectric substrates 1a and 1b using the anisotropic conductive adhesive 4, the high-frequency signal is propagated in the direction perpendicular to the strip conductor patterns 2a and 2b. There is no restriction on the arrangement of the vias, and the connector 10 can be mounted at a position different from the feeding point 11 of the patch antenna. Therefore, the degree of freedom in design is improved, such as supplying electrical signals to a plurality of antenna conductor patterns 12 for one connector.

1a, 1b Dielectric substrate, 2a, 2b Strip conductor pattern, 3a, 3b, 6a, 6b Ground conductor pattern, 4 Anisotropic conductive adhesive, 5 Conductive particles, 7a, 7b, 8a, 8b Via, 9a, 9b Input / output unit, 10 connector, 12 antenna conductor pattern

Claims (10)

A first dielectric substrate provided with a first ground conductor pattern on one side and a first strip conductor pattern on a surface opposite to the surface on which the first ground conductor pattern is provided;
A second dielectric substrate provided with a second ground conductor pattern on one side and a second strip conductor pattern on a surface opposite to the surface on which the second ground conductor pattern is provided;
Provided between the surface of the first dielectric substrate on which the first strip conductor pattern is provided and the surface of the second dielectric substrate on which the second strip conductor pattern is provided; An anisotropic method for electrically connecting one strip conductor pattern and the second strip conductor pattern in a direction perpendicular to the surface provided with the first strip pattern and the surface provided with the second strip pattern With conductive adhesive,
The first strip conductor pattern and the second strip conductor pattern constitute one signal conductor, and an electric field is generated from the signal conductor toward the first ground conductor pattern and the second ground conductor pattern. A transmission line characterized by propagating a high-frequency signal to the signal conductor. The first dielectric substrate is provided with a third ground conductor pattern on a surface provided with the first strip conductor pattern,
The second dielectric substrate is provided with a fourth ground conductor pattern on the surface provided with the second strip conductor pattern,
The third ground conductor pattern is electrically connected to the first ground conductor pattern by a via formed in the first dielectric substrate,
The fourth ground conductor pattern is electrically connected to the second ground conductor pattern by a via formed in the second dielectric substrate,
The transmission line according to claim 1, wherein the anisotropic conductive adhesive electrically connects the third ground conductor pattern and the fourth ground conductor pattern. The first dielectric substrate includes a first input / output unit for inputting / outputting an electric signal on a surface provided with the first ground conductor pattern,
The second dielectric substrate includes a second input / output unit for inputting / outputting an electric signal on a surface provided with the second ground conductor pattern,
The first strip conductor pattern is electrically connected to the first input / output unit by a via formed in the first dielectric substrate,
The said 2nd strip conductor pattern is electrically connected with the said 2nd input / output part by the via | veer formed in the said 2nd dielectric substrate, The Claim 1 or Claim 2 characterized by the above-mentioned. Transmission line. 4. The width of the first strip conductor pattern in the short direction is different from the width in the short direction of the second strip conductor pattern. 5. The transmission line according to crab. In the first strip conductor pattern and the second strip conductor pattern, a center line in the longitudinal direction of the first strip conductor pattern and a center line in the longitudinal direction of the second strip conductor pattern overlap each other. The transmission line according to claim 1, wherein the transmission line is opposed to the transmission line. The relative permittivity of the first dielectric substrate and the relative permittivity of the second dielectric substrate are larger than the relative permittivity of the anisotropic conductive adhesive. The transmission line according to any one of 5. The transmission line according to claim 1, wherein the anisotropic conductive adhesive material includes conductive particles uniformly contained in an insulating material. A first dielectric substrate provided with a first ground conductor pattern on one side and a first strip conductor pattern on a surface opposite to the surface on which the first ground conductor pattern is provided;
A second dielectric substrate provided with a second ground conductor pattern on one side and a second strip conductor pattern on a surface opposite to the surface on which the second ground conductor pattern is provided;
Provided on the surface of the second dielectric substrate on which the second ground conductor pattern is provided, and electrically connected to the second strip conductor pattern by vias formed on the first dielectric substrate. A connector for inputting and outputting electrical signals;
Provided between the surface of the first dielectric substrate on which the first strip conductor pattern is provided and the surface of the second dielectric substrate on which the second strip conductor pattern is provided; An anisotropic method for electrically connecting one strip conductor pattern and the second strip conductor pattern in a direction perpendicular to the surface provided with the first strip pattern and the surface provided with the second strip pattern Conductive adhesive,
A third dielectric substrate bonded to the surface of the first dielectric substrate provided with the first ground conductor pattern;
Vias formed on the surface of the third dielectric substrate facing the surface bonded to the first dielectric substrate and formed on the first dielectric substrate and the third dielectric substrate. An antenna conductor pattern electrically connected to the first strip conductor pattern by
The first strip conductor pattern and the second strip conductor pattern constitute one signal conductor, and an electric field is generated from the signal conductor toward the first ground conductor pattern and the second ground conductor pattern. By doing so, a high-frequency signal is propagated through the signal conductor. A first dielectric having a first ground conductor pattern provided on one side and a first strip conductor pattern and a third ground conductor pattern provided on a surface opposite to the surface provided with the first ground conductor pattern. Providing vias for connecting the first ground conductor pattern and the third ground conductor pattern on a body substrate;
A second dielectric having a second ground conductor pattern provided on one side and a second strip conductor pattern and a fourth ground conductor pattern provided on a surface opposite to the surface provided with the first ground conductor pattern. Providing vias for connecting the second ground conductor pattern and the fourth ground conductor pattern on a body substrate;
The first strip conductor pattern and the second strip conductor pattern are electrically connected in a direction perpendicular to the surface provided with the first strip pattern and the surface provided with the second strip pattern. An anisotropic conductive adhesive is formed between the surface of the first dielectric substrate on which the first strip conductor pattern is provided and the surface of the second dielectric substrate on which the second strip conductor pattern is provided. A transmission line manufacturing method comprising the step of connecting the first dielectric substrate and the second dielectric substrate between each other. A first input / output unit for inputting / outputting electrical signals to / from the first ground conductor pattern is provided on one side, and a first strip conductor pattern is provided on a surface facing the surface on which the first ground conductor pattern is provided. Providing a via for connecting the first input / output unit and the first strip conductor pattern to the first dielectric substrate formed;
A second input / output unit for inputting / outputting electric signals to / from the second ground conductor pattern is provided on one side, and a second strip conductor pattern is provided on a surface opposite to the surface on which the second ground conductor pattern is provided. Providing a via for connecting the second input / output unit and the second strip conductor pattern to the second dielectric substrate;
The first strip conductor pattern and the second strip conductor pattern are electrically connected in a direction perpendicular to the surface provided with the first strip pattern and the surface provided with the second strip pattern. An anisotropic conductive adhesive is formed between the surface of the first dielectric substrate on which the first strip conductor pattern is provided and the surface of the second dielectric substrate on which the second strip conductor pattern is provided. A transmission line manufacturing method comprising the step of connecting the first dielectric substrate and the second dielectric substrate between each other.

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