JP6416437B2 - 回路カードのための強化された液体検出機構 - Google Patents

回路カードのための強化された液体検出機構 Download PDF

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Publication number
JP6416437B2
JP6416437B2 JP2018507607A JP2018507607A JP6416437B2 JP 6416437 B2 JP6416437 B2 JP 6416437B2 JP 2018507607 A JP2018507607 A JP 2018507607A JP 2018507607 A JP2018507607 A JP 2018507607A JP 6416437 B2 JP6416437 B2 JP 6416437B2
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Japan
Prior art keywords
circuit card
channel
liquid
detection
artwork
Prior art date
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Active
Application number
JP2018507607A
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English (en)
Japanese (ja)
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JP2018526637A (ja
Inventor
ミクラク、スティーブン
アレン カースウェル、サミュエル
アレン カースウェル、サミュエル
ローズ ウィンストン、ジョセフ
ローズ ウィンストン、ジョセフ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Safran Passenger Innovations LLC
Original Assignee
Systems and Software Enterprises LLC
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Publication date
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Publication of JP2018526637A publication Critical patent/JP2018526637A/ja
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Publication of JP6416437B2 publication Critical patent/JP6416437B2/ja
Active legal-status Critical Current
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Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02H—EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS
    • H02H5/00—Emergency protective circuit arrangements for automatic disconnection directly responsive to an undesired change from normal non-electric working conditions with or without subsequent reconnection
    • H02H5/08—Emergency protective circuit arrangements for automatic disconnection directly responsive to an undesired change from normal non-electric working conditions with or without subsequent reconnection responsive to abnormal fluid pressure, liquid level or liquid displacement, e.g. Buchholz relays
    • H02H5/083—Emergency protective circuit arrangements for automatic disconnection directly responsive to an undesired change from normal non-electric working conditions with or without subsequent reconnection responsive to abnormal fluid pressure, liquid level or liquid displacement, e.g. Buchholz relays responsive to the entry or leakage of a liquid into an electrical appliance
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M3/00—Investigating fluid-tightness of structures
    • G01M3/02—Investigating fluid-tightness of structures by using fluid or vacuum
    • G01M3/04—Investigating fluid-tightness of structures by using fluid or vacuum by detecting the presence of fluid at the leakage point
    • G01M3/16—Investigating fluid-tightness of structures by using fluid or vacuum by detecting the presence of fluid at the leakage point using electric detection means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
    • G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
    • G01N27/048—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance for determining moisture content of the material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
    • G01N27/22—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating capacitance
    • G01N27/223—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating capacitance for determining moisture content, e.g. humidity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09909—Special local insulating pattern, e.g. as dam around component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Immunology (AREA)
  • Electrochemistry (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Pathology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Fluid Mechanics (AREA)
  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
  • Structure Of Printed Boards (AREA)
  • Examining Or Testing Airtightness (AREA)
  • Infusion, Injection, And Reservoir Apparatuses (AREA)
  • Storage Device Security (AREA)
JP2018507607A 2015-09-16 2016-09-16 回路カードのための強化された液体検出機構 Active JP6416437B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201562219561P 2015-09-16 2015-09-16
US62/219,561 2015-09-16
PCT/US2016/052307 WO2017049203A1 (en) 2015-09-16 2016-09-16 Enhanced liquid detection mechanisms for circuit cards

Publications (2)

Publication Number Publication Date
JP2018526637A JP2018526637A (ja) 2018-09-13
JP6416437B2 true JP6416437B2 (ja) 2018-10-31

Family

ID=58239058

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018507607A Active JP6416437B2 (ja) 2015-09-16 2016-09-16 回路カードのための強化された液体検出機構

Country Status (6)

Country Link
US (1) US10090669B2 (US20090163788A1-20090625-C00002.png)
EP (1) EP3350559B1 (US20090163788A1-20090625-C00002.png)
JP (1) JP6416437B2 (US20090163788A1-20090625-C00002.png)
BR (1) BR112018005093B8 (US20090163788A1-20090625-C00002.png)
CA (1) CA2994559C (US20090163788A1-20090625-C00002.png)
WO (1) WO2017049203A1 (US20090163788A1-20090625-C00002.png)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016069018A1 (en) * 2014-10-31 2016-05-06 Hewlett Packard Enterprise Development Lp Server device with capacitive circuit

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4297686A (en) 1979-10-01 1981-10-27 Tom M Dale Water detection device
JPH10242902A (ja) * 1997-02-27 1998-09-11 Sanyo Electric Co Ltd 屋外設置用筐体及び移動体通信用屋外基地局
JPH11135955A (ja) * 1997-10-28 1999-05-21 Kyocera Corp 筺体の浸水検知構造
JP3678897B2 (ja) * 1998-01-07 2005-08-03 株式会社オートネットワーク技術研究所 水濡れ検知機能を備えた電子制御ユニットおよび水濡れ検知センサ
JP3793359B2 (ja) 1998-11-30 2006-07-05 株式会社オートネットワーク技術研究所 水濡れセンサ及び水濡れセンサを備えた電子制御回路基板
US6175310B1 (en) * 1999-05-10 2001-01-16 Richard J. Gott Leak detection tape
JP2001356690A (ja) * 2000-06-12 2001-12-26 Sony Corp 水濡れ判定ラベル及び電子機器
US7217354B2 (en) * 2003-08-29 2007-05-15 Ut-Battelle, Llc Method and apparatus for detection of chemical vapors
EP1672701B1 (en) * 2004-12-15 2012-02-15 LG Electronics, Inc. Method for fabricating and packaging Zener diodes
JP2006208219A (ja) * 2005-01-28 2006-08-10 Victor Co Of Japan Ltd 水滴浸入検出装置
JP2008107985A (ja) * 2006-10-24 2008-05-08 Toshiba Corp 電子機器および電気機器の制御方法
US8482305B2 (en) * 2010-08-11 2013-07-09 Apple Inc. Mechanisms for detecting exposure to water in an electronic device
FR2985153B1 (fr) * 2011-12-23 2017-07-28 Cie Ind Et Financiere D'ingenierie Ingenico Dispositif de protection d'un circuit imprime electronique.
JP5693515B2 (ja) 2012-01-10 2015-04-01 エイチズィーオー・インコーポレーテッド 内部耐水性被覆を備える電子デバイス
US9146207B2 (en) 2012-01-10 2015-09-29 Hzo, Inc. Methods, apparatuses and systems for sensing exposure of electronic devices to moisture
US10126263B2 (en) * 2012-10-16 2018-11-13 Koninklijke Philips N.V. Wide dynamic range fluid sensor based on nanowire platform
EP2755023B1 (en) * 2013-01-11 2017-06-21 MEAS France Capacitive sensor integrated onto semiconductor circuit
TW201437636A (zh) * 2013-03-22 2014-10-01 Ichia Tech Inc 生物液體的測試片製作方法及其結構

Also Published As

Publication number Publication date
EP3350559A1 (en) 2018-07-25
JP2018526637A (ja) 2018-09-13
BR112018005093A2 (US20090163788A1-20090625-C00002.png) 2018-10-02
EP3350559A4 (en) 2019-07-03
US20170077694A1 (en) 2017-03-16
CA2994559C (en) 2018-10-23
EP3350559B1 (en) 2021-01-06
BR112018005093B1 (pt) 2022-10-04
BR112018005093B8 (pt) 2023-04-18
WO2017049203A1 (en) 2017-03-23
US10090669B2 (en) 2018-10-02
CA2994559A1 (en) 2017-03-23

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